TWI692834B - Packaging device and packaging method of electronic parts - Google Patents

Abstract

The invention provides a packaging device and a packaging method for electronic components that can package electronic components on a substrate with high accuracy. Before the upper and lower camera 51 images the packaging area of the electronic component (semiconductor chip t) and the substrate K at the pre-set packaging position C, the upper and lower camera 51 performs the packaging area positioned at the packaging position C For imaging, the positional deviation of the package area relative to the package position C is obtained from the imaged image, and the stage driving unit 22 is controlled to correct the position of the package area so as to eliminate the obtained positional deviation.

Description

Packaging device and packaging method of electronic parts

The invention relates to a packaging device and a packaging method of electronic parts.

In the manufacturing process of semiconductor packages such as Quad Flat Package (QFP) or Ball Grid Array Package (BGA), the electrode-formed surface (electrode forming surface) of electronic components such as semiconductor wafers is formed A flip chip package that is packaged opposite to a substrate on which a circuit pattern is formed, such as an interposer substrate. In the flip chip package, in order to directly bond the fine electrode pads of the electronic component and the fine terminals formed on the circuit pattern of the substrate, it is necessary to position the two with high accuracy. Therefore, in the packaging device of the electronic component for flip chip packaging, high positioning accuracy and packaging accuracy are required.

As a packaging device for electronic parts that meets such requirements, the one disclosed in Patent Document 1 is known. Such an electronic component packaging device positions the packaging area of the packaged electronic component on the substrate at a predetermined packaging position set in advance, and also positions the electronic component packaged in the packaging area above the packaging area. In this state, the upper and lower camera are inserted between the substrate and the electronic component, the lower camera is used to identify the position of the package area of the substrate, and the upper camera is used to identify the position of the electronic component. Then, the electronic device is packaged after positioning the package area of the substrate and the electronic component based on the recognition results of the two.

Such a packaging device realizes about ±2 μm to 3 μm as a sufficient packaging accuracy for manufacturing QFP or BGA.

However, in recent years, due to the popularization of mobile devices such as mobile phones, the development of small and high-functional high-bandwidth memory is being used, and semiconductor packages using three-dimensional high-volume integration technology using through-silicon-via (TSV) are used The manufacturing process is gaining attention. The TSV refers to an electrode that vertically penetrates the inside of the semiconductor wafer. In such a three-dimensional high-integration technology using TSV, each semiconductor wafer has more than 1,000 through electrodes more than the semiconductor wafer used in QFP, and all of the through electrodes must be electrically Sexual connection.

Therefore, it is presumed that the packaging accuracy of each semiconductor wafer, that is, the electronic component is required to be higher than the packaging accuracy required in the manufacturing process of QFP, BGA, etc., specifically, the packaging accuracy is ±1 μm or less. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2011-077173

[Problems to be Solved by the Invention] However, if the electronic device packaging device of the configuration disclosed in Patent Document 1 is directly used, it is difficult to obtain a packaging accuracy of ±1 μm or less.

Therefore, the inventors have tried to increase the imaging magnification of the up and down camera to improve the position recognition accuracy. However, if only the position recognition accuracy is improved, the packaging accuracy cannot be sufficiently improved to the extent that it meets the requirements in the manufacturing process using TSV.

An object of the present invention is to provide a packaging device and a packaging method for electronic components that can package electronic components on a substrate with high accuracy. [Means to solve the problem]

The electronic component packaging device of this embodiment is an electronic component packaging device for packaging electronic components in a plurality of packaging regions on a substrate, and includes: a supply section for supplying the electronic component; a substrate platform including the mounting platform A mounting table for a substrate and a mounting table driving section for moving the mounting table, by the driving of the mounting table driving section, sequentially positioning the plurality of packaging regions of the substrate mounted on the mounting table At a pre-set packaging position; a packaging section, which includes a packaging tool that holds the electronic component supplied from the supply section and a tool driving section that moves the packaging tool, and packages the electronic component in the positioning In the packaging area at the packaging position; the camera section at the packaging position performs the packaging area of the electronic component held on the packaging tool and the substrate placed on the mounting table Imaging; and the control unit, based on the imaging image obtained by the imaging unit, recognizes the relative positional relationship between the electronic component and the package area, and controls the tool drive unit, the electronic component and the package The area is relatively positioned so that the electronic component is packaged in the packaging area; and before the control portion uses the imaging unit to image the electronic component and the packaging area at the packaging position, The imaging section is used to image the packaging area positioned at the packaging position, and the positional deviation of the packaging area relative to the packaging position is obtained from the captured image to eliminate the calculated position Control the mounting table drive unit in a deviated manner.

The packaging method of an electronic component of this embodiment is a packaging method of an electronic component in a plurality of packaging regions on a substrate, which includes: a packaging region positioning step of placing the substrate on a mounting table The predetermined packaging area of the plurality of packaging areas is positioned at a pre-set packaging position; the electronic component positioning step uses a packaging tool to hold the electronic component supplied from the supply section and position the held electronic component At the packaging position; the camera step, the camera and the electronic component are imaged at the package position; and the packaging step, the package area is captured according to the camera image obtained in the camera step Positioning relative to the electronic parts and packaging the electronic parts in the packaging area; and having a position correction step of the packaging area, the position correction step of the packaging area before performing the imaging step, borrow The packaging area positioned at the packaging position by the packaging area positioning step is imaged, and the positional deviation of the packaging area relative to the packaging position is obtained from the camera image to eliminate the calculated The position of the packaging area is corrected in a manner that the position of the position deviates. [Effect of invention]

According to the present invention, electronic components can be packaged on a substrate with high accuracy.

Hereinafter, an embodiment of the present invention (hereinafter, referred to as an embodiment) will be specifically described with reference to the drawings. In addition, the position, size, etc. of each component are merely expedient expressions for easy understanding of the structure.

Here, in the configuration of the conventional electronic component packaging device, there is a limit to the improvement of packaging accuracy of electronic components. That is, after positioning the packaging area of the substrate at a predetermined packaging position, and positioning the electronic component at the predetermined packaging position, the upper and lower cameras are placed between the two, to identify the relative position of the substrate and the electronic component, In the configuration where the two are aligned and packaged, there is a limit to the improvement of package accuracy.

The inventors and others conducted intensive studies and found that the following two factors particularly hinder the improvement of packaging accuracy. One factor is the position error when the substrate is placed on the substrate platform provided in the packaging device of electronic parts, especially the rotation position error in the horizontal rotation direction. Another factor is the positioning error of the packaging area generated when positioning each packaging area of the substrate on the packaging position.

The following describes these situations. When the packaging part or the substrate platform included in the packaging device for electronic parts repeatedly moves to the same position, the reproducibility of the moving position is high. Therefore, in the previous packaging device, the packaging position is specified as a fixed position, and the packaging area of the electronic component and the substrate is positioned relative to the position, thereby trying to eliminate the error of the moving position of the packaging portion or the substrate platform. Therefore, the inventors and others conducted a detailed verification of the operation of the package and the substrate platform. As a result, it can be said that the package portion that can be said to be moved repeatedly repeatedly can substantially eliminate the movement position error.

On the other hand, on the substrate platform, in order to position each package area at the package position in sequence, the intermittent movement in the distance corresponding to the arrangement of the package areas is repeated. Although this motion is repeated movement at the same distance, it is not purely repeated movement. Therefore, it is found that the positioning error slightly occurs due to the absolute position accuracy of the substrate stage each time the movement is intermittent. Furthermore, when the substrate is placed on the substrate stage, a placement position error including horizontal rotation deviation occurs. The mounting position error is corrected by the substrate platform. In this way, it is found that when the placement position error is corrected, even if the same intermittent movement occurs, the substrate stage moves on a different trajectory than when the placement position error is not corrected. Moreover, it is found that the positioning error further becomes larger when the trajectories are different. The inventors and others measured this positioning error on a plurality of substrates and found that although there is a deviation due to the position where the substrate stage moves intermittently or the distance at which it moves intermittently, a positioning error of about 20 μm to 100 μm has occurred.

However, when the electronic component is packaged in the package area, the positioning error is corrected on the package part side. Therefore, even if the packaging portion is positioned at the packaging position with good reproducibility by repeatedly moving, the packaging error is corrected, so the packaging portion packages the electronic component at a position deviated from the packaging position.

Therefore, the inventors et al. have a relationship between the amount of movement of the correction movement of the packaging tool driven in the XYZ direction by the tool driving section in the packaging section and the decrease in the packaging accuracy of the packaging tool due to the correction movement We conducted a survey. That is, the Z axis of the packaging tool appears to maintain a vertical state and moves in the XY direction. However, when viewed microscopically, it moves while shaking with respect to the vertical direction. The reason for this is pitching, yawing, rolling, etc. of the XY moving axis. Therefore, it can be considered that if the movement position of the packaging tool changes, the state of tilt of the Z axis also changes, and if the movement position of the packaging tool changes, the positional deviation in the XY direction that occurs when the packaging tool is lowered also changes. In order to investigate the position deviation caused by this, at the height position where the electronic parts are imaged, the packaging tool is lowered from each of the eight positions set based on the packaging position, and it is confirmed that the electronic parts are packaged on the substrate Packaging accuracy at the time. That is, for each of the eight positions, the degree of deviation from the position immediately below the position before the descent is checked to package the electronic component. Furthermore, the eight positions are shifted by +50 μm, +100 μm, -50 μm, -100 μm in the X direction, and shifted by +50 μm, +100 μm, -50 μm in the Y direction relative to the package position. -100 μm four positions. As a result, it was found that at eight positions, the directions of the position deviations are different, but the maximum package position deviation of more than 1 μm occurs. In addition, it has been found that there is a tendency that the position deviation from the position away from the package position is relatively large compared to the position close to the package position.

Therefore, the inventors have found that by eliminating the movement position error when positioning each packaging area of the substrate on the packaging position, the packaging accuracy can be particularly improved.

[Configuration of Electronic Component Packaging Device] FIG. 1 is a front view showing a schematic configuration of the electronic component packaging device 1 of the embodiment. The electronic component packaging device 1 includes: a supply unit 10 that supplies a semiconductor wafer t that is an electronic component; a substrate stage 20 that mounts a substrate K that encapsulates the semiconductor wafer t; a transfer unit 30 that picks up semiconductor wafers t from the supply unit 10 one by one ; Packaging unit 40, suction and holding the semiconductor wafer t picked up by the transfer unit 30, and the semiconductor wafer t is packaged in a packaging area (not shown) on the substrate K mounted on the substrate platform 20; the imaging unit 50, When the semiconductor wafer t is packaged by the packaging part 40, the semiconductor wafer t and the substrate K are imaged; and the control part 60 controls the supply part 10, the substrate stage 20, the transfer part 30, the packaging part 40, the imaging part 50, etc. ( (See Figure 2).

The supply unit 10 has a wafer table 12 that holds a wafer ring 11. The wafer ring 11 is a member that holds an adhesive sheet (not shown) to which a plurality of semiconductor wafers t that cut and singulate the semiconductor wafer W are attached. The wafer stage 12 can be used in the X direction which is one direction along the horizontal direction, the Y direction which is a direction perpendicular to the X direction along the horizontal direction by the wafer stage driving unit 13 (see FIG. 2 ), and as The direction of rotation in the horizontal plane moves in the θ direction.

The substrate stage 20 includes: a mounting table 21 on which a substrate K that encapsulates a semiconductor wafer t is mounted; and a mounting table drive unit 22 that moves the mounting table 21 in the X direction, Y direction, and θ direction. The substrate platform 20 sequentially positions a plurality of packaging regions in the substrate K placed on the mounting table 21 at the packaging position C shown by the chain line in FIG. 1. The mounting table 21 supplies the substrate K before the semiconductor wafer t is packaged by a substrate transfer device (not shown), and the substrate K after the semiconductor wafer t is packaged is carried out.

The transfer unit 30 includes: an adsorption nozzle 31 that adsorbs and holds the semiconductor wafer t; and an elevating/reversing driving unit 32 (see FIG. 2) that elevates the adsorption nozzle 31 in the Z direction, which is an up-down direction orthogonal to the horizontal direction. , And the suction nozzle 31 is turned upside down about the rotating shaft 31a provided parallel to the X direction. The suction nozzle 31 picks up the semiconductor wafer t from the wafer ring 11 of the supply unit 10 at the pickup position A indicated by the chain line in FIG. 1, and reverses the picked semiconductor wafer t toward the point in FIG. 1. The transfer position B indicated by the crossed line is transferred.

The packaging unit 40 includes: a packaging tool 41 that sucks and holds the semiconductor wafer t supplied from the supply unit 10 and packages the semiconductor wafer t that has been suction-held in a packaging area on the substrate K placed on the mounting table 21; and a tool The driving unit 42 moves the packaging tool 41 in the X direction, Y direction, Z direction, and θ direction. The packaging tool 41 receives the semiconductor wafer t from the adsorption nozzle 31 at the delivery position B, and packages the semiconductor wafer t on the substrate K positioned at the packaging position C at the packaging position C shown by the chain line in FIG. In the package area.

The imaging unit 50 includes: an upper and lower camera 51 that images the package area of the semiconductor wafer t and the substrate K; an advance and retreat drive unit 52 that moves the upper and lower camera 51 forward and backward along the Y direction between the imaging position and the retracted position; and the image The processing unit 53 performs image processing such as binarization on the captured image obtained by the upper and lower camera 51 and sends it to the control unit 60. In addition, the upper and lower imaging cameras 51 include an upper camera 51 a that images the semiconductor wafer t and a lower camera 51 b that images the substrate K. The upper camera 51a and the lower camera 51b are connected to the video processing unit 53 respectively. In addition, the up and down camera 51 includes an optical path conversion unit 51c such as 稜鏡. The optical path conversion portion 51c converts the direction of the optical axis of the upper camera 51a from the Y direction to the upward direction along the Z direction, and converts the direction of the optical axis of the lower camera 51b from the Y direction to the downward direction along the Z direction. In FIG. 1, the optical axes of the upper camera 51 a and the lower camera 51 b are indicated by dot-and-dash arrows. The upper camera 51a, the lower camera 51b, and the optical path conversion unit 51c are accommodated in the housing 51d of the upper and lower imaging cameras 51. Here, the optical axis of the upper camera 51a converted into the Z direction toward the semiconductor wafer t and the optical axis of the lower camera 51b converted into the Z direction toward the package area are arranged so as to coincide in the vertical direction, that is Coaxially arranged. In addition, in the frame body 51d, the openings (not shown) for imaging correspond to the positions of the optical axis converted into the Z direction, and the center positions of the openings are respectively provided in the frame body 51d in a positional relationship corresponding to the optical axis. On the upper and lower surfaces. Therefore, at the imaging position, the opening is positioned at the package position C.

The control unit 60 includes a memory unit 61. The memory unit 61 stores data necessary for the operation of the packaging device 1 such as the operating conditions of the transfer unit 30 or the packaging unit 40 including the information of the packaging position C. The control unit 60 refers to the data stored in the memory unit 61 and controls the supply unit 10, the substrate stage 20, the transfer unit 30, the packaging unit 40, the imaging unit 50, and the like.

[Explanation of operation] Next, the operation of the packaging device 1 of the present embodiment will be described using FIGS. 3 to 6. First, the wafer ring 11 having a plurality of semiconductor wafers t attached to the adhesive sheet (not shown) is supplied and held on the wafer table 12 of the supply unit 10 (wafer ring supply step). In addition, the substrate K before packaging is placed on the substrate stage 20 by a substrate conveying device (not shown) (substrate supply step).

In this state, the wafer stage driving unit 13 is controlled to position the semiconductor wafer t initially picked up on the wafer ring 11 at the pickup position A. When the semiconductor wafer t is positioned at the pickup position A, as shown in FIG. 3, the lift/reverse drive unit 32 is controlled to lower the suction nozzle 31 onto the semiconductor wafer t. The suction nozzle 31 sucks and holds the semiconductor wafer t, rises to the original height, and picks up the semiconductor wafer t (pickup step). Then, the suction nozzle 31 is reversed up and down about the rotation axis 31a, and as shown by the two-dot chain line in FIG. 3, the semiconductor wafer t is positioned at the delivery position B with the front and back reversed (reversal step) .

At this time, as shown in FIG. 3, the packaging tool 41 is positioned at the delivery position B by the tool drive unit 42, more specifically, is positioned at a position directly above the semiconductor wafer t positioned at the delivery position B to stand by . Therefore, when the semiconductor wafer t is positioned at the delivery position B, the tool driving unit 42 is controlled to lower the packaging tool 41 to the position where the semiconductor wafer t held by the suction nozzle 31 is suctioned as shown in FIG. 4. Furthermore, the packaging tool 41 suction-holds the semiconductor wafer t. When the packaging tool 41 sucks and holds the semiconductor wafer t, the packaging tool 41 is raised to the original height by the tool driving unit 42 and transferred to the packaging position C. As indicated by the two-dot chain line in FIG. 4, the transferred semiconductor wafer t is positioned at the package position C at a height position where imaging is performed by the upper and lower camera 51 (electronic component positioning step).

Here, in the present embodiment, the position correction step of the package area is executed during the period from when the package tool 41 receives the supply of the semiconductor wafer t from the supply section 10 to the package position, that is, the package is executed simultaneously with the electronic part positioning step Steps to correct the position of the area.

That is, at the timing when the semiconductor wafer t is picked up by the packaging tool 41 in the pickup step, the package area of the current packaged semiconductor wafer t on the substrate K is positioned at the package position C (package area positioning step). If the packaging area is positioned at the packaging position C, the advancing and retreating drive section 52 is controlled, or the positioning area is positioned at the packaging position C and the advancing and retreating drive section 52 is controlled, as shown in FIG. The position moves toward the camera position. If the upper and lower camera 51 is positioned at the imaging position, the package area is imaged by the lower camera 51b.

Here, on the substrate K, in each package area, for example, a circuit pattern is provided corresponding to the TSV of the semiconductor wafer t, and an alignment mark for positioning is provided. Therefore, the lower camera 51b takes an image of the package area including the alignment mark.

When the lower camera 51b captures an image of the package area, the captured image is sent to the image processing unit 53, and after performing image processing such as binarization in the image processing unit 53, it is sent to the control unit 60. The control unit 60 calculates the position of the package area using image recognition techniques such as a well-known pattern matching method based on the data of the captured image of the lower camera 51b sent from the image processing unit 53, and the package stored in the memory unit 61 in advance By comparing the position information of the position C, the position deviation of the package area relative to the package position C is obtained. As a result, if there is a positional deviation, the stage driving unit 22 is driven to eliminate the positional deviation, and the position of the package area is corrected (position correction step of the package area). Thereby, the packaging area can be correctly positioned on the packaging position C. Furthermore, after correcting the position deviation, the lower camera 51b may be used to image the package area again to confirm whether the position correction of the package area is appropriate. Furthermore, when the result determines that the position correction is inappropriate, the position correction of the package area may be performed again.

After the electronic part positioning step and the package area position correction step are completed, as shown in FIG. 5, the semiconductor chip t held on the packaging tool 41 and the package area of the substrate K are imaged by the upper and lower camera 51 (Camera steps). That is, at the packaging position C, the semiconductor wafer t and the packaging area are arranged in a positional relationship that is vertically separated. The upper and lower camera 51 enters between the semiconductor wafer t and the package area, and the upper side camera 51a images the semiconductor wafer t, and the lower side camera 51b images the package area. When the semiconductor chip t and the package area are imaged by the upper and lower camera 51, the control unit 60 recognizes both based on the captured image data of the semiconductor chip t and the package area image-processed by the image processing unit 53 Relative positional relationship (position recognition step). Furthermore, the up and down camera 51 that has completed imaging moves to the retreat position as shown in FIG. 6.

Thereafter, the control unit 60 controls the tool drive unit 42 to package the semiconductor wafer t held on the packaging tool 41 in the packaging area. At this time, when a deviation occurs in the relative positional relationship between the semiconductor wafer t and the package region, the tool drive unit 42 is operated to eliminate the position deviation, and then the package is carried out (package step).

The above operations are repeated for all the package areas on the substrate K. When the packaging of the semiconductor wafer t for all the packaging areas on the substrate K is completed, the substrate K that has been packaged is removed from the mounting table 21 by a substrate transfer device (not shown), and a new substrate K is supplied. In addition, when all the semiconductor wafers t on the wafer ring 11 are picked up, the wafer ring 11 is replaced with a new wafer ring 11. This action only repeats the necessary production volume, such as a batch.

[Functions and effects] According to the packaging device 1 of this embodiment, before the imaging of the semiconductor chip t and the package area positioned at the packaging position C by the upper and lower camera 51, the lower camera 51b of the upper and lower camera 51 The packaging area positioned at the packaging position C is imaged, and the positional deviation of the packaging area relative to the packaging position C is obtained from the image data. In the case of a positional deviation, the load is controlled in a manner to eliminate the positional deviation. The stage driving unit 22 corrects the position of the packaging area.

Therefore, when the package area of the semiconductor wafer t and the substrate K positioned at the package position C is simultaneously imaged by the upper and lower camera 51, since the package area is positioned at the package position C with high accuracy, the semiconductor When the relative positional deviation between the wafer t and the package area is corrected, the amount of movement of the packaging tool 41 is limited to a small amount, or the amount of movement is eliminated, and the semiconductor wafer t can be packaged in the package area with high packaging accuracy.

That is, the packaging tool 41 repeatedly moves between the delivery position B and the packaging position C, so the repeating movement accuracy toward the packaging position C is very high. However, if the positioning accuracy of the package area with respect to the package position C is low, and the relative positional deviation between the package area and the semiconductor wafer t is large, the correction movement amount of the package tool 41 in the XY direction required for the correction of the positional deviation becomes Big. In this case, the tool drive unit 42 changes the state of the Z-axis tilt caused by pitching, panning, rolling, etc. of the XY moving axis, which hinders the improvement of packaging accuracy. In the present embodiment, as described above, the position of the package area is corrected with respect to the package position C before the semiconductor wafer t and the package area positioned at the package position C are imaged by the vertical camera 51. Therefore, the relative positional deviation of the packaging area from the semiconductor wafer t is suppressed, and thereby the amount of correction movement of the packaging tool 41 in the XY direction can be reduced as much as possible, so that the change in the state of the Z-axis tilt of the packaging tool 41 can be suppressed as much as possible . As a result, the posture of the packaging tool 41 or the trajectory of the lowering movement when the packaging tool 41 is lowered toward the packaging area can be kept substantially constant every time, thereby improving the packaging accuracy. This makes it possible to cope with the manufacturing process of semiconductor packages such as high-frequency memory using TSV's three-dimensional high-integration technology that requires higher packaging accuracy than semiconductor packages such as QFP or BGA.

In addition, during the period from when the packaging tool 41 receives the supply of the semiconductor wafer t from the supply section 10 until it moves toward the packaging position C, the position correction step of the packaging area of the substrate K positioned at the packaging position C, that is, positioning with the electronic component is performed The step simultaneously executes the position correction step of the package area of the substrate K positioned on the package position C. Therefore, there is no need to ensure a separate time for the new step of the position correction step of the packaging area, the time required for packaging one semiconductor wafer t on the substrate K can be prevented from increasing, and the productivity can be prevented from being lowered.

In addition, using the up and down camera 51 that simultaneously images the semiconductor wafer t and the package area of the substrate K positioned at the package position C up and down, the package area of the substrate K when performing the position correction step of the package area is performed Camera. Therefore, there is no need to separately provide an imaging device such as a camera for a new step of the position correction step of the packaging area, and the configuration of the packaging device 1 can be avoided from being complicated.

(Other Embodiments) Furthermore, the present invention is not limited to the above embodiments. For example, in the above embodiment, the upper and lower imaging cameras 51 in the imaging unit 50 are provided with an upper camera 51a that images the semiconductor wafer t (electronic component) and a lower camera 51b that images the package area of the substrate K The example is not limited to this. For example, a single camera may be used to simultaneously image the electronic components located on the upper side and the package area of the substrate K located on the lower side. Specifically, it may be arranged on the optical axis of the horizontally arranged camera with the horizontal line perpendicular to the optical axis as the boundary, and the upper half is set at an angle of 45° in a direction away from the camera The reflecting surface inclined upwards, the lower half is set as the reflecting surface inclined downward at an angle of 45° in the direction away from the camera, and the electronic parts are taken in the upper half in the imaging field of view of the camera The image of the package area is taken in the lower part. In addition, when the package area of the substrate K is imaged during the position correction step of the package area, it is sufficient to use only the lower half of the imaging field of view of the camera. Even if the imaging unit 50 is provided in this manner, the same operational effects as in the above-described embodiment can be obtained.

In addition, an imaging camera for imaging the semiconductor wafer t (electronic component), an imaging camera for imaging the package area of the substrate K, and an image of the packaging area of the substrate K in the position correction step of the package area may be separately provided. Video camera.

In addition, the position correction step of the package area of the substrate K is set to be the same as the electronic part positioning step during the period from when the package tool 41 receives the supply of the semiconductor wafer t (electronic component) from the supply part 10 to the package position C Examples of implementation. However, it is not limited to this, and the step of correcting the position of the package area of the substrate K may be performed before imaging the semiconductor wafer t and the package area positioned at the package position C by the upper and lower camera 51. Therefore, it may be parallel to the pick-up step in which the transfer unit 30 picks up the semiconductor wafer t from the supply unit 10. That is, it may be performed simultaneously with the electronic component positioning step during the period from when the transfer unit 30 picks up the semiconductor wafer t from the supply unit 10 until the packaging tool 41 moves toward the packaging position C.

In addition, in the above embodiment, the package position may always be set to a fixed position regardless of the type of semiconductor wafer t or substrate K as an electronic component, or may correspond to the type of semiconductor wafer t or substrate K, For example, the size and other changes are switched. In short, it suffices to be maintained at a fixed position during the period from the start of the packaging of the necessary production volume (for example, a batch) of the semiconductor wafer t of the type to be packaged to the completion of packaging.

The embodiments of the present invention have been described above, but these embodiments are not intended to limit the scope of the invention. The new embodiment can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments or modifications are included in the scope or gist of the invention, and included in the invention described in the scope of the patent application.

1‧‧‧Packaging device 10‧‧‧Supply section 11‧‧‧ Wafer ring 12‧‧‧Wafer table 13‧‧‧Wafer table drive section 20‧‧‧Substrate platform 21‧‧‧Placement table 22‧‧ ‧Mounting table drive unit 30‧‧‧Transfer unit 31‧‧‧Suction nozzle 31a‧‧‧Rotating shaft 32‧‧‧Lift/reverse drive unit 40‧‧‧Packing unit 41‧‧‧Packing tool 42‧‧‧Tool Drive unit 50‧‧‧Camera unit 51‧‧‧Up and down camera 51a‧‧‧Upper camera 51b‧‧‧Lower camera 51c‧‧‧Light path conversion unit 51d‧‧‧Frame 52‧‧‧Advance and retreat drive unit 53‧ ‧‧Image processing part 60‧‧‧Control part 61‧‧‧Memory part A‧‧‧Pickup position B‧‧‧Handover position C‧‧‧Package position K‧‧‧Substrate t‧‧‧Semiconductor chip W‧‧‧ Semiconductor wafer X, Y, Z, θ‧‧‧ direction

FIG. 1 is a front view showing a schematic configuration of an electronic component packaging device of an embodiment. 2 is a block diagram of an electronic component packaging device according to an embodiment. 3 is a front view showing the operation of the electronic component packaging device. 4 is a front view showing the operation of the electronic component packaging device. FIG. 5 is a front view showing the operation of the electronic component packaging device. 6 is a front view showing the operation of the electronic component packaging device.

1‧‧‧Packaging device

10‧‧‧Supply Department

11‧‧‧ Wafer ring

12‧‧‧wafer table

20‧‧‧Substrate platform

21‧‧‧Placing table

22‧‧‧Mounting table drive unit

31‧‧‧Adsorption nozzle

40‧‧‧Packaging Department

41‧‧‧Packaging tool

42‧‧‧Tool Drive Department

50‧‧‧Camera Department

51‧‧‧Up and down camera

51a‧‧‧Upper camera

51b‧‧‧Lower camera

52‧‧‧Advance and retreat drive

A‧‧‧ Picking position

B‧‧‧ Transfer location

C‧‧‧Packing location

K‧‧‧Substrate

t‧‧‧Semiconductor chip

W‧‧‧Semiconductor wafer

X, Y, Z, θ‧‧‧ direction

Claims (5)

An electronic component packaging device, which is an electronic component packaging device for packaging electronic components in a plurality of packaging regions on a substrate, is characterized by comprising: a supply section for supplying the electronic component; a substrate platform provided with a mounting A mounting table of the substrate and a mounting table driving section that moves the mounting table, by the driving of the mounting table driving section, a plurality of the package regions of the substrate mounted on the mounting table It is sequentially positioned at a pre-set packaging position; the packaging section includes a packaging tool that holds the electronic component supplied from the supply section and a tool drive section that moves the packaging tool, and packages the electronic component at a positioning position In the packaging area at the packaging position; the camera section, at the packaging position, encapsulates the electronic component held on the packaging tool and the substrate placed on the mounting table Imaging of the area; and the control portion, based on the captured image obtained by the imaging portion, identifying the relative positional relationship between the electronic component and the packaging area, and controlling the tool driving portion, the electronic component and all The packaging area is relatively positioned so that the electronic component is packaged in the packaging area; and the control section performs the electronic component and the packaging area at the packaging position by the camera section Before imaging, the imaging unit controls the imaging of the packaging area positioned at the packaging position, and the positional deviation of the packaging area relative to the packaging position is obtained from the captured image and the eliminate The control of driving the mounting table drive unit so that the determined position is shifted is performed during the period from when the packaging tool receives the supply of the electronic component from the supply unit until it moves toward the packaging position. The electronic component packaging device according to item 1 of the patent application scope, wherein the imaging unit includes the electronic component positioned at the packaging position and the substrate positioned at the packaging position. Between the packaging areas, an up and down camera camera capable of capturing images of the electronic component and the packaging area simultaneously, and the control unit is performed by the up and down camera in The imaging of the packaging area positioned at the packaging position before the imaging of the electronic component and the packaging area at the packaging position. The electronic device packaging device according to item 2 of the patent application scope, wherein the top and bottom camera includes an upper camera for imaging the electronic component and a lower camera for imaging the packaging area, and faces the camera The optical axis of the upper camera of the electronic component is arranged coaxially with the optical axis of the lower camera facing the package area. An electronic part packaging method, which is an electronic part packaging method for packaging electronic parts in a plurality of packaging regions on a substrate, is characterized by comprising: a packaging region positioning step, which is placed on the mounting table A predetermined packaging area of the plurality of packaging areas of the substrate is positioned at a pre-set packaging position; an electronic component positioning step, using a packaging tool to hold the electronic component supplied from the supply section, and store the held electronic component Parts are positioned at the packaging position; An imaging step, imaging the packaging area and the electronic component positioned at the packaging position; and an packaging step, the packaging area is opposed to the electronic component according to the camera image obtained in the imaging step Positioning, and encapsulating the electronic parts in the packaging area; and including the position correction step of the packaging area, the position correction step of the packaging area before performing the imaging step, the positioning by the packaging area Steps, the packaging area positioned at the packaging position is imaged, the positional deviation of the packaging area relative to the packaging position is obtained from the camera image, and corrected to eliminate the calculated positional deviation The location of the packaging area. The method for packaging electronic parts as described in item 4 of the patent application range, wherein the step of correcting the position of the packaging area and the step of positioning the electronic parts are performed simultaneously.

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