JP2024055992A - Electronic component mounting equipment - Google Patents

Abstract

An electronic component mounting device capable of mounting electronic components while suppressing the effects of generated dust is provided.
[Solution] In an embodiment, a mounting device 1 for an electronic component C has a mounting head 31 that holds an electronic component C, a mounting mechanism 3 that mounts the electronic component C on a board S at a mounting position OA, a board support mechanism 2 that supports the board S on which the electronic component C is to be mounted, a supply unit 6 that supplies the electronic components C, and a transfer unit 7 that transfers the electronic components C from the supply unit 6 to the mounting position OA, and the transfer unit 7 has a transfer head 71 that picks up the electronic components C from a placement surface F of the electronic components C in the supply unit 6 and passes them to the mounting head 31, an arm unit 72 having the transfer head 71 provided at one end, and a transfer mechanism 73 that has a sliding part provided at a position that does not overlap the placement surface F in a planar view and drives the arm unit 72 in accordance with the sliding of the sliding part to move the transfer head 71 between the supply unit 6 and the mounting position OA.
[Selected Figure] Figure 1

Description

The present invention relates to an electronic component mounting device.

There are two methods for mounting a semiconductor chip, an electronic component, on a substrate: face-up and face-down. The surface of a semiconductor chip on which the semiconductor layer is formed is called the face. Face-up mounting is a method in which this face side is placed opposite the substrate. For example, face-up mounting is used when a semiconductor chip is mounted on a lead frame and wires are used to connect the electrodes to the frame.

Face-down mounting is a mounting method in which the face side faces the substrate. For example, face-down mounting is used in the case of flip-chip connections, in which bump electrodes are provided on the surface of the semiconductor layer and pressed against the wiring on the substrate to achieve fixation and electrical connection.

When mounting electronic components such as semiconductor chips on a board, the electronic components must be precisely positioned relative to the board. To address this, for example, a camera that can simultaneously capture images in both the upward and downward directions is inserted between the board and the mounting tool that holds the electronic components by suction. The horizontal relative position between the board and the electronic components is recognized based on the images captured by this camera. Then, after correcting the position of the mounting tool based on the recognized relative position, the electronic components are mounted on the board.

JP 2010-129913 A

In recent years, 3D packaging and hybrid bonding, which increase integration by arranging semiconductor chips in multiple layers, require bonding electrodes with a very narrow pitch. For this reason, higher precision, for example precision on the submicron order, is now required when mounting electronic components on a substrate. Furthermore, during mounting, errors due to the operation of the mounting mechanism and dust generated by the operation can lead to poor bonding, so it is preferable to keep the distance over which the mechanism operates as short as possible.

However, electronic components attached to a wafer sheet are picked up and inverted by a transfer tool or the like, and then received by a mounting tool that has moved to a receiving position, and transported to the mounting position. In this way, when the mounting tool moves between the receiving position where the mounting tool receives the electronic components and the mounting position where the electronic components are mounted on a board, the amount of dust generated at the mounting position increases. To address this, it is conceivable to increase the travel distance of the transfer tool to reduce the travel distance of the mounting tool. However, increasing the travel distance of the transfer tool increases the possibility that dust generated by the transfer tool will affect the electronic components attached to the wafer sheet.

The present invention has been proposed to solve the problems described above, and its purpose is to provide an electronic component mounting device that can mount electronic components while minimizing the effects of dust that is generated.

The electronic component mounting device of the present invention has a mounting mechanism in which a mounting head that holds electronic components mounts the electronic components on a board at a mounting position, a board support mechanism that supports the board on which the electronic components are mounted, a supply unit that supplies the electronic components, and a transfer unit that transfers the electronic components from the supply unit to the mounting position, and the transfer unit has a transfer head that picks up the electronic components from the electronic component placement surface in the supply unit and passes them to the mounting head, an arm unit with the transfer head at one end, and a transfer mechanism that has a sliding part that is provided at a position that does not overlap the placement surface in a plan view and drives the arm unit in accordance with the sliding of the sliding part to move the transfer head between the supply unit and the mounting position.

The present invention can provide an electronic component mounting device that can mount electronic components while minimizing the effects of dust that is generated.

1 is a front view showing a schematic configuration of a mounting device according to an embodiment; FIG. 2 is a plan view showing an electronic component and a substrate. 1A is a plan view of the mounting device, and FIG. 1B is an enlarged plan view of a mounting location. 1A and 1B are enlarged views showing a turning over operation of an electronic component, the left side being a front view and the right side being a plan view. FIG. 11 is an explanatory diagram showing an operation of picking up an electronic component. FIG. 11 is an explanatory diagram showing an electronic component delivery operation. FIG. 4 is an explanatory diagram showing a mounting operation of the mounting device. 10 is a flowchart showing a procedure of an electronic component pick-up operation and a delivery operation. 1 is a flowchart showing a mounting procedure for electronic components.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in Fig. 1 and Fig. 2, this embodiment is a mounting device 1 that mounts an electronic component C on a substrate S. Fig. 1 is a front view showing a schematic configuration of the mounting device 1. Fig. 2 is a plan view showing the electronic component C and the substrate S. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions), shape, and relative size ratios of each part may differ from the actual ones.
[Electronic Components]
First, the electronic component C to be mounted in this embodiment can be, for example, a semiconductor element such as an IC or an LSI.

As shown in FIG. 2, this embodiment uses a rectangular parallelepiped semiconductor chip as the electronic component C. Each semiconductor chip is a bare chip that has been separated by dicing a semiconductor wafer into individual pieces. The bare chip has bump electrodes on the exposed semiconductor, and is mounted by flip-chip connection that bonds to pads on the substrate S.

A plurality of marks m for positioning are formed on the electronic component C. In this embodiment, two marks m are formed, one at each of a pair of diagonal corners of the rectangular electronic component C. The marks m are formed on a surface of the electronic component C on which electrodes are formed, that is, on the face. This embodiment is an apparatus for face-down mounting in which the face side faces the board S for mounting.
[substrate]
2, the substrate S on which the electronic component C is mounted is a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed, etc. The substrate S is provided with a mounting area B in which the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In this embodiment, two marks M are formed at positions outside the mounting area B and corresponding to the marks m of the electronic component C.
[Mounting Equipment]
The mounting device 1 of this embodiment is capable of realizing high-precision mounting, for example, with a mounting accuracy of ±0.2 μm or less, and as shown in Figures 1 and 3, has a substrate support mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, a supply unit 6, a transport unit 7, and a control device 8. Figure 3(A) is a plan view of the mounting device 1, and Figure 3(B) is a plan view showing the mark M transmitted through the mounting head 31.

In the following description, the direction in which the mounting mechanism 3 moves to mount the electronic component C on the substrate S is referred to as the Z axis, and the two mutually perpendicular axes in a plane perpendicular to the Z axis are referred to as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction following gravity is referred to as the downward direction, and the direction resisting gravity is referred to as the upward direction, and the position on the Z axis is referred to as the height. The X axis and the Y axis are on a horizontal plane, and when viewed from the front side of FIG. 1, the X axis is the left-right direction, and the Y axis is the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as the upper side and the opposite side is referred to as the lower side with respect to the substrate S or the substrate support mechanism 2.

The substrate support mechanism 2 is a mechanism that supports the substrate S on which the electronic component C is mounted, and is a so-called substrate stage. The mounting mechanism 3 is a mechanism that mounts the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. As shown in FIG. 3B, the mounting head 31 has a transparent portion that allows the mark M on the substrate S facing the electronic component C to be recognized through transmission while holding the electronic component C.

The first imaging unit 4 is disposed below the board support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the board S, and images the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, that is, from below, when the board S is retracted from the mounting position OA by the board support mechanism 2. The mounting position OA is the position where the electronic component C is mounted on the board S, and is shown in the figure by a dashed line in the direction along the Z axis passing through a point (e.g., a center point) on the XY coordinate within the area of the electronic component C to be mounted. The mounting position OA coincides with the optical axis of the cameras of the first imaging unit 4 and the second imaging unit 5, as described later. The second imaging unit 5 is disposed above the mounting head 31 at the mounting position OA, and images the mark M of the board S through the transparent portion of the mounting head 31 (hereinafter, this is referred to as "imaging through the mounting head 31"). Based on the image captured in this way, it is possible to detect marks m and M, that is, to recognize marks m and M.

The board support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism performs positioning of the board S and the electronic component C based on the positions of the board S and the electronic component C determined from the images of the marks M and m captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting device 1 described above is mounted on a support stand 11 installed on an installation surface. The top surface of the support stand 11 is a horizontal plane.

The supply unit 6 supplies electronic components C. The transfer unit 7 transfers the electronic components C from the supply unit 6 to the mounting position OA. The transfer unit 7 has a transfer head 71 and a transfer mechanism 73. The transfer head 71 picks up the electronic components C from the supply unit 6, inverts them, and passes them to the mounting head 31. The transfer mechanism 73 moves the transfer head 71 into the space created by the board support mechanism 2 retracting the board S from the mounting position OA, and positions it at the mounting position OA.

The control device 8 controls the operation of the mounting device 1. The control device 8 is configured, for example, by a dedicated electronic circuit or a computer that operates with a predetermined program. In other words, the control device 8 is a processing device such as a PLC or a CPU that reads out programs and data from a storage device and executes control of the mounting device 1. Each part will be described in detail below.
(Substrate Support Mechanism)
1 and 3A, the substrate support mechanism 2 is disposed on the support base 11, and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 is, for example, a two-axis movement mechanism having a guide rail 22a in the X-axis direction and a guide rail 22b in the Y-axis direction, and moves the stage 21 in a horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. This drive mechanism 22 functions as a positioning mechanism that positions the substrate S. Although not shown, the drive mechanism 22 includes a θ drive mechanism that rotates and moves the stage 21 in a horizontal plane.

The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

Although not shown, a loader/unloader that supplies/stores the substrate S to/from the stage 21 of the substrate support mechanism 2 is provided at one of the moving ends in the X-axis direction of the stage 21 (specifically, the moving end on the right side in the figure). With the stage 21 moved to the moving end, the substrate support mechanism 2 receives the substrate S from the loader and passes the substrate S to the unloader.
(Implementation mechanism)
The mounting mechanism 3 has a mounting head 31 and a drive mechanism 32. The mounting head 31 has a roughly rectangular parallelepiped shape, and has a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through-hole formed with the Z-axis direction as its axis. The holding portion 31b is a plate-like member that can transmit light for imaging, and is attached so as to cover the opening of the hollow portion 31a on the side facing the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool, and holds the electronic component C.

3B, a suction area D is provided in the center of the holding section 31b for suctioning and holding the electronic component C. Although not shown, a suction hole is formed in the suction area D. A flow path is formed inside the holding section 31b to connect the suction hole to a negative pressure source, and the electronic component C can be suctioned and held by generating negative pressure in the suction hole. The periphery of the suction area D of the holding section 31b is a transparent area T that can transmit and image the mark M of the board S even when the electronic component C is suctioned. In other words, the mounting head 31 has a transparent portion so that the mark M of the board S can be imaged by the second imaging section 5. The holding surface (suction surface) of the holding section 31b that holds the electronic component C is called the lower end surface.

The driving mechanism 32 includes movable bodies 33, 34, and 35, and is a mechanism for driving the mounting head 31. The movable body 33 is provided so as to be movable along a Y-axis guide rail 33a provided on the support base 11. The movable body 34 is provided so as to be movable along an X-axis guide rail 34a provided on the top surface of the movable body 33. The movable body 35 is provided so as to be movable along a Z-axis guide rail 35a provided on the front surface of the movable body 34. The movable body 35 is formed in a roughly concave shape in a plan view. These movable bodies 33, 34, and 35 are driven by a ball screw, a linear motor, a cylinder, or the like, which uses a motor as a drive source.

The mounting head 31 is provided below the moving body 35, which moves in the Z-axis direction. Therefore, the moving body 35 performs an operation to mount the electronic component C held by the holding portion 31b of the mounting head 31 on the board S. In addition, the moving body 35 on which the mounting head 31 is provided moves in the X-axis direction and the Y-axis direction by the movement of the moving bodies 33 and 34. Therefore, the driving mechanism 32 functions as a positioning mechanism that positions the electronic component C held by the mounting head 31. Although not shown in the figure, the driving mechanism 32 is equipped with a θ driving mechanism that rotates and moves the mounting head 31 in a horizontal plane.

In this embodiment, it is preferable to set the amount of movement in the X-axis, Y-axis, and Z-axis directions by the driving mechanism 32 as short as possible in order to prevent movement errors. For example, the amount of movement in the X-axis and Y-axis directions by the moving bodies 33 and 34 is set to several mm to several tens of mm, respectively. The amount of movement in the Z-axis direction by the moving body 35 is also set to several mm to several tens of mm. That is, the mounting head 31 receives the electronic component C and captures an image of the mark m of the received electronic component C at a height position where the lower end surface of the holding part 31b is spaced apart from the upper surface of the board S placed on the stage 21 by a distance of several mm, for example, 1 to 2 mm (vertical separation distance). Therefore, with regard to the amount of movement in the Z-axis direction of the moving body 35, it is sufficient to ensure at least a movement amount that can pressurize the electronic component C held by the holding part 31b to the board S with a predetermined pressure force from this height position and mount it.
(First imaging unit)
The first imaging unit 4 has a camera, a lens, a lens barrel, a light source, etc., and is fixed to a storage hole 11a provided in the support base 11. The first imaging unit 4 is arranged in a direction in which the optical axis of the camera can capture an image of the mark m of the electronic component C held by the mounting head 31. Specifically, the first imaging unit 4 is arranged so that the optical axis is vertical. The first imaging unit 4 is immovable with respect to the mounting position OA of the electronic component C. In this embodiment, the first imaging unit 4 is arranged facing upward in the storage hole 11a of the support base 11, which is a position below the board support mechanism 2, with the optical axis of the camera aligned with the mounting position OA. The first imaging unit 4 is fixed to the support base 11 with a size and positional relationship such that the two marks m do not fall out of the imaging field of view even if the electronic component C moves to the maximum for positioning. In other words, the imaging field of the first imaging unit 4 is set in consideration of the range in which the two marks m of the electronic component C can move to the maximum for positioning when the optical axis is aligned with the mounting position OA and fixed.

Here, "immobile" means that the first imaging unit 4 (the same applies to the second imaging unit 5 described later) does not move when capturing images of the marks m and M. For example, "immobile" includes a configuration in which the imaging units 4 and 5 are provided with drive devices in the X- and Y-axis directions (horizontal directions) and a drive device in the Z-axis direction (vertical direction), and these drive devices adjust the horizontal and vertical positions of the imaging units 4 and 5 as preparations for the operation of the device, and the imaging units do not move thereafter during operation of the device.
(Second imaging unit)
The second imaging unit 5 has a camera, a lens, a lens barrel, a light source, etc., and is supported and fixed by a frame (not shown) or the like above the support stand 11, more specifically, above the mounting head 31. The second imaging unit 5 is arranged in a direction in which the optical axis of the camera passes through the holding portion 31b of the mounting head 31 and can capture an image of the mark M around the mounting area B of the board S. That is, in this embodiment, the second imaging unit 5 is arranged facing downward at a position directly above the mounting head 31 with the optical axis of the camera aligned with the mounting position OA. The second imaging unit 5 is immobile with respect to the mounting position OA of the electronic component C, similar to the first imaging unit 4. That is, the imaging field of the second imaging unit 5 is set in consideration of the range in which the two marks attached to the mounting area B of the board S can move to the maximum for positioning. For this reason, the size of the transmission portion of the mounting head 31 is set to match the imaging field of the second imaging unit 5.

The arrangement of the first imaging unit 4 and the second imaging unit 5 in this embodiment will now be described. It is preferable for the mounting device 1 of this embodiment to achieve a mounting accuracy of 0.2 μm or less. To achieve this, the first imaging unit 4 and the second imaging unit 5 must have the performance to perform high magnification and high-definition imaging that matches that accuracy.

It is generally known that in order to capture a high-definition image, it is necessary to place the imaging unit in a position close to the electronic component C or circuit board S that is the subject of the image. Therefore, it is preferable to place the first imaging unit 4 and the second imaging unit 5 as close as possible to the electronic component C or circuit board S, in other words, to shorten the imaging distance.

However, in the mounting device 1 of this embodiment, in order to minimize the amount of downward movement of the electronic component C during mounting, the electronic component C is positioned at a position close to the height of the top surface of the board S, and an image of the mark m of the electronic component C and an image of the mark M of the board S are taken. Therefore, the stage 21 and the moving plate 23 of the drive mechanism 22 are present between the first imaging unit 4 and the electronic component C, and the mounting head 31 is present between the second imaging unit 5 and the board S. Then, because it is necessary to avoid interference between the moving plate 23 and the mounting head 31, there is a limit to shortening the distance between the first imaging unit 4 and the electronic component C, and between the second imaging unit 5 and the board S.

The inventors of the present application therefore investigated the maximum imaging distance at which an image that can achieve the above mounting accuracy can be captured. As a result, they concluded that it was approximately 100 mm. Based on these results, in this embodiment, the first imaging unit 4 is fixedly positioned at a height position where the distance from the electronic component C is within 100 mm, and the second imaging unit 5 is fixedly positioned at a height position where the distance from the board S is within 100 mm.

The mounting head 31 located between the second imaging unit 5 and the substrate S is a member with a relatively large height dimension (Z-axis dimension) for the purpose of ensuring rigidity. Therefore, interference may occur in a normal configuration. As a result of extensive investigation, the inventors of the present application have succeeded in minimizing the height dimension while maintaining the functionality and rigidity required of the mounting head 31. Specifically, the height dimension of the mounting head 31 (the dimension from the lower end of the holding portion 31b to the upper opening of the hollow portion 31a) is set to about 70 mm. This makes it possible to place the second imaging unit 5 at a height position of 100 mm or less with respect to the substrate S.
(Supply Department)
The supply unit 6 has a support mechanism 61 and a drive mechanism 62. The support mechanism 61 is a device that supports the wafer sheet WS to which the electronic components C are attached. The drive mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. The electronic components C are divided into individual pieces by dicing. In the supply unit 6, the surface on which the electronic components C are mounted is called the placement surface F. In this embodiment, the surface of the wafer sheet WS to which the electronic components C are attached is the placement surface F. The wafer sheet WS is attached to a wafer ring (not shown). The support mechanism 61 has a ring holder 61a to which the wafer ring is attached. In other words, the surface of the support mechanism 61 that supports the wafer sheet WS can also be called the placement surface F.

Although not shown, a loader/unloader that supplies/stores wafer rings in the ring holder 61a is provided at one of the moving ends of the support mechanism 61 in the Y-axis direction (specifically, the moving end on the front side in the figure). When the support mechanism 61 moves to the moving end, it receives wafer rings from the loader and passes them to the unloader.

Although not shown, the support mechanism 61 has an expanding mechanism that stretches the wafer sheet WS to create gaps between the electronic components C, and a push-up mechanism that sandwiches the stretched wafer sheet WS and pushes up the electronic components C individually to separate them. Furthermore, the support mechanism 61 has a θ drive mechanism that rotates the ring holder 61a in a horizontal plane. The push-up mechanism is fixedly disposed on the support base 11, and the transfer unit 7 receives the electronic components C from the supply unit 6, i.e., picks them up, at this position (pick-up position).

The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the drive mechanism 62 has an X-axis guide rail 62a and a Y-axis guide rail 62b, and is a mechanism that moves the support mechanism 61 in the X-axis and Y-axis directions in a horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. The drive mechanism 62 functions as a positioning mechanism that positions the electronic component C with respect to the transfer head 71. The drive mechanism 62 is disposed at a position lower than the height position L (see FIG. 5) of the placement surface F.
(Transportation section)
The transfer unit 7 has a transfer head 71, an arm unit 72, and a transfer mechanism 73. As shown in the enlarged view of Fig. 4, the transfer head 71 has a suction nozzle 71a and a reversal drive unit 71b. The suction nozzle 71a is connected to an air pressure circuit (not shown) via a tube, and sucks an electronic component C to its tip by negative pressure, and releases the electronic component C by releasing the negative pressure or by positive pressure. The reversal drive unit 71b reverses the electronic component C sucked by the suction nozzle 71a in the up-down direction, as shown in Figs. 4(A) and (B). That is, the suction nozzle 71a is provided so as to be rotatable between a direction facing the wafer sheet WS and a direction facing the mounting head 31 by the reversal drive unit 71b. The reversal drive unit 71b is, for example, a motor.

Although not shown, the transfer head 71 drives the suction nozzle 71a in the vertical direction and has a buffer member that applies an appropriate load and absorbs excessive load when the tip of the suction nozzle 71a comes into contact with the electronic component C. A voice coil motor, for example, is used as the buffer member.

The arm 72 is a member having a transfer head 71 at one end. As shown in FIG. 3A, the arm 72 has an extension 72a and a base 72b. The extension 72a is an L-shaped member formed by a rectangular parallelepiped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped member extending linearly in the X-axis direction toward the mounting mechanism 3. At one end of the extension 72a toward the mounting mechanism 3, an inversion drive unit 71b is provided with a rotation axis in the Y-axis direction. The suction nozzle 71a is attached to the rotation axis of the inversion drive unit 71b, so that the suction nozzle 71a is rotatably provided. The base 72b is a plate-like body parallel to the X-axis direction, and is fixed to the other end of the extension 72a (see FIG. 5).

The tube for supplying negative pressure connected to the suction nozzle 71a, the inversion drive unit 71b, and the cable for electrical connection connected to the buffer member are built into the arm unit 72. Built-in means that they are not exposed to the outside because they are covered by the exterior of the arm unit 72. In this embodiment, the tube and cable are inserted into a hollow portion formed inside the arm unit 72.

The transfer mechanism 73 drives the arm 72 to move the transfer head 71 between the supply unit 6 and the mounting position OA. The transfer mechanism 73 has a sliding part provided at a position that does not overlap the placement surface F in a plan view. In other words, the sliding part of the transfer mechanism 73 is provided outside the movement range of the support mechanism 61. The transfer mechanism 73 drives the arm 72 in accordance with the sliding of the sliding part. The sliding part here refers to a component part in which members move while in contact with each other. Such a sliding part is a source of dust generation. As shown in FIG. 5, the sliding part of this embodiment is configured to include a first sliding part 732b and a second sliding part 734b, which will be described later. The first sliding part 732b and the second sliding part 734b are provided at a position lower (lower) than the height position L of the placement surface F.

As shown in FIG. 5, the transfer mechanism 73 has a fixed body 731, a first drive unit 732, a moving body 733, and a second drive unit 734. As shown in FIG. 1 and FIG. 3(A), the fixed body 731 is a rectangular parallelepiped member that is fixed to the support base 11 and extends in the X-axis direction. The position of the fixed body 731 is fixed with respect to the mounting position OA.

The first driving unit 732 drives the arm unit 72 in the X-axis direction. The first driving unit 732 has a first driving source 732a and a first sliding portion 732b. The first driving source 732a is a linear motor extending in the X-axis direction and is provided along the upper surface of the fixed body 731. The first sliding portion 732b is a linear guide extending in the X-axis direction and is provided in front of the fixed body 731. Note that the linear motor does not have a sliding portion because the mover moves without contacting the stator.

The moving body 733 is a rectangular parallelepiped block to which the mover of the first driving source 732a and the slider of the first sliding portion 732b are attached, so that the moving body 733 can slide in the X-axis direction in response to the operation of the first driving source 732a.

The second driving unit 734 drives the arm unit 72 in the Z-axis direction. The second driving unit 734 has a second driving source 734a and a second sliding unit 734b. The second driving source 734a is a linear motor extending in the Z-axis direction and is provided on the moving body 733. The second sliding unit 734b is a linear guide extending in the Z-axis direction and is provided on the moving body 733.

The base portion 72b of the arm portion 72 is provided so as to be slidable in the Z-axis direction by mounting the movable element of the second driving source 734a and the slider of the second sliding portion 734b. Thus, the sliding portion of this embodiment has a first sliding portion 732b and a second sliding portion 734b that slide linearly along two orthogonal axes. The first sliding portion 732b and the second sliding portion 734b are arranged in a positional relationship in which they overlap in the height direction on two side surfaces facing each other on the front and back of a common moving body 733. In other words, the positions of the two orthogonal axes are close to each other. In addition, it is preferable that the distance between the two side surfaces of the moving body 733 is short, that is, the moving body 733 is thin.
(Relationship between the distance between the substrate on the stage and the mounting head, and the dimensions of the transfer head)
In this embodiment, as shown in FIG. 1, the facing distance between the substrate S at the mounting position OA and the mounting head 31 is set so that the substrate S needs to be withdrawn in order for the transfer head 71 to move to the mounting position OA. In other words, the height position of the mounting head 31 when receiving the electronic component C at the mounting position OA is set so close to the height position of the upper surface of the substrate S supported by the substrate support mechanism 2 that the substrate S needs to be withdrawn in order for the transfer head 71 to move to the mounting position OA. More specifically, the distance h between the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 at the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C is shorter than the height dimension H of the transfer head 71 at the tip of the arm part 72 (h<H). Here, as described above, the distance from the lower end surface of the holding part 31b to the height position of the upper surface of the substrate S is, for example, several mm.
(Arm dimensions)
1, 3(A), and 4(A), the extension 72a of the arm portion 72 has a width w of the member extending linearly in the Y-axis direction and a width d of the member extending linearly in the X-axis direction both longer than the thickness t in the Z-axis direction (w>t, d>t). This makes it possible to ensure the rigidity of the relatively long arm portion 72 while suppressing the increase in the height dimension of the arm portion 72, and to stabilize the position of the electronic component C transferred by the transfer head 71. By suppressing the increase in the height dimension of the arm portion 72, it becomes unnecessary to raise the receiving position of the mounting head 31.
(Control device)
The control device 8 controls the positioning mechanism so that the board S and the electronic component C are positioned based on the marks m and M captured by the first imaging unit 4 and the second imaging unit 5. That is, the control device 8 stores in a storage device the position of the mark m of the electronic component C on the XY coordinate system and the position of the mark M of the board S on the XY coordinate system as reference positions corresponding to the position where the electronic component C should be accurately mounted.

This reference position can be the position of marks m and M when electronic component C is accurately mounted as a result of a trial of mounting electronic component C on board S in advance. The control device 8 determines the deviation between the reference position and the mark m captured by the first imaging unit 4 and the mark M captured by the second imaging unit 5, and controls the positioning mechanism (drive mechanism 22 and drive mechanism 32) so that the electronic component C and board S move in a direction and by an amount that corrects the deviation.

Furthermore, the control device 8 controls the transfer mechanism 73 of the transfer section 7 and the drive mechanism 62 of the supply section 6 based on map information indicating the position coordinates of the electronic components C on the wafer sheet WS, thereby sequentially positioning the electronic components C to be picked up at the pick-up position. Note that the term "pick-up" used here refers to removing and receiving the electronic components C from the member on which the electronic components C are placed, such as the wafer sheet WS. Furthermore, the control device 8 controls the holding of the electronic components C by the suction nozzle 71a of the transfer head 71, the inversion of the suction nozzle 71a by the inversion drive section 71b, the movement of the transfer head 71 to the mounting head 31 by the transfer mechanism 73, the delivery of the electronic components C to the mounting head 31 by the suction nozzle 71a, etc.
[motion]
The operation of this embodiment as described above will be described with reference to the explanatory diagrams of Figures 4 to 7 and the flow charts of Figures 8 and 9. Note that in the initial state, the substrate S is handed over from the loader to the stage 21 of the substrate support mechanism 2, but is retreated together with the stage 21 from the position facing the mounting head 31, i.e., the mounting position OA.
[Transportation of Electronic Components]
The transfer operation of the electronic components C will be described with reference to the explanatory diagrams of Figures 4 to 6 and the flow chart of Figure 8. A wafer ring with a wafer sheet WS attached thereto is attached by an autoloader to the ring holder 61a of the support mechanism 61 in the supply unit 6. Electronic components C, which have been separated into individual pieces by dicing, are attached to this wafer sheet WS. Note that in Figure 5, only the electronic components C to be picked up are shown.

First, as shown in Fig. 5(A) and Fig. 3(A), the support mechanism 61 moves in the X-axis and Y-axis directions to position the electronic component C to be mounted at the pick-up position. In addition, the arm portion 72 moves in the X-axis direction to position the tip of the suction nozzle 71a of the transfer head 71 directly above the electronic component C to be mounted, that is, at the pick-up position (step S101).

At this time, the movement of the wafer sheet WS in the X-axis and Y-axis directions is performed by the drive mechanism 62 of the supply unit 6. The movement of the arm unit 72 in the X-axis direction is performed by the movement of the moving body 733 along the first sliding portion 732b as a result of the first drive source 732a of the first drive unit 732 being activated.

As shown in FIG. 5(B), the push-up mechanism pushes up the electronic component C to be mounted. Then, the suction nozzle 71a of the transfer head 71 picks up the electronic component C (step S102). That is, the arm portion 72 and the buffer member move in a direction approaching the wafer sheet WS to suction and hold the electronic component C, and then move in a direction away from the wafer sheet WS to detach the electronic component C from the wafer sheet WS.

At this time, the arm portion 72 moves when the second drive source 734a of the second drive unit 734 is actuated to move the base portion 72b along the second sliding portion 734b. Then, as shown in Figures 4(A), (B), 5(C), and (D), the inversion drive unit 71b rotates the suction nozzle 71a by 180 degrees to invert the electronic component C (step S103).

6A and 6B, the arm 72 moves in the X-axis direction to position the transfer head 71 at the mounting position OA (step S104). That is, the electronic component C held by the suction nozzle 71a of the transfer head 71 comes to a position facing the holding portion 31b of the mounting head 31 in the mounting mechanism 3. The movement of the arm 72 in the X-axis direction at this time is performed by the first driving source 732a of the first driving portion 732 operating, and the moving body 733 moving the distance from the pickup position to the mounting position OA along the first sliding portion 732b. At this time, the mounting head 31 waits at a height position where the facing distance between the lower end surface of the holding portion 31b and the upper surface of the board S is a few mm. This height position is maintained until the positioning of the electronic component C and the board S is completed and the mounting head 31 is driven toward the board S, as described later.

As shown in FIG. 6(C), the arm portion 72 moves in a direction approaching the holding portion 31b and presses the electronic component C against the holding portion 31b. As shown in FIG. 6(D), the holding portion 31b of the mounting head 31 receives the electronic component C by suction and holding it using negative pressure (step S105). At the same time, the suction nozzle 71a releases the negative pressure, and the arm portion 72 moves in a direction away from the holding portion 31b, thereby releasing the electronic component C. The movement of the arm portion 72 at this time is achieved by the second drive source 734a of the second drive portion 734 operating to move the base portion 72b along the second sliding portion 734b.

6(E), the arm unit 72 moves toward the supply unit 6, causing the transfer head 71 to retreat from directly below the holder 31b. The movement of the arm unit 72 at this time is performed by the first drive source 732a of the first drive unit 732 being actuated to move the moving body 733 in the X-axis direction along the first sliding portion 732b. Note that the transfer unit 7 transfers the electronic component C to the holder 31b at the mounting position OA, and therefore the stage 21 remains retracted during the transfer to avoid interference with the transfer mechanism 73.
[Electronic component mounting]
Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagram of Fig. 7 and the flow chart of Fig. 9. Here, as shown in Fig. 7(A), the holding portion 31b of the mounting head 31 holding the electronic component C as described above is located directly below the second imaging unit 5. The first imaging unit 4 captures an image of the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 determines the amount of deviation between the position of the mark m captured by the first imaging unit 4 and a reference position, and operates the drive mechanism 32 to position the electronic component C so as to eliminate the amount of deviation (step S202).

Next, as shown in Fig. 7(B), the board support mechanism 2 moves the stage 21 so that the mounting area B of the board S (the mounting area B where the electronic component C is mounted this time) faces the electronic component C held by the mounting head 31, that is, so that the center of the mounting area B is at the mounting position OA (step S203). Then, as shown in Fig. 3(B), the second imaging unit 5 images the mark M of the board S visible in the transparent area T around the electronic component C through the mounting head 31 (step S204).

The control device 8 determines the amount of deviation between the position of the mark M imaged by the second imaging unit 5 and the reference position, and positions the board S by operating the drive mechanism 22 so as to eliminate the amount of deviation (step S205). Furthermore, as shown in FIG. 7(C), the drive mechanism 32 drives the mounting head 31 toward the board S, and the electronic component C held by the mounting head 31 is mounted on the board S (step S206).

In this manner, by repeating the operations of transferring the electronic components C from the wafer sheet WS, handing over the electronic components C to the mounting head 31, positioning the electronic components C and the board S, and mounting, the electronic components C are sequentially mounted in each mounting area B of the board S. The board S on which a predetermined number of electronic components C have been mounted is transported by the board support mechanism 2 and stored in the unloader.
[Action and Effect]
(1) The mounting device 1 for electronic components C in this embodiment includes a mounting head 31 that holds the electronic components C, a mounting mechanism 3 that mounts the electronic components C on a board S at a mounting position OA, a board support mechanism 2 that supports the board S on which the electronic components C are mounted, a supply unit 6 that supplies the electronic components C, and a transfer unit 7 that transfers the electronic components C from the supply unit 6 to the mounting position OA.

The transfer unit 7 has a transfer head 71 that picks up electronic components C from the placement surface F of the electronic components C in the supply unit 6 and passes them to the mounting head 31, an arm unit 72 with the transfer head 71 at one end, and a sliding part (732b, 734b) that is provided at a position that does not overlap the placement surface F in a plan view, and a transfer mechanism 73 that moves the transfer head 71 between the supply unit 6 and the mounting position OA by driving the arm unit 72 in accordance with the sliding of the sliding part.

In this way, since the sliding portion is positioned so as not to overlap with the mounting surface F of the electronic component C in a planar view, when the arm portion 72 moves in accordance with the sliding of the sliding portion, dust generated from the sliding portion is less likely to fall onto the mounting surface F, thereby suppressing poor bonding caused by dust adhering to the electronic component C.
(2) The sliding portion is provided at a position lower than the height position of the mounting surface F. Therefore, dust generated from the sliding portion falls below the mounting surface F and hardly reaches the mounting surface F, so that poor bonding can be further suppressed.
(3) The transfer head 71 has a suction nozzle 71a that sucks the electronic component C by negative pressure, and a tube that supplies negative pressure to the suction nozzle 71a is built into the arm portion 72. Therefore, even if dust is generated from the tube that deforms as the arm portion 72 moves, it does not escape to the outside of the arm portion 72 and does not affect the surroundings.
(4) The transfer head 71 is an inversion head that is driven by a motor that is an inversion drive unit 71b and inverts the electronic components C, and a cable that supplies power to the motor is built into the arm unit 72. Therefore, even if dust is generated from a tube that deforms as the arm unit 72 moves, it does not escape to the outside of the arm unit 72 and does not affect the surroundings.
(5) The sliding portion has a first sliding portion 732b and a second sliding portion 734b that slide linearly along two perpendicular axes, and the first sliding portion 732b and the second sliding portion 734b are arranged in a positional relationship in which they overlap in the height direction on two side surfaces facing each other on the front and back of a common moving body 733.

Therefore, the two shafts of the first sliding portion 732b and the second sliding portion 734b are disposed in close proximity to each other via a common member, and it is possible to prevent the positional deviation of the transfer head 71 caused by the rattle of the first sliding portion 732b and the second sliding portion 734b from expanding. Therefore, by providing the sliding portion at a position that does not overlap with the placement surface F in a plan view, even if the arm portion 72 is long, accurate positioning and transfer of the electronic component C are possible.
(6) The transfer unit 7 has a transfer head 71 that picks up an electronic component C from the supply unit 6, inverts it, and passes it to the mounting head 31, and a transfer mechanism 73 that moves the transfer head 71 into the space created by the substrate support mechanism 2 retracting the substrate S (stage 21) from the mounting position OA.

Therefore, there is no need for the mounting head 31 to move in order to receive the electronic component C from the transfer mechanism 73, the position of the electronic component C at the mounting position OA can be maintained constant, and the electronic component C can be received at a height position close to the height position of the upper surface of the board S, thereby obtaining high mounting accuracy. In this way, the amount of movement of the mounting head 31 can be reduced, and therefore the amount of dust generated at the mounting position OA can also be reduced.
(7) The distance between the board S at the mounting position OA and the mounting head 31 is set so that the board S needs to be withdrawn in order for the transfer head 71 to move to the mounting position OA. This allows the position of the mounting head 31 when receiving the electronic component C to be close to the board S at the time of mounting. This makes it possible to significantly shorten the distance that the mounting head 31 moves for mounting after receiving the electronic component C, preventing misalignment due to the movement of the mounting head 31 and improving mounting accuracy.
(8) The mounting head 31 has a transparent portion that allows the mark M of the board S to be recognized through a transparent portion while holding the electronic component C, and is arranged below the board support mechanism 2 at the mounting position OA. The mounting head 31 has a first imaging unit 4 that images the mark m of the electronic component C held by the mounting head 31 when the board S is retracted from the mounting position OA, a second imaging unit 5 that is arranged above the mounting head 31 at the mounting position OA and images the mark M of the board S through the transparent portion, and a positioning mechanism that positions the board S and the electronic component C based on the positions of the board S and the electronic component C determined from the images of the marks m and M imaged by the first imaging unit 4 and the second imaging unit 5.

According to this embodiment, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4 arranged below the board support mechanism 2 at the mounting position OA while the board S is retracted from the mounting position OA, and the board S supported by the board support mechanism 2 is imaged through the transparent portion of the mounting head 31 by the second imaging unit 5 arranged above the mounting head 31 at the mounting position OA, so that it is possible to image the mark m of the electronic component C and the mark M of the board S while bringing the electronic component C and the board S as close as possible to each other.

This allows the movement distance of the electronic component C (mounting head 31) and the board S (board support mechanism 2) when capturing images of the marks m and M, and the relative movement distance of the electronic component C (mounting head 31) and the board S (board support mechanism 2) after capturing images of the marks m and M to be as short as possible. This allows the increase in error caused by moving the mounting head 31 and the board support mechanism 2 a long distance to be suppressed. Also, the longer the movement distance of the mechanism, the more dust is generated, but in this embodiment, the movement distance can be suppressed, so it is possible to prevent a decrease in cleanliness caused by dust and resulting in poor bonding.

Here, if the mark M is imaged by a camera installed adjacent to the mounting head 31, rather than through the mounting head 31, it is practically impossible to achieve the required high accuracy using a high-magnification camera. In other words, the area on the board S where the mark M is placed is only a few millimeters larger than the area where the electronic component C is mounted, and the diameter of the mounting head 31 is also only a few millimeters larger than the area where the mark M is placed. For this reason, even if the camera barrel is placed adjacent to the mounting head 31, multiple marks M will not fit within the camera's field of view, and multiple marks M cannot be imaged simultaneously by the camera.

In this case, in order to capture an image of multiple (two) marks M on the board S, the camera (mounting head 31) must be moved a distance greater than the separation distance between the two marks M, and this movement creates errors. In other words, after recognizing and aligning the mark m of the electronic component C, the camera must be moved together with the mounting head 31 in order to recognize the mark M on the board S, and even if it is returned to its original position afterwards, there is a possibility that the position of the electronic component C will be shifted.

To deal with this, if the recognition and alignment of the mark M on the board S is performed first, the position of the electronic component C cannot be recognized when the board S is in the position where it is to be mounted. Therefore, the board S must be moved after alignment, resulting in misalignment of the board S.

It is also possible to prepare a template with a mark corresponding to the mark M on the board S at a position different from the position where the electronic component is to be mounted, and to position the component based on the relative positions of the mark on the template and the mark M on the board S. However, in this case, the mounting head 31 and the camera must be moved to recognize the mark on the template each time an electronic component C is mounted. This reduces productivity because it takes extra time to recognize the mark on the template and to position the component. Also, the amount of dust generated increases because the distance traveled by the mechanism increases.

In this embodiment, after the images of the marks m and M are captured, the moving distance of the electronic component C and the board S can be reduced, so that positional deviation, reduced productivity, and the amount of dust generation can all be reduced.
(9) The transmission portion includes a transparent plate-like member, so that it is possible to hold the electronic component C and ensure transparent imaging of the mark M on the substrate S in a narrow area corresponding to the size of the microscopic electronic component C.
(10) The first imaging unit 4 and the second imaging unit 5 are fixed to the mounting position OA. Therefore, there is no misalignment between the imaging area of the first imaging unit 4 and the imaging area of the second imaging unit 5, and dust generation due to movement can be prevented.
[Modification]
The supply unit 6 is not limited to a device that supplies electronic components C attached to a wafer sheet WS. For example, it may be a device that supplies electronic components C arranged on a tray. The transfer mechanism 73 may be configured to pick up and transfer electronic components C individually from the supply unit 6. For this reason, the arm unit 72 may be configured to move in the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move in the X-axis and Y-axis directions.

In the transfer mechanism 73, the drive unit that drives the arm unit 72 is not limited to a mechanism that uses a linear motor as a drive source. It may be a mechanism using a ball screw or a belt that uses a motor with a rotating shaft as a drive source. In the case of such a mechanism, since it includes a sliding part, it is preferable to provide it at a position that does not overlap with the mounting surface F in a planar view. Furthermore, it is preferable to provide the sliding part at a position lower than the height position of the mounting surface F. Note that, when there are multiple sliding parts, some of the sliding parts do not have to be provided at a position that does not overlap with the mounting surface F in a planar view. Also, some of the sliding parts do not have to be provided at a position lower than the height position of the mounting surface F. In such a case, it is preferable to provide a shield such as an exterior, a wall, or other components between the sliding part and the mounting surface F. It is also preferable to increase the distance between the sliding part and the mounting surface F.

The mounting head 31 may be configured such that the second imaging unit 5 can image the mark M on the substrate S. Therefore, it is not necessary to form the mounting head 31 from a transparent material, and a through hole may be formed at a location corresponding to the mark M. More specifically, the holding portion 31b may be formed from an opaque material, and a through hole may be formed at a location corresponding to the mark M, or the hollow portion 31a may not exist, the holding portion 31b may be formed from an opaque material, and a through hole may be formed at a location corresponding to the mark M of the mounting head 31 and the holding portion 31b. The mounting head 31 may also move in order to transfer the electronic component C.

The first imaging unit 4 and the second imaging unit 5 may be provided so as to be movable relative to the position (mounting position OA) where the electronic component C is mounted. In other words, if it is not possible to simultaneously image the multiple marks m of the electronic component C or the multiple marks M of the board S, the first imaging unit 4 and the second imaging unit 5 may be configured to move between the marks m or between the marks M to capture the images. In other words, the first imaging unit 4 may be provided with a moving device for moving between the marks m, and the second imaging unit 5 may be provided with a moving device for moving between the marks M. Even in this case, the moving distance is short and remains within the range of the size of the mounting area B of the electronic component C or the board S, so errors and dust generation can be suppressed.

In addition, the position of mark m of electronic component C and the position of mark M of mounting area B of substrate S are aligned to their respective reference positions, but this is not limited to the above, and the position of mounting area B may be aligned to the position of electronic component C, or the position of electronic component C may be aligned to the position of mounting area B. The point is that it is sufficient to be able to align the position of mounting area B of substrate S with the position of electronic component C.

Furthermore, the board S may be transferred to and from the stage 21 of the board support mechanism 2 at the mounting position OA. In this case, after the board S is supplied to the stage 21, the board S may be retracted from the mounting position OA before the first imaging unit 4 captures an image of the mark m of the electronic component C.
[Other embodiments]
Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims.

REFERENCE SIGNS LIST 1 mounting device 2 substrate support mechanism 3 mounting mechanism 4 first imaging section 5 second imaging section 6 supply section 7 transport section 8 control device 11 support base 11a accommodation hole 21 stage 22 drive mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b guide rail 23 moving plate 23a through hole 31 mounting head 31a hollow section 31b holding section 32 drive mechanism 33, 34, 35 moving body 61 support mechanism 61a ring holder 62 drive mechanism 71 transport head 71a suction nozzle 71b inversion drive section 72 arm section 72a extension section 72b base section 73 transport mechanism 731 fixed body 732 first drive section 732a first drive source 732b First sliding part 733 Moving body 734 Second driving part 734a Second driving source 734b Second sliding part

The electronic component mounting device of the present invention has a mounting mechanism for mounting an electronic component on a board at a mounting position, a board support mechanism for supporting the board on which the electronic component is to be mounted, a supply unit for supplying the electronic components, and a transfer unit for transferring the electronic components from the supply unit to the mounting position, the transfer unit having a transfer head for picking up the electronic components from a placement surface of the electronic components in the supply unit and delivering them to the mounting head, an arm unit having the transfer head at one end, and a sliding part provided at a position that does not overlap the placement surface in a plan view , and a transfer mechanism for moving the transfer head between the supply unit and the mounting position by driving the arm unit in accordance with the sliding of the sliding part, The mounting head is provided to the mounting mechanism and has a transparent portion that allows the mark on the board to be recognized through a transmission portion while holding the electronic component, and is arranged below the board support mechanism at a mounting position where the mounting head mounts the electronic component on the board, and has a first imaging portion that images the mark of the electronic component held by the mounting head while the board is retracted from the mounting position, a second imaging portion that is arranged above the mounting head at the mounting position and images the mark on the board through the transparent portion, and a positioning mechanism that positions the board and the electronic component based on positions of the board and the electronic component determined from images of the marks imaged by the first imaging portion and the second imaging portion.

Claims (6)

a mounting mechanism in which a mounting head holds an electronic component and mounts the electronic component on a board at a mounting position;
a substrate support mechanism for supporting the substrate on which the electronic components are mounted;
a supply unit that supplies the electronic components;
a transfer section that transfers the electronic components from the supply section to the mounting position;
having
The transport unit includes:
a transfer head that picks up the electronic components from a placement surface of the electronic components in the supply section and transfers the electronic components to the mounting head;
an arm portion having the transfer head at one end;
a transfer mechanism that has a sliding part provided at a position that does not overlap with the placement surface in a plan view, and that moves the transfer head between the supply part and the mounting position by driving the arm part in accordance with the sliding of the sliding part;
An electronic component mounting device comprising: The electronic component mounting device according to claim 1, characterized in that the sliding portion is located at a position lower than the height position of the mounting surface. the transfer head has a suction nozzle that sucks the electronic component by negative pressure,
3. The electronic component mounting device according to claim 1, wherein a tube for supplying negative pressure to said suction nozzle is built into said arm portion. the transfer head is a reversing head that is driven by a motor and reverses the electronic component;
4. The electronic component mounting device according to claim 1, wherein a cable for supplying power to the motor is built into the arm portion. The sliding portion is
The movable member has a first sliding portion and a second sliding portion that slide linearly along two orthogonal axes,
5. The electronic component mounting device according to claim 1, wherein the first sliding portion and the second sliding portion are disposed on two side surfaces of a common moving body. the mounting head is provided in the mounting mechanism and has a transmission portion that allows a mark on the board to be recognized through transmission while holding the electronic component;
a first imaging unit that is disposed below the board support mechanism at a mounting position where the mounting head mounts the electronic component on the board, and that images an image of a mark of the electronic component held by the mounting head in a state where the board is retracted from the mounting position;
a second imaging unit that is disposed above the mounting head at the mounting position and that images the mark on the board through the transmission unit;
a positioning mechanism that performs positioning of the board and the electronic component based on positions of the board and the electronic component obtained from images of marks captured by the first imaging unit and the second imaging unit;
6. The electronic component mounting apparatus according to claim 1, further comprising:

Images