JP6902974B2 - Electronic component mounting device and mounting method - Google Patents

Description

The present invention relates to a mounting device and a mounting method for electronic components.

In the manufacturing process of semiconductor packages such as QFP (Quad Flat Package) and BGA (Ball Grid Array Package), the surface on which the electrodes of electronic components such as semiconductor chips are formed on the substrate on which the circuit pattern such as the interposer substrate is formed. Flip-chip mounting is performed in which (electrode forming surfaces) are mounted facing each other. In flip-chip mounting, since the fine electrode pads of electronic components are directly bonded to the fine terminals formed in the circuit pattern of the substrate, both must be positioned accurately. Therefore, high positioning accuracy and mounting accuracy are required in the mounting device for electronic components for flip-chip mounting.

As a mounting device for electronic components that meets such demands, those disclosed in Patent Document 1 are known. Such an electronic component mounting device positions a mounting area on the board on which the electronic component is mounted this time at a predetermined mounting position, and mounts the electronic component in the mounting area above the mounting area. Positioned in. Then, in this state, the upper and lower imaging cameras are inserted between the board and the electronic component, the lower camera is used to recognize the position of the mounting area of the board, and the upper camera is used to recognize the position of the electronic component, both of which are recognized. After aligning the mounting area of the board with the electronic component based on the recognition result of, the electronic component is mounted.

Such a mounting device achieves a mounting accuracy of about ± 2 to 3 μm, which is sufficient for manufacturing QFP and BGA.

By the way, in recent years, with the spread of mobile devices such as mobile phones, the development of small and high-performance high-bandwidth memory has progressed, and semiconductor packages using three-dimensional high integration technology using TSV (Through Silicon Via) have been developed. The manufacturing process is drawing attention. A TSV is an electrode that penetrates the inside of a semiconductor chip up and down. In such a three-dimensional high integration technology using TSV, 1000 or more through electrodes are arranged on each semiconductor chip, which is much larger than the semiconductor chip used for QFP, and all of them. Through electrodes need to be electrically connected.

Therefore, the mounting accuracy of individual semiconductor chips, that is, electronic components, is required to be higher than the mounting accuracy required in the manufacturing process of QFP, BGA, etc., specifically, the mounting accuracy of ± 1 μm or less. It is presumed that it will be.

Japanese Unexamined Patent Publication No. 2011-077773

However, if the mounting device for electronic components having the configuration disclosed in Patent Document 1 is used as it is, it is difficult to obtain a mounting accuracy of ± 1 μm or less.

Therefore, the inventors have tried to improve the position recognition accuracy by increasing the imaging magnification of the vertical imaging camera. However, it was not possible to sufficiently improve the mounting accuracy to meet the requirements of the manufacturing process using TSV only by improving the position recognition accuracy.

An object of the present invention is to provide a mounting device and a mounting method for electronic components capable of accurately mounting electronic components on a substrate.

The electronic component mounting device of the embodiment is an electronic component mounting device that mounts electronic components in a plurality of mounting areas on a substrate, and is a supply unit that supplies the electronic components and a mounting table on which the substrate is mounted. The plurality of mounting areas of the board mounted on the pre-described pedestal are sequentially set to preset mounting positions by driving the pre-described pedestal driving unit. The electronic component includes a board stage to be positioned, a mounting tool for holding the electronic component supplied from the supply unit, and a tool driving unit for moving the mounting tool, and the electronic component is located in the mounting area positioned at the mounting position. a mounting portion for mounting the said at mounting positions, mounting region positioned on the mounting position of the substrate placed on the electronic component and the mounting table held by the mounting tool positioned on the mounting position Based on the image captured by the imaging unit and the image captured by the imaging unit, the relative positional relationship between the electronic component and the mounting region is recognized, and the tool driving unit is controlled to control the electronic component and the mounting region. A control unit that relatively positions the mounting area and mounts the electronic component on the mounting area is provided, and the control unit captures the electronic component and the mounting area at the mounting position by the imaging unit. before, imaging the mounting region positioned on Oite the mounting position on the mounting position by the imaging unit obtains the positional deviation of the mounting region for the mounting position on the basis of the captured image, obtained position It is characterized in that the position of the mounting area is corrected by controlling the stand drive unit described above so as to eliminate the deviation.

The method of mounting the electronic component of the present embodiment is a method of mounting the electronic component on a plurality of mounting areas on the board, and is among the plurality of mounting areas of the board mounted on the mounting table. a predetermined mounting area, holds the mounting region positioned step of positioning a preset mounted position, the electronic component supplied from the supply unit in the implementation tool, positioning the mounting tool which holds the electronic component to the mounting position an imaging step for imaging an electronic component positioned step, Oite on the mounting position, and said mounting region positioned on the electronic component and the mounting position held by the mounting tool positioned on the mounting position, this before based on the captured image obtained by the imaging process, the relative positioning of the electronic component and the mounting region, and a mounting step of mounting the electronic component on the mounting region, performing the imaging process In the mounting position, the mounting region positioned at the mounting position in the mounting region positioning step is imaged, and the positional deviation of the mounting region with respect to the mounting position is obtained based on the captured image, and the obtained positional deviation is obtained. It is characterized by including a position correction step of the mounting area for correcting the position of the mounting area so as to eliminate it.

According to the present invention, electronic components can be mounted on a substrate with high accuracy.

It is a front view which shows the schematic structure of the mounting apparatus of the electronic component of an embodiment. It is a block diagram of the mounting apparatus of the electronic component of an embodiment. It is a front view which shows the operation of the mounting apparatus of an electronic component. It is a front view which shows the operation of the mounting apparatus of an electronic component. It is a front view which shows the operation of the mounting apparatus of an electronic component. It is a front view which shows the operation of the mounting apparatus of an electronic component.

Hereinafter, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings. The positions and sizes of each component are merely convenient expressions for making the structure easy to understand.

Here, in the conventional configuration of the electronic component mounting device, there is a limit to improving the mounting accuracy of the electronic component. That is, after positioning the mounting area of the board at a preset mounting position and positioning the electronic component, the vertical imaging camera is inserted between the two, the relative position between the board and the electronic component is recognized, and the two are aligned. There was a limit to the improvement of mounting accuracy in the mounting configuration.

As a result of diligent studies, the inventors set the position error when mounting the board on the board stage of the mounting device for electronic components, especially the rotation position error in the horizontal rotation direction, and each mounting area of the board as the mounting position. It was found that the positioning error of the mounting area that occurs during positioning hinders the improvement of mounting accuracy.

That is, when the mounting portion and the board stage provided in the electronic component mounting device are repeatedly moved to the same position, the reproducibility of the moving position is high. Therefore, in the conventional mounting device, the mounting position is set to a fixed position, and the electronic component and the board mounting area are positioned with respect to this position to eliminate the movement position error of the mounting part and the board stage as much as possible. I was trying. Therefore, the inventors examined the operation of the mounting unit and the board stage in detail. As a result, it was found that the movement position error can be substantially eliminated in the mounting part which can be said to be a pure repetitive movement.

On the other hand, in the board stage, intermittent movement is repeated at a distance according to the arrangement of the mounting areas in order to sequentially position each mounting area at the mounting position. Since this operation is a repetitive movement of the same distance but not a pure repetitive movement, it was found that a slight positioning error occurs for each intermittent movement due to the absolute position accuracy of the substrate stage. Further, the mounting position error generated when the board is mounted on the board stage is corrected by the board stage. However, the substrate stage operates on different trajectories depending on whether the mounting position error is corrected or not. Then, it was found that the above-mentioned positioning error becomes larger when the trajectories are different. When the inventors measured this positioning error for a plurality of substrates, they found that a positioning error of about 20 μm to 100 μm occurred, although there were variations depending on the position where the substrate stage was intermittently moved and the distance where the substrate stage was intermittently moved. did.

By the way, this positioning error is corrected on the mounting portion side when the electronic component is mounted in the mounting region. Therefore, even if the mounting part is positioned in the mounting position with good reproducibility by repeated movement, in order to correct the above-mentioned mounting error, the mounting part is actually positioned at a position deviated from the mounting position of the electronic component. It was being implemented.

Therefore, the inventors investigated the relationship between the amount of correction movement of the mounting tool and the decrease in mounting accuracy of the mounting tool caused by this correction movement. That is, the Z-axis of the mounting tool seems to move in the XY direction while maintaining the vertical state, but when viewed microscopically, it moves while swinging in the vertical direction. This is due to pitching, yawing, rolling, etc. of the XY moving shaft. Therefore, when the moving position of the mounting tool changes, the state of inclination of the Z axis also changes, and the positional deviation in the XY direction that occurs when the mounting tool is lowered also changes when the moving position of the mounting tool changes. In order to investigate the misalignment due to this, at the height position where the electronic component is imaged, the mounting tool is +50 μm, +100 μm, -50 μm, -100 μm in the X direction, +50 μm, +100 μm,-in the Y direction with respect to the mounting position. The mounting tool was lowered from each of the eight positions shifted by 50 μm and -100 μm, and the mounting accuracy when the electronic components were mounted on the substrate was confirmed. That is, for each of the eight positions, it was confirmed how much the electronic component was mounted with respect to the position immediately below the position before the descent. As a result, it was found that the directions of the misalignment were different at the eight positions, but the mounting misalignment of a maximum of more than 1 μm occurred.

From these facts, the inventors have found that the mounting accuracy can be remarkably improved by eliminating the movement position error when positioning each mounting area of the board at the mounting position.
[Configuration of electronic component mounting device]
FIG. 1 is a front view showing a schematic configuration of a mounting device for electronic components according to an embodiment. The electronic component mounting device 1 has a supply unit 10 for supplying the semiconductor chip t as an electronic component, a substrate stage 20 on which the substrate K on which the semiconductor chip t is mounted is mounted, and a semiconductor chip t from the supply unit 10 one by one. The semiconductor chip t picked up by the transfer unit 30 and the transfer unit 30 is sucked and held, and the semiconductor by the mounting unit 40 and the mounting unit 40 mounted in a mounting area (not shown) on the substrate K mounted on the substrate stage 20. An imaging unit 50 that images the semiconductor chip t and the substrate K when the chip t is mounted, and a control unit 60 that controls the supply unit 10, the substrate stage 20, the transfer unit 30, the mounting unit 40, the imaging unit 50, and the like. Be prepared.

The supply unit 10 has a wafer table 12 that holds a wafer ring 11 that holds an adhesive sheet (not shown) to which a plurality of semiconductor chips t obtained by cutting and fragmenting the semiconductor wafer W are attached. The waha table 12 is arranged by the waha table driving unit 13 (see FIG. 2) in the X direction, which is one direction along the horizontal direction, the Y direction, which is the direction orthogonal to the X direction along the horizontal direction, and the rotation direction in the horizontal plane. It is possible to move in the θ direction.

The board stage 20 includes a mounting table 21 on which the board K on which the semiconductor chip t is mounted is mounted, and a mounting table driving unit 22 for moving the mounting table 21 in the X, Y, and θ directions. The board stage 20 sequentially positions a plurality of mounting areas on the board K mounted on the mounting table 21 at mounting positions C shown by an alternate long and short dash line in FIG. The mounting table 21 is supplied with the substrate K before the semiconductor chip t is mounted by a substrate transfer device (not shown), and the substrate K after the semiconductor chip t is mounted is carried out.

The transfer unit 30 is provided with a suction nozzle 31 that sucks and holds the semiconductor chip t and the suction nozzle 31 that is moved up and down along the Z direction, which is the vertical direction orthogonal to the horizontal direction, and parallel to the X direction. It is provided with an elevating / reversing drive unit 32 (see FIG. 2) that inverts up and down around the rotating shaft 31a. The suction nozzle 31 picks up the semiconductor chip t from the wafer ring 11 of the supply unit 10 at the pickup position A shown by the alternate long and short dash line in FIG. 1, inverts the picked-up semiconductor chip t, and uses the alternate long and short dash line in FIG. Transfer to the indicated delivery position B.

The mounting unit 40 attracts and holds the semiconductor chip t supplied from the supply unit 10, and mounts the semiconductor chip t sucked and held in the mounting region on the substrate K mounted on the mounting table 21 and the mounting tool 41. A tool driving unit 42 for moving the tool 41 in the X, Y, Z, and θ directions is provided. The mounting tool 41 receives the semiconductor chip t from the suction nozzle 31 at the delivery position B, and mounts the semiconductor chip t in the mounting area of the substrate K positioned at the mounting position C at the mounting position C shown by the alternate long and short dash line in FIG.

The image pickup unit 50 includes a vertical image pickup camera 51 that images the mounting area of the semiconductor chip t and the substrate K, and an advance / retreat drive unit 52 that moves the vertical image pickup camera 51 forward and backward along the Y direction between the image pickup position and the retracted position. An image processing unit 53 that performs image processing such as binarization of an image captured by the vertical imaging camera 51 and sends the image to the control unit 60 is provided. Further, the vertical imaging camera 51 includes an upper camera 51a that images the semiconductor chip t and a lower camera 51b that images the substrate K. The upper camera 51a and the lower camera 51b are connected to the image processing unit 53, respectively. Further, the vertical imaging camera 51 changes the direction of the optical axis of the upper camera 51a from the Y direction to the upward direction along the Z direction, and changes the direction of the optical axis of the lower camera 51b from the Y direction to the downward direction along the Z direction. It is provided with an optical path conversion unit 51c such as a prism to be converted. The optical axes of the upper camera 51a and the lower camera 51b are indicated by alternate long and short dash arrows in FIG. The upper camera 51a, the lower camera 51b, and the optical path conversion unit 51c are housed in the housing 51d of the upper and lower imaging camera 51. Here, the optical axis of the upper camera 51a converted in the Z direction and facing the semiconductor chip t and the optical axis of the lower camera 51b converted in the Z direction and facing the mounting region are arranged so as to coincide with each other in the vertical direction. , Are arranged coaxially. Further, in the housing 51d, an opening for imaging (not shown) corresponding to the position of the optical axis converted in the Z direction is provided on the upper and lower surfaces thereof, and the center of the opening coincides with the optical axis. It is provided in a positional relationship. Therefore, at the above-mentioned imaging position, this opening is positioned at the mounting position C.

The control unit 60 includes a storage unit 61. The storage unit 61 stores data necessary for the operation of the mounting device 1, such as operating conditions of the transfer unit 30 and the mounting unit 40, including information on the mounting position C. The control unit 60 refers to the data stored in the storage unit 61 and controls the supply unit 10, the substrate stage 20, the transfer unit 30, the mounting unit 40, the imaging unit 50, and the like.
[Explanation of operation]
Next, the operation of the mounting device 1 of the present embodiment will be further described with reference to FIGS. 3 to 6.

First, a wafer ring 11 having a plurality of semiconductor chips t attached to an adhesive sheet (not shown) is supplied to and held on a wafer table 12 of a supply unit 10 (wafer ring supply step). Further, the substrate K before mounting is placed on the substrate stage 20 by a substrate transfer device (not shown) (board supply step).

In this state, the wafer table drive unit 13 is controlled, and the semiconductor chip t that is first picked up on the wafer ring 11 is positioned at the pickup position A. When the semiconductor chip t is positioned at the pickup position A, as shown in FIG. 3, the elevating / reversing drive unit 32 is controlled, and the suction nozzle 31 is lowered onto the semiconductor chip t. The suction nozzle 31 sucks and holds the semiconductor chip t and then rises to the original height to pick up the semiconductor chip t (pickup step). Next, the suction nozzle 31 is inverted up and down about the rotation shaft 31a, and the semiconductor chip t is positioned at the delivery position B in a state of being inverted upside down as shown by a two-dot chain line in FIG. 3 (inversion step).

At this time, as shown in FIG. 3, the mounting tool 41 is positioned by the tool driving unit 42 at the delivery position B, more specifically, at a position directly above the semiconductor chip t positioned at the delivery position B and stands by. ing. Therefore, when the semiconductor chip t is positioned at the delivery position B, the tool drive unit 42 is controlled, and as shown in FIG. 4, the mounting tool 41 descends to the position of the semiconductor chip t that is attracted and held by the suction nozzle 31. .. Then, the mounting tool 41 sucks and holds the semiconductor chip t. When the mounting tool 41 sucks and holds the semiconductor chip t, the tool driving unit 42 raises the mounting tool 41 to its original height and transfers it to the mounting position C. As shown by the alternate long and short dash line in FIG. 4, the transferred semiconductor chip t is positioned at the height position where the vertical imaging camera 51 takes an image at the mounting position C (electronic component positioning step).

Here, in the present embodiment, the mounting region is located between the time when the mounting tool 41 receives the supply of the semiconductor chip t from the supply unit 10 and the time when the mounting tool 41 moves to the mounting position, that is, in parallel with the electronic component positioning process. Perform the position correction step.

That is, at the timing when the semiconductor chip t is picked up by the mounting tool 41 in the pick-up process, the mounting region on which the semiconductor chip t is mounted this time on the substrate K is positioned at the mounting position C (mounting region positioning step). When the mounting area is positioned at the mounting position C, or in parallel with it, the advancing / retreating driving unit 52 is controlled, and as shown in FIG. 4, the vertical imaging camera 51 is moved from the retracted position to the imaging position. When the vertical imaging camera 51 is positioned at the imaging position, the mounting region is imaged by the lower camera 51b.

Here, on the substrate K, for each mounting region, for example, a circuit pattern is provided corresponding to the TSV of the semiconductor chip t, and an alignment mark for positioning is provided. Therefore, the lower camera 51b captures an image of the mounting area including the alignment mark.

When the lower camera 51b captures the mounting region, the captured image is sent to the image processing unit 53, and after being subjected to image processing such as binarization by the image processing unit 53, it is sent to the control unit 60. The control unit 60 calculates the position of the mounting region using an image recognition technique such as a known pattern matching method based on the data of the captured image of the lower camera 51b sent from the image processing unit 53, and stores the storage unit 61 in advance. The positional deviation of the mounting area with respect to the mounting position C is obtained by comparing with the position information of the mounting position C stored in. As a result, when there is a misalignment, the mounting table drive unit 22 is driven so as to eliminate the misalignment, and the position of the mounting area is corrected (position correction step of the mounting area). As a result, the mounting area can be accurately positioned at the mounting position C. After correcting the misalignment, the mounting area may be imaged again with the lower camera 51b to confirm the suitability of the position correction of the mounting area. Furthermore, if it is determined that the position correction is inappropriate as a result of this, the position correction of the mounting area may be performed again.

After the electronic component positioning step and the mounting area position correction step are completed, as shown in FIG. 5, the semiconductor chip t held by the mounting tool 41 and the mounting area of the substrate K are imaged by the vertical imaging camera 51. Is performed (imaging process). That is, since the semiconductor chip t and the mounting region are arranged vertically separated from each other in the mounting position C, the vertical imaging camera 51 enters between them, the semiconductor chip t is imaged by the upper camera 51a, and the lower camera 51. The mounting area is imaged by 51b. When the semiconductor chip t and the mounting region are imaged by the vertical imaging camera 51, the control unit 60 uses the data of the semiconductor chip t image-processed by the image processing unit 53 and the captured image of the mounting region to capture both of them. Recognize the relative positional relationship of (position recognition process). The vertical imaging camera 51 that has completed imaging moves to the retracted position as shown in FIG.

After that, the control unit 60 controls the tool drive unit 42 to mount the semiconductor chip t held by the mounting tool 41 in the mounting region. At this time, if there is a deviation in the relative positional relationship between the semiconductor chip t and the mounting region, mounting is performed after operating the tool drive unit 42 so as to eliminate this positional deviation (mounting process). ..

The above operation is repeatedly executed for all the mounting areas on the substrate K. When the mounting of the semiconductor chip t on all the mounting regions on the substrate K is completed, the mounted substrate K is carried out from the mounting table 21 by a substrate transfer device (not shown), and a new substrate K is supplied. Further, when all the semiconductor chips t on the wafer ring 11 have been picked up, the wafer ring 11 is replaced with a new wafer ring 11. Such an operation is repeated for the required production amount, for example, one lot.
[Action effect]
According to the mounting device 1 of such an embodiment, the mounting region positioned at the mounting position C is vertically imaged before the semiconductor chip t positioned at the mounting position C and the mounting region are imaged by the vertical imaging camera 51. The image is taken by the lower camera 51b of the camera 51, and the positional deviation of the mounting region with respect to the mounting position C is obtained based on this image data. Was controlled to correct the position of the mounting area.

Therefore, when the mounting area of the semiconductor chip t and the substrate K positioned at the mounting position C is simultaneously imaged by the vertical imaging camera 51, the mounting area is accurately positioned at the mounting position C, so that the semiconductor chip t and the mounting area are mounted. The amount of movement of the mounting tool 41 when correcting the relative positional deviation with the region can be kept or eliminated to a small amount, and the semiconductor chip t can be mounted in the mounting region with high mounting accuracy. Become.

That is, since the mounting tool 41 repeatedly moves between the delivery position B and the mounting position C, the accuracy of the repeated movement to the mounting position C is very high. However, if the positioning accuracy of the mounting region with respect to the mounting position C is low and the relative positional deviation between the mounting region and the semiconductor chip t is large, the amount of correction movement of the mounting tool 41 required to correct this positional deviation in the XY direction is large. growing. In such a case, the state of inclination of the Z-axis due to pitching, yawing, rolling, etc. of the XY moving shaft of the tool driving unit 42 changes, which hinders the improvement of mounting accuracy. In the present embodiment, as described above, the mounting region is position-corrected with respect to the mounting position C before the semiconductor chip t and the mounting region positioned at the mounting position C are imaged by the vertical imaging camera 51. Therefore, the relative positional deviation between the mounting region and the semiconductor chip t is suppressed, and as a result, the amount of correction movement of the mounting tool 41 in the XY direction can be minimized, so that the Z-axis of the mounting tool 41 is tilted. Changes can be suppressed as much as possible. As a result, the posture of the mounting tool 41 and the trajectory of the descending movement when the mounting tool 41 is lowered toward the mounting area can be kept substantially constant each time, and thus the mounting accuracy can be improved. .. Therefore, it is possible to support the manufacturing process of semiconductor packages such as high bandwidth memory using 3D high integration technology using TSV, which requires higher mounting accuracy than semiconductor packages such as QFP and BGA. It becomes.

Further, the position correction step of the mounting region of the substrate K positioned at the mounting position C is performed between the time when the mounting tool 41 receives the supply of the semiconductor chip t from the supply unit 10 and the time when the mounting tool 41 moves to the mounting position C, that is, It is now performed in parallel with the electronic component positioning process. Therefore, it is not necessary to secure individual time for the new process of the position correction step of the mounting region, and it is possible to prevent the time required for mounting one semiconductor chip t on the substrate K from becoming long. It is possible to prevent a decrease in productivity.

Further, when the position correction step of the mounting region is performed by using the vertical imaging camera 51 that simultaneously captures the semiconductor chip t positioned at the mounting position C and the mounting region of the substrate K in a vertically separated state, the substrate K The mounting area is imaged. Therefore, it is not necessary to individually provide an image pickup device such as a camera for a new step of a position correction step of the mounting area, and it is possible to avoid complication of the configuration of the mounting device 1.
(Other embodiments)
The present invention is not limited to the above embodiment. For example, in the above mounting embodiment, the upper and lower camera 51 in the image pickup unit 50 includes an upper camera 51a for photographing the semiconductor chip t (electronic component) and a lower camera 51b for photographing the mounting area of the substrate K. However, the present invention is not limited to this, and for example, a single imaging camera may simultaneously image the electronic component located on the upper side and the mounting area of the substrate K located on the lower side. Specifically, on the optical axis of the horizontally arranged imaging camera, the upper half is tilted upward at an angle of 45 ° in the direction away from the imaging camera with the horizontal line intersecting perpendicular to the optical axis as a boundary. An image of an electronic component is captured in the upper half of the imaging field of the imaging camera by arranging a prism with the reflecting surface as the reflective surface and the lower half as the reflecting surface inclined downward at an angle of 45 ° in the direction away from the imaging camera. The image of the mounting area may be captured in the lower half. When the mounting area of the substrate K is imaged when the position correction step of the mounting area is performed, only the lower half of the imaging field of view of the imaging camera may be used. Imaging unit 50 Even in this way, the same effects as those of the above-described embodiment can be obtained.

Further, an imaging camera for imaging the semiconductor chip t (electronic component), an imaging camera for imaging the mounting region of the substrate K, and an imaging camera for imaging the mounting region of the substrate K in the position correction step of the mounting region are individually provided. You can do it.

Further, the position correction step of the mounting region of the substrate K is the electronic component positioning step between the time when the mounting tool 41 receives the supply of the semiconductor chip t (electronic component) from the supply unit 10 and the time when the mounting tool 41 moves to the mounting position C. This is an example of executing in parallel. However, the present invention is not limited to this, and the position correction step of the mounting region of the substrate K is performed before the semiconductor chip t positioned at the mounting position C and the mounting region are imaged by the vertical imaging camera 51. Just do it. Therefore, the transfer unit 30 may be arranged in parallel with the pickup process of picking up the semiconductor chip t from the supply unit 10. That is, it may be executed in parallel with the electronic component positioning step between the time when the transfer unit 30 picks up the semiconductor chip t from the supply unit 10 and the time when the mounting tool 41 moves to the mounting position C.

Further, in the above embodiment, the mounting position may always be a constant position regardless of the type of the semiconductor chip t or the type of the substrate K as an electronic component, or the type of the semiconductor chip t or the type of the substrate K, for example. , The size may be changed according to the change of the size and the like. The point is that the required production amount (for example, one lot) of the semiconductor chip t of the type to be mounted may be maintained at a fixed position from the start of mounting to the completion of mounting.

Although embodiments of the present invention have been described above, they are not intended to limit the scope of the invention. The novel embodiment described above can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

1 Mounting device 10 Supply unit 20 Board stage 21 Mounting table 22 Mounting table Drive unit 30 Transfer unit 31 Suction nozzle 40 Mounting unit 41 Mounting tool 42 Tool drive unit 50 Imaging unit 51 Vertical imaging camera 51a Upper camera 51b Lower camera 51c Optical path conversion unit 51d Housing 52 Advance / retreat drive unit 53 Image processing unit 60 Control unit 61 Storage unit t Semiconductor chip K Substrate

Claims (6)

An electronic component mounting device that mounts electronic components in multiple mounting areas on a board.
The supply unit that supplies the electronic components and
The plurality of mounting areas of the board mounted on the pre-described pedestal are provided with a pedestal on which the board is mounted and a pedestal drive unit for moving the pre-described pedestal. A board stage that is sequentially positioned at preset mounting positions,
A mounting unit that includes a mounting tool that holds the electronic component supplied from the supply unit and a tool driving unit that moves the mounting tool, and mounts the electronic component in the mounting area positioned at the mounting position. When,
In the mounting position, an imaging unit that captures a mounting region positioned on the mounting position of the substrate placed on the electronic component and the mounting table held by the mounting tool positioned on the mounting position ,
Based on the image captured by the imaging unit, the relative positional relationship between the electronic component and the mounting region is recognized, and the tool driving unit is controlled to relatively position the electronic component and the mounting region. A control unit for mounting the electronic component in the mounting area is provided.
Wherein the control unit, and said electronic component and the mounting area in the mounting position prior to imaging by the imaging unit, the mounting region positioned on Oite the mounting position on the mounting position imaged by the imaging unit Based on this captured image, the position deviation of the mounting region with respect to the mounting position is obtained, and the position of the mounting region is corrected by controlling the above-described pedestal drive unit so as to eliminate the obtained position deviation. Electronic component mounting device. Performs the control unit performs said electronic component and the mounting area in the mounting position prior to imaging by the imaging unit, and the imaging by the imaging section of the mounting area in the mounting position, on the basis of the captured image The electron according to claim 1, wherein the mounting tool controls the pedestal drive unit from the time when the mounting tool receives the supply of the electronic component from the supply unit to the time when the mounting tool moves to the mounting position. Component mounting device. The imaging unit enters between the electronic component held by the mounting tool positioned at the mounting position and the mounting area of the substrate positioned at the mounting position, and enters the electronic component and the mounting area. Equipped with a top-bottom imaging camera that can simultaneously capture images with
Wherein the control unit performs said electronic component and the mounting area in the mounting position prior to imaging by the upper and lower imaging camera, the imaging of the mounting region definitive in the mounting position, be performed using the upper and lower imaging camera The electronic component mounting device according to claim 1 or 2. The vertical imaging camera includes an upper camera that images the electronic component and a lower camera that images the mounting region, and the optical axis of the upper camera facing the electronic component and the light of the lower camera facing the mounting region. The electronic component mounting device according to claim 3, wherein the shafts are arranged coaxially. It is a mounting method of electronic components that mounts electronic components in multiple mounting areas on a board.
A mounting area positioning step of positioning a predetermined mounting area among the plurality of mounting areas of the board mounted on the mounting table at a preset mounting position, and a mounting area positioning step.
The electronic component supplied from a supply held in the mounting tool, and an electronic component positioned step of positioning the mounting tool holding said electronic component on the mounting position,
An imaging step of Oite, imaging the said mounting region positioned on the electronic component and the mounting position held by the mounting tool positioned on the mounting position on the mounting position,
Based on the captured image obtained in this imaging step, the relative positioning of the electronic component and the mounting region, and a mounting step of mounting the electronic component on the mounting area,
Before executing the imaging step, the mounting region positioned at the mounting position in the mounting region positioning step is imaged at the mounting position, and the displacement of the mounting region with respect to the mounting position is determined based on the captured image. A method for mounting an electronic component, which comprises a mounting region position correction step of obtaining and correcting the position of the mounting region so as to eliminate the obtained positional deviation. The method for mounting an electronic component according to claim 5, wherein the position correction step of the mounting region is performed in parallel with the step of positioning the electronic component.

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