JP2018069503A - Resin sealing metal mold, primary molding die, secondary molding die and manufacturing method for resin molded article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide, regarding a resin molded article in which an exposed part is formed on a surface of an optical element using a two-colar molding technique, a resin sealing metal mold, a primary molding die, a secondary molding die and a manufacturing method for the resin molded article, capable of molding the resin molded article while preventing leaking of a resin material to the surface of the optical element without applying an excessive pressure against a primary molded article.SOLUTION: In a manufacturing method for a resin molded article, a resin molding part 16, a recess part 17 and a protrusion part 18 located at an outer peripheral edge of the recess part 17 are formed in a cavity recess part 13 of a secondary upper chess 1. The resin molding part 16 is a part that forms a supporting member of a primary molded article 8 on an outer peripheral surface of the primary molded article 8 molded of a transparent resin. The recess part 17 is a part that covers a lens part 19 of the primary molded article 8 during resin sealing. The protrusion part 18 is a part that hits against an outer peripheral edge of the lens part 19 of the primary molded article 8 during resin sealing and causes the lens part 19 to be exposed while preventing intrusion of the resin into a side of the lens part 19.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a resin sealing mold, a primary molding mold, a secondary molding mold, and a method for producing a resin molded product.

  Conventionally, insert molding has been performed in which an electronic component such as a semiconductor is sealed with a resin to manufacture a resin-sealed package. In this insert molding, an electronic component, a substrate with an electronic component, or the like is fixed inside a mold, and a resin melted in a cavity is filled and cured to integrate the substrate with the electronic component, etc. and a resin molding portion.

  Depending on the type of electronic components such as semiconductors sealed in the resin-sealed package, the optical element such as a lens is primarily molded with resin, and the primary element that supports the optical element while exposing a part of the surface to the outside. There is a resin molded product obtained by integrally molding a molded product with a resin for secondary molding.

  In such a resin molded product, for example, two-color molding in which an optical element such as a lens is primarily molded with a transparent resin material, and then a primary molded product that supports the optical element is secondarily molded with a colored resin material such as black. Technology is being used.

  In the two-color molding technology, a primary molding die that fills a transparent resin raw material to form a primary molded product and a colored resin raw material are filled to expose the optical element and form a support member that supports the optical element. A secondary molding die is used.

  As a method of integrally molding an optical element such as a lens and a support member using a two-color molding technique, for example, a method for manufacturing a resin molded product and a mold for resin sealing described in Patent Document 1 have been proposed. Yes.

  In the resin sealing mold described in Patent Document 1, a resin molded product 100 shown in FIG. 11 is molded. The resin molded product 100 is obtained by first molding the optical element 101 with a transparent resin and integrally molding the support member 102 with a colored resin material by secondary molding while exposing the optical element 101.

JP 2012-51291 A

  Here, in the case of producing a resin molded product in which a part of the primary molded product is exposed to the outside by insert molding using the two-color molding technology, including the resin molded product described in Patent Document 1, It is necessary to mask the corresponding exposed portion at the time of resin sealing in the next molding. Masking is performed, for example, by bringing a nesting having a concave shape provided in the secondary molding die into close contact with the outer peripheral surface of the exposed portion.

  When this masking is performed, if a gap is formed between the exposed portion and the insert, or if the force for adhering both members of the exposed portion and the insert is insufficient, the colored resin material for secondary molding At the time of filling, the resin material may leak into and enter the exposed portion, and the resin may adhere to the surface of the exposed portion. If the resin adheres to the exposed portion, the function that the exposed portion should perform is impaired, leading to a product defect.

  For this reason, in the conventional resin molded product manufacturing process, in order to suppress the penetration of the resin into the exposed portion, when the mold is clamped with the secondary molding die, the nest is in contact with the exposed portion, A constant pressure is applied to the surrounding area.

  Here, the transparent resin raw material such as polycarbonate for molding the exposed portion is generally low in hardness, and distortion may occur inside the transparent resin due to the pressure applied during masking.

  When the distortion occurs in the transparent resin, there arises a problem that the primary molded product is peeled off from the substrate side and the wire connected to the semiconductor chip is deformed.

  The present invention was devised in view of the above points, and a resin molded product in which an exposed portion is formed by using a two-color molding technique can be applied to an exposed portion without exerting excessive pressure on the primary molded product. It is an object of the present invention to provide a resin sealing mold, a primary molding mold, a secondary molding mold, and a method for producing a resin molded product, which can prevent resin material leakage and mold a resin molded product.

  In order to achieve the above object, the resin sealing mold of the present invention fills a first internal space formed by a pair of molds with a light-transmitting molding material to form a substrate with an electronic component. A primary molding die molded with the primary molding die is filled with a thermosetting molding material in a second internal space formed by a primary molding die sealed with a resin and another pair of dies. A resin molding die comprising a secondary molding die for resin-sealing the primary molded product so as to expose a part thereof, wherein the primary molding die is the base material with electronic parts A first mold for mounting the first mold and the first internal space formed together with the first mold, and a small space imitating a recess forming an exposed portion and a step formed at the periphery of the recess. A second mold for forming the secondary mold, wherein the secondary mold is a third mold for placing the primary molded product, and the primary mold. A fourth mold that forms the second internal space together with the third mold in a state of covering the exposed part and the part formed by the step, which is imitated by the small space, .

  Here, the first inner mold formed by the pair of molds is filled with a light-transmitting molding material, and the first molding mold for resin-sealing the substrate with electronic components is used to form the first molding mold. A primary molded product in which a base material with an electronic component is resin-sealed can be molded in one internal space. In addition, the base material with an electronic component here means what contains various boards, such as an electronic circuit board containing a printed circuit board, or a lead frame, for example.

  Further, the second internal space formed by another pair of molds is filled with a thermosetting molding material, and the primary molded product molded by the primary molding mold is exposed so that a part of the primary molded product is exposed. With the secondary molding die for resin-sealing the molded product, a resin molded product that is resin-sealed by exposing a part of the primary molded product in the second internal space of the secondary molding die can be molded.

  Further, in the first internal space formed together with the first mold of the primary molding die, a second space that forms a recess that forms an exposed portion and a small space that imitates a step formed at the periphery of the recess. By the mold, a shape corresponding to a step can be formed on the exposed portion and the peripheral edge of the primary molded product resin-sealed in the first internal space. In addition, the exposed part formed in the primary molded article here is a part used as optical elements, such as a lens, for example.

  Moreover, by the 4th metal mold | die which forms a 2nd internal space with a 3rd metal mold | die in the state which covered the part formed in the exposed part and the level | step difference imitated by a small space among primary molded articles. It is possible to prevent the resin from entering the exposed part of the primary molded product formed by the depression of the second mold without exposing it to the outside without covering with the thermosetting resin. It becomes. That is, when the second internal space is filled with the thermosetting resin, the fourth mold covers the exposed portion and the portion formed by the step, which is imitated by the small space in the primary molded product. Infiltration of the resin toward the exposed portion can be suppressed.

  In addition, when the fourth mold has a contact portion that is in contact with a portion formed by a step, which is imitated by a small space, of the primary molded product in the second internal space, primary molding is performed. When the product is clamped with the third mold and the fourth mold, the contact part of the fourth mold and the part formed by the step, which is imitated by the small space in the primary molded product, come into contact It becomes. By this contact, it is possible to block the penetration of the molten thermosetting resin into the exposed portion of the primary molded product. In addition, for example, when a portion formed by a step, which is imitated by a small space in the primary molded product, has a recessed shape, the molten thermosetting resin passes through the recessed portion, so that the resin moves Since the distance becomes long, it is possible to make it difficult for the resin to adhere to the exposed portion of the primary molded product.

  Further, in the second mold, the concave shape arranged at the periphery of the recess is formed as a step, and in the fourth mold, the exposed part formed by the recess and the concave shape are formed in the primary molded product. When the second internal space is formed in the state where the convex portions are covered, when the primary molded product is clamped with the third mold and the fourth mold, The convex part formed corresponding to the concave shape of the mold, that is, the convex part formed on the periphery of the exposed part is covered with the fourth mold. Thereby, infiltration of the molten thermosetting resin into the exposed part of the primary molded product can be blocked. Moreover, pressure can be applied to the convex part of the primary molded product to stop the flow of the melted thermosetting resin, and the resin can hardly adhere to the exposed portion of the primary molded product.

  In order to achieve the above object, the primary molding die of the present invention is a base material with an electronic component in which a first internal space formed by a pair of dies is filled with a light-transmitting molding material. By sealing with resin, a thermosetting molding material is filled in the second internal space formed by another pair of molds that are secondary molding dies in the subsequent process, and a part thereof is exposed. A primary molding die for molding a primary molded product that is resin-sealed so as to form a first mold on which the substrate with electronic parts is placed, and the first mold that is formed together with the first mold And a second mold that forms, in one internal space, a recess that forms an exposed portion and a small space that imitates a step formed at the periphery of the recess.

  Here, the first internal space formed by a pair of molds is filled with a light-transmitting molding material, and the substrate with the electronic component is resin-sealed, whereby the electronic component is placed in the first internal space. A primary molded product in which the attached substrate is resin-sealed can be molded.

  In addition, a second internal space formed by another pair of molds of the secondary molding die is filled with a thermosetting molding material and resin-sealed so that a part of the primary molded product is exposed. Thus, a resin molded product in which a part of the primary molded product is exposed and resin-sealed can be molded in the second internal space of the secondary molding die.

  In addition, the second mold that forms a small space that imitates a recess that forms an exposed portion and a step formed at the periphery of the recess in the first internal space that is formed together with the first mold. An exposed portion can be formed in the primary molded product sealed with resin in one internal space, and a shape corresponding to the step can be formed on the periphery of the exposed portion. Therefore, for example, when the primary molded product is resin-sealed with the secondary molding die, the exposed portion of the primary molded product and the peripheral portion of the exposed portion corresponding to the step are formed into the secondary molding die. By covering with, it is possible to prevent the resin material from entering the exposed portion.

  In order to achieve the above object, the secondary molding die of the present invention is a base material with an electronic component in which a first internal space formed by a pair of dies is filled with a light-transmitting molding material. The primary molded product obtained by resin-sealing is filled with a thermosetting molding material in a second internal space formed by another pair of molds so that a part thereof is exposed. A secondary molding die that is sealed with a resin, the primary molded product having a lens portion that is molded by the primary molding die and exposed to the outside, and a convex portion or a concave portion that is disposed at the periphery of the lens portion. Forming a second internal space together with the third mold in a state of covering the lens part and the convex part or the concave part of the primary molded product, And a resin to the lens part in contact with the convex part or the concave part of the primary molded product. Intrusion to suppress.

  Here, a primary molded product obtained by filling a first internal space formed by a pair of molds with a light-transmitting molding material and resin-sealing the substrate with electronic components is separated from another Filling the second internal space formed by a pair of molds with a thermosetting molding material and resin-sealing the resin-encapsulated base material with electronic components in the first internal space A resin molded product obtained by sealing the primary molded product with a thermosetting molding material can be molded.

  Further, the primary molded product is filled with a thermosetting molding material in a second internal space formed by another pair of molds and resin-sealed so as to partially expose the primary molded product. A resin molded product in which a part of the molded product is exposed and resin-sealed can be molded.

  Further, a third mold for placing the primary molded product, which is molded by the primary molding die and has a lens part exposed to the outside and a convex part or a concave part arranged at the periphery of the lens part, With the fourth mold forming the second internal space together with the third mold in a state of covering the lens part and the convex part or the concave part of the primary molded article, the lens part of the primary molded product is thermosetting. It can be exposed outside without being covered with resin. That is, when the second internal space is filled with the thermosetting resin, the fourth mold can cover the lens portion of the primary molded product so that the resin is not filled. Further, it is possible to prevent the resin from entering the exposed portion while exposing the lens portion of the primary molded product to the outside without being covered with the thermosetting resin. That is, when the thermosetting resin is filled in the second internal space, the lens part is formed by covering the convex part or the concave part arranged on the periphery of the lens part in the primary molded product with the fourth mold. It is possible to suppress the penetration of the resin into the.

  Further, the resin can be made difficult to adhere to the exposed lens portion of the resin molded product by abutting against the convex portion or the concave portion of the primary molded product to suppress the intrusion of the resin into the lens portion.

  In addition, in order to achieve the above object, a method for producing a resin molded product of the present invention includes a lens portion that is exposed to the outside by filling a light-transmitting molding material in a first internal space of a primary mold A primary molding step of molding a primary molded product having a convex portion or a concave portion arranged around the lens portion, and the convex portion or the concave portion of the primary molded product is a second molding die. The second internal space is filled with a thermosetting molding material so as to abut against a concave portion or a convex portion provided in the internal space and to prevent the molding material from entering the lens portion. A next forming step.

  Here, the first inner space of the primary molding die is filled with a light-transmitting molding material, and has a lens part exposed to the outside, and a primary part having a convex part or a concave part arranged around the lens part. By the primary molding step of molding the molded product, the primary molded product that is resin-sealed with a light-transmitting molding material in the first internal space can be molded. In addition, the primary molded product is provided with a lens portion exposed to the outside and a convex portion or a concave portion disposed around the lens portion.

  Further, the convex portion or the concave portion of the primary molded product is brought into contact with the concave portion or the convex portion provided in the second internal space of the secondary molding die, and the penetration of the molding material into the lens portion is suppressed. As described above, the lens portion of the primary molded product can be exposed to the outside without being covered with the thermosetting resin by the secondary molding step of filling the second internal space with the thermosetting molding material. That is, when the thermosetting resin is filled in the second internal space, the convex portion or the concave portion of the primary molded product is brought into contact with the concave portion or the convex portion provided in the second internal space. The lens portion can be a region not filled with resin. Further, it is possible to prevent the resin from entering the exposed portion while exposing the lens portion of the primary molded product without being covered with the thermosetting resin.

  The resin sealing mold, the primary molding mold, the secondary molding mold, and the resin molded product manufacturing method according to the present invention are the primary molding of the resin molded product in which the exposed portion is formed using the two-color molding technology. Without exerting excessive pressure on the product, the resin molded product can be molded by suppressing leakage of the resin material to the exposed portion.

It is a schematic explanatory drawing which shows one Embodiment of the resin sealing apparatus using the metal mold | die for resin sealing to which this invention is applied. It is a schematic perspective view of the resin sealing apparatus using the resin sealing metal mold | die to which this invention is applied. (A) is a perspective explanatory view of the state where the upper mold and the lower mold of the secondary molding mold provided in the resin sealing mold are separated from each other, and (b) is the secondary molding mold of FIG. It is a perspective explanatory view showing the internal structure of. It is the elements on larger scale which show the periphery of the upper mold | type of a secondary shaping metal mold | die, and a cavity recessed part. (A) is a plan view and a cross-sectional view of a primary molded product molded by a primary molding die, and (b) is a plan view of a secondary upper die chess of a secondary molding die and the primary molded product is clamped. The top view and sectional drawing in that case, (c) are the top view and sectional drawing of a resin molded product. (A) is a plan view and a cross-sectional view of a primary molded product molded by a primary molding die, and (b) is a plan view of a secondary upper die chess of a secondary molding die and the primary molded product is clamped. The top view and sectional drawing in that case, (c) are the top view and sectional drawing of a resin molded product. (A) is sectional drawing which shows the upper mold | type cavity block in other embodiment, (b) is sectional drawing which shows the upper mold | type cavity block in another embodiment. (A) is sectional drawing which shows the upper mold | type cavity block which tensioned the protective film, (b) is sectional drawing which shows the upper mold | type cavity block in other embodiment which tensioned the protective film. (A) thru | or (d) are sectional drawings which show the pattern of the shape of the convex part formed in the cavity recessed part. (A) thru | or (c) is process drawing which shows the flow of resin sealing of the primary molded product by a secondary molding die. It is sectional drawing which shows the conventional resin molded product shape | molded using the two-color molding technique.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the resin sealing device A includes a secondary molding upper mold constituted by an upper die set 420 and a secondary upper die chess 1, a lower die set 430 and a secondary lower die chess 2. The mold includes a secondary molding die B composed of a secondary molding lower mold, a resin injection device 3, and a mold clamping device 4 that drives the mold up and down to open and close the mold. Further, the resin sealing device A includes a substrate transport device that transports the substrate and the primary molded product, and a product transport device (both not shown) that transports the molded product after resin sealing. The secondary molding die B is an example of a secondary molding die according to the present invention. In the present embodiment, the position of the lower die set 430 relative to the upper die set 420 is “lower”, and the position of the upper die set 420 relative to the lower die set 430 is “upper”.

  The secondary molding die B is obtained by resinating a primary molded product obtained by resin-sealing a substrate with electronic components with a transparent resin by a resin sealing device (not shown) in which the primary molding die is arranged, with a black epoxy resin. This is a mold for sealing. The secondary molding die B is resin-sealed so that the lens part molded with the transparent resin of the primary molded product is exposed to the outside. The resin sealing device A is a device in which the secondary molding die B is arranged, but the primary molding die has the same device configuration (the primary upper die chess and the primary lower die chess are different parts). The resin sealing device is arranged. A primary molded product is molded in the resin sealing device in which the primary molding die is arranged, and the primary molded product is transported to the resin sealing device A by the substrate transport device.

  The upper die set 420 is a member that supports the secondary upper die chess 1, and the lower die set 430 is a member that supports the secondary lower die chess 2. The secondary upper mold chess 1 and the secondary lower mold chess 2 have cavities into which a resin material is injected, and cooperate to manufacture a resin molded product. The secondary upper mold chess 1 and the secondary lower mold chess 2 can be exchanged according to the type of molded product, and the detailed structure thereof will be described later. Further, in principle, the same upper die set 420 and lower die set 430 can be used regardless of the type of molded product.

  The resin injection device 3 is a device that extrudes a thermosetting resin material while melting a resin tablet of an epoxy resin heated in a pot described later in a state where the secondary molding die B is clamped.

  As shown in FIG. 1, the mold clamping device 4 includes a plurality of substantially parallel tie bars 41 provided in the vertical direction. The upper ends of the tie bars 41 are connected by a fixed platen 42. Furthermore, the lower end of each tie bar 41 is connected to a base platen (not shown).

  Further, a movable platen 43 is fitted to each tie bar 41 so as to be movable up and down. The movable platen 43 can be moved up and down with a required stroke by an elevating drive unit (not shown) provided with an actuator such as a hydraulic cylinder or a toggle link device via a ball screw driven by a motor.

  An upper die set 420 is fixed to the lower surface of the fixed platen 42. The secondary upper die chess 1 is fixed to the lower side of the upper die set 420. A lower die set 430 is fixed on the upper surface of the movable platen 43. On the upper side of the lower die set 430, the secondary lower die chess 2 is fixed.

  As shown in FIG. 2, the secondary lower mold chess 2 is formed in a thick plate shape by integrating the lower mold cavity block 5 and the pot block 6. A primary molded product 8 in which the substrate 7 is resin-sealed with a transparent resin is placed on the upper surface of the lower mold cavity block 5. The pot block 6 is formed with a pot 9 for heating the resin material.

  As shown in FIGS. 3A and 3B, the upper surface of the lower die cavity block 5 in the secondary lower die chess 2 cooperates with the lower surface of the upper die cavity block 10 in the secondary upper die chess 1. Thus, it becomes a die-matching surface for sandwiching the primary molded product 8.

  The secondary upper mold chess 1 is formed in a thick plate shape by integrating the upper mold cavity block 10 and the cull block 11. The cull block 11 is formed with a cull portion 12 that communicates with the pot block 6 during mold clamping (see FIG. 3B). In addition, a cavity recess 13 is formed in the upper mold cavity block 10, and the cull portion 12 and the cavity recess 13 are connected by a resin passage 14.

  The cavity recess 13 is formed at a position facing the region where the primary molded product 8 is placed when the secondary upper mold chess 1 and the secondary lower mold chess 2 are clamped, and is filled with a resin material. It becomes an area. A resin molded product 15 in which the primary molded product 8 is sealed with an epoxy resin is molded in accordance with the shape of the cavity recess 13 (see FIG. 5C). The shape of the resin molded product 15 will be described later.

  The primary molded product 8 has a hemispherical lens portion 19 formed of a transparent resin (see FIGS. 3A and 3B). The lens part 19 has an optical element, for example, and becomes a part exposed outside in the resin molded product 15 after the secondary molding.

  As shown in FIG. 4, the cavity concave portion 13 of the secondary upper mold chess 1 is formed with a resin molded portion 16, a concave portion 17, and a convex portion 18 positioned on the outer peripheral edge of the concave portion 17. The resin molded portion 16 is a portion that forms a support member for the primary molded product 8 on the outer peripheral surface of the primary molded product 8 molded with a transparent resin. The hollow portion 17 is a portion that covers the lens portion 19 of the primary molded product 8 during resin sealing. Further, the convex portion 18 is a portion that abuts the outer peripheral edge of the lens portion 19 of the primary molded product 8 at the time of resin sealing, prevents the resin from entering the lens portion 19 side, and exposes the lens portion 19. . The convex portion 18 is a member corresponding to the “contact portion” in the claims of the present application.

  The primary molded product 8 and the secondary molding die B will be further described with reference to FIGS. 5 (a) to 5 (c). The primary molded product 8 is formed by sealing a transparent resin on the upper surface of the substrate 7 and has a main body portion 20 and the lens portion 19 described above as shown in FIG. A concave portion 21 is formed on the outer peripheral edge of the lens portion 19 in the main body portion 20.

  The concave portion 21 of the primary molded product 8 is a portion that abuts on the convex portion 18 of the cavity concave portion 13 in the secondary upper mold chess 1 described above when the secondary molding die B is clamped. The shapes of the main body part 20, the lens part 19 and the recessed part 21 in the primary molded product 8 are molded by a primary molding die (not shown). That is, the cavity concave portion of the primary upper mold chess constituting the primary molding die is imitating the shape of the primary molded product 8 (all are not shown). In the cavity concave portion of the primary upper chess, a small space is formed in which a hemispherical hollow portion corresponding to the lens portion 19 of the primary molded product 8 and a protrusion which is a step formed on the outer peripheral edge of the hollow portion are imitated. Has been.

  As shown in FIG. 5B, in the state where the mold is clamped by the secondary molding die B, the primary molded product 8 placed on the upper surface of the lower mold cavity block 5 in the secondary lower mold chess 2 is The upper upper mold chess 1 is positioned opposite to the cavity recess 13 of the upper mold cavity block 10.

  The lens part 19 of the primary molded product 8 is covered with the hollow part 17 of the cavity concave part 13. Further, the recessed portion 21 of the primary molded product 8 comes into contact with the protruding portion 18 of the cavity recessed portion 13 (see the lower diagram in FIG. 5B). Further, the outer peripheral surface of the main body portion 20 of the primary molded product 8 is covered with the resin molding portion 16 of the cavity recess 13. The resin molding part 16 is connected to a pot 9 serving as an epoxy resin supply and a resin passage 14 communicating with the cull part 12 (see the lower diagram in FIG. 5B). The molten epoxy resin is filled in the resin molding portion 16 of the cavity recess 13 through the resin passage 14.

  When the epoxy resin is filled, the molten resin material fills the resin molded portion 16, but the convex portion 18 of the cavity concave portion 13 comes into contact with the concave portion 21 of the primary molded product 8, and the lens portion 19. Infiltration of the resin material into the can be suppressed. Further, when the resin material tries to enter the lens portion 19, the resin material flows along the shape of the recessed portion 21, so that the moving distance necessary for the resin material to reach the lens portion 19 becomes long, and the lens portion It is possible to make the resin difficult to adhere to 19. In this case, since the intrusion of the resin toward the lens unit 19 is hindered by the shape of the concave portion 21, the mold clamping is performed without applying pressure to the lens unit 19 and the peripheral area when the secondary molding die is clamped. Is possible.

  As shown in FIG. 5C, the resin molded product 15 in which the primary molded product 8 is sealed with an epoxy resin has a support member 22 molded on the outer peripheral surface of the primary molded product 8 with an epoxy resin. Further, the lens portion 19 becomes an exposed portion 23 exposed to the outside without being covered by the support member 22.

  In the primary molded product 8 and the secondary molding die B described above, when the secondary molding die B is clamped, the hollow portion 17 and the convex portion 18 of the cavity concave portion 13 in the secondary upper mold chess 1 become the primary molded product 8. It will be in the state which covered the lens part 19 and the recessed part 21 of the outer periphery. Thereby, in the resin molded product 15 after the secondary molding, the lens part 19 is exposed to the outside, and the epoxy resin does not adhere to the lens part 19.

  Other embodiments of the primary molded product (primary molding die) and the secondary molding die will be described. As shown in FIG. 6A, the primary molded product 24 is molded by sealing a transparent resin on the upper surface of the substrate 25. The primary molded product 24 has a main body portion 26 and a lens portion 27. A convex portion 28 is formed on the outer peripheral edge of the lens portion 27 in the main body portion 26.

  The convex portion 28 of the primary molded product 24 is a portion that comes into contact with the concave portion 31 formed in the cavity concave portion 30 in the secondary upper mold chess 29 when the secondary molding die is clamped (see FIG. 6B). ). The shapes of the main body part 26, the lens part 27, and the convex part 28 in the primary molded product 24 are molded by a primary molding die (not shown). That is, the cavity concave portion of the primary upper mold chess constituting the primary molding die is imitating the shape of the primary molded product 24 (all are not shown). In the cavity concave portion of the primary upper mold chess, a hemispherical hollow portion corresponding to the lens portion 27 of the primary molded product 24 and a concave portion which is a step formed on the outer peripheral edge of the hollow portion are imitated as steps. A small space is formed.

  As shown in FIG. 6B, in the state where the mold is clamped by the secondary molding die, the primary molded product 24 placed on the upper surface of the lower mold cavity block 33 in the secondary lower mold chess 32 is a secondary mold. The upper die ches 29 is located opposite to the cavity recess 30 of the upper die cavity block 34.

  The lens part 27 of the primary molded product 24 is covered with a recess 35 of the cavity recess 30. Further, the convex portion 28 of the primary molded product 24 abuts on the concave portion 31 of the cavity concave portion 30 (see the lower diagram in FIG. 6B). Further, the outer peripheral surface of the main body portion 26 of the primary molded product 24 is covered with a resin molding portion 36 of the cavity recess 30. The resin molding part 36 is connected to a resin passage 37 communicating with a pot and a cull part (both not shown) (see the lower figure in FIG. 6B). The molten epoxy resin is filled in the resin molding portion 36 of the cavity recess 30 through the resin passage 37.

  When the epoxy resin is filled, the molten resin material fills the resin molding portion 36, but the concave portion 31 of the cavity concave portion 30 comes into contact with the convex portion 31 of the primary molded product 24, and the lens portion 27. Infiltration of the resin material into the can be suppressed. Further, when the secondary molding die is clamped, it is possible to further suppress the intrusion of the resin material into the lens portion 27 by applying a certain pressure at the position of the convex portion 31 of the primary molded product 24. . At this time, since the pressure at the time of mold clamping is applied not to the lens portion 27 but to the convex portion 31 located on the outer peripheral edge thereof, the occurrence of distortion in the lens portion 27 can be suppressed.

  As shown in FIG. 6C, a resin molded product 38 in which the primary molded product 24 is sealed with an epoxy resin has a support member 39 molded with an epoxy resin on the outer peripheral surface of the primary molded product 24. Further, the lens portion 27 becomes an exposed portion 40 exposed to the outside without being covered by the support member 39.

  In the primary molded product 24 and the secondary molding die described above, when the secondary molding die is clamped, the hollow portion 35 and the concave portion 31 of the cavity concave portion 30 in the secondary upper die chess 29 are replaced with the lens of the primary molded product 24. It will be in the state which covered the convex part 28 of the part 27 and its outer periphery. Thereby, in the resin molded product 38 after the secondary molding, the lens portion 27 is exposed to the outside, and the epoxy resin does not adhere to the lens portion 27.

Subsequently, still another embodiment of the secondary molding die will be described.
A cavity recess 45 in the cavity block 44 of the secondary upper chess shown in FIG. 7A has a recess 46 and a protrusion 47. The recessed portion 46 has a shape that fits along the outer peripheral surface of the hemispherical lens portion 49 of the primary molded product 48. A cavity recess 51 in the cavity block 50 of the secondary upper chess shown in FIG. 7B has a recess 52 and a recess 53. The recessed portion 52 has a shape that fits along the outer peripheral surface of the hemispherical lens portion 55 of the primary molded product 54.

  The recess 46 and the recess 52 shown in FIGS. 7A and 7B are different from the shape in which a little space is formed above the lens portions 19 and 27 in the recess 17 and the recess 35 described above (FIG. 5 (b) and FIG. 6 (b)), the hemispherical lens portions 49 and 55 have a shape that fits snugly along the hemispherical outer peripheral surface. With respect to the cavity blocks 44 and 50 of the secondary upper chess having the concave portions 46 and 52 having such shapes, the convex portions 47 and the concave portions 53 are brought into contact with the outer peripheral edge portions of the lens portions 49 and 55. Intrusion of the molten resin material 56 into the lens portions 49 and 55 can be suppressed, and a resin molded product in which the lens portions 49 and 55 are exposed is molded.

  Further, as the structure of the secondary molding die, as shown in FIGS. 8A and 8B, the cavity recesses 59 and 60 in the cavity blocks 57 and 58 of the secondary upper mold chess are provided with cushioning protection. A structure in which the film 61 is closely attached can also be adopted. By causing the protective film 61 to follow the outer peripheral surfaces of the primary molded products 62 and 63, it is possible to reduce the influence of pressure on the primary molded products 62 and 63 when the secondary molding dies are aligned. Even in the structure using the protective film 61, the convex portions 66 and the concave portions 67 abut on the outer peripheral edge portions of the lens portions 64 and 65 of the primary molded product, so that the lens portions 64 and 65 are melted to the side. Intrusion of the resin material 68 is suppressed, and a resin molded product in which the lens portions 64 and 65 are exposed is molded.

  9A to 9D, variations of the shape of the convex portion formed in the cavity concave portion in the upper cavity block of the secondary upper chess will be described. The convex portion 18 formed in the cavity concave portion 13 in the upper cavity block of the above-described secondary upper chess 1 shown in FIG. 9A has a flat tip end surface in contact with the primary molded product 8 in cross section. There is a slope from the front end surface to the base side.

  In addition to the shape of the convex portion 18, for example, the convex portion 70 formed in the cavity concave portion 69 has a rounded tip surface, and has a slope from the tip surface to the base side. (See FIG. 9B). Further, the convex portion 72 formed in the cavity concave portion 71 has a shape with a flat tip surface, a slope from the tip surface to the base side, and a shape in which the tip surface and the slope are connected by a smooth curved surface. (See FIG. 9C). Furthermore, the convex part 74 formed in the cavity concave part 73 has a shape with a sharp tip (see FIG. 9D).

  Each of the convex portions 18, 70, 72, and 74 shown in FIGS. 9A to 9D is in contact with the outer peripheral edge portion of each lens portion of the primary molded product, and toward each lens portion side. Intrusion of molten resin material is suppressed. In the primary molded product corresponding to the convex portions 18, 70, 72 and 74, concave portions simulating the shape of each convex portion are formed. Further, in the primary molded product corresponding to the convex portion 74, the periphery of the lens portion is molded flat, the sharp tip of the convex portion 74 is stuck into this flat surface, and the cavity concave portion 73 and the primary molded product abut, It is possible to prevent the material from entering the lens unit side. As described above, various shapes of the convex portions formed in the cavity concave portions in the secondary upper mold chess can be employed.

  Hereinafter, the flow of manufacturing a resin-sealed molded product using the above-described secondary molding die B will be described.

  As shown in FIG. 10A, the primary molded product 8 is conveyed between the secondary upper mold chess 1 and the secondary lower mold chess 2 constituting the secondary molding die B. The primary molded product 8 is formed by sealing a base material with a transparent resin by a primary molding die, and is transported by a substrate transport device (none is shown). The conveyed primary molded product 8 is placed on the upper surface of the lower mold cavity block 5.

  Thereafter, the movable platen 43 described above rises, and with this movement, the secondary lower mold chess 2 fixed to the movable platen 43 and the lower die set 430 rises, and the lower mold of the secondary lower mold chess 2 The cavity block 5 and the upper mold cavity block 10 of the secondary upper mold chess 1 are in a state of being matched with each other.

  At this time, the cavity recess 13 of the upper mold cavity block 10 covers the primary molded product 8, and an internal space (corresponding to the second internal space of the present invention claim) is formed between the lower mold cavity block 5 and the upper mold cavity block 10. It is formed. In the internal space, the hollow portion 17 of the cavity concave portion 13 covers the lens portion 19 of the primary molded product 8. Further, the convex portion 18 of the cavity concave portion 13 abuts on the concave portion 21 of the primary molded product 8.

  While the secondary molding die B is clamped, the thermosetting resin material 75 is extruded by the resin injection device 3 while melting the epoxy resin resin tablet heated in the pot 9 described above. The resin material 75 flows from the pot 9 through the cull portion 12 and the resin passage 14 and fills the cavity recess 13. Then, by holding and curing the melted thermosetting resin 75, the primary molded product 8 is sealed, and a resin molded product 15 shown in FIG. 10C is formed.

  After the resin sealing, the movable platen 43 is lowered, and with this movement, the secondary lower mold chess 2 is lowered, and the upper cavity block 5 of the secondary lower mold chess 2 and the upper upper mold chess 1 are moved upward. The mold cavity block 10 is opened (see the left side of FIG. 10C). The resin molded product 15 has an exposed portion 23 in which the lens portion 19 is exposed to the outside, and a lower die cavity block of the secondary lower die chess 2 by a product conveying device (not shown) in a state where the cull 76 is connected. 5 is conveyed. By the above flow, the secondary molding by the secondary molding die B is completed, and the resin molded product 15 is molded.

As described above, the resin-sealing mold according to the present invention can be applied to the exposed portion without excessive pressure applied to the primary molded product with respect to the resin molded product in which the exposed portion is formed using the two-color molding technique. The resin material can be molded while suppressing the leakage of the resin material.
Further, the primary molding die according to the present invention is a resin molded product in which an exposed portion is formed using a two-color molding technique, and the resin material leaks to the exposed portion without exerting excessive pressure on the primary molded product. This makes it possible to mold resin molded products.
Further, the secondary molding die according to the present invention is a resin molded product in which the exposed portion is formed using the two-color molding technique, and the resin material to the exposed portion is not exerted on the primary molded product without excessive pressure. The resin molded product can be molded while suppressing leakage.
Furthermore, the method for producing a resin molded product according to the present invention is a resin material in which an exposed portion is formed using a two-color molding technique, without applying excessive pressure to the primary molded product. It is possible to mold a resin molded product by suppressing leakage of the resin.

1 Secondary upper mold chess 2 Secondary lower mold chess 3 Resin injection device 4 Clamping device (press device)
5 Lower mold cavity block 6 Pot block 7 Substrate 8 Primary molded product 9 Pot 10 Upper mold cavity block 11 Cull block 12 Cull part 13 Cavity recessed part 14 Resin passage 15 Resin molded part 16 Resin molded part 17 Recessed part 18 Convex part 19 Lens part DESCRIPTION OF SYMBOLS 20 Main body part 21 Recessed part 22 Support member 23 Exposed part 24 Primary molded product 25 Substrate 26 Main body part 27 Lens part 28 Convex part 29 Secondary upper type chess 30 Cavity concave part 31 Recessed part 32 Secondary lower type chess 33 Lower type cavity block 34 Upper mold cavity block 35 Recessed portion 36 Resin molded portion 37 Resin passage 38 Resin molded product 39 Support member 40 Exposed portion 41 Tie bar 42 Fixed platen 43 Movable platen 44 Upper mold cavity block 45 Cavity recessed portion 46 Recessed portion 47 Convex portion 48 Primary molding Goods 49 Lens part 50 Upper mold cavity block 51 Cavity concave part 52 Cavity part 53 Cavity part 54 Primary molded product 55 Lens part 56 Resin material 57 Upper mold cavity block 58 Upper mold cavity block 59 Cavity concave part 60 Cavity concave part 61 Protective film 62 Primary molded product 63 Primary molding 64 Lens part 65 Lens part 66 Convex part 67 Concave part 68 Resin material 69 Cavity concave part 70 Convex part 71 Cavity concave part 72 Convex part 73 Cavity concave part 74 Convex part 75 Resin material 76 Cal 420 Upper die set 430 Lower mold Die set

Claims (6)

A primary molding die for filling a first internal space formed by a pair of molds with a light-transmitting molding material and resin-sealing the substrate with electronic components;
The primary space is formed by filling a second internal space formed by another pair of molds with a thermosetting molding material and exposing a part of the primary molded product molded by the primary mold. A mold for resin sealing composed of a secondary molding mold for resin-sealing a molded product,
The primary mold is
A first mold for placing the substrate with electronic components;
In the first internal space formed together with the first mold, a second mold that forms a recess that forms an exposed portion and a small space that imitates a step formed at the periphery of the recess. Prepared,
The secondary mold is
A third mold for placing the primary molded product;
A fourth forming the second internal space together with the third mold in a state of covering the exposed portion and the portion formed by the step, which is imitated by the small space, in the primary molded product. A mold, and
Resin sealing mold. The fourth mold is
2. The resin sealing gold according to claim 1, wherein a contact portion that is in contact with a portion formed by the step, which is imitated by the small space, is modeled in the second internal space. Type. The second mold is
A dent shape arranged at the periphery of the dent is formed as the step,
The fourth mold is
The second internal space is formed in a state of covering the exposed portion formed by the depression and the convex portion formed by the depression shape in the primary molded product. Mold for resin sealing. In the subsequent process, the second internal mold is formed by filling the first internal space formed by a pair of molds with a light-transmitting molding material and resin-sealing the substrate with electronic components. A primary molding die that molds a primary molded product that is filled with a thermosetting molding material into a second internal space formed by a pair of molds and is resin-sealed so as to expose a part thereof. There,
A first mold for placing the substrate with electronic components;
In the first internal space formed together with the first mold, a second mold that forms a recess that forms an exposed portion and a small space that imitates a step formed at the periphery of the recess. Equipped with a primary mold. A primary molded product obtained by filling a first internal space formed by a pair of molds with a light-transmitting molding material and resin-sealing the substrate with electronic components is replaced with another pair of molds. A secondary molding die that is filled with a thermosetting molding material in a second internal space formed by a mold and resin-sealed so as to expose a part thereof,
A third mold for placing the primary molded product, which is molded with the primary molding die and has a lens part exposed to the outside and a convex part or a concave part arranged at the periphery of the lens part;
A fourth mold that forms the second internal space together with the third mold in a state of covering the lens part and the convex part or the concave part of the primary molded product,
A secondary molding die that suppresses intrusion of resin into the lens portion by contacting the convex portion or the concave portion of the primary molded product. A primary molded product having a lens part exposed to the outside by filling a light-transmitting molding material in a first internal space of a primary molding die, and a convex part or a concave part arranged around the lens part. A primary molding process for molding
The convex portion or the concave portion of the primary molded product is brought into contact with the concave portion or the convex portion provided in the second internal space of the secondary molding die, and the penetration of the molding material into the lens portion is suppressed. And a secondary molding step of filling the second internal space with a thermosetting molding material. A method for producing a resin molded product.

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