KR20100028135A - Light emitting diode and apparatus for lens molding of light emitting diode - Google Patents

Light emitting diode and apparatus for lens molding of light emitting diode Download PDF

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Publication number
KR20100028135A
KR20100028135A KR1020080081215A KR20080081215A KR20100028135A KR 20100028135 A KR20100028135 A KR 20100028135A KR 1020080081215 A KR1020080081215 A KR 1020080081215A KR 20080081215 A KR20080081215 A KR 20080081215A KR 20100028135 A KR20100028135 A KR 20100028135A
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KR
South Korea
Prior art keywords
molding
lens
mold
light emitting
emitting diode
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Application number
KR1020080081215A
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Korean (ko)
Inventor
김경태
Original Assignee
삼성전기주식회사
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Publication date
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Priority to KR1020080081215A priority Critical patent/KR20100028135A/en
Publication of KR20100028135A publication Critical patent/KR20100028135A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting diode and a lens molding apparatus thereof, comprising: an upper molding mold on which a substrate on which an LED chip is mounted is mounted; Injected with the upper molding mold, the injection hole for injecting molding resin through a plunger, a runner connected to the injection hole to move the molding resin, connected to the runner and corresponding to the LED chip A lower molding mold having a lens-shaped cavity and an air vent for discharging gas generated when the molding resin is cured; And a molding plate formed between the substrate and the lower molding mold and covering the substrate surface and opening the cavity. The lens molding apparatus of claim 1, further comprising a light emitting diode.

Description

Light emitting diode and apparatus for lens molding of light emitting diode

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode and a lens molding apparatus thereof, and more particularly, to a light emitting device including a lens in which a gate portion is formed at an outer portion of the lens, and an air vent is formed at a position facing the gate portion or at a predetermined angle. A diode and a lens molding apparatus thereof.

A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors of light by forming a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, and InGaInP.

In recent years, thanks to the rapid development of semiconductor technology, LED devices have moved away from general-purpose products with low brightness, enabling production of high-brightness and high-quality products. In addition, as the implementation of high-performance blue and white LEDs becomes a reality, the application value of LEDs is being extended to displays and next-generation lighting sources.

Products of LED for backlight unit and LED for lighting need lens of light emitting part, and this lens protects light emitting chip and electrode by enlarging and packaging while transmitting light. Done.

As the resin used in the molding of the lens, a thermosetting resin, an epoxy or a silicone resin is used. Conventional lens molding methods using resins include lens attach, injection molding, compression molding, and the like.

However, the lens attach method can obtain a lens having excellent light transmittance by combining the molded lens on the encapsulant, but has a disadvantage in that the resin has a high loss rate and a high production cost.

In addition, the injection molding method has an advantage of reducing the resin loss rate by injecting a resin into a lens-shaped mold and curing the lens to form a lens, but has a disadvantage in that bubbles are generated in the resin and productivity is reduced.

In addition, in the compression molding method, resin is injected into a lower mold in which a lens shape is processed, and then a substrate is mounted with LEDs, and then cured to form a lens, thereby reducing the loss rate of the resin. If formed together and the package size is large, there is a disadvantage in that the productivity is lowered due to the lack of integration.

That is, in the lens molding using a resin, the conventional lens attach method and injection molding method have limitations in productivity and yield, and therefore, development of a new lens molding method is required.

Accordingly, the present invention has been made to solve the above problems, an object of the present invention is to prevent the occurrence of bubbles in the molding resin and to prevent the occurrence of defects due to the unfilled molding resin to improve the quality and productivity of the lens A light emitting diode and a lens molding apparatus thereof are provided.

In order to achieve the above object, there is provided a lens molding apparatus for a light emitting diode according to an embodiment of the present invention, including: an upper molding mold on which a substrate on which an LED chip is mounted is mounted; Injected with the upper molding mold, the injection hole for injecting molding resin through a plunger, a runner connected to the injection hole to move the molding resin, connected to the runner and corresponding to the LED chip A lower molding mold having a lens-shaped cavity and an air vent for discharging gas generated when the molding resin is cured; And a molding plate formed between the substrate and the lower molding mold and covering the substrate surface and opening the cavity.

In addition, a dummy groove may be processed between the air vent and the cavity of the lower molding mold.

In addition, the LED chip may be mounted inside a mold part in which a molding resin filling space is formed, and a spacer may be formed between the substrate and the molding plate outside the mold part.

In addition, the spacer may be formed to the same thickness as the mold portion.

In addition, the molding resin may be made of a thermosetting resin.

In addition, the air vent may be formed at a position opposite to the injection hole or at a predetermined angle with the injection hole.

In addition, a light emitting diode according to an embodiment of the present invention for achieving the above object, the substrate, the mold portion is fixed to the substrate, the LED chip mounting space is provided on the inside, and the mounting on the substrate inside the mold portion The lens may be formed on the LED chip and the mold part, and a gate part may be formed at an outer part thereof, and an air vent may be formed at a position facing the gate part or at a predetermined angle with the gate part.

Here, an air vent may be formed on an upper surface of the mold part at a position facing the gate part of the lens or at a predetermined angle with the gate part.

As described above, according to the light emitting diode and the lens molding apparatus thereof according to the present invention, the lens-shaped cavity at the position corresponding to the LED chip, the runner for the movement of the molding resin, and occurs during curing of the molding resin By forming a lens by injecting a molding resin using a plunger into a molding mold in which an air vent for discharging gas and the like and a dummy groove for preventing unfilling of the molding resin are formed, bubbles are generated in the molding resin. It is possible to prevent defects due to unfilling of the molding resin, thereby obtaining a lens having a dense structure.

Therefore, the present invention has the effect of improving the quality and productivity of the lens.

Matters relating to the operational effects including the technical configuration for the above object of the light emitting diode and the lens molding apparatus thereof according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

1 is a cross-sectional view showing a lens molding apparatus of a light emitting diode according to an embodiment of the present invention, Figure 2 is a partially enlarged perspective view showing a light emitting diode manufactured by a lens molding apparatus of a light emitting diode according to an embodiment of the present invention.

First, the lens molding apparatus of the LED according to the embodiment of the present invention, as shown in Figure 1, the upper molding mold 100 and the lower molding mold 200 fastened to the lower of the upper molding mold 100 It includes.

The upper molding mold 100 is mounted with a substrate 5 such as a lead frame type.

On the board | substrate 5, the LED chip 1 is mounted by the wire 3 bonding system etc.

In the lower molding mold 200, an injection hole 210 for injecting the molding resin 10 through a plunger 300, and connected to the injection hole 210 to move the molding resin 10. A lenticular cavity 230 is formed at a position connected to the runner 220 and the runner 220 and corresponding to the LED chip 1.

The molding resin 10 may be made of a thermosetting resin such as a silicone resin.

The cavity 230 may be formed in a curved shape as shown in the drawing, or may be formed in various shapes, including a non-curved shape, for example, a cross-sectional shape such as a square or a trapezoid. That is, the cavity 230 may be variously processed according to a desired lens shape.

In addition, the lower molding mold 200 is provided with an air vent 240 for discharging gas or air, which may be generated when the molding resin 10 is cured. The air vent 240 may be formed at a position opposite to the injection hole 210 or at a predetermined angle with the injection hole 210.

In addition, a dummy groove 250 may be processed between the air vent 240 and the cavity 230 of the lower molding mold 200 to prevent the filling of the molding resin 10 from filling. have.

Between the substrate 5 and the lower molding mold 200, a molding plate 400 covering the surface of the substrate 5 and opening the cavity 230 is formed.

The molding plate 400 is for preventing the molding resin 10 from sticking to the substrate 5 other than the portion where the lens of the LED chip 1 is to be formed.

Meanwhile, the LED chip 1 may be mounted inside the mold part 7 in which a molding resin filling space (not shown) is formed. In addition, a spacer 500 may be formed between the substrate 5 on the outside of the mold part 7 and the molding plate 400.

Since the spacer 500 is to eliminate the step between the substrate 5 and the molding plate 400 due to the formation of the mold part 7, the spacer part 500 may be formed on the upper part of the substrate 5. It is preferred to be formed with the same thickness. In this case, the spacer 500 may not be formed depending on the shape of the substrate 5.

The molding plate 400, the spacer 500, and the substrate 5 may be fastened by a reference pin (not shown) or a reference surface of the lower molding mold 200.

The molding method of the lens using the lens molding equipment of the light emitting diode according to the embodiment of the present invention as described above is as follows.

First, in the injection hole 210 of the lower molding mold 200 in which the injection hole 210, the runner 220, the cavity 230, the dummy groove 250, the air vent 240, and the like of the molding resin 10 are formed. After the molding resin 10 is injected, the molding plate 400, the spacer 500, and the substrate 5 on which the LED chip 1 is mounted are sequentially mounted.

Then, the upper molding mold 100 is fastened to the lower molding mold 200. The upper molding mold 100 presses the substrate 5 so that the molding resin 10 does not leak.

Here, the injection process of the molding resin 10 may be performed after fastening the molding plate 400, the substrate 5 and the upper molding mold 100 on the lower molding mold 200.

After the upper and lower molding molds 100 and 200 are fastened and the plunger 300 is moved to push the molding resin 10, the molding resin 10 is pushed out while filling the processed moving passage, that is, the runner 220. When the molding resin 10 fills the lens-shaped cavity 230 and the runner 220, the plunger 300 is stopped.

At this time, in the embodiment of the present invention, since the dummy groove 250 is formed in a portion adjacent to the air vent 240, in the process of pushing the molding resin 10 by using the plunger 300, Since the plunger 300 may be stopped after the molding resin 10 is filled up to the dummy groove 250, there is no fear that the molding resin 10 may not be filled in the cavity 230. Therefore, there is an advantage in that defects caused by unfilling of the molding resin 10 in the cavity 230 can be prevented and a lens having a dense structure can be obtained.

In this case, the upper and lower molding molds 100 and 200 maintain a constant temperature by a heater, and the molding resin 10 is cured as a predetermined time passes by heat.

According to the exemplary embodiment of the present invention, the gas or air generated in the process of curing the molding resin 10 may be discharged to the outside through the air vent 240 to prevent the occurrence of bubbles in the molding resin 10. You can stop it.

After curing of the molding resin 10 is completed, the upper and lower molding molds (100, 200) are separated from each other, the substrate 5, the spacer 500 and the molding plate 400 is separated from the lower molding mold (200) Then, as illustrated in FIG. 2, the processing of the lens L of the light emitting diode is completed.

The light emitting diode having the lens L obtained as described above may be used as it is as a light emitting diode array or may be used as an individual module through a dicing process.

3A is a plan view illustrating a light emitting diode according to an exemplary embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along the line II ′ of FIG. 3A.

In the light emitting diode according to the embodiment of the present invention, as illustrated in FIGS. 3A and 3B, a mold part in which a substrate 5 and the substrate 5 are fixed, and an LED chip 1 mounting space is provided inside the substrate 5. (7), an LED chip (1) mounted on the substrate (5) inside the mold portion (7) and a lens (L) formed on the mold portion (7).

The lens L may be made of a thermosetting resin such as a silicone resin.

Although not shown in the drawing, a thermosetting resin such as a silicone resin may be filled in the inner space of the mold 7 under the lens L.

The outer portion of the lens L is integrally formed with a gate portion 10a having a predetermined width and thickness. The gate part 10a is formed by filling a molding resin 10 between a runner 22, which is a resin moving passage of the lower molding mold 200, and a cavity 230 having a lens L shape.

The gate portion 10a is preferably formed so as not to cross the upper edge of the mold portion 7. This is because when the gate part 10a is formed to extend beyond the upper edge of the mold part 7, foreign material defects may occur when the gate part 10a is broken during SMT pickup of the LED.

An air vent 10b may be formed at a position facing the gate portion 10a of the lens L or at a predetermined angle with the gate portion 10a. The air vent 10b may discharge the air inside the lens L to the outside.

In addition, although not shown in the drawing, the air vent 10b may be formed on the upper surface of the mold part 7 in contact with the lens L to more smoothly discharge the air inside the lens L. . The air vent 10b formed on the upper surface of the mold portion 7 may also be formed at a position facing the gate portion 10a of the lens L or at a position at a predetermined angle with the gate portion 10a. Can be.

According to the embodiment of the present invention as described above, it is possible to obtain a productivity improvement effect of about five times as compared to the conventional injection molding method, and to form the cavity 230, etc. for forming the lens L as desired number There is an advantage that can maximize the effect of improving the productivity.

In addition, by molding the lens L directly on the LED chip 1 using the molding resin 10, the lens L may be formed in an accurate shape, and the molding resin is controlled by adjusting the pressure of the plunger 300. (10) The air contained in the interior is allowed to escape through the air vent 240 to obtain a lens (L) having no bubbles and a dense structure.

In addition, the molding resin 10 may be filled to the periphery of the electrode (not shown) of the LED chip 1 and the substrate 5 on which the LED chip 1 is mounted, thereby improving the adhesion of the molding resin 10. There is an advantage to increase.

Therefore, according to this embodiment, there is an effect that can improve the quality and productivity of the light emitting diode lens (L).

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is a cross-sectional view showing a lens molding apparatus of a light emitting diode according to an embodiment of the present invention.

2 is a partially enlarged perspective view illustrating a light emitting diode manufactured by a lens molding apparatus of a light emitting diode according to an exemplary embodiment of the present invention.

3A is a plan view showing a light emitting diode according to an embodiment of the present invention.

3B is a cross-sectional view taken along the line II ′ of FIG. 3A;

<Explanation of symbols for the main parts of the drawings>

1: LED chip 3: wire

5: substrate 7: mold part

10: molding resin 100: upper molding mold

200: lower molding mold 210: injection hole

220: runner 230: cavity

240: air vent 250: dummy groove

300: plunger 400: molding plate

500: spacer L: lens

10a: gate portion 10b: air vent

Claims (8)

An upper molding mold on which a substrate on which an LED chip is mounted is mounted; Injected with the upper molding mold, the injection hole for injecting molding resin through a plunger, a runner connected to the injection hole to move the molding resin, connected to the runner and corresponding to the LED chip A lower molding mold having a lens-shaped cavity and an air vent for discharging gas generated when the molding resin is cured; And A molding plate formed between the substrate and the lower molding mold to cover the substrate surface and to open the cavity; Lens molding device of a light emitting diode comprising a. The method of claim 1, A lens molding apparatus for a light emitting diode in which a dummy groove is processed between the air vent of the lower molding mold and the cavity. The method of claim 1, The LED chip is a lens molding apparatus of a light emitting diode mounted on the inside of the mold portion formed with a molding resin filling space, a spacer is formed between the substrate and the molding plate outside the mold portion. The method of claim 3, The spacer is a lens molding apparatus of a light emitting diode formed to the same thickness as the mold portion. The method of claim 1, The molding resin is a lens molding apparatus of a light emitting diode made of a thermosetting resin. The method of claim 1, And the air vent is formed at a position facing the injection hole or at a predetermined angle with the injection hole. Board; A mold unit fixing the substrate and having an LED chip mounting space provided therein; An LED chip mounted on the substrate inside the mold; And A lens formed on the mold portion, a gate portion formed on an outer portion thereof, and an air vent formed at a position facing the gate portion or at a predetermined angle with the gate portion; Light emitting diode comprising a. The method of claim 7, wherein And an air vent formed on an upper surface of the mold portion at a position facing the gate portion of the lens or at a predetermined angle with the gate portion.
KR1020080081215A 2008-08-20 2008-08-20 Light emitting diode and apparatus for lens molding of light emitting diode KR20100028135A (en)

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KR1020080081215A KR20100028135A (en) 2008-08-20 2008-08-20 Light emitting diode and apparatus for lens molding of light emitting diode

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Application Number Priority Date Filing Date Title
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100963110B1 (en) * 2010-02-24 2010-06-15 우리마이크론(주) Compression type molding device
KR101237191B1 (en) * 2011-04-20 2013-02-25 이상근 A LED emission type ornament and manufacture method of LED emission type ornament
CN104253188A (en) * 2013-06-27 2014-12-31 展晶科技(深圳)有限公司 Manufacturing method of light emitting diode element
CN113921681A (en) * 2020-07-10 2022-01-11 广州市鸿利显示电子有限公司 Mini LED pressing die, preparation method and Mini LED assembly
CN115377271A (en) * 2022-09-02 2022-11-22 盐城东山精密制造有限公司 Novel Mini-COB packaging structure and method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100963110B1 (en) * 2010-02-24 2010-06-15 우리마이크론(주) Compression type molding device
KR101237191B1 (en) * 2011-04-20 2013-02-25 이상근 A LED emission type ornament and manufacture method of LED emission type ornament
CN104253188A (en) * 2013-06-27 2014-12-31 展晶科技(深圳)有限公司 Manufacturing method of light emitting diode element
CN113921681A (en) * 2020-07-10 2022-01-11 广州市鸿利显示电子有限公司 Mini LED pressing die, preparation method and Mini LED assembly
CN115377271A (en) * 2022-09-02 2022-11-22 盐城东山精密制造有限公司 Novel Mini-COB packaging structure and method

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