JP2020017559A - Transfer mechanism, electronic component manufacturing installation, transfer method and manufacturing method of electronic component - Google Patents

Abstract

To restrain up-sizing of device and complication in the structure of the device.SOLUTION: A transfer mechanism comprises a holding mechanism (21) capable of holding a transferred object (5a) and configured movably, a light source (32), an optical marking section (33) capable of optically forming an optical mark (37), a first camera (101) including a first image pick-up device (31) configured to image the optical mark (37) and a transfer target position (23a) of the transferred object (5a), a second camera (102) including a second image pick-up device (41) configured to be able to image the transferred object (5a) held by the holding mechanism (21) and the optical mark (37), and a calculation mechanism (27) configured to be able to correct the travel of the transferred object (5a) up to the transfer target position (23a) on the basis of the relative position displacement of the first camera (101) and the second camera (102).SELECTED DRAWING: Figure 22

Description

  The present disclosure relates to a transport mechanism, an electronic component manufacturing apparatus, a transport method, and an electronic component manufacturing method.

  Patent Document 1 discloses a first recognition camera for recognizing a position of a substrate, a second recognition camera for recognizing a position of a semiconductor chip, and setting of reference positions of the first and second recognition cameras. And a chip bonding apparatus having a correction mechanism used for the above.

  In the chip bonding apparatus described in Patent Literature 1, the reference positions of the first recognition camera and the second recognition camera are set as follows. First, the rod of the correction mechanism is extended, and the target provided with the cross-shaped specific mark at the same position on both the front and back sides is advanced to a predetermined position and stopped. The stop position of the target is a position where the center intersection of the specific mark comes below the center of the second recognition camera.

  Next, the first recognition camera is moved so that the center intersection of the cross figure as the specific mark is located at the center of the first recognition camera. Thus, the center of the first recognition camera, the center of the second recognition camera, and the center intersection of the specific mark are located coaxially. The X-axis position and the Y-axis position at this time are recorded in the storage device as the first recognition camera, the second recognition camera, and the reference position of the target.

  Then, after a predetermined number of chip bondings or after a lapse of a predetermined time, a relative shift amount of the first recognition camera with respect to the reference position and a relative shift amount of the second recognition camera with respect to the reference position are detected. The relative displacement between the first recognition camera and the second recognition camera is calculated based on the detected relative displacement. The positional relationship between the substrate and the semiconductor chip is corrected in consideration of the calculated relative shift amount as a correction amount, and chip bonding is restarted.

JP-A-7-7028

  However, in the chip bonding apparatus described in Patent Document 1, it is necessary to provide a moving space for a correction mechanism having a rod and a target in setting the reference positions of the first recognition camera and the second recognition camera. Therefore, there is a problem that the apparatus becomes large.

  Further, in the chip bonding apparatus described in Patent Literature 1, it is necessary to attach a correction mechanism to the apparatus, so that there is a problem that the structure of the apparatus becomes complicated.

  According to the embodiment disclosed herein, a holding mechanism configured to be capable of holding and moving a transferred object, a light source, and optically forming an optical mark in an optical path of light emitted from the light source. An optical mark forming unit, a first camera including a first image sensor configured to be able to image the optical mark and a transfer destination of the transferred object, and a transferred object held by a holding mechanism And a second camera provided with a second image sensor configured to capture an optical mark, and an object to be transported to a transfer destination position based on an amount of relative displacement between the first camera and the second camera. An operation mechanism configured to be able to correct the moving distance of the object can be provided.

  According to the embodiment disclosed herein, a holding mechanism configured to be capable of holding and moving a transferred object, a light source, and optically forming an optical mark in an optical path of light emitted from the light source. A first optical image forming unit configured to be capable of imaging an optical mark forming unit, a surface on which a non-optical mark is provided, a target position of an object to be conveyed, and a non-optical mark; A camera, a second camera provided with a second image sensor configured to be able to image the transferred object and the optical mark held by the holding mechanism, and configured to be able to image an optical mark and a non-optical mark A third camera provided with the third image pickup device, and a configuration in which the moving distance of the object to be conveyed to the transfer destination can be corrected based on the relative positional shift amount between the first camera and the second camera. A transport mechanism that includes It can be.

  According to the embodiment disclosed herein, it is possible to provide an electronic component manufacturing apparatus including the above-described transport mechanism.

  According to the embodiment disclosed herein, a step of holding an object to be transferred by a holding mechanism, a step of optically forming an optical mark, and a step of forming an optical mark by a first imaging device of a first camera. An imaging step, an imaging step of an optical mark by a second imaging element of the second camera, an imaging step of an object held by the holding mechanism by the second imaging element, and a first imaging step A step of capturing an image of the transfer target position of the object to be transferred by the element, a step of calculating a relative position shift amount between the first camera and the second camera, and a step of calculating the relative position shift amount based on the relative position shift amount. It is possible to provide a transport method including a step of correcting a moving distance of a transported object and a step of placing the transported object at a transport destination.

  According to the embodiment disclosed herein, a step of holding an object to be transported by a holding mechanism, a step of optically forming an optical mark, and a step of non-optical mark by a first imaging element of a first camera. Imaging the optical mark, imaging the optical mark with the second imaging element of the second camera, and imaging the non-optical mark with the third imaging element of the third camera attached to the holding mechanism. A step of imaging the transported object held by the holding mechanism by the second image sensor, a step of imaging the transport target location of the transported object by the first image sensor, and a first camera and a second camera. Calculating the relative position shift amount with respect to the camera, correcting the moving distance of the transferred object to the transfer destination based on the relative position shift amount, and placing the transferred object at the transfer target position. Transporting, comprising: The law can be provided.

  According to the embodiment disclosed herein, the method includes a step of transporting a transported object to a transport destination by the transport method described above, the transported object includes a semiconductor package, and a semiconductor package substrate is cut to manufacture a semiconductor package. A method for manufacturing an electronic component, further comprising the step of:

  According to the embodiments disclosed herein, it is possible to provide a transport mechanism, an electronic component manufacturing apparatus, a transport method, and a method of manufacturing an electronic component that can suppress an increase in the size of the apparatus and the complexity of the structure of the apparatus.

FIG. 2 is a schematic plan view of the electronic component manufacturing apparatus according to the first embodiment. FIG. 9 is a schematic side view illustrating an example of the operation of the substrate supply mechanism A. FIG. 9 is a schematic side view illustrating an example of the operation of the substrate supply mechanism A. FIG. 9 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B. FIG. 9 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B. FIG. 9 is a schematic side view illustrating an example of the operation of the substrate cutting mechanism B. FIG. 9 is a schematic side view illustrating an example of the operation of the cleaning mechanism C. FIG. 9 is a schematic side view illustrating an example of the operation of the cleaning mechanism C. FIG. 9 is a schematic side view illustrating an example of the operation of the transport mechanism D. FIG. 9 is a schematic side view illustrating an example of the operation of the transport mechanism D. FIG. 9 is a schematic side view illustrating an example of the operation of the transport mechanism D. FIG. 9 is a schematic side view illustrating an example of the operation of the transport mechanism D. FIG. 9 is a schematic side view illustrating an example of the operation of the transport mechanism D. FIG. 7 is a schematic side view illustrating an example of an operation in which a holding mechanism holds a semiconductor package. FIG. 9 is a schematic cross-sectional view illustrating another example of the operation in which the holding mechanism holds the semiconductor package. FIG. 10 is a schematic side view illustrating an example of an operation of capturing an image of a semiconductor package held by a second image sensor by a holding mechanism from below in a Z-axis direction. FIG. 9 is a schematic side view illustrating an example of an operation in which a first imaging element captures an image of an opening of an arrangement member from above in a Z-axis direction. FIG. 4 is a schematic cross-sectional view illustrating an example of an operation of performing alignment of a semiconductor package. FIG. 5 is a schematic cross-sectional view illustrating an example of an operation for arranging semiconductor packages. FIG. 5 is a schematic partial perspective side view illustrating an example of an operation in which a first imaging element captures an optical mark formed optically. FIG. 4 is a schematic plan view of an example of an image of an optically formed optical mark captured by a first image sensor. It is a typical partial see-through side view which illustrates an example of the operation in which the second imaging element captures an optical mark formed optically. FIG. 9 is a schematic plan view of an example of an image of an optically formed optical mark captured by a second image sensor. 4A to 4D are schematic side views illustrating an example of the operation of the transport mechanism D. FIG. 13 is a schematic plan view illustrating an example of the operation of the transport mechanism of the electronic component manufacturing device according to the second embodiment. FIG. 13 is a schematic plan view illustrating an example of the operation of the transport mechanism of the electronic component manufacturing device according to the second embodiment. FIG. 13 is a schematic plan view illustrating an example of the operation of the transport mechanism of the electronic component manufacturing device according to the second embodiment. FIG. 13 is a schematic plan view illustrating an example of the operation of the transport mechanism of the electronic component manufacturing device according to the second embodiment. FIG. 13 is a schematic plan view illustrating an example of the operation of the transport mechanism of the electronic component manufacturing device according to the second embodiment. FIG. 13 is a schematic partial perspective side view of an example of a first camera of the electronic component manufacturing apparatus according to the third embodiment. FIG. 13 is a schematic partial perspective side view of an example of a first camera of the electronic component manufacturing apparatus according to the third embodiment. FIG. 31 is a schematic plan view illustrating an example of an image of an optical mark captured by a first image sensor of the first camera in the state illustrated in FIG. 30. FIG. 32 is a schematic plan view illustrating an example of an image of a surface captured by the first image sensor of the first camera in the state illustrated in FIG. 31. FIG. 13 is a schematic partial perspective side view of another example of the first camera of the electronic component manufacturing apparatus according to the third embodiment.

  Hereinafter, embodiments will be described. In the drawings used for describing the embodiments, the same reference numerals represent the same or corresponding parts.

<First embodiment>
FIG. 1 is a schematic plan view of the electronic component manufacturing apparatus according to the first embodiment. The electronic component manufacturing apparatus according to the first embodiment illustrated in FIG. 1 includes a substrate supply mechanism A, a substrate cutting mechanism B, a cleaning mechanism C, and a transport mechanism D.

  As shown in FIG. 1, the substrate supply mechanism A includes a substrate loading unit 1 for loading a semiconductor package substrate 5 and a substrate supply table 7 for placing the semiconductor package substrate 5 taken out from the substrate loading unit 1. A package inloader 6 for holding the semiconductor package substrate 5 and supplying it to the substrate cutting mechanism B; and a rail 6a for moving the package inloader 6 to the substrate cutting mechanism B.

  2 and 3 are schematic side views illustrating an example of the operation of the substrate supply mechanism A. The substrate supply mechanism A operates, for example, as follows. First, as shown in FIG. 2, the semiconductor package substrate 5 loaded in the substrate loading section 1 is extruded in the X-axis direction by the substrate push-out member 2 and placed on the substrate supply table 7. Next, the package inloader 6 located above the semiconductor package substrate 5 in the Z-axis direction holds the semiconductor package substrate 5 on the substrate supply table 7. Next, as shown in FIG. 1, the package inloader 6 moves to the substrate cutting mechanism B along the rail 6a in the X-axis direction while holding the semiconductor package substrate 5. Thereafter, as shown in FIG. 3, the package inloader 6 places the semiconductor package substrate 5 on the cut table 8 of the substrate cutting mechanism B below the Z-axis direction. Thus, the operation of the substrate supply mechanism A is completed.

  The semiconductor package substrate 5 is an object to be cut which is finally cut and singulated into a plurality of semiconductor packages 5a. The semiconductor package substrate 5 covers, for example, a base made of a substrate or a lead frame, a semiconductor chip-shaped component mounted on each of a plurality of regions of the base, and a plurality of regions of the base. And a sealing resin formed as described above. In the first embodiment, as an example, a case will be described in which a semiconductor package substrate 5 including a base material 3 on which a plurality of semiconductor chip-shaped components are mounted and a sealing resin 4 is used.

  As shown in FIG. 1, the substrate cutting mechanism B includes a cut table 8 on which the semiconductor package substrate 5 before cutting or the semiconductor package 5a after cutting is placed, and a rotating mechanism 8a for rotating the cut table 8. A moving mechanism (not shown) for moving the cut table 8 and the rotation mechanism 8a, an alignment camera 8b for confirming the position of the semiconductor package substrate 5 on the cut table 8, and cutting the semiconductor package substrate 5. A washing water spray member 11 for spraying washing water onto the semiconductor package 5a, and an air jet member 12 for drying washing water sprayed on the semiconductor package 5a. .

  1 and 4 to 6 are schematic side views illustrating an example of the operation of the substrate cutting mechanism B. The substrate cutting mechanism B operates, for example, as follows. First, as shown in FIG. 1, the cut table 8 on which the semiconductor package substrate 5 before cutting is placed and the rotating mechanism 8a are moved in the Y-axis direction by a moving mechanism (not shown). At this time, the position of the semiconductor package substrate 5 on the cut table 8 is confirmed by the alignment camera 8b.

  Next, as shown in FIG. 1, the cut table 8 on which the semiconductor package substrate 5 is placed and the rotation mechanism 8a are moved in the X-axis direction to the spindle 9, and the semiconductor package substrate 5 is rotated by the rotation mechanism 8a. Next, as shown in FIG. 4, the blade 10 is rotated by rotating the spindle 9 to cut the semiconductor package substrate 5 on the cut table 8. Thereby, the semiconductor package substrate 5 is singulated to obtain a plurality of semiconductor packages 5a. Each semiconductor package 5a may have, for example, a configuration including the base material 3 on which the individual semiconductor chip-shaped components are mounted, and the sealing resin 4 covering the semiconductor chip-shaped components.

  Next, as shown in FIG. 5, cleaning water is sprayed by the cleaning water spraying member 11 on the base material 3 side of the individualized semiconductor package 5 a on the cut table 8. Next, as shown in FIG. 6, the cleaning water sprayed on the base material 3 side of the semiconductor package 5a is blown off by injecting air from the air ejecting member 12 to dry the semiconductor package 5a. Thereafter, the semiconductor package 5a on the cut table 8 is moved to the cleaning mechanism C. Thus, the operation of the substrate cutting mechanism B is completed.

  As shown in FIG. 1, the cleaning mechanism C includes a package unloader 13 for holding the semiconductor package 5a, a sponge roller 16 for cleaning the sealing resin 4 side of the semiconductor package 5a, and a drying of the semiconductor package 5a. And an air ejecting member 17 for the purpose.

  1, 7, and 8 are schematic side views illustrating an example of the operation of the cleaning mechanism C. The cleaning mechanism C operates as follows, for example. First, as shown in FIG. 7, the package unloader 13 holds the semiconductor package 5a and lifts the semiconductor package 5a upward from the cut table 8 in the Z-axis direction. Next, as shown in FIG. 1, the package unloader 13 moves the semiconductor package 5a in the X-axis direction to move the sponge roller 16 and the air ejecting member 17 upward in the Z-axis direction. Thereafter, as shown in FIG. 8, the sponge roller 16 cleans the sealing resin 4 side of the semiconductor package 5a, and the air ejection member 17 injects air to dry the semiconductor package 5a. Thus, the operation of the cleaning mechanism C is completed.

  As shown in FIG. 1, the transport mechanism D includes a marking inspection camera 18 for inspecting a marking printed on the sealing resin 4 of the semiconductor package 5a, and a package for inspecting the base material 3 of the semiconductor package 5a. An inspection camera 19, a flipper 14 for holding and reversing the semiconductor package 5 a, a rail 14 a for moving the flipper 14, and an index table 15 for placing the semiconductor package 5 a reversed by the flipper 14. And a moving mechanism (not shown) for moving the index table 15.

  The transport mechanism D also includes a holding mechanism 21 for holding and transporting the semiconductor package 5a, an arrangement member 23 for mounting the semiconductor package 5a, a table 22 for mounting the arrangement member 23, A moving mechanism (not shown) for moving the table 22, an arrangement member loader 24 for holding an arrangement member 23 on which the semiconductor package 5a is mounted, and a rail 25 for moving the arrangement member loader 24; A placement member loading section 26 for loading the placement member 23 on which the semiconductor package 5a is placed, and a semiconductor package 5a as an object to be transported to the opening 23a of the placement member 23 as a transport destination as described later. A calculation mechanism 27 configured to be able to correct the relative movement amount.

  In the first embodiment, as the holding mechanism 21, for example, a suction mechanism that sucks, holds, and transports the semiconductor package 5a can be used. Further, as the arrangement member 23, for example, an attaching member including a support base such as a metal stencil provided with a plurality of openings 23a and a resin sheet on the support base can be used.

  When a suction mechanism is used as the holding mechanism 21, a suction head can be used as a holding member for holding the semiconductor package 5a. In this case, for example, by suctioning the gas in the hollow suction head using a vacuum pump (not shown), the semiconductor package 5a can be sucked and held on the end face provided with the opening of the suction head. .

  As the resin sheet used for the attaching member, for example, a sheet provided with a resin sheet-shaped base material and an adhesive layer (adhesive layer) made of an adhesive applied to at least one surface of the sheet-shaped base material is used. Can be used. As the adhesive, for example, a pressure-sensitive adhesive (pressure sensitive adhesive) can be used. As the resin sheet, for example, a resin sheet in which a silicone-based adhesive is applied to both surfaces of a polyimide film or the like can be used. Here, in the resin sheet, an adhesive is applied to at least the surface of the sheet-like base material on the side to which the semiconductor package 5a is attached, thereby forming an adhesive layer. An adhesive may be applied to the surface of the sheet-like substrate and the surface of the sheet-like substrate on the opposite side to form an adhesive layer. As described above, since the adhesive layer (adhesive layer) is provided on at least the surface of the resin sheet on which the semiconductor package 5a is arranged, the semiconductor package 5a can be attached to the arrangement member 23 that is the attaching member.

  Hereinafter, an example of the operation of the transport mechanism D will be described with reference to FIGS. 9 to 19 and FIGS. 24A to 24D. First, as shown in the schematic side view of FIG. 9, the package unloader 13 holds the semiconductor package 5 a after being cleaned by the sponge roller 16 and dried by the air ejecting member 17, and is positioned above the marking inspection camera 18 in the Z-axis direction. Move up to. Next, the marking inspection camera 18 confirms the suitability of the marking printed on the sealing resin 4 of the semiconductor package 5a.

  Next, as shown in the schematic side view of FIG. 10, the package unloader 13 moves in the X-axis direction, moves to the upper part of the flipper 14 in the Z-axis direction, and lowers the semiconductor package 5a downward in the Z-axis direction. Place on top. Next, as shown in a schematic side view of FIG. 11, the semiconductor package 5a is inverted by rotating the flipper 14. At this time, the flipper 14 holds the semiconductor package 5a such that the substrate 3 side of the semiconductor package 5a faces downward in the Z-axis direction.

  Next, as shown in FIG. 1, the flipper 14 moves along the rail 14a in the X-axis direction, and as shown in the schematic side view of FIG. The package 5a is transported. Next, the package inspection camera 19 inspects the base material 3 of the semiconductor package 5a. When the substrate 3 is a substrate, for example, the package inspection camera 19 inspects, for example, the position, number, and shape of the solder balls. When the substrate 3 is a lead frame, for example, the package inspection camera 19 inspects, for example, the position, number, and shape of the leads. Next, as shown in FIG. 1, the flipper 14 moves in the X-axis direction along the rail 14a to a position above the index table 15 in the Z-axis direction, and as shown in the schematic side view of FIG. Is placed on the index table 15.

  Next, as shown in FIG. 1, the arithmetic mechanism 27 moves the index table 15 on which the semiconductor package 5a is placed in the Y-axis direction toward the holding mechanism 21, and moves the holding mechanism 21 toward the index table 15 in the X-axis direction. Move in the direction. Thus, as shown in the schematic side view of FIG. 14, the holding mechanism 21 is located above the semiconductor package 5a on the index table 15 in the Z-axis direction. In the X-axis direction of the index table 15, a second camera 102 having a second image sensor 41 is arranged. An arrangement member 23 is arranged in the X-axis direction of the second camera 102. A first camera 101 having a first image sensor 31 is attached to the holding mechanism 21. Further, in the first embodiment, the arrangement member 23 includes a sheet-shaped base material 72 made of resin and an adhesive layer (adhesive layer) 71 made of an adhesive applied to at least one surface of the sheet-shaped base material 72. Sheets are used. In the first embodiment, the arrangement member 23 is provided with an opening 23a serving as a transfer destination.

  Next, as shown in the schematic side view of FIG. 15, the arithmetic mechanism 27 moves the holding head 21a of the holding mechanism 21 downward in the Z-axis direction and moves the holding head 21a to the semiconductor to be the object to be transferred in the first embodiment. The package 5a is held. Thereafter, as shown in FIG. 14, the arithmetic mechanism 27 causes the holding head 21a to pull the semiconductor package 5a upward in the Z-axis direction. For convenience of explanation, FIG. 14 shows a case where the holding mechanism 21 holds only one semiconductor package 5a. However, the present invention is not limited to this case. As shown in FIG. The package 5a may be held at the same time.

  Next, as shown in the schematic side view of FIG. 16, the arithmetic mechanism 27 moves the holding mechanism 21 holding the semiconductor package 5a from above the semiconductor package 5a in the Z-axis direction to above the arrangement member 23 in the Z-axis direction. To move in the X-axis direction. At this time, as shown in a schematic side view of FIG. 16, for example, the arithmetic mechanism 27 causes the second image sensor 41 of the second camera 102 to move the semiconductor package 5a held by the holding mechanism 21 downward in the Z-axis direction. To obtain an image of the semiconductor package 5a. The arithmetic mechanism 27 causes the arithmetic mechanism 27 to transmit data of the image of the semiconductor package 5a captured by the second image sensor 41.

  Next, as shown in the schematic side view of FIG. 17, the arithmetic mechanism 27 moves the holding mechanism 21 further in the X-axis direction from above the first imaging element 41 in the Z-axis direction to above the arrangement member 23 in the Z-axis direction. Move. After that, the arithmetic mechanism 27 causes the first image sensor 31 of the first camera 101 attached to the holding mechanism 21 to image the opening 23a from above in the Z-axis direction, thereby acquiring an image of the opening 23a. The arithmetic mechanism 27 also causes the arithmetic mechanism 27 to transmit data of the image of the opening 23a acquired by the first image sensor 31.

  In the above, after the arithmetic mechanism 27 acquires the image of the semiconductor package 5a by the second image sensor 41 of the second camera 102, the arithmetic mechanism 27 converts the image of the opening 23a by the first image sensor 31 of the first camera 101. Although the case of acquiring the image has been described, the order of acquiring the images of the first image sensor 31 and the second image sensor 41 is reversed, and after the image of the opening 23a is acquired by the first image sensor 31, the second image is acquired. The image of the semiconductor package 5a may be acquired by the imaging device 41.

  Next, the arithmetic mechanism 27 calculates the amount of misalignment between the second camera 102 and the semiconductor package 5a based on the image of the semiconductor package 5a captured by the second image sensor 41, and calculates the first image sensor. Based on the image of the opening 23a taken by the controller 31, the amount of positional deviation between the first camera 101 and the opening 23a is calculated.

  The calculation of the amount of misalignment between the second camera 102 and the semiconductor package 5a is performed, for example, by calculating the semiconductor package 5a imaged from the center of the light incident portion of the second camera 102 and the second image sensor 41 from below in the Z-axis direction. For example, in the X-axis direction as the first direction and the distance in the Y-axis direction as the second direction different from the first direction.

  The calculation of the amount of misalignment between the first camera 101 and the opening 23a is performed, for example, by calculating the center of the light incident portion of the first camera 101 and the center of the opening 23a imaged by the first image sensor 31 from above in the Z-axis direction. By calculating the distance in the X-axis direction and the distance in the Y-axis direction between the two.

  Next, the arithmetic mechanism 27 calculates the amount of positional deviation between the second camera 102 and the semiconductor package 5a in the X-axis direction and the Y-axis direction calculated between the second camera 102 and the semiconductor package 5a. For example, by correcting the designed movement distances of the semiconductor package 5a to the opening 23a in the X-axis direction and the Y-axis direction with the positional shift amounts in the X-axis direction and the Y-axis direction, respectively, The actual moving distance in each of the Y-axis directions is calculated. The design moving distance in the X-axis direction and the Y-axis direction to the opening 23a of the semiconductor package 5a is, for example, such that the center of the semiconductor package 5a as the object to be conveyed is the center of the opening 23a as the transfer destination. The calculated moving distances in the X-axis direction and the Y-axis direction, which are considered necessary for accurate placement, can be used. Instead of correcting from the designed moving distance, for example, a value measured in advance by the first camera 101 and the second camera 102 (for example, the center of the holding head 21a before holding the semiconductor package 5a) Of the semiconductor package 5a to the opening 23a in the X-axis direction and the Y-axis direction based on the moving distance from the center of the opening 23a to the center of the opening 23a or the moving distance calculated in the previous measurement. Good.

  Next, the arithmetic mechanism 27 moves the semiconductor package 5a in the X-axis direction and the Y-axis direction by the holding mechanism 21 by the actual movement distance in the X-axis direction and the Y-axis direction calculated as described above. As shown in the schematic side view of FIG. 18, the opening 23a is moved upward in the Z-axis direction.

  For example, when the semiconductor package 5a is a BGA (Ball Grid Array) semiconductor package in which a ball electrode (not shown) is provided on one surface of the semiconductor package 5a, the ball electrode is provided near the periphery of the semiconductor package 5a, The distance from the ball electrode of the semiconductor package 5a to the periphery may be very short. In this case, it is necessary to set all the regions of a short distance from the ball electrode of the semiconductor package 5a to the periphery outside the opening 23a while keeping the ball electrode in the opening 23a. May be required.

  After that, the arithmetic mechanism 27 lowers the semiconductor package 5a held by the holding head 21a downward in the Z-axis direction so that the semiconductor package 5a fits in the opening 23a, as shown in, for example, a schematic sectional view of FIG. Thus, the transfer of the semiconductor package 5a to the opening 23a is completed.

  However, the relative position between the first camera 101 and the second camera 102 depends on the temperature environment in which the electronic component manufacturing apparatus and the transport mechanism D are used, processing variations of individual components, and component assembly variations. Deviation sometimes occurred. Therefore, in order to more accurately position the semiconductor package 5a with respect to the opening 23a, it may be necessary to further consider the amount of relative positional deviation between the first camera 101 and the second camera 102.

  Hereinafter, an example of a method of calculating the relative positional shift amount between the first camera 101 and the second camera 102 in the first embodiment will be described with reference to FIGS. First, as shown in the schematic side view of FIG. 20, the arithmetic mechanism 27 moves the holding mechanism 21 to a position above the table 22 on which the placement member 23 is placed in the Z-axis direction.

  As shown in a schematic partial perspective side view of FIG. 20, a first camera 101 is attached to the holding mechanism 21. The first camera 101 includes, for example, a first image sensor 31, a first light source 32, an optical mark forming unit 33 including a light transmitting unit 33a and a light shielding unit 33b, and a unit conjugate ratio design. A first lens 34, a second lens 35, and a half mirror 36 are provided. As the optical mark forming part 33, for example, a member having a circular hole at the center can be used. Further, the unit conjugate ratio design means a design in which light from an object at a finite position that is not at infinity is condensed to another certain point through an optical system.

  The arithmetic mechanism 27 can generate light 38 from the first light source 32. Light 38 emitted from the first light source 32 passes through the optical mark forming unit 33, is reflected by the half mirror 36 toward the table 22, passes through the first lens 34, and enters the surface 22 a of the table 22. I do. At this time, an optical mark 37 is optically formed on the surface 22a of the table 22, which is an optical path of the light 38.

  The optical mark forming unit 33 is movably arranged in the first camera 101 along the optical path of the light 38 emitted from the first light source 32, for example. Therefore, the first imaging element 31 can capture an image of the optical mark 37 in a state where, for example, the center of the optical mark 37 is focused by the arithmetic mechanism 27 moving the optical mark forming unit 33. Become. In other words, the focus adjustment (focus adjustment) of the optical mark 37 becomes possible by moving the optical mark forming unit 33.

  The arithmetic mechanism 27 causes the first image sensor 31 to image the optical mark 37 optically formed on the surface 22a of the table 22 through the first lens 34, the half mirror 36, and the second lens 35. Then, an image of the optical mark 37 is obtained. The operation mechanism 27 causes the image of the optical mark 37 acquired by the first image sensor 31 to be transmitted to the operation mechanism 27 as data. The electronic component manufacturing apparatus according to the first embodiment includes a half mirror 36, a first lens 34, and a second lens 35 as an optical system in the optical path of the light 38.

  FIG. 21 shows a schematic plan view of an example of an image of the optical mark 37 captured by the first image sensor 31. As shown in FIG. 21, the optical mark 37 includes a light portion 39 and a dark portion 40. The bright portion 39 has a shape corresponding to the shape of the light transmitting portion 33a which transmits the light 38 of the optical mark forming portion 33. The dark part 40 has a shape corresponding to the shape of the light shielding part 33b, which is a part that shields the light 38 of the optical mark forming part 33. By using the first lens 34 having the unit conjugate ratio design, the boundary between the light part 39 and the dark part 40 of the optical mark forming part 33 can be clarified.

  Then, based on the image of the optical mark 37 captured by the first image sensor 31, the arithmetic mechanism 27 calculates a first positional deviation amount that is a positional deviation amount between the first camera 101 and the optical mark 37. Is calculated. The calculation of the first positional deviation amount between the first camera 101 and the optical mark 37 is performed, for example, by imaging the center of the light incident portion 101a of the first camera 101 and the first image sensor 31 from above in the Z-axis direction. The distance can be calculated by calculating the distance in the X-axis direction and the distance in the Y-axis direction from the center of the optical mark 37 thus set.

  Next, the arithmetic mechanism 27 moves the holding mechanism 21 to which the first camera 101 is attached upward in the Z-axis direction of the second camera 102, as shown in the partial perspective side view of FIG. The second camera 102 includes, for example, a second imaging element 41, a third lens 42, a fourth lens 43, a mirror 44, and illumination 45.

  Next, the arithmetic mechanism 27 causes the first light source 32 of the first camera 101 to emit light, thereby placing an optical mark 37 on the optical path between the first camera 101 and the second camera 102. It is formed.

  Next, as shown in FIG. 22, the arithmetic mechanism 27 causes the second image sensor 41 of the second camera 102 to image the optical mark 37 from below in the Z-axis direction.

  That is, the light 38 emitted from the first light source 32 passes through the optical mark forming unit 33, is reflected by the half mirror 36 toward the second camera 102, and passes through the first lens 34. An optical mark 37 is formed optically. Thereafter, the light 38 enters the mirror 44 from the light incident portion 102 a of the second camera 102, is reflected toward the second image sensor 41, passes through the fourth lens 43 and the third lens 42, and Incident on the image pickup device 41. Thereby, the second image sensor 41 causes the optical mark 37 optically formed in the optical path between the first camera 101 and the second camera 102 to be imaged from below in the Z-axis direction, and The image of the mark 37 is obtained. The arithmetic mechanism 27 causes the image of the optical mark 37 acquired by the second image sensor 41 to be transmitted to the arithmetic mechanism 27 as data. The electronic component manufacturing apparatus according to the first embodiment includes a half mirror 36, a first lens 34, a mirror 44, a fourth lens 43, and a third lens 42 as optical systems in the optical path of the light 38. It has.

  FIG. 23 shows a schematic plan view of an example of an image of the optical mark 37 captured by the second image sensor 41. As shown in FIG. 23, the optical mark 37 includes a bright portion 46 and a dark portion 47. The bright portion 46 has a shape corresponding to the shape of the light transmitting portion 33a of the optical mark forming portion 33. The dark part 40 has a shape corresponding to the shape of the light shielding part 33b of the optical mark forming part 33.

  Next, based on the image of the optical mark 37 imaged by the second image sensor 41, the arithmetic mechanism 27 calculates a second positional shift amount that is the positional shift amount between the second camera 102 and the optical mark 37. Calculate the amount. The calculation of the second positional shift amount between the second camera 102 and the optical mark 37 is performed, for example, by calculating the center of the light incident portion 102a of the second camera 102 and the optical mark captured by the second image sensor 41. This can be performed by calculating the distance in the X-axis direction and the distance in the Y-axis direction from the center of the 37.

  Next, the arithmetic mechanism 27 calculates the first positional deviation amount between the first camera 101 and the optical mark 37 and the second positional deviation amount between the second camera 102 and the optical mark 37. , The relative positional shift amount between the first camera 101 and the second camera 102 is calculated.

  If the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 imaged by the second image sensor 41 do not exist on the same axis extending in the Z-axis direction, It is preferable to move the first camera 101 so that the center of the camera is located coaxially. In this case, the second positional shift amount between the second camera 102 and the optical mark 37 can be made zero, so that the first camera 101 and the second camera 102 Can be made equal to the first positional deviation between the first camera 101 and the optical mark 37. The position of the first camera 101 when the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 are coaxially extending in the Z-axis direction is referred to as a temporary position described later. It can be used as a reference position for correcting the moving distance of the transferred object to the transfer destination.

FIG. 24A shows an example of a state in which the first camera 101 and the second camera 102 are located at a temporary reference position. First, the arithmetic mechanism 27 moves the first camera 101 and the second camera 102 to a temporary reference position. The temporary reference position is, for example, when the center of the light incident part 101a of the first camera 101 and the center of the light incident part 102a of the second camera 102 are on the coaxial 103 extending in the Z-axis direction. This is a design position in the X-axis direction. In the temporary reference position of the first embodiment, actually, the center of the light incident portion 102a of the second camera 102 and the center of the optical mark 37 are located on the coaxial 103 extending in the Z-axis direction. However, the relative positional shift amount in the X-axis direction between the first camera 101 and the second camera 102 calculated by the arithmetic mechanism 27 is ΔX ₀ . The position in the X-axis direction of the center of the light incident portion 101a of the first camera 101 at the temporary reference position is P ₁ x. Further, in this example, the holding mechanism 21 has already lifted and held the semiconductor package 5a from the index table 15.

Next, as shown in FIG. 24B, the arithmetic mechanism 27 moves the first camera 101 from the temporary reference position by a distance L1 in the X-axis direction. The distance L1 is, for example, coaxial from the temporary reference position such that the center of the light incident portion 102a of the second camera 102 and the center of the middle semiconductor package 5a shown in FIG. 24B extend in the Z-axis direction. This is a design distance in the X-axis direction to a design position assumed to exist above. Assuming that the position of the center of the light incident portion 101a of the first camera 101 in the X-axis direction at this time is P ₂ x, the equation of P ₂ x = P ₁ x + L1 holds.

At this time, the second image sensor 41 of the second camera 102 images the semiconductor package 5a held by the holding mechanism 21 from below in the Z-axis direction. The data of the image of the semiconductor package 5 a captured by the second image sensor 41 is transmitted to the arithmetic mechanism 27. Thereby, the arithmetic mechanism 27 calculates the position of the center of the light incident part 102a of the second camera 102 and the center of the semiconductor package 5a in the X-axis direction from the image of the semiconductor package 5a captured by the second image sensor 41. The displacement amount ΔX ₁ can be calculated. As a result, the arithmetic mechanism 27 can grasp the actual center position of the semiconductor package 5a (transported object).

Next, as shown in FIG. 24C, the arithmetic mechanism 27 moves the first camera 101 from the temporary reference position to a position at a distance L2 in the X-axis direction. The distance L2 is, for example, coaxial with the center of the light incident portion 101a of the first camera 101 and the center of the opening 23a shown in FIG. 24C extending from the temporary reference position in the Z-axis direction. This is a design distance to a design position in the X-axis direction. Assuming that the position of the center of the light incident portion 101a of the first camera 101 in the X-axis direction at this time is P ₃ x, the equation of P ₃ x = P ₁ x + L2 is established.

At this time, the first imaging element 31 of the first camera 101 captures an image of the opening 23a, which is an example of the transfer destination, of the semiconductor package 5a, which is an example of the object to be transferred, from above in the Z-axis direction. The image of the opening 23 a captured by the first image sensor 31 is transmitted to the arithmetic mechanism 27 as data. As a result, the arithmetic mechanism 27 calculates a positional shift amount in the X-axis direction between the center of the light incident portion 101a of the first camera 101 and the center of the opening 23a from the image of the opening 23a captured by the first image sensor 31. ΔX ₂ can be calculated. Thus, the arithmetic mechanism 27 can grasp the actual center position of the opening 23a (the destination of the transfer).

  Next, as shown in FIG. 24D, the arithmetic mechanism 27 moves the semiconductor package 5a by a distance L3 from the temporary reference position in the X-axis direction by the holding mechanism 21 to which the first camera 101 is attached. Move to

  Here, the arithmetic mechanism 27 calculates the distance L3 as follows, for example. By adding the distance L1 and the distance L2, a design movement distance L3 ′ (= L1 + L2) in the X-axis direction up to the opening 23a that is the transfer destination of the semiconductor package 5a as the transfer target at the temporary reference position. ) Is calculated. The design movement distance L3 ′ is such that, for example, the center of the middle semiconductor package 5a shown in FIG. 24B and the center of the opening 23a shown in FIG. Is the design movement distance to the design position in the X-axis direction, which is assumed to be on the same coaxial axis that extends.

Then, the designed movement distance L3 ′ is corrected by adding or dividing the relative displacement amount △ X _{0, the} position displacement amount △ X _1, and the position displacement amount △ X ₂ calculated above. This makes it possible to calculate the actual movement distance L3 in the X-axis direction up to the opening 23a serving as the transfer destination of the semiconductor package 5a as the transferred object at the temporary reference position in the X-axis direction. In other words, it is possible to calculate the moving distance by which the semiconductor package 5a (the object to be transferred) captured by the second camera 102 is moved to the opening 23a which is the destination of the transfer.

  By moving the semiconductor package 5a to a position separated in the X-axis direction from the temporary reference position by the actual movement distance L3 calculated as described above, the semiconductor as the object to be transferred with respect to the opening 23a to be the transfer target position is moved. More accurate positioning of the package 5a in the X-axis direction can be performed. By performing the same operation in the Y-axis direction as in the X-axis direction, more accurate positioning of the semiconductor package 5a with respect to the opening 23a in the Y-axis direction becomes possible. By actually placing the semiconductor package 5a in the opening 23a after such alignment, the semiconductor package 5a can be placed in a more accurate position of the opening 23a. The same processing may be performed on the opening of the semiconductor package and the arrangement member held by the holding mechanism other than the semiconductor package 5a and the opening 23a, so that the corresponding parts are placed at the correct positions. .

  Thereafter, as shown in FIG. 1, the table 22 moves in the Y-axis direction, and moves the arrangement member 23 in a state where the semiconductor packages 5 a are respectively placed in the plurality of openings 23 a to the arrangement member loader 24. The placement member loader 24 moves in the X-axis direction along the rail 25 while holding the placement member 23, and loads the placement member loading section 26 with the placement member 23 on which the semiconductor package 5a is placed. In the above description, the movement distance of the transported object to the transfer destination is corrected based on the designed movement distance or position. However, the present invention is not limited to this. For example, the first camera 101 may be corrected in advance. And a value measured by the second camera 102 (for example, the center of the light incident portion 101a of the first camera 101 and the center of the light incident portion 102a of the second camera 102 are coaxially extending in the Z-axis direction). Movement of the transported object to the transport destination based on the existing measured position, the distance from the center of the holding head 21a before holding the semiconductor package 5a to the opening 23a, or the position and distance calculated in the previous measurement). The distance may be corrected.

  As described above, in the electronic component manufacturing apparatus according to the first embodiment, the optical mark 37 optically formed to align the semiconductor package 5a with the opening 23a is used. For this reason, in the electronic component manufacturing apparatus according to the first embodiment, it is not necessary to provide a moving space for a jig such as a correction mechanism such as a rod and a target on a transport path of a conveyed object in the apparatus. Can be suppressed. Further, in the electronic component manufacturing apparatus according to the first embodiment, since it is not necessary to attach a jig such as a correction mechanism having a rod and a target to the apparatus, it is possible to suppress the structure of the apparatus from becoming complicated.

<Embodiment 2>
The electronic component manufacturing apparatus according to the second embodiment includes a third imaging device 51 in addition to a first camera 201 provided with a first imaging device 31 and a second camera 202 provided with a second imaging device 41. A third camera 203 is provided. Hereinafter, an example of the operation of the transport mechanism of the electronic component manufacturing apparatus according to the second embodiment will be described with reference to the schematic plan views of FIGS.

  FIG. 25 illustrates a basic configuration of a transport mechanism of the electronic component manufacturing apparatus according to the second embodiment. A third camera 203 is attached to the holding mechanism 21 in addition to the first camera 201. The holding mechanism 21 is movable in the X-axis direction as the first direction. The holding mechanism 21a includes a holding head 21a configured to hold the semiconductor package 5a.

  The second camera 202 is movable in the Y-axis direction as a second direction. The second camera 202 may be located coaxially with the third camera 203 in the Z-axis direction, but may be located coaxially with the first camera 201 in the Z-axis direction due to device limitations. I can't get it. The table 22 is movable only in the Y-axis direction, and a non-optical mark 48 is provided on the surface 22a of the table 22 on the side on which the arrangement member 23 is placed.

  Also in the second embodiment, first, similarly to the first camera 201 of the first embodiment, the arithmetic mechanism 27 moves the third camera 203 upward in the Z-axis direction of the table 22 to optically move the third camera 203 to the surface 22 a of the table 22. The target mark 37 is formed. Next, the arithmetic mechanism 27 causes the third imaging element 51 of the third camera 203 to capture an image of the optical mark 37, thereby acquiring an image of the optical mark 37. Next, the arithmetic mechanism 27 causes the image of the optical mark 37 acquired by the third imaging element 51 to be transmitted to the arithmetic mechanism 27 as data. Then, based on the image of the optical mark 37 acquired by the third image sensor 51, the arithmetic mechanism 27 calculates a first positional deviation amount, which is a positional deviation amount between the third camera 203 and the optical mark 37. calculate.

  Next, as shown in FIG. 26, the arithmetic mechanism 27 moves the third camera 203 in the X-axis direction so that the third camera 203 is located above the second camera 202 in the Z-axis direction. The second camera 202 is moved in the Y-axis direction. At this time, the moving distance of the third camera 203 in the X-axis direction and the moving distance of the second camera 202 in the Y-axis direction are, for example, the center of the light incident part of the third camera 203 and the second camera. It is possible to use a design distance at which the center of the light incident portion 202 is located on the same axis extending in the Z-axis direction.

  Next, similarly to the first camera 201 and the second camera 202 of the first embodiment, the arithmetic mechanism 27 optically marks the optical mark 37 on the optical path between the third camera 203 and the second camera 202. Then, the image data of the optical mark 37 is acquired by causing the second image sensor 41 of the second camera 202 to image the optical mark 37 from below in the Z-axis direction. Next, the arithmetic mechanism 27 causes the arithmetic mechanism 27 to transmit data of the image of the optical mark 37 acquired by the second image sensor 41. Then, based on the image of the optical mark 37 acquired by the second image sensor 41, the arithmetic mechanism 27 calculates a second positional shift amount that is the positional shift amount between the second camera 202 and the optical mark 37. calculate.

  The arithmetic mechanism 27 calculates the first positional deviation amount and the second positional deviation amount, so that the center of the light incident part of the third camera 203 and the center of the light incident part of the second camera 202 become Z. It is possible to specify the position of the third camera 203 in the X-axis direction and the actual position of the second camera 202 in the Y-axis direction when the positions are on the same axis extending in the axial direction.

  Next, as shown in FIG. 27, the arithmetic mechanism 27 moves the table 22 so that the first camera 201 is positioned above the non-optical mark 48 provided on the surface 22a of the table 22 in the Z-axis direction. The first camera 201 is moved in the X-axis direction by moving in the axial direction. At this time, the moving distance of the table 22 in the Y-axis direction and the moving distance of the first camera 201 in the X-axis direction are, for example, provided at the center of the light incident portion of the first camera 201 and the surface 22a of the table 22. It is possible to use a design distance where the center of the provided non-optical mark 48 is located on the same axis extending in the Z-axis direction.

  Next, the arithmetic mechanism 27 causes the first image sensor 31 of the first camera 201 to capture an image of the non-optical mark 48 by imaging the non-optical mark 48 from above in the Z-axis direction. Next, the arithmetic mechanism 27 causes the arithmetic mechanism 27 to transmit data of the image of the non-optical mark 48 acquired by the first image sensor 31. Then, the arithmetic mechanism 27 calculates a third positional shift amount between the first camera 201 and the non-optical mark 48 based on the image of the non-optical mark 48 acquired by the first image sensor 31. In other words, the arithmetic mechanism 27 determines that the center of the light incident portion of the first camera 201 and the center of the non-optical mark 48 are located on the same axis extending in the Z-axis direction. The position in the X-axis direction and the actual position of the table 22 in the Y-axis direction are calculated.

  Next, as shown in FIG. 28, the arithmetic mechanism 27 moves the table 22 so that the third camera 203 is positioned above the non-optical mark 48 provided on the surface 22a of the table 22 in the Z-axis direction. The camera is moved in the axial direction, and the third camera 203 is moved in the X-axis direction. At this time, the moving distance of the table 22 in the Y-axis direction and the moving distance of the third camera 203 in the X-axis direction are, for example, the center of the light incident portion of the third camera 203 and the center of the non-optical mark 48. Can be used as a design distance at which the positions are located on the same axis extending in the Z-axis direction.

  Next, the arithmetic mechanism 27 obtains an image of the non-optical mark 48 by causing the third image sensor 51 of the third camera 203 to image the non-optical mark 48 from above in the Z-axis direction. Next, the arithmetic mechanism 27 causes the arithmetic mechanism 27 to transmit data of the image of the non-optical mark 48 acquired by the third image sensor 51. Then, the arithmetic mechanism 27 calculates a fourth positional shift amount between the third camera 203 and the non-optical mark 48 from the image of the non-optical mark 48 acquired by the third imaging element 51. In other words, the arithmetic mechanism 27 determines that the center of the light incident portion of the third camera 203 and the center of the non-optical mark 48 are located on the same axis extending in the Z-axis direction. The position in the X-axis direction and the actual position of the table 22 in the Y-axis direction are calculated.

  The calculation mechanism 27 calculates the relative positional relationship between the first camera 201 and the third camera 203 based on the third position shift amount and the fourth position shift amount calculated as described above. It becomes possible. For example, the position of the first camera 201 in the X-axis direction where the center of the light incident portion of the first camera 201 and the center of the non-optical mark 48 exist on the same axis extending in the Z-axis direction; A third camera in which the position of the table 22 in the Y-axis direction, the center of the light incident portion of the third camera 203, and the center of the non-optical mark 48 are coaxially extending in the Z-axis direction. The arithmetic mechanism 27 calculates the difference between the position of the light 203 in the X-axis direction and the position of the table 22 in the Y-axis direction. It is possible to calculate the distance in the X-axis direction and the distance in the Y-axis direction from the center of the section.

  Then, the arithmetic mechanism 27 can calculate the distance in the X-axis direction and the distance in the Y-axis direction between the center of the light incident part of the first camera 201 and the center of the light incident part of the third camera 203. In this case, the relative position between the center of the light incident portion of the first camera 201 and the center of the light incident portion of the second camera 202 with respect to the design position in each of the X-axis direction and the Y-axis direction. The displacement amount can be calculated. That is, in the second embodiment, the arithmetic mechanism 27 aligns the first camera 201 with the second camera 202 by aligning the second camera 202 with the third camera 203. Becomes possible.

  As described above, the arithmetic mechanism 27 determines the relative position between the center of the light incident portion of the first camera 201 and the center of the light incident portion of the second camera 202 in each of the X-axis direction and the Y-axis direction. After calculating the position shift amount, the design movement distance of the semiconductor package 5a as the object to be transferred to the opening 23a as the transfer destination in each of the X-axis direction and the Y-axis direction is represented by the relative position shift amount. to correct. Thus, also in the second embodiment, more accurate positioning of the semiconductor package 5a with respect to the opening 23a can be performed.

  As shown in FIG. 29, the second imaging element 41 of the second camera 202 can image the holding head 21a of the holding mechanism 21 from below in the Z-axis direction. This means that the second imaging element 41 of the second camera 202 can image the semiconductor package 5a held by the holding head 21a of the holding mechanism 21 from below in the Z-axis direction. In addition, the first imaging element 51 of the first camera 201 is configured to be able to image the non-optical mark 48 as well as the opening 23a as the transport destination of the transported object from above in the Z-axis direction.

  Therefore, in the second embodiment as well, the respective relative positional shift amounts in the X-axis direction and the Y-axis direction between the center of the light incident part of the first camera 201 and the center of the light incident part of the second camera 202 In addition, the amount of positional deviation between the center of the light incident portion of the second camera 202 and the center of the semiconductor package 5a in the X-axis direction and the Y-axis direction, and the position of the light incident portion of the first camera 201 The design movement distance to the opening 23a of the semiconductor package 5a in each of the X-axis direction and the Y-axis direction is also taken into consideration in consideration of the amount of positional deviation between the center and the opening 23a in the X-axis direction and the Y-axis direction. Correction is also possible.

  The description of the second embodiment other than the above is the same as that of the first embodiment, and thus the description thereof is omitted.

<Embodiment 3>
The electronic component manufacturing apparatus according to the third embodiment is characterized in that it includes a first camera 301 whose schematic partial perspective side view is shown in FIGS. The first camera 301 according to the third embodiment includes a second light source 65 in addition to the first light source 32.

  When the electronic component manufacturing apparatus according to the third embodiment is in the state illustrated in FIG. 30, light is emitted from the first light source 32, but no light is emitted from the second light source 65. In this case, the optical mark 37 is formed by the light emitted from the first light source 32. FIG. 32 is a schematic plan view showing an example of an image of the optical mark 37 captured by the first image sensor 31 of the first camera 301 at this time.

  When the electronic component manufacturing apparatus according to the third embodiment is in the state shown in FIG. 31, light is not emitted from the first light source 32, but light is emitted from the second light source 65. In this case, since the light emitted from the second light source 65 and transmitted through the half mirror 64 only irradiates the surface, the optical mark 37 is not formed, and the irradiated surface is merely illuminated brightly. . FIG. 33 is a schematic plan view showing an example of an image of the surface captured by the first image sensor 31 of the first camera 301 at this time. When the electronic component manufacturing apparatus according to the third embodiment is in the state shown in FIG. 33, it is possible to capture an image with a wider field of view than when the optical mark 37 is formed. That is, when the camera needs to be aligned, the state shown in FIG. 30 is used, and when an image of an opening or the like is taken, the state shown in FIG. 31 is used. That is, in the third embodiment, by performing a process including a process of switching between the light source 32 including the optical mark forming unit 33 and the second light source 65 not including the optical mark forming unit 33, the electronic device may be changed depending on the situation. It becomes possible to use a component manufacturing apparatus.

  The optical mark forming part 33 is disposed in the adapter 62 and the position thereof is fixed. For example, as shown in a schematic side perspective view of FIG. 34, the set screw 63 for fixing the adapter 62 is loosened. By changing the position of the adapter 62 upward, for example, in the Z-axis direction, the optical mark forming unit 33 can be moved. In addition, the screw 61 fixes the first light source 32 to the adapter 62.

  The first camera 301 of the electronic component manufacturing apparatus according to the third embodiment having the above configuration is applicable to both the first camera 101 according to the first embodiment and the first camera 201 according to the second embodiment.

  The description of the third embodiment other than the above is the same as that of the first or second embodiment, and thus the description thereof is omitted.

  In the first to third embodiments, the electronic component manufacturing apparatus is not limited to this, and may be, for example, a cutting apparatus.

  The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  Reference Signs List 1 substrate loading section, 2 substrate extrusion member, 3 base material, 4 sealing resin, 5 semiconductor package substrate, 5a semiconductor package, 6 package inloader, 6a rail, 7 substrate supply table, 8 cut table, 8a rotation mechanism, 8b Alignment camera, 9 spindle, 10 blade, 11 cleaning water spray member, 12 air injection member, 13 package unloader, 14 flipper, 14a rail, 15 index table, 16 sponge roller, 17 air injection member, 18 marking inspection camera, 19 Camera for package inspection, 21 holding mechanism, 21a holding head, 22 table, 22a surface, 23 arranging member, 23a opening, 24 arranging member loader, 25 rail, 26 arranging member loading section, 27 arithmetic mechanism, 31 first imaging device , 32 1st Light source, 33 optical mark forming section, 33a light transmitting section, 33b light shielding section, 34 first lens, 35 second lens, 36 half mirror, 37 optical mark, 38 light, 39 light section, 40 dark section, 41 Second imaging device, 42 Third lens, 43 Fourth lens, 44 Mirror, 45 Illumination, 46 Bright portion, 47 Dark portion, 48 Non-optical mark, 51 Third imaging device, 61 Set screw, 62 Adapter , 63 set screw, 64 half mirror, 65 second light source, 71 adhesive layer (adhesive layer), 72 sheet base material, 101, 201, 301 first camera, 101a light incidence part, 102, 202 second Camera, 103 Coaxial, 203 Third camera.

Claims (15)

A holding mechanism configured to be able to hold the transferred object and to be movable,
Light source,
An optical mark forming unit that can optically form an optical mark on an optical path of light emitted from the light source,
A first camera including a first image sensor configured to be able to image the optical mark and a transfer destination portion of the transferred object;
A second camera including a second image sensor configured to be able to image the transported object and the optical mark held by the holding mechanism;
An operation mechanism configured to be able to correct a moving distance of the object to be transferred to the transfer destination based on an amount of relative positional shift between the first camera and the second camera. .   The arithmetic mechanism is configured to calculate a first positional shift amount between the first camera and the optical mark calculated based on an image of the optical mark captured by the first imaging device; Calculating the relative position shift amount based on the second position shift amount between the second camera and the optical mark calculated based on the image of the optical mark captured by the imaging device of The transport mechanism according to claim 1, wherein the transport mechanism is capable. Further comprising a surface configured to be able to optically form the optical mark,
The transport mechanism according to claim 2, wherein the first imaging element acquires an image of the optical mark by imaging the optical mark optically formed on the surface. A holding mechanism configured to be able to hold the transferred object and to be movable,
Light source,
An optical mark forming unit that can optically form an optical mark on an optical path of light emitted from the light source,
A surface provided with a non-optical mark,
A first camera including a first imaging element configured to be capable of imaging the transport target portion of the transported object and the non-optical mark,
A second camera including a second imaging element configured to be able to image the transported object and the optical mark held by the holding mechanism;
A third camera including a third image sensor configured to be able to image the optical mark and the non-optical mark;
An operation mechanism configured to be able to correct the moving distance of the object to be transferred to the transfer destination based on an amount of relative displacement between the first camera and the second camera. . The arithmetic mechanism is
A first positional shift amount between the third camera and the optical mark calculated based on data of an image of the optical mark captured by the third image sensor, and the second image sensor The second camera and the third camera based on the second position shift amount between the second camera and the optical mark calculated based on the image of the optical mark captured by And the first relative position shift amount can be calculated.
The first camera and the third camera based on an image of the non-optical mark imaged by the first image sensor and an image of the non-optical mark imaged by the third image sensor; The transport mechanism according to claim 4, wherein a distance in a first direction from the camera and a distance in a second direction different from the first direction can be calculated.   The operation mechanism is configured to calculate a position shift amount between the second camera and the object to be transported calculated based on an image of the object to be transported captured by the second image sensor, and the first image sensor The moving distance can be corrected based on at least one of a positional shift amount between the first camera and the transport target location calculated based on an image of the transport target location captured by the camera. The transport mechanism according to claim 5.   The transport mechanism according to claim 1, wherein the optical mark forming unit is configured to be movable.   The optical mark forming unit includes a light blocking unit configured to block the light and a light transmitting unit configured to transmit the light. 2. The transport mechanism according to claim 1.   The transport mechanism according to claim 1, further comprising an optical system in the optical path.   The transport mechanism according to any one of claims 1 to 9, further comprising a second light source not including the optical mark forming unit, wherein the second light source is switched between the light source and the second light source.   An electronic component manufacturing apparatus comprising the transport mechanism according to claim 1. A step of holding the transferred object by a holding mechanism,
Optically forming an optical mark;
Imaging the optical mark by a first image sensor of a first camera;
Imaging the optical mark by a second imaging element of a second camera;
Imaging the transferred object held by the holding mechanism by the second image sensor;
A step of capturing an image of a transfer target portion of the transferred object by the first image sensor;
Calculating a relative positional shift amount between the first camera and the second camera;
Correcting the moving distance of the transported object to the transport destination based on the relative displacement amount;
Placing the transported object at the transport destination. A step of holding the transferred object by a holding mechanism,
Optically forming an optical mark;
Imaging a non-optical mark by a first image sensor of a first camera;
Imaging the optical mark by a second imaging element of a second camera;
Imaging the non-optical mark by a third imaging element of a third camera attached to the holding mechanism;
Imaging the transferred object held by the holding mechanism by the second image sensor;
A step of capturing an image of a transfer target portion of the transferred object by the first image sensor;
Calculating a relative positional shift amount between the first camera and the second camera;
Correcting the moving distance of the transported object to the transport destination based on the relative displacement amount;
Placing the transported object on the transport destination.   14. The transport method according to claim 12, further comprising a step of switching between a light source including an optical mark forming unit and a second light source not including the optical mark forming unit. A step of transporting the transported object to the transport destination by the transport method according to any one of claims 12 to 14,
The transferred object includes a semiconductor package,
A method for manufacturing an electronic component, further comprising a step of cutting the semiconductor package substrate to produce the semiconductor package.

Images