TWI835316B - Operating device, installation device and installation method of electronic components - Google Patents

Abstract

The present invention provides an operating device, an installation device, and an installation method for electronic parts that can pick up electronic parts in a non-contact manner and position the electronic parts at an installation position. The operation device of the embodiment includes: a mounting head for mounting electronic components on a substrate at a mounting position; and a pick-up collet including a porous member and a guide part. The porous member ejects gas and passes through the suction hole. The negative pressure holds the electronic parts in a non-contact manner, the guide part limits the movement of the electronic parts, the pick-up collet picks up the electronic parts from the supply part and transfers them to the mounting head; the reverse drive part makes the pick-up tube The clamp is reversed; the transfer mechanism transfers the pick-up collet to the mounting head; the component side imaging unit captures the appearance of the reversed electronic component; and the positioning mechanism positions the mounting head to the electronic component based on the captured appearance of the electronic component. parts, and after transferring the electronic parts to the mounting head, position the mounting head in the mounting position.

Description

Operating device, installation device and installation method of electronic components

The invention relates to an operating device for electronic parts, an installation device for electronic parts, and an installation method for electronic parts.

When electronic components, such as logic devices, memories, and image sensors, which are semiconductor elements, are mounted on a substrate, the wafer on which the semiconductor elements are formed is cut into individual wafers. Then, the wafers are picked up one by one by a transfer device, transferred to the substrate, and mounted using a mounting mechanism. Various devices have been proposed as mounting devices used when mounting such semiconductors on a substrate. As one of them, a device including an operating device for electronic components such as wafers, a supply unit, a substrate supporting mechanism, and a control device for these is known. Furthermore, the operating device is provided with a mounting mechanism, a substrate side imaging unit, a component side imaging unit, and a transfer device. The transfer device picks up electronic components from the supply device and delivers the picked-up electronic components to the mounting device.

One surface of the wafer becomes a functional surface on which fine circuits are formed. When the wafer is picked up from the wafer, if the picked-up member comes into direct contact with the functional surface, there is a risk of damage to the circuit, etc., so there is a demand to avoid contact.

Furthermore, the connection terminals on the surface of the wafer and the connection terminals on the substrate are joined to face each other. At this time, in order to ensure and improve the bonding properties between the connection terminals, the surface of the wafer may be subjected to surface treatment such as plasma treatment or surface activation treatment. In order to maintain the surface condition of the wafer subjected to such processing, there is also a requirement to avoid direct contact between the picked-up member and the surface of the wafer.

In order to cope with the requirement that the member does not come into contact with the surface of the wafer, conventionally, in a collet as a member for picking up a wafer, the surface holding the wafer is made into a tapered surface, so that only the peripheral portion of the collet is tapered with the collet, not the surface of the wafer. The state of surface contact is sucked and maintained from the center of the wafer (see Patent Document 1). [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. Sho 63-124746

[Problem to be solved by the invention] However, in the conventional technology as described above, only the peripheral portion of the wafer comes into contact with the collet, and suction is performed from the center portion of the wafer. Therefore, the wafer is prone to strain, which may lead to chip defects or cracks. Furthermore, the collet is in contact with the peripheral edge portion of the wafer, and the contact portion is used to support the sucked wafer. Therefore, stress is concentrated on the peripheral portion, which easily causes defects and cracks. Furthermore, since the holding position of the wafer is fixed in the suction-holding state, if the wafer is shifted or tilted during the suction-holding, it cannot be corrected when it is later transferred to the mounting device.

Embodiments of the present invention are proposed to solve the above-mentioned problems, and an object thereof is to provide an electronic component operating device, an electronic component mounting device, and an electronic component operating device that can pick up electronic components in a non-contact manner and position the mounting position. How to install electronic components.

[Technical means to solve problems] An electronic component operating device according to an embodiment of the present invention includes: a mounting head for mounting electronic components on a substrate at a mounting position; a pickup collet including a porous member that ejects gas from pores and a guide portion; And the electronic parts are held in a non-contact manner by the negative pressure of the suction hole, the guide portion restricts the movement of the electronic parts held in a non-contact manner, and the pickup collet is supplied from the supply of the electronic parts The electronic part is picked up by the part and transferred to the mounting head; the reversal drive part is used to reverse the pickup collet from the supply position; the transfer mechanism is used to transfer the electronic parts between the supply part and the mounting head. the pickup collet; a component-side imaging unit that photographs the appearance of the electronic component held by the inverted pickup collet; and a positioning mechanism based on the appearance of the electronic component photographed by the component-side imaging unit , position the mounting head on the electronic component held by the pickup collet, and after transferring the electronic component from the pickup collet to the mounting head, position the mounting head on the mounting Location.

An electronic component mounting device according to an embodiment of the present invention includes a mounting mechanism that includes an operating device for the electronic component, and the electronic component positioned by the positioning mechanism is mounted on the mounting position. substrate.

The mounting method of electronic components according to the embodiment of the present invention is an installation method for positioning and mounting a substrate and electronic components. A pick-up collet including a porous member and a guide portion picks up the electronic components from a supply portion of the electronic components, The porous member ejects gas from the pores and holds the electronic components in a non-contact manner through the negative pressure of the suction holes. The guide portion restricts the movement of the held electronic components and reverses the movement. The drive unit reverses the pickup collet that picked up the electronic component, and the transfer mechanism transfers the pickup collet that picked up the electronic component to a mounting head for mounting the electronic component on the substrate. The component The side imaging unit photographs the outer shape of the electronic component held by the inverted pickup collet, and the positioning mechanism positions the mounting head based on the outer shape of the electronic component photographed by the component side imaging unit. The electronic components held by the pickup collet are transferred from the pickup collet to the mounting head through the relative movement of the pickup collet and the mounting head. The positioning mechanism The mounting head with the electronic component delivered and held is positioned at a mounting position for mounting the electronic component on the substrate, and the substrate is retracted from the mounting position by the substrate support mechanism. Next, the substrate-side imaging unit captures an image of the mark of the electronic component held by the mounting head, and the component-side imaging unit captures an image of the mark of the substrate positioned at the mounting position by the substrate support mechanism. , the positioning mechanism performs the positioning of the substrate and the electronic component based on the positions of the substrate and the electronic component calculated from the image of the mark captured by the component-side imaging unit and the substrate-side imaging unit. Positioning of electronic parts.

[Effects of the invention] Embodiments of the present invention can provide an electronic component operating device, an electronic component mounting device, and an electronic component mounting method that can pick up electronic components in a non-contact manner and position the electronic components at a mounting position.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2 , this embodiment is a mounting device 1 for mounting an electronic component C on a substrate S. FIG. 1 is a front view showing the schematic structure of the mounting device 1 . FIG. 2 is a plan view showing the electronic component C and the substrate S. FIG. In addition, the drawings are schematic diagrams, and the dimensions (hereinafter also referred to as sizes) and shapes of each part, the ratio of mutual dimensions of each part, etc. may differ from reality.

[Electronic parts] First, the electronic component C used as the mounting object in this embodiment may be a semiconductor element such as an integrated circuit (IC) or a large scale integrated circuit (LSI). As shown in FIG. 2 , this embodiment uses a rectangular parallelepiped-shaped semiconductor wafer as a semiconductor element. A semiconductor wafer is a bare wafer that is singulated by cutting the semiconductor wafer into small square dice. One side of the bare chip has a functional side that functions as a semiconductor element. Bumps or bumpless electrodes are provided on the functional surface side, and are mounted by flip-chip connection to electrode pads on the substrate S.

The electronic component C is provided with a plurality of marks m for positioning. In this embodiment, two marks m are provided, one each at a pair of opposite corner portions of the rectangular electronic component C. The mark m is provided on the surface of the electronic component C on which the electrode is formed, that is, the face. This embodiment is an example of a face-down mounting device for mounting the surface side toward the substrate S.

[Substrate] In this embodiment, as shown in FIG. 2 , the substrate S on which the electronic component C is mounted is a resin plate-shaped member on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed. The substrate S is provided with a mounting area B, which is an area where the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In this embodiment, two marks M are provided outside the mounting area B at positions corresponding to the marks m of the electronic component C.

[install device] The mounting device 1 of this embodiment is a mounting device 1 that can achieve high-precision mounting, for example, a mounting accuracy of ±0.2 μm or less. As shown in FIGS. 1 , 3(A) and 3(B) , it has a substrate. Support mechanism 2 , mounting mechanism 3 , substrate side imaging unit 4 , component side imaging unit 5 , supply unit 6 , transfer device 7 , and control device 8 . The operating device is used in such a mounting device 1 and includes a part or all of the mounting mechanism 3 , the board-side imaging unit 4 , the component-side imaging unit 5 , and the transfer device 7 . (A) of FIG. 3 is a plan view of the mounting device 1 , and (B) of FIG. 3 is a plan view showing a mark M through which a mounting head 31 described below is transmitted.

In addition, in the following description, the direction in which the mounting mechanism 3 moves in order to mount the electronic component C on the substrate S is referred to as the Z axis, and two axes orthogonal to each other in a plane orthogonal thereto are referred to as the X axis and the Y axis. axis. In this embodiment, the Z-axis is vertical, the direction along the gravity is called downward, the direction against gravity is called upward, and the position on the Z-axis is called height. Moreover, the X-axis and the Y-axis are on a horizontal plane. When viewed from the front side of FIG. 1 , the X-axis is in the left-right direction and the Y-axis is in the depth direction. However, the present invention is not limited to the installation direction. Regardless of the installation direction, with the substrate S or the substrate support mechanism 2 as a reference, the side on which the electronic component C is mounted is called the upper side, and the opposite side is called the lower side.

The substrate support mechanism 2 is a mechanism that supports the substrate S on which the electronic component C is mounted, and is a so-called substrate stage. The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31 . The mounting head 31 has a transmissive part capable of transmitting and recognizing the mark M of the substrate S facing the electronic component C while holding the electronic component C.

The substrate-side imaging unit 4 is disposed on the mounting head 31 to mount the electronic component C on the lower side of the substrate support mechanism 2 at the mounting position OA of the substrate S. In a state where the substrate S is evacuated from the mounting position OA by the substrate supporting mechanism 2, The mark m of the electronic component C held by the mounting head 31 is photographed from a position facing the electronic component C, that is, from below. The mounting position OA is a position where the electronic component C is mounted on the substrate S. In the figure, it is a single point along the Z-axis direction passing through a point (for example, the center point) on the XY coordinates in the area where the electronic component C is mounted. Indicated by underlining. As described below, the mounting position OA coincides with the optical axes of the cameras of the substrate-side imaging unit 4 and the component-side imaging unit 5 .

The component-side imaging unit 5 is disposed above the mounting head 31 in the mounting position OA, and captures the mark M of the substrate S through the transmission part of the mounting head 31 (hereinafter, this case is referred to as "photography through the mounting head 31"). . Based on the image captured in the above manner, the mark m and the mark M can be detected, that is, the mark m and the mark M can be identified. Furthermore, the component-side imaging unit 5 photographs the outer shape of the electronic component C held by the pickup collet 700 of the transfer head 71 described below via the mounting head 31 .

In addition, the substrate support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism positions the mounting head 31 relative to the electronic component C held by the pickup collet 700 based on the outer shape of the electronic component C captured by the component-side imaging unit 5 . Furthermore, the positioning mechanism performs the positioning of the substrate S and the electronic component C by the mounting head 31 based on the positions of the substrate S and the electronic component C calculated from the mark m and the image of the mark M captured by the substrate side imaging unit 4 and the component side imaging unit 5 . Maintain the positioning of electronic component C. Each component of the mounting device 1 as described above is mounted on the support base 11 provided on the installation surface. The top surface of the support base 11 becomes a horizontal surface.

The supply unit 6 supplies electronic components C. The transfer device 7 transfers the electronic component C from the supply unit 6 to the mounting position OA. The transfer device 7 has a transfer head 71 and a transfer mechanism 73 . The transfer head 71 picks up the electronic component C from the supply unit 6 , reverses it, and transfers it to the mounting head 31 . The transfer mechanism 73 moves the transfer head 71 in the space formed by retracting the substrate S from the mounting position OA by the substrate support mechanism 2, and positions it at the mounting position OA.

The control device 8 controls the operation of the mounting device 1 . The control device 8 includes, for example, an electronic circuit or a computer running a predetermined program. That is, the control device 8 uses a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU) to read programs and data from the storage device to execute the installation device 1 control. Each part is explained in detail below.

(Substrate support mechanism) As shown in (A) of FIG. 1 and FIG. 3 , the substrate supporting mechanism 2 is arranged on the supporting table 11 and has a stage 21 and a driving mechanism 22 . The stage 21 is a plate-shaped member on which the substrate S is placed. The driving mechanism 22 is a biaxial moving mechanism, for example, having an X-axis direction guide rail 22a and a Y-axis direction guide rail 22b. It uses a motor (not shown) as a driving source and moves the stage 21 in a horizontal plane through a conveyor belt or a ball screw. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. In addition, although illustration is omitted, the drive mechanism 22 includes a θ drive mechanism that rotates the stage 21 in a horizontal plane.

The drive mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along the guide rail 22b. A through hole 23 a is formed in the movable plate 23 so that the substrate side imaging unit 4 can image the electronic component C.

In addition, although not shown in the figure, one of the moving ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the moving end on the right side in the figure) is provided with a device for supplying/storing the substrate S on the stage. 21 loader/unloader. Therefore, the substrate support mechanism 2 receives the substrate S supplied from the loader or transfers the substrate S to the unloader while moving the stage 21 to the moving end.

(installation mechanism) The mounting mechanism 3 has a mounting head 31 and a driving mechanism 32 . The mounting head 31 has a substantially rectangular parallelepiped shape and has a hollow portion 31a as a transmission portion and a holding portion 31b. The hollow portion 31a is a cylindrical through hole formed with the Z-axis direction as an axis. The holding part 31b is a plate-shaped member through which light for imaging can transmit, and is attached so as to close the opening of the hollow part 31a toward the substrate S side. For example, a transparent glass plate is used as the holding part 31b. The holding part 31b is a so-called mounting tool and holds the electronic component C.

As shown in FIG. 3(B) , an adsorption area D for adsorbing and holding the electronic component C is provided in the center of the holding portion 31 b. In the figure, the adsorption area D and its center line are represented by double-dot dash lines. The adsorption area D is a position where the electronic component C is held by the holding portion 31b. Although not shown in the figure, adsorption holes are formed in the adsorption region D. A flow path for connecting the adsorption hole to the negative pressure source is formed inside the holding portion 31b, and is provided so that the electronic component C can be adsorbed and held by generating a negative pressure in the adsorption hole. The adsorption area D of the holding portion 31 b and its surroundings become a transmission area T capable of photographing the electronic component C held by the pickup collet 700 . Furthermore, even when the electronic component C is attracted to the adsorption area D, the mark M of the imaging substrate S can be transmitted through the transmission area T around the adsorption area D. That is, the mounting head 31 has a transparent portion so that the outer shape of the electronic component C and the mark M of the substrate S can be photographed by the component-side imaging unit 5 . In addition, the holding surface (adsorption surface) of the holding part 31b holding the electronic component C is called a lower end surface.

The driving mechanism 32 is composed of a moving body 33 , a moving body 34 , and a moving body 35 , and is a mechanism that drives the mounting head 31 . The moving body 33 is provided movably along the guide rail 33 a provided in the Y-axis direction of the support base 11 . The moving body 34 is provided movably along the X-axis direction guide rail 34 a provided on the top surface of the moving body 33 . The moving body 35 is provided movably along the Z-axis direction guide rail 35a provided on the front surface of the moving body 34 . The moving body 35 is formed in a substantially concave shape in plan view. These moving bodies 33 , 34 , and 35 are driven by a ball screw, a linear motor, a pressure cylinder, or the like using a motor as a driving source.

The mounting head 31 is provided at the lower part of the moving body 35 that moves in the Z-axis direction. Therefore, the moving body 35 performs an operation for mounting the electronic component C held by the holding portion 31 b of the mounting head 31 on the substrate S. Furthermore, the moving body 35 provided with the mounting head 31 moves along the X-axis direction and the Y-axis direction by the movement of the moving body 33 and the moving body 34 . Therefore, the drive mechanism 32 functions as a positioning mechanism for positioning the electronic component C held by the mounting head 31 . In addition, although illustration is omitted, the drive mechanism 32 includes a θ drive mechanism that rotates the mounting head 31 in a horizontal plane.

In addition, in this embodiment, from the viewpoint of preventing movement errors, it is preferable to set the movement amounts in the X-axis direction, Y-axis direction, and Z-axis direction by the drive mechanism 32 to be as short as possible. For example, the movement amounts of the moving body 33 and the moving body 34 in the X-axis direction and the Y-axis direction are respectively set to several millimeters to more than ten millimeters. Furthermore, the amount of movement of the moving body 35 in the Z-axis direction is also set to about several millimeters to about ten millimeters. That is, the mounting head 31 is at a height position where the lower end surface of the holding portion 31 b is facing away from the upper surface of the substrate S placed on the stage 21 by several millimeters, for example, 1 mm to 2 mm (separation distance in the vertical direction). The electronic component C is received or the mark m of the received electronic component C is photographed. Therefore, the amount of movement of the movable body 35 in the Z-axis direction is sufficient to ensure that the electronic component C held by the holding portion 31 b can be mounted on the substrate S by pressing with a predetermined pressure from the height position.

(Substrate side imaging unit) The substrate-side imaging unit 4 has a camera, a lens, a lens barrel, a light source, etc., and is fixed to the receiving hole 11 a provided in the support base 11 . The board-side imaging unit 4 arranges the optical axis of the camera in a direction in which the mark m of the electronic component C held by the mounting head 31 can be photographed. Specifically, it is arranged so that the optical axis becomes a vertical direction. In this embodiment, the substrate-side imaging unit 4 is arranged upward in the accommodation hole 11 a of the support base 11 located below the substrate support mechanism 2 with the optical axis of the camera aligned with the mounting position OA. When facing the mounting head 31 in order to transfer the electronic component C to the pickup collet 700 , the substrate-side imaging unit 4 is fixed to the support base 11 so that the electronic component C falls into the imaging field of view. Furthermore, the board-side imaging unit 4 sets the imaging magnification so that the accuracy of imaging the mark m of the electronic component C held by the mounting head 31 and recognizing the position becomes required accuracy. Of course, there is a visual field range sufficient to capture the mark m. Furthermore, the visual field range is set taking into consideration the unevenness of the position at which the electronic component C is held by the mounting head 31, that is, the holding position accuracy. Furthermore, when a plurality of marks m are photographed and the position of the electronic component C held by the mounting head 31 is recognized, the field of view range may be such that a plurality of marks m can be photographed simultaneously. This magnification or field of view range can be appropriately determined based on the required positioning accuracy.

(Parts side photography department) The component-side imaging unit 5 has a camera, a lens, a barrel, a light source, etc., and is supported by a frame or the like (not shown) above the support base 11 , more specifically above the mounting head 31 . The component-side imaging unit 5 arranges the optical axis of the camera in a direction that can transmit the holding portion 31 b of the mounting head 31 and image the mark M around the mounting area B of the substrate S. That is, in this embodiment, the component-side imaging unit 5 is disposed facing downward at a position directly above the mounting head 31 in a state where the optical axis of the camera coincides with the mounting position OA. The component-side imaging unit 5 sets the imaging magnification so that the accuracy of identifying the position of the mark M marked on the mounting area B of the substrate S placed on the stage 21 becomes the required accuracy. At the same time, the imaging field of view of the component-side imaging unit 5 is set so as to include two marks M marked on opposite corners of the mounting area B of the substrate S. Furthermore, the range of the imaging field of view is also set taking into consideration the unevenness of the position where the substrate S is placed on the stage 21, that is, the placement position accuracy.

Furthermore, the component-side imaging unit 5 can photograph the outer appearance of the electronic component C in a state where the pickup collet 700 faces the mounting head 31 in order to transfer the electronic component C. Therefore, the imaging field of view of the component-side imaging unit 5 is also set taking into account the maximum movable range of the electronic component C held in the pickup collet 700 . At this time, compared with the outer dimensions of the electronic component C, the area formed by the two marks M marked on the opposite corners of the mounting area B of the substrate S is larger, so Rongguang takes the image with the same component-side imaging unit 5 The appearance of two marks M and electronic component C. However, when the imaging magnification and the imaging field of view are very different for the identification accuracy required for the substrate S and the imaging magnification and the imaging field of view for the identification accuracy for the outer shape of the electronic component C, the magnification can be appropriately determined using, for example, a zoom lens. and shooting field of view. Furthermore, if necessary, a focusing mechanism such as a lens moving mechanism or a lens barrel moving mechanism may be provided to adjust the focus position that moves with the magnification change. In addition, when the component-side imaging unit 5 photographs the outer shape of the electronic component C, it is preferable to set the height position of the surface of the electronic component C to be the same as the height position of the surface of the substrate S on which the mark M is present. This eliminates the need to adjust the focus position when photographing the appearance of the electronic component C.

(Supply Department) The supply part 6 has a support mechanism 61 and a drive mechanism 62 . The support mechanism 61 is a device that supports the wafer WS on which the electronic component C is attached. The driving mechanism 62 moves the support mechanism 61 along the X-axis direction and the Y-axis direction. The surface (region) in the supply part 6 on which the electronic component C is mounted is called a mounting surface F. In this embodiment, the electronic component C is obtained by dividing a wafer attached to the wafer WS into individual pieces by dicing. Therefore, the surface of the wafer WS on which the electronic component C is attached (wafer surface) is the mounting surface F. The wafer WS is attached to a wafer ring (not shown). The support mechanism 61 has a ring holder 61a to which a patch ring is mounted. That is, the surface of the support mechanism 61 that supports the wafer WS can also be considered as the mounting surface F.

In addition, although not shown in the figure, one of the moving ends in the Y-axis direction of the support mechanism 61 (specifically, the moving end on the front side in the figure) is provided with a device for supplying/storing patch rings to the ring holder 61a. Loader/Unloader. The support mechanism 61 receives the patch ring supplied from the loader or transfers the patch ring to the unloader in a state of moving to the moving end.

Furthermore, although not shown in the figure, the support mechanism 61 has an expansion mechanism that creates a gap between the electronic components C by stretching the wafer WS, and clamps the stretched wafer WS to individually mount the electronic components C. A push-up mechanism that pushes and separates. Furthermore, the support mechanism 61 includes a θ drive mechanism that rotates the ring holder 61a in a horizontal plane. In addition, the push-up mechanism is fixedly arranged on the support base 11 , and the electronic component C is received, that is, picked up, from the supply unit 6 by the transfer device 7 at the above-mentioned position (supply position).

The drive mechanism 62 moves the support mechanism 61 in a predetermined direction. For example, the driving mechanism 62 has a guide rail 62a in the X-axis direction and a guide rail 62b in the Y-axis direction, and uses a motor (not shown) as a driving source to move the support mechanism 61 along the X-axis and Y-axis in the horizontal plane through a conveyor belt or a ball screw. direction movement. The drive mechanism 62 functions as a positioning mechanism for positioning the electronic component C with respect to the transfer head 71 . In addition, the drive mechanism 62 is arranged at a lower position than the height position L of the mounting surface F (see FIG. 5 ).

(transfer device) The transfer device 7 transfers the electronic component C to the mounting device 1 . The transfer device 7 has a transfer head 71 , an arm 72 , and a transfer mechanism 73 . As shown in FIG. 3(A) , the transfer head 71 has a pickup collet 700 and a reversal drive unit 710 . As shown in FIGS. 4(A) to 6 , the pick-up collet 700 is a member that suction-holds the electronic components C and releases the electronic components C by releasing the suction-holding. The pickup collet 700 has a porous member 701, a base 702, and a guide part 703. In this embodiment, the transfer device 7 moves the pickup collet 700 and transfers the electronic component C to the mounting head 31 . However, the movement for handover only needs to be relative movement, and either or both of the pickup collet 700 and the mounting head 31 can move.

The porous member 701 is a member that has air permeability and supplies gas supplied to the inside through the pores of the opposing surface 701 a facing the electronic component C (in addition, in the following description, the gas supplied to the electronic component C is denoted by the symbol G (illustrated). The porous member 701 of this embodiment has a rectangular parallelepiped plate shape, and is densely and substantially uniformly formed with interconnected fine spaces as a whole. The porous member 701 has air permeability due to the above-mentioned structure, but its flow conductivity is very small. Either surface of the porous member 701 serves as the opposing surface 701a. If gas is supplied into the interior from the back surface 701b opposite to the opposing surface 701a, the gas will be ejected from the dense and uniform pores on the opposing surface 701a. The discharge is a substantially planar discharge that spreads over the entire surface of the facing surface 701 a of the discharge. The ejection is extremely slow, and it can be said to be an oozing feeling, to the extent that you can feel the airflow slightly when you get close to your finger. In addition, pores on surfaces other than the opposing surface 701a and the back surface 701b may be clogged.

The porous member 701 is a continuous structure in which pores serving as internal microspaces are connected to each other and gas can pass between the pores as described above. As this porous member 701, sintered metal, ceramics, resin, etc. can be used. From the viewpoint that the particles inside are difficult to separate and flow out, it is preferable to use sintered metal.

Furthermore, as shown in FIGS. 4(A), 4(B), and 5, the porous member 701 is provided with a suction hole 701c having an opening 701d on the opposing surface 701a and passing through it. The through hole of the electronic component C is sucked by negative pressure. The suction hole 701c of this embodiment linearly penetrates from the center of the back surface 701b to the center of the opposing surface 701a.

The base 702 is a member that covers the surfaces of the porous member 701 other than the facing surface 701a. The base 702 of this embodiment is a rectangular parallelepiped box with an open bottom. The porous member 701 is inserted from the opening of the base 702 so that the bottom surface becomes the facing surface 701a and is exposed, and is assembled into the base 702 and fixed.

As shown in FIG. 4(A), FIG. 4(B), and FIG. 6, an air supply hole 702a, an exhaust hole 702b, and a mounting hole 702c are provided on the top surface of the base 702. The air supply hole 702a is a through hole for supplying air to the porous member 701. The air supply hole 702a is formed close to the outer edge of the base 702 by a pipe connected to the air supply hole 702a. The exhaust hole 702b is a through hole for generating negative pressure in the opening 701d via the suction hole 701c. The exhaust hole 702b extends downward and is formed to coincide with the suction hole 701c of the porous member 701. A space in which gas accumulates is formed between the inner surface of the base 702 and the porous member 701 around the exhaust hole 702b. In addition, the exhaust hole 702b may penetrate the suction hole 701c and reach the opposing surface 701a. In this case, the suction hole 701c and the opening 701d of the porous member 701 are provided in close contact with the outside of the exhaust hole 702b reaching the facing surface 701a of the porous member 701. The mounting hole 702c is a pair of recessed holes for preventing deviation when connecting to the attachment and detachment portion 704 described below.

The gas supply hole 702a is connected to a gas supply circuit via a pipe (not shown). The supply circuit is composed of a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member 701 via the gas supply hole 702a is an inert gas. The exhaust hole 702b is connected to a negative pressure generating circuit including a vacuum pump, a valve, and the like via piping (not shown).

The guide portion 703 is a member arranged along the four sides of the side surface of the rectangular base 702 so as to follow the outer edge of the electronic component C, and restricts the movement of the electronic component C held by the opposing surface 701a. For example, as shown in FIG. 4(A), FIG. 4(B), FIG. 5, and FIG. 6, the guide portion 703 is provided along the four side surfaces of the base 702, that is, the four sides of the rectangular facing surface 701a. Multiple plates. In this embodiment, one guide portion 703 is provided on each side of the opposing surface 701a, but the guide portion 703 is not limited to this. Furthermore, the outer edge of the pickup collet 700 formed of the base 702 is not limited to a rectangular shape. The guide portion 703 only needs to be arranged in a direction along the outer edge of the electronic component C in a manner that can restrict the movement of the electronic component C, and is not limited to the form arranged along the side surface of the base 702 .

Each guide portion 703 has a protruding portion protruding from the opposing surface 701a. The distance (protrusion amount) of the guide portion 703 from the facing surface 701a is sufficient to restrict the movement of the electronic component C held by the facing surface 701a across the gas layer, and is at least from the facing surface 701a to the electrons held across the gas layer. Part C or above is enough. However, when the protruding portion of the guide portion 703 exceeds the protruding distance of the electronic component C held by the opposing surface 701a across the gas layer, it is necessary to consider avoiding contact with the picked-up electrons when picking up the wafer. Part C is in contact with the surrounding electronic parts C. Therefore, the distance by which the protruding portion of the guide portion 703 protrudes from the facing surface 701a is preferably within the side surface of the electronic component C held by the facing surface 701a via the gas layer. However, before the pickup collet 700 approaches the wafer WS for picking, the electronic components C are individually pushed up through the wafer WS by the push-up mechanism. This can cope with various protrusion amounts and avoid contact with the surrounding electronic components. C contact.

In addition, in the following description, one of the orthogonal guide parts 703 is referred to as 703K and 703L, and the other orthogonal guide part 703 is referred to as 703M and 703N. Description will be made in the form of lead 703. The term "orthogonal" here includes the case where two guide portions 703 on adjacent sides are in contact or continuous to form a right angle, and also includes the case where there are multiple guide portions 703 on one side and the guide portions 703 are separated. The case where the straight lines (planes) along which the two are intersecting are orthogonal (see FIG. 14(A) and FIG. 14(B) ).

As shown in FIGS. 7(A) and 7(B) , the reversal drive unit 710 reverses the electronic component C adsorbed by the pickup collet 700 in the up and down direction. That is, the pickup collet 700 is provided so as to be rotatable between the direction toward the wafer WS and the direction toward the mounting head 31 by the reversal drive unit 710 . The reverse drive unit 710 may use a rotation motor, for example.

The pick-up collet 700 is attached to the reversal drive part 710 via the rotating body 720 and the attachment and detachment part 704 . The rotating body 720 is connected to the inversion driving part 710 and is provided rotatably about the axis in the Y direction. The attachment and detachment part 704 is attached to the rotating body 720, and is provided rotatably together with the rotating body 720. The attachment and detachment portion 704 includes a magnet inside, and the base 702 of the pickup collet 700 is attracted and held by the suction force of the magnet. As shown in FIGS. 5 and 6 , a pair of pins 704 a are provided on the contact surface of the attachment and detachment portion 704 with the base 702 . By fitting the pin 704a into the mounting hole 702c provided in the base 702, the pickup collet 700 is prevented from being displaced relative to the attachment and detachment portion 704. In addition, although not shown in the figure, the pipe connected to the exhaust hole 702b passes through the attachment and detachment part 704, and the pipe connected to the air supply hole 702a is supported by the attachment and detachment part 704.

Furthermore, although not shown in the figure, the transfer head 71 has a buffer member that drives the pickup collet 700 in the up-down direction and applies an appropriate load when the front end of the pickup collet 700 comes into contact with the electronic component C, and Absorb excessive loads. As the buffering member, for example, elastic members such as springs and rubber, magnets, air cylinders, dampers, and voice coil motors can be used.

The arm part 72 is a member provided with the transfer head 71 at one end. As shown in FIG. 3(A) , the arm part 72 has an extension part 72a and a base part 72b. The extension portion 72 a is an L-shaped member formed from a rectangular parallelepiped-shaped member extending linearly in the Y-axis direction toward the front and a rectangular parallelepiped-shaped member extending linearly in the X-axis direction toward the mounting mechanism 3 . The reverse driving part 710 is provided at one end of the extension part 72a facing the mounting mechanism 3 so that the rotation axis is in the Y-axis direction. The pickup collet 700 is rotatably installed by attaching the pickup collet 700 to the rotation shaft of the reversing drive unit 710 . The base part 72b is a plate-shaped body parallel to the X-axis direction, and is fixed to the other end of the extension part 72a (see FIGS. 8(A) to 8(D) ).

A tube for supplying negative pressure connected to the pickup collet 700 and a cable for electrical connection connected to the reverse drive unit 710 and the buffer member are built into the arm 72 . The term "built-in" means that it is covered by the outer packaging of the arm portion 72 and is not exposed to the outside. In this embodiment, the tube and the cable are inserted into the hollow portion formed inside the arm portion 72 .

The transfer mechanism 73 drives the arm part 72 to move the transfer head 71 between the supply part 6 and the mounting position OA. The transfer mechanism 73 has a slide portion SL provided at a position not overlapping the placement surface F in a plan view. In other words, the sliding portion SL of the transfer mechanism 73 is provided outside the movement range of the support mechanism 61 . The transfer mechanism 73 drives the arm portion 72 as the slide portion SL slides. The sliding portion SL here refers to a structural portion that moves while the members are in contact with each other. This sliding portion SL becomes a source of dust. As shown in FIG. 5 , the sliding portion SL of this embodiment includes a first sliding portion 732b and a second sliding portion 734b described below. The first sliding portion 732b and the second sliding portion 734b are provided at a lower position (below) than the height position L of the mounting surface F.

As shown in FIGS. 8(A) to 8(D) , the transfer mechanism 73 has a fixed body 731 , a first driving part 732 , a moving body 733 , and a second driving part 734 . The fixed body 731 is a rectangular parallelepiped-shaped member that is fixed to the support base 11 (see FIG. 3(A) ) and extends along the X-axis direction. The position of the fixed body 731 is fixed relative to the installation position OA.

The first driving part 732 drives the arm part 72 along the X-axis direction. The first driving part 732 has a first driving source 732a and a first sliding part 732b. The first drive source 732a is a linear motor extending along the X-axis direction and is provided along the upper surface of the fixed body 731 (surface parallel to the XY plane). The first sliding part 732b is a linear guide extending along the X-axis direction and is provided on the front surface of the fixed body 731 (a surface parallel to the XZ plane). In addition, since the linear motor moves so that the rotor does not come into contact with the stator, the first drive source 732a does not have the sliding portion SL.

The moving body 733 is a rectangular parallelepiped-shaped block, and is configured to move along the X-axis direction along with the operation of the first driving source 732a by mounting the rotor of the first driving source 732a and mounting the slider of the first sliding portion 732b. Slide to move.

The second driving part 734 drives the arm part 72 along the Z-axis direction. The second driving part 734 has a second driving source 734a and a second sliding part 734b. The second drive source 734a is a linear motor extending along the Z-axis direction and is provided on the moving body 733 . The second sliding part 734b is a linear guide extending along the Z-axis direction and is provided on the moving body 733.

The base portion 72b of the arm portion 72 is provided to be slidable in the Z-axis direction by attaching the rotor of the second drive source 734a and attaching the slider of the second sliding portion 734b. In this way, the sliding part SL of this embodiment has the first sliding part 732b and the second sliding part 734b that linearly slide along two orthogonal axes. Furthermore, the first sliding part 732b and the second sliding part 734b are arranged on two side surfaces facing each other at the front and back of the common moving body 733 in a positional relationship that overlaps in the height direction. That is, the positions of the two orthogonal axes are close to each other. Furthermore, it is preferable that the distance between the two side surfaces of the movable body 733 is short, that is, the movable body 733 is preferably thin.

(Relationship between the distance between the substrate on the stage and the mounting head and the size of the transfer head) In this embodiment, as shown in FIG. 1 , in order to move the transfer head 71 to the mounting position OA, the substrate S needs to be retracted. For this purpose, the opposing distance between the substrate S and the mounting head 31 at the mounting position OA is set. In other words, in order to move the transfer head 71 to the mounting position OA, the substrate S needs to be retracted. Therefore, the mounting head 31 is set to a height position close to the upper surface of the substrate S supported by the substrate supporting mechanism 2 when the electronic component C is received at the mounting position OA. height position. More specifically, the distance h between the height position of the upper surface of the substrate S placed on the stage 21 of the substrate support mechanism 2 in the mounting position OA and the lower end surface of the mounting head 31 when receiving the electronic component C is smaller than the arm. The size H in the height direction of the transfer head 71 at the front end of the portion 72 (h<H). Here, as described above, the distance from the lower end surface of the holding portion 31 b to the height position of the upper surface of the substrate S is, for example, several millimeters.

(Arm size) As shown in FIGS. 1 , 3(A) and 7(A) , the width w of the member extending linearly along the Y-axis direction of the extension portion 72a of the arm 72 is linearly linear along the X-axis direction. The width d of the members extending in a shape is longer than the thickness t in the Z-axis direction (w>t, d>t). This suppresses an increase in the size of the arm portion 72 in the height direction, ensures the rigidity of the relatively long arm portion 72 , and stabilizes the position of the electronic component C transferred by the transfer head 71 . By suppressing an increase in the size of the arm portion 72 in the height direction, there is no need to increase the receiving position of the mounting head 31 .

(control device) The control device 8 controls the positioning mechanism so that the adsorption area D is positioned at the position of the outer shape of the electronic component C photographed by the component-side imaging unit 5 . Furthermore, the control device 8 controls the positioning mechanism so that the electronic component C held in the adsorption area D is positioned at the mounting position OA. Furthermore, the control device 8 controls the positioning mechanism to position the substrate S and the electronic component C based on the mark m and the mark M captured by the substrate side imaging unit 4 and the component side imaging unit 5 . That is, in the control device 8, the position corresponding to the designed outer shape of the electronic component C (corresponding to the adsorption area D when the mounting head 31 is in the mounting position OA, that is, the holding position) is corresponding to the position where the electronic component C should be accurately mounted. position), the position on the XY coordinates of the mark m of the electronic component C on the design, and the position on the XY coordinates of the mark M on the designed substrate S are stored in the storage device as respective reference positions.

The reference position may not be a designed position, but may be the position of the outer shape of the electronic component C, the mark m, and the mark when the electronic component C is mounted accurately as a result of a previous trial mounting of the electronic component C on the substrate S. M's position. The control device 8 determines the deviation between the position of the outer shape of the electronic component C captured by the component-side imaging unit 5 and the reference position, and controls the positioning mechanism to move the mounting head 31 in accordance with the direction and movement amount of correcting the deviation ( Drive mechanism 32). Furthermore, the control device 8 obtains the deviation between the mark m captured by the substrate side imaging unit 4 and the mark M captured by the component side imaging unit 5 and the reference position, so as to correct the offset in accordance with the direction and movement amount. The way in which the electronic component C and the substrate S move controls the positioning mechanism (the driving mechanism 22 and the driving mechanism 32).

Furthermore, the control device 8 controls the transfer mechanism 73 of the transfer device 7 and the drive mechanism 62 of the supply unit 6 based on the mapping information indicating the position coordinates of the electronic component C on the wafer WS, thereby picking up the electronic component C. Positioned in the supply position in turn. In addition, the term "picking up" here refers to removing the electronic component C from a member on which the electronic component C is mounted, such as the wafer WS, and receiving it. Furthermore, the control device 8 controls the holding of the electronic component C by the pickup collet 700 using the transfer head 71 , the reversal of the pickup collet 700 by the reversal drive unit 710 , and the transfer head 71 using the transfer mechanism 73 to stand by the mounting head 31 movement of the mounting position OA, transfer of the electronic component C from the pickup collet 700 to the mounting head 31, etc.

[Principle of suction holding using pick-up collet] Next, the principle of sucking and holding the electronic component C by the pickup collet 700 as described above will be described. As shown in FIG. 4(A) , the gas supplied from the gas supply hole 702 a is ejected in a planar shape from the pores of the opposing surface 701 a, thereby forming a gas layer between the electronic component C and the gas. The layer is, for example, 2 μm to 10 μm. Then, with the negative pressure acting on the suction hole 701c through the negative pressure generating circuit, the opposing surface 701a is brought close to the electronic component C, thereby sucking and holding the electronic component C. At this time, since a gas layer is formed between the facing surface 701a and the electronic component C, the facing surface 701a and the electronic component C are maintained in a non-contact state. Furthermore, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure no longer acts on the suction hole 701c, so the electronic component C is released from the pickup collet 700.

[action] The operation of the present embodiment as described above will be described with reference to the explanatory diagrams of FIGS. 7(A) to 11(C) and the flowcharts of FIGS. 12 and 13 in addition to the above-mentioned FIGS. 1 to 6 . In addition, in the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but is retracted together with the stage 21 from the position facing the mounting head 31, that is, the mounting position OA.

[Transfer of electronic parts] The transfer operation of the electronic component C will be described with reference to the explanatory diagrams of FIGS. 7(A) to 9(E) and the flowchart of FIG. 12 . The chip ring with the wafer WS attached is mounted on the ring holder 61 a of the support mechanism 61 in the supply unit 6 using an automatic loader (see FIGS. 3(A) and 3(B) ). Electronic components C divided into individual pieces by dicing are attached to the wafer WS. In addition, in FIGS. 8(A) to 8(D) , illustrations other than the picked-up electronic components C are omitted.

First, as shown in FIG. 8(A) and FIG. 3(A) , the support mechanism 61 moves along the X-axis and Y-axis directions to bring the electronic component C to be the mounting object to the supply position. Then, the arm 72 is moved in the X-axis direction, thereby positioning the front end of the pickup collet 700 of the transfer head 71 at the supply position directly above the electronic component C to be the mounting object (step S101 ).

At this time, the movement of the wafer WS in the X-axis and Y-axis directions is performed by the drive mechanism 62 of the supply unit 6 . The movement of the arm part 72 in the X-axis direction is performed by operating the first drive source 732a of the first drive part 732 so that the moving body 733 moves along the first sliding part 732b.

As shown in (B) of FIG. 8 , a push-up mechanism (not shown) pushes up the electronic component C that becomes the mounting object. Then, the pickup collet 700 of the transfer head 71 picks up the electronic component C (step S102). At this time, pressurized gas is supplied to the porous member 701 of the pickup collet 700 via the gas supply hole 702a, and the gas is blown out from the opposing surface 701a. Furthermore, exhaust is not performed through the exhaust hole 702b, and suction is not performed through the opening 701d. In this way, the pickup collet 700 to which the gas is supplied from the opposing surface 701a descends and approaches the electronic component C. When the pickup collet 700 approaches the electronic component C, the gas on the opposing surface 701a is sandwiched between the opposing surface 701a and the electronic component C, forming a gas layer. The trapped gas layer at this time is considered to be a viscous flow layer. Then, the pickup collet 700 passes through the gas layer that is not further compressed, and stops descending relative to the electronic component C. In this way, while the pickup collet 700 is stopped via the gas layer, the suction by the suction hole 701c is started by exhausting the air from the exhaust hole 702b, so that the electronic component C can be adsorbed and held on the opposing surface 701a.

As described above, the arm 72 moves in the direction approaching the wafer WS. After the pickup collet 700 absorbs and holds the electronic component C, it moves in the direction away from the wafer WS. As a result, as shown in FIG. 8(C) As shown, the electronic component C is separated from the wafer WS.

The movement of the arm portion 72 at this time is performed by operating the second drive source 734a of the second drive portion 734 so that the base portion 72b moves along the second sliding portion 734b. Then, as shown in FIGS. 7(A) , 7(B) , 8(C) , and 8(D) , the reverse drive unit 710 rotates the pickup collet 700 by 180°, thereby causing the electronic Part C is reversed (step S103).

Next, as shown in FIGS. 9(A) and 9(B) , the transfer head 71 is positioned at the mounting position OA by moving the arm 72 in the X-axis direction (step S104 ). That is, the pickup collet 700 of the transfer head 71 reaches the position facing the holding portion 31 b of the mounting head 31 in the mounting mechanism 3 . At this time, the movement of the arm 72 in the X-axis direction is performed by operating the first drive source 732a of the first drive unit 732 and causing the moving body 733 to move along the first sliding unit 732b by a distance from the supply position to the installation position OA. . At this time, the mounting head 31 is waiting at a height position such that the opposing distance between the lower end surface of the holding portion 31 b and the upper surface of the substrate S becomes several millimeters. Furthermore, the height position is maintained until the positioning of the electronic component C and the substrate S, which will be described later, is completed and the mounting head 31 is driven toward the substrate S.

As shown in FIG. 10(A) , the component-side imaging unit 5 photographs the outer shape of the electronic component C visible in the transmission area T via the mounting head 31 (step S105 ). In the example of FIG. 10(A) , the electronic component C is shifted to the upper left in the figure and tilted to the right with respect to the adsorption area D and its center shown by the two-dot chain line. The control device 8 obtains the outer shape of the electronic component C photographed by the component-side imaging unit 5 and the deviation amount (XY direction and θ direction) from the reference position, and as shown in FIG. 10(B) , causes the drive mechanism 32 to Operation is performed to eliminate the offset, thereby positioning the mounting head 31 on the electronic component C (step S106). In the example of FIG. 10(B) , the mounting head 31 moves to the upper left in the figure and rotates to the right to align the electronic component C with the adsorption area D. In addition, in the figure, the movement to the upper left is indicated by an arrow on the lower right outside the dotted line of the holding portion 31b. Furthermore, the rightward rotation is indicated by an arrow on the upper right side of the solid circle indicating the hollow portion 31a.

As shown in (C) of FIG. 9 , the arm portion 72 moves in the direction approaching the holding portion 31 b and presses the electronic component C against the holding portion 31 b. As shown in (D) of FIG. 9 , the holding portion 31 b of the mounting head 31 holds and receives the electronic component C by negative pressure suction (step S107 ). At the same time, the pickup collet 700 releases the negative pressure and moves the arm 72 in a direction away from the holding portion 31b, thereby releasing the electronic component C. The movement of the arm portion 72 at this time is performed by operating the second driving source 734a of the second driving portion 734 so that the base portion 72b moves along the second sliding portion 734b.

Then, as shown in FIG. 10(C) , the control device 8 operates the drive mechanism 32 to return the electronic component C held by the mounting head 31 to the original mounting position OA (step S108 ). In the example of FIG. 10(C) , the mounting head 31 moves to the lower right in the figure, and rotates left to return to the mounting position OA. In addition, in the figure, the movement to the lower right is indicated by an arrow on the upper left outside the dotted line indicating the holding portion 31b. Furthermore, the leftward rotation is indicated by an arrow on the upper right side of the solid circle indicating the hollow portion 31a.

Furthermore, as shown in (E) of FIG. 9 , the arm portion 72 moves toward the supply portion 6 , whereby the transfer head 71 is retracted from directly below the holding portion 31 b. The movement of the arm portion 72 at this time is performed by operating the first driving source 732a of the first driving portion 732 so that the moving body 733 moves in the X-axis direction along the first sliding portion 732b. In addition, the electronic component C is transferred to the holding part 31 b by the transfer device 7 at the mounting position OA. Therefore, during the transfer, the stage 21 is kept in a retracted state in order to avoid interference with the transfer mechanism 73 .

[Installation of electronic parts] Next, the mounting operation of the electronic component C will be described with reference to the explanatory diagrams of FIGS. 11(A) to 11(C) and the flowchart of FIG. 13 . Here, as shown in (A) of FIG. 11 , the holding portion 31 b of the mounting head 31 holding the electronic component C as described above is located directly below the component side imaging portion 5 . The board-side imaging unit 4 photographs the mark m of the electronic component C held by the mounting head 31 (step S201). The control device 8 determines the positional deviation amount between the position of the mark m captured by the substrate-side imaging unit 4 and the reference position, and operates the drive mechanism 32 to eliminate the offset amount, thereby positioning the electronic component C (step S202).

Next, as shown in FIG. 11(B) , the substrate support mechanism 2 reaches the mounting area B of the substrate S (this time, the mounting area B for mounting the electronic component C) facing the electronic component C held by the mounting head 31 . The stage 21 is moved so that the center of the mounting area B reaches the mounting position OA (step S203). Then, as shown in FIG. 3(B) , the component side imaging unit 5 photographs the mark M of the substrate S visible in the transmission area T around the electronic component C via the mounting head 31 (step S204 ).

The control device 8 determines the positional deviation amount between the position of the mark M photographed by the component side imaging unit 5 and the reference position, and operates the drive mechanism 22 to eliminate the deviation amount, thereby positioning the substrate S (step S205). Furthermore, as shown in (C) of FIG. 11 , the mounting head 31 is driven toward the substrate S by the driving mechanism 32 , and the electronic component C held by the mounting head 31 is mounted on the substrate S (step S206 ).

As described above, the operations of transferring the electronic component C from the wafer WS, handing over the electronic component C to the mounting head 31, positioning the electronic component C and the substrate S, and mounting the electronic component C on the substrate S are repeated, whereby the electronic component C is sequentially mounted on the substrate. Each installation area B of S. The substrate S after mounting a predetermined number of electronic components C is transported by the substrate support mechanism 2 and stored in the unloader.

[Effect] (1) The electronic component C transfer device 7 of this embodiment includes a mounting head 31 that mounts the electronic component C on the substrate S at the mounting position OA; and a pickup collet 700 that has a porous member 701 and a guide portion 703. The porous member 701 ejects gas from the pores and holds the electronic component C in a non-contact manner through the negative pressure of the suction hole 701c. The movement is restricted, and the pick-up collet 700 picks up the electronic components C from the supply part 6 that supplies the electronic components C, and transfers them to the mounting head 31; the reversal drive part 710 reverses the pick-up collet 700 from the supply position; transfer The mechanism 73 transfers the pickup collet 700 between the supply part 6 and the mounting head 31; the component side imaging part 5 photographs the appearance of the electronic component C held by the inverted pickup collet 700; and the positioning mechanism based on the component side The outer shape of the electronic component C captured by the imaging unit 5 positions the mounting head 31 on the electronic component C held by the pickup collet 700. After the pickup collet 700 transfers the electronic component C to the mounting head 31, the mounting head 31 is Positioned at installation location OA.

Furthermore, the mounting device 1 for the electronic component C according to this embodiment includes the mounting mechanism 3 for mounting the electronic component C positioned by the positioning mechanism on the substrate S at the mounting position OA via the mounting head 31 .

Furthermore, in the mounting method of the electronic component C according to this embodiment, the pickup collet 700 picks up the electronic component C from the supply part 6 of the electronic component C. The pickup collet 700 has a porous member 701 and ejects gas from the pores. Moreover, the electronic component C is held in a non-contact manner by the negative pressure of the suction hole 701c; and the guide part 703 restricts the movement of the electronic component C held in a non-contact manner, and the inversion driving part 710 causes the picked up The pickup collet 700 of the electronic component C is reversed, and the transfer mechanism 73 transfers the pickup collet 700 that has picked up the electronic component C to the mounting head 31 for mounting the electronic component C on the substrate S. The positioning mechanism positions the mounting head 31 on the electronic component C held by the pickup collet 700 based on the outer shape of the electronic component C captured by the component-side imaging unit 5, Through the relative movement of the pick-up collet 700 and the mounting head 31, the electronic component C is transferred from the pick-up collet 700 to the mounting head 31. The positioning mechanism positions the mounting head 31 that has been handed over and holds the electronic component C to position the electronic component. C is mounted at the mounting position OA of the substrate S. In a state where the substrate S is evacuated from the mounting position OA by the substrate support mechanism 2 , the substrate side imaging unit 4 images the mark m of the electronic component C held by the mounting head 31 , and the component side images The part 5 captures an image of the mark M of the substrate S positioned at the mounting position OA by the substrate support mechanism 2. The positioning mechanism is based on the image of the mark m and the mark M captured by the part-side imaging part 5 and the substrate-side imaging part 4. Based on the found positions of the substrate S and the electronic component C, the substrate S and the electronic component C are positioned.

Therefore, in this embodiment, the electronic component C can be picked up in a non-contact manner by the pick-up collet 700 and can be positioned when delivered to the mounting head 31 . Here, when the gas is ejected from the porous member 701 and the electronic component C is picked up in a non-contact manner by suction through the suction hole 701c, the electronic component C can easily move in the area surrounded by the guide portion 703. . However, in this embodiment, the mounting head 31 is positioned relative to the displaced electronic component C, receives the electronic component C, returns to the reference position, and then mounts it. Therefore, the position where the electronic component C is held by the mounting head 31 is set to Invariably, it is possible to suppress the time-consuming or increase in error in the position recognition by imaging the mark m of the electronic component C and the subsequent corrective movement. This can reduce positional deviation during installation.

(2) The mounting head 31 has a transmissive part capable of transmitting and identifying the electronic component C held by the pickup collet 700 , and the component side imaging part 5 is disposed so as to be able to capture the outer shape of the electronic component C through the transmissive part. The upper side of the installation head 31. Therefore, the position at which the electronic component C is transferred from the pick-up collet 700 to the mounting head 31 can be substantially aligned with the imaging position, and it is possible to suppress errors in the position recognition using the imaging of the mark m of the electronic component C and the subsequent corrective movement. It takes time or the error increases.

(3) It has: a substrate support mechanism 2 that supports the substrate S and moves the substrate S between the installation position OA and a position retreated from the installation position OA; and a substrate side imaging unit 4 that is arranged in the substrate support mechanism 2 in the installation position OA. On the lower side of The image of the mark M of the substrate S supported by the stage 21 positioned at the mounting position OA and the image of the mark m of the electronic component C captured by the substrate-side imaging unit 4 determine the relationship between the substrate S and the electronic component. At the position of C, the substrate S and the electronic component C are positioned.

According to this embodiment, in a state where the substrate S is retracted from the mounting position OA, the electronic component C held by the mounting head 31 is photographed by the substrate-side imaging unit 4 disposed below the substrate supporting mechanism 2 in the mounting position OA. , the component-side imaging unit 5 arranged above the mounting head 31 in the mounting position OA is used to photograph the substrate S supported by the substrate supporting mechanism 2 through the transmission part of the mounting head 31, so that the electronic component C and the substrate S are brought as close as possible. In an equivalent state, the mark m of the electronic component C and the mark M of the substrate S can be photographed.

Therefore, the movement amount of the electronic component C (mounting head 31 ) and the substrate S (substrate support mechanism 2 ) when the mark m is photographed and the mark M can be captured, and the mark m and the electronic component C (mounting head 31 ) after the mark M can be photographed. The amount of movement relative to the substrate S (substrate support mechanism 2 ) is as short as possible. Therefore, amplification of errors caused by moving the mounting head 31 or the substrate support mechanism 2 over a long distance can be suppressed. In addition, the longer the moving distance of the mechanism, the more dust is generated. However, in this embodiment, the moving distance can be suppressed, so it is possible to prevent dust from reducing cleanliness and causing joint failure. Furthermore, as described above, by holding the electronic component C in a non-contact manner, it is possible to reduce the position of the mounting head 31 relative to the holding position (adsorption area D) when receiving the electronic component C from the pick-up collet 700 in which the electronic component C can be easily moved. Therefore, when the mark m is captured by the substrate side imaging unit 4, the offset amount can be reduced in advance, and the time required for position recognition using the capture of the mark m of the electronic component C and the subsequent corrective movement can be suppressed. Or the error increases.

In the present embodiment, the movement distance of the electronic component C and the substrate S can be suppressed after the marks m and marks M are photographed. Therefore, positional deviation, reduction in productivity, and amount of dust generation can be suppressed.

(4) The transmission part has a transparent plate-shaped member. Therefore, it is possible to achieve transmissive imaging of the outer shape of the electronic component C, holding the electronic component C, and transmissive imaging of the mark M on the substrate S. Therefore, in the state before the electronic component C is held by the transmissive part, the outer shape of the electronic component C can be photographed at a very close distance between the transmissive part and the electronic component C. Therefore, the amount of deviation when the transmissive part receives the electronic component C can be suppressed, thereby The electronic component C can be delivered more reliably while aligning the holding position (adsorption area D) of the mounting head 31 . Since the posture of the electronic component C received by the mounting head 31 can be brought into a state close to a predetermined posture, position recognition is performed by photographing the mark m of the electronic component C held by the mounting head 31 using the substrate-side imaging unit 4 , it is possible to prevent the subsequent correction movement from taking time or increasing the error.

(5) The board-side imaging unit 4 and the component-side imaging unit 5 are provided so as not to move relative to the mounting position OA. Therefore, the imaging area of the substrate side imaging unit 4 and the imaging area of the component side imaging unit 5 do not shift, and dust generation due to movement can be prevented.

[Modification] (1) The guide portion 703 of the pickup collet 700 only needs to be provided along the outer edge of the facing surface 701 a so as to restrict the movement of the electronic component C. That is, it suffices to limit the movement of the electronic component C to the extent that the electronic component C is detached from the pickup collet 700 due to movement or reversal of the pickup collet 700 . Therefore, the guide portion 703 only needs to be provided on the four sides of the facing surface 701a. It may be provided on the entire circumference of the facing surface 701a, or may be provided on a part of each side. For example, the guide portion 703 may be continuously arranged across the corner portion as shown in FIG. 14(A) or along the corner portion as shown in FIG. 14(B) . In addition, as shown in FIG. 14(B) , one of the orthogonal guide portions 703 may be continuous with the other orthogonal guide portion 703 .

(2) The number or size of the suction holes 701c and the openings 701d is not limited to the above-mentioned forms. In the facing surface 701a of the porous member 701, the suction holding state and the non-contact state can be maintained by balancing the area in which the electronic component C is supported by the gas layer and the total area of the opening 701d.

(3) The positions and shapes of the suction holes 701c and the openings 701d are not limited to the above-mentioned forms. For example, the shape of the opening 701d may be a circle, a rectangle, or other elliptical shapes, polygons, rounded polygons, star shapes, etc.

(4) By making the pickup collet 700 replaceable, it can be replaced according to the shape and size of the electronic component C. As the replaceable structure, the structure that can be sucked and held by magnets is simple, and the replacement operation is also easy. However, it only needs to be a structure in which the pickup collet 700 can be replaced. For example, it may be adsorption holding using negative pressure or a mechanical holding structure.

(5) The supply unit 6 is not limited to a device that supplies the electronic components C attached to the wafer WS. For example, it may be a device that supplies electronic components C arranged on a tray. Furthermore, the transfer mechanism 73 may be configured so as to be able to individually pick up the electronic components C from the supply unit 6 and transfer them. Therefore, the arm 72 may be configured to move along the X-axis and Y-axis directions, or the support mechanism 61 may be configured to move along the X-axis and Y-axis directions.

(6) In the transfer mechanism 73 , the driving unit that drives the arm portion 72 is not limited to a mechanism using a linear motor as a driving source. A mechanism using a ball screw or a conveyor belt using a motor that rotates a shaft as a driving source may also be used. In the case of such a mechanism, since it includes the sliding part SL, it is preferable to provide it in the position which does not overlap with the mounting surface F in a plan view. Furthermore, it is preferable to provide the sliding portion SL at a lower position than the height position of the mounting surface F. In addition, when there are a plurality of sliding portions SL, some of the sliding portions SL may not be provided at a position that does not overlap the mounting surface F in a plan view. Furthermore, some of the sliding portions SL may not be provided at a position lower than the height position of the mounting surface F. In this case, it is preferable to provide a shield such as an outer package, a wall, or other structural parts between the sliding portion SL and the mounting surface F. Furthermore, it is preferable to lengthen the distance between the sliding portion SL and the mounting surface F.

(7) The mounting head 31 only needs to be configured so that the component-side imaging unit 5 can image the outer shape of the electronic component C and the mark M of the substrate S. Therefore, the transmissive portion of the mounting head 31 may not be formed of a transparent material, or a through hole may be formed in a location corresponding to the outer shape of the electronic component C or the mark M. More specifically, the holding portion 31b may be formed of an opaque member, and a through hole may be formed at a location corresponding to the outer shape of the electronic component C or the mark M, or the holding portion 31a may not be present and may be formed of an opaque member. The holding portion 31b has through holes formed in the mounting head 31 and the holding portion 31b at locations corresponding to the outer shape of the electronic component C or the mark M. That is, this through hole is also the transmission part of the mounting head 31 . In addition, when photographing the outer shape of the electronic component C, a part of the outer shape of the electronic component C is photographed. Therefore, it is preferable to be able to photograph adjacent portions of the electronic component C. In this case, the photographed part may be the corner part of the electronic part C. By including images of both adjacent sides, the posture (position or inclination in the horizontal plane) of the electronic component C can be recognized.

(8) The board-side imaging unit 4 or the component-side imaging unit 5 may be provided movably with respect to the position where the electronic component C is mounted (mounting position OA). That is, when the plurality of marks m of the electronic component C or the plurality of marks M of the substrate S cannot be photographed at once, the substrate side imaging unit 4 or the component side imaging unit 5 can move between the marks m or between the marks M to photograph. way of composition. That is, a moving device for moving the substrate side imaging unit 4 between the marks m or a moving device for moving the component side imaging unit 5 between the marks M may be provided. Even in this case, the moving distance is limited to the size of the electronic component C or the mounting area B of the substrate S and is short, so errors and dust generation can be suppressed. Since the imaging magnification can be selected according to the required mounting accuracy, position recognition accuracy can be improved.

(9) In the above aspect, the position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are respectively aligned with the reference position (mounting position OA). However, the invention is not limited to this, and the electronic component may be The position of the component C is aligned with the position of the mounting area B, or the position of the mounting area B is aligned with the position of the electronic component C. In short, it suffices as long as the position of the mounting area B of the substrate S and the position of the electronic component C can be aligned. When the stage 21 is moved by a correction amount for position alignment and the positions of the substrate S and the electronic component C are aligned, there is no need to align the positions of the relatively large and heavy stage 21 in each mounting area B. Therefore, the installation accuracy can be further improved and the time for position correction can be shortened.

(10) The substrate support mechanism 2 can be transferred to the substrate S of the stage 21 at the mounting position OA. In this case, after the substrate S is supplied to the stage 21 , the substrate S may be evacuated from the mounting position OA before the mark m of the electronic component C is imaged by the substrate side imaging unit 4 .

[Other embodiments] The present invention is not limited to the above-described embodiments, and at the implementation stage, the structural elements can be modified and embodied within the scope that does not deviate from the gist of the invention. Furthermore, various inventions can be formed by appropriate combinations of the plurality of structural elements disclosed in the embodiments. For example, some structural elements may be deleted from all the structural elements shown in the embodiments. Furthermore, structural elements in different embodiments may be combined appropriately.

1: Install the device 2:Substrate support mechanism 3: Installation mechanism 4:Substrate side imaging part 5: Part side shooting department 6: Supply Department 7: Transfer device 8:Control device 11:Support platform 11a:Containment hole 21: Carrier platform 22, 32, 62: Driving mechanism 22a, 22b, 33a, 34a, 35a, 62a, 62b: guide rail 23:Mobile board 23a:Through hole 31: Installation head 31a: Hollow part 31b:Maintenance Department 33, 34, 35, 733: moving body 61:Support mechanism 61a: Ring retainer 71:Transfer head 71a: Adsorption nozzle 71b, 710: Reverse drive unit 72:Arm 72a:Extension 72b: Base part 73:Transfer agency 700: Pick up collet 701: Porous components 701a: Opposing surface 701b: Back 701c: Suction hole 701d:Open your mouth 702:Pedestal 702a: Air supply hole 702b:Exhaust hole 702c:Mounting hole 703, 703K～703N: Guidance Department 704: Loading and unloading department 704a: pin 720:Rotating body 731: Fixed body 732:First drive department 732a: First driving source 732b: First sliding part 734:Second drive unit 734a: Second drive source 734b: Second sliding part B:Installation area C: Electronic parts D: Adsorption area F: mounting surface G: gas L: height position M, m: mark OA: installation location S:Substrate SL: sliding part T: Transmission area WS: wafer

FIG. 1 is a front view showing the schematic structure of the mounting device according to the embodiment. FIG. 2 is a plan view showing the electronic component and the substrate. 3(A) and 3(B) are a plan view (A) of the mounting device and an enlarged plan view (B) of the mounting location. (A) of FIG. 4 is a schematic cross-sectional view showing the principle of holding electronic components using a pickup collet, and (B) of FIG. 4 is a bottom perspective view of the base. Fig. 5 is a bottom perspective view showing the pickup collet and the attachment and detachment portion. Fig. 6 is an upper surface side perspective view showing the pickup collet and the attachment and detachment portion. 7(A) and 7(B) are enlarged views showing the reversal operation of the electronic component, with the left side being a front view and the right side being a plan view. 8(A) to 8(D) are explanatory diagrams showing the pickup operation of electronic components. 9(A) to 9(E) are explanatory diagrams showing the transfer operation of electronic components. 10(A) to 10(C) show a photograph of the electronic component when the mounting head is used to receive the electronic component (A), the positioning of the mounting head on the electronic component (B), and the positioning of the mounting head on the electronic component. Explanatory diagram of positioning (C). 11(A) to 11(C) are explanatory diagrams showing the mounting operation of the mounting device. FIG. 12 is a flowchart showing the sequence of picking up and handing over electronic components. FIG. 13 is a flowchart showing the mounting procedure of electronic components. 14(A) and 14(B) are bottom views showing modifications of the arrangement of the guide portion.

1: Install the device

2:Substrate support mechanism

3: Installation mechanism

4:Substrate side imaging part

5: Part side shooting department

6: Supply Department

7: Transfer device

8:Control device

11:Support platform

11a:Containment hole

21: Carrier platform

32:Driving mechanism

22b, 33a, 34a, 35a, 62a, 62b: guide rail

23:Mobile board

23a:Through hole

31: Installation head

31a: Hollow part

31b:Maintenance Department

33, 34, 35: moving body

61:Support mechanism

62:Driving mechanism

71: Transfer head

72:Arm

72a:Extension

72b: Base part

73:Transfer agency

700: Pick up collet

732:First drive department

C: Electronic parts

OA: installation location

S:Substrate

WS: wafer

Claims (5)

An operating device for electronic parts, including: The mounting head is used to mount electronic components on the substrate at the mounting position; The pick-up collet includes a porous member and a guide part. The porous member ejects gas from the pores and holds the electronic parts in a non-contact manner through the negative pressure of the suction hole. The guide part is for The movement of the electronic components held in a non-contact manner is restricted, and the pickup collet picks up the electronic components from a supply part that supplies the electronic components and transfers them to the mounting head; a reversal drive unit to reverse the pickup collet from the supply position; a transfer device that transfers the pickup collet between the supply part and the mounting head; a component-side imaging unit that photographs the appearance of the electronic component held by the inverted pickup collet; and A positioning mechanism positions the mounting head on the electronic component held by the pickup collet based on the outer shape of the electronic component photographed by the component-side imaging unit, and removes the electronic component from the After the pickup collet is transferred to the mounting head, the mounting head is positioned in the mounting position. The operating device for electronic parts as described in claim 1 includes: a substrate support mechanism that supports the substrate so that the substrate moves between the installation position and a position retreated from the installation position; The substrate-side imaging unit is disposed below the substrate support mechanism in the mounting position, and captures images held by the mounting head in a state where the substrate is retracted from the mounting position by the substrate support mechanism. and the mark of the electronic component located at the installation position; and a control device that controls the component-side imaging unit, the positioning mechanism, the substrate support mechanism, and the substrate-side imaging unit, The control device is At the mounting position, in a state where the substrate is positioned at the mounting position by the substrate supporting mechanism, the component-side imaging unit captures a mark of the substrate positioned at the mounting position, Based on the image of the mark of the substrate positioned at the mounting position captured by the component-side imaging unit and the image of the mark of the electronic component captured by the substrate-side imaging unit The positions of the substrate and the electronic components are determined, and the positioning mechanism positions the substrate and the electronic components. The operating device for electronic parts according to claim 1, wherein the mounting head includes a transmissive part capable of transmitting and identifying the electronic parts held by the pickup collet, The component-side imaging unit is disposed on the upper side of the mounting head so as to be able to photograph the outer shape of the electronic component through the transmission unit. A mounting device for electronic parts, including: a mounting mechanism, the mounting mechanism including the operating device according to any one of claims 1 to 3, and The electronic component positioned by the positioning mechanism is mounted on the substrate at the mounting position. An installation method of electronic parts, positioning and installing a substrate and electronic parts, wherein: A pick-up collet including a porous member that ejects gas from pores and a guide portion picks up the electronic components from a supply portion of the electronic components in a non-contact manner by the negative pressure of the suction hole The electronic component is held, and the guide portion restricts movement of the electronic component held in a non-contact manner, The reversal drive unit reverses the pickup collet that has picked up the electronic component, The transfer mechanism transfers the pickup collet that picked up the electronic component to a mounting head for mounting the electronic component on the substrate, The component side imaging unit photographs the appearance of the electronic component held by the inverted pickup collet, A positioning mechanism positions the mounting head on the electronic component held by the pickup collet based on the outer shape of the electronic component photographed by the component-side imaging unit, The electronic component is transferred from the pickup collet to the mounting head through relative movement of the pickup collet and the mounting head, The positioning mechanism positions the mounting head in which the electronic component is delivered and held at a mounting position for mounting the electronic component on the substrate, In a state where the substrate is retracted from the mounting position by the substrate support mechanism, the substrate side imaging unit captures the mark of the electronic component held by the mounting head, The component-side imaging unit captures an image of the mark of the substrate positioned at the mounting position by the substrate support mechanism, The positioning mechanism performs positioning of the substrate and the electronic component based on the positions of the substrate and the electronic component found based on the image of the mark captured by the component-side imaging unit and the substrate-side imaging unit. Positioning of parts.

Images