TWI803844B - Mounting device for electronic parts - Google Patents

Abstract

The present invention provides a mounting device for electronic components that can mount with high precision while suppressing generated dust. The mounting device 1 of the embodiment includes: a mounting mechanism 3 for mounting the electronic component C on the substrate S at the mounting position OA by a mounting head 31 holding the electronic component C; a substrate supporting mechanism 2 for supporting the substrate S on which the electronic component C is mounted; Part 6, supplying the electronic component C; and a transfer part 7, transferring the electronic part C from the supply part 6 to the mounting position OA, the transfer part 7 includes: a transfer head 71, picking up the electronic part C from the supply part 6 and turning it over, to the mounting head 31 ; and the transfer mechanism 73 to move the transfer head 71 to the space formed by the substrate support mechanism 2 retracting the substrate S from the mounting position OA.

Description

Mounting device for electronic parts

The invention relates to a mounting device for electronic components.

There are two methods of mounting a semiconductor chip (chip) as an electronic component on a substrate: face-up and face-down. The surface of the semiconductor wafer on which the semiconductor layer is formed is called a front surface (face). The method of mounting with the front side facing the substrate is facing upward. For example, when mounting a semiconductor chip on a lead frame or the like and wiring between electrodes and the frame using wires, the mounting is performed with the front face up.

The method of mounting with the front side facing the substrate is face down. For example, in the case of a flip chip connection in which a bump electrode is provided on the surface of a semiconductor layer and the bump electrode is pressed against the wiring of the substrate to perform fixation and electrical connection, the front-side-down installed.

When mounting electronic components such as semiconductor wafers on a substrate, it is necessary to precisely position the electronic components with respect to the substrate. In order to cope with this problem, for example, a camera capable of taking pictures in both vertical and vertical directions is inserted between the mounting tool and the board that absorb and hold the electronic components. Based on the image taken by the camera, the relative positions of the board and the electronic parts in the horizontal direction are recognized. Then, after correcting the position of the mounting tool based on the recognized relative position, the electronic component is mounted on the substrate. [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-129913

[Problem to be Solved by the Invention] In recent years, in three dimensional (3D) packages and hybrid bonding in which semiconductor chips are arranged in multiple layers to increase the density, it is necessary to bond electrodes with very narrow pitches. Therefore, higher precision, such as submicron order precision, is required when electronic components are mounted on a substrate. Furthermore, at the time of mounting, errors due to the movement of the mechanical part used for mounting and dust generated by the movement may cause joint failure. Therefore, it is preferable that the distance over which the mechanical part operates is as short as possible.

However, electronic components are picked up by a reversing tool or the like from a state attached to a wafer sheet, inverted, received by a mounting tool moved to a receiving position, and transported to a mounting position. As such, if the mounting tool moves between the receiving position where the mounting tool receives the electronic components and the mounting position where the electronic components are mounted on the substrate, the position of the electronic components at the mounting position cannot be fixedly maintained, making it difficult to obtain high mounting accuracy. In addition, due to the movement of the installation tool, the amount of dust generated at the installation location also increases.

This invention was made in order to solve the above-mentioned subject, and it aims at providing the mounting apparatus of the electronic component which can mount with high precision, suppressing the amount of the dust which generate|occur|produces.

[Technical means to solve the problem] The electronic component mounting device of the present invention includes: a mounting mechanism for holding a mounting head of the electronic component at a mounting position to mount the electronic component on a substrate; a substrate support mechanism for supporting the substrate on which the electronic component is mounted; a supply unit, supplying the electronic components; and a transfer unit that transfers the electronic components from the supply unit to the mounting position, the transfer unit including: a transfer head that picks up the electronic components from the supply unit and reverses them. transfer to the mounting head; and a transfer mechanism to move the transfer head to a space formed by retracting the substrate from the mounting position by the substrate support mechanism.

[Effect of the invention] The present invention can provide a mounting device for electronic components that can mount with high precision while suppressing the amount of generated dust.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2 , this embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. As shown in FIG. FIG. 1 is a front view showing a schematic configuration of a mounting device 1 . FIG. 2 is a plan view showing an electronic component C and a substrate S. As shown in FIG. In addition, the drawings are schematic diagrams, and the size (hereinafter also referred to as “dimensions”), shape, ratio of the sizes of the respective parts, and the like of each part may differ from actual ones.

[electronic parts] First, semiconductor elements such as integrated circuits (integrated circuits, ICs) and large-scale integrated circuits (large-scale integrated circuits, LSIs) are exemplified as electronic components C to be mounted in the present embodiment.

As shown in FIG. 2 , the present embodiment uses a rectangular parallelepiped semiconductor wafer as the electronic component C. As shown in FIG. Each semiconductor wafer is a bare chip (bare chip) separated into individual pieces by dicing which cuts a semiconductor wafer (wafer) into small pieces. The bare chip has bumps or bumpless electrodes on the exposed semiconductor, and is mounted by flip-chip connection to pads on the substrate S.

The electronic component C is provided with a plurality of marks m for positioning. In the present embodiment, the two marks m are provided one each at a pair of diagonal corners of the rectangular electronic component C. As shown in FIG. The mark m is provided on the surface of the electronic component C on which the electrodes are formed, that is, the front surface. This embodiment is an example of an apparatus for performing front-down mounting in which the front side faces the board|substrate S and mounts.

[substrate] In this embodiment, as shown in FIG. 2 , the substrate S on which the above-mentioned electronic components C are mounted is a plate-shaped member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed. The substrate S is provided with a mounting area B, which is an area where the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. As shown in FIG. In the present embodiment, the two marks M are provided at positions outside the mounting area B and at positions corresponding to the marks m of the electronic component C. As shown in FIG.

[installation device] The mounting device 1 of this embodiment is a mounting device 1 capable of mounting with high precision, for example, mounting accuracy below ±0.2 μm, as shown in FIG. 1 and FIG. 3 (A) and FIG. 3 (B), including: A substrate support mechanism 2 , a mounting mechanism 3 , a first imaging unit 4 , a second imaging unit 5 , a supply unit 6 , a transfer unit 7 , and a control device 8 . 3(A) is a plan view of the mounting device 1 , and FIG. 3(B) is a plan view showing a mark M transmitted through a mounting head 31 described later.

In addition, in the following description, the direction in which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is referred to as the Z-axis, and two axes orthogonal to each other in a plane perpendicular thereto are referred to as the X-axis and the Y-axis. . In this embodiment, the Z-axis is vertical, the direction following gravity is referred to as downward, the direction resisting gravity is referred to as upward, and the position on the Z-axis is referred to as height. In addition, the X-axis and the Y-axis are on a horizontal plane, and when viewed from the front side of FIG. 1 , the X-axis is the left-right direction, and the Y-axis is the depth direction. However, the present invention is not limited to the above installation direction. Regardless of the installation direction, on the basis of the substrate S or the substrate support mechanism 2, the side on which the electronic component C is mounted is called the upper side, and the opposite side is called the lower side.

The substrate supporting mechanism 2 is a mechanism for supporting the substrate S on which the electronic component C is mounted, and is a so-called substrate stage (stage). The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. As shown in FIG. The mounting mechanism 3 has a mounting head 31 . The mounting head 31 has a transmissive portion for allowing the mark M of the substrate S facing the electronic component C to be recognized through the transmissive portion while the electronic component C is being held.

The first imaging unit 4 is arranged on the mounting head 31 at the mounting position OA where the electronic component C is mounted on the substrate S, and is disposed on the lower side of the substrate supporting mechanism 2, and the substrate S is moved from the mounting position OA by the substrate supporting mechanism 2. In the retracted state, the mark m of the electronic component C held by the mounting head 31 is imaged from the position facing the electronic component C, that is, from below. The mounting position OA is a position where the electronic part C is mounted on the substrate S, and in the figure, a point along the direction of the Z axis passing through a point (such as a center point) on the XY coordinates in the area where the electronic part C is to be mounted underlined. As will be described later, the attachment position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5 . The second imaging unit 5 is disposed above the mounting head 31 at the mounting position OA, and images the mark M of the substrate S through the transmission portion of the mounting head 31 (hereinafter referred to as “shooting over the mounting head 31 ”). Based on the image captured in this way, detection of the marker m and the marker M, that is, identification of the marker m and the marker M can be performed.

In addition, the substrate supporting mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from the images of the marks m and M captured by the first imaging unit 4 and the second imaging unit 5 . Each part of the mounting device 1 as described above is mounted on the support stand 11 provided on the installation surface. The top surface of the supporting platform 11 is a horizontal plane.

The supply unit 6 supplies the electronic components C. As shown in FIG. The transfer unit 7 transfers the electronic component C from the supply unit 6 to the mounting position OA. The transfer unit 7 has a transfer head 71 and a transfer mechanism 73 . The transfer head 71 picks up the electronic component C from the supply unit 6 , reverses it, and hands it to the mounting head 31 . The transfer mechanism 73 moves the transfer head 71 to the space formed by the substrate supporting mechanism 2 retracting the substrate from the mounting position OA, and positions it at the mounting position OA.

The control device 8 controls the operation of the mounting device 1 . The control device 8 includes, for example, a dedicated electronic circuit or a computer that operates with a predetermined program. That is, the control device 8 uses a processing device such as a Programmable Logic Controller (PLC) or a central processing unit (Central Processing Unit, CPU) to read out programs and data from a storage device to control the mounting device 1 . Each part will be described in detail below.

(substrate support mechanism) As shown in FIGS. 1 and 3(A) , the substrate support mechanism 2 is disposed on the support table 11 and has a stage 21 and a drive mechanism 22 . The stage 21 is a plate-shaped member on which the substrate S is placed. The driving mechanism 22 is, for example, a double-layered structure that has a guide rail 22 a in the X-axis direction and a guide rail 22 b in the Y-axis direction, and uses a motor (not shown) as a drive source to move the stage 21 in a horizontal plane using a belt or a ball screw. Shaft movement mechanism. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. As shown in FIG. In addition, although illustration is omitted, the drive mechanism 22 includes a θ drive mechanism that rotates and moves the stage 21 in the horizontal plane.

The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along the guide rail 22b. The through-hole 23a is formed in the said moving plate 23 so that the 1st imaging part 4 can image|photograph the electronic component C. As shown in FIG.

In addition, although not shown, at one of the moving ends of the stage 21 of the substrate support mechanism 2 in the X-axis direction (specifically, the moving end on the right side in the drawing), there is a device for supplying/storing the substrate S to/from the stage. 21 loaders/unloaders. Therefore, the substrate support mechanism 2 receives the supply of the substrate S from the loader or delivers the substrate S to the unloader in a state where the stage 21 is moved to the moving end.

(mounting mechanism) The mounting mechanism 3 has a mounting head 31 and a drive mechanism 32 . The mounting head 31 has a substantially rectangular parallelepiped shape, and has a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through hole formed with the Z-axis direction as the axis. The holding portion 31b is a plate-shaped member capable of transmitting light for imaging, and is installed so as to close the opening of the hollow portion 31a toward the substrate S side. For example, a transparent glass plate is used as the holding portion 31b. The holding part 31b is a so-called mounting tool, and holds the electronic component C. As shown in FIG.

As shown in FIG. 3(B) , a suction region D for suction-holding the electronic component C is provided at the center of the holding portion 31 b. Although not shown in the figure, adsorption holes are formed in the adsorption region D. As shown in FIG. A flow path for communicating the suction hole with a negative pressure source is formed inside the holding portion 31b, and the electronic component C can be sucked and held by generating negative pressure in the suction hole. The periphery of the suction area D of the holding portion 31 b is a transmission area T through which the mark M of the substrate S can be transmitted and imaged even when the electronic component C is suctioned. That is, the mounting head 31 has a transparent portion so that the mark M on the substrate S can be imaged by the second imaging unit 5 . In addition, the holding surface (adsorption surface) which holds the electronic component C by the holding part 31b is called a lower end surface.

The driving mechanism 32 includes a moving body 33 , a moving body 34 , and a moving body 35 , and is a mechanism for driving the mounting head 31 . The movable body 33 is provided so as to be movable along a guide rail 33 a in the Y-axis direction provided on the support table 11 . The moving body 34 is provided so as to be movable along a guide rail 34 a in the X-axis direction provided on the top surface of the moving body 33 . The moving body 35 is provided so as to be able to move along a guide rail 35 a in the Z-axis direction provided on the front surface of the moving body 34 . The mobile body 35 is formed in a substantially concave shape in plan view. These moving bodies 33 , 34 , and 35 are driven by a ball screw, a linear motor, an air cylinder, or the like using an electric motor as a drive source.

The mounting head 31 is provided on the lower portion of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31 b holding the mounting head 31 on the substrate S. As shown in FIG. In addition, the moving body 35 provided with the mounting head 31 moves in the X-axis direction and the Y-axis direction by the movement of the moving body 33 and the moving body 34 . Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31 . In addition, although illustration is omitted, the drive mechanism 32 is provided with theta drive mechanism which rotates and moves the mounting head 31 in a horizontal plane.

In addition, in this embodiment, from the viewpoint of preventing movement errors, it is preferable to set the movement amount of the drive mechanism 32 in the X-axis direction, the Y-axis direction, and the Z-axis direction to be extremely short. For example, the moving amounts of the moving body 33 and the moving body 34 in the X-axis direction and the Y-axis direction are set to several mm to several tens of mm, respectively. In addition, the amount of movement of the moving body 35 in the Z-axis direction is also set to about several mm to several tens of mm. That is, the mounting head 31 is at a height position where the lower end surface of the holding portion 31 b is at a distance of several mm, for example, 1 mm to 2 mm (separation distance in the vertical direction) relative to the upper surface of the substrate S placed on the stage 21. , reception of the electronic component C and imaging of the mark m of the received electronic component C are performed. Therefore, as long as the movement amount of the movable body 35 in the Z-axis direction can be ensured, the electronic component C held by the holding portion 31b can be pressurized and mounted on the substrate S with a predetermined pressure from at least the height position. That's it.

(first filming department) The first photographing unit 4 has a camera, a lens, a lens barrel, a light source, etc., and is fixed in a receiving hole 11 a provided in the supporting table 11 . The first imaging unit 4 arranges the optical axis of the camera in a direction capable of imaging the mark m of the electronic component C held by the mounting head 31 . Specifically, it is arranged so that the optical axis becomes a vertical direction. The first imaging unit 4 does not move relative to the mounting position OA of the electronic component C. In the present embodiment, the first imaging unit 4 is disposed upward in a position below the substrate support mechanism 2 , that is, in the housing hole 11 a of the support base 11 , so that the optical axis of the camera coincides with the mounting position OA. The first imaging unit 4 is fixed to the support table 11 with a size and a positional relationship in which the two marks m do not deviate from the imaging field of view even if the electronic component C is moved to the maximum for positioning. That is, the imaging field of view of the first imaging unit 4 is set in consideration of the range in which the two marks m of the electronic component C can move to the maximum for positioning in a state where the optical axis coincides with the mounting position OA and is fixed.

Here, the immobility means that the first imaging unit 4 (the same applies to the second imaging unit 5 described later) does not move when imaging the marker m and the marker M. For example, the imaging unit 4 and the imaging unit 5 are equipped with driving devices in the X-axis and Y-axis directions (horizontal direction) and a driving device in the Z-axis direction (up-down direction), and photographing is performed as an operation preparation operation of the device by these driving devices. The adjustment of the horizontal direction position and the adjustment of the vertical direction position of the part 4 and the imaging part 5, and the structure which does not move during the operation of the apparatus afterwards are included in immobility.

(Second filming department) The second imaging unit 5 has a camera, a lens, a lens barrel, a light source, and the like, and is supported by a frame (not shown) and fixed at a position above the support table 11 , more specifically, above the mounting head 31 . The second imaging unit 5 arranges the optical axis of the camera in a direction capable of imaging the mark M around the mounting area B of the substrate S through the holding portion 31 b of the mounting head 31 . That is, in the present embodiment, the second imaging unit 5 is disposed directly above the mounting head 31 so that the optical axis of the camera coincides with the mounting position OA and is disposed downward. Like the first imaging unit 4 , the second imaging unit 5 does not move relative to the mounting position OA of the electronic component C. As shown in FIG. That is, the imaging field of view of the second imaging unit 5 is set in consideration of the maximum movable range of the two marks marked on the mounting area B of the substrate S for positioning. Therefore, the size of the transmission portion of the mounting head 31 is set in accordance with the imaging field of view of the second imaging unit 5 .

Here, the arrangement of the first imaging unit 4 and the second imaging unit 5 in this embodiment will be described. The mounting device 1 of this embodiment preferably achieves a mounting accuracy of 0.2 μm or less. For this reason, the first imaging unit 4 and the second imaging unit 5 need to have performance capable of performing high-magnification and high-definition imaging commensurate with their accuracy.

In general, it is known that in order to capture a high-definition image, it is necessary to arrange an imaging unit at a position close to the electronic component C or substrate S to be captured. Therefore, it is also preferable to arrange the first imaging unit 4 and the second imaging unit 5 as close as possible to the electronic component C or the substrate S, that is, to shorten the imaging distance.

However, in the mounting apparatus 1 of the present embodiment, in order to shorten the amount of downward movement of the electronic component C during mounting as much as possible, the electronic component C is positioned at a position highly close to the upper surface of the substrate S. The photograph of the mark m of C or the photograph of the mark M of the substrate S. Therefore, the moving plate 23 of the stage 21 and the drive mechanism 22 exists between the 1st imaging part 4 and the electronic component C, and the mounting head 31 exists between the 2nd imaging part 5 and the board|substrate S. As shown in FIG. Therefore, it is necessary to avoid interference with the moving plate 23 and the mounting head 31 , so there is a limit to shortening the distance between the first imaging unit 4 and the electronic component C and shortening the distance between the second imaging unit 5 and the substrate S.

Therefore, the inventors of the present application studied the maximum value of an imaging distance (so-called working distance) at which an image capable of achieving the mounting accuracy can be captured. As a result, it was deduced to be approximately 100 mm. Based on the above results, in this embodiment, the first imaging unit 4 is fixedly arranged at a height position within 100 mm of the imaging distance from the electronic component C, and the second imaging unit 5 is fixedly arranged at a height position within 100 mm from the substrate S. Height position within 100 mm distance.

In addition, the mounting head 31 positioned between the second imaging unit 5 and the substrate S is a member having a relatively large height dimension (dimension in the Z-axis direction) in order to ensure rigidity and the like. Therefore, it is considered that interference occurs in a normal configuration. Therefore, as a result of diligent research by the inventors of the present application, they succeeded in minimizing the height dimension while maintaining the functions and rigidity required for the mounting head 31 . Specifically, the height dimension (dimension from the lower end of the holding portion 31 b to the upper opening of the hollow portion 31 a ) of the mounting head 31 is configured to be about 70 mm. Thereby, the second imaging part 5 can be arrange|positioned at the height position of 100 mm or less with respect to the board|substrate S. As shown in FIG.

(Supply Department) The supply unit 6 has a support mechanism 61 and a drive mechanism 62 . The support mechanism 61 is a device that supports the wafer sheet WS on which the electronic components C are attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. In the supply unit 6 , the surface (region) on which the electronic component C is mounted is referred to as a mounting surface F. As shown in FIG. In the present embodiment, the electronic component C is a component in which a wafer attached to the wafer sheet WS is divided into individual pieces by dicing. Therefore, the surface (surface of the wafer) on which the electronic component C is attached of the wafer sheet WS is the mounting surface F. As shown in FIG. The wafer sheet WS is attached to an unillustrated wafer ring. The supporting mechanism 61 has a ring holder (ring holder) 61 a to which a wafer ring is fitted. That is, the surface of the support mechanism 61 that supports the wafer sheet WS may also be referred to as a mounting surface F. As shown in FIG.

In addition, although not shown, one of the moving ends in the Y-axis direction of the support mechanism 61 (specifically, the moving end on the front side in the drawing) is provided with a loader for supplying/storing wafer rings to the ring holder 61a. machine/unloader. The support mechanism 61 receives the supply of wafer rings from the loader or hands the wafer rings to the unloader while moving to the moving end.

In addition, although not shown, the support mechanism 61 has an expansion mechanism that opens a gap between the electronic components C by extending the wafer sheet WS, sandwiches the extended wafer sheet WS, and separates the electronic components C by stretching the wafer sheet WS. A push-up mechanism that pushes up and separates. Furthermore, the support mechanism 61 is equipped with theta drive mechanism which rotates and moves the ring holder 61a in a horizontal plane. In addition, the push-up mechanism is fixedly arranged on the support table 11 , and the receiving of the electronic components C from the supply unit 6 by the transfer unit 7 , that is, pickup is performed at this position (pick-up position).

The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the driving mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and uses a motor not shown as a driving source, and uses a belt or a ball screw to make the support mechanism 61 move in the X-axis and Y-axis directions in the horizontal plane. Moving institutions. The drive mechanism 62 functions as a positioning mechanism that positions the electronic component C with respect to the transfer head 71 . Moreover, the drive mechanism 62 is arrange|positioned at the position lower than the height position L of the mounting surface F (refer FIG.5(A) - FIG.5(D)).

(transfer department) The transfer unit 7 has a transfer head 71 , an arm 72 , and a transfer mechanism 73 . As shown in FIG.4(A) and the enlarged view of FIG.4(B), the transfer head 71 has the adsorption nozzle 71a and the reverse drive part 71b. The adsorption nozzle 71a is connected to an air pressure circuit (not shown) through a tube, and the electronic component C is adsorbed to the tip by negative pressure, and the electronic component C is released by releasing the negative pressure or positive pressure. The reverse drive part 71b reverses the electronic component C adsorbed by the adsorption nozzle 71a in the up-down direction, as shown in FIG.4(A) and FIG.4(B). That is, the suction nozzle 71a is provided so as to be rotatable between a direction toward the wafer sheet WS and a direction toward the mounting head 31 by the reverse drive portion 71b. The reverse drive unit 71b is, for example, a motor.

In addition, although not shown, the transfer head 71 has a buffer member that drives the adsorption nozzle 71a in the vertical direction, and applies an appropriate load when the tip of the adsorption nozzle 71a comes into contact with the electronic component C, and absorbs an excessive load. . As a buffer member, for example, a voice coil motor (voice coil motor) is used.

The arm part 72 is a member provided with the transfer head 71 at one end. As shown in FIG. 3(A) , the arm portion 72 has an extension portion 72 a and a base portion 72 b. The extension portion 72a is formed into an L-shape by a rectangular parallelepiped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped member linearly extending in the X-axis direction toward the mounting mechanism 3 . . At one end of the extension portion 72a facing the attachment mechanism 3, the reverse drive portion 71b is provided so that the rotation axis becomes the Y-axis direction. The adsorption nozzle 71a is provided rotatably by installing the adsorption nozzle 71a on the rotation shaft of the reverse drive part 71b. The base portion 72 b is a plate-shaped body parallel to the X-axis direction, and is fixed to the other end of the extension portion 72 a (see FIG. 5(A) to FIG. 5(D) ).

A pipe for supplying negative pressure connected to the suction nozzle 71 a, a reverse drive part 71 b, and a cable for electrical connection connected to the buffer member are built in the arm part 72 . Built-in means that it is not exposed to the outside by being covered by the outer package of the arm part 72 . In this embodiment, a tube and a cable are inserted into a hollow portion formed inside the arm portion 72 .

The transfer mechanism 73 moves the transfer head 71 between the supply part 6 and the installation position OA by driving the arm part 72 . The transfer mechanism 73 has a slide portion provided at a position not overlapping the loading surface F in plan view. In other words, the sliding portion of the transfer mechanism 73 is provided outside the moving range of the support mechanism 61 . The transfer mechanism 73 drives the arm part 72 as the slider slides. The term "sliding part" as used herein refers to a structural part in which components move while contacting each other. Such a sliding portion becomes a source of generation of dust. As shown in FIG. 5(A) to FIG. 5(D), the sliding part of this embodiment includes a first sliding part 732b and a second sliding part 734b which will be described later. The first sliding portion 732b and the second sliding portion 734b are provided at a position lower than the height position L of the mounting surface F (below).

As shown in FIGS. 5(A) to 5(D), the transfer mechanism 73 has a fixed body 731 , a first drive unit 732 , a moving body 733 , and a second drive unit 734 . The fixed body 731 is a rectangular parallelepiped member fixed to the support table 11 (see FIG. 3(A) ) and extending in the X-axis direction. The position of the fixed body 731 is fixed relative to the installation position OA.

The first drive section 732 drives the arm section 72 in the X-axis direction. The first driving part 732 has a first driving source 732a and a first sliding part 732b. The first driving source 732 a is a linear motor extending in the X-axis direction, and is provided along the upper surface of the fixed body 731 . The first sliding part 732b is a linear guide rail extending in the X-axis direction, and is disposed on the front of the fixed body 731 . In addition, since the mover moves without contacting the stator, the linear motor does not have a sliding portion.

The moving body 733 is a block in the shape of a cuboid, and is configured to be able to follow the operation of the first driving source 732a by installing the mover of the first driving source 732a and the sliding member of the first sliding portion 732b. And slide to move in the X-axis direction.

The second drive section 734 drives the arm section 72 in the Z-axis direction. The second driving part 734 has a second driving source 734a and a second sliding part 734b. The second drive source 734 a is a linear motor extending in the Z-axis direction, and is provided on the moving body 733 . The second sliding portion 734 b is a linear guide extending in the Z-axis direction, and is provided on the moving body 733 .

The base part 72b of the arm part 72 is configured to be able to slide and move in the Z-axis direction by installing the mover of the second driving source 734a and the slider of the second sliding part 734b. In this way, the sliding part of this embodiment has the 1st sliding part 732b and the 2nd sliding part 734b which slide linearly along two orthogonal axes. Furthermore, the first sliding part 732b and the second sliding part 734b are disposed on both sides facing the front and back of the common moving body 733 in a positional relationship overlapping in the height direction. That is, the positions of the two orthogonal axes are close to each other. In addition, it is preferable that the distance between the two sides of the moving body 733 is short, that is, the moving body 733 is thin.

(The relationship between the distance between the substrate on the stage and the mounting head and the size of the transfer head) In this embodiment, as shown in FIG. 1 , in order to move the transfer head 71 to the mounting position OA, it is necessary to retreat the substrate S, and thereby set the facing distance between the substrate S at the mounting position OA and the mounting head 31 . In other words, in order to move the transfer head 71 to the mounting position OA, it is necessary to retreat the substrate S, so the height position of the upper surface of the substrate S supported by the substrate support mechanism 2 is set to be close to the height position when receiving the electronic component C at the mounting position OA. The height position of the mounting head 31. More specifically, the distance h between the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C is relatively small. The dimension H in the height direction of the transfer head 71 at the tip of the arm portion 72 is shorter (h<H). Here, as described above, the distance from the lower end surface of the holding portion 31 b to the height position of the upper surface of the substrate S is, for example, several mm.

(arm size) As shown in FIG. 1 , FIG. 3(A), and FIG. 4(A), the extension portion 72 a of the arm portion 72 has a width w of a member extending linearly in the Y-axis direction and a linear length in the X-axis direction. The width d of the members extending in a shape is longer than the thickness t in the Z-axis direction (w>t, d>t). Thereby, while suppressing the dimension expansion of the height direction of the arm part 72, the rigidity of the relatively long arm part 72 is ensured, and the position of the electronic component C transferred by the transfer head 71 is stabilized. By suppressing the dimension expansion of the arm portion 72 in the height direction, it is not necessary to raise the receiving position of the mounting head 31 .

(control device) The control device 8 controls the positioning mechanism so as to position the substrate S and the electronic component C based on the marks m and the marks M imaged by the first imaging unit 4 and the second imaging unit 5 . That is, in the control device 8, the position of the mark m of the designed electronic component C on the XY coordinates and the position of the mark M of the designed board S on the XY coordinates correspond to the position where the electronic component C should be accurately mounted. It is stored in the storage device as each reference position.

The reference position may not be a designed position, but may be the position of the mark m and the mark M when mounting the electronic component C on the substrate S in advance was attempted and as a result, it was correctly mounted. The control device 8 obtains the deviation between the mark m photographed by the first imaging unit 4 and the mark M photographed by the second imaging unit 5 and the reference position, and controls the positioning mechanism (the driving mechanism 22 and the driving mechanism 32) so that The electronic component C and the substrate S move in the direction and amount of movement in which the misalignment is corrected.

In addition, the control device 8 controls the transfer mechanism 73 of the transfer unit 7 and the drive mechanism 62 of the supply unit 6 based on the map data indicating the position coordinates of the electronic components C on the wafer sheet WS, thereby picking up the electronic components to be picked up. C is sequentially positioned at the pick-up position. In addition, the pick-up here means detaching and receiving the electronic component C from a member on which the electronic component C is placed, for example, the wafer sheet WS. Furthermore, the control device 8 controls the holding of the electronic component C by the suction nozzle 71a of the transfer head 71, the reverse rotation of the suction nozzle 71a by the reverse drive unit 71b, the movement of the transfer head 71 to the mounting head 31 by the transfer mechanism 73, Delivery and the like of the electronic component C to the mounting head 31 by the suction nozzle 71a.

[action] The operation of the present embodiment as described above will be described with reference to the explanatory diagrams of FIG. 3(A) to FIG. 7(C) and the flowcharts of FIGS. 8 and 9 . In addition, in the initial state, the substrate S is delivered from the loader to the stage 21 of the substrate support mechanism 2 , but retreats together with the stage 21 from the mounting position OA, which is a position facing the mounting head 31 .

[Transfer of electronic parts] The transfer operation of the electronic component C will be described with reference to the explanatory diagrams of (A) to (E) of FIG. 6 and the flowchart of FIG. 8 . The ring holder 61 a of the support mechanism 61 in the supply unit 6 is equipped with a wafer ring to which the wafer sheet WS is attached by an automatic loader (see FIG. 3(A) and FIG. 3(B) ). Electronic components C divided into individual pieces by dicing are attached to the wafer sheet WS. In addition, in FIG. 5(A) - FIG. 5(D), illustration is omitted except for the electronic component C to be picked up.

First, as shown in FIG. 5(A) and FIG. 3(A), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pick-up position. Also, by moving the arm 72 in the X-axis direction, the tip of the suction nozzle 71a of the transfer head 71 is positioned directly above the electronic component C to be mounted, that is, at the pick-up position (step S101 ).

The movement of the wafer sheet WS in the X-axis and Y-axis directions at this time is performed by the drive mechanism 62 of the supply unit 6 . The movement of the arm portion 72 in the X-axis direction is performed by the first drive source 732 a of the first drive portion 732 , so that the moving body 733 moves along the first slide portion 732 b.

As shown in FIG. 5(B) , a push-up mechanism (not shown) pushes up the electronic component C to be mounted. Then, the suction nozzle 71a of the transfer head 71 picks up the electronic component C (step S102). That is, the arm portion 72 and the buffer member move closer to the wafer sheet WS, and after holding the electronic component C by suction, move away from the wafer sheet WS to detach the electronic component C from the wafer sheet WS.

The movement of the arm portion 72 at this time is performed by the second driving source 734a of the second driving portion 734 operating, so that the base portion 72b moves along the second sliding portion 734b. Then, as shown in FIG. 4(A), FIG. 4(B), FIG. 5(C), and FIG. 5(D), the reverse drive unit 71b rotates the suction nozzle 71a by 180°, thereby turning the electronic component C reverse (step S103).

Next, as shown in FIG. 6(A) and FIG. 6(B), the transfer head 71 is positioned at the mounting position OA by moving the arm portion 72 in the X-axis direction (step S104 ). That is, the electronic component C held by the suction nozzle 71 a of the transfer head 71 arrives at a position facing the holding portion 31 b of the mounting head 31 in the mounting mechanism 3 . At this time, the movement of the arm portion 72 in the X-axis direction is performed by the first drive source 732a of the first drive portion 732, so that the moving body 733 moves from the pick-up position to the installation position OA along the first slide portion 732b. distance to proceed. Note that, at this time, the mounting head 31 is on standby at a height position where the distance between the lower end surface of the holding portion 31 b and the upper surface of the substrate S is several mm. In addition, the said height position is maintained until the positioning of the electronic component C and the board|substrate S mentioned later is complete, and immediately before the mounting head 31 is driven toward the board|substrate S. As shown in FIG.

As shown in FIG. 6(C) , the arm portion 72 moves in a direction close to the holding portion 31b, thereby pressing the electronic component C against the holding portion 31b. As shown in (D) of FIG. 6 , the holding portion 31 b of the mounting head 31 absorbs and holds the electronic component C by negative pressure to receive the electronic component C (step S105 ). At the same time, the suction nozzle 71a releases the negative pressure, the arm portion 72 moves away from the holding portion 31b, and the electronic component C is released. The movement of the arm portion 72 at this time is performed by the second driving source 734a of the second driving portion 734 operating, so that the base portion 72b moves along the second sliding portion 734b.

Furthermore, as shown to (E) of FIG. 6, the arm part 72 moves toward the supply part 6, and by this, the transfer head 71 retreats from just below the holding|maintenance part 31b. At this time, the movement of the arm portion 72 is performed by operating the first driving source 732a of the first driving portion 732 to move the moving body 733 in the X-axis direction along the first sliding portion 732b. In addition, delivery of the electronic component C to the holding unit 31b by the transfer unit 7 is performed at the mounting position OA, and therefore the stage 21 is kept in a retracted state to avoid interference with the transfer mechanism 73 at the time of delivery.

[Installation of electronic parts] Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagrams of FIG. 7(A) to FIG. 7(C) and the flowchart of FIG. 9 . Here, as shown in (A) of FIG. 7 , the holding portion 31 b of the mounting head 31 holding the electronic component C as described above is located directly below the second imaging portion 5 . The first imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 (step S201 ). The control device 8 obtains the amount of displacement between the position of the mark m imaged by the first imaging unit 4 and the reference position, and operates the driving mechanism 32 to position the electronic component C to eliminate the amount of displacement (step S202 ). .

Next, as shown in (B) of FIG. 7 , the substrate support mechanism 2 moves the stage 21 so that the mounting area B of the substrate S (the mounting area B for mounting the electronic component C at this time) reaches the position held by the mounting head 31 . The position where the electronic components C face each other, that is, the center of the mounting area B reaches the mounting position OA (step S203 ). Then, as shown in FIG. 3(B) , the second imaging unit 5 passes over the mounting head 31 and images the mark M of the substrate S visible in the transmission region T around the electronic component C (step S204 ).

The control device 8 obtains the amount of displacement between the position of the mark M imaged by the second imaging unit 5 and the reference position, and operates the driving mechanism 22 to position the substrate S to eliminate the amount of displacement (step S205 ). Furthermore, as shown in FIG.7(C), the mounting head 31 is driven toward the board|substrate S by the drive mechanism 32, and the electronic component C held by the mounting head 31 is mounted on the board|substrate S (step S206).

In this way, by repeating the operations of transferring the electronic component C from the wafer sheet WS, handing over the electronic component C to the mounting head 31, positioning and mounting the electronic component C and the substrate S, each mounting area B of the substrate S is sequentially processed. Install electronic parts C. The substrate S on which a predetermined number of electronic components C are mounted is conveyed by the substrate support mechanism 2 and stored in an unloader.

[Effect] (1) The mounting device 1 of the electronic component C of this embodiment includes: a mounting mechanism 3 for mounting the electronic component C on the substrate S at the mounting position OA by a mounting head 31 holding the electronic component C; a substrate supporting mechanism 2 for supporting the electronic component C for mounting. The substrate S of the electronic component C; the supply unit 6 that supplies the electronic component C; and the transfer unit 7 that transfers the electronic component C from the supply unit 6 to the mounting position OA.

Moreover, the transfer part 7 includes: a transfer head 71, which picks up the electronic component C from the supply part 6 and reverses it, and hands it to the mounting head 31; A space formed by retracting S (stage 21 ) from the mounting position OA.

Therefore, the mounting head 31 does not need to move in order to receive the electronic component C from the transfer mechanism 73, and the position of the electronic component C at the mounting position OA can be maintained fixedly, and the height position close to the height position of the upper surface of the substrate S can be maintained. The position receives the electronic part C, and high mounting accuracy can be obtained. In this way, since the amount of movement of the mounting head 31 can be reduced, the amount of dust generated at the mounting position OA can also be reduced.

(2) In order to move the transfer head 71 to the mounting position OA, the board|substrate S needs to retreat, and the distance between the board|substrate S located in the mounting position OA and the mounting head 31 is set by this. Therefore, the position of the mounting head 31 at the time of receiving the electronic component C can be made a position close to the board|substrate S at the time of mounting. Thus, after the mounting head 31 receives the electronic component C, the distance that the mounting head 31 moves for mounting is very short, and positional deviation caused by the movement of the mounting head 31 can be prevented, thereby improving mounting accuracy.

(3) The transfer unit 7 includes: a transfer head 71 that picks up the electronic component C from the mounting surface F of the electronic component C of the supply unit 6 and hands it to the mounting head 31; an arm portion 72 that is provided with the transfer head 71 at one end; The mechanism 73 has sliding parts (732b, 734b) provided at positions that do not overlap with the loading surface F in plan view, and drives the arm part 72 with the sliding of the sliding parts, so that the transfer head 71 is feeding Part 6 moves between the installation position OA.

In this way, since the sliding portion is positioned so as not to overlap the mounting surface F of the electronic component C in plan view, when the arm portion 72 moves along with the sliding of the sliding portion, dust generated from the sliding portion is less likely to fall onto the mounting surface F. , it is possible to suppress poor bonding caused by dust adhering to the electronic component C.

(4) The sliding portion is provided at a position lower than the height position of the mounting surface F. Therefore, since the dust generated from the sliding part falls below the mounting surface F, it is hardly possible to reach the mounting surface F, and it is possible to further suppress poor bonding.

(5) The transfer head 71 has the adsorption nozzle 71a which adsorbs the electronic component C by negative pressure, and the tube which supplies negative pressure to the adsorption nozzle 71a is built in the arm part 72. Therefore, even if dust is generated from the pipe deformed with the movement of the arm portion 72, it does not reach the outside of the arm portion 72 and thus does not affect the surroundings.

(6) The transfer head 71 is driven by a motor as the reverse drive unit 71 b to reverse the electronic component C, and a cable for supplying electric power to the motor is built in the arm part 72 . Therefore, even if dust is generated from the pipe deformed with the movement of the arm portion 72, it does not reach the outside of the arm portion 72 and thus does not affect the surroundings.

(7) The sliding part has a first sliding part 732b and a second sliding part 734b that slide linearly along two orthogonal axes, and the first sliding part 732b and the second sliding part 734b overlap in the height direction The positional relationship of is arranged on both sides of the front and back of the common mobile body 733 facing each other.

Therefore, the two shafts of the first sliding part 732b and the second sliding part 734b are arranged at close positions through a common member, and the transfer head 71 caused by the shaking of the first sliding part 732b and the second sliding part 734b can be prevented. The position offset is expanded. Therefore, even if the arm part 72 is long, the electronic component C can be accurately positioned and transferred by providing a slide part in the position which does not overlap with the said mounting surface F in planar view.

(8) The mounting head 31 has a transmissive portion that enables the marking M of the substrate S to be recognized through the transmissive portion while the electronic component C is being held, and the mounting device 1 includes: a first imaging portion 4 , at the mounting position OA is arranged on the lower side than the substrate support mechanism 2, and in the state where the substrate S is withdrawn from the mounting position OA, it photographs the mark m of the electronic component C held by the mounting head 31; The position OA is arranged on the upper side than the mounting head 31, and the mark M of the substrate S is photographed by the transmission part; The positions of the substrate S and the electronic component C obtained from the image are used to position the substrate S and the electronic component C.

According to this embodiment, with the substrate S retracted from the mounting position OA, the electronic component held by the mounting head 31 is controlled by the first imaging unit 4 disposed below the substrate support mechanism 2 at the mounting position OA. C performs imaging, and uses the second imaging unit 5 arranged on the upper side of the mounting head 31 at the mounting position OA to photograph the substrate S supported by the substrate supporting mechanism 2 through the transparent portion of the mounting head 31. In a state as close as possible to the electronic component C and the substrate S, the mark m of the electronic component C and the mark M of the substrate S are photographed.

Therefore, the movement amount of the electronic component C (mounting head 31 ) and the substrate S (substrate support mechanism 2 ) when imaging the mark m and the mark M, and the movement amount of the electronic component C (mounting head 31 ) after imaging the mark m and the mark M can be shortened as much as possible. ) and the relative movement amount of the substrate S (substrate support mechanism 2). Therefore, expansion of errors caused by moving the mounting head 31 or the substrate support mechanism 2 over a long distance can be suppressed. In addition, the longer the movement distance of the mechanism, the more dust will be raised. However, in this embodiment, since the movement distance can be suppressed, it is possible to prevent the dust from reducing cleanliness and causing joint failure.

Here, when the mark M is photographed not over the mounting head 31 but by a camera installed adjacent to the mounting head 31, it is practically impossible to use a high-magnification camera to achieve high required accuracy. That is, the area of the substrate S where the mark M is marked is only a few millimeters larger than the area where the electronic component C is mounted, and the diameter of the mounting head 31 is only a few millimeters larger than the area where the mark M is marked. diameter. Therefore, even if the lens barrel of the camera is arranged adjacent to the mounting head 31 , the multiple marks M do not enter the field of view of the camera, and the multiple marks M cannot be photographed simultaneously by the camera.

Therefore, in order to image a plurality of (two) marks M on the substrate S, it is necessary to move the camera (mounting head 31 ) to move the mounting head 31 more than the separation distance between the two marks M, and an error occurs during the movement. That is, after the mark m of the electronic component C is recognized and the position is aligned, the camera must be moved together with the mounting head 31 in order to recognize the mark M of the substrate S, and even if the position is returned to the original position after that, the position of the electronic component C still occurs. Possibility of offset.

In order to deal with this problem, if the recognition and position alignment of the mark M on the substrate S are carried out first, the position recognition of the electronic component C cannot be performed when the substrate S is in the position to be mounted, so it is necessary to move the aligned substrate. S, resulting in a positional shift of the substrate S.

Furthermore, it is also conceivable to prepare a template (template) marked with a mark corresponding to the mark M of the substrate S at a position different from the position to be mounted, and to determine the to locate. However, in this case, the mounting head 31 and the camera must be moved in order to recognize the mark on the template every time the electronic component C is mounted. Then, the time required for recognizing the mark of the template and the time required for positioning are additionally taken, and thus the productivity is lowered. In addition, since the movement distance of the mechanism increases, the amount of dust is also increased, and the error accompanying the movement is also increased.

In this embodiment, since the movement distance of the electronic component C and the board|substrate S can be suppressed after imaging|photography of the mark m and the mark M, any one of a positional shift, fall of productivity, and dust generation amount can be suppressed.

(9) The transmission part has a transparent plate-like member. Therefore, in a narrow area corresponding to the size of the minute electronic component C, it is possible to hold the electronic component C and ensure transparent imaging of the mark M on the substrate S. FIG.

(10) The first imaging unit 4 and the second imaging unit 5 are fixedly installed with respect to the attachment position OA. Therefore, the imaging area of the first imaging unit 4 and the imaging area of the second imaging unit 5 do not deviate, and dust due to movement can be prevented.

[modified example] The supply unit 6 is not limited to a device that supplies the electronic components C attached to the wafer sheet WS. For example, it may be a device that supplies electronic components C arranged on a tray. Moreover, what is necessary is just to pick up and transfer the electronic component C individually from the supply part 6 also about the structure of the transfer mechanism 73. Therefore, the arm part 72 may be configured to move in the X-axis and Y-axis directions, and the support mechanism 61 may be configured to move in the X-axis and Y-axis directions.

In the transfer mechanism 73 , the driving unit that drives the arm unit 72 is not limited to a mechanism that uses a linear motor as a driving source. A mechanism using a ball screw or a belt using a motor that rotates the shaft as a drive source may also be used. In the case of such a mechanism, since a sliding part is included, it is preferable to install it in the position which does not overlap with the mounting surface F in planar view. Furthermore, it is preferable to provide the slide part at a position lower than the height position of the mounting surface F. As shown in FIG. In addition, when there are a plurality of sliding parts, some sliding parts do not need to be provided at positions that do not overlap the mounting surface F in plan view. In addition, some sliding parts may not be provided at a position lower than the height position of the mounting surface F. As shown in FIG. In this case, it is preferable to provide a shield such as an outer package, a wall, or other structural parts between the sliding part and the mounting surface F. As shown in FIG. In addition, it is preferable to lengthen the distance between the sliding part and the mounting surface F.

The mounting head 31 should just be comprised so that the 2nd imaging part 5 can image|photograph the mark M of the board|substrate S. Therefore, even if the transparent part of the mounting head 31 is not formed of a transparent material, a through-hole can be formed at a position corresponding to the mark M. As shown in FIG. More specifically, the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a position corresponding to the mark M, or the hollow portion 31a may not exist, and the holding portion 31b may be formed of an opaque member, and it is connected to the mounting head 31 and the mounting head 31b. A through-hole is formed at a portion of the holding portion 31b corresponding to the mark M. That is, such a through hole is also a penetrating portion of the mounting head 31 .

The first imaging unit 4 and the second imaging unit 5 may be provided so as to be movable relative to a position (mounting position OA) where the electronic component C is mounted. That is, when it is not possible to photograph a plurality of marks m of the electronic component C or a plurality of marks M of the substrate S in batches, the first imaging unit 4 and the second imaging unit 5 may be configured so that the marks m or the marks M to move between shots. That is, a moving device for moving between the marks M may be provided in the first imaging unit 4 , or a moving device for moving between the marks M may be provided in the second imaging unit 5 . In this case, the movement distance is short and the electronic component C or the substrate S stays within the size range of the mounting area B of the substrate S, so that errors and dust emission can also be suppressed.

In addition, although the position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are respectively aligned with the reference position, the present invention is not limited to this, and the position of the mounting area B may be aligned with the position of the electronic component C. , or align the position of the electronic component C with the position of the installation area B. In short, what is necessary is just to be able to align the position of the mounting area B of the board|substrate S, and the position of the electronic component C.

In addition, delivery of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the board|substrate S is supplied to the stage 21, before the mark m of the electronic component C is imaged by the 1st imaging part 4, board|substrate S may be retracted from mounting position OA.

[Other implementations] As mentioned above, although embodiment of this invention and the modification of each part were demonstrated, the said embodiment and the modification of each part are shown as an example, and it does not intend to limit the scope of invention. These novel embodiments described above can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and spirit of the invention, and are also included in the invention described in the claims of the invention.

1: Install the device 2: Substrate support mechanism 3: Installation mechanism 4: The first shooting department 5: The second filming department 6:Supply Department 7:Transfer Department 8: Control device 11: Support table 11a: Containment hole 21: Carrier 22: Driving mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b: guide rail 23: Mobile board 23a: through hole 31: Mounting head 31a: Hollow part 31b: holding part 32: Driving mechanism 33, 34, 35: moving objects 61: Support mechanism 61a: ring bracket 62: Driving mechanism 71: transfer head 71a: adsorption nozzle 71b: Reverse drive unit 72: Arm 72a: Extension 72b: base part 73: transfer mechanism 731: fixed body 732: The first driving department 732a: The first driving source 732b: first sliding part 733:Moving body 734:Second driving unit 734a: Second driving source 734b: second sliding part B: Installation area C: electronic parts d, w: width D: adsorption area F: loading surface h:interval H: size L: The height position of the loading surface m, M: mark OA: installation location S: Substrate S101～S105, S201～S206: steps t: thickness T: through area WS: wafer sheet X, Y, Z: coordinate axes

FIG. 1 is a front view showing a schematic configuration of a mounting device according to an embodiment. Fig. 2 is a plan view showing an electronic component and a substrate. (A) of FIG. 3 is a plan view of the mounting device, and (B) of FIG. 3 is an enlarged plan view of the mounting portion. 4(A) and 4(B) are enlarged views showing the reverse operation of the electronic component, the left side is a front view, and the right side is a plan view. FIG. 5(A) to FIG. 5(D) are explanatory diagrams showing a pickup operation of an electronic component. FIG. 6(A) to FIG. 6(E) are explanatory diagrams showing delivery operations of electronic components. 7(A) to 7(C) are explanatory views showing the mounting operation of the mounting device. FIG. 8 is a flowchart showing the procedure of picking up operation and delivery operation of electronic components. FIG. 9 is a flowchart showing a mounting process of electronic components.

1: Install the device

2: Substrate support mechanism

3: Installation mechanism

4: The first shooting department

5: The second filming department

6:Supply Department

7:Transfer Department

8: Control device

11: Support table

11a: Containment hole

21: Carrier

22b, 33a, 34a, 35a, 62a, 62b: guide rail

23: Mobile board

23a: through hole

31: Mounting head

31a: Hollow part

31b: holding part

32: Driving mechanism

33, 34, 35: moving body

61: Support mechanism

62: Driving mechanism

71: transfer head

72: Arm

72a: Extension

72b: base part

73: transfer mechanism

732: The first driving department

C: electronic parts

h:interval

H: size

OA: installation location

S: Substrate

t: thickness

WS: wafer sheet

X, Y, Z: coordinate axes

Claims (7)

A mounting device for electronic components, characterized in that it comprises: The mounting mechanism keeps the mounting head of the electronic component at the mounting position and mounts the electronic component on the substrate; a substrate supporting mechanism supporting the substrate on which the electronic parts are mounted; a supply section that supplies the electronic parts; and a transfer unit that transfers the electronic component from the supply unit to the mounting position, and The transfer unit includes: a transfer head that picks up the electronic component from the supply unit, reverses it, and hands it to the mounting head; and The transfer mechanism moves the transfer head to a space formed by retracting the substrate from the mounting position by the substrate support mechanism. The electronic component mounting device according to claim 1, wherein in order to move the transfer head to the mounting position, it is necessary to retract the substrate, so that the substrate at the mounting position and the mounting position are set. head spacing. The mounting device for electronic parts as described in Claim 1 or Claim 2, wherein The mounting head has a transmissive portion that enables the marking of the substrate to be recognized through the transmissive portion in a state where the electronic component is held, and The installation device of described electronic part comprises: The first imaging unit is arranged below the substrate supporting mechanism at the mounting position, and captures the electronic component held by the mounting head in a state where the substrate is retracted from the mounting position. mark to shoot; The second imaging unit is disposed on the upper side of the mounting head at the mounting position, and captures the mark on the substrate through the transmission portion; and a positioning mechanism for aligning the board and the electronic component based on the positions of the board and the electronic component obtained from the images of the marks captured by the first imaging unit and the second imaging unit; position. The electronic component mounting device according to claim 3, wherein the transparent part has a transparent plate-shaped member. The electronic component mounting device according to claim 3, wherein the first imaging unit and the second imaging unit are fixedly arranged relative to the mounting position. The mounting device for electronic parts as claimed in claim 3, wherein the transmission part has a transparent plate member, and The first imaging unit and the second imaging unit are fixedly installed relative to the installation position. The installation device for electronic parts as described in claim 1 or claim 2, which includes: an imaging unit for imaging the mark on the substrate; and The transparent part of the mounting head, the transparent part enables the imaging part to recognize the mark on the substrate through the transparent part in the state of holding the electronic component, and The transfer unit delivers the electronic component to the transmission unit of the mounting head at the mounting position.

Images