CN113921426A - Novel radio frequency chip packaging equipment - Google Patents
Novel radio frequency chip packaging equipment Download PDFInfo
- Publication number
- CN113921426A CN113921426A CN202111169623.8A CN202111169623A CN113921426A CN 113921426 A CN113921426 A CN 113921426A CN 202111169623 A CN202111169623 A CN 202111169623A CN 113921426 A CN113921426 A CN 113921426A
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- packaging
- chip
- conveying belt
- hydraulic cylinder
- box
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 118
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000005192 partition Methods 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000001125 extrusion Methods 0.000 abstract description 3
- 239000003921 oil Substances 0.000 description 12
- 238000005538 encapsulation Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- KJLPSBMDOIVXSN-UHFFFAOYSA-N 4-[4-[2-[4-(3,4-dicarboxyphenoxy)phenyl]propan-2-yl]phenoxy]phthalic acid Chemical compound C=1C=C(OC=2C=C(C(C(O)=O)=CC=2)C(O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 KJLPSBMDOIVXSN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container Filling Or Packaging Operations (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The invention discloses novel packaging equipment for a radio frequency chip, which belongs to the relevant field of chip production and comprises a conveying belt and a chip placed on the conveying belt, wherein packaging box pushing mechanisms are arranged above and below the conveying belt, dropping holes for the chip to pass through are formed in the conveying belt, and the packaging box pushing mechanisms and the conveying belt are arranged on a fixed frame. The upper packaging box and the lower packaging box are mutually buckled under the extrusion of the upper packaging hydraulic cylinder and the lower packaging hydraulic cylinder, and the chip is packaged in the sealing box formed by the upper packaging box and the lower packaging box to complete the packaging; the pushing hydraulic cylinder and the packaging hydraulic cylinder are communicated through an oil pipe, the moving directions are opposite, the moving relations are interlocked, and the packaging box and the chip are matched with a material, so that the chip packaging work is continuously carried out, and the efficient production is realized.
Description
Technical Field
The invention relates to packaging equipment, in particular to novel packaging equipment for a radio frequency chip.
Background
A chip is a miniature integrated circuit that is a way to miniaturize circuits in electronics and is often fabricated on the surface of a semiconductor wafer. When transporting, because the chip is more small difficult for taking, and the chip type is more moreover, and the chip type of being carved with on the chip is unclear, is difficult for seeking when seeking required chip, and chip itself is fragile, and in the use of transportation, naked chip can be touched unavoidably, and the microcircuit and the wiring pin on chip surface can be unavoidably impaired, and the chip after the destruction is difficult to continue to use.
The package of chip is to solve the above problems, the package for packaging semiconductor integrated circuit chip plays a role of placing, fixing, sealing, protecting chip and enhancing electrothermal performance, and is also a bridge for communicating the chip internal world with external circuit-the connection points on the chip are connected to the pins of the package by wires, and these pins are connected with other devices by wires on the printed board, and the package plays an important role for the integrated circuit.
The mode that two upper and lower casings coincide is often adopted during the chip encapsulation and is capsulated, places the chip in lower packaging box earlier, then will go up packaging box and packaging box lock down, transports the chip after the lock is encapsulated again, and whole process operation step is more, can not the efficient encapsulation of accomplishing the chip.
Disclosure of Invention
The present invention is directed to a novel radio frequency chip packaging device to solve the problems set forth in the background art.
In order to solve the defects of the prior art, the invention provides the following technical scheme:
a novel packaging device for radio frequency chips comprises a conveyer belt and chips placed on the conveyer belt, the packaging box pushing mechanisms are arranged above and below the conveying belt, dropping holes for passing the chips are arranged on the conveying belt, the packaging box pushing mechanism and the conveying belt are arranged on the fixing frame, the packaging box pushing mechanism comprises a positioning frame, a packaging hydraulic cylinder, a pushing hydraulic cylinder and an accommodating box which are arranged on the fixing frame, the positioning frame is communicated with the containing box, the upper end surface and the lower end surface of the positioning frame are provided with through holes, the through holes on the lower end surface of the positioning frame are provided with supporting components, the encapsulation pneumatic cylinder sets up in the top of locating rack, the propelling movement pneumatic cylinder sets up in the left side that holds the box and the piston rod of propelling movement pneumatic cylinder runs through and holds the box and will go up encapsulation box propelling movement to locating rack, the propelling movement pneumatic cylinder passes through oil pipe and oil pump intercommunication with the encapsulation pneumatic cylinder.
As a modified scheme of the invention: the inside fixed mounting of locating rack has the locating piece, fixed mounting has the baffle on the propelling movement pneumatic cylinder piston rod terminal surface.
As a further improvement of the invention: the supporting component comprises two supporting units which are symmetrically arranged on two sides of the through hole on the lower end face of the positioning frame, each supporting unit comprises a supporting plate which is hinged to the positioning frame, and an elastic unit used for supporting the supporting plates is arranged between the positioning frame and the supporting plate.
As a further improvement of the invention: the elastic unit comprises two sleeves connected with the supporting plate and the positioning frame, a sliding rod is arranged in each sleeve in a sliding mode, another sleeve is arranged between the sliding rods in a sliding mode, and a tensioning spring is arranged between each sleeve and each sliding rod.
As a further scheme of the invention: the encapsulating box pushing mechanism below the conveying belt further comprises an upper material plate arranged in the containing box in a sliding mode, a piston plate is arranged between the upper material plate and the end face of the containing box in a sliding sealing mode, and a plurality of feeding springs are uniformly distributed between the piston plate and the upper material plate.
As a further scheme of the invention: the inside equipartition of conveyer belt is provided with a plurality of switching subassemblies, the switching subassembly includes the switching unit that two symmetries set up, be provided with the wedge between the switching unit, wedge fixed mounting is on the mount, the switching unit is including setting up the division board in the conveyer belt, the equipartition is provided with a plurality of closed springs between division board and the conveyer belt.
As an optimization scheme of the invention: a plurality of blanking blocks are uniformly distributed and fixedly arranged on the surface of the conveying belt.
Compared with the prior art, the invention has the beneficial effects that:
the upper packaging box and the lower packaging box are mutually buckled under the extrusion of the upper packaging hydraulic cylinder and the lower packaging hydraulic cylinder, and the chip is packaged in the sealing box formed by the upper packaging box and the lower packaging box to complete the packaging; the pushing hydraulic cylinder and the packaging hydraulic cylinder are communicated through an oil pipe, the moving directions are opposite, the moving relations are interlocked, and the packaging box and the chip are matched with a material, so that the chip packaging work is continuously carried out, and the efficient production is realized.
Drawings
FIG. 1 is a front view of a novel RF chip package device;
FIG. 2 is a schematic structural view of a pushing mechanism of a package box below a novel radio frequency chip packaging device;
FIG. 3 is a schematic diagram of a structure of a resetting unit of a novel radio frequency chip packaging device;
FIG. 4 is a three-dimensional view of a resetting unit of a novel radio frequency chip packaging device;
FIG. 5 is a schematic diagram of a chip conveyor belt of a novel RF chip packaging device;
FIG. 6 is a partial top view of a chip carrier tape of a novel RF chip package device;
in the figure: 1-conveying belt, 2-positioning frame, 3-positioning block, 4-upper packaging box, 5-packaging hydraulic cylinder, 6-oil pipe, 7-oil pump, 8-pushing hydraulic cylinder, 9-containing box, 10-supporting plate, 11-packaging hole, 12-baffle, 13-piston plate, 14-loading spring, 15-loading plate, 16-sleeve, 17-sliding rod, 18-tensioning spring, 19-chip, 20-unloading block, 21-lower packaging box, 22-closing spring, 23-partition plate and 24-wedge block.
Detailed Description
The present invention will be described in detail with reference to the following embodiments, wherein like or similar elements are designated by like reference numerals throughout the several views, and wherein the shape, thickness or height of the various elements may be expanded or reduced in practice. The examples are given solely for the purpose of illustration and are not intended to limit the scope of the invention. Any obvious modifications or variations can be made to the present invention without departing from the spirit or scope of the present invention.
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Referring to fig. 1 and 2, the embodiment provides a novel radio frequency chip packaging device, which includes a conveyor belt 1 and a chip 19 placed on the conveyor belt 1, package box pushing mechanisms are respectively disposed above and below the conveyor belt 1, a drop hole for the chip 19 to pass through is disposed on the conveyor belt 1, the package box pushing mechanisms and the conveyor belt 1 are mounted on a fixed frame, the package box pushing mechanisms include a positioning frame 2 mounted on the fixed frame, a packaging hydraulic cylinder 5, a pushing hydraulic cylinder 8 and a containing box 9, the positioning frame 2 is communicated with the containing box 9, through holes are disposed on upper and lower end surfaces of the positioning frame 2, a support component is disposed at the through hole of the lower end surface of the positioning frame 2, the packaging hydraulic cylinder 5 is disposed above the positioning frame 2, the pushing hydraulic cylinder 8 is disposed on the left side of the containing box 9, and a piston rod of the pushing hydraulic cylinder 8 penetrates through the containing box 9 to push the upper box 4 into the positioning frame 2, the pushing hydraulic cylinder 8 and the packaging hydraulic cylinder 5 are communicated with an oil pump 7 through an oil pipe 6. The packaging box pushing mechanism below the conveying belt 1 further comprises an upper material plate 15 arranged in the containing box 9 in a sliding mode, a piston plate 13 is arranged between the upper material plate 15 and the end face of the containing box 9 in a sliding sealing mode, and a plurality of feeding springs 14 are uniformly distributed between the piston plate 13 and the upper material plate 15.
The packaging hydraulic cylinders 5 in the packaging box pushing mechanisms above and below the conveying belt 1 are oppositely arranged, a plurality of upper packaging boxes 4 are stacked in the containing box 9 of the packaging box pushing mechanism above the conveying belt 1, a plurality of lower packaging boxes 21 are stacked in the containing box 9 of the packaging box pushing mechanism below the conveying belt 1, when the packaging box pushing mechanism is used, the chip 19 is placed on the conveying belt 1 and conveyed between the packaging box pushing mechanisms above and below the conveying belt 1, when the chip 19 is positioned right below the packaging hydraulic cylinder 5, the chip 19 falls into the lower packaging box 21 from a falling hole, the oil pumps 7 in the upper and lower packaging box pushing mechanisms are started to convey hydraulic oil in the pushing hydraulic cylinders 8 into the packaging hydraulic cylinders 5 to push the packaging hydraulic cylinders 5 to move, piston rods of the pushing hydraulic cylinders 8 move to the left, and the packaging hydraulic cylinders 5 extrude the upper packaging boxes 4 and the lower packaging boxes 21 to pass through the supporting components to move in opposite directions, the upper packaging box 4 and the lower packaging box 21 are mutually buckled under the extrusion of the upper packaging hydraulic cylinder 5 and the lower packaging hydraulic cylinder 5, the chip 19 is packaged in a sealing box consisting of the upper packaging box 4 and the lower packaging box 21, the packaging is completed, the device can simultaneously complete the loading and the packaging of the chip 19, the packaging steps are rapid and efficient, and the packaging box and the chip 19 are matched for loading, so that the chip packaging work is continuously carried out and the efficient production is realized; when the packaging hydraulic cylinder 5 is inserted into the positioning frame 2, the piston rod of the pushing hydraulic cylinder 8 moves leftwards to leave the inside of the containing box 9, the upper packaging box 4 in the containing box 9 automatically falls under the action of gravity, the lower packaging box 21 in the containing box 9 continuously moves upwards under the action of the elastic force of the loading spring 14, so that the position right opposite to the pushing hydraulic cylinder 8 is supplemented with one upper packaging box 4 and one lower packaging box 21 again, when the oil pump 7 transmits the hydraulic pressure in the packaging hydraulic cylinder 5 to the pushing hydraulic cylinder 8, the two packaging hydraulic cylinders 5 are separated from each other and leave from the positioning frame 2, the piston rod of the pushing hydraulic cylinder 8 extends out, the upper packaging box 4 and the lower packaging box 21 are pushed into the positioning frame 2, and the next chip 19 is packaged conveniently. The pushing hydraulic cylinder 8 and the packaging hydraulic cylinder 5 are communicated through an oil pipe 6, the moving directions are opposite, and the moving relations are interlocked.
Referring to fig. 1 and fig. 2, as an optimized embodiment of the present invention: the inside fixed mounting of locating rack 2 has locating piece 3, fixed mounting has baffle 12 on the propelling movement pneumatic cylinder 8 piston rod terminal surface. The positioning block 3 is additionally arranged to position the upper packaging box 4 and the lower packaging box 21 at specified positions so that the upper packaging box 4 and the lower packaging box 21 correspond to the through holes on the positioning frame 2; the baffle 12 is additionally arranged to prevent the upper packaging box 4 and the lower packaging box 21 from contacting with the piston rod of the pushing hydraulic cylinder 8, and prevent the upper packaging box 4 or the lower packaging box 21 from scratching the surface of the piston rod of the pushing hydraulic cylinder 8, so that the oil cylinder leaks oil, the service life is shortened, and the maintenance cost is increased.
Referring to fig. 1-3, as another preferred embodiment of the present invention: the supporting component comprises two supporting units which are symmetrically arranged on two sides of a through hole on the lower end face of the positioning frame 2, each supporting unit comprises a supporting plate 10 which is hinged to the positioning frame 2, and an elastic unit used for supporting the supporting plate 10 is arranged between the positioning frame 2 and the supporting plate 10. The elastic unit comprises two sleeves 16 connected with the supporting plate 10 and the positioning frame 2, two sliding rods 17 are arranged in the two sleeves 16 in a sliding mode, another sleeve 16 is arranged between the two sliding rods 17 in a sliding mode, and a tensioning spring 18 is arranged between the sleeve 16 and the sliding rod 17. When the device is used, the upper packaging box 4 or the lower packaging box 21 is pressed to extrude the support plate 10, the support plate 10 rotates around the hinged joint, the rotating support plate 10 extrudes the sliding rod 17 to slide in the sleeve 16, so that the distance between the sleeves 16 is reduced, the support plate 10 can rotate by a larger angle, when the upper packaging box 4 is moved out of the positioning frame 2, the sliding rod 17 extends out of the sleeve 16 under the action of the elastic force of the tensioning spring 18, the support plate 10 is pushed to return to the horizontal position, and the upper packaging box 4 or the lower packaging box 21 to be moved into the positioning frame 2 is supported.
Please refer to fig. 1 and fig. 6, which illustrate another preferred embodiment of the present invention: the inside equipartition of conveyer belt 1 is provided with a plurality of switching subassemblies, the switching subassembly includes the switching unit that two symmetries set up, be provided with wedge 24 between the switching unit, wedge 24 fixed mounting is on the mount, the switching unit is including setting up division board 23 in conveyer belt 1, the equipartition is provided with a plurality of closed springs 22 between division board 23 and the conveyer belt 1. The wedge-shaped block 24 is arranged on the right side of the through hole of the positioning frame 2, when the conveying belt 1 drives the chip 19 to be conveyed to the position right below the upper packaging box 4, the wedge-shaped block 24 is in contact with the partition plates 23, along with the continuous movement of the conveying belt 1, two pairs of partition plates 23 in the upper and lower groups of opening and closing units symmetrically arranged in the conveying belt 1 are separated by the wedge-shaped block 24, a falling hole is formed between the separated partition plates 23, the chip 19 falls into the lower packaging box 21 from the falling hole, and the upper packaging box 4 and the lower packaging box 21 are waited to be packaged.
Referring to fig. 1 and 5, as a further preferred embodiment of the present invention: a plurality of blanking blocks 20 are uniformly and fixedly arranged on the surface of the conveying belt 1. In use, after the chip 19 is encapsulated by the upper and lower encapsulation boxes 4 and 21, the encapsulated chip 19 is positioned
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A novel radio frequency chip packaging device comprises a conveying belt (1) and a chip (19) placed on the conveying belt (1), and is characterized in that packaging box pushing mechanisms are arranged above and below the conveying belt (1), a falling hole for the chip (19) to pass through is formed in the conveying belt (1), the packaging box pushing mechanisms and the conveying belt (1) are installed on a fixing frame, each packaging box pushing mechanism comprises a positioning frame (2), a packaging hydraulic cylinder (5), a pushing hydraulic cylinder (8) and a containing box (9) which are installed on the fixing frame, the positioning frame (2) is communicated with the containing box (9), through holes are formed in the upper end face and the lower end face of the positioning frame (2), a supporting component is arranged at the through hole of the lower end face of the positioning frame (2), and the packaging hydraulic cylinder (5) is arranged above the positioning frame (2), the pushing hydraulic cylinder (8) is arranged on the left side of the accommodating box (9) and a piston rod of the pushing hydraulic cylinder (8) penetrates through the accommodating box (9), and the pushing hydraulic cylinder (8) and the packaging hydraulic cylinder (5) are communicated through an oil pipe (6) and an oil pump (7).
2. The novel radio frequency chip packaging device according to claim 1, wherein a positioning block (3) is fixedly installed inside the positioning frame (2), and a baffle (12) is fixedly installed on the end face of the piston rod of the pushing hydraulic cylinder (8).
3. The packaging equipment of a novel radio frequency chip according to claim 1, wherein the supporting component comprises two supporting units symmetrically installed at two sides of the through hole on the lower end face of the positioning frame (2), the supporting units comprise supporting plates (10) hinged and installed on the positioning frame (2), and an elastic unit for supporting the supporting plates (10) is arranged between the positioning frame (2) and the supporting plates (10).
4. The packaging equipment of a novel radio frequency chip is characterized in that the elastic unit comprises two sleeves (16) connected with the support plate (10) and the positioning frame (2), a sliding rod (17) is arranged in the two sleeves (16) in a sliding mode, another sleeve (16) is arranged between the two sliding rods (17) in a sliding mode, and a tension spring (18) is arranged between the sleeves (16) and the sliding rods (17).
5. The packaging equipment of the novel radio frequency chip according to claim 1, wherein the packaging box pushing mechanism below the conveyor belt (1) further comprises a feeding plate (15) slidably disposed in the containing box (9), a piston plate (13) is disposed between the feeding plate (15) and the end face of the containing box (9) in a sliding and sealing manner, and a plurality of feeding springs (14) are uniformly disposed between the piston plate (13) and the feeding plate (15).
6. The novel radio frequency chip packaging equipment according to claim 1, wherein a plurality of opening and closing assemblies are uniformly arranged in the conveying belt (1), each opening and closing assembly comprises two opening and closing units which are symmetrically arranged, a wedge block (24) is arranged between the two opening and closing units, the wedge block (24) is fixedly installed on a fixed frame, each opening and closing unit comprises a partition plate (23) arranged in the conveying belt (1), and a plurality of closing springs (22) are uniformly arranged between each partition plate (23) and the conveying belt (1).
7. The packaging equipment of the novel radio frequency chip is characterized in that a plurality of blanking blocks (20) are uniformly and fixedly arranged on the surface of the conveying belt (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111169623.8A CN113921426B (en) | 2021-10-08 | 2021-10-08 | Novel radio frequency chip packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111169623.8A CN113921426B (en) | 2021-10-08 | 2021-10-08 | Novel radio frequency chip packaging equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113921426A true CN113921426A (en) | 2022-01-11 |
| CN113921426B CN113921426B (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111169623.8A Active CN113921426B (en) | 2021-10-08 | 2021-10-08 | Novel radio frequency chip packaging equipment |
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| Country | Link |
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| CN (1) | CN113921426B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018069503A (en) * | 2016-10-26 | 2018-05-10 | 第一精工株式会社 | Resin sealing metal mold, primary molding die, secondary molding die and manufacturing method for resin molded article |
| JP2020017559A (en) * | 2018-07-23 | 2020-01-30 | Ｔｏｗａ株式会社 | Transfer mechanism, electronic component manufacturing installation, transfer method and manufacturing method of electronic component |
| CN111584407A (en) * | 2020-05-29 | 2020-08-25 | 太极半导体（苏州）有限公司 | Embedded chip packaging structure and using method thereof |
| CN111739824A (en) * | 2020-07-03 | 2020-10-02 | 顾骏 | Semiconductor chip packaging structure and packaging component thereof |
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2021
- 2021-10-08 CN CN202111169623.8A patent/CN113921426B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018069503A (en) * | 2016-10-26 | 2018-05-10 | 第一精工株式会社 | Resin sealing metal mold, primary molding die, secondary molding die and manufacturing method for resin molded article |
| JP2020017559A (en) * | 2018-07-23 | 2020-01-30 | Ｔｏｗａ株式会社 | Transfer mechanism, electronic component manufacturing installation, transfer method and manufacturing method of electronic component |
| CN111584407A (en) * | 2020-05-29 | 2020-08-25 | 太极半导体（苏州）有限公司 | Embedded chip packaging structure and using method thereof |
| CN111739824A (en) * | 2020-07-03 | 2020-10-02 | 顾骏 | Semiconductor chip packaging structure and packaging component thereof |
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| CN113921426B (en) | 2022-08-30 |
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