JP2010135574A - Transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a means for transferring chips accurately to a transfer destination by providing a control means that adjusts heads for chucking chips from a substrate wherein the chips to be transferred are placed and transferring them to a transfer destination, with first, second and third cameras for their mutual positions in a transfer apparatus. <P>SOLUTION: The movement of a head 21 is imaged without stopping when a chip 16 is transferred from the transfer source 14 to the transfer destination 15, and the position of the chip is corrected while the head is moved, thereby permitting more accurate transfer work and shortening a tact time. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention transfers a transferred object such as a chip, glass, or seal from a transfer source to a transfer destination during an operation such as a packaging method of an IC chip called CSP (chip scale package), embossed tape, BGA, or QFM. The present invention relates to a transfer device to be placed.

In general, in the manufacturing process of a semiconductor wafer or the like, the back surface of the semiconductor wafer is attached to an adhesive sheet (dizing sheet) and then divided into chips by a dicing saw. Next, each divided chip is supplied to a die bonding apparatus, and each chip is die bonded to a lead frame, a package base, or the like.

  However, the parts divided into chips by the dicing saw are packaged and transported and supplied to the die bonding apparatus so as not to get dust and dirt. Therefore, packaging work for each chip is required.

Also, in recent years, the number of chips per rod may be small due to the trend of small quantity and variety of semiconductor devices. On the other hand, the size of the semiconductor wafer is increasing, so the total number of chips on one semiconductor wafer is increased. is doing.
In such a case, the required number of semiconductor devices to be produced per rod may be smaller than the total number of chips obtained from one semiconductor wafer.
In such a case, the remaining chips other than putting all the semiconductor wafers into the production line are stored in a package, and when there is a new order, they are put into the production line again.

Further, a diced product such as a wafer may be peeled off from the wafer ring and picked up and stored in a tray or the like.
Further, the product is picked up from the tray and taped on the embossed tape.
There is also a transfer operation in which a sticker or glass is sucked and held, transferred from the transfer source to the transfer destination, and attached to the product stored in the tray.

  Generally, a conventional transfer machine is configured as shown in FIG. This conventional example is disclosed in Japanese Patent Application Laid-Open No. 2004-56041. The wafer ring 92 stored in the ring magazine 94 is pulled out directly below the head 91 by the X-axis moving means 96.

The chips on the adhesive sheet of the wafer ring 92 are sucked and held by the head 91 and transferred to the other tray 93. When this operation is repeated and the tray 93 is filled with chips, the tray 93 is accommodated in the tray magazine 95 by the Y-axis moving means 97. The transfer operation is performed by the apparatus as described above.

JP2004-56041

In the conventional apparatus shown in FIG. 5, the wafer ring 92 pulled out from the ring magazine 94 is mounted in a state where the adhesive sheet with the wafer attached is stretched in the outer peripheral direction so that the head 91 can be easily peeled off when being sucked and held. ing.
At that time, the chip has moved slightly, and there has been a problem that the head 91 cannot accurately adsorb the center portion with coordinates calculated by assuming absolute values. In other words, the chip is not necessarily in the predetermined position, but it is executed by being controlled by the control unit on the assumption that the chip is in the predetermined position without confirmation.

Also, when peeling the chip from the adhesive sheet, it is configured to push up the chip adsorbed by the push-up part from the back side of the adhesive sheet and easily peel off with the adsorption force of the head 91. Since the position is changed due to slight movement, the center of the chip cannot be pushed up from the back surface with the assumed absolute coordinates, which may cause problems such as a suction error or breakage of the chip.

Also, the head 91 may be sucked and held by the head 91 while it is twisted and rotated at the moment when the chip sucked and held on the wafer is picked up, and the sucked and held chip rotates in the θ direction in FIG. Otherwise, the tray 93 could not be placed at the specified position.

Furthermore, chips in recent years have become smaller, and the designated position of the tray 93 may be accurate and must be placed at the designated position within an error of about 0.1 mm or more.

  In addition, it was necessary to shorten the tact time (production speed per product) by shortening the transfer work time of one chip as much as possible to improve efficiency, and to transfer a large amount in a short time.

The conventional transfer machine sucks and holds the chip on the wafer ring 92 of the assumed coordinate axis by the head 91 and transports it to the tray 93 on the assumption that it is sucked and held in the center without error, and the tray 93 of the assumed coordinate axis. However, since the chip was downsized and no error was allowed, an apparatus capable of more precise and faster transfer was required.

  Therefore, a head provided with a rotation mechanism for attracting and holding the chip placed on the substrate on which a plurality of transfer source chips are arranged and placed and transferring the chip to the transfer destination placement plate is provided. A transfer device having a first camera that images the chip of the transfer source, a second camera that images the head holding the chip, and a transfer position of the transfer destination A third camera that captures an image; and a control unit that adjusts the positions of the transfer source, the transfer destination, the head, the substrate, and the mounting plate, and the control unit includes the first camera By analyzing the captured image of one camera, adjusting the position of the substrate so that the head is sucked and held at the center of the chip, and analyzing the captured images of the second camera and the third camera Adjusting the position of the tip and the mounting plate There is provided a transfer device for.

In the transfer device, the control unit rotates the head by the rotation mechanism so that the chip sucked and held by the head is aligned with a reference position by an image captured by the second camera. And the control means adjusts the mounting position on the mounting plate according to the image captured by the third camera, and the substrate is other than the vertical direction of the head. A transfer apparatus comprising a position adjustment means in a direction perpendicular to the transfer direction of the head, wherein the mounting plate is positioned in a direction perpendicular to the transfer direction other than the vertical direction of the head. It is the transfer apparatus characterized by providing a means.
Furthermore, X-axis direction moving means for moving the head from the substrate to the mounting plate, and shutter speed changing means for changing the shutter speed at the time of imaging of the second camera based on the moving speed of the head. A transfer device characterized by the above is provided.

  The invention according to the present application is a first camera 11 that images the transferred object (chip 16) of the transfer destination 14 and a second camera 12 that images the head 21 that holds and transfers the chip 16; A third camera for imaging the mounting position of the chip 16 of the transfer destination 15 is provided.

Then, the first camera 11 recognizes an image of the position of the chip 16 attached to the transfer source 14, and recognizes the chip 16 so that the sucking head 21 sucks at the center of the chip 16, and controls the position. .
Further, the XY table 31 of the transfer source 14 can be adjusted so that the chip 16 of the wafer ring 161 pushes up the chip 16 (not shown) at the same position as the head 21.

With the configuration as described above, even if the tip 16 is finely moved due to the stretching operation of the adhesive seal 162 and the position thereof is slightly changed, the center portion of the tip 16 can be accurately pushed up, and the tip 16 can be pushed in one side. Can prevent damage.
Further, since the head also accurately sucks and holds the central portion of the chip 16, it does not fall and the transfer speed can be made faster than before.

Even if the head 21 accurately captures the center of the chip 16 by the method as described above, when the head 21 is lifted by suction, a part of the head 16 is not peeled off from the adhesive seal 162 and the chip 16 is twisted, or a part of the adhesive seal 162 is It may be difficult to peel off and the suction position may change slightly.
As a result, the chip 16 may be attracted and held at an angle shifted from the head 21.

However, the head 21 that sucks and holds the chip 16 by the imaging of the second camera of the present application is imaged from below while moving from the movement source 14 to the movement destination 15, and the deviation in the XYθ axis direction with respect to the center of the head 21 is small. Can be adjusted.

As a result, it is possible to confirm how the chip 16 is attracted to the head 21 and to correct the position before the chip arrives at the transfer destination 15 and is mounted.

Further, the third camera 13 captures the state of the transfer destination 15 so that the position of the transfer destination 15 can be confirmed, and the transfer destination table 32 so that there is no error in the position of the tray 17 of the transfer destination 15. It is now possible to transfer to an accurate position by fine-tuning.

In addition, the head 21 that sucks and holds the chip 16 when passing the upper part of the second camera 12 does not stop at the upper part of the second camera 12, and the shutter operates in synchronism with the upper part of the second camera 12, and is imaged. Therefore, since the head 21 does not stop at the upper part of the second camera 12, the tact time (production speed per product) can be shortened and the work efficiency can be improved, and the load applied to the motor 43 can be reduced to prevent wear. be able to.

Further, with respect to the correction operation for fine adjustment of the XYθ axis, correction of the transfer destination 15 and the head 21 XYθ axis can be completed while the head 21 is moving in the X direction, and the tact time can be further shortened. Is.

In the present invention, the first camera 11 that images the transfer source 14 and the second camera 12 that images the head 21 on the way to the transfer destination 15 by sucking and holding the chip 16 from below, and the transfer destination 15 Even if the transfer source 14 and the transfer destination 15 are finely moved by providing the third camera 13 for imaging the state of the above, even if accuracy is required by the recent manufacture of the microchip 16 The object to be transferred can be corrected in the XYθ axis direction.
These operations enable the XYθ axis correction operation to be completed while the head 21 is being moved by the X axis moving means. It is configured to shorten the time and increase the working efficiency.

FIG. 1 is a schematic diagram showing the operation of the head 21 from the transfer source 14 to the transfer destination 15.
FIG. 2 shows a state where the head 21 is above the transfer source 15 and holds the chip 16 by suction.
FIG. 3 is a diagram showing a state in which the head 21 is picked up by passing through the upper part of the second camera 12 by the X-axis moving means 42.
FIG. 4 is a diagram showing a normal state where the movement of the head 21 by the X-axis moving means 42 is completed and the head 21 is stopped on the tray 17 of the transfer destination 15 and the chip 16 is placed.
FIG. 5 shows a conventional apparatus for transferring chips from the wafer ring 92 to the tray 93.

Examples of the present invention will be described below. As shown in FIG. 2, the chip 16 attached to the adhesive seal 162 of the wafer ring 161 is placed on the wafer ring case 18 (the transfer source substrate described in the claims) placed on the transfer source table 31. It is stored and set in the main body 1.

Wafer ring case 18 is fixed to transfer source table 31. The wafer ring case 18 can be moved in the X direction by the transfer source X table 34 and can be moved in the Y direction by the transfer source Y table 33.
The transfer source X table 34 and the transfer source Y table 33 are configured such that the bearing portions that are screwed to the screw shafts rotated by the motors installed on the respective tables move.

  In addition, the first camera 11 is installed immediately above the wafer ring case 18, and the position of the transfer source table 31 is adjusted based on the image of the first camera 11, so that the chip 16 is attracted by the head 21. It has become.

  Further, although not shown on the back side of the wafer ring case 18, a push-up portion pushes up only one chip 16 just below the chip 16 to be sucked (true back side) so that the chip 16 is easily peeled off. That is, a push-up part is provided on the back side of the chip 16 to which the head 21 is sucked directly under the first camera 11, and the push-up work is performed in synchronization with the work for the head 21 to suck the chip 16, so that the chip 16 is It is configured so that it can be easily peeled off and held on the head 21 by suction.

  The chip 16 transferred by such a configuration of the transfer source table 31 is image-recognized so that it is always directly under the first camera 11, and the center of the chip 16 to be accurately transferred, the push-up portion, and the head 21 Control is performed by the control unit 2 so that the centers are arranged in a straight line.

At this time, the control unit 2 performs image recognition work. In other words, the reference image captured in advance and stored in the control unit 2 is compared with the current image captured each time to calculate an error in the XY directions and cause the operation unit such as each table to perform a position correction operation. . Such image recognition work is performed by all the first to third cameras.

The transfer destination 15 will be described with reference to FIGS. The table 351 (the transfer destination mounting plate described in the claims) placed on the transfer destination Y table 35 moves in the Y direction by being engaged with the screw shaft 353 rotated by the motor 352. It is configured as follows.
A tray 17 is fixed on the table 351. The tray 17 is formed with a recess corresponding to the chip 16, and the operation of filling the chip 16 carried by the head 21 into the recess of the tray 17 is repeated.

  The movement of the tray 17 in the Y direction is performed by the transfer destination Y table 35, but the movement in the X direction is adjusted by the X axis moving means 42 of the head 21. As for confirmation of the predetermined position at that time, the image is taken when the third camera 13 fixed next to the head 21 passes over the tray 17, and the control unit 2 is arranged so that a recess to be inserted immediately below the head 21 comes. Then, the image recognition operation is performed, and the position correction operation is performed using the head 21 in the X direction and the transfer destination Y table 35 in the Y direction.

The motors used in various parts of the apparatus of the present invention are all pulse motors or servo motors. In the case of servo motors, a rotary encoder is built in. The motor is configured to be able to determine how much the motor has rotated in which direction by generating a rotation pulse in accordance with the number of rotations and the rotation angle and measuring and calculating the rotation pulse by the control unit 2. Therefore, the screw shaft 353 is rotated by the motor 352 (servo motor) and the base 351 fixed to the bearing portion screwed together is moved in the Y direction. The position of the base 351 is determined by calculating the rotation of the motor 352 if the screw pitch of the screw shaft 353 and the bearing portion fixed to the base 351 is screwed is known. Thus, the position of the tray 17 can be determined. The position of the part that operates in the above manner is recognized and controlled by the control unit 2.
The motor 421 of the X-axis moving means 42 and the motor used for the transfer source table 31 are similarly controlled.

  Next, the head unit 20 will be described. A hole is formed in the center of the tip of the head 21 and connected to a vacuum pump so that the chip 16 can be sucked and held. The head 21 is attached to the tip of the shaft 22. The shaft 22 is configured such that a bearing 232 moves up and down by a screw shaft 231 that is rotated by driving of a Z-axis motor 23.

Further, as the θ-axis motor 24 rotates, the shaft 22 connected by a gear or a timing belt also rotates. Similarly, the head 21 fixed to the shaft 22 rotates about the θ axis. With such a configuration, the chip 16 attracted and held by the head 21 can also rotate in the θ direction.

  The head unit 20 is fixed to a head base 24, and the third camera 13 is also fixed to the head base 24. The focal point of the third camera 13 is provided on the same straight line as the center of the head 21 in the X direction. As a result, when moving in the X-axis direction, the head 21 passes through the position captured by the third camera 13.

  The head unit 20 is fixed to the head base 24 and the head base 24 is fixed to the bearing 423. The bearing 423 is screwed to the screw shaft 422, and the head unit 20 moves in the X-axis direction when the motor 421 is driven. The X axis moving means 42 is configured as described above.

  Next, the first camera 11 will be described. The first camera 11 is always fixed to the upper part of the transfer source 14. The position where the chip 16 is taken out is image-recognized, and the controller 2 is controlled to operate the transfer source table 31 so that the center of the chip 16 is directly below the first camera 11.

As described above, the adhesive seal 162 to which the chip 16 is attached is attached by being pulled and stretched outward so that the chip 16 can be easily peeled off. Yes. Accordingly, the chip 16 is not always located at the calculated position. Therefore, if the transfer table 31 is corrected so that the image of the chip 16 captured by the first camera 11 is the same as the reference image captured in advance and stored in the control unit 2, the center of the chip 16 is moved to the head. 21 can be sucked and the push-up part pushes up at the same position in synchronism, so that the chip 16 is sucked and held at an accurate position without being damaged.
That is, the image of the first camera 11 is analyzed, the transfer source table 31 is corrected, and the center portion of the chip 16 can be brought directly above the push-up portion.

  Next, the second camera 12 will be described as shown in FIG. The chip 16 is sucked and held by the head 21 and passed through the upper part of the second camera 12 without stopping to take an image. This configuration is generated by the motor 421 when the head 21 fixed to the bearing 423 moved by the rotation of the screw shaft 422 passes the upper part of the second camera 12 by driving the motor 421 of the X-axis moving means 42. The illumination built in the second camera 12 tuned by the position information by the pulse is emitted to take an image.

  The control unit 2 calculates how much the displacement is in the XYθ direction compared to a reference image captured in advance. Since the chip 16 adsorbed to the head 21 is imaged without stopping, a blurred image is captured, but the shutter speed at the time of imaging is a high shutter speed so that the blur is within the error of the movement destination. As described above, the moving speed, illumination, and shutter speed are adjusted.

  In reality, the head 21 that has adsorbed the chip 16 is imaged so that it can be determined in which direction and how much the chip is blurred even if it passes over the second camera 12 at a high speed of 1500 mm / sec. For example, when passing at a speed of 1500 mm / sec, a shatter speed of about 1/10000 second is adopted. If this is a speed of about 500 mm / sec, an image is taken at a shutter speed of about 1/1000 to 1/2000.

  Next, the third camera will be described. Even when the chips 16 are stored in the tray 17 at the transfer destination 15, the positions to be arranged are not always constant. Even in Tray 17, the pocket position moves slightly, and the pocket system may change.

Therefore, when the third camera 13 attached to the side portion of the head 21 passes over a predetermined pocket of the tray 17, the pocket position of the tray 17 is imaged, and the Y direction correction operation of the Y table of the transfer destination 15 and the head Perform 21 X-direction correction operations to correct the transfer destination to the correct position.
Further, at the time of imaging, the third camera 13 is also imaged without stopping similarly to the second camera 12, but the blurring at the time of imaging is adjusted and adjusted so as to be within the error of the destination 15.

  Next, the X axis moving means of the head 21 will be described. The chip 16 placed at the position corrected by the first camera 11 at the transfer source 14 is sucked and held by the bed 21, and the Z-axis motor 23 is driven to raise the head 21. If nothing interferes with the head 21 at this time, the motor 421 is driven to move the head 21 in the X direction while raising the head 21 to a certain height as shown in FIG.

When the head 21 passes through the upper part of the second camera 12, the head 21 passes at a predetermined height and speed, and the chip 16 sucked and held by the head 21 is imaged.
The control unit 2 compares the imaging of the second camera 12 with the reference image to calculate the correction operation in the XYθ direction, and before the head completes the movement in the X direction on the transfer destination 15, the correction operation in the XYθ direction The chip 16 is corrected so as to be in the same state as the reference image.

  In addition, the third camera 13 is imaged when it passes over the designated pocket of the transfer destination 15, and compared with the reference image, the motor 352 is driven to correct the tray 17 in the Y direction and the motor 421 The head 21 is driven to stop at a predetermined pocket position of the tray 17. Thereafter, the Z-axis motor is driven to lower the head 21, and the chip 16 is placed in a designated pocket.

  In the present embodiment, the third camera 13 is attached to the head unit 20 and moved. However, as with the first camera 11, the third camera 13 is fixed to the main body 1 and imaged from above the transfer destination 15. Also good. However, in that case, the table of the transfer destination 15 must be moved in the XY directions in the same manner as the transfer source table 31 so that the designated pocket of the tray 17 is always directly below the third camera 13.

The operation of the transfer apparatus configured as described above will be described.
In the transfer source 14, the operation of attaching the wafer ring 161 to the wafer ring case 18 is carried out manually or by an automatic feeding mechanism from an upstream process.
Similarly, the operation of installing the tray 17 on the table 351 of the transfer destination 15 is also performed manually or by automatic feeding from the upstream side.

Next, the chip 16 designated by the first camera 11 is imaged. Since the first camera 11 is fixed, the first camera 11 is configured to check whether there is a chip scheduled to be transferred immediately below. At this time, if the reference image is different from the reference image stored in advance, the transfer source table 31 is finely moved in the XY directions to perform the correction operation so as to be the same as the reference image. Of course, if it is calculated that it does not coincide with the reference image even if the correction operation is performed by the transfer source table 31, an error occurs, and the operation is stopped, and the means for selecting the next chip 16 is taken.
By such a correction operation, the chip 16 scheduled to be transferred directly under the first camera 11 is accurately arranged.

When the position of the chip 16 is determined, a push-up portion is set on the back side of the position, and the head 21 is controlled so as to descend directly above it. When the push-up portion, the tip 16, the head 21, and the first camera 11 are aligned on a straight line in the Z direction, the head 21 descends and comes into contact with the tip 16, and suction is performed from the center of the head 21 so that the tip 16 is moved to the head 21. Adsorb and hold.

Thereafter, the head 21 raises the tip 16 while the head 21 and the push-up portion are synchronized, and the needle-like push-up portion pushes up from the back surface via the adhesive seal 162 so that the tip 16 can be easily peeled off.

Thereafter, the head 21 moves up directly and drives the motor 421 at a position where it does not interfere with the wafer ring case 18 and the like, and moves the head unit 20 toward the transfer destination 15 in the X direction.
When the head 21 passes through the upper part of the second camera 12, it passes through a certain height at a preset constant speed.

When the head 21 passes over the second camera 12, the pulse generated by the motor 421 synchronizes with the time when the head 21 comes directly above the second camera 12, and the illumination of the second camera emits light to capture the image. Then, the image is captured. The captured image is compared with a reference image in a calculation unit in the control unit to create correction data.

Even after passing through the second camera 12, the motor 421 is driven as it is, and the head 21 moves to the transfer destination 15 along the X direction without stopping. During this movement, the θ-axis motor 24 is driven to perform correction in the θ direction.
Further, the correction in the XY directions by the head 21 is also performed, and the stop position is corrected by the correction data so that the chip 16 is the same as when the chip 16 is sucked and held at the reference position.
In this way, the second camera 12 captures an image in synchronism with the motor 421 without stopping the head unit 20, analyzes the image, and the posture of the chip 16 while the head unit 20 is transporting (X, Y, θ direction) The operation of performing the position correction by the above without reducing the moving speed is called fly recognition.

Actually, the chip 16 is sucked and held by the head 21 and passed over the second camera 12 at a high speed of 1500 mm / sec, and the positional relationship of the chip 16 is instantaneously calculated. Correct the position of each motor so that it is in the correct position. This achieves a positional accuracy of plus or minus 0.03mm. The chip 16 adsorbed to the head 21 by the imaging of the second camera 12 as described above is corrected so as to be in a normal position.

Next, when the head 21 moves in the X direction and the third camera 13 passes above the tray 17, the designated pocket of the transfer destination tray 17 is imaged and compared with the reference image. If there is an error between the captured image and the reference image, the transfer destination table 32 performs fine adjustment in the Y direction. At the same time, fine adjustment of the stop position of the head 21 in the X direction is performed, and the head 21 is corrected by the control unit 2 so as to be accurately disposed at the designated position of the transfer destination 15.

The placement position of the transfer destination 15 is not always constant, and even with the tray 17, the pocket position moves slightly and the pocket accuracy also changes. The same applies to embossed tapes and the like that are pitch fed. Therefore, the third camera 13 captures and recognizes the placement position of the transfer destination 15 with the third camera 13, and ensures higher positioning accuracy by combining with the correction data of the second camera 12, and the tray. The mounting accuracy that is not affected by the accuracy of 17 is achieved.

Thereafter, by driving the motor 23, the head descends and the chip 16 is embedded in the designated pocket of the tray 17, and then the suction holding air is cut and the chip 16 is released.
Next, the head 21 with the chip 16 released moves from the transfer destination 15 to the transfer source 14 while ascending so as not to interfere with the tray 17.

During this time, the transfer source table 31 is corrected based on the imaging of the first camera 11, and the correction of the transfer source table 31 is completed so that the chip 16 to which the head 21 is attracted is positioned directly below the first camera 11. ing.

Then, when the head 21 descends and comes into contact with the chip 16, suction of the chip 16 is started and one process is completed. Such a cycle is repeated until the tray 17 is full.

As described above, according to the present invention, since the image captured by the first camera 11 is analyzed and the head unit 20 is controlled to be sucked and held at the center of the chip 16, the chip is reliably sucked and held in cooperation with the push-up unit. it can.
Further, the tact time can be greatly shortened by the correction operation by the captured image analysis of the second camera 12 and the third camera 13 by fly recognition, and the working efficiency can be greatly increased.

As described above, the present invention relates to a transfer device for performing product transfer work with high accuracy in the process of manufacturing electronic components such as semiconductor packages (CSP, BGA, QFN, etc.), glass, and substrates. It is.

Next, the process of peeling chips from semiconductors and electronic components, etc. that have been attached to the adhesive sheet, transferring them to a tray or embossed tape, and storing them, and the products supplied in the tray In order to transfer products with high accuracy, such as refilling the carrier used in the process, etc., in the process of manufacturing electronic substrates, picking up products from rings and trays and mounting the products on the substrate, etc. This is a mechanism for recognizing and controlling the posture of the product, the position of the transfer destination, the posture of the product at the transfer source, and the like.

Conventionally, the product is picked up and transported to a predetermined position of the transfer destination 15 simply by recognizing the transfer source 14 with the first camera 11. Actually, it was not possible to recognize how the product was adsorbed by the pickup.
For this reason, even if the posture at the time of suction is shifted, it is conveyed to the transfer destination 15 as it is. A mechanism that can convey the product to the transfer destination 15 with high accuracy by recognizing the posture of the product with the second camera camera 12 and correcting it to the correct posture is provided.

Furthermore, a first camera 11 and a third camera 13 for recognizing the positions of the transfer source 14 and the transfer destination 15 are added, and a second camera 12 for imaging for a product posture recognition camera (fly) By providing this data, we provide a device and mechanism that realizes higher transfer accuracy, enabling various parts to be transferred.

The present invention can be applied not only to a chip transfer apparatus but also to an inspection apparatus for all small parts. In addition to transferring from the wafer ring to the tray, it is also possible to change the chip transfer from the tray to the embossed tape, from the wafer ring to the embossed tape, and from the tray to the tray.

FIG. 6 is a schematic diagram showing the operation of the head 21 from the transfer source 14 to the transfer destination 15. A state in which the head 21 is above the transfer source 15 and sucks and holds the chip 16 is shown. 6 is a diagram showing a state in which the head 21 is picked up by passing through the upper part of the second camera 12 by the X-axis moving means 42. FIG. FIG. 5 is a diagram showing a normal state in which the movement of the head 21 by the X-axis moving means 42 is completed and the head 21 is stopped on the tray 17 of the transfer destination 15 and the chip 16 is placed. 1 shows a conventional apparatus for transferring chips from a wafer ring 92 to a tray 93.

Explanation of symbols

1
Body
2
Control unit
11
First camera
12
Second camera
13
Third camera
14
Transfer source
15
Transfer destination
16
Chip
161 Wafer ring
17
tray
18
Wafer ring case
20 Head
21 heads
23 Z-axis motor
231 Screw shaft
232 bearings
31 Transfer source table
32 Transfer destination table
33 Transfer source Y table
34 Source X table
35 Transfer destination table
351 units
352 motor
353 Screw shaft
42 X axis moving means
421 motor
422 Screw shaft
423 bearings
91 head (conventional example)
92 Wafer ring (conventional example)
93 Tray (conventional example)
94 Ring magazine (conventional example)
95 Tray magazine (conventional example)
96 X-axis moving means (conventional example)
97 Y-axis moving means (conventional example)

Claims (6)

A transfer having a head having a rotation mechanism for sucking and holding a chip mounted on a substrate on which a plurality of transfer source chips are arranged and mounted and transferring the chip to a transfer destination mounting plate. Mounting device,
A first camera that images the chip of the transfer source;
A second camera for imaging the head holding the chip by suction;
A third camera for imaging the transfer position of the transfer destination;
A control means for adjusting the positions of the transfer source, the transfer destination, the head, and the substrate and the mounting plate;
The control means analyzes an image captured by the first camera, adjusts the position of the substrate so that the head is sucked and held at the center of the chip, and images captured by the second camera and the third camera. A transfer apparatus for adjusting the positions of the chip and the mounting plate by analyzing an image.
2. The transfer according to claim 1, wherein the control unit rotates the head by the rotation mechanism so that the chip sucked and held by the head is aligned with a reference position by a captured image of the second camera. Mounting device.
2. The transfer apparatus according to claim 1, wherein the control unit adjusts the mounting position on the mounting plate according to an image captured by the third camera.
4. The transfer apparatus according to claim 1, wherein the substrate includes position adjustment means in a direction perpendicular to the transfer direction other than the vertical direction of the head.

4. The transfer device according to claim 1, wherein the mounting plate includes position adjusting means in a direction perpendicular to the transfer direction other than the vertical direction of the head.
X-axis direction moving means for moving the head from the substrate to the mounting plate, and shutter speed changing means for changing the shutter speed during imaging of the second camera based on the moving speed of the head. 4. The transfer device according to claim 1, 2 or 3.

Images