KR20230141554A - Mounting device and mounting method - Google Patents

Abstract

A mounting device and method that can reduce errors caused by movement of a bonding head and an imaging unit are provided.
The mounting device 1 of the embodiment displays the head mark 313 and the electronic component ( 2) a first positional relationship calculation unit 73 that calculates the first positional relationship, a second image β obtained by imaging the substrate mark 3b at the mounting position P3, and an electronic component held by the bonding head 310 ( 2) Calculate the second positional relationship between the head mark 313 and the substrate mark 3b based on the third image γ captured of the head mark 313 in a state facing the mounting area 3a. 2. A positional relationship calculation unit 74, and a third positional relationship calculation unit 75 that calculates a third positional relationship between the electronic component 2 and the substrate mark 3b based on the first positional relationship and the second positional relationship. , and has a positioning mechanism for positioning the electronic component 2 and the substrate mark 3b based on the third positional relationship.

Description

Mounting device and mounting method {MOUNTING DEVICE AND MOUNTING METHOD}

The present invention relates to a mounting device and a mounting method.

Electronic components such as semiconductor chips are picked up from a wafer or tray, transported onto a substrate, and mounted by pressing and attaching them to the substrate. In such mounting of electronic components, there is a case where multiple electronic components are mounted on one board. For example, in the manufacturing process of a micro LED display, a large number of micro LEDs, which are electronic components, are collectively mounted on a substrate using a device called a mass transfer. In the mounting of such a large number of electronic components, unmounted parts or defective electronic parts may occur. The unmounted portion is a portion in which no electronic components are mounted. Additionally, a defective part of an electronic component is a part of an electronic component that is determined to be defective through inspection. In the above-mentioned micro LED, there is a non-lit portion. The non-illuminated part is a part of the installed micro LED that was found not to light through inspection.

It is necessary to perform a repair process on such unmounted parts or defective parts of electronic components. The repair process is a process of mounting electronic components on the non-mounted portion, removing electronic components from the defective portion, and mounting the electronic component again. In the repair process, it is necessary to mount electronic components one by one using a bonding head. In this case, the electronic components must be precisely positioned for each mounting area on the board. For example, in the case of a square micro LED with a side of 20㎛, a precision of about 1㎛ is required.

The following methods are used to position the substrate and electronic components. First, the bonding head holding the electronic components on the bottom surface is placed on standby above the mounting area of the board, and an imaging unit capable of simultaneously capturing images in both directions is introduced between the bonding head and the board, and the bonding head holding the electronic components is brought into contact with the bonding head. The mounting area of the electronic components and the board is imaged and retracted. Then, based on the image captured by the imaging unit, the relative position of the substrate and the electronic component in the horizontal direction is recognized, and based on the position recognition, the bonding head is positioned to mount the electronic component on the substrate.

Japanese Patent Publication No. 2010-129913

In order to insert an imaging unit between an electronic component and a board, it is necessary to leave a large gap in the vertical direction between the electronic part and the board. For this reason, the moving distance when the imaging unit is retracted from between the electronic component and the substrate, the bonding head is lowered, and the electronic component is mounted on the substrate becomes longer. Then, positional deviation caused by movement from the imaging or positioning position is likely to occur. Additionally, if the moving distance is long, the amount of dust generated from the mechanism portion during movement increases. Additionally, since the imaging unit repeats movements for entry and retreat, the imaging position changes for each imaging and errors are likely to occur in the imaging positions of the upper and lower cameras.

The purpose of embodiments of the present invention is to provide a mounting device and a mounting method that can reduce errors due to movement of the bonding head and the imaging unit.

In order to achieve the above object, the mounting device of the embodiment includes a mounting device that has a bonding head provided with a head mark and mounts the electronic component held by the bonding head on the mounting area of the substrate at the mounting position; , a first imaging unit provided at a position capable of capturing a first image of the electronic component held by the bonding head together with the head mark, and, at the mounting position, imaging a substrate mark provided in the mounting area. a second image, and after capturing the second image, the bonding head is positioned at the mounting position, and the electronic component held by the bonding head faces the mounting area, the head mark a second imaging unit provided to be capable of capturing a third image, and a first positional relationship calculation unit that calculates a first positional relationship, which is a positional relationship between the head mark and the electronic component, based on the first image; A second positional relationship calculation unit that calculates a second positional relationship that is a positional relationship between the head mark and the substrate mark, based on the second image and the third image, and the first positional relationship and the second positional relationship A third positional relationship calculation unit that calculates a third positional relationship, which is the positional relationship between the electronic component and the substrate mark, based on the third positional relationship, and a third positional relationship between the electronic component and the substrate before mounting the electronic component, based on the third positional relationship. It has a positioning mechanism for positioning the mark.

In the mounting method of the embodiment, a first image of an electronic component held by a bonding head provided with a head mark is imaged together with the head mark by a first imaging unit, and a substrate is captured by a second imaging unit. A second image in which a substrate mark provided in the mounting area of the electronic component is imaged is captured, and after the second image is captured by the second imaging unit, the electronic component faces the mounting area. In a state in which the bonding head is disposed, a third image in which the head mark is captured is captured, and a first positional relationship calculation unit determines a first position, which is the positional relationship between the head mark and the electronic component, based on the first image. A relationship is calculated, and a second positional relationship calculation unit calculates a second positional relationship, which is a positional relationship between the head mark and the substrate mark, based on the second image and the third image, and a third positional relationship calculation unit, Based on the first positional relationship and the second positional relationship, a third positional relationship that is a positional relationship between the electronic component and the substrate mark is calculated, and the positioning mechanism calculates a third positional relationship between the electronic component and the substrate mark based on the third positional relationship. and positions the substrate mark, and a mounting device mounts the electronic component held by the bonding head on the mounting area of the substrate.

In the embodiment of the present invention, errors due to movement of the bonding head and the imaging unit can be reduced.

1 is a front view showing a mounting device of an embodiment and a block diagram showing a control device.
Figure 2 is a plan view showing the mounting device of Figure 1.
FIG. 3 is a front view showing the electronic component of the mounting device of FIG. 1 when delivered.
Figure 4 is a plan view showing the mounting device in the state of Figure 3.
FIG. 5 is a cross-sectional view taken along line AA of FIG. 1 and is a diagram showing the electronic components when mounted.
Figure 6 is a cross-sectional view showing the tip of the bonding head.
Fig. 7 is an explanatory diagram showing imaging of a first image by the first imaging unit and imaging of a second image and a third image by the second imaging unit.
Fig. 8 is a flowchart showing the mounting procedure according to the embodiment.
Fig. 9 is a cross-sectional view showing a head mark of a modified example.

An embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the drawings. In addition, the drawing is a schematic diagram, and the size and proportion of each part include exaggerated portions to facilitate understanding.

[outline]

1 to 4, the mounting device 1 of this embodiment includes a supply device 10, a pickup device 20, a placement device 30, and a substrate stage 40 for the electronic component 2. , has a first imaging unit 50, a second imaging unit 60, and a control device 70. The mounting device 1 picks up the electronic component 2 from the supply device 10 by the pickup device 20, inverts it, and transfers it to the mounting device 30, where the electronic component 2 is placed on the substrate stage by the mounting device 30. It is mounted by mounting it on the board 3 supported on 40.

The electronic component 2 is, for example, a rectangular thin piece component. In this embodiment, the electronic component 2 is a micro LED. The micro LED has an electrode portion on one of the front and back surfaces and is a mounting surface 2a mounted on the substrate 3. The substrate 3 is, for example, a plate body in which a plurality of mounting areas 3a on which the electronic components 2 are mounted are provided in a matrix shape. An electrode portion is provided in each mounting area 3a. The electrode portion of this embodiment serves as a substrate mark 3b (see FIG. 7) as an alignment mark. The substrate mark 3b of this embodiment has the shape of two parallel rows of straight lines. The electrode portion of the electronic component 2 is bonded to the electrode portion of this mounting area 3a. Therefore, it is necessary to position the electronic component 2 and the mounting area 3a.

[Supply device]

The supply device 10 is a device that supplies the electronic component 2 to the pickup device 20 . The supply device 10 moves the electronic component 2 to be picked up to the supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 that is a pickup target. The supply device 10 includes a supply stage 12 that supports a tray 11 on which a plurality of electronic components 2 are loaded, and a stage moving mechanism 13 that moves the supply stage 12. As this stage moving mechanism 13, for example, a linear guide in which a slider moves on a rail can be used by a ball screw mechanism driven by a servo motor. The supply device 10 supplies the electronic component 2 to be picked up from among the plurality of electronic components 2 supported on the supply stage 12 via the tray 11 by the stage moving mechanism 13. Move to P1.

The tray 11 on which the electronic component 2 is loaded is a plate body on which the electronic component 2 is loaded. On the tray 11, concave portions (not shown) are formed in a matrix shape. By loading the electronic components 2 into each recess, the electronic components 2 are arranged in a matrix shape on the tray 11. In this embodiment, the electronic component 2 is arranged face-up with the mounting surface 2a exposed upward.

The supply stage 12 is a stand that horizontally supports the tray 11 on which the electronic components 2 are loaded. The supply stage 12 is provided to be movable in the horizontal direction by the stage moving mechanism 13. Since the tray 11 is supported on the supply stage 12, the supply stage 12 is moved by the stage moving mechanism 13, and the tray 11 and the electronic components loaded on the tray 11 (2) is also provided to be movable in the horizontal direction.

As shown in FIG. 1, among the horizontal directions, the direction in which the supply device 10 and the mounting device 30 are aligned is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Additionally, the direction perpendicular to the plane of the tray 11 is called the Z-axis direction or the up-down direction. Additionally, the direction of rotation in the horizontal direction is called the θ-axis direction. However, these directions do not limit the installation direction of the mounting device 1.

[Pick-up device]

The pickup device 20 is a device that picks up the electronic component 2 from the supply device 10 and delivers the picked up electronic component 2 to the mounting device 30 . This pickup device 20 is provided with a pickup nozzle 21, a moving mechanism 22, and a reversing mechanism 23.

(pickup nozzle)

The pickup nozzle 21 is a mechanism that suctions and holds the electronic component 2 and releases the electronic component 2 by releasing the suction. The pickup nozzle 21 has a nozzle hole opened at the front end surface. The nozzle hole is in communication with a negative pressure generating circuit (not shown) including a vacuum pump, etc., and the circuit generates negative pressure to attract and hold the electronic component 2 on the front end surface of the pickup nozzle 21. . Additionally, by releasing the negative pressure, the holding state of the electronic component 2 from the tip end surface is released.

As shown in FIGS. 1 to 4, the moving mechanism 22 moves the pickup nozzle 21 back and forth between the supply position P1 and the delivery position P2, and also moves the pickup nozzle 21 at the supply position P1 and the delivery position P2. It is a mechanism that elevates. In addition, the delivery position P2 is a position where the pickup device 20 delivers the electronic component 2 picked up at the supply position P1 to the bonding head 310 that functions as a receiving unit described later. The supply position P1 and delivery position P2 mainly mean a position in the XY direction and do not necessarily mean a position in the Z-axis direction.

(Mobile device)

The moving mechanism 22 has an arm 22a on which the pickup nozzle 21 is installed, and moves the pickup nozzle 21 by moving the arm 22a. The moving mechanism 22 includes a slide mechanism 22b and a lifting mechanism 22f. The slide mechanism 22b moves the arm 22a on which the pickup nozzle 21 is installed, thereby reciprocating the pickup nozzle 21 between the supply position P1 and the delivery position P2. Here, the slide mechanism 22b has a rail 22d that extends parallel to the X-axis direction and is fixed to the support frame 22c, and a slider 22e that travels on the rail 22d. Although not shown, the slider 22e is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

The lifting mechanism 22f moves the pickup nozzle 21 in the vertical direction by moving the arm 22a on which the pickup nozzle 21 is installed. Specifically, the lifting mechanism 22f can use a linear guide in which a slider moves on a rail by a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 moves up and down along the Z-axis direction by driving the servo motor.

(inversion mechanism)

The inversion mechanism 23 is provided between the pickup nozzle 21 and the moving mechanism 22. The reversal mechanism 23 here is an actuator including a drive source such as a motor that changes the direction of the pickup nozzle 21, and a rotation guide such as a ball bearing. Changing the direction means rotating 0° to 180° in the vertical direction.

[Mounted device]

The mounting device 30 is a device that mounts the electronic component 2 on the mounting area 3a of the substrate 3. As shown in FIGS. 3 and 4, the placement device 30 transports the electronic component 2 received from the pickup device 20 to the mounting position P3, and places it on the board 3, as shown in FIG. 5. It is implemented by mounting it. The mounting position P3 is a position where the electronic component 2 is mounted on the board 3. The mounting position P3 mainly refers to a position in the XY direction and does not necessarily mean a position in the Z-axis direction. The mounting device 30 has a bonding head 310 and a head movement mechanism 320.

(bonding head)

The bonding head 310 has a function as a receiving unit that receives the electronic component 2 from the pickup nozzle 21 at the delivery position P2, and mounts the electronic component 2 on the board 3 at the mounting position P3. It is a device that The bonding head 310 holds the electronic component 2, and after mounting, the holding state is released to release the electronic component 2.

Specifically, the bonding head 310 has a bonding tool 311 and a holding mechanism 314, as shown in FIG. 6 . The bonding tool 311 is a plate body that transmits light. Having light transmission means that light required for imaging by the first imaging unit 50 and the second imaging unit 60, which will be described later, is transmitted. The bonding tool 311 of this embodiment is a circular glass plate. One surface of the bonding tool 311 faces downward and is a holding surface 311a that holds the electronic component 2. An adhesive portion 312 is provided at the center of the holding surface 311a. The adhesive portion 312 is a member that adhesively holds the electronic component 2. The adhesive portion 312 uses, for example, polydimethylsiloxane (PDMS).

The surface opposite to the holding surface 311a of the bonding tool 311 is a holding surface 311b that faces upward and is held by a holding mechanism 314 described later. A head mark 313 is provided on the held support surface 311b. In FIGS. 6 and 7 , the head mark 313 is not shown in the same cross section as the electronic component 2, and is therefore shown as a dotted line for convenience. As shown in (D) of FIG. 7, the head mark 313 is located on the outside of the electronic component 2 adhesively held by the adhesive portion 312, that is, at a position that does not overlap the electronic component 2 in plan view. This is an alignment mark provided. In this embodiment, two head marks 313 are provided at positions sandwiching the electronic component 2 in plan view. The head mark 313 is a circular concave portion. Since the bonding tool 311 is transparent, the head mark 313 can be imaged from the lower holding surface 311a side.

The holding mechanism 314 is a mechanism that holds the bonding tool 311. The holding mechanism 314 has a holding portion 315, a load control portion 316, and a rotation unit 317. The holding portion 315 is a plate-shaped member that holds the bonding tool 311 and releases the bonding tool 311 by canceling the holding state. The holding portion 315, like the bonding tool 311, is formed of a light-transmitting material such as glass. The holding portion 315 has a suction hole 315a. One end of the suction hole 315a is open on the bottom of the holding part 315, the other end is open on the side of the holding part 315, and communicates with a negative pressure generating circuit (not shown) including a vacuum pump or the like. there is. For this reason, the negative pressure generating circuit generates negative pressure to attract and hold the bonding tool 311 on the bottom surface of the holding portion 315. Additionally, by releasing the negative pressure, the holding state of the bonding tool 311 from the bottom surface is released.

The load control unit 316 is a member that controls the vertical position of the holding unit 315 and the load applied by the holding unit 315 to the electronic component 2. The load control unit 316 is an air bearing having a sleeve 316a and a movable shaft 316b. The sleeve 316a has a cylindrical gap penetrating upward and downward inside. The movable shaft 316b is a cylindrical body provided inside the sleeve 316a so that it can move up and down within a predetermined range. The upper surface of the holding portion 315 is provided at the lower end of the movable shaft 316b. In this way, by using air bearings, mounting with a low load of 1N or less becomes possible.

The rotation unit 317 has an outer cylinder 317a and a rotation shaft 317b rotatably provided within the outer cylinder 317a. The rotation shaft 317b is a cylindrical body and is provided so as to be able to rotate via a belt using a motor (not shown). The lower end of the rotation axis 317b is installed on the sleeve 316a of the load control unit 316. For this reason, the rotation unit 317 can rotate the bonding tool 311 held by the load control unit 316 in the horizontal direction. Thereby, the rotation unit 317 can position the electronic component 2 held by the bonding tool 311 in the θ-axis direction. Additionally, the head mark 313 can be imaged from above through the hollow portion of the rotation axis 317b, the hollow portion of the movable shaft 316b, and the translucent holding portion 315.

(Head moving mechanism)

The head moving mechanism 320 is a mechanism that moves the bonding head 310 back and forth between the delivery position P2 and the mounting position P3, and also raises and lowers the bonding head 310 in the delivery position P2 and the mounting position P3. The head moving mechanism 320 of the present embodiment, together with the above-mentioned rotation unit 317, positions the mounting surface 2a of the electronic component 2 with respect to the mounting area 3a of the substrate 3. Functions as a decision-making body. Specifically, the head moving mechanism 320 includes a slide mechanism 321 and a lifting mechanism 322.

The slide mechanism 321 moves the bonding head 310 back and forth between the delivery position P2 and the mounting position P3. Here, the slide mechanism 321 extends parallel to the X-axis direction and has two rails 321b fixed to the support frame 321a and a slider 321c running on the rails 321b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

In addition, although not shown, the slide mechanism 321 has a slide mechanism that slides the bonding head 310 in the Y-axis direction. This slide mechanism can also be comprised of a rail in the Y-axis direction and a slider running on the rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

The lifting mechanism 322 moves the bonding head 310 in the vertical direction. Specifically, the lifting mechanism 322 can use a linear guide in which the slider 322c moves on the rail 322b by a ball screw mechanism driven by the servo motor 322a. That is, the bonding head 310 moves up and down along the Z-axis direction by driving the servo motor 322a.

[Substrate stage]

The substrate stage 40 is a mechanism that supports the substrate 3 for mounting the electronic component 2 and positions the mounting area 3a at the mounting position P3. The substrate stage 40 is provided with a support 41 on which the substrate 3 is mounted on the stage moving mechanism 42. The stage moving mechanism 42 slides the support stand 41 on the XY plane and positions the mounting area 3a on the substrate 3 at the mounting position P3. The stage moving mechanism 42 can use, for example, a linear guide in which a slider moves on a rail using a ball screw mechanism driven by a servo motor.

[First imaging unit]

As shown in FIG. 7 (A), the first imaging unit 50 is provided at a position where it can image the electronic component 2 held by the bonding head 310 together with the head mark 313. As shown in FIG. 7(D), the image including the electronic component 2 and the head mark 313 captured by the first imaging unit 50 is called first image α. More specifically, the first imaging unit 50 has a camera, lens, barrel, light source, etc., and is installed at the delivery position P2 in this embodiment. The optical axis of the first imaging unit 50 is arranged in the vertical direction so that the camera faces upward and can image the electronic component 2 and the head mark 313 held by the bonding tool 311.

The first imaging unit 50 is provided so that the electronic component 2 and the head mark 313 do not deviate from the imaging field of view at the imaging position, that is, the transfer position P2. At the delivery position P2, there is variation in the position of the bonding head 310 positioned at the delivery position P2 and the holding position of the electronic component 2 delivered from the pickup nozzle 21 to the bonding tool 311. That is, the positions of the electronic component 2 and the head mark 313 change with respect to the delivery position P2. The maximum range of this variation becomes the range in which the electronic component 2 and the head mark 313 at the delivery position P2 can move as much as possible.

The first imaging unit 50 is designed to be capable of capturing images with sufficient magnification to ensure necessary mounting precision and with the illuminance of illumination by a light source and the brightness necessary for position recognition. In addition, the range in which the head mark 313 at the above-described delivery position P2 can move as much as possible is also taken into consideration, and has an imaging field of view (field of view) determined from those conditions. The first imaging unit 50 is provided at a position where the center of the imaging field of view coincides with the delivery position P2. The first imaging unit 50 is provided independently from the bonding head 310 and the pickup nozzle 21 so as not to interfere with their movement.

The first imaging unit 50 is fixedly supported at a position where the first image α can be captured. In this embodiment, the first imaging unit 50 is immobile with respect to the delivery position P2 of the electronic component 2. Floating as used here means that no movement is performed between the position retreating from the delivery position P2 and the delivery position P2, and may be moved up and down by several millimeters to focus the camera, for example.

[2nd imaging unit]

As shown in FIG. 7(B), the second imaging unit 60 images the substrate mark 3b at the mounting position P3. After that, the bonding head 310 moves to the mounting position P3, and as shown in FIG. 7 (C), the electronic component 2 held by the bonding head 310 faces the mounting area 3a. In this state, the head mark 313 is imaged. As shown in FIG. 7(E), the image of the board|substrate mark 3b imaged by the 2nd imaging part 60 is called 2nd image β. As shown in FIG. 7(F), the image of the head mark 313 imaged by the 2nd imaging part 60 is called third image γ. In addition, in Figure 7(E), the mounting area 3a is indicated by a dotted line to facilitate understanding. Similarly, in Fig. 7(F), the electronic component 2 is indicated by a dashed-dotted line, and the substrate mark 3b is indicated by a dashed-dotted line.

More specifically, the second imaging unit 60 has a camera, lens, barrel, light source, etc., and is supported by the frame 61 at a position above the bonding head 310 at the mounting position P3. there is. The optical axis of the second imaging unit 60 is arranged in the vertical direction so that the camera faces downward, passes through the holding unit 315, and can image the head mark 313.

The second imaging unit 60 is provided so that the substrate mark 3b of the substrate 3 and the head mark 313 of the bonding head 310 do not deviate from the imaging field of view at the imaging position, that is, the mounting position P3. there is. There is variation in the support position of the substrate 3 placed on the substrate stage 40. That is, the position of the substrate 3 changes with respect to the mounting position P3. For this reason, the position of the substrate mark 3b on the substrate 3 also changes. The maximum range of this variation becomes the range in which the board mark 3b of the board 3 at the mounting position P3 can move as much as possible. Additionally, there is variation in the position where the bonding head 310 reaches at the mounting position P3. That is, the position of the head mark 313 changes with respect to the mounting position P3. The maximum range of this variation is the range in which the head mark 313 at the mounting position P3 can move as much as possible.

The second imaging unit 60 is designed to be capable of capturing images with sufficient magnification to ensure necessary mounting precision and with the illuminance of illumination by a light source and the brightness necessary for position recognition. In addition, the range in which the substrate mark 3b and the head mark 313 at the above-described mounting position P3 can move as much as possible is also taken into consideration, and has an imaging field of view (field of view) determined from those conditions. The size of the bonding tool 311 of the bonding head 310 is set to match the imaging field of view of the second imaging unit 60.

The second imaging unit 60 is provided at a position where the center of the imaging field of view coincides with the mounting position P3. The second imaging unit 60 is provided independently from the bonding head 310 and the substrate stage 40 so as not to interfere with their movement.

The second imaging unit 60 is fixed and supported at a position where the second image β and the third image γ can be imaged. The second imaging unit 60 of this embodiment, like the first imaging unit 50, is immobile with respect to the mounting position P3 of the electronic component 2. Floating here means that no movement is performed between the position retreated from the mounting position P3 and the mounting position P3. For example, to focus the camera, it may be moved up and down by several millimeters.

Additionally, the coordinates of the first imaging unit 50 and the second imaging unit 60 are adjusted to match the coordinates of the mounting device 1. Specifically, the coordinates of the control device 70 are the XY coordinates in the design of the mounting device 1, and the origin can be the mounting position P3. Additionally, a vertex spaced a predetermined distance away from the origin can be set as the transfer position P2.

The coordinates of the second imaging unit 60 are set so that, for example, the imaging center becomes the origin of the XY coordinates, and this origin coincides with the mounting position P3 as mechanical or computable information. In this case, the reference position on the XY coordinates in the mounting device 1 is the mounting position P3, and the imaging center of the second imaging unit 60 is also the same reference position. Additionally, the coordinates of the first imaging unit 50 are set so that, for example, the imaging center becomes the origin of the XY coordinates, and this origin coincides with the transmission position P2 as mechanical or computable information. Since the transfer position P2 is a position spaced apart from the mounting position P3 by a predetermined distance, the imaging center of the first imaging unit 50 also has the same reference position of the mounting device 1.

[controller]

The control device 70 starts and stops the supply device 10, the pickup device 20, the mounting device 30, the substrate stage 40, the first imaging unit 50, and the second imaging unit 60. , speed, operation timing, etc. In order to realize various functions of the mounting device 1, the control device 70 has a processor that executes programs, a memory that stores various information such as programs and operating conditions, and a driving circuit that drives each element. Additionally, the control device 70 is connected to an input device through which the operator inputs instructions or information necessary for control, and an output device for checking the status of the device.

As shown in FIG. 1, the control device 70 of this embodiment includes a mechanism control unit 71, an image processing unit 72, a first position relationship calculation unit 73, a second position relationship calculation unit 74, It has a third position relationship calculation unit 75 and a storage unit 76. The mechanism control unit 71 controls the mechanisms of each part of the supply device 10, the pickup device 20, the placement device 30, and the substrate stage 40. For example, the mechanism control unit 71 controls the rotation unit 317 and the head movement mechanism 320 to place the mounting surface 2a of the electronic component 2 on the mounting area 3a of the substrate 3. Decide on location. Additionally, the mechanism control unit 71 controls the load control unit 316 to control the load applied by the bonding tool 311 to the electronic component 2 and the substrate 3.

The image processing unit 72 processes the first image α captured by the first imaging unit 50 to extract the head mark 313 and the shape of the electronic component 2. Additionally, the image processing unit 72 processes the second image β and the third image γ captured by the second imaging unit 60 to extract the shapes of the substrate mark 3b and the head mark 313. Additionally, since the size of the head mark 313 and the distance between the plurality of head marks 313 are known, the head marks imaged by each may be determined by the difference in magnification between the first imaging unit 50 and the second imaging unit 60. Even if there is a difference in the size of 313 and the distance of the plurality of head marks 313, correction can be made based on known size and distance data.

The first positional relationship calculation unit 73 detects the center of gravity, angle, etc. of the head mark 313 of the first image α and the electronic component 2, thereby calculating the first positional relationship, which is the positional relationship between the two. That is, the first position relationship calculation unit 73 calculates the position coordinates of the head mark 313 of the first image α in order to specify each position on a coordinate with the imaging center of the first imaging unit 50 as the origin. (X, Y, θ), obtain the position coordinates (X, Y, θ) of the electronic component 2.

The second positional relationship calculation unit 74 detects the center of gravity, angle, etc. of the substrate mark 3b of the second image β and the head mark 313 of the third image γ, thereby determining the second positional relationship between the two. Calculate . The second image β and the third image γ are both captured by the same second image capturing unit 60. Therefore, the second image β and the third image γ have the same coordinate system of the second imaging unit 60. Additionally, since the images are captured by the fixed second imaging unit 60, there is no origin deviation between the second image β and the third image γ. That is, the second positional relationship calculation unit 74 specifies the positions of the substrate mark 3b and the head mark 313, which are the second positional relationship, on coordinates with the imaging center of the second imaging unit 60 as the origin. To this end, the position coordinates (X, Y, θ) of the substrate mark 3b of the second image β and the position coordinates (X, Y, θ) of the head mark 313 of the third image γ are obtained.

The third positional relationship calculation unit 75 calculates the third positional relationship, which is the positional relationship between the electronic component 2 and the substrate mark 3b, based on the first positional relationship and the second positional relationship. That is, the amount of deviation between the positional coordinates of the head mark 313 in the first positional relationship and the positional coordinates of the head mark 313 in the second positional relationship, and the electronic component 2 in the first positional relationship The amount of deviation between the position coordinates of and the position coordinates of the substrate mark 3b in the second position relationship is determined. That is, the amount of deviation between the position of the head mark 313 at the receiving position P2 and the position at the mounting position P3 is determined and added to the amount of deviation between the electronic component 2 and the substrate mark 3b, thereby determining the mounting position. The position of the electronic component 2 with respect to the position of the substrate mark 3b in P3 can be obtained.

Based on the third positional relationship, the mechanism control unit 71 adjusts the electronic component 2 in a movement amount and direction in which the amount of misalignment is corrected and the electronic component 2 and the substrate mark 3b match (within the allowable range for mounting). ) is controlled so that the positioning mechanism (rotating unit 317 and head moving mechanism 320) moves. After this positioning, the mechanism control unit 71 lowers the bonding head 310 by the lifting mechanism 322 of the head moving mechanism 320 and places the electronic component 2 in the mounting area 3a of the substrate 3. ) is installed.

Additionally, the image processing unit 72 and the first positional relationship calculation unit 73 may be configured in a circuit included in the first imaging unit 50. Additionally, the image processing unit 72, the second positional relationship calculation unit 74, and the third positional relationship calculation unit 75 may be configured in a circuit included in the second imaging unit 60.

The storage unit 76 is a storage device that includes various types of memory (HDD: Hard Disk Drive, SSD: Solid State Drive, etc.) as a recording medium, a recording medium, and an external interface. The storage unit 76 stores data and programs necessary for the operation of the mounting device 1. Required data includes, for example, first image α, second image β, third image γ, first position relationship, second position relationship, third position relationship, various thresholds, etc. Additionally, data output from each device is also appropriately stored in the storage unit 76. In the following description, data output from each device, such as images captured by the first imaging unit 50 and images captured by the second imaging unit 60, are also acquired using the storage unit 76. It is equivalent to remembering.

[movement]

In the above mounting device 1, the electronic component 2 is picked up from the supply device 10 by the pickup device 20, and the electronic component 2 is delivered to the mounting device 30 and mounted. The procedure for mounting the electronic component 2 on the board 3 in the device 30 will be explained in addition to FIGS. 1 to 7 described above with reference to the flowchart of FIG. 8 .

That is, the pickup nozzle 21 is moved to the supply position P1 by the moving mechanism 22 of the pickup device 20. On the other hand, the supply device 10 moves the supply stage 12 and positions the electronic component 2 to be picked up at the supply position P1. After this, the pickup nozzle 21 descends, approaches the electronic component 2, and comes into contact with the electronic component 2 and stops. Then, with the pickup nozzle 21 stopped, suction from the nozzle hole starts. In this state, when the pickup nozzle 21 rises, the electronic component 2 sucked by the pickup nozzle 21 is picked up from the tray 11.

The pickup device 20 inverts the pickup nozzle 21 using the inversion mechanism 23 . The pickup device 20 moves the picked up electronic component 2 to the delivery position P2 using the moving mechanism 22 . 3 and 4, at the delivery position P2, the bonding head 310 of the mounting device 30 is on standby and faces the electronic component 2 held by the inverted pickup nozzle 21. . After raising the pickup nozzle 21 toward the bonding head 310 and attaching and holding the electronic component 2 to the adhesive portion 312 of the bonding tool 311, the pickup nozzle 21 releases the negative pressure. By doing so, the electronic component 2 is transferred to the bonding head 310. After this, the pickup nozzle 21 descends to be spaced apart from the bonding head 310 and returns to the supply position P1.

In this state, as shown in Fig. 7 (A) and (D), the first imaging unit 50 captures the first image α (step S101). That is, the first imaging unit 50 images the head mark 313 provided on the bonding tool 311 along with the electronic component 2 held by the bonding tool 311. The first position relationship calculation unit 73 calculates the first position relationship based on the first image α processed by the image processing unit 72 (step S102). Additionally, in parallel with this, as shown in FIGS. 7B and 7E , the second imaging unit 60 captures the second image β (step S103). That is, the second imaging unit 60 is supported on the substrate stage 40 and images the substrate mark 3b of the substrate 3 with the mounting area 3a positioned at the mounting position P3.

Next, as shown in FIGS. 1 and 2, the bonding head 310 moves to the mounting position P3, thereby connecting the mounting surface 2a of the electronic component 2 and the mounting area 3a of the substrate 3. Face each other (step S104). Then, as shown in FIGS. 7(C) and 7(F), the second imaging unit 60 captures the third image γ (step S105). That is, the second imaging unit 60 transmits the holding portion 315 and images the head mark 313 of the bonding tool 311. The second position relationship calculation unit 74 calculates the second position relationship based on the second image β and the third image γ processed by the image processing unit 72 (step S106).

The third positional relationship calculation unit 75 calculates the third positional relationship based on the first positional relationship and the second positional relationship (step S107). That is, the amount of deviation of X, Y, and θ of the head mark 313 and the amount of deviation of X, Y, and θ of the electronic component 2 and the substrate mark 3b are determined. The mechanism control unit 71 determines the position by operating the rotation unit 317 and the head movement mechanism 320 so that the amount of misalignment is eliminated based on the third positional relationship (step S108). Then, as shown in FIG. 5, the bonding head 310 is lowered by the lifting mechanism 322 of the head moving mechanism 320, and the electronic component 2 is mounted on the mounting area 3a of the substrate 3. Do it (step S109).

[Calculation of positional relationship]

The calculation of the above positional relationship will be explained in more detail. In addition, “in the coordinate system” in the description below refers to the positions of X, Y, and θ with respect to the origin in each of the above-mentioned coordinates. First, based on the first image α, the position of the head mark 313 is calculated in the coordinate system of the first imaging unit 50 at the delivery position P2. Additionally, the position of the electronic component 2 is calculated in the coordinate system of the first imaging unit 50. Next, based on the second image β at the mounting position P3, the position of the substrate mark 3b is calculated in the coordinate system of the second imaging unit 60. Furthermore, based on the third image γ, the position of the head mark 313 is calculated in the coordinate system of the second imaging unit 60. Then, the amount of deviation between the position of the head mark 313 in the coordinate system of the first imaging unit 50 and the position of the head mark 313 in the coordinate system of the second imaging unit 60 is determined. Since the head mark 313 is common, this amount of deviation corresponds to the deviation between the coordinate system of the first imaging unit 50 and the coordinate system of the second imaging unit 60.

Therefore, the position of the electronic component 2 in the coordinate system of the first imaging unit 50 can be converted to the position in the coordinate system of the second imaging unit 60 by correcting this amount of deviation. The amount of deviation between the position of the electronic component 2 in the converted coordinate system of the second imaging unit 60 and the substrate mark 3b in the coordinate system of the second imaging unit 60 is at the mounting position P3. It corresponds to the amount of deviation between the electronic component 2 and the substrate mark 3b, that is, it becomes a third positional relationship. The mechanism control unit 71 positions the electronic component 2 and the substrate mark 3b, which are in the third positional relationship, so that the amount of misalignment is eliminated. Thereby, the electronic component 2 is mounted on the mounting area of the board 3 to be mounted.

[effect]

(1) The mounting device 1 of the present embodiment has a bonding head 310 provided with a head mark 313, and the electronic component 2 held by the bonding head 310 is placed at the mounting position P3. The first image α captures the mounting device 30 mounted on the mounting area 3a of the substrate 3 and the electronic component 2 held by the bonding head 310 together with the head mark 313. After imaging the first imaging unit 50 provided at a position capable of imaging, a second image β for imaging the substrate mark 3b provided in the mounting area 3a at the mounting position P3, and the second image β. , the bonding head 310 is positioned at the mounting position P3, and the electronic component 2 held by the bonding head 310 faces the mounting area 3a, and the head mark 313 is imaged. It has a second imaging unit 60 capable of capturing three images γ.

Additionally, the mounting device 1 includes a first position relationship calculation unit 73 that calculates a first position relationship, which is the position relationship between the head mark 313 and the electronic component 2, based on the first image α; Based on the second image β and the third image γ, a second positional relationship calculation unit 74 that calculates a second positional relationship that is the positional relationship between the head mark 313 and the substrate mark 3b, and a first positional relationship and a second positional relationship. 2 Based on the positional relationship, a third positional relationship calculation unit 75 that calculates a third positional relationship that is the positional relationship between the electronic component 2 and the substrate mark 3b, and based on the third positional relationship, an electronic component ( Before mounting 2), there is a positioning mechanism for positioning the electronic component 2 and the substrate mark 3b.

In addition, in the mounting method of the present embodiment, the electronic component 2 held by the first imaging unit 50 on the bonding head 310 provided with the head mark 313 is held together with the head mark 313. The captured first image α is imaged, and the substrate mark 3b provided in the mounting area 3a of the electronic component 2 in the substrate 3 is imaged by the second imaging unit 60. After imaging the image β and capturing the second image β by the second imaging unit 60, the bonding head 310 is arranged so that the electronic component 2 faces the mounting area 3a, The third image γ in which the head mark 313 is imaged is captured.

The first positional relationship calculation unit 73 calculates a first positional relationship, which is the positional relationship between the head mark 313 and the electronic component 2, based on the first image α, and the second positional relationship calculation unit 74 First, based on the second image β and the third image γ, a second positional relationship, which is the positional relationship between the head mark 313 and the substrate mark 3b, is calculated, and the third positional relationship calculation unit 75 calculates the first positional relationship. Based on the positional relationship and the second positional relationship, a third positional relationship that is the positional relationship between the electronic component 2 and the substrate mark 3b is calculated, and the positioning mechanism calculates the electronic component 2 based on the third positional relationship. ) and the substrate mark 3b are positioned, and the mounting device 30 mounts the electronic component 2 held by the bonding head 310 on the mounting area 3a of the substrate 3.

In this way, since the first image α captured by the first imaging unit 50 and the third image γ captured by the second imaging unit 60 include the common head mark 313, the first image capturing unit 50 The amount of deviation in the positional relationship between 50 and the second imaging unit 60 can be canceled. In addition, since the second image β including the substrate mark 3b and the third image γ including the head mark 313 are imaged by the same second imaging unit 60, the position of the substrate mark 3b and The positional relationship of the head mark 313 becomes constant. Additionally, since the second image pickup unit 60 images the second image β and the third image γ at the same mounting position P3, movement error of the second image pickup unit 60 does not occur. For this reason, the electronic component 2 can be accurately positioned and mounted with respect to the mounting area 3a of the substrate 3. Therefore, this embodiment is particularly suitable for cases where the electronic component 2 needs to be mounted with high precision, such as a micro LED repair process.

In addition, imaging by the second imaging unit 60 at the mounting position P3 uses only the head mark 313, and there is no need to image the electronic component 2 and the substrate mark 3b, so the configuration is simplified. can do. In other words, for example, an imaging unit that simultaneously captures images in both the upper and lower directions becomes unnecessary, so the imaging position does not change for each image taken when the imaging unit is entered, and errors in the imaging positions of the upper and lower cameras do not occur. Since there is no need to separate the bonding head 310 and the substrate 3 significantly in order to introduce the camera, the amount of movement during mounting after positioning can be suppressed, and movement errors can be reduced. In particular, since the distances at the time of alignment and the time of mounting can be brought closer, deviation in the horizontal direction after alignment can be suppressed as much as possible. Moreover, since there is no need to recognize the electronic component 2 and the board mark 3b at the mounting position P3, positioning is possible even if both overlap.

Additionally, the cameras used in the first imaging unit 50 and the second imaging unit 60 may be any camera capable of imaging the electronic component 2, head mark 313, and substrate mark 3b, and are limited to specific cameras. It doesn't work. However, since a normal camera that captures visible light can be used and there is no need to use a special camera such as an infrared camera, device costs can be kept down while ensuring mounting precision.

(2) The head mark 313 is provided on the outside of the electronic component 2 held by the bonding head 310 in plan view. For this reason, the first imaging unit 50 can capture images of the head mark 313 and the electronic component 2 while clearly distinguishing them. In holding using PDMS as in the above-described embodiment, the size of the PDMS film varies greatly and the head mark 313 is covered, or the head mark 313 is contaminated during formation of the PDMS film, making it impossible to capture images. is assumed, but it can be avoided. Of course, even when the electronic component 2 is held by suction, the holding position varies, so it is possible to avoid the head mark 313 being covered and making it impossible to capture an image.

(3) The bonding head 310 has a bonding tool 311 for holding the electronic component 2 and a holding portion 315 for holding the bonding tool 311, and the head mark 313 is, It is provided in the bonding tool 311. For this reason, the difference in distance between the electronic component 2 and the head mark 313 between the first imaging unit 50 is small, and when the first imaging unit 50 captures the first image α, it is possible to focus on both. It becomes easier, and there are fewer errors in recognizing the positions of both parties. In addition, the second imaging unit 60 can image the head mark 313 at a position close to the substrate 3 at the mounting position P3, so the focus when imaging the second image β and the third The focus when capturing the image γ becomes closer, and the error in position recognition of the imaged substrate mark 3b and the head mark 313 is small.

(4) The bonding tool 311 and the holding portion 315 are transparent. For this reason, the first imaging unit 50 and the second imaging unit 60 can image the head mark 313 from either the top or bottom. For this reason, the head mark 313, which requires high precision, only needs to be provided at one location, and thus the device cost can be reduced. In addition, even when images are captured by each imaging unit (the first imaging unit 50 and the second imaging unit 60) at separate locations, the same head mark 313 is imaged, so differences in the imaging units can be canceled. there is.

(5) The head mark 313 is a concave portion. For this reason, the head mark 313 is easy to form and is unlikely to be lost due to contact with another member. For example, there is little change due to wear due to contact between the bonding tool 311 and the holding portion 315.

(6) The first imaging unit 50 is fixedly supported at a position where the first image α can be captured. Additionally, the second imaging unit 60 is fixed and supported at a position where the second image β and the third image γ can be imaged. For this reason, there is no error due to movement of the first imaging unit 50 and the second imaging unit 60. Additionally, since there is no need for a mechanism for movement, it can be constructed simply and inexpensively.

[Variation example]

The present invention is not limited to the above-described embodiments. The basic configuration is the same as the above-described embodiment, and the following modifications are also applicable.

(1) The positions and numbers of the head marks 313 are not limited to the above. For example, as shown in (A) of FIG. 9, by providing the head mark 313 on the holding surface 311a of the bonding tool 311, the focus can be brought closer to the electronic component 2. there is. Accordingly, a clear image of the head mark 313 and the electronic component 2 can be obtained, and the accuracy of position recognition can be improved. Additionally, as shown in FIG. 9B, a head mark 313 may be provided on the upper surface of the holding portion 315. In this case, since there is no contact with the head mark 313, there is no case of scratches or peeling even if a metal film as described later is provided. Since the position and shape of the head mark 313 can be accurately formed by the metal film, the position recognition accuracy can be improved. Additionally, as shown in FIG. 9C, the head mark 313 may be provided on the lower surface of the holding portion 315. In this case, in the holding using PDMS as in the above-described embodiment, it is assumed that the PDMS film may be contaminated or covered during formation and become unrecognizable, but this can be avoided. Of course, it is also possible to avoid that the head mark 313 is peeled off or scratched and becomes unrecognizable due to contact with the electronic component 2 due to suction and holding, etc. 6 and 9(C) are also examples in which the head mark 313 is provided between the bonding tool 311 and the holding portion 315.

(2) The aspect of the head mark 313 is not limited to the above-described concave portion. For example, it may be formed by depositing a metal film. As the metal film, chromium (Cr) is used, for example. As a result, the precision of the shape of the head mark 313 can be increased. However, to prevent peeling due to contact with other members, it is desirable to provide a transparent cover to cover the metal film, or to form the metal film at the bottom of the step or recess. The aspect of the substrate mark 3b is also not limited to the above-mentioned electrode. The mark may be formed separately from the electrode.

(3) In the above embodiment, the bonding tool 311 and the holding portion 315 are assumed to be transparent, but they do not necessarily have to be transparent. Any configuration that can accurately image the head mark 313 from the vertical direction is sufficient. For example, the head mark 313 may be referred to as a through hole. In addition, by providing the head mark 313 on both sides of the bonding tool 311 and the holding portion 315, the first imaging unit 50, which captures images from below, and the second imaging unit 60, which captures images from above, The head mark 313 can be imaged.

(4) The electronic component 2 is not limited to micro LED, and can be applied to various electronic components 2 mounted on the substrate 3. In the above-described embodiment, in the supply device 10, the electronic component 2 was arranged in a face-up state with the functional surface provided with electrodes etc. exposed upward, but the functional surface was positioned on the tray 11 side below. It may be placed in a face-down state. In addition, the electronic component 2 includes cases where it is mounted face down or face up with respect to the board 3. That is, the electronic component 2 arranged face-up can be face-down bonded by being reversed, and face-up bonding can be performed by providing a relay device and passing through this relay device. Additionally, the electronic component 2 arranged face down can be face-up bonded by being reversed, and face-down bonding can be done by passing through a relay device.

In the case of passing through a relay device, the picked up electronic component 2 is first loaded on the relay device and imaged in that state by the first imaging unit 50. Accordingly, the first imaging unit 50 It is placed above the relay device. That is, by placing the two first imaging units 50 between the top and bottom of the relay device, images can be captured by switching between cases where the relay device passes through the relay device and when it does not pass through the relay device. By doing so, both face-up bonding and face-down bonding can be used, and the application range of the mounting form in the mounting device 1 can be expanded. Additionally, as will be described later, the first imaging unit 50 may be disposed only above the relay device.

Additionally, if the stage on which the electronic component 2 of the relay device is mounted is made transparent, the electronic component 2 loaded on the relay device can be imaged by the first imaging unit 50 from the bottom of the relay device. there is. In this case as well, both face-up bonding and face-down bonding can be used.

In addition, in any case, the bonding tool 311 is brought close to the electronic component 2 loaded on the relay device, or the bonding tool 311 is brought into contact with the electronic component 2 loaded on the relay device to receive it. In this state, imaging is performed by the first imaging unit 50. As a result, the respective focal distances of the head mark 313 and the electronic component 2 from the first imaging unit 50 can be brought close to each other, and both can be clearly imaged. Additionally, the relay device may be provided to be detachable or may be provided to be retractable from the delivery position P2.

(5) The first imaging unit 50 may be disposed at a position above the bonding head 310 at the delivery position P2, regardless of the presence or absence of a relay device. That is, the first imaging unit 50 may be configured so that the camera faces downward and transmits and captures the head mark 313 and the electronic component 2 below.

In addition, in the above-described aspect, the first imaging unit 50 was installed at the delivery position P2. However, the first imaging unit 50 may be installed at a position where the electronic component 2 held by the bonding head 310 can be imaged together with the head mark 313. Between the delivery position P2 and the mounting position P3, the first imaging unit 50 may be installed anywhere on the movement path of the bonding head 310. In this case as well, the first imaging unit 50 can be installed both above and below the bonding head 310. An appropriate installation location can be determined depending on the layout of other units such as the substrate stage 40.

When the first imaging unit 50 is installed in the path of the bonding head 310, the movement of the bonding head 310 may or may not be stopped for imaging. When stopping, time is required for stopping, but clearer images can be captured and position recognition accuracy can be improved. When imaging while moving without stopping, the time for stopping and the time for imaging can be shortened from the throughput. When capturing images while moving, it is desirable to speed up the shutter speed and brighten the lighting in order to maintain recognition accuracy. Whether or not to stop can be determined appropriately based on the required precision and throughput.

In addition, when installed at the delivery position P2, the first image α can be captured in the same state as when the electronic component 2 was delivered immediately after delivery and before the bonding head 310 starts moving, Although it takes time for imaging, as described above, there is no decrease in recognition accuracy due to imaging after the bonding head 310 has paused from the start of movement or imaging while moving.

(6) Holding of the electronic component 2 by the bonding head 310 is not limited to adhesion. For example, it may be suction-maintained by negative pressure. For example, the end of the suction path connected to the negative pressure generation circuit is a suction port opened in the holding surface of the electronic component 2 of the bonding tool 311, and the electronic component 2 is in this suction port. You may maintain suction.

(7) The supply device 10 may be a device having a supply stage that supports the sheet to which the electronic component 2 is attached, and a push-up mechanism that pushes the electronic component 2 up through the sheet during pickup.

[Other Embodiments]

The present invention is not limited to the above-described embodiments, and also includes a combination of all or any of the above-described embodiments. In addition, various omissions, substitutions, and changes may be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention.

1: Mounting device
2: Electronic components
2a: Real scene
3: Substrate
3a: Mounting area
3b: substrate mark
10: Supply device
11: tray
12: Supply stage
13: Stage moving mechanism
20: pickup device
21: Pick-up nozzle
22: moving mechanism
22a: cancer
22b: Slide mechanism
22c: support frame
22d: rail
22e: slider
22f: lifting mechanism
23: Inversion mechanism
30: Payload device
40: substrate stage
41: support
42: Stage moving mechanism
50: first imaging unit
60: second imaging unit
61: frame
70: control device
71: Mechanism control unit
72: Image processing unit
73: First position relationship calculation unit
74: Second position relationship calculation unit
75: Third position relationship calculation unit
76: memory unit
310: bonding head
311: Bonding tool
311a: holding surface
311b: Pyujimyeon
312: Adhesive part
313: head mark
314: holding support mechanism
315: holding support
315a: suction hole
316: load control unit
316a: sleeve
316b: movable shaft
317: rotation unit
317a: outer cylinder
317b: rotation axis
320: Head moving mechanism
321: Slide mechanism
321a support frame
321b: rail
321c: slider
322: Elevating mechanism
322a: servo motor
322b: rail
322c: slider

Claims (10)

A mounting device that has a bonding head provided with a head mark and mounts the electronic component held by the bonding head on a mounting area of the substrate at the mounting position;
a first imaging unit provided at a position capable of capturing a first image of the electronic component held by the bonding head together with the head mark;
At the mounting position, a second image for imaging a substrate mark provided in the mounting area, and after imaging the second image, the bonding head is positioned at the mounting position, and the bonding head is held by the bonding head. a second imaging unit provided to capture a third image of the head mark with the electronic component facing the mounting area;
a first position relationship calculation unit that calculates a first position relationship between the head mark and the electronic component based on the first image;
a second positional relationship calculation unit that calculates a second positional relationship, which is a positional relationship between the head mark and the substrate mark, based on the second image and the third image;
a third positional relationship calculation unit that calculates a third positional relationship, which is a positional relationship between the electronic component and the substrate mark, based on the first positional relationship and the second positional relationship;
Based on the third positional relationship, a positioning mechanism for positioning the electronic component and the substrate mark before mounting the electronic component
A mounting device characterized by having. The mounting device according to claim 1, wherein the head mark is provided on an outside of the electronic component held by the bonding head when viewed from a plan view. The method of claim 1 or 2, wherein the bonding head,
A bonding tool for holding and supporting the electronic component,
A holding portion that holds and supports the bonding tool.
Have,
The head mark is provided on the bonding tool. The method of claim 1 or 2, wherein the bonding head,
A bonding tool for holding and supporting the electronic component,
A holding portion that holds and supports the bonding tool.
Have,
A mounting device characterized in that the head mark is provided on the holding portion. The method of claim 1 or 2, wherein the bonding head,
A bonding tool for holding and supporting the electronic component,
A holding portion that holds and supports the bonding tool.
Have,
The mounting device, wherein the head mark is provided between the bonding tool and the holding portion. The method of claim 1 or 2, wherein the bonding head,
A bonding tool for holding and supporting the electronic component,
A holding portion that holds and supports the bonding tool
Have,
A mounting device characterized in that the bonding tool and the holding portion have light transparency. The mounting device according to claim 1 or 2, wherein the head mark is a concave portion. The mounting device according to claim 1, wherein the first imaging unit is fixedly supported at a position capable of capturing the first image. The mounting device according to claim 1 or 8, wherein the second imaging unit is fixedly supported at a position from which the second image and the third image can be captured. An electronic component held by a bonding head provided with a head mark is imaged by a first imaging unit, and a first image captured together with the head mark is captured,
A second image is captured by a second imaging unit, in which a substrate mark provided in a mounting area of the electronic component on the substrate is imaged,
After capturing the second image by the second imaging unit, a third image in which the head mark is captured is captured in a state in which the bonding head is disposed so that the electronic component faces the mounting area,
A first positional relationship calculation unit calculates a first positional relationship, which is a positional relationship between the head mark and the electronic component, based on the first image,
A second positional relationship calculation unit calculates a second positional relationship, which is a positional relationship between the head mark and the substrate mark, based on the second image and the third image,
A third positional relationship calculation unit calculates a third positional relationship, which is a positional relationship between the electronic component and the substrate mark, based on the first positional relationship and the second positional relationship,
A positioning mechanism positions the electronic component and the substrate mark based on the third positional relationship,
A mounting device mounts the electronic component held by the bonding head on the mounting area of the substrate.
A mounting method characterized by having:

Images