TWI827281B - Installation device for electronic components and installation method for electronic components - Google Patents

Abstract

The present invention provides an electronic component mounting device and an electronic component mounting method that can pick up electronic components in a non-contact manner and position the electronic components at a mounting position. The electronic component mounting device of the embodiment includes: a mounting head that mounts suction-held electronic components on a substrate; and a pick-up collet that includes a porous member that holds electronic components in a non-contact manner and picks up electronic components from a supply unit, and handed over to the mounting head; a moving device to relatively move the mounting head and the pickup collet; and a control device to eject gas from the porous member and hold the electronic parts in a non-contact manner through the negative pressure of the suction hole. In the state, use the moving device to bring the mounting head and the pickup collet close to the specified distance, and use the mounting head to perform suction. After the specified time has passed at the specified interval, the suction of the pickup collet is released, and the suction of the mounting head is maintained. Electronic parts.

Description

Installation device for electronic components and installation method for electronic components

The invention relates to an electronic component mounting device and an electronic component mounting method.

When electronic components, such as logic devices, memories, and image sensors, which are semiconductor elements, are mounted on a substrate, the wafer on which the semiconductor elements are formed is cut into individual wafers. Then, the wafers are picked up one by one, transferred to the substrate and mounted.

One surface of the wafer becomes a functional surface on which fine circuits are formed. When the wafer is picked up from the wafer, if the picked-up member comes into direct contact with the functional surface, there is a risk of damage to the circuit, etc., so there is a demand to avoid contact.

In addition, as a non-contact adsorption technology, there is the representative Bernoulli suction cup, but it requires a large air flow, but the adsorption force is very small. Therefore, when the wafer is picked up from the state held by the UV tape, it is impossible to obtain the adsorption holding force to peel the wafer from the UV tape.

Furthermore, the connection terminals on the surface of the wafer and the connection terminals on the substrate are joined to face each other. At this time, in order to ensure and improve the bonding properties between the connection terminals, the surface of the wafer may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the surface condition of the wafer subjected to such processing, there is also a requirement to avoid direct contact between the picked-up member and the surface of the wafer.

In order to cope with the requirement that the member does not come into contact with the surface of the wafer, conventionally, in a collet as a member for picking up a wafer, the surface holding the wafer is made into a tapered surface, so that only the peripheral portion of the collet is tapered with the collet, not the surface of the wafer. The state of surface contact is sucked and maintained from the center of the wafer (see Patent Document 1). [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. Sho 63-124746

[Problem to be solved by the invention] However, in the conventional technology as described above, only the peripheral portion of the wafer comes into contact with the collet, and suction is performed from the center portion of the wafer. Therefore, the wafer is prone to strain, which may lead to chip defects or cracks. Furthermore, the collet is in contact with the peripheral edge portion of the wafer, and the contact portion is used to support the sucked wafer. Therefore, stress is concentrated on the peripheral portion, which easily causes defects and cracks. Furthermore, since the holding position of the wafer is fixed in the suction-holding state, if the wafer is shifted or tilted during the suction-holding, it cannot be corrected when it is later transferred to the mounting device.

Embodiments of the present invention are proposed to solve the above-described problems, and an object thereof is to provide an electronic component mounting device and an electronic component mounting method that can pick up electronic components in a non-contact manner and position the electronic components at a mounting position.

[Technical means to solve problems] An electronic component mounting device according to an embodiment of the present invention includes: a mounting head for mounting electronic components sucked and held by the negative pressure of a suction hole on a substrate; and a pickup collet having a porous member from which the The fine holes eject gas and hold the electronic parts in a non-contact manner through the negative pressure of the suction hole. The pickup collet picks up the electronic parts from a supply part that supplies the electronic parts and delivers them to the mounting head; a moving device that relatively moves the mounting head and the pickup collet; and a control device that ejects gas from the porous member and maintains the position in a non-contact manner by the negative pressure of the suction hole. In the state of the electronic components, the moving device is used to bring the mounting head and the pickup collet close to a predetermined distance, and the mounting head is used to perform suction. After a predetermined time has elapsed at the predetermined interval, the release is The suction of the pick-up collet causes the mounting head to suction and hold the electronic components.

In the electronic component mounting method according to the embodiment of the present invention, the pick-up collet having the porous member holds the electronic components in a non-contact manner and picks up the electronic components from the electronic component supply part. The gas is ejected from the fine holes and the electronic components are held in a non-contact manner by the negative pressure of the suction hole. The moving device uses a mounting head for mounting the electronic components on the substrate and picks up the electronic components and reverses them. When the pickup collet approaches a predetermined interval, suction is started through the negative pressure provided in the suction hole of the mounting head. After a predetermined time has elapsed at the predetermined interval, the suction of the pick-up collet is released. , thereby causing the mounting head to suck and hold the electronic component.

[Effects of the invention] Embodiments of the present invention can provide an electronic component mounting device and an electronic component mounting method that can pick up electronic components in a non-contact manner and position the electronic components at a mounting position.

1. First Embodiment Hereinafter, the first embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2 , this embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. FIG. 1 is a front view showing the schematic structure of the mounting device 1 . FIG. 2 is a plan view showing the electronic component C and the substrate S. FIG. In addition, the drawings are schematic diagrams, and the dimensions (hereinafter also referred to as sizes) and shapes of each part, the ratio of mutual dimensions of each part, etc. may differ from reality.

[Electronic parts] First, the electronic component C used as the mounting object in this embodiment may be a semiconductor element such as an integrated circuit (IC) or a large scale integrated circuit (LSI). As shown in FIG. 2 , this embodiment uses a rectangular parallelepiped-shaped semiconductor wafer as a semiconductor element. A semiconductor wafer is a bare wafer that is singulated by cutting the semiconductor wafer into small square dice. One side of the bare chip has a functional side that functions as a semiconductor element. Bumps or bumpless electrodes are provided on the functional surface side, and are mounted by flip-chip connection to electrode pads on the substrate S.

The electronic component C is provided with a plurality of marks m for positioning. In this embodiment, two marks m are provided, one each at a pair of opposite corner portions of the rectangular electronic component C. The mark m is provided on the surface of the electronic component C on which the electrode is formed, that is, the face. This embodiment is an example of a face-down mounting device for mounting the surface side toward the substrate S.

[Substrate] In this embodiment, as shown in FIG. 2 , the substrate S on which the electronic component C is mounted is a resin plate-shaped member on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed. The substrate S is provided with a mounting area B, which is an area where the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In this embodiment, two marks M are provided outside the mounting area B at positions corresponding to the marks m of the electronic component C.

[install device] The mounting device 1 of this embodiment is a mounting device 1 that can achieve high-precision mounting, for example, a mounting accuracy of ±0.2 μm or less. As shown in FIGS. 1 , 3(A) and 3(B) , it has a substrate. Support mechanism 2 , mounting mechanism 3 , first imaging part 4 , second imaging part 5 , supply part 6 , moving device 7 , and control device 8 . (A) of FIG. 3 is a plan view of the mounting device 1 , and (B) of FIG. 3 is a plan view showing a mark M through which a mounting head 31 described below is transmitted.

In addition, in the following description, the direction in which the mounting mechanism 3 moves in order to mount the electronic component C on the substrate S is referred to as the Z axis, and two axes orthogonal to each other in a plane orthogonal thereto are referred to as the X axis and the Y axis. axis. In this embodiment, the Z-axis is vertical, the direction along the gravity is called downward, the direction against gravity is called upward, and the position on the Z-axis is called height. Furthermore, the X-axis and the Y-axis are on a horizontal plane. When viewed from the front side of FIG. 1 , the X-axis is in the left-right direction and the Y-axis is in the depth direction. However, the present invention is not limited to the installation direction. Regardless of the installation direction, with the substrate S or the substrate support mechanism 2 as a reference, the side on which the electronic component C is mounted is called the upper side, and the opposite side is called the lower side.

The substrate support mechanism 2 is a mechanism that supports the substrate S on which the electronic component C is mounted, and is a so-called substrate stage. The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31 . The mounting head 31 has a transmissive part capable of transmitting and recognizing the mark M of the substrate S facing the electronic component C while holding the electronic component C.

The first imaging unit 4 is disposed below the substrate supporting mechanism 2 in which the mounting head 31 mounts the electronic component C on the mounting position OA of the substrate S. In a state where the substrate S is retracted from the mounting position OA by the substrate supporting mechanism 2, The mark m of the electronic component C held by the mounting head 31 is photographed from a position facing the electronic component C, that is, from below. The mounting position OA is a position where the electronic component C is mounted on the substrate S. In the figure, it is a single point along the Z-axis direction passing through a point (for example, the center point) on the XY coordinates in the area where the electronic component C is mounted. Indicated by underlining. As described below, the mounting position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5 . The second imaging unit 5 is arranged above the mounting head 31 in the mounting position OA, and captures the mark M of the substrate S through the transmission part of the mounting head 31 (hereinafter, this case is referred to as "photography through the mounting head 31"). . Based on the image captured in the above manner, the mark m and the mark M can be detected, that is, the mark m and the mark M can be identified.

In addition, the substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C calculated from the mark m and the image of the mark M captured by the first imaging unit 4 and the second imaging unit 5 . Each component of the mounting device 1 as described above is mounted on the support base 11 provided on the installation surface. The top surface of the support base 11 becomes a horizontal surface.

The supply unit 6 supplies electronic components C. The moving device 7 moves the electronic component C from the supply unit 6 to the mounting position OA. The moving device 7 has a transfer head 71 and a transfer mechanism 73 . The transfer head 71 picks up the electronic component C from the supply unit 6 in a non-contact manner, reverses it, and transfers it to the mounting head 31 . The transfer mechanism 73 moves the transfer head 71 in the space formed by retracting the substrate S from the mounting position OA by the substrate support mechanism 2 and positions it at the mounting position OA.

The control device 8 controls the operation of the mounting device 1 . The control device 8 includes, for example, an electronic circuit or a computer running a predetermined program. That is, the control device 8 uses a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU) to read programs and data from the storage device to execute the installation device 1 control. Each part is explained in detail below.

(Substrate support mechanism) As shown in (A) of FIG. 1 and FIG. 3 , the substrate supporting mechanism 2 is arranged on the supporting table 11 and has a stage 21 and a driving mechanism 22 . The stage 21 is a plate-shaped member on which the substrate S is placed. The driving mechanism 22 is a biaxial moving mechanism, for example, having an X-axis direction guide rail 22a and a Y-axis direction guide rail 22b. It uses a motor (not shown) as a driving source and moves the stage 21 in a horizontal plane through a conveyor belt or a ball screw. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. In addition, although illustration is omitted, the drive mechanism 22 includes a θ drive mechanism that rotates the stage 21 in a horizontal plane.

The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along the guide rail 22b. A through hole 23 a is formed in the movable plate 23 so that the first imaging unit 4 can image the electronic component C.

In addition, although not shown in the figure, one of the moving ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the moving end on the right side in the figure) is provided with a device for supplying/storing the substrate S on the stage. 21 loader/unloader. Therefore, the substrate support mechanism 2 receives the substrate S supplied from the loader or transfers the substrate S to the unloader while moving the stage 21 to the moving end.

(installation mechanism) The mounting mechanism 3 has a mounting head 31 and a driving mechanism 32 . The mounting head 31 has a substantially rectangular parallelepiped shape and has a hollow portion 31a as a transmission portion and a holding portion 31b. The hollow portion 31a is a cylindrical through hole formed with the Z-axis direction as an axis. The holding part 31b is a plate-shaped member through which light for imaging can transmit, and is attached so as to close the opening of the hollow part 31a toward the substrate S side. For example, a transparent glass plate is used as the holding part 31b. The holding part 31b is a so-called mounting tool and holds the electronic component C.

As shown in FIG. 3(B) , an adsorption area D for adsorbing and holding the electronic component C is provided in the center of the holding portion 31 b. The adsorption area D is a position where the electronic component C is held by the holding portion 31b. The suction hole 31c is formed in the adsorption area D. That is, the suction hole 31c connected to the suction path formed in the holding part 31b is formed in the center of the holding part 31b. The center here is a region including the center of the adsorption region D and having a certain width. The suction path inside the holding part 31b is a flow path for connecting the suction hole 31c to a negative pressure source, and is provided so that the electronic component C can be sucked and held by generating negative pressure in the suction hole 31c.

The adsorption area D of the holding portion 31 b and its surroundings become a transmission area T capable of photographing the electronic component C held by the pickup collet 700 . Furthermore, even when the electronic component C is adsorbed and held by the adsorption area D, the mark M of the imaging substrate S can be transmitted through the transmission area T around the adsorption area D. That is, the mounting head 31 has a transparent portion so that the mark M on the substrate S can be imaged by the second imaging unit 5 . In addition, the holding surface (adsorption surface) of the holding part 31b holding the electronic component C is called a lower end surface.

The driving mechanism 32 is composed of a moving body 33 , a moving body 34 , and a moving body 35 , and is a mechanism that drives the mounting head 31 . The moving body 33 is provided movably along the guide rail 33 a provided in the Y-axis direction of the support base 11 . The moving body 34 is provided movably along the X-axis direction guide rail 34 a provided on the top surface of the moving body 33 . The moving body 35 is provided movably along the Z-axis direction guide rail 35a provided on the front surface of the moving body 34 . The moving body 35 is formed in a substantially concave shape in plan view. These moving bodies 33 , 34 , and 35 are driven by a ball screw, a linear motor, a pressure cylinder, or the like using a motor as a driving source.

The mounting head 31 is provided at the lower part of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31 b of the mounting head 31 on the substrate S. Furthermore, the moving body 35 provided with the mounting head 31 moves along the X-axis direction and the Y-axis direction by the movement of the moving body 33 and the moving body 34 . Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31 . In addition, although illustration is omitted, the drive mechanism 32 includes a θ drive mechanism that rotates the mounting head 31 in a horizontal plane.

In addition, in this embodiment, from the viewpoint of preventing movement errors, it is preferable to set the movement amounts in the X-axis direction, Y-axis direction, and Z-axis direction by the drive mechanism 32 to be as short as possible. For example, the movement amounts of the moving body 33 and the moving body 34 in the X-axis direction and the Y-axis direction are respectively set to several millimeters to more than ten millimeters. Furthermore, the amount of movement of the moving body 35 in the Z-axis direction is also set to about several millimeters to about ten millimeters. That is, the mounting head 31 is at a height position where the lower end surface of the holding portion 31 b is facing away from the upper surface of the substrate S placed on the stage 21 by several millimeters, for example, 1 mm to 2 mm (separation distance in the vertical direction). The electronic component C is received or the mark m of the received electronic component C is photographed. Therefore, the amount of movement of the movable body 35 in the Z-axis direction is sufficient to ensure that the electronic component C held by the holding portion 31 b can be mounted on the substrate S by pressing with a predetermined pressure from the height position.

(First Photography Department)

The first imaging unit 4 has a camera, a lens, a lens barrel, a light source, etc., and is fixed to the receiving hole 11 a provided in the support base 11 . The first imaging unit 4 arranges the optical axis of the camera in a direction in which the mark m of the electronic component C held by the mounting head 31 can be photographed. Specifically, it is arranged so that the optical axis becomes a vertical direction. The first imaging unit 4 does not move relative to the mounting position OA of the electronic component C. In the present embodiment, the first imaging unit 4 is arranged upward in the accommodation hole 11 a of the support base 11 located below the substrate support mechanism 2 with the optical axis of the camera aligned with the mounting position OA. When the pickup collet 700 faces the mounting head 31 in order to transfer the electronic component C, the first imaging unit 4 is fixed to the support base 11 so that the electronic component C falls into the imaging field of view. Furthermore, the first imaging unit 4 sets the imaging magnification so that the accuracy of imaging the mark m of the electronic component C held by the mounting head 31 and recognizing the position becomes required accuracy. Of course, there is a visual field range sufficient to capture the mark m. Furthermore, the visual field range is set taking into consideration the unevenness of the position at which the electronic component C is held by the mounting head 31, that is, the holding position accuracy. Furthermore, when a plurality of marks m are photographed and the position of the electronic component C held by the mounting head 31 is recognized, the field of view range may be such that a plurality of marks m can be photographed simultaneously. This magnification or field of view range can be appropriately determined based on the required positioning accuracy.

Here, "not moving" means that the first imaging unit 4 (the same applies to the second imaging unit 5 described below) does not move when photographing the mark m or the mark M. For example, the first imaging unit 4 and the second imaging unit 5 include driving devices in the X and Y axis directions (horizontal directions) or Z axis directions (up and down directions). The driving devices are used to adjust the horizontal position or the vertical position of the first imaging unit 4 and the second imaging unit 5 as a preparatory operation for the operation of the device, and do not need to be used during the subsequent operation of the device. Moving, such structures are included in immobility.

(Second Photography Department)

The second imaging unit 5 has a camera, a lens, a barrel, a light source, etc., and is supported and fixed by a frame or the like (not shown) at a position above the support base 11 , more specifically above the mounting head 31 . The second imaging unit 5 arranges the optical axis of the camera in a direction that can transmit the holding portion 31 b of the mounting head 31 and image the mark M around the mounting area B of the substrate S. That is, in this embodiment, the second imaging unit 5 is arranged downward at a position directly above the mounting head 31 with the optical axis of the camera aligned with the mounting position OA. Like the first imaging unit 4 , the second imaging unit 5 does not move relative to the mounting position OA of the electronic component C. That is, the second imaging unit 5 sets the imaging magnification so that the accuracy of imaging the mark M marked on the mounting area B of the substrate S mounted on the stage 21 and recognizing the position becomes the required accuracy. At the same time, the imaging field of view of the second imaging unit 5 is set so as to include at least two marks M marked on opposite corners of the mounting area B of the substrate S. Furthermore, the range of the imaging field of view is also set taking into consideration the unevenness of the position where the substrate S is placed on the stage 21, that is, the placement position accuracy.

(Supply Department)

The supply part 6 has a support mechanism 61 and a drive mechanism 62 . The support mechanism 61 is a device that supports the wafer WS on which the electronic component C is attached. The driving mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. The surface (region) in the supply part 6 on which the electronic component C is mounted is called a mounting surface F. In this embodiment, the electronic component C is obtained by dividing a wafer attached to the wafer WS into individual pieces by dicing. Therefore, the surface of the wafer WS on which the electronic component C is attached (wafer surface) is the mounting surface F. The wafer WS is attached to a mounting ring (not shown). The support mechanism 61 has a ring holder 61a to which a patch ring is mounted. That is, the surface of the support mechanism 61 that supports the wafer WS can also be considered as the mounting surface F.

In addition, although not shown in the figure, one of the moving ends in the Y-axis direction of the support mechanism 61 (specifically, the moving end on the front side in the figure) is provided with a device for supplying/storing patch rings to the ring holder 61a. Loader/Unloader. The support mechanism 61 receives the patch ring supplied from the loader or transfers the patch ring to the unloader in a state of moving to the moving end.

Furthermore, although not shown in the figure, the support mechanism 61 has an expansion mechanism that creates a gap between the electronic components C by stretching the wafer WS, and clamps the stretched wafer WS to individually mount the electronic components C. A push-up mechanism that pushes and separates. Furthermore, the support mechanism 61 includes a θ drive mechanism that rotates the ring holder 61a in a horizontal plane. In addition, the push-up mechanism is fixedly arranged on the support base 11 , and the electronic component C is received from the supply unit 6 by the moving device 7 at the above-mentioned position (pickup position), that is, it is picked up.

The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the driving mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and uses a motor (not shown) as a driving source to move the support mechanism 61 along the X-axis and Y-axis in the horizontal plane through a conveyor belt or a ball screw. direction movement. The drive mechanism 62 functions as a positioning mechanism for positioning the electronic component C with respect to the transfer head 71 . In addition, the drive mechanism 62 is arranged at a lower position than the height position L of the mounting surface F (see FIG. 5 ).

(mobile device) The moving device 7 moves the mounting head 31 and the pickup collet 700 relative to each other. The moving device 7 has a transfer head 71 , an arm 72 , and a transfer mechanism 73 . As shown in FIG. 3(A) , the transfer head 71 has a pickup collet 700 and a reversal drive unit 710 . As shown in FIGS. 4(A) to 6 , the pick-up collet 700 is a member that suction-holds the electronic components C and releases the electronic components C by releasing the suction-holding. The pickup collet 700 has a porous member 701, a base 702, and a guide part 703. In this embodiment, the moving device 7 moves the pickup collet 700 and transfers the electronic component C to the mounting head 31 . However, the movement for handover only needs to be relative movement, and either or both of the pickup collet 700 and the mounting head 31 can move.

The porous member 701 is a member that has air permeability and supplies gas supplied to the inside through the pores of the opposing surface 701 a facing the electronic component C (in addition, in the following description, the gas supplied to the electronic component C is denoted by the symbol G (illustrated). The porous member 701 of this embodiment has a rectangular parallelepiped plate shape, and is densely and substantially uniformly formed with interconnected fine spaces as a whole. The porous member 701 has air permeability due to the above-mentioned structure, but its flow conductivity is very small. Either surface of the porous member 701 serves as the opposing surface 701a. If gas is supplied into the interior from the back surface 701b opposite to the opposing surface 701a, the gas will be ejected from the dense and uniform pores on the opposing surface 701a. The discharge is a substantially planar discharge that spreads over the entire surface of the facing surface 701 a of the discharge. The ejection is extremely slow, and it can be said to be an oozing feeling, to the extent that you can feel the airflow slightly when you get close to your finger. In addition, pores on surfaces other than the opposing surface 701a and the back surface 701b may be clogged.

The porous member 701 is a continuous structure in which pores serving as internal microspaces are connected to each other and gas can pass between the pores as described above. As this porous member 701, sintered metal, ceramics, resin, etc. can be used. From the viewpoint that the particles inside are difficult to separate and flow out, it is preferable to use sintered metal.

Furthermore, as shown in FIGS. 4(A), 4(B), and 5, the porous member 701 is provided with a suction hole 701c having an opening 701d on the opposing surface 701a and passing through it. The through hole of the electronic component C is sucked by negative pressure. The suction hole 701c of this embodiment linearly penetrates from the center of the back surface 701b to the center of the opposing surface 701a.

The base 702 is a member that covers the surfaces of the porous member 701 other than the facing surface 701a. The base 702 of this embodiment is a rectangular parallelepiped box with an open bottom. The porous member 701 is inserted from the opening of the base 702 so that the bottom surface becomes the facing surface 701a and is exposed, and is assembled into the base 702 and fixed.

As shown in FIG. 4(A), FIG. 4(B), and FIG. 6, an air supply hole 702a, an exhaust hole 702b, and a mounting hole 702c are provided on the top surface of the base 702. The air supply hole 702a is a through hole for supplying air to the porous member 701. The air supply hole 702a is formed close to the outer edge of the base 702 by a pipe connected to the air supply hole 702a. The exhaust hole 702b is a through hole for generating negative pressure in the opening 701d via the suction hole 701c. The exhaust hole 702b extends downward and is formed to coincide with the suction hole 701c of the porous member 701. A space in which gas accumulates is formed between the inner surface of the base 702 and the porous member 701 around the exhaust hole 702b. In addition, the exhaust hole 702b may penetrate the suction hole 701c and reach the opposing surface 701a. In this case, the suction hole 701c and the opening 701d of the porous member 701 are provided in close contact with the outside of the exhaust hole 702b reaching the facing surface 701a of the porous member 701. The mounting hole 702c is a pair of recessed holes for preventing deviation when connecting to the attachment and detachment portion 704 described below.

The gas supply hole 702a is connected to a gas supply circuit via a pipe (not shown). The supply circuit is composed of a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 701 via the gas supply hole 702a is an inert gas. The exhaust hole 702b is connected to a negative pressure generating circuit including a vacuum pump, a valve, and the like via piping (not shown).

The guide portion 703 is a member arranged along the four sides of the side surface of the rectangular base 702 so as to follow the outer edge of the electronic component C, and restricts the movement of the electronic component C held by the opposing surface 701a. For example, as shown in FIG. 4(A), FIG. 4(B), FIG. 5, and FIG. 6, the guide portion 703 is provided along the four side surfaces of the base 702, that is, the four sides of the rectangular facing surface 701a. Multiple plates. In this embodiment, one guide portion 703 is provided on each side of the opposing surface 701a, but the guide portion 703 is not limited to this. Furthermore, the outer edge of the pickup collet 700 formed of the base 702 is not limited to a rectangular shape. The guide portion 703 only needs to be disposed at a position that can restrict the movement of the electronic component C, for example, in a direction along the outer edge of the electronic component C, and is not limited to the form disposed along the side surface of the base 702 .

Each guide portion 703 has a protruding portion protruding from the opposing surface 701a. The distance (protrusion amount) of the guide portion 703 from the facing surface 701a is sufficient to restrict the movement of the electronic component C held by the facing surface 701a across the gas layer, and is at least from the facing surface 701a to the electrons held across the gas layer. Part C or above is enough. However, when the protruding portion of the guide portion 703 exceeds the protruding distance of the electronic component C held by the opposing surface 701a across the gas layer, it is necessary to consider avoiding the problem when picking up the wafer in a non-contact manner. It comes into contact with the electronic components C surrounding the picked-up electronic component C. Therefore, the distance by which the protruding portion of the guide portion 703 protrudes from the facing surface 701a is preferably within the side surface of the electronic component C held by the facing surface 701a via the gas layer. However, before the pickup collet 700 approaches the wafer WS for picking, the electronic components C are individually pushed up through the wafer WS by the push-up mechanism. This can cope with various protrusion amounts and avoid contact with the surrounding electronic components. C contact.

In addition, in the following description, one of the orthogonal guide parts 703 is referred to as 703K and 703L, and the other orthogonal guide part 703 is referred to as 703M and 703N. Description will be made in the form of lead 703. The term "orthogonal" here includes the case where two guide portions 703 on adjacent sides are in contact or continuous to form a right angle, and also includes the case where there are multiple guide portions 703 on one side and the guide portions 703 are separated. The case where the straight lines (planes) along which the two are intersecting are orthogonal (see FIG. 16(A) and FIG. 16(B) ).

As shown in FIGS. 7(A) and 7(B) , the reversal drive unit 710 reverses the electronic component C adsorbed and held by the pickup collet 700 in the up-down direction. That is, the pickup collet 700 is provided so as to be rotatable between the direction toward the wafer WS and the direction toward the mounting head 31 by the reversal drive unit 710 . The reverse drive unit 710 may use a rotation motor, for example.

The pick-up collet 700 is attached to the reversal drive part 710 via the rotating body 720 and the attachment and detachment part 704 . The rotating body 720 is connected to the inversion driving part 710 and is provided rotatably about the axis in the Y direction. The attachment and detachment part 704 is attached to the rotating body 720, and is provided rotatably together with the rotating body 720. The attachment and detachment portion 704 includes a magnet inside, and the base 702 of the pickup collet 700 is attracted and held by the suction force of the magnet. As shown in FIGS. 5 and 6 , a pair of pins 704 a are provided on the contact surface of the attachment and detachment portion 704 with the base 702 . By fitting the pin 704a into the mounting hole 702c provided in the base 702, the pickup collet 700 is prevented from being displaced relative to the attachment and detachment portion 704. In addition, although not shown in the figure, the pipe connected to the exhaust hole 702b passes through the attachment and detachment part 704, and the pipe connected to the air supply hole 702a is supported by the attachment and detachment part 704.

Furthermore, although not shown in the figure, the transfer head 71 has a buffer member that drives the pickup collet 700 in the up-down direction and applies an appropriate load when the front end of the pickup collet 700 comes into contact with the electronic component C, and Absorb excessive loads. As the buffering member, for example, elastic members such as springs and rubber, magnets, air cylinders, dampers, and voice coil motors can be used.

The arm part 72 is a member provided with the transfer head 71 at one end. As shown in FIG. 3(A) , the arm part 72 has an extension part 72a and a base part 72b. The extension portion 72 a is an L-shaped member formed from a rectangular parallelepiped-shaped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped-shaped member extending linearly in the X-axis direction toward the mounting mechanism 3 . The reverse driving part 710 is provided at one end of the extension part 72a facing the mounting mechanism 3 so that the rotation axis is in the Y-axis direction. The pickup collet 700 is rotatably installed by attaching the pickup collet 700 to the rotation shaft of the reversing drive unit 710 . The base part 72b is a plate-shaped body parallel to the X-axis direction, and is fixed to the other end of the extension part 72a (see FIGS. 8(A) to 8(D) ).

A tube for supplying negative pressure connected to the pickup collet 700 and a cable for electrical connection connected to the reverse drive unit 710 and the buffer member are built into the arm 72 . The term "built-in" means that it is covered by the outer packaging of the arm portion 72 and is not exposed to the outside. In this embodiment, the tube and the cable are inserted into the hollow portion formed inside the arm portion 72 .

The transfer mechanism 73 drives the arm part 72 to move the transfer head 71 between the supply part 6 and the mounting position OA. The transfer mechanism 73 has a slide portion SL provided at a position not overlapping the placement surface F in a plan view. In other words, the sliding portion SL of the transfer mechanism 73 is provided outside the movement range of the support mechanism 61 . The transfer mechanism 73 drives the arm portion 72 as the slide portion SL slides. The sliding portion SL here refers to a structural portion that moves while the members are in contact with each other. This sliding portion SL becomes a source of dust. As shown in FIG. 5 , the sliding portion SL of this embodiment includes a first sliding portion 732b and a second sliding portion 734b described below. The first sliding portion 732b and the second sliding portion 734b are provided at a lower position (below) than the height position L of the mounting surface F.

As shown in FIGS. 8(A) to 8(D) , the transfer mechanism 73 has a fixed body 731 , a first driving part 732 , a moving body 733 , and a second driving part 734 . The fixed body 731 is a rectangular parallelepiped-shaped member that is fixed to the support base 11 (see FIG. 3(A) ) and extends along the X-axis direction. The position of the fixed body 731 is fixed relative to the installation position OA.

The first driving part 732 drives the arm part 72 along the X-axis direction. The first driving part 732 has a first driving source 732a and a first sliding part 732b. The first drive source 732a is a linear motor extending along the X-axis direction and is provided along the upper surface of the fixed body 731 (surface parallel to the XY plane). The first sliding part 732b is a linear guide extending along the X-axis direction and is provided on the front surface of the fixed body 731 (a surface parallel to the XZ plane). In addition, since the linear motor moves so that the rotor does not come into contact with the stator, the first drive source 732a does not have the sliding portion SL.

The moving body 733 is a rectangular parallelepiped-shaped block, and is configured to move along the X-axis direction along with the operation of the first driving source 732a by mounting the rotor of the first driving source 732a and mounting the slider of the first sliding portion 732b. Slide to move.

The second driving part 734 drives the arm part 72 along the Z-axis direction. The second driving part 734 has a second driving source 734a and a second sliding part 734b. The second drive source 734a is a linear motor extending along the Z-axis direction and is provided on the moving body 733 . The second sliding part 734b is a linear guide extending along the Z-axis direction and is provided on the moving body 733.

The base portion 72b of the arm portion 72 is provided to be slidable in the Z-axis direction by attaching the rotor of the second drive source 734a and attaching the slider of the second sliding portion 734b. In this way, the sliding part SL of this embodiment has the first sliding part 732b and the second sliding part 734b that linearly slide along two orthogonal axes. Furthermore, the first sliding part 732b and the second sliding part 734b are arranged on two side surfaces facing each other at the front and back of the common moving body 733 in a positional relationship that overlaps in the height direction. That is, the positions of the two orthogonal axes are close to each other. Furthermore, it is preferable that the distance between the two side surfaces of the movable body 733 is short, that is, the movable body 733 is preferably thin.

(Relationship between the distance between the substrate on the stage and the mounting head and the size of the transfer head) In this embodiment, as shown in FIG. 1 , in order to move the transfer head 71 to the mounting position OA, the substrate S needs to be retracted. For this purpose, the opposing distance between the substrate S and the mounting head 31 at the mounting position OA is set. In other words, in order to move the transfer head 71 to the mounting position OA, the substrate S needs to be retracted. Therefore, the mounting head 31 is set to a height position close to the upper surface of the substrate S supported by the substrate supporting mechanism 2 when the electronic component C is received at the mounting position OA. height position. More specifically, the distance h between the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 in the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C is smaller than the arm. The size H in the height direction of the transfer head 71 at the front end of the portion 72 (h<H). Here, as described above, the distance from the lower end surface of the holding portion 31 b to the height position of the upper surface of the substrate S is, for example, several millimeters.

(Arm size) As shown in FIGS. 1 , 3(A) and 7(A) , the width w of the member extending linearly along the Y-axis direction of the extension portion 72a of the arm 72 is linearly linear along the X-axis direction. The width d of the members extending in a shape is longer than the thickness t in the Z-axis direction (w>t, d>t). This suppresses an increase in the size of the arm portion 72 in the height direction, ensures the rigidity of the relatively long arm portion 72 , and stabilizes the position of the electronic component C transferred by the transfer head 71 . By suppressing an increase in the size of the arm portion 72 in the height direction, there is no need to increase the receiving position of the mounting head 31 .

(control device) The control device 8 controls the moving device 7 , the negative pressure generating circuit, the positioning mechanism, and the like so that the electronic component C held in the adsorption area D is positioned at the mounting position OA. First, in a state where the electronic component C is held in a non-contact manner by the ejection of gas from the porous member 701 in the pickup collet 700 and the negative pressure of the suction hole 701c, the transfer mechanism 73 moves the mounting head 31 After approaching the pickup collet 700 to a predetermined distance, suction of the mounting head 31 is started. After a predetermined time has elapsed at a predetermined interval, the suction of the pickup collet 700 is released, and the mounting head 31 suctions and holds the electronic component C.

The predetermined interval sets a first interval (refer to d1 in Fig. 10(A), (B), and (C) of Fig. 10) and a second interval (refer to (D) of Fig. 10) that is smaller than the first interval d1. d2). The first distance d1 and the second distance d2 in this embodiment are the distances between the opposing surface 701a and the holding portion 31b. The predetermined interval is set to an interval determined in advance through experiments or the like. The first interval d1 is an interval that can draw the electronic component C held by the pickup collet 700 to the center of the mounting head 31 through suction of the suction hole 31c of the holding part 31b within a predetermined allowable range, and the second interval d2 is The holding portion 31b of the mounting head 31 adsorbs and holds the space between the electronic components C. Furthermore, the second interval d2 is an interval in which the holding portion 31 b does not contact the guide portion 703 or is just in contact with the guide portion 703 .

The predetermined time is the time required to pull the electronic component C held by the pickup collet 700 to the center of the mounting head 31 within a predetermined allowable range. The predetermined time is set to a time determined in advance through experiments or the like. The specified allowable range refers to the area within which the substrate S described below can be positioned during installation. The control device 8 starts the suction of the mounting head 31 in the state of the first interval d1, and after a predetermined time has elapsed, stops the suction of the pickup collet 700 in the state of the second interval d2.

Furthermore, the control device 8 controls the positioning mechanism to position the substrate S and the electronic component C based on the mark m captured by the first imaging unit 4 and the second imaging unit 5 . That is, in the control device 8, the designed XY coordinate position of the mark m of the electronic component C and the designed XY coordinate position of the mark M of the substrate S correspond to the position where the electronic component C should be accurately mounted. are stored in the storage device as respective reference positions.

The reference position may not be a designed position, but may be the mark m and the position of the mark M when the mounting of the electronic component C on the substrate S is accurately mounted as a result of a trial in advance. The control device 8 obtains the deviation between the mark m captured by the first imaging unit 4 and the mark M captured by the second imaging unit 5 and the reference position, so as to move the electronic component according to the direction and movement amount of correcting the offset. The positioning mechanism (the driving mechanism 22 and the driving mechanism 32) is controlled by the movement of C and the substrate S.

Furthermore, the control device 8 controls the transfer mechanism 73 of the moving device 7 and the driving mechanism 62 of the supply unit 6 based on the mapping information indicating the position coordinates of the electronic component C on the wafer WS, thereby picking up the electronic component C. Position the pick position in turn. In addition, the term "picking up" here refers to removing the electronic component C from a member on which the electronic component C is mounted, such as the wafer WS, and receiving it. Furthermore, the control device 8 controls the holding of the electronic component C by the pickup collet 700 using the transfer head 71 , the reversal of the pickup collet 700 by the reversal drive unit 710 , and the transfer head 71 using the transfer mechanism 73 to stand by the mounting head 31 movement of the mounting position OA, transfer of the electronic component C from the pickup collet 700 to the mounting head 31, etc.

[Principle of suction holding using pick-up collet] Next, the principle of sucking and holding the electronic component C by the pickup collet 700 as described above will be described. As shown in FIG. 4(A) , the gas supplied from the gas supply hole 702 a is ejected in a planar shape from the pores of the opposing surface 701 a, thereby forming a gas layer between the electronic component C and the gas. The layer is, for example, 2 μm to 10 μm. Then, with the negative pressure acting on the suction hole 701c through the negative pressure generating circuit, the opposing surface 701a is brought close to the electronic component C, thereby sucking and holding the electronic component C. At this time, since a gas layer is formed between the facing surface 701a and the electronic component C, the facing surface 701a and the electronic component C are maintained in a non-contact state. Furthermore, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 701c, so the electronic component C is released from the pickup collet 700.

[action] In addition to referring to (B) of FIGS. 1 to 7 , the description of the present embodiment as described above is also referred to the explanatory diagrams of (A) to (C) of FIGS. 8 and 12 and the flowcharts of FIGS. 13 and 14 . Action is explained. In addition, in the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but is retracted together with the stage 21 from the position facing the mounting head 31, that is, the mounting position OA.

[Transfer of electronic parts] The transfer operation of the electronic component C will be described with reference to the explanatory diagrams of FIGS. 8(A) to 12(C) and the flowchart of FIG. 13 . The chip ring with the wafer WS attached is mounted on the ring holder 61 a of the support mechanism 61 in the supply unit 6 using an automatic loader (see FIGS. 3(A) and 3(B) ). Electronic components C divided into individual pieces by dicing are attached to the wafer WS. In addition, in FIGS. 8(A) to 8(D) , illustrations other than the picked-up electronic components C are omitted.

First, as shown in FIG. 8(A) and FIG. 3(A) , the support mechanism 61 moves along the X-axis and Y-axis directions to position the electronic component C to be the mounting object at the pick-up position. Then, the arm 72 is moved in the X-axis direction, thereby positioning the front end of the pickup collet 700 of the transfer head 71 at the pickup position directly above the electronic component C to be the mounting object (step S101 ).

At this time, the movement of the wafer WS in the X-axis and Y-axis directions is performed by the drive mechanism 62 of the supply unit 6 . The movement of the arm part 72 in the X-axis direction is performed by operating the first drive source 732a of the first drive part 732 so that the moving body 733 moves along the first sliding part 732b.

As shown in (B) of FIG. 8 , a push-up mechanism (not shown) pushes up the electronic component C that becomes the mounting object. Then, the pickup collet 700 of the transfer head 71 picks up the electronic component C (step S102). At this time, pressurized gas is supplied to the porous member 701 of the pickup collet 700 via the gas supply hole 702a, and the gas is blown out from the opposing surface 701a. Furthermore, exhaust is not performed through the exhaust hole 702b, and suction is not performed through the opening 701d. In this way, the pickup collet 700 to which the gas is supplied from the opposing surface 701a descends and approaches the electronic component C. When the pickup collet 700 approaches the electronic component C, the gas on the opposing surface 701a is sandwiched between the opposing surface 701a and the electronic component C, forming a gas layer. The trapped gas layer at this time is considered to be a viscous flow layer. Then, the pickup collet 700 passes through the gas layer that is not further compressed, and stops descending relative to the electronic component C.

In this way, while the pickup collet 700 is stopped via the gas layer, the suction by the suction hole 701c is started by exhausting the air from the exhaust hole 702b, so that the electronic component C can be adsorbed and held on the opposing surface 701a. At this time, the electronic component C that is sucked and held may be shifted from the center. As described below, it is positioned at the center when it is transferred to the mounting head 31 .

As described above, the arm 72 moves in the direction approaching the wafer WS. After the pickup collet 700 absorbs and holds the electronic component C, it moves in the direction away from the wafer WS. As a result, as shown in FIG. 8(C) As shown, the electronic component C is separated from the wafer WS.

The movement of the arm portion 72 at this time is performed by operating the second drive source 734a of the second drive portion 734 so that the base portion 72b moves along the second sliding portion 734b. Then, as shown in FIGS. 7(A), 7(B), 8(C), and 8(D), the reversal drive unit 710 rotates the pickup collet 700 by 180°, thereby causing the electronic Part C is reversed (step S103). There may be cases where the inertial force acting on the electronic component C during reversal causes the adsorbed and held electronic component C to shift from the center. As described below, the electronic component C is positioned at the center when transferred to the mounting head 31 .

Next, as shown in FIGS. 9(A) and 9(B) , the transfer head 71 is positioned at the mounting position OA by moving the arm 72 in the X-axis direction (step S104 ). That is, the pickup collet 700 of the transfer head 71 reaches the position facing the holding portion 31 b of the mounting head 31 in the mounting mechanism 3 . At this time, the first driving source 732a of the first driving part 732 operates, and the moving body 733 moves along the first sliding part 732b by a distance from the pickup position to the mounting position OA, thereby moving the arm part 72 in the X-axis direction. At this time, the mounting head 31 is waiting at a height position where the distance between the lower end surface of the holding portion 31 b and the upper surface of the substrate S is several millimeters. The opposing distance at this time is greater than the first distance d1. There may be cases where the inertial force acting on the electronic component C due to the movement of the transfer head 71 causes the adsorbed and held electronic component C to shift from the center. However, as will be described below, the electronic component C is positioned at the center when it is transferred to the mounting head 31 . central.

Then, as shown in FIGS. 9(C) and 10(A) , the arm 72 moves along the Z-axis direction, thereby changing the distance between the holding part 31 b of the mounting head 31 and the opposing surface 701 a of the pickup collet 700 . Let it be the first interval d1 (step S105). At this time, the second driving source 734a of the second driving part 734 operates so that the base part 72b moves along the second sliding part 734b, thereby moving the arm part 72 (see (A) to ((A) of FIG. 8 D)). Then, as shown in FIGS. 10(B) and 11(A) , the suction of the mounting head 31 is started through the negative pressure generating circuit (step S106 ), the suction force of the pickup collet 700 is weakened, and a predetermined time is waited for. (No in step S107).

In this way, suction is performed from the suction hole 31c of the mounting head 31, and the suction flow Q drawn to the center where the suction hole 31c exists acts on the electronic component C as shown by the arrow with a single-dot chain line in the figure. That is, when suction is performed from the suction hole 31c, a suction flow Q is generated that suctions the surrounding gas from the entire circumference in the horizontal direction. The suction flow Q flows through the narrow gap between the holding portion 31 b of the mounting head 31 and the electronic component C (see FIG. 10(B) and FIG. 10(C) ). At this time, friction between the suction flow Q and the surface of the electronic component C generates a force that presses the electronic component C from the outer circumference of the mounting head 31 toward the suction hole 31 c. The larger the opposing area between the suction flow Q and the electronic component C, the greater the force. Therefore, when the electronic component C is shifted from the center, the area of the surface of the electronic component C in the direction of the shift increases. , so the pressing force becomes larger than the part where the area on the opposite side becomes smaller (the pressing force is represented by a dotted arrow in the figure). Therefore, as shown in FIG. 10(C) and FIG. 11(B) , the electronic component C is positioned close to the center. At this time, since the suction force attracted by the opposing surface 701a of the pickup collet 700 is weakened, the electronic component C moves more smoothly. In addition, since the suction through the opening 701d of the porous member 701 is weakened but continues, the force drawn to the center where the opening 701d exists acts on the electronic component C, and the force near the center is strengthened.

After the predetermined time has elapsed (YES in step S107 ), as shown in (D) of FIG. 10 , the suction of the pickup collet 700 is released, and the arm 72 moves along the Z-axis direction, thereby aligning the holding portion 31 b with the opposing surface. The distance 701a is set to the second interval d2 (step S108). In this way, the electronic component C is pulled to and held by the holding portion 31b of the mounting head 31 (step S109). At this time, a force close to the center of the holding portion 31b acts on the electronic component C due to the suction from the suction hole 31c. Furthermore, the distance between the electronic component C and the holding portion 31b is very close. Therefore, the electronic component C is held by the holding portion 31b. When the electronic component C is used, there is almost no or very little positional deviation of the electronic component C. Thereafter, as shown in FIG. 9(D) , the electronic component C is released by moving the arm portion 72 in a direction away from the holding portion 31b. At this time, the second driving source 734a of the second driving part 734 operates, and the base part 72b moves along the second sliding part 734b, thereby moving the arm part 72 (see FIGS. 8(A) to 8(D) )).

Furthermore, as shown in (E) of FIG. 9 , the arm portion 72 moves toward the supply portion 6 , thereby retracting the transfer head 71 from directly below the holding portion 31 b. At this time, the first driving source 732a of the first driving part 732 operates, so that the moving body 733 moves in the X-axis direction along the first sliding part 732b, thereby moving the arm part 72 (see FIGS. 2 and 8 (A) ~ (D) of Figure 8). In addition, since the electronic component C is transferred to the holding part 31 b by the moving device 7 at the mounting position OA, the stage 21 is kept in a retracted state to avoid interference with the transfer mechanism 73 during the transfer.

[Installation of electronic parts] Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagrams of FIGS. 12(A) to 12(C) and the flowchart of FIG. 14 . Here, as shown in FIG. 12(A) , the holding portion 31 b of the mounting head 31 holding the electronic component C as described above is located directly below the second imaging portion 5 . The first imaging unit 4 photographs the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 determines the offset between the position of the mark m captured by the first imaging unit 4 and the reference position, and operates the drive mechanism 32 to eliminate the offset, thereby positioning the electronic component C (step S202 ). .

Next, as shown in FIG. 12(B) , the substrate support mechanism 2 reaches the position facing the electronic component C held by the mounting head 31 in the mounting area B of the substrate S (this time, the mounting area B where the electronic component C is mounted). , that is, the stage 21 is moved so that the center of the installation area B reaches the installation position OA (step S203 ). Then, as shown in FIG. 3(B) , the second imaging unit 5 photographs the mark M of the substrate S visible in the transmission area T around the electronic component C via the mounting head 31 (step S204 ).

The control device 8 determines the offset amount between the position of the mark M captured by the second imaging unit 5 and the reference position, and operates the drive mechanism 22 to eliminate the offset amount, thereby positioning the substrate S (step S205). Furthermore, as shown in FIG. 12(C) , the mounting head 31 is driven toward the substrate S by the driving mechanism 32 , and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206 ).

As described above, the electronic components C are sequentially mounted on the substrate S by repeating the operations of transferring the electronic components C from the wafer WS, handing over the electronic components C to the mounting head 31 , and positioning and mounting the electronic components C and the substrate S. Each installation area B. The substrate S after mounting a predetermined number of electronic components C is transported by the substrate support mechanism 2 and stored in the unloader.

[Effect] (1) The mounting device 1 for electronic components C according to this embodiment includes: a mounting head 31 for mounting the electronic components C sucked and held by the negative pressure of the suction hole 31 c on the substrate S; and a pick-up collet 700 having a porous structure. The porous member 701 ejects gas from the pores and holds the electronic components C in a non-contact manner by the negative pressure of the suction hole 701c. The pickup collet 700 picks up the electronic components C from the supply unit 6. The electronic component C is transferred to the mounting head 31; the moving device 7 moves the mounting head 31 and the pickup collet 700 relative to each other; and the control device 8 ejects the gas from the porous member 701 and passes through the suction hole 701c. While holding the electronic component C in a non-contact manner under negative pressure, the moving device 7 is used to bring the mounting head 31 and the pickup collet 700 close to a predetermined distance, and the mounting head 31 is used to perform suction. After a predetermined time has elapsed at the predetermined interval, Then, the suction of the pickup collet 700 is released, so that the mounting head 31 suctions and holds the electronic component C.

Furthermore, in the mounting method of the electronic component C of this embodiment, the pick-up collet 700 includes the porous member 701 that ejects gas from the pores and holds the electronic component C in a non-contact manner by the negative pressure of the suction hole 701c. The electronic component C is held in a non-contact manner and is picked up from the supply part 6 of the electronic component C. The moving device 7 uses the mounting head 31 for mounting the electronic component C on the substrate S and the pickup that picks up the electronic component C and reverses it. The collet 700 approaches a predetermined distance, and starts suction through the negative pressure provided in the suction hole 31c of the mounting head 31. After a predetermined time has elapsed at a predetermined interval, the suction of the pickup collet 700 is released. The mounting head 31 sucks and holds the electronic component C.

Therefore, in this embodiment, when the electronic component C is picked up in a non-contact manner using the pickup collet 700 and transferred to the mounting head 31, it can be positioned at the suction hole 31c. Here, when the gas is ejected from the porous member 701 and the electronic component C is picked up in a non-contact manner by suction through the suction hole 31c, the electronic component C can easily move in the area surrounded by the guide portion 703.

However, in this embodiment, the mounting head 31 pulls the displaced electronic component C to the suction hole 31c and positions it, and then receives the electronic component C. Therefore, the position where the mounting head 31 holds the electronic component C is fixed. In the position recognition using the image of the mark m of the electronic component C and the subsequent corrective movement, it is possible to suppress the time required or the error from increasing. This can reduce positional deviation during installation. In addition, even if the deviation of the holding position of the mounting head 31 in the horizontal direction or the θ direction is not corrected at all, it is possible to reduce the number of subsequent position corrections by positioning the electronic component C using the mark m and the mark M as described above. The amount of movement allows for more accurate installation.

Furthermore, if suction is continued from before the mounting head 31 receives the electronic component C, the surrounding dust will continue to be sucked, thereby affecting the nearby electronic component C. However, in this embodiment, suction using the negative pressure of the suction hole 31c is started after the mounting head 31 and the pickup collet 700 approach a predetermined distance. Therefore, the time for suctioning dust can be minimized, thereby reducing the risk of damage to electronic components. The influence of C.

(2) The suction hole 31c is provided in the center of the suction area D of the electronic component C of the mounting head 31, and the center of the electronic component C held by the pickup collet 700 is pulled to the suction area D within a predetermined allowable range within a predetermined time. Central time. Therefore, the electronic component C can move horizontally with respect to the holding portion 31b of the mounting head 31 and can be transferred to the mounting head 31 after ensuring time for positioning at the center. Therefore, the possibility of positioning in the center of the adsorption area D can be increased.

(3) The predetermined interval is set to include a first interval d1 and a second interval d2 smaller than the first interval d1, and the control device 8 causes the moving device 7 to move the mounting head 31 and the pickup tube from the first interval d1 to the second interval d2. The clamp 700 is sucked by the mounting head 31 for a predetermined time in the state of the first distance d1, and the suction of the pickup collet 700 is released in the state of the second distance d2.

Therefore, by setting the first distance d1, the electronic component C can move horizontally with respect to the holding portion 31b, ensuring the state of being sucked and positioned by the suction hole 31c, and by setting the second distance d2, the electronic component C can be placed in a very close position In this state, the mounting head 31 holds the electronic component C. Therefore, the change in the posture (XYθ) of the electronic component C during the handover of the electronic component C can be minimized, and the amount of movement when positioning the electronic component C using the mark m, positioning of the mark M, etc. can be reduced, and it can be more accurate. installed on the ground.

Furthermore, when the mounting head 31 starts suction, the suction force on the electronic component C may become stronger instantaneously. In this case, there is a possibility that the electronic component C may jump up and accidentally come into contact with the mounting head 31 , or may fall due to detachment from the pickup collet 700 . Therefore, by starting the suction of the mounting head 31 in the first interval d1 where the mounting head 31 is relatively far away from the electronic component C, a strong suction force is suppressed from instantaneously acting on the electronic component C. In a stable state, Positioning is performed in the state, and by setting the second distance d2, the mounting head 31 can be held.

In addition, the start of suction by the mounting head 31 is accompanied by the start of the suction force, as long as a period in which the suction force suddenly becomes stronger due to a sudden start of suction can be avoided. Therefore, suction can be started before the first interval d1 is reached. Even before reaching the first interval d1, as long as the period of instantaneous intensification has passed, since it is very close, there is no continuous suction of surrounding dust to affect the nearby electronic component C. Therefore, "using the moving device to bring the mounting head and the pickup collet close to a predetermined distance and performing suction using the mounting head" includes when the suction of the mounting head 31 starts before the predetermined distance becomes, or when the predetermined distance has already been reached.

Furthermore, the second interval d2 does not necessarily need to be set. The electronic component C can also be directly adsorbed and held at the first interval d1. When the suction of the pickup collet 700 is stopped and the electronic component C is adsorbed to the holding part 31 b, it is not necessary as long as the damage to the electronic component C is within the allowable range or even if the deviation occurs, it is within the allowable range. It changes to the second interval d2 and can be adsorbed and held. Furthermore, by gradually stopping the suction of the pickup collet 700, the movement of the electronic component C when being sucked can be slowed down, thereby suppressing impact or positional deviation. At this time, a flow rate adjustment mechanism or a suction pressure adjustment mechanism that controls suction may be provided to weaken the suction of the holding portion 31b. Weakening the suction of the holding portion 31b and gradually weakening and stopping the suction of the pickup collet 700 may be performed simultaneously. In this case, the movement to the second interval d2 and the stop need not be performed, so the takt time can be shortened. In addition, the control device 8 may be set to a mode so that the adsorption and holding at the first interval d1 or the second interval d2 can be selected based on which one takes priority between damage or positional deviation of the electronic components and the takt time.

(4) In this embodiment, when the mounting head 31 performs suction at predetermined intervals when transferring the electronic component C, the suction force of the pickup collet 700 is weakened. Therefore, the force pulling to the pickup collet 700 in the vertical direction is weakened, the electronic component C is easily moved horizontally, and the suction and holding of the electronic component C by the mounting head 31 becomes smooth.

[Modification] (1) In the above form, with the mounting head 31 approaching the electronic component C, the holding part 31b performs suction to pull the electronic component C. However, depending on the distance of the gap between the electronic component C and the holding part 31b, there is a concern that The resistance when the gas flows is large, and sufficient air flow cannot be obtained depending on the size of the electronic component C. Therefore, as shown in FIG. 15 , the mounting head 31 may be provided with an ejection port 31 d for ejecting gas toward the outer periphery of the electronic component C. For example, a through hole inclined in the direction toward the outer periphery of the electronic component C in the holding portion 31b of the mounting head 31 is provided as the discharge port 31d. A gas supply circuit (not shown) is connected to the discharge port 31d, and the gas is discharged toward the outer periphery of the electronic component C from the bottom surface side of the holding portion 31b. This makes it easier for the electronic component C to move closer to the center. As described above, by ejecting the gas from the outer peripheral side of the holding portion 31b and supplying the gas to the outer peripheral portion of the electronic component C to increase the air pressure, the required air flow can be easily ensured. Therefore, as long as the necessary gas can be supplied, the discharge port 31d does not necessarily need to be inclined toward the outer periphery of the electronic component C.

(2) In the above-mentioned form, the moving device 7 moves the pickup collet 700 to the mounting position OA to approach the mounting head 31 (see FIGS. 9(A) to 9(E) ). However, the movement only needs to be relative movement, and the pickup collet 700 can be brought close to the pickup collet 700 by moving the moving device of the mounting head 31, or the two can be brought close to each other by moving the moving devices of both. For example, the height of the pickup collet 700 may be fixed at the reversed position, and the mounting head 31 may be lowered to perform transfer.

(3) The guide portion 703 of the pickup collet 700 only needs to be provided along the outer edge of the facing surface 701 a so as to restrict the movement of the electronic component C. That is, it suffices to limit the movement of the electronic component C to the extent that the electronic component C is detached from the pickup collet 700 due to movement or reversal of the pickup collet 700 . Therefore, the guide portion 703 only needs to be provided on the four sides of the facing surface 701a. It may be provided on the entire circumference of the facing surface 701a, or may be provided on a part of each side. For example, the guide portion 703 may be continuously arranged across the corner portion as shown in FIG. 16(A) or along the corner portion as shown in FIG. 16(B) . In addition, as shown in (B) of FIG. 16 , one of the orthogonal guide portions 703 may be continuous with the other orthogonal guide portion 703 .

Furthermore, the pickup collet 700 without the guide part 703 may be used. In this case, the electronic component C is prone to shift, but a large shift can be corrected by positioning by the suction.

(4) The number or size of the suction holes 701c and the openings 701d is not limited to the above-mentioned forms. In the facing surface 701a of the porous member 701, the suction holding state and the non-contact state can be maintained by balancing the area in which the electronic component C is supported by the gas layer and the total area of the opening 701d.

(5) The positions and shapes of the suction holes 701c and the openings 701d are not limited to the above-mentioned forms. For example, the shape of the opening 701d may be a circle, a rectangle, or other elliptical shapes, polygons, rounded polygons, star shapes, etc.

(6) By making the pickup collet 700 replaceable, it can be replaced according to the shape and size of the electronic component C. As the replaceable structure, the structure that can be sucked and held by magnets is simple, and the replacement operation is also easy. However, it only needs to be a structure in which the pickup collet 700 can be replaced. For example, it may be adsorption holding using negative pressure or a mechanical holding structure.

(7) The supply unit 6 is not limited to a device that supplies the electronic components C attached to the wafer WS. For example, it may be a device that supplies electronic components C arranged on a tray. Furthermore, the transfer mechanism 73 may be configured so as to be able to individually pick up the electronic components C from the supply unit 6 and transfer them. Therefore, the arm 72 may be configured to move along the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move along the X-axis and Y-axis directions.

(8) In the transfer mechanism 73 , the driving unit that drives the arm portion 72 is not limited to a mechanism using a linear motor as a driving source. A mechanism using a ball screw or a conveyor belt using a motor that rotates a shaft as a driving source may also be used. In the case of such a mechanism, since it includes the sliding part SL, it is preferable to provide it in the position which does not overlap with the mounting surface F in a plan view. Furthermore, it is preferable to provide the sliding portion SL at a lower position than the height position of the mounting surface F. In addition, when there are a plurality of sliding portions SL, some of the sliding portions SL may not be provided at a position that does not overlap the mounting surface F in a plan view. Furthermore, some of the sliding portions SL may not be provided at a position lower than the height position of the mounting surface F. In this case, it is preferable to provide a shield such as an outer package, a wall, or other structural parts between the sliding portion SL and the mounting surface F. Furthermore, it is preferable to lengthen the distance between the sliding portion SL and the mounting surface F.

(9) The mounting head 31 only needs to be configured so that the second imaging unit 5 can image the mark M on the substrate S. Therefore, the transmissive portion of the mounting head 31 does not need to be formed of a transparent material, or a through hole may be formed at a location corresponding to the mark M. More specifically, the holding part 31b may be formed of an opaque member, and a through hole may be formed at a location corresponding to the mark M, or the hollow part 31a may not exist, and the holding part 31b may be formed of an opaque member. Through-holes are formed in portions of the head 31 and the holding portion 31b corresponding to the mark M. That is, this through hole is also the transmission part of the mounting head 31 .

(10) The first imaging unit 4 or the second imaging unit 5 may be provided movably with respect to the position where the electronic component C is mounted (mounting position OA). That is, when the plurality of marks m of the electronic component C or the plurality of marks M of the substrate S cannot be photographed at once, the first imaging unit 4 or the second imaging unit 5 may move between the marks m or between the marks M to photograph. way of composition. That is, a moving device for moving the first imaging unit 4 between the marks m or a moving device for moving the second imaging unit 5 between the marks M may be provided. Even in this case, the moving distance is limited to the size of the electronic component C or the mounting area B of the substrate S and is short, so errors and dust generation can be suppressed. Since the imaging magnification can be selected according to the required mounting accuracy, position recognition accuracy can be improved.

(11) In the above aspect, the position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are respectively aligned with the reference position (mounting position OA). However, the invention is not limited to this, and the electronic component may be The position of the component C is aligned with the position of the mounting area B, or the position of the mounting area B is aligned with the position of the electronic component C. In short, it suffices as long as the position of the mounting area B of the substrate S and the position of the electronic component C can be aligned. When the stage 21 is moved by a correction amount for position alignment and the positions of the substrate S and the electronic component C are aligned, there is no need to align the positions of the relatively large and heavy stage 21 in each mounting area B. Therefore, the installation accuracy can be further improved and the time for position correction can be shortened.

(12) The substrate support mechanism 2 can be transferred to the substrate S of the stage 21 at the installation position OA. In this case, after the substrate S is supplied to the stage 21 , the substrate S may be evacuated from the mounting position OA before the first imaging unit 4 captures the mark m of the electronic component C.

2. Second embodiment The second embodiment of the present invention will be described with reference to (A) and (B) of FIG. 17 , (A) and (B) of FIG. 18 , and (A) to (O) of FIG. 19 instruction. The second embodiment uses a different mounting head 31 from the first embodiment. The other parts are the same as those in the first embodiment, so description of parts other than the mounting head 31 is omitted. 17(A) and 17(B) are an example of the mounting head 31 used in the second embodiment, and are plan views showing a state in which the pickup collet 700 that holds the electronic component C in a non-contact manner approaches the mounting head 31 . FIG. 18(A) and FIG. 18(B) are cross-sectional views showing the above situation. 17(A) and 17(B) are schematic diagrams showing the mounting head 31 seen through from the mounting head 31 side. [structure] In the second embodiment, as shown in FIGS. 17(A) and 17(B) , two suction holes 311 c and 312 c are provided in the holding part 31 b provided in the mounting head 31 . The suction hole 311 c and the suction hole 312 c are arranged symmetrically with respect to the center of the suction area D in the mounting head 31 . For example, the two suction holes 311 c and the suction hole 312 c are arranged at positions that are symmetrical (line symmetric) with respect to a straight line passing through the center of the adsorption area D. At this time, a straight line passing through the center of the adsorption area D may extend in a direction required for mounting the electronic component C on the substrate S. In FIG. 17(A) and FIG. 17(B) , it is a line (not shown) orthogonal to the line represented by the center line extending vertically in the figure.

Furthermore, as long as the suction holes are linearly symmetrical, the number of suction holes provided in the holding portion 31b does not need to be two, and the number can be increased or decreased according to the size of the electronic component C. At this time, in the assumed maximum offset state of the electronic component C just before the mounting head 31 is delivered from the pickup collet 700 , the suction hole 311 c and the suction hole 312 c are positioned so as not to be exposed from the electronic component C. That is, Can. Furthermore, in order to achieve a balanced suction force, it is advisable to set the number of suction holes and the distance from the center to be the same. Moreover, in the direction along the straight line passing through the center of the adsorption area D, even if there is a difference in the number of suction holes, the distance from the center point can be adjusted according to the number of suction holes, thereby obtaining the suction. Suction balance. The same applies to the direction intersecting the straight line passing through the center of the adsorption area D.

The arrangement of each suction hole is preferably such that the electronic components to be sucked move along the center direction of the adsorption area D of the mounting head 31, and is preferably line symmetrical with respect to a straight line in a direction consistent with the vertical and horizontal center lines of the adsorption area D. And it is point symmetrical with equal distances and equal angles relative to the center point of the adsorption area D.

Furthermore, in the second embodiment, as shown in FIG. 19(A) , the suction holes are provided at equal distances and equal angles (180 degrees) from the center of the adsorption area, as shown in FIG. 19(B to H) As shown in the figure, even when more than two suction holes are provided, each suction hole can be arranged at an equal distance and an equal angle from the center of the adsorption area. For example, as shown in (C) of FIG. 19 , in the case of four angles, it may be 90 degrees or the like.

[effect] In the second embodiment having such a structure, when gas is sucked from the suction hole 311c and the suction hole 312c that are provided symmetrically with respect to the center of the mounting head 31, the mounting head 31 sucks the surrounding area from the entire circumference in the horizontal direction. The gas thus generates a suction flow Q flowing from the outer circumference of the mounting head 31 toward the suction hole 311 c and the suction hole 312 c on the center side. As shown in FIGS. 18(A) and 18(B) , the suction flow Q passes between the surface of the electronic component C supported by the airflow G blown out from the pores of the porous member 701 and the mounting head 31 . The gap between the holding portion 31b flows.

At this time, friction between the suction flow Q and the surface of the electronic component C generates a force that presses the electronic component C from the outer circumference of the mounting head 31 toward the suction hole 311 c and the suction hole 312 c. The force is greater at a portion where the opposing area between the suction flow Q and the electronic component C is larger. Therefore, when the center of the electronic component C and the mounting head 31 is offset as shown in FIG. 18(A) , as shown in FIG. 18(A) , the force is greater. As shown on the right side of the figure, the larger the deflection amplitude is and the larger the contact area with the suction flow Q is, the more force it receives from the suction flow Q, the stronger the electronic component C is pressed to the suction hole 311c and the suction hole 312c. side, that is, the center side of the mounting head 31.

As shown in (A) of FIG. 17 , the above-described action occurs around the entire circumference of the electronic component C. Therefore, as shown in (B) of FIG. 17 , the electronic component C is disposed at the center of the mounting head 31 . Especially in the second embodiment, by providing two or more suction holes 311c and 312c symmetrically with respect to the center of the holding portion 31b, even if the electronic component C rotates and deviates in a certain direction, it can be adjusted according to the direction of the electronic component C. The positional or rotational deviation plays a role, and the force V of each suction hole 311c and the suction hole 312c that sucks the electronic component C is naturally balanced. In addition, the greater the distance between the suction holes, the longer the distance from the fulcrum to the force point, and the greater the angle correction (traction) force.

As a result, the suction flow Q from the two suction holes that are symmetrical about the center of the installation tool is pulled toward the center of the installation tool, and the offset in the rotation direction is also balanced at the two suction holes, so that The state of the required posture brings the electronic component C closer and eliminates the rotational offset.

[Effect] As described above, by providing two or more suction holes in the holding part 31b of the mounting head 31 symmetrically with respect to the center of the holding part 31b, when the electronic component C is transferred from the pickup collet 700 to the mounting head 31, it is possible to The posture (position or rotation in the horizontal direction) of the electronic component C held by the pickup collet 700 in a non-contact manner is corrected to an angle corresponding to the shape of the holding part 31 b at the center of the holding part 31 b. Therefore, when two or more suction holes are present, the electronic component C can be received from the pickup collet at a more appropriate position in the holding portion 31 b of the mounting head 31 than when there is one suction hole. The electronic component C held by the pickup collet 700 in a non-contact manner is likely to move or rotate during transfer or reversal. However, even if there is such movement or rotation, it can be set to a desired posture. Furthermore, the electronic component C held by the holding portion 31b can be prevented from freely rotating. As a result, the mounting head 31 can always hold the electronic component C at a fixed position or a rotational position, thereby achieving higher-precision mounting.

Furthermore, a plurality of suction holes are used to set the posture of the electronic component C to a desired posture. Therefore, the force acting on the electronic component C is increased, and the electronic component held by the pickup collet 700 can be shortened within a predetermined allowable range. The time required for the center of C to be pulled to the center of adsorption area D is the predetermined time. As a result, the takt time can be shortened and productivity can be improved.

In particular, by arranging the plurality of suction holes in a symmetrical state (line symmetry) with respect to a straight line passing through the center of the suction area D corresponding to the direction required for installation, that is, a straight line passing through the center of the holding portion 31b, it is possible to achieve better performance (line symmetry). Reliably and quickly correct the posture (position, orientation) of electronic component C to the desired state. This enables higher-precision installation.

3. Other implementations The present invention is not limited to the above-described embodiments, and at the implementation stage, the structural elements can be modified and embodied within the scope that does not deviate from the gist of the invention. Furthermore, various inventions can be formed by appropriate combinations of the plurality of structural elements disclosed in the embodiments. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, structural elements in different embodiments may be combined appropriately. The following is an example.

Other arrangement examples of the suction holes are shown in FIGS. 19(A) to 19(O) . In addition, each suction hole is indicated by a circle in (A) to (O) of FIG. 19 . They may be arranged in one row horizontally or one row vertically as shown in (A) to (O) of Fig. 19 , or they may be arranged crosswise. Furthermore, the plurality of suction holes may be at the vertex positions of a square, a rectangle, a rhombus, etc. or along the sides thereof. Furthermore, various other line symmetries not included in FIGS. 19(A) to 19(O) may be arranged. When the electronic component C is transferred from the pick-up collet 700 to the holding part 31 b by suction, the electronic component C may be pulled into a posture (position, orientation) required for mounting the electronic component C on the substrate S.

For example, when a plurality of suction holes are arranged in a straight line, and when the electronic component C is shifted in the rotation direction so as to cross the extension direction of the straight line, the suction holes are arranged along the straight line. The straight line of the hole corrects the orientation of the electronic component C. Moreover, the shift in the horizontal direction (XY direction) of the electronic component C draws the center position of the electronic component C to the center position where the plurality of suction holes are arranged. This effect is the same as that shown in FIGS. 17(A) and 17(B) , and 18(A) and 18(B) . The arrangement of FIG. 19(A) is the same as the arrangement of FIG. 17(A) and FIG. 17(B) whose orientation changed by 90°. exert the same effect. The arrangement of FIG. 19(D) can be considered to be the same as that of FIG. 17(A) and FIG. 17(B) . Therefore, the same effect is exerted.

(B) of FIG. 19 , (E) of FIG. 19 , and (J) of FIG. 19 can also be considered to be the same as these and exhibit the same effects. However, as the number of suction holes is large, the correction force in the horizontal direction or the rotation direction is strongly exerted. Therefore, regarding this corrective force, (B) of FIG. 19 acts stronger than (A) of FIG. 19 , and (J) of FIG. 19 acts stronger than (B) of FIG. 19 . (E) in Figure 19 functions stronger than (D) in Figure 19 . As a result, the posture can be corrected more reliably and quickly.

19(C) and 19(D) show the relationship between the dotted line in FIGS. 19(A) to 19(O) (the line passing through the center of the adsorption area D). The four suction holes are arranged symmetrically with respect to the extending direction of the line and the direction intersecting the line (orthogonal direction in the above case). Furthermore, the four suction holes are arranged so that the centers thereof coincide with the centers of the adsorption areas D. In any case, the electronic component C can be pulled in the direction along the line passing through the center of the adsorption area D and the center of the adsorption area D, similarly to FIGS. 17(A) and 17(B) .

It exerts the same effect as FIG. 17(A) and FIG. 17(B) , and rotates while being separated from the center of the adsorption area D in a direction orthogonal to the extending direction of the line passing through the center of the adsorption area D. The direction correction force becomes stronger. Therefore, the electronic component C can be quickly corrected to a desired posture more reliably. In Figure 19 (G), Figure 19 (H), Figure 19 (I), Figure 19 (K), Figure 19 (L), Figure 19 (M), Figure 19 (N), The same effect is also exerted in (O) of Fig. 19 . Therefore, the same effect is exerted by various arrangements that are symmetrical about a line passing through the center of the adsorption area D corresponding to the desired posture of the electronic component C.

In addition, as described above, in FIGS. 19(A) to 19(O) , the distance from the center of the adsorption area D to the suction hole with respect to the extending direction of the line indicated by the dotted line is longer than the distance of the line. In the case of a distance in an orthogonal direction, the longer the distance, the greater the correction force is especially in the rotation direction. Therefore, the posture of the electronic component C can be quickly changed to the desired posture more reliably. Therefore, the correction force of (F) in FIG. 19 is stronger than that of (C) of FIG. 19 , and the correction force of (L) of FIG. 19 is stronger than that of (K) of FIG. 19 . That is, the posture of the electronic component C can be quickly corrected more reliably.

Of course, the suction holes are arranged as shown in Fig. 19 (B), Fig. 19 (E), Fig. 19 (K), Fig. 19 (L), Fig. 19 (N), and Fig. 19 (O). When it is installed at the center of the adsorption area D, a correcting force to position the electronic component C at the center of the adsorption area D is exerted strongly. Therefore, the electronic component C can be quickly brought into the desired position more reliably.

Furthermore, when arranging three suction holes, at least one suction hole may be provided on a line passing through the center of the adsorption area D, and more preferably, as shown in (H) of FIG. 19 , it may be located on a vertex. The suction holes are arranged on a line passing through the center of the adsorption area D, and the remaining two suction holes are arranged symmetrically with respect to the line in an orthogonal direction to the line passing through the center of the adsorption area D.

This can produce the same effects as those in (A) and (B) of FIG. 17 . In addition, in this case, the center of the electronic component C is drawn to the two suction holes. Therefore, taking this aspect into consideration, the electronic component C may be staggered so as to be positioned at the center of the suction area D.

Regarding the correction force in the direction of rotation, it is appropriate that the suction hole at the vertex is far away from other suction holes, so the triangle with three suction holes as vertices should be set as an isosceles triangle.

1: Install the device 2:Substrate support mechanism 3: Installation mechanism 4:First shooting department 5:Second shooting department 6: Supply Department 7:Mobile device 8:Control device 11:Support platform 11a:Containment hole 21: Carrier platform 22, 32, 62: Driving mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b: guide rail 23:Mobile board 23a:Through hole 31: Installation head 31a: Hollow part 31b:Maintenance Department 31c, 311c, 312c, 701c: suction hole 31d: spout 33, 34, 35, 733: moving body 61:Support mechanism 61a: Ring retainer 71:Transfer head 71a: Adsorption nozzle 71b, 710: Reverse drive unit 72:Arm 72a:Extension 72b: Base part 73:Transfer agency 700: Pick up collet 701: Porous components 701a: Opposing surface 701b: Back 701d:Open your mouth 702:Pedestal 702a: Air supply hole 702b:Exhaust hole 702c:Mounting hole 703, 703K～703N: Guidance Department 704: Loading and unloading department 704a: pin 720:Rotating body 731: Fixed body 732:First drive department 732a: First driving source 732b: First sliding part 734:Second drive unit 734a: Second drive source 734b: Second sliding part B:Installation area C: Electronic parts D: Adsorption area F: mounting surface G: gas M, m: mark OA: installation location Q:Suction flow S:Substrate SL: sliding part T: Transmission area V: The force that attracts the electronic component C WS: wafer

FIG. 1 is a front view showing the schematic structure of the mounting device according to the embodiment. FIG. 2 is a plan view showing the electronic component and the substrate. 3(A) and 3(B) are a plan view (A) of the mounting device and an enlarged plan view (B) of the mounting location. (A) of FIG. 4 is a schematic cross-sectional view showing the principle of holding electronic components using a pickup collet, and (B) of FIG. 4 is a bottom perspective view of the base. Fig. 5 is a bottom perspective view showing the pickup collet and the attachment and detachment portion. Fig. 6 is an upper surface side perspective view showing the pickup collet and the attachment and detachment portion. 7(A) and 7(B) are enlarged views showing the reversal operation of the electronic component, with the left side being a front view and the right side being a plan view. 8(A) to 8(D) are explanatory diagrams showing the pickup operation of electronic components. 9(A) to 9(E) are explanatory diagrams showing the transfer operation of electronic components. 10(A) to 10(D) show a state in which the mounting head and the pickup collet are close to the first distance (A), a state in which suction of the mounting head is started (B), and a state in which the pickup collet is weakened. Explanatory diagram of the state of suction (C), and the state of approaching the second distance and holding electronic parts (D). 11(A) and 11(B) are explanatory diagrams showing a state in which the pickup collet is positioned on the mounting head (A), and a state in which the electronic component is positioned in the center (B). 12(A) to 12(C) are explanatory diagrams showing the mounting operation of the mounting device. FIG. 13 is a flowchart showing the sequence of picking up and handing over electronic components. FIG. 14 is a flowchart showing the mounting procedure of electronic components. FIG. 15 is an explanatory diagram showing a mounting head provided with a discharge port. 16(A) and 16(B) are bottom views showing modifications of the arrangement of the guide portion. 17(A) and 17(B) are schematic plan views showing the arrangement of the suction holes and the pulling state of the electronic components according to the second embodiment. ((A) shows the state in which the electronic components are offset, and (B) ) indicates the state in which electronic components are pulled to the center). 18(A) and 18(B) are cross-sectional views showing the arrangement of the suction holes according to the second embodiment. ((A) shows the state in which the electronic components are offset, and (B) shows the electronic components being pulled to the center. status). 19(A) to 19(O) are explanatory diagrams showing arrangement examples (A) to (O) of suction holes.

31: Installation head

31b:Maintenance Department

31c: Suction hole

700: Pick up collet

701: Porous components

701a: Opposing surface

701b: Back

701c: Suction hole

701d:Open your mouth

702:Pedestal

702a: Air supply hole

702b:Exhaust hole

702c:Mounting hole

703: Guidance Department

C: Electronic parts

G: gas

Q:Suction flow

V: The force that holds electronic component C

Claims (8)

An electronic component mounting device, including: The mounting head is used to mount the electronic components sucked and held by the negative pressure of the suction hole on the substrate; A pick-up collet includes a porous member that ejects gas from pores and holds the electronic components in a non-contact manner by negative pressure passing through the suction hole, and the pick-up collet is supplied from the The electronic parts supply part picks up the electronic parts and delivers them to the mounting head; A moving device to relatively move the mounting head and the pickup collet; and The control device uses the moving device to move the mounting head and the electronic component in a state where the gas is ejected from the porous member and the electronic component is held in a non-contact manner by the negative pressure of the suction hole. The pickup collet approaches to a predetermined distance, and uses the mounting head to perform suction. After a predetermined time has elapsed at the predetermined interval, the suction of the pickup collet is released, so that the suction of the mounting head is maintained. Described electronic parts. The mounting device for electronic parts according to claim 1, wherein: one of the suction holes is provided in the center of the adsorption area of the electronic parts of the mounting head, The predetermined time is the time required to pull the center of the electronic component held by the pickup collet to the center of the adsorption area within a predetermined allowable range. The mounting device for electronic parts according to claim 1, wherein a plurality of the suction holes are provided symmetrically with respect to a line passing through the center of the adsorption area of the electronic parts of the mounting head, The predetermined time is the time required to pull the center of the electronic component held by the pickup collet to the center of the adsorption area within a predetermined allowable range. The mounting device for electronic components as described in claim 1, wherein: A plurality of the suction holes are provided at equal distances and equal angles with respect to the center of the adsorption area of the electronic component of the mounting head, The predetermined time is the time required to pull the center of the electronic component held by the pickup collet to the center of the adsorption area within a predetermined allowable range. The electronic component mounting device according to claim 1, wherein the predetermined interval is set to include a first interval and a second interval smaller than the first interval, The control device is causing the moving device to move the mounting head and the pickup collet from the first interval to the second interval, In the state of the first interval, suction is performed by the mounting head for a prescribed time, In the second spaced state, the suction of the pickup collet is released. The electronic component mounting device according to any one of claims 1 to 5, wherein when the electronic component is handed over, the pickup collet is weakened when the mounting head suctions at the prescribed interval. of suction power. The electronic component mounting device according to any one of claims 1 to 5, wherein the mounting head is provided with an ejection port for ejecting gas toward the outer periphery of the electronic component. An installation method of electronic parts, wherein: A pick-up collet including a porous member that ejects gas from pores and passes through the negative side of a suction hole holds electronic parts in a non-contact manner and picks up the electronic parts from a supply portion of the electronic parts. Pressure holds the electronic parts in a non-contact manner, The moving device brings the mounting head for mounting the electronic component on the substrate and the pickup collet that picks up the electronic component and inverts them close to a predetermined distance, Start suction through the negative pressure provided in the suction hole of the mounting head, After a predetermined time has elapsed at the predetermined interval, suction of the pickup collet is released, whereby the mounting head suction-holds the electronic component.

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