CN109906029B - Electronic component mounting device and electronic component mounting method - Google Patents
Electronic component mounting device and electronic component mounting method Download PDFInfo
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- CN109906029B CN109906029B CN201811354138.6A CN201811354138A CN109906029B CN 109906029 B CN109906029 B CN 109906029B CN 201811354138 A CN201811354138 A CN 201811354138A CN 109906029 B CN109906029 B CN 109906029B
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- 238000000034 method Methods 0.000 title abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 274
- 239000012780 transparent material Substances 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 claims description 28
- 230000036544 posture Effects 0.000 description 13
- 238000012937 correction Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
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Abstract
The invention aims to provide an electronic component mounting device and an electronic component mounting method, which can perform the position alignment of a chip component and a substrate with high precision in short beat time. The electronic component mounting apparatus 1 and the electronic component mounting method of the present invention include: a collet 28 formed of a transparent material and holding the chip component 13 by suction; a first mirror 35 provided on the opposite side of the chip component 13 from the collet 28 and projecting an image of the chip component 13; a chip component recognition camera 34 which recognizes the chip component 13; a second mirror 38 disposed between the substrate 11 and the chuck 28 and projecting an image of the substrate 11; and a substrate recognition camera 37 that recognizes the substrate 11. The first reflecting mirror 35 and the second reflecting mirror 38 are moved integrally to the recognition operation position A, B of the chip component 13 and the substrate 11, and after recognizing the respective positions of the chip component 13 and the substrate 11, the positional deviation between the chip component 13 and the substrate 11 is corrected based on the recognition information.
Description
Technical Field
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method.
Background
When mounting electronic components (referred to as chip components) similar to semiconductor chips on a substrate, the chip components are aligned with the substrate with high accuracy and then bonded to the substrate. Such alignment is generally performed by recognizing a chip component recognition mark provided on a chip component and a substrate recognition mark provided on a substrate with a camera or the like, and regulating a relative positional relationship between the recognition marks to a predetermined accuracy. An apparatus for mounting a chip component on a substrate is called an electronic component mounting apparatus, a Die Bonder (Die Bonder), or a Bonding apparatus (Bonding).
As an alignment means between a chip component and a substrate, there is an electronic component mounting apparatus including: a confirmation camera that recognizes a position of the chip component in the pickup position; and a recognition camera for recognizing the positions of the chip component and the substrate in the bonding position. When the chip component is moved from the pickup position to the bonding position, the confirmation camera can move together with the chip component and recognize the positions of the chip component and the substrate (see, for example, patent document 1).
Further, as a means for aligning the chip component with the substrate, there is also a method comprising: a chip component recognition mark provided at the 2-position of the chip component and a substrate recognition mark provided at the 2-position of the substrate are mapped on the first reflecting mirror and projected onto the CCD camera corresponding to each of the first reflecting mirror and the second reflecting mirror, respectively, so that a difference between the positions of the chip component and the substrate is recognized, and a movable table holding the substrate and a movable table holding a head portion to which the chip component is adsorbed are driven to correct the position between the chip component and the substrate (for example, refer to patent document 2).
[ PRIOR TECHNICAL DOCUMENT ]
[ patent document ]
[ patent document 1 ] Japanese patent application laid-open No. 2008-124382
[ patent document 2 ] International publication No. 2006/129547
However, in the electronic component mounting apparatus described in patent document 1, since the position of the chip component is confirmed by the confirmation camera and the chip component is moved to the position of the substrate recognition camera, and then the chip component and the substrate are recognized by the recognition camera, there is a problem that it takes time for the chip component to move and the tact time becomes long. Further, when there are only 1 recognition camera, since the recognition camera and the chip component are moved to the substrate recognition operation position, more movement time is required and the tact time becomes longer, and further, since the recognition camera and the chip component which become the reference of position recognition are moved to the bonding position, there is a problem that it is difficult to obtain the position accuracy.
In the electronic component mounting apparatus described in patent document 2, when the chip component and the substrate are aligned, the chip component is moved to the bonding position by the movable table and the substrate is moved to the bonding position by the movable table, and therefore, a required recognition accuracy cannot be obtained due to an error caused by the respective movements and an error caused by the stop position, and a problem arises that the chip component and the substrate cannot be aligned with each other with high accuracy.
Accordingly, the present invention has been made to solve at least one of the above-mentioned problems, and an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of aligning a chip component and a substrate with high accuracy in a short tact time.
Disclosure of Invention
An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus for bonding a chip component to a predetermined position on a substrate in a face-up posture, comprising: an engagement head having: a chuck formed of a transparent material and holding the chip component in suction; a first reflecting mirror provided on the opposite side of the chip component held and adsorbed by the chuck and projecting an image of the chip component; a chip component recognition camera for recognizing the image of the chip component projected by the first reflector; a second reflecting mirror disposed between the substrate and the chuck and projecting an image of the substrate when the substrate is recognized; a substrate recognition camera recognizing the image of the substrate projected by the second reflecting mirror; a camera driving unit configured to move the first mirror and the second mirror integrally to a recognition operation position of the chip component and the substrate; and a control unit configured to correct a positional deviation between the chip component and the substrate based on identification information of respective positions of the chip component and the substrate identified by the chip component identification camera and the substrate identification camera.
According to the electronic component mounting apparatus of the present invention, since the positions of the chip component and the substrate can be recognized by projecting the images of the chip component and the substrate onto the same recognition operation position by the first reflecting mirror and the second reflecting mirror and capturing the images by the chip component recognition camera and the substrate recognition camera, respectively, it is possible to provide an electronic component mounting apparatus capable of highly accurately aligning the positions of the chip component and the substrate in a shorter tact time than the conventional art in which the positions of the chip component and the substrate are separately recognized.
The electronic component mounting apparatus according to the present invention is characterized in that: wherein an optical axis of the first reflecting mirror when the image of the chip component is projected and an optical axis of the second reflecting mirror when the image of the substrate is projected are set to be perpendicular and coaxial with respect to the chip component bonding surface of the substrate.
Since the optical axis of the first reflecting mirror and the optical axis of the second reflecting mirror are coincident with each other, the image of the chip component and the image of the substrate can be projected simultaneously on the same basis. That is, the chip component recognition camera and the substrate recognition camera can recognize the images of the chip component and the substrate projected on the same optical axis, and the positions of the chip component and the substrate can be recognized with high accuracy, so that high-accuracy alignment (position correction) can be performed.
The electronic component mounting apparatus according to the present invention is characterized in that: wherein the recognition operation position is set at least at the position where 2 are separated from each other, and the camera driving part has: and a camera X-axis driving part and a camera Y-axis driving part which move the first reflecting mirror and the second reflecting mirror to the identification operation positions.
Here, the X axis and the Y axis refer to an X direction and a Y direction of the substrate when the substrate is configured in an X-Y plane. In order to specify the positions of the chip component and the substrate, it is necessary to identify the chip component and the substrate at identification operation positions of at least 2 or more positions. Therefore, if the first reflecting mirror (the chip component camera unit) and the second reflecting mirror (the substrate camera unit) are sequentially moved to the respective recognition operation positions simultaneously, the positions of the chip component and the substrate can be recognized in a short time from among the plurality of recognition operation positions. Further, since the optical axes of the first reflecting mirror and the second reflecting mirror are aligned, the positions of the chip component and the substrate can be recognized with high accuracy at each recognition operation position, and thus, high-accuracy alignment can be performed.
The electronic component mounting apparatus according to the present invention is characterized in that: wherein the engagement head has: a head Z-axis driving part for moving the chip component to a position where the chip component is bonded to the substrate from a position where the chuck holds and sucks the chip component, and a theta-axis driving part for rotating the chip component in parallel with the chip component bonding surface.
Here, the Z-axis refers to the axis perpendicular with respect to the X-Y plane, and the θ -axis refers to the Z-axis in a particular plane position. The θ -axis driving unit is a mechanism for rotating the chuck, i.e., the chip component, in the planar direction, and since the bonding head does not move in the planar direction (X direction, Y direction), it is possible to suppress an error caused by the movement in the planar direction, and it is possible to complete high-precision alignment between the chip component and the substrate.
The electronic component mounting apparatus according to the present invention is characterized in that: wherein the substrate is held and adsorbed on a substrate table (stage) having: and a substrate X-axis driving part and a substrate Y-axis driving part which move the substrate to a bonding object position and correct the position deviation of the substrate relative to the chip component in the bonding object position.
With this configuration, since the substrate can be aligned with the chip component by the substrate X-axis driving unit and the substrate Y-axis driving unit, it is possible to perform highly accurate alignment with less influence of the movement accuracy in the planar direction and the movement stopping accuracy, compared to the conventional technique of determining the positions of the substrate and the chip component by moving both the substrate and the chip component.
An electronic component mounting method according to the present invention is an electronic component mounting method for bonding a chip component to a predetermined position on a substrate in a face-up posture, the electronic component mounting method including: picking up the chip components and conveying the chip components to a bonding position; a step of holding and adsorbing the chip component on a chuck formed of a transparent material; recognizing the chip components and the substrate positions at a first recognition operation position and recognizing the chip components and the substrate positions at other recognition operation positions among recognition operation positions of at least 2 positions; correcting a positional deviation between the chip component and the substrate based on various identification information for each of the identification operation positions; and bonding the chip component to a predetermined position of the substrate after correcting the positional deviation.
According to the electronic component mounting method of the present invention, since the positions of the chip component and the substrate can be simultaneously recognized at the same recognition operation position by the chip component recognition camera and the substrate recognition camera, it is possible to provide an electronic component mounting method in which the chip component and the substrate are aligned and bonded with high accuracy in a shorter tact time than in the conventional technique in which the positions of the chip component and the substrate are separately recognized.
The electronic component mounting method according to the present invention is characterized in that: wherein, in the step of identifying the chip component and the substrate, the chip component and the substrate are identified simultaneously on the same optical axis.
With this configuration, the chip component and the substrate can be recognized simultaneously with the same positional reference, and the position between the chip component and the substrate can be recognized with high accuracy.
The electronic component mounting method according to the present invention is characterized in that: wherein the step of correcting the positional deviation between the chip component and the substrate includes: a step of correcting the position of the substrate with respect to the chip component based on the identification information obtained in the step of identifying the chip component and the position of the substrate, and a step of correcting the posture of the chip component with respect to the plane direction of the substrate after the correction.
Since the positional deviation of the chip component from the substrate in the X, Y direction is corrected by moving the substrate side relative to the chip component and by rotating the chip component relative to the attitude of the chip component relative to the substrate, the movement error (or movement stop position error) at the time of performing the positional correction can be suppressed.
Drawings
Fig. 1 is a plan view showing a general structure of an electronic component mounting apparatus 1 in the embodiment.
Fig. 2 is a front view showing the electronic component mounting device 1 seen from the lower side of the view of fig. 1.
Fig. 3 is a perspective view showing an example of a state in which the chip component 13 is bonded to the substrate 11.
Fig. 4 is an explanatory view schematically showing alignment between the chip component 13 and the substrate 11.
Fig. 5 is a process flow chart showing the main steps in the electronic component mounting method in the embodiment.
Detailed Description
Hereinafter, the electronic component mounting apparatus 1 and the electronic component mounting method in the embodiment of the present invention will be described with reference to fig. 1 to 5.
[ Structure of electronic component mounting apparatus 1 ]
Fig. 1 is a plan view showing a general structure of an electronic component mounting apparatus 1 in the embodiment,
fig. 2 is a front view showing the electronic component mounting device 1 seen from the lower side of the view of fig. 1. The drawings described below are described with the left-right direction of the drawing in fig. 1 being the Y direction or the Y axis, and the up-down direction of the drawing being the X direction or the X axis. Alternatively, the vertical direction with respect to the X-Y plane will be described as the Z direction or the up-down direction.
The structure of the electronic component mounting apparatus 1 will be described with reference to fig. 1 and 2. The electronic component mounting apparatus 1 is composed of: a substrate table 12 for holding the substrate 11 on the base 10, a chip component table 14 for holding the chip components 13, a bonding head 15 provided above the substrate 11 for bonding the chip components 13 to the substrate 11, and a recognition camera unit 16 for detecting positions of the chip components 13 and the substrate 11.
The substrate 11 is not limited to a material such as a glass substrate, a resin substrate, a film substrate, or a metal substrate, and may be a large-sized substrate on which a large number of chip components 13 can be mounted or a small-sized substrate on which a small number of chip components are mounted. A bonding layer (not shown) capable of bonding the chip components 13 is provided on the surface of the substrate 11. The bonding layer may be a thermosetting adhesive applied or a thermosetting adhesive film attached, and the bonding layer may be formed on the entire surface of the substrate 11 or only on the bonding position of the chip component 13, and it is desirable to select a chip component 13 having adhesiveness on the surface not moving on the substrate 11. When the bonding surface between the substrate 11 and the chip component 13 is required to have conductivity, a silver paste may be used as the bonding layer, or the chip component 13 and the substrate 11 may be bonded by a eutectic bonding technique.
The chip component 13 may be, for example, an electronic component such as an IC chip, a semiconductor chip, an optical element, or a surface mount component, the type and size of which are not limited, and the active surface to be bonded to the substrate 11 in a posture in which the active surface faces upward (referred to as bonding). When the chip component 13 is a semiconductor chip or an IC chip, the chip component 13 is a chip component that is singulated by completely dicing the wafer 17 having a circular outer shape. Thus, the chip component table 14 is a wafer table, and the extended table is used in order to make it easier to pick up the chip components 13 one by one. In the following description, the chip component table 14 may be referred to as a wafer table 14.
The substrate table 12 moves the substrate 11 to the bonding position by the substrate X-axis driving unit 18 and the substrate Y-axis driving unit 19, and further moves the substrate 11 in the X direction and the Y direction in order to align the chip components 13 with the substrate 11 (correct positional deviation).
The wafer stage 14 has an X-axis drive unit and a Y-axis drive unit, not shown, and moves the position of the chip component 13 to be bonded to a position where the chip component can be picked up. In this example, as shown in fig. 1, the pickup position of the chip component 13 is set as the center position of the wafer 17, but the pickup position is not limited to the center position if it is determined that the moving distance of the wafer 17 can be shortened. A wafer recognition camera, not shown, is disposed above the wafer stage 14, recognizes the chip component 13 to be bonded, and moves the chip component 13 to be picked up to the pickup position based on the recognition information.
The engagement head 15 has: a head Z-axis drive unit 26 attached to the lateral support 25 standing on the base 10, and a chuck holding frame 27 movable in the Z direction (up and down) by the head Z-axis drive unit 26. The cartridge holding frame 27 is a frame body having openings on the side surface of the recognition camera unit 16, the upper side and the lower side as shown in fig. 2, and a cartridge 28 made of a transparent material such as glass is attached to the opening on the lower side. The chuck 28 is provided with a plurality of suction holes (not shown), which are connected to a vacuum generating device (not shown) and can hold and suck the chip components 13.
The chuck holding frame 27 is coupled to the θ -axis driving unit 29, and rotates the chuck holding frame 27 about the θ -axis 30. That is, the θ -axis driving unit 29 rotates the chip component 13 held and adsorbed by the chuck 28. The chip component 13 is held and attracted by the chuck 28 in such a manner that the center (center of the drawing) of the chip component is on the θ axis 30.
As shown in fig. 2, the recognition camera unit 16 includes: a chip component camera unit 31 disposed above the chuck 28, and a substrate camera unit 32 disposed between the chuck 28 and the substrate table 12. The chip component camera unit 31 and the substrate camera unit 32 are fixed integrally with each other with a gap in the vertical direction by a support block 33. The chip component camera unit 31 is configured to include: the chip component recognition camera 34, the first reflecting mirror 35 that projects an image of the chip component 13 through the collet 28, and the mirror 36 that inputs the image of the chip component 13 projected by the first reflecting mirror 35 to the chip component recognition camera 34. The board camera unit 32 is configured to include: the substrate recognition camera 37, the second mirror 38 that projects a part of the substrate 11, and the lens 36 that inputs the image of the substrate 11 projected by the second mirror 38 to the substrate recognition camera 37. As the first reflecting mirror 35 and the second reflecting mirror 38, although a prism is used in this example, a half mirror (half mirror) may be used.
The chip component camera unit 31 and the substrate camera unit 32 each have: a light source 39 and a third reflector 40. In the chip component camera unit 31, the light emitted from the light source 39 is irradiated onto the chip component 13 through the third reflecting mirror 40, the mirror 36, and the first reflecting mirror 35, and the reflected light from the chip component 13 is input to the chip component recognition camera 34. In the substrate camera unit 32, the light emitted from the light source 39 is irradiated onto the substrate 11 through the third mirror 40, the mirror 36, and the second mirror 38, and the reflected light from the substrate 11 is input to the substrate recognition camera 37. As shown in fig. 2, the first reflecting mirror 35 and the second reflecting mirror 38 are arranged such that the optical axis L of the first reflecting mirror 35 when the image of the chip component 13 is projected and the optical axis L of the second reflecting mirror 38 when the image of the substrate 11 is projected are perpendicular to and coaxial with the chip-component bonding surface 11A of the substrate 11. The optical axis L of the recognition camera unit 16 does not change even when the unit moves. In fig. 2, the case where the optical axis L and the θ axis 30 are coaxial is illustrated. The optical axis L is an optical axis between the first reflecting mirror 35 and the chip component 13 among optical axes connecting the chip component recognition camera 34, the first reflecting mirror 35, and the chip component 13, and is an optical axis between the second reflecting mirror 38 and the substrate 11 among optical axes connecting the chip component recognition camera 34, the second reflecting mirror 38, and the substrate 11.
The recognition camera unit 16 includes: the camera Y-axis drive unit 41 and the camera X-axis drive unit 42, which are camera drive units, horizontally move the chip-component camera unit 31 and the substrate camera unit 32 in the Y direction and the X direction. The recognition camera unit 16 moves the position where the first reflecting mirror 35 and the second reflecting mirror 38 project the image of the chip component 13 onto the first reflecting mirror 35 and the retracted position (position where the joining is not affected) by the camera Y-axis driving unit 41. Since the optical axes L of the first mirror 35 and the second mirror 38 are always on the same axis, the recognition camera unit 16 can capture the images of the chip component 13 and the substrate 11 at the same time with the same positional reference.
As shown in fig. 1, the electronic component mounting apparatus 1 includes: a wafer table 14, a pick-up arm (pick up arm)45 that picks up the singulated chip components 13 on the wafer table 14, and a chip transfer arm 46 that transports the chip components 13 from the pick-up arm 45 to the receiving bonding head 15. A wafer recognition camera (not shown) is provided above the wafer stage 14, and the chip component stage 14 is moved in the X direction and the Y direction based on the recognition information of the wafer recognition camera, and the pickup target chip components 13 are moved below the suction portion of the pickup arm 45. The pick-up arm 45 is movable in the X direction and the Z direction, and picks up a non-defective product from the wafer 17 and picks up the chip component 13 at the bonding object position. The chip component 13 is carried in a face-up posture.
The chip transfer arm 46 is disposed below the pick-up arm 45, and after receiving the chip component 13 in a face-up posture from the pick-up arm 45 at a predetermined position in the X direction (a position substantially intermediate between the chip component stage 14 and the bonding head 15), conveys the chip component 13 to a position where the chuck 28 of the bonding head 15 can suck. When the chip component 13 reaches a position immediately below the collet 28, the bonding head 15 lowers the collet 28 by the head Z-axis driving unit 26, holds the chip component 13 in a face-up posture, and raises the chip component 13 to a predetermined height and stops the raising. After that, whether or not there is a positional deviation between the chip component 13 and the substrate 11 is detected, and the positional deviation is corrected to bond the chip component 13 to a predetermined position of the substrate 11. The operation and mounting method of the electronic component mounting apparatus 1 for mounting the chip component 13 on the substrate 11 will be described in detail in the electronic component mounting method section described later.
Fig. 3 is a perspective view showing an example of a state in which the chip component 13 is bonded to the substrate 11. The electronic component mounting apparatus 1 is an apparatus for bonding a chip component 13 (semiconductor chip or the like) to a substrate 11 in a face-up posture mainly in the Fan out Wafer Level technology. Therefore, the substrate 11 has a square shape and a circular shape, and has various sizes. In the example shown in fig. 3, 9 chip components 13 are bonded to the square substrate 11 in the X direction and 9 chip components 13 are bonded to the square substrate in the Y direction, but the number and arrangement of the chip components 13 are not limited to this.
Chip component identification marks R1 and R2 are provided diagonally on the chip component 13, and substrate identification marks M1 and M2 are provided diagonally in the same direction as the chip component 13 on the substrate 11. The chip component identification mark and the substrate identification mark are so-called alignment marks, and may be 3 or 4 positions, although not limited to being disposed at every 2 positions, and the substrate identification mark is provided for each chip component 13.
Fig. 4 is an explanatory view schematically showing alignment between the chip component 13 and the substrate 11. Fig. 4(a) shows a state after alignment (a state without positional deviation), and fig. 4(b) shows a state after recognition of positional deviation. In the example shown in fig. 4(a), the board recognition marks M1 and M2 are arranged on a straight line connecting the chip component recognition marks R1 and R2 provided on the chip component 13. The area enclosed by the broken line a is the first recognition operation position a, and the area enclosed by the broken line B is the second recognition operation position B. That is, after the chip component recognition mark R1 and the substrate recognition mark M1 are recognized by the recognition camera unit 16 at the first recognition operation position a, the chip component recognition mark R2 and the substrate recognition mark M2 are moved to the second recognition operation position B and the positions of the chip component recognition mark R2 and the substrate recognition mark M2 are recognized by the recognition camera unit 16, thereby recognizing the positional deviation (positional deviation and posture of the substrate 11 with respect to the X direction and the Y direction of the chip component 13).
In the example shown in fig. 4, the chip component identification marks R1 and R2 and the substrate identification marks M1 and M2 are formed in various square or circular shapes, but the shapes may be not limited to square and circular, and may be triangular, cross-shaped, or the like. Alternatively, the number of the chip component identification marks and the number of the substrate identification marks may be increased by at least 2 positions, or 3 positions or 4 positions. If the first recognition operation position a and the second recognition operation position B are added to the visual fields of the first reflecting mirror 35 and the second reflecting mirror 38, a recognition operation can be performed once.
Fig. 4(b) shows an example of the case where the substrate 11 is displaced from the chip component 13. In the first recognition operation position a, the substrate 11 is displaced from the chip component 13 by X1 in the X direction and Y1 in the Y direction. The position of M1 is designated as M1-0. In the second recognition operation position B, the substrate 11 is displaced from the chip component 13 by X2 in the X direction and Y2 in the Y direction. The position of M2 is designated as M2-0. Based on the positional deviation information recognized at the first recognition operation position a and the second recognition operation position B, the positional correction amount of the substrate 11 with respect to the chip components 13 is calculated by a control unit (not shown), and the positional correction in the X direction and the Y direction is performed by driving the substrate table 12. When the positional deviation between the first recognition operation position a and the second recognition operation position B is not the same, since the substrate 11 is rotated (tilted in the planar direction) with respect to the chip parts 13, if the posture is corrected by rotating the chip parts 13, the chip parts 13 and the substrate 11 can be aligned with high accuracy. The control unit includes: a function of controlling at least the recognition camera unit 16 to acquire positional information of the chip component 13 and the substrate 11 and correcting the positions by controlling the positions and postures of the chip component 13 and the substrate 11.
The electronic component mounting apparatus 1 described above includes: a bonding head 15 having a collet 28 formed of a transparent material and holding the suction chip component 13; a first mirror 35 provided on the opposite side of the chip component 13 held and adsorbed by the chuck 28 and projecting an image of the chip component 13; a chip component recognition camera 34 for recognizing the image of the chip component 13 projected by the first reflecting mirror 35; a second mirror 38 disposed between the substrate 11 and the chuck 28 and projecting an image of the substrate 11; a substrate recognition camera 37 for recognizing the image of the substrate 11 projected by the second reflecting mirror 38; and a camera Y-axis driving unit 41 and a camera X-axis driving unit 42 as camera driving units for moving the first reflecting mirror 35 and the second reflecting mirror 38 integrally to the recognition operation positions of the chip component 13 and the substrate 11. The electronic component mounting apparatus 1 further includes: the control unit (not shown) corrects the positional deviation between the chip component 13 and the substrate 11 based on the identification information of the respective positions of the chip component 13 and the substrate 11 identified by the chip component identification camera 34 and the substrate identification camera 37.
In the electronic component mounting apparatus 1, the chip component 13 and the substrate 11 are projected at the same recognition operation position by the first reflecting mirror 35 and the second reflecting mirror 38 at the same time, and the positions of the chip component 13 and the substrate 11 can be recognized by capturing images by the chip component recognition camera 34 and the substrate recognition camera 37, respectively, so that the positions of the chip component 13 and the substrate 11 can be aligned with high accuracy in a shorter tact time than in the conventional technique in which the positions of the chip component 13 and the substrate 11 are recognized separately.
In the electronic component mounting apparatus 1, the optical axis L of the first reflecting mirror 35 when projecting the image of the chip component 13 and the optical axis L of the second reflecting mirror 38 when projecting the image of the substrate 11 are set to be perpendicular to and coaxial with the chip component bonding surface 11A of the substrate 11. With this configuration, the chip components 13 and the images of the substrate 11 can be projected simultaneously with the same reference. That is, the chip component recognition camera 34 and the substrate recognition camera 37 can recognize the images of the chip components 13 and the substrate 11 projected on the same optical axis with the same positional reference, and can recognize the positions of the chip components 13 and the substrate 11 with high accuracy, so that high-accuracy alignment (positional correction) can be achieved.
In the electronic component mounting apparatus 1, the recognition operation positions are set at least at positions separated from each other at 2. In the example where the recognition operation position is the 2-position, the first mirror 35 and the second mirror 38 are moved from the first recognition operation position a to the second recognition operation position B by the camera X-axis driving unit 42 and the camera Y-axis driving unit 41, which are camera driving units. By doing so, if the first mirror 35 and the second mirror 38 are moved from the first recognition operation position a to the second recognition operation position B at the same time, the positions of the chip component 13 and the substrate 11 can be recognized in the recognition operation position of the 2-position in a short time. Further, since the positions of the chip component 13 and the substrate 11 can be recognized with high accuracy at each recognition operation position by aligning the optical axes L of the first reflecting mirror 35 and the second reflecting mirror 38, high-accuracy alignment can be achieved.
In the electronic component mounting apparatus 1, the bonding head 15 includes: a head Z-axis driving unit 26 for moving the chip component 13 to a bonding position on the substrate 11 at a position where the chuck 28 holds the chip component 13; and a theta axis driving unit 29 for rotating the chip component 13 parallel to the chip component bonding surface 11A. Since the bonding head 15 is not moved in the planar direction (X direction, Y direction), an error due to the movement in the planar direction can be suppressed, and high-precision alignment between the chip component 13 and the substrate 11 can be completed. Although the positional deviation between the chip component 13 and the substrate 11 can be corrected by rotating the substrate table 12, the device can be made compact because the rotation locus is small if the correction is made by rotating the chip component 13.
The substrate 11 is held and adsorbed on the substrate table 12, and the substrate table 12 includes: a substrate X-axis driving part 18 and a substrate Y-axis driving part 19 which move to the bonding object position and the recognition operation position (a first recognition operation position A and a second recognition operation position B) of the chip component 13 and correct the position deviation of the substrate 11 relative to the chip component 13. Since the substrate 11 can be aligned with the chip component 13 by the substrate X-axis driving unit 18 and the substrate Y-axis driving unit 19, it is possible to perform highly accurate alignment with less influence of the movement accuracy in the planar direction and the movement stopping accuracy, compared to the conventional technique of determining the positions of the substrate 11 and the chip component 13 by moving both the substrate 11 and the chip component 13. After the chip components 13 are handed to the chip transfer arm 46, the tact time can be further shortened if the pick-up arm 45 is operated to return to the pick-up position during the time when the chip transfer arm 46 carries the chip components 13 to the bonding position (i.e., the suction position of the collet 28).
[ electronic component mounting method ]
Fig. 5 is a process flow chart showing the main steps in the electronic component mounting method in the embodiment. The process flow shown in fig. 5 will be described with reference to fig. 1 to 4. First, the substrate 11 is supplied to the substrate stage 12 and held by suction (step S1). At this time, the wafer 17 completely cut in advance is used as an article to be supplied to a predetermined position of the wafer stage 14. The substrate table 12 is moved and the substrate 11 is moved to the bonding target position (step S2). The engagement subject position is directly below the chuck 28 of the engagement head 15. After that, the chip components 13 are picked up from the wafer 17 by the pick-up arm 45 (step S3). The wafer 17 is moved to a pickup position of the pickup object chip component 13 within the movable range of the pickup arm 45.
The pick-up arm 45 moves to the standby position of the chip transfer arm 46, and hands the chip component 13 to the chip transfer arm 46. The chip transfer arm 46 carries the chip component 13 to the bonding position (step S4). That is, the chip component 13 is conveyed to the suction position of the chuck 28 of the bonding head 15. The collet 28 holds the chip component 13 by suction (step S5). The chip component 13 is attracted to the center (center position) of the chuck 28 and is rotated about the center position (θ axis 30).
Subsequently, the recognition camera unit 16 is driven to move the first mirror 35 and the second mirror 38 to the first recognition operation position a (step S6). In the first recognition operation position a, the chip part recognition mark R1 is recognized by the chip part recognition camera 34, and the substrate recognition mark M1 is recognized by the substrate recognition camera 37 (step S7). Since the optical axes L of the first and second mirrors 35 and 38 are coaxial, the chip component recognition camera 34 and the substrate recognition camera 37 can capture the chip component recognition mark R1 and the substrate recognition mark M1 as images of the same positional reference, and recognize the direction and amount of positional deviation of the chip component 13 and the substrate 11 in the first recognition operation position a.
Next, the recognition camera unit 16 is driven to move the first mirror 35 and the second mirror 38 to the second recognition operation position B (step S8). In the second recognition operation position B, the chip part recognition mark R2 is recognized by the chip part recognition camera 34, and the substrate recognition mark M2 is recognized by the substrate recognition camera 37 (step S9). Since the optical axes L of the first and second reflecting mirrors 35 and 38 are coaxial, the chip component recognition camera 34 and the substrate recognition camera 37 can capture the chip component recognition mark R2 and the substrate recognition mark M2 as images of the same positional reference, and detect the direction and amount of positional deviation of the chip component 13 and the substrate 11 in the second recognition operation position B. The recognition camera unit 16 is driven at a time point after the end of the recognition operation in the second recognition operation position B, and the first reflecting mirror 35 and the second reflecting mirror 38 are retracted to positions where the joining operation is not hindered (step S10).
The control unit determines a correction amount based on the positional deviation direction and the positional deviation amount recognized in each of the first recognition operation position a and the second recognition operation position B, corrects the positional deviation of the substrate 11 with respect to the chip component 13 in the X direction and the Y direction by driving the substrate table 12, and corrects the attitude deviation of the chip component 13 with respect to the substrate 11 by rotating the chuck 28 (step S11). After the position correction is completed, the chip components 13 are bonded to the predetermined positions of the substrate 11 by being pressed (step S12). After the chip components 13 are bonded to all the positions of the substrate 11 to be bonded, the substrate 11 is removed (step S13).
The electronic component mounting method described above includes: a step of conveying the chip component 13 to a position where the chip component is picked up and bonded; a step of holding and adsorbing the chip component 13 on a chuck 28 formed of a transparent material; a step of recognizing the positions of the chip component 13 and the substrate 11 in a first recognition operation position a and a step of recognizing the positions of the chip component 13 and the substrate 11 in a second recognition operation position B, in recognition operation positions of at least 2 positions; correcting a positional deviation between the chip component 13 and the substrate 11 based on various identification information for identifying each operation position; and a step of bonding the chip component 13 to a predetermined position of the substrate 11 after the positional deviation is corrected.
Since the chip component recognition camera 34 and the substrate recognition camera 37 can recognize the positions of the chip component 13 and the substrate 11 at the same recognition operation position at the same time, the chip component 13 and the substrate 11 can be aligned with each other with high accuracy in a shorter tact time than in the conventional technique in which the positions of the chip component 13 and the substrate 11 are recognized separately, and the bonding can be performed. According to this electronic component mounting method, when the positional accuracy of each chip component 13 after bonding is expressed by σ as a standard deviation, the positional deviation amount is within 2 μm in the range of 3 σ, and the overall positional accuracy of the chip components 13 after bonding to the substrate 11 is within 3 μm in the range of 3 σ.
In the step of identifying the chip components 13 (chip component identification marks R1, R2) and the substrates 11 (substrate identification marks M1, M2), the chip components and the substrates are identified simultaneously on the same optical axis L. Thus, the chip component 13 and the substrate 11 can be recognized simultaneously with the same positional reference, and the positions of the chip component 13 and the substrate 11 can be recognized with high accuracy.
The step of correcting the positional deviation between the chip component 13 and the substrate 11 includes: a step of correcting the position of the substrate 11 with respect to the chip component 13 based on the position identification information obtained in the step of identifying the position of the chip component 13 (chip component identification marks R1, R2) and the position of the substrate 11 (substrate identification marks M1, M2); and correcting the posture of the chip component 13 in the planar direction with respect to the substrate 11 after the correction. Since the positional deviation in the X, Y direction between the chip component 13 and the substrate 11 is corrected by moving the substrate 11 with reference to the chip component 13 and rotating the chip component 13 with reference to the position of the substrate 11 after the positional deviation correction in the posture of the chip component 13 relative to the substrate 11, the movement error (or movement stop position error) at the time of the positional correction can be suppressed.
[ notation ] to show
1 … electronic component mounting apparatus, 11 … substrate, 12 … substrate table, 13 … chip component, 14 … chip component table (wafer table), 15 … bonding head, 16 … recognition camera unit, 17 … wafer, 18 … substrate X-axis driving section, 19 … substrate Y-axis driving section, 28 … chuck, 29 … θ -axis driving section, 31 … chip component camera unit, 32 … substrate camera unit, 34 … chip component recognition camera, 35 … first mirror, 37 … substrate recognition camera, 38 … second mirror, 45 … pick-up arm, 46 … chip transfer arm, a … first recognition operation position, B … second recognition operation position, L … optical axis, R1, R2 … chip component recognition mark, M1, M2 … substrate recognition mark.
Claims (4)
1. An electronic component mounting apparatus for bonding a chip component to a predetermined position on a substrate in a face-up posture, comprising:
an engagement head having: a chuck formed of a transparent material and holding the chip component in suction;
a first reflecting mirror provided on the opposite side of the chip component held and adsorbed by the chuck and projecting an image of the chip component;
a chip component recognition camera for recognizing the image of the chip component projected by the first reflector;
a second reflecting mirror disposed between the substrate and the chuck and projecting an image of the substrate when the substrate is recognized;
a substrate recognition camera recognizing the image of the substrate projected by the second reflecting mirror;
a camera driving unit configured to move the first mirror and the second mirror integrally to a recognition operation position of the chip component and the substrate; and
a control unit that corrects a positional deviation between the chip component and the substrate based on identification information of respective positions of the chip component and the substrate identified by the chip component identification camera and the substrate identification camera,
wherein the outgoing light from the light source irradiates the chip part via the first reflecting mirror, the reflected light at the chip part is projected to the chip part recognition camera via the first reflecting mirror to be recognized by the chip part recognition camera,
the light emitted from the light source irradiates the substrate via the second reflecting mirror, the reflected light at the substrate is projected to the substrate recognition camera via the second reflecting mirror to be recognized by the substrate recognition camera,
an optical axis of the first mirror when projecting the image of the chip component and an optical axis of the second mirror when projecting the image of the substrate are disposed perpendicularly and coaxially with respect to the chip-component bonding surface of the substrate, so that the image of the chip component and the image of the substrate are captured simultaneously.
2. The electronic component mounting apparatus according to claim 1, wherein:
wherein the identification operation positions are at least arranged at positions separated from each other at 2,
the camera driving section includes: and a camera X-axis driving part and a camera Y-axis driving part which move the first reflecting mirror and the second reflecting mirror to the identification operation positions.
3. The electronic component mounting apparatus according to claim 1 or 2, wherein:
wherein the engagement head has: a head Z-axis driving part for moving the chip component to a position where the chip component is bonded to the substrate from a position where the chuck holds and sucks the chip component, and a theta-axis driving part for rotating the chip component in parallel with the chip component bonding surface.
4. The electronic component mounting apparatus according to claim 1 or 2, wherein:
wherein the substrate is held and adsorbed on the substrate table,
the substrate table includes: and a substrate X-axis driving part and a substrate Y-axis driving part which move the substrate to a bonding object position and correct the position deviation of the substrate relative to the chip component in the bonding object position.
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| JP2017-235988 | 2017-12-08 | ||
| JP2017235988A JP2019102771A (en) | 2017-12-08 | 2017-12-08 | Electronic component mounting device and electronic component mounting method |
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| CN110854045A (en) * | 2019-11-20 | 2020-02-28 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Method for adjusting parallelism between chip sucker and substrate sucker by using collimation light path |
| JP7436251B2 (en) * | 2020-03-16 | 2024-02-21 | ファスフォードテクノロジ株式会社 | Die bonding equipment and semiconductor device manufacturing method |
| JP7450429B2 (en) * | 2020-03-26 | 2024-03-15 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
| JP7451259B2 (en) * | 2020-03-26 | 2024-03-18 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment |
| KR102590191B1 (en) * | 2020-06-30 | 2023-10-16 | 시바우라 메카트로닉스 가부시끼가이샤 | Apparatus and method for bonding |
| JPWO2022014451A1 (en) * | 2020-07-13 | 2022-01-20 |
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| JP2019102771A (en) | 2019-06-24 |
| KR102132094B1 (en) | 2020-07-08 |
| KR20190068467A (en) | 2019-06-18 |
| CN109906029A (en) | 2019-06-18 |
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