TWI841852B - Mounting device and mounting method - Google Patents

Abstract

The present invention provides a mounting device and a mounting method. The present invention includes: a substrate carrier for mounting a substrate; a carrier moving mechanism for moving the substrate carrier; a first detection unit for detecting the position of the electronic component before mounting and the position of the predetermined mounting area of the substrate at a mounting position where the electronic component is mounted on the substrate; a bonding head for aligning the position of the electronic component with the position of the predetermined mounting area of the substrate at the mounting position and mounting the electronic component on the substrate; a second detection unit for detecting the mounted electronic component at a check position isolated from the mounting position; and a control device, the control device including an offset detection unit for detecting the position offset between the position of the predetermined mounting area of the substrate on which the electronic component is mounted and the position of the electronic component detected by the second detection unit based on the position of the predetermined mounting area of the substrate detected by the first detection unit.

Description

Mounting device and mounting method

The present invention relates to an installation device and an installation method for electronic components.

The mounting of electronic components on a substrate is performed, for example, by flip-chip mounting. Flip-chip mounting is a method of mounting a semiconductor chip or other electronic component such that the surface on which the electrodes are formed faces a substrate on which a conductive pattern is formed. In flip-chip mounting, the fine electrodes of the electronic component need to be directly joined to the fine terminals of the conductive pattern formed on the substrate, so the electronic component and the substrate must be positioned with high precision. [Prior art literature] [Patent literature]

[Patent Document 1] Japanese Patent Publication No. 10-125728

[Problems to be solved by the invention] In recent years, due to the miniaturization and high density of the circuits of electronic components such as semiconductor chips, the mounting accuracy has been continuously improved. Therefore, after the electronic components are mounted, the alignment marks provided on the electronic components and the substrate are photographed by a camera unit, and the positional deviation between the mounted electronic components and the substrate is checked. For example, an infrared camera is used to photograph the alignment marks provided on the lower surface of the substrate side of the electronic components and the alignment marks provided on the upper surface of the substrate through the electronic components, thereby detecting the position of the electronic components and the position of the substrate.

However, the alignment mark of the substrate located below the electronic component overlaps with the alignment mark of the electronic component or the wiring pattern and cannot be photographed, or the photographed image becomes unclear, so the position of the substrate cannot be detected. In this case, the positional deviation between the electronic component and the substrate after installation cannot be determined, and it is impossible to check whether the product is within the allowable range. In addition, the positional deviation used to correct the position during installation cannot be obtained.

The present invention is made to solve the above-mentioned problem, and its purpose is to provide a mounting device and a mounting method, which can detect the positional deviation between the electronic component and the substrate even when the position of the substrate after installation cannot be detected, and can detect the positional deviation amount used to correct the position during installation. [Technical means for solving the problem]

The present invention is a mounting device for mounting electronic components on a substrate, comprising: a substrate carrier for mounting the substrate; a carrier moving mechanism for moving the substrate carrier; a first detection unit for detecting the position of the electronic component before mounting and the position of a predetermined mounting area of the substrate at a mounting position of the substrate mounted on the substrate carrier; a bonding head for aligning the position of the electronic component with the position of the predetermined mounting area of the substrate at the mounting position and mounting the electronic component on the substrate. the substrate; a second detection unit, which detects the position of the electronic component after the installation at an inspection position isolated from the installation position; and a control device, wherein the control device includes an offset detection unit, which detects the position offset between the position of the predetermined installation area of the substrate on which the electronic component is installed and the position of the electronic component detected by the second detection unit based on the position of the predetermined installation area of the substrate detected by the first detection unit.

In addition, the present invention is a mounting method for mounting an electronic component on a substrate, which includes: a first detection process, in which a first detection unit detects the position of the electronic component before mounting and the position of the predetermined mounting area of the substrate at a mounting position where the electronic component is mounted on the substrate; a mounting process, in which a bonding head aligns the position of the electronic component with the position of the predetermined mounting area of the substrate at the mounting position based on the result of the first detection process, and mounts the electronic component on the substrate; a second detection process, in which a second detection unit detects the position of the electronic component after the mounting at a detection position isolated from the mounting position; and an offset detection process, in which an offset detection unit detects the position offset between the position of the predetermined mounting area of the substrate on which the electronic component is mounted and the position of the electronic component detected by the second detection process based on the position of the predetermined mounting area of the substrate detected by the first detection process. [Effect of invention]

According to the present invention, a mounting device and a mounting method can be obtained, which can detect the positional deviation between electronic components and a substrate even when the position of the substrate after mounting cannot be detected, and can detect the positional deviation amount used to correct the position during mounting.

The embodiment of the mounting device of the present invention will be described in detail with reference to the accompanying drawings. Fig. 1 is a plan view showing an electronic component mounting system to which the mounting device of the embodiment is applied. Fig. 2 is a front view showing an electronic component mounting system to which the mounting device of the embodiment is applied.

The electronic component mounting system 1 is a system for mounting an electronic component 2 on a substrate 3. The electronic component 2 is, for example, a semiconductor chip containing silicon. In the present embodiment, the electronic component 2 is a semiconductor chip having a bump formed thereon as a protruding electrode formed of a solder material. Alignment marks are provided on the electronic component 2. When the electronic component 2 is formed into a rectangular shape, alignment marks are provided at the four corners or diagonal corners of the surface on which the bump is formed.

The substrate 3 is a plate-like body on which the electronic component 2 is mounted. A conductive pattern connected to bumps is formed on the substrate 3. A predetermined mounting area for mounting the electronic component 2 is provided on the surface of the substrate 3 on which the conductive pattern is formed. A plurality of predetermined mounting areas are provided here, and are arranged in an array. Alignment marks are provided in the predetermined mounting areas, respectively. When the electronic component 2 is set to a rectangular shape, the alignment marks are provided at the four corners or diagonal corners of the rectangular predetermined mounting area, for example. After the alignment marks of the electronic component 2 and the substrate 3 are aligned, the electronic component 2 is mounted on the predetermined mounting area of the substrate 3. In this embodiment, the position of the alignment mark is detected to detect various positions such as the position of the electronic component 2 before or after installation, the position of the predetermined mounting area of the substrate 3, and the like. Aligning the positions of the alignment marks means setting the offset of the positions of the compared alignment marks within a predetermined range, thereby aligning the positions of the electronic component 2 to be mounted and the substrate 3.

(Structure) The electronic component mounting system 1 includes: a supply device 10, a pickup device 20, a mounting device 30, and a control device 50. The pickup device 20 picks up the electronic component 2 from the supply device 10, transfers the electronic component 2 to the mounting device 30, and mounts the electronic component 2 on the substrate 3 using the mounting device 30.

The supply device 10 is a device for supplying electronic components 2. Specifically, the supply device 10 includes a supply stage 11 on which a sheet 12 carrying the electronic components 2 is placed. The supply device 10 moves the supply stage 11 in such a manner that the electronic components 2 to be picked up come to a supply position P1. The so-called supply position P1 is a predetermined position where the electronic components 2 to be picked up by the picking device 20 are picked up by the picking device 20. For example, a camera 13 is provided above the supply position P1 in such a manner that the optical axis is aligned with the supply position P1, and the supply device 10 moves the supply stage 11 in such a manner that the electronic components 2 to be picked up come to the shooting center of the camera 13.

The sheet 12 carrying the electronic components 2 placed on the supply stage 11 is a wafer sheet in this case. The sheet 12 is an adhesive sheet, and the electronic components 2 are arranged in a matrix on the sheet 12. The electronic components 2 can be arranged face up with the bumps exposed on the top, or face down with the bumps in contact with the sheet 12. In this embodiment, the electronic components are arranged face up.

When supplying the electronic component 2 to the pickup device 20, the supply device 10 may also push the electronic component 2 on the supply position P1 upward through the sheet 12 by using a block or needle-shaped pin disposed below the supply position P1, thereby easily peeling the electronic component 2 from the sheet 12.

The pickup device 20 is a relay device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. The pickup device 20 includes a pickup head 21 and a head moving mechanism 22. The pickup head 21 holds the electronic component 2 and releases the electronic component 2 by releasing the holding state. Specifically, the pickup head 21 has a cylindrical adsorption nozzle 21a. The interior of the adsorption nozzle 21a is connected to a negative pressure generating circuit of a vacuum pump or the like, and by generating a negative pressure in the circuit, the electronic component 2 is adsorbed by the opening at the front end of the adsorption nozzle 21a, thereby holding the electronic component 2. In addition, the electronic component 2 is detached from the adsorption nozzle 21a by releasing the negative pressure.

The head moving mechanism 22 moves the pickup head 21 back and forth between the supply position P1 and the delivery position P2 of the electronic component 2 to the mounting device 30. The head moving mechanism 22 can use, for example, a ball screw mechanism driven by a servo motor. The head moving mechanism 22 is arranged on the support frame 23 in a manner extending along the X-axis direction described later. The head moving mechanism 22 is provided with a suction nozzle 21a via a reversing mechanism. The reversing mechanism reverses the direction of the suction nozzle 21a. When the head moving mechanism 22 uses the suction nozzle 21a with the opening end facing downward to adsorb and hold the electronic component 2 at the supply position P1, the head moving mechanism 22 positions the suction nozzle 21a at the delivery position P2. The head moving mechanism 22 uses the reversing mechanism to rotate the suction nozzle 21a by 180 degrees so that the opening end holding the electronic component 2 faces upward, thereby reversing the electronic component 2. Then, the reversed electronic component 2 is delivered to the mounting device 30.

In the present embodiment, the supply device 10 and the mounting device 30 are arranged in a horizontal arrangement. The arrangement direction of the supply device 10 and the mounting device 30, that is, the straight line direction connecting the supply position P1 and the mounting position P3 is set as the X-axis direction. In addition, on the horizontal plane where the supply stage 11 extends, the direction perpendicular to the X-axis direction is set as the Y-axis direction, and the direction perpendicular to the X-axis and the Y-axis is set as the Z-axis direction. In this specification, the position in the Z-axis direction is sometimes referred to as "height". For example, a specific reference position can be determined such as the position in the Z-axis direction of a specific position on the substrate stage 33 described later, and the distance in the Z-axis direction relative to the reference position is set as the height. Furthermore, the rotation direction on the XY plane centered on the Z-axis is set as the θ direction.

The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate 3. The mounting position P3 is a position where the electronic component 2 is mounted on the substrate 3, and is set at a fixed location.

The mounting device 30 includes a bonding head 31 , a head moving mechanism 32 , a substrate stage 33 , a stage moving mechanism 34 , a first detection unit 35 , and an inspection unit 40 .

At the mounting position P3, the bonding head 31 aligns the position of the electronic component 2 with the position of the predetermined mounting area of the substrate 3 based on the detection result of the first detection unit 35 described later, and mounts the electronic component 2 on the substrate 3. Specifically, the bonding head 31 receives the electronic component 2 from the pickup device 20 at the delivery position P2, and mounts the electronic component 2 on the substrate 3 at the mounting position P3. The bonding head 31 holds the electronic component 2, and releases the electronic component 2 by releasing the holding state after the mounting. Specifically, the bonding head 31 has a cylindrical adsorption nozzle 31a. The interior of the adsorption nozzle 31a is connected to a negative pressure generating circuit of a vacuum pump or the like, and by generating a negative pressure in the circuit, the electronic component 2 is adsorbed by the opening at the front end of the adsorption nozzle 31a, thereby holding the electronic component 2. Furthermore, the electronic component 2 is separated from the suction nozzle 31a by releasing the negative pressure.

The bonding head 31 reciprocates between the transfer position P2 and the mounting position P3 by the head moving mechanism 32 , and is also lifted and lowered at the transfer position P2 and the mounting position P3 . In other words, the head moving mechanism 32 includes a sliding mechanism 321 and a lifting mechanism 322 .

The sliding mechanism 321 enables the bonding head 31 to move linearly between the handover position P2 and the mounting position P3. Here, the sliding mechanism 321 includes: two rails 321a extending parallel to the X-axis direction and fixed to the support frame 323; and a slider 321b moving on the rails 321a. Furthermore, although not shown, the sliding mechanism 321 includes a sliding mechanism that enables the bonding head 31 to slide in the Y-axis direction. The sliding mechanism may also include a rail in the Y-axis direction and a slider running on the rail. When the sliding mechanism 321 moves the adsorption nozzle 31a of the bonding head 31 to the handover position P2, the adsorption nozzle 31a faces the adsorption nozzle 21a of the pickup head 21 located at the handover position P2 via the electronic component 2. When the slide mechanism 321 moves the suction nozzle 31 a holding the electronic component 2 to the mounting position P3 , the suction nozzle 31 a faces the mounting planned region on the substrate 3 positioned at the mounting position P3 with the electronic component 2 interposed therebetween.

The lifting mechanism 322 lifts the bonding head 31. Here, the lifting direction is a direction parallel to the Z-axis direction. Specifically, the lifting mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, the bonding head 31 is lifted and lowered along the Z-axis direction by the drive of the servo motor.

The substrate stage 33 is a stage on which the substrate 3 is placed. The substrate stage 33 slides on the XY plane. In addition, the substrate stage 33 rotates in the θ direction on the XY plane.

The stage moving mechanism 34 slides the substrate stage 33 on the XY plane. Specifically, the stage moving mechanism 34 includes an X-axis moving mechanism that moves the substrate stage 33 in the X-axis direction, a Y-axis moving mechanism that moves the substrate stage 33 in the Y-axis direction, and a rotation mechanism that rotates the substrate stage 33 in the θ direction.

The X-axis moving mechanism and the Y-axis moving mechanism include, for example, a servo motor and a ball screw mechanism, and the ball screw mechanism includes a screw shaft, a nut, a guide rail, and a sliding member. The X-axis moving mechanism is arranged in such a manner that its screw shaft and guide rail extend in the X-axis direction, and the nut is screwed with the screw shaft. The substrate stage 33 is fixed to the nut via the sliding member, and the screw shaft is rotated by the servo motor, and the sliding member moves along the guide rail extending in the X-axis direction, so that the substrate stage 33 moves linearly in the X-axis direction. The Y-axis moving mechanism is arranged in such a manner that its screw shaft and guide rail extend in the Y-axis direction, and the nut is screwed with the screw shaft. The X-axis moving mechanism is fixed to the nut via a slider, and the screw shaft is rotated by a servo motor to move the slider along a guide rail extending in the Y-axis direction, so that the substrate stage 33 moves linearly in the Y-axis direction together with the X-axis moving mechanism.

The rotating mechanism includes, for example, a servo motor, a rotating shaft, and a transmission mechanism. The power of the servo motor is transmitted to the rotating shaft by the transmission mechanism using gears or belts, thereby rotating the substrate stage 33.

The first detection unit 35 detects the position of the electronic component 2 before installation and the position of the predetermined installation area of the substrate 3 at the installation position P3. The first detection unit 35 of the present embodiment includes a camera 35a that photographs the alignment mark of the electronic component 2 and the alignment mark of the predetermined installation area of the substrate 3 at the installation position P3, and extracts the specified position of the alignment mark from the image photographed by the camera 35a, for example, extracts the outer shape from the outline of the recognized alignment mark to detect its center of gravity, corners, and other points. The detection of the specified position can be performed by the circuit included in the camera 35a, or by the control device 50 described later. When the control device 50 performs the detection, the control device 50 assumes part of the function of the first detection unit 35.

The camera unit 35a is a camera with two fields of view, upper and lower. That is, as shown in FIG3 , the camera unit 35a enters between the bonding head 31 and the substrate stage 33, and photographs the alignment mark of the electronic component 2 held by the upper suction nozzle 31a and the alignment mark of the predetermined mounting area located at the mounting position P3 in the lower substrate 3. As shown in FIG3 , the camera unit 35a enters between the bonding head 31 and the substrate stage 33 before the electronic component 2 is mounted on the substrate 3, and when the bonding head 31 is used for mounting, as shown in FIG4 , the camera unit 35a retreats to a position that does not interfere with the bonding head 31.

The inspection unit 40 inspects the positional deviation between the mounted electronic component 2 and the substrate 3. The inspection unit 40 includes a second inspection unit 42 and a camera lifting mechanism 43 (see FIGS. 1 and 2). The second inspection unit 42 inspects the position of the mounted electronic component 2 at an inspection position P4 described later, which is separated from the mounting position P3. The second inspection unit 42 of the present embodiment also has the function of inspecting the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted.

The second detection unit 42 includes an imaging unit 42a for photographing the mounted electronic component 2 and the substrate 3, and extracts the predetermined position of the alignment mark from the image photographed by the imaging unit 42a, for example, extracts the outer shape from the outline of the identified alignment mark, and detects the center of gravity, corners, and other points. The detection of the predetermined position can be performed by the circuit included in the imaging unit 42a, or by the control device 50 described later. When the control device 50 performs the detection, the control device 50 assumes part of the function of the second detection unit 42.

The imaging unit 42a photographs the alignment marks of the mounted electronic component 2 and the alignment marks of the predetermined mounting area of the substrate 3. The imaging unit 42a photographs the alignment marks of at least two locations for each electronic component 2. In addition, the imaging unit 42a photographs the alignment marks of at least two locations for each mounting location of the substrate 3. The imaging unit 42a may use an infrared (IR) camera. The imaging unit 42a allows infrared rays to pass through the electronic component 2 and photographs the alignment marks of the electronic component 2 and the alignment marks of the predetermined mounting area of the substrate 3.

The second detection unit 42 is set at the inspection position P4. That is, the camera unit 42a is set above the substrate stage 33 in such a way that the optical axis of the camera is consistent with the inspection position P4. The inspection position P4 is a position for inspecting the positional deviation between the electronic component 2 and the substrate 3, that is, the positional deviation between the alignment mark of the mounted electronic component 2 and the alignment mark of the predetermined installation area of the substrate 3 by photographing the mounted electronic component 2 and the predetermined installation area of the substrate 3 using the camera unit 42a. The positional deviation is the positional deviation when each alignment mark of the predetermined installation area of the electronic component 2 and the substrate 3 is projected onto the XY plane. In the present embodiment, the inspection position P4 is a fixed position.

The camera unit lifting mechanism 43 lifts the camera unit 42a. Here, the lifting direction is parallel to the Z-axis direction, that is, the direction of advance and retreat relative to the mounted electronic component 2 located at the inspection position P4. The camera unit lifting mechanism 43 can use a ball screw mechanism driven by a servo motor. That is, the camera unit 42a is lifted and lowered along the Z-axis direction by the drive of the servo motor.

The imaging unit lifting mechanism 43 focuses to a degree that the imaging unit 42a can recognize the alignment mark of the mounted electronic component 2 or the alignment mark of the predetermined mounting area of the substrate 3. In other words, the imaging unit lifting mechanism 43 adjusts the height of the imaging unit 42a so that the alignment mark of the mounted electronic component 2 or the alignment mark of the predetermined mounting area of the substrate 3 as the imaging object is limited to the depth of field of the lens of the imaging unit 42a. The height adjustment is performed by controlling the imaging unit lifting mechanism 43 through the lifting mechanism control unit 57 described later. Depending on the magnification or numerical aperture used to obtain the required position information with high accuracy, the distance between the alignment mark of the electronic component 2 mounted on the substrate 3 and the alignment mark of the predetermined mounting area of the substrate 3, that is, the separation distance in the height direction, may exceed the depth of field (e.g., 10 μm) of the lens of the imaging unit 42a. Therefore, the imaging unit lifting mechanism 43 switches the height of the imaging unit 42a when photographing the alignment mark of the electronic component 2 and when photographing the alignment mark of the predetermined mounting area of the substrate 3.

The control device 50 controls the start, stop, speed, and operation timing of the supply device 10, the pickup device 20, the mounting device 30, and the inspection unit 40. The control device 50 can be realized, for example, by a dedicated electronic circuit or a computer running a prescribed program. The control device 50 is connected to an input device for inputting instructions or information required by the operator for control, and an output device for confirming the state of the device and outputting it. For example, a jog dial, a mouse, a touch screen, etc. that operates the stage moving mechanism 34 to move the substrate stage 33 to the desired position are examples of input devices. An example of the output device is a display device that displays the installation position P3, the inspection position P4, the images captured by the imaging unit 35a, the imaging unit 42a, the points extracted from the alignment mark, the position deviation, etc. on the display screen, and a notification device such as a speaker and a buzzer.

FIG5 is a functional block diagram of the control device 50. As shown in FIG5, the control device 50 includes: a supply device control unit 51, a pickup head control unit 52, a bonding head control unit 53, a substrate stage control unit 54, a substrate position calculation unit 55, a correction value calculation unit 56, a lifting mechanism control unit 57, a camera control unit 58, an offset detection unit 59a, a determination unit 59b and a storage unit M.

The supply device control unit 51 controls the movement of the supply stage 11 so that the electronic component 2 to be supplied, which is placed on the sheet 12 on the supply stage 11, is located at the supply position P1.

The pickup head control unit 52 controls the movement of the pickup device 20. Specifically, the pickup head control unit 52 controls the negative pressure generating circuit connected to the adsorption nozzle 21a, and controls the holding and separation of the electronic component 2. In addition, the pickup head control unit 52 controls the movement of the pickup head 21, that is, the movement of the head moving mechanism 22.

The bonding head control unit 53 controls the movement of the bonding head 31, that is, the operation of the head moving mechanism 32. The substrate stage control unit 54 controls the operation of the stage moving mechanism 34.

The substrate position calculation unit 55 calculates the position of the predetermined mounting area of the substrate 3 when it moves from the mounting position P3 to the inspection position P4. The amount of movement in this case is theoretically the distance A in the X direction and the distance B in the Y direction from the fixed mounting position P3 to the fixed inspection position P4 as shown in FIG6. Therefore, in the coordinate system used to control the movement of the stage moving mechanism 34, the coordinates (X, Y) obtained by adding the distance A and the distance B to the coordinates (X+A, Y+B) when the alignment mark am of each predetermined mounting area of the substrate 3 is aligned with the fixed mounting position P3 become the coordinates (X', Y') when the alignment mark am of each predetermined mounting area moves to the inspection position P4.

However, in the movement of the substrate stage 33 using the stage moving mechanism 34, there is a movement error caused by the mechanism part. That is, the stage moving mechanism 34 includes, for example, a guide rail along the X-axis direction and a guide rail along the Y-axis direction. Such a guide rail sometimes has fluctuations and strains caused by processing accuracy or assembly accuracy. Therefore, even if the movement distance of the coordinate system used to move the stage moving mechanism 34 is set to the theoretical distance A and distance B to move the substrate stage 33, the actual movement position is offset from the inspection position P4 due to the movement error as shown in Figure 7. The movement error includes not only the error of the movement distance in the X direction and the error of the movement distance in the Y direction, but also the error of the rotation direction on the XY plane, that is, the angle in the θ direction. That is, even if the alignment mark am of each predetermined installation area is moved by a distance A in the X direction and a distance B in the Y direction from the coordinates (X, Y) when the alignment mark am of the installation position P3, the alignment mark am of each predetermined installation area is offset from the coordinates (X', Y') of the inspection position P4 due to movement errors in the X direction, the Y direction and the θ direction.

In order to cope with this situation, the present embodiment includes a correction value calculation unit 56. The correction value calculation unit 56 calculates a correction value for the substrate position calculation unit 55 to calculate the position of the predetermined mounting area when it moves from the mounting position P3 to the inspection position P4. The correction value is the movement amount that corrects the movement error in the X direction, the Y direction, and the θ direction. The substrate position calculation unit 55 calculates the position of each predetermined mounting area when it moves from the mounting position P3 to the inspection position P4 based on the correction value calculated by the correction value calculation unit 56.

For example, the correction value calculation unit 56 detects the coordinates when the substrate stage 33 is moved in advance and each predetermined mounting area of the substrate 3 is aligned with the mounting position P3. Furthermore, the correction value calculation unit 56 detects the coordinates when the substrate stage 33 is moved and each predetermined mounting area is aligned with the inspection position P4, and calculates each movement distance in the X direction and the Y direction between the two coordinates. At this time, each movement distance includes not only the movement error in the X direction and the Y direction, but also in the θ direction.

More specifically, the following is performed using a display device that displays images captured by the imaging unit 35a and the imaging unit 42a, an input device that operates the stage moving mechanism 34, and a calibration glass to which marks corresponding to the respective scheduled mounting regions of the substrate 3 are given. That is, the calibration glass is mounted on the substrate stage 33, and each mark captured by the imaging unit 35a and displayed on the display device is aligned with the mounting position P3 by operating the input device. Furthermore, each coordinate is detected when each mark captured by the imaging unit 42a and displayed on the display device is aligned with the inspection position P4 by moving the calibration glass by operating the input device. The shift amounts in the X direction and the Y direction between the coordinates detected for each mark are calculated, and these shift amounts are used as correction values when each scheduled mounting area is moved from the mounting position P3 to the inspection position P4.

Furthermore, the correction value calculation unit 56 preferably prepares in advance the correction value when moving from the installation position P3 to the inspection position P4 for all the predetermined installation areas. However, it is not necessary to calculate the movement amount (X direction, Y direction) for all the predetermined installation areas through the above sequence. For example, a predetermined installation area in the specified area of the substrate 3 is used as the reference position (the representative point, representative position of the specified area), and the movement amount (X direction, Y direction) with respect to the reference position is calculated. Moreover, with respect to other predetermined installation areas in the specified area, the movement amount (X direction, Y direction) is calculated based on the relative position relative to the reference position. In this way, the correction value of the position of each predetermined installation area can be calculated. Therefore, the mark of the calibration glass does not necessarily need to correspond to each predetermined installation area, and can also be set at a position representing the specified area.

In addition, the correction value calculation unit 56 preferably calculates the correction value at a predetermined timing. That is, it is preferred that the correction value calculated temporarily is not used continuously and fixedly as the mounting device 30 is operated, but that the correction value is calculated and updated at a predetermined timing. For example, it is conceivable to update the correction value by calculating each time a predetermined time has passed since the start of the operation, calculating each time an unacceptable positional deviation occurs, or calculating each time the frequency of unacceptable positional deviations within a predetermined time reaches a threshold.

The lifting mechanism control unit 57 is a control unit that controls the camera lifting mechanism 43. For example, the lifting mechanism control unit 57 adjusts the height of the camera 42a by controlling the camera lifting mechanism 43. The camera control unit 58 controls the operation of the camera 42a. For example, it controls the start, stop, shooting, and shooting timing of the camera 42a.

The displacement detection unit 59a detects the displacement between the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42, based on the position of the predetermined mounting area of the substrate 3 detected by the first detection unit 35. When the second detection unit 42 can detect the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted, the displacement detection unit 59a of the present embodiment detects the displacement based on the position detected by the second detection unit 42. When the second detection unit 42 cannot detect the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted, the displacement detection unit 59a detects the displacement based on the position of the predetermined mounting area of the substrate 3 detected by the first detection unit 35 and the position of the electronic component 2 detected by the second detection unit 42.

The determination unit 59b determines the positional deviation between the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted and the electronic component 2 detected by the second detection unit 42, based on the positional deviation detected by the deviation detection unit 59a. The determination unit 59b determines whether the detected positional deviation is within the allowable range. If the positional deviation is within the allowable range, it is determined that there is no positional deviation, and if the positional deviation is outside the allowable range, it is determined that there is a positional deviation.

More specifically, when the image of the alignment mark of the electronic component 2 and the image of the alignment mark of the predetermined mounting area of the substrate 3 can be identified from the image captured by the imaging unit 42a, the displacement detection unit 59a detects the position displacement of the predetermined positions of the two alignment marks based on the recognition result. When the image of the alignment mark of the predetermined mounting area of the substrate 3 cannot be recognized in a correct shape because it overlaps with the alignment mark of the electronic component 2, the wiring pattern, etc., the displacement detection unit 59a detects the position displacement based on the predetermined position of the image of the alignment mark of the predetermined mounting area of the substrate 3 captured by the imaging unit 35a and the predetermined position of the image of the alignment mark of the electronic component 2 obtained by the imaging unit 42a.

As described above, the determination of the positional deviation by the determination unit 59b is performed based on whether the deviation amount of the predetermined position of the alignment mark detected by the deviation amount detection unit 59a is within the predetermined range (permissible range). When using the image of the alignment mark of the predetermined mounting area of the substrate 3 obtained based on the result of the imaging unit 35a, the predetermined position of the alignment mark of the predetermined mounting area of the substrate 3 is converted to the position when it moves from the mounting position P3 to the inspection position P4, that is, the position calculated by the substrate position calculation unit 55 based on the correction value calculated by the correction value calculation unit 56.

In the present embodiment, as shown in FIG8 , an example is given in which the electronic component 2 is mounted face down on the substrate 3. The alignment mark 2a of the electronic component 2 is provided on the surface provided with the bump 2b, and is facing the substrate 3 by face down mounting. The alignment mark 3a of the predetermined mounting area of the substrate 3 is provided on the surface opposite to the substrate stage 33, that is, the surface on which the electronic component 2 is mounted. By face down mounting, the electronic component 2 and the predetermined mounting area of the substrate 3 provided with the alignment mark 2a and the alignment mark 3a are brought to a position where they overlap in the Z-axis direction. In addition, in the figure, the double-dotted line is an imaginary line when the substrate 3 is cut and divided according to each electronic component 2.

FIG9 (A) is an example of an alignment mark 2a of an electronic component 2, and FIG9 (B) is an example of an alignment mark 3a of a predetermined installation area of a substrate 3. The alignment mark 2a is an example including a triangle and 20 quadrilaterals arranged around it. The alignment mark 3a is an example including a triangle. Furthermore, in the figure, the double-dotted line is an imaginary line when the substrate 3 is cut and divided according to each electronic component 2, and is equivalent to a predetermined installation area of the substrate 3. FIG10 (A) is a diagram showing a state in which the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the predetermined installation area of the substrate 3 are aligned, that is, the positioning is roughly accurate. FIG. 10 (B) is a diagram showing a situation where the alignment mark 2a of the electronic component 2 is offset from the alignment mark 3a of the predetermined mounting area of the substrate 3, and the alignment mark 3a of the predetermined mounting area of the substrate 3 is hidden by the alignment mark 2a of the electronic component 2 and cannot be identified. Furthermore, in FIG. 10 (A) and FIG. 10 (B), the image of the alignment mark 2a becomes unclear because the imaging unit 42a does not focus sufficiently on the alignment mark 2a of the electronic component 2.

As a method for determining positional deviation, for example, the deviation detection unit 59a calculates the distance between a predetermined position extracted from the recognition result of the image of the alignment mark 2a of the electronic component 2 and a predetermined position extracted from the recognition result of the image of the alignment mark 3a of the predetermined mounting area of the substrate 3. If the calculated distance is within a predetermined threshold value (allowable range), the determination unit 59b determines that the mounting is well aligned. If the calculated distance exceeds the predetermined threshold value (allowable range), the determination unit 59b determines that the mounting is poorly aligned. If the positioning is poorly determined, the operator is notified by a notification device such as a display device or a speaker connected to the control device 50. Furthermore, if the positioning is poorly determined, it may be considered to stop the mounting device 30. However, even when it is determined that the alignment is poor, the determination result can be recorded without stopping. For example, it can stop when the number of poor alignments reaches a specified number or when it occurs a specified number of times in a row. In addition, it can continue to operate even when the detection is poor due to dust on the electronic component 2 or the substrate 3.

The storage unit M is, for example, a magnetic or electronic recording medium such as a hard disk drive (HDD) or a solid state drive (SSD). In the storage unit M, data and programs required for the operation of the system are pre-stored, and data required for the operation of the system is stored. For example, the storage unit M stores the position of the electronic component 2 and the predetermined installation area of the substrate 3 before installation detected by the first detection unit 35, and the position of the electronic component 2 after installation and the position of the predetermined installation area of the substrate 3 on which the electronic component 2 is installed detected by the second detection unit 42. In addition, the storage unit M also stores the position of the predetermined installation area of the substrate 3 calculated by the substrate position calculation unit 55 and the correction value calculated by the correction value calculation unit 56. Furthermore, the storage unit M also stores the allowable range of the position shift amount, the position shift amount, and the determination result of the position shift.

(Function) The function of the electronic component mounting system 1 and the mounting device 30 of the embodiment is described. Furthermore, a mounting method for mounting electronic components according to the processing sequence shown below is also one form of the present invention. FIG. 11 is an example of an operation flow chart of the electronic component mounting system 1. A sheet 12 on which electronic components 2 are arranged in an array is pre-placed on the supply stage 11, and a substrate 3 as a mounting object of the electronic components 2 is pre-placed on the substrate stage 33. In addition, it is assumed that the electronic component 2 on the sheet 12 is placed in a state where the bump 2b faces upward.

First, the supply device 10 moves the electronic component 2 as the supply target among the multiple electronic components 2 on the sheet 12 to the supply position P1 (step S01). The head moving mechanism 22 moves the pickup head 21 to the supply position P1, picks up the electronic component 2 at the supply position P1 (step S02), and delivers the electronic component 2 to the bonding head 31 at the delivery position P2 (step S03). That is, the pickup head 21 moves to the delivery position P2, and the picked-up electronic component 2 is reversed 180° by the reversing device. As a result, the bonding head 31 faces the electronic component 2 and delivers it. As a result, the electronic component 2 is held on the bonding head 31 with the alignment mark 2a facing downward.

The bonding head 31 is moved to the mounting position P3 by the slide mechanism 321 (step S04). Meanwhile, the substrate stage 33 is moved by the stage moving mechanism 34 to move the currently mounted scheduled area of the substrate 3 to the mounting position P3 (step S05).

In this way, after the electronic component 2 and the predetermined mounting area of the substrate 3 are moved to the mounting position P3, the camera 35a as the upper and lower field cameras is moved in and out between the bonding head 31 and the substrate 3, and the alignment mark 2a of the electronic component 2 located at the upper side and the alignment mark 3a of the predetermined mounting area of the substrate 3 located at the lower side are photographed, and the positions of the electronic component 2 and the predetermined mounting area of the substrate 3 are detected (step S06). The bonding head 31 performs the alignment of the predetermined mounting area of the electronic component 2 and the substrate 3 (step S07).

After alignment, the bonding head 31 is lowered by the lifting mechanism 322 so that the electronic component 2 is abutted against the predetermined mounting area of the substrate 3 for mounting (step S08). After mounting, the bonding head 31 releases the holding of the electronic component 2 and rises to return to the transfer position P2 in order to receive the next electronic component 2.

After the electronic component 2 is mounted on the substrate 3, the electronic component 2 at the mounting position P3 is moved to the inspection position P4 by the stage moving mechanism 34 (step S09). The camera lifting mechanism 43 is controlled by the lifting mechanism control unit 57, and the height of the camera 42a is adjusted to photograph the alignment mark 2a and the alignment mark 3a, thereby detecting the position of the electronic component 2 and the position of the mounting predetermined area of the substrate 3 on which the electronic component 2 is mounted (step S10). Furthermore, when the distance between the alignment mark 2a and the alignment mark 3a becomes a distance exceeding the depth of field of the lens, the height adjustment of the camera 42a and the photographing of the alignment mark 2a and the alignment mark 3a are performed separately.

The photographing of the alignment mark 2a and the alignment mark 3a is preferably performed at two locations for one electronic component 2 and one predetermined installation area of the substrate 3. By identifying the positions of two locations that are a fixed distance away, the rotational offset of the object can be identified with higher accuracy. In the case where the electronic component 2 is rectangular in shape, for example, the alignment mark 2a and the alignment mark 3a at the diagonal position are photographed. For example, from the viewpoint of the camera unit 42a, in order to photograph the alignment mark 2a at the lower left corner, the substrate stage 33 is moved by the stage moving mechanism 34 in such a way that the lower left corner of the mounted electronic component 2 as the object comes to the inspection position P4, and the height of the camera unit 42a is adjusted to photograph the alignment mark 2a. Then, based on the height of the alignment mark 3a paired with the alignment mark 2a, the height of the imaging unit 42a is adjusted by the imaging unit lifting mechanism 43, and the alignment mark 3a is photographed.

Furthermore, in order to photograph the alignment mark 3a located at the upper right corner of the diagonal part, the substrate stage 33 is moved by the stage moving mechanism 34 so that the upper right corner of the mounted electronic component 2 as the object comes to the inspection position P4. As a result, the alignment mark 3a at the upper right corner is limited to the field of view, and therefore, the camera 42a is used to photograph. Thereafter, in order to photograph the alignment mark 2a at the lower right corner, the camera lifting mechanism 43 is used to adjust the height of the camera 42a based on the height of the alignment mark 2a, and the alignment mark 2a at the upper right corner is photographed by the camera 42a. Furthermore, the diagonal alignment marks 2a and 3a are photographed because the distance between the two points is long and the angle is easy to identify, thereby reducing position calculation errors. However, it is not necessary to photograph the diagonal alignment marks 2a and 3a. The probability of identification can be increased by setting the alignment marks 2a and 3a at positions that are easy to identify. For example, by placing the alignment marks 3a in the installation area of the substrate 3 at a position that is difficult to hide, the situation where they cannot be identified can be reduced.

Next, when the positions of the electronic component 2 and the predetermined mounting area of the substrate 3 after mounting can be detected based on the obtained image (YES in step S11), the positional offset between the electronic component 2 and the predetermined mounting area of the substrate 3 after mounting is detected by the offset detection unit 59a based on the detected position (step S13), and the positional offset is determined by the determination unit 59b (step S14). When the position of the predetermined mounting area of the substrate 3 after mounting the electronic component 2 cannot be detected based on the obtained image (NO in step S11), the substrate position calculation unit 55 calculates the position of the predetermined mounting area of the substrate 3 when it moves from the mounting position P3 to the inspection position P4 (step S12). Then, based on the detected position of the electronic component 2 and the calculated position of the predetermined installation area of the substrate 3, the position offset between the installed electronic component 2 and the predetermined installation area of the substrate 3 is detected using the offset detection unit 59a (step S13), and the position offset is determined using the determination unit 59b (step S14).

When it is determined that the positional deviation is within the permissible range, that is, the alignment is good (Yes in step S15), the process returns to step S01 and moves to the installation of the next electronic component 2. Steps S01 to S15 are repeated, and when there is no electronic component 2 on the supply stage 11, or when the electronic component 2 is installed in all the predetermined installation areas of the substrate 3, the system operation is stopped. On the other hand, when the determination unit 59b determines that the positional deviation is within the unpermissible range, that is, the alignment is poor (No in step S15), the notification component is used to notify the operator, and the system is stopped and terminated. Furthermore, the supply of electronic components 2 can also be performed in parallel during the detection of the positional deviation amount or the determination of the positional deviation. Therefore, for example, it is not necessary to return to the process of S01, and it is also possible to return to the process of S05. That is, the processing sequence described above is an example, and the present invention is not limited to this. Alternatively, the imaging unit 42a may be moved to the positions of the alignment marks 2a and 3a to capture images.

(Effect) (1) The present embodiment is a mounting device 30 for mounting an electronic component 2 on a substrate 3, comprising: a substrate stage 33 for mounting the substrate 3; a stage moving mechanism 34 for moving the substrate stage 33; a first detection unit 35 for detecting the position of the electronic component 2 before mounting and the position of the predetermined mounting area of the substrate 3 at a mounting position P3 where the electronic component 2 is mounted on the substrate stage 33; a bonding head 31 for aligning the position of the electronic component 2 with the position of the predetermined mounting area of the substrate 3 at the mounting position P3 and mounting the electronic component 2 on the substrate 3; a second detection unit 42 for detecting the position of the electronic component 2 after mounting at a detection position P4 isolated from the mounting position P3; and a control device 50.

Moreover, the control device 50 includes an offset detection unit 59a, which detects the position offset between the position of the predetermined installation area of the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42 based on the position of the predetermined installation area of the substrate 3 detected by the first detection unit 35.

In addition, the present embodiment is a mounting method for mounting an electronic component 2 on a substrate 3, which includes: a first detection process, in which a first detection unit 35 detects the position of the electronic component 2 before mounting and the position of the predetermined mounting area of the substrate 3 when the electronic component 2 is mounted on a substrate carrier 33 moved by a carrier moving mechanism 34 at a mounting position P3; a mounting process, in which a bonding head 31 detects the position of the electronic component 2 and the predetermined mounting area of the substrate 3 at the mounting position P3 based on the result of the first detection process. The electronic component 2 is aligned with the position of the predetermined installation area of the substrate 3 and installed on the substrate 3; a second detection processing, in which the second detection unit 42 detects the position of the electronic component after installation at the inspection position P4 isolated from the installation position P3; and an offset detection processing, in which the offset detection unit 59a detects the position offset between the position of the predetermined installation area of the substrate 3 on which the electronic component 2 is installed and the position of the electronic component 2 detected by the second detection processing, based on the position of the predetermined installation area of the substrate 3 detected by the first detection processing.

Thus, even when the position of the intended mounting area of the substrate 3 after mounting cannot be detected, the positional deviation between the electronic component 2 and the intended mounting area of the substrate 3 can be detected. Therefore, the generation of stop time caused by the inability to detect the position of the intended mounting area of the substrate 3 can be suppressed, so that the mounting device 30 with high productivity can be manufactured. In addition, when the electronic component 2 is mounted, even if the position of the intended mounting area of the substrate 3 cannot be detected, the positional deviation can be detected, so that the mounting device 30 with a wide range of applications of the substrate 3 or electronic component 2 that can be mounted can be manufactured.

(2) The control device 50 includes a substrate position calculation unit 55 that calculates the position of the predetermined mounting area of the substrate 3 when it moves from the mounting position P3 to the inspection position P4, and a displacement detection unit 59a detects the position displacement between the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted and the position of the electronic component 2 detected by the second detection unit 42 based on the position calculated by the substrate position calculation unit 55. Therefore, the predetermined mounting area of the substrate 3 can be converted into the position when it moves from the mounting position P3 to the inspection position P4 to detect the position displacement.

(3) The control device 50 includes a correction value calculation unit 56 that calculates a correction value for the substrate position calculation unit 55 to calculate the position of the scheduled mounting area when it moves from the mounting position P3 to the inspection position P4. Therefore, the position of the scheduled mounting area when it moves from the mounting position P3 to the inspection position P4 is calculated using the correction value, so that even if there is a movement error in the stage moving mechanism 34, the positional deviation can be accurately determined.

(4) The second detection unit 42 has a function of detecting the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted. When the second detection unit 42 can detect the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted, the displacement detection unit 59a detects the position displacement based on the position detected by the second detection unit 42. Therefore, when the second detection unit 42 can detect the position of the predetermined mounting area of the substrate 3, by determining the position displacement using the position, the position displacement can be detected with relatively good accuracy even without considering the change caused by the movement. When the second detection unit 42 cannot detect the position of the predetermined mounting area of the substrate 3, the position displacement can be detected by using the position of the predetermined mounting area of the substrate 3 at the mounting position P3.

In addition, since two detection methods can be performed, it is possible to prevent the situation where the position of the predetermined mounting area of the substrate 3 cannot be detected and the position deviation cannot be determined, thereby improving the mounting accuracy and preventing the occurrence of defects. In this way, even electronic components 2 or substrates 3 for which it is difficult to detect the position of the predetermined mounting area of the substrate 3 can be applied, thereby expanding the application range of electronic components 2 or substrates 3 that can be mounted.

(5) The second detection unit 42 includes an imaging unit 42a, which captures the alignment mark 2a of the electronic component 2 and the alignment mark 3a of the predetermined mounting area of the substrate 3 through the electronic component 2 after installation. Therefore, regardless of the arrangement or form of the alignment mark 2a and the alignment mark 3a of the predetermined mounting area of the electronic component 2 or the substrate 3, positional deviation can be determined. The degree of freedom in the arrangement of the alignment mark 2a and the alignment mark 3a of the predetermined mounting area of the electronic component 2 or the substrate 3 is increased, thereby expanding the application range of the electronic components 2 or the substrate 3 that can be installed. The area of the non-functional part that needs to be secured for the alignment marks 2a and 3a can be reduced, and the area of the functional part of the electronic component 2 or the substrate 3 such as the wiring pattern can be expanded, thereby increasing the mounting density in the same area. Furthermore, the density of the functional part can be increased to miniaturize the overall size.

(6) The control device 50 includes a determination unit 59b that determines whether the positional deviation is within the allowable range based on the positional deviation detected by the deviation detection unit 59a. Therefore, whether the mounting is good or not can be determined based on the degree of the positional deviation.

(7) Each time the electronic component 2 is mounted on the substrate 3, the determination unit 59b determines the positional deviation. Therefore, since the inspection can be performed in real time each time the installation is performed, compared with the case where all the substrates 3 after the installation are inspected at the same time in a separately provided inspection device, it is possible to interrupt or correct the operation each time a defect occurs, thereby suppressing the waste of the installed electronic components 2. Furthermore, the number of installation defects can be suppressed to improve the yield rate. Furthermore, the present invention does not necessarily need to determine the positional deviation each time the electronic component 2 is mounted on the substrate 3, and the positional deviation can also be determined every specified number of installations or at specified time intervals. As a result, the time for determination processing can be saved to improve productivity.

(8) The correction value calculation unit 56 calculates the correction value at a predetermined timing. As the mounting device 30 operates, the movement error may change due to changes in the surrounding temperature, deterioration of the mechanism, etc. However, by calculating and updating the movement amount at a predetermined timing, the change in the movement error can be corrected, thereby improving the inspection accuracy.

(Other embodiments) The present invention is not limited to the above embodiments, but also includes other embodiments shown below. In addition, the present invention also includes a combination of all or any one of the above embodiments and other embodiments described below. Furthermore, various omissions, substitutions, and changes may be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention.

(1) The correction value calculation unit 56 may be omitted. When the movement error of the stage moving mechanism 34 is small, the movement amount when moving from the mounting position P3 to the inspection position P4 may be set to be fixed. As an example, the substrate position calculation unit 55 may calculate the position of the predetermined mounting area of the substrate 3 using the distance (A, B) from the mounting position P3 to the inspection position P4 as the movement amount. Thus, there is no need to calculate the correction value in advance. Since there is no need to calculate the correction value, productivity is improved. The inventor conducted research and found that the movement error is within a range of about 100 mm or less, which is negligible. Therefore, for example, by setting the mounting position P3 and the inspection position P4 within 100 mm, the movement range of the substrate stage 33 can be set within 100 mm, so even if the correction value of the movement of the stage moving mechanism 34 is not calculated, the movement error of the substrate stage 33 can be suppressed. Furthermore, such a setting can be appropriately determined based on the required inspection accuracy by pre-measurement.

(2) The second detection unit 42 does not necessarily need to detect the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted. That is, the determination unit 59b may always use the position of the predetermined mounting area of the substrate 3 detected by the first detection unit 35 at the inspection position P4 to determine the positional deviation. Thus, there is no need to use the second detection unit 42 to detect the position of the predetermined mounting area of the substrate 3 on which the electronic component 2 is mounted, thereby improving productivity. Furthermore, it may be possible to select either a mode of using the position of the predetermined mounting area of the substrate 3 detected by the second detection unit 42 or a mode of using the position of the predetermined mounting area of the substrate 3 detected by the first detection unit 35. Thus, an arbitrary mode can be selected depending on whether to improve the inspection accuracy or to attach importance to productivity, thereby improving the degree of freedom in the use of the mounting device 30.

(3) The height variation of the substrate stage 33 when the mounted electronic component 2 located at the mounting position P3 is moved to the inspection position P4 may be detected, and based on the variation, the height of the imaging unit 42a when photographing the alignment mark 2a of the electronic component 2 and the height of the imaging unit 42a when photographing the alignment mark 3a of the predetermined mounting area of the substrate 3 may be changed. Thus, the height of the imaging unit 42a may be limited to within the depth of field of the lens (e.g., 10 μm) to obtain a focused image, thereby improving the detection accuracy of the positional deviation.

(4) In the above embodiment, the electronic component 2 is mounted on the substrate 3 face-down, but the mounting device 30 may be mounted face-up with the surface of the electronic component 2 on which the electrodes including the bumps 2b are formed facing the side opposite to the substrate 3. In this case, the alignment mark 3a of the mounting area of the substrate 3 cannot be identified, so the present invention becomes effective.

(5) The shapes of the alignment marks 2a and 3a are not limited to those shown in the above examples. For example, FIG. 12 (A) shows a state where the position of the cross-shaped alignment mark 2a is aligned with the square alignment mark 3a arranged at four points. In this case, for example, as shown in FIG. 12 (B) and FIG. 12 (C), the alignment mark 2a and the alignment mark 3a overlap, which may cause the alignment mark 3a to be unrecognizable. Furthermore, in FIG. 12 (B), the state where the alignment mark 2a and the alignment mark 3a overlap is also indicated by solid lines.

(6) The alignment marks 2a and 3a do not need to be provided only for alignment. For example, the electronic component 2, a portion of the substrate 3, a portion of the wiring pattern, etc. may be used as the alignment mark. In this case, the alignment mark 3a in the predetermined mounting area of the substrate 3 may not be recognized, so the present invention becomes effective.

(7) In the above example, the movement amount (X direction, Y direction) is calculated using calibration glass. In this way, the movement amount (X direction, Y direction) can be calculated more accurately. However, the movement amount (X direction, Y direction) can be calculated using the substrate 3 before installation instead of the calibration glass. By using the substrate 3 before installation, it is not necessary to prepare calibration glass, and the movement amount (X direction, Y direction) can be calculated more simply. When the correction value is updated at a predetermined timing, the substrate 3 used during installation is directly used, so there is no need to switch to calibration glass, etc., thereby suppressing the reduction in productivity.

(8) In the above example, an example of recording the result of the judgment when the alignment is judged to be poor is explained. However, the information to be recorded also includes the judgment result when the alignment is judged to be good and the detected position deviation. The control device 50 can, for example, determine the timing of updating the correction value based on the monitoring and analysis of the recorded position deviation. In this way, it is possible to update at an appropriate time, thereby improving the installation accuracy and suppressing the reduction in productivity. In addition, for example, by stopping the work and promoting confirmation based on the monitoring and analysis of the position deviation results, the occurrence of defects can be prevented. Furthermore, by performing such monitoring and analysis at the same time as the installation, real-time feedback can be provided to the installation, thereby further improving the yield rate.

1: Electronic component mounting system 2: Electronic component 2a, 3a, am: Alignment mark 2b: Bump 3: Substrate 10: Supply device 11: Supply stage 12: Sheet 13: Camera 20: Pickup device 21: Pickup head 21a: Adsorption nozzle 22, 32: Head moving mechanism 23, 323: Support frame 30: Mounting device 31: Bonding head 31a: Adsorption nozzle 33: Substrate stage 34: Stage moving mechanism 35: First detection unit 35a, 42a: Camera unit 40: Inspection unit 42: Second detection unit 43: Camera lifting mechanism 5 0: Control device 51: Feeding device control unit 52: Pickup head control unit 53: Bonding head control unit 54: Substrate stage control unit 55: Substrate position calculation unit 56: Correction value calculation unit 57: Lifting mechanism control unit 58: Camera control unit 59a: Offset detection unit 59b: Determination unit 321: Sliding mechanism 321a: Track 321b: Slider 322: Lifting mechanism A, B: Distance M: Storage unit P1: Feeding position P2: Handover position P3: Installation position P4: Inspection position S01~S15: Steps X, Y, Z: Axes θ: Direction

FIG. 1 is a plan view showing an electronic component mounting system to which a mounting device according to an embodiment is applied. FIG. 2 is a front view showing an electronic component mounting system to which a mounting device according to an embodiment is applied. FIG. 3 is a cross-sectional view taken along line A-A of FIG. 2 , showing a state in which a camera unit enters between a bonding head and a substrate stage in order to photograph an electronic component and a predetermined mounting area on a substrate. FIG. 4 is a cross-sectional view taken along line A-A of FIG. 2 , showing a state in which an electronic component held by a bonding head is mounted on a substrate. FIG. 5 is a functional block diagram of a control device. FIG. 6 is a diagram showing a movement amount from a mounting position to an inspection position. FIG. 7 is a diagram showing a movement error from a mounting position to an inspection position. FIG. 8 is a diagram showing a state in which an electronic component is mounted face-down on a substrate. FIG. 9 (A) is a diagram showing an alignment mark of an electronic component, and FIG. 9 (B) is a diagram showing an alignment mark of a predetermined mounting area of a substrate. FIG. 10 (A) is a diagram showing a state where the alignment mark of an electronic component is aligned with the alignment mark of a predetermined mounting area of a substrate, and FIG. 10 (B) is a diagram showing a state where the alignment mark of a predetermined mounting area of a substrate cannot be recognized. FIG. 11 is an example of an operation flow chart of an electronic component mounting system. FIG. 12 (A) to FIG. 12 (C) are diagrams showing another form of an alignment mark.

1:Electronic parts installation system

2: Electronic parts

3: Substrate

10: Supply device

11: Supply platform

12: Sheet

20: Pickup device

21: Pickup head

21a: Suction nozzle

22, 32: Head moving mechanism

30: Installation

31:Joint head

33: Substrate carrier

34: Stage moving mechanism

35: First detection unit

35a, 42a: Imaging unit

40: Inspection unit

42: Second detection unit

43: Camera lifting mechanism

50: Control device

321: Sliding mechanism

321a: Track

321b: Sliding member

322: Lifting mechanism

P1: Supply position

P2: Handover position

P3: Installation location

P4: Check position

X, Y, Z: axis

θ: direction

Claims (8)

A mounting device for mounting an electronic component on a substrate, the mounting device comprising: a substrate carrier for mounting the substrate; a carrier moving mechanism for moving the substrate carrier; a first detection unit for detecting the position of the electronic component before mounting and the position of a predetermined mounting area of the substrate before mounting at a mounting position where the electronic component is mounted on the substrate carrier; a bonding head for aligning the position of the electronic component with the position of the predetermined mounting area of the substrate at the mounting position and mounting the electronic component on the substrate; a second detection unit for detecting the position of the electronic component after mounting at a detection position isolated from the mounting position; and a control device, wherein the control device includes The device comprises an offset detection unit, which detects the position offset between the position of the predetermined mounting area of the substrate on which the electronic component is mounted and the position of the electronic component detected by the second detection unit based on the position of the predetermined mounting area of the substrate detected by the first detection unit; and a substrate position calculation unit, which calculates the position of the predetermined mounting area of the substrate when it moves from the mounting position to the inspection position, and the offset detection unit detects the position offset between the position of the predetermined mounting area of the substrate after the electronic component is mounted and moved to the inspection position calculated by the substrate position calculation unit and the position of the electronic component at the inspection position detected by the second detection unit. The mounting device as described in claim 1 is characterized in that the control device includes a correction value calculation unit, and the correction value calculation unit calculates a correction value used by the substrate position calculation unit to calculate the position of the predetermined mounting area moving from the mounting position to the inspection position. The mounting device as described in claim 1 or claim 2 is characterized in that the second detection unit has a function of detecting the position of the predetermined mounting area of the substrate on which the electronic component is mounted, and when the second detection unit is capable of detecting the position of the predetermined mounting area of the substrate on which the electronic component is mounted, the offset detection unit detects the position offset based on the position detected by the second detection unit. The mounting device as described in claim 1 or claim 2 is characterized in that the second detection unit includes a camera unit, and the camera unit photographs the alignment mark of the electronic component or the alignment mark of the predetermined mounting area of the substrate through the electronic component after the mounting. The mounting device as described in claim 1 or claim 2 is characterized in that the control device includes a determination unit, which determines whether the position offset of the position offset is within an allowable range based on the position offset detected by the offset detection unit. The mounting device as described in claim 5 is characterized in that the determination unit determines the positional deviation each time the electronic component is mounted on the substrate. The installation device as described in claim 2 is characterized in that the correction value calculation unit calculates the correction value at a specified time. A mounting method for mounting an electronic component on a substrate, wherein the mounting method comprises: a first detection process, wherein a first detection unit detects the position of the electronic component before mounting and the position of a predetermined mounting area of the substrate before mounting at a mounting position where the electronic component is mounted on the substrate; a mounting process, wherein a bonding head aligns the position of the electronic component with the position of the predetermined mounting area of the substrate at the mounting position based on a result of the first detection process and mounts the electronic component on the substrate; a second detection process, wherein a second detection unit detects the position of the electronic component after mounting at a detection position isolated from the mounting position; and an offset detection process, wherein the offset detection unit detects the position of the electronic component after mounting based on a result of the first detection process. The position of the predetermined installation area of the substrate is detected by the first detection processing, and the position offset between the position of the predetermined installation area of the substrate on which the electronic component is installed and the position of the electronic component detected by the second detection processing is detected; and a substrate position calculation processing is performed, in which a substrate position calculation unit calculates the position of the predetermined installation area of the substrate when it moves from the installation position to the inspection position, and the offset detection processing detects the position offset between the position of the predetermined installation area of the substrate that moves to the inspection position after the electronic component is installed, calculated by the substrate position calculation unit, and the position of the electronic component at the inspection position detected by the second detection unit.