JP5873678B2 - LED package substrate manufacturing method and LED package manufacturing method - Google Patents

Description

  The present invention relates to an LED package substrate obtained by molding a resin in a lead frame and a method for manufacturing the LED package substrate.

  Conventionally, in LED package molding using an LED package substrate obtained by molding a resin on a lead frame, a lens portion for an LED package is formed by transfer molding a lens resin. However, when the lens portion is formed by transfer molding, the resin molded on the parts such as the cull and the runner is wasted, which causes an increase in the manufacturing cost of the LED package.

  On the other hand, Patent Document 1 discloses a method of manufacturing a lens portion by compression molding a resin. Manufacturing cost can be reduced by molding resin by compression molding instead of transfer molding.

JP 2010-125647 A

  However, in the compression molding method disclosed in Patent Document 1, the resin is supplied to the heated lower mold. For this reason, it is difficult to control the viscosity of the resin, and it is necessary to use a resin having a long gel time (a time until the viscosity of the liquid resin increases to gel). For this reason, the resin used as the lens portion must be selected from limited resins that satisfy the above conditions, and the manufacturing cost cannot be reduced sufficiently.

  Therefore, the present invention provides an LED package substrate that can be manufactured at low cost, an LED package, an LED package substrate manufacturing method, and an LED package manufacturing method.

An LED package substrate manufacturing method according to an aspect of the present invention is an LED package substrate manufacturing method used for manufacturing a plurality of LED packages, and the LED chips included in each of the plurality of LED packages. Processing the lead frame to include a die pad for electrical connection to the first electrode of the LED and a lead for electrical connection to the second electrode of the LED chip; and by one transfer molding Resin is filled in a hole between the die pad and the lead, and the resin is used to form an annular ring outside the region corresponding to the plurality of LED packages at the end on the surface of the lead frame. Forming a dam part.

An LED package manufacturing method according to another aspect of the present invention is an LED package manufacturing method, a die pad for electrical connection to a first electrode of an LED chip included in each of a plurality of LED packages, and A step of processing the lead frame so as to have a lead for electrical connection to the second electrode of the LED chip; and filling the hole between the die pad and the lead by a single transfer molding And forming an annular dam portion on the outside of the region corresponding to the plurality of LED packages on the surface of the lead frame using the resin, and a plurality of LED chip mounting regions The step of mounting the LED chip on each, and before carrying the lead frame mounted with the LED chip into the mold Supplying the lens resin inside the annular dam, sealing the LED chip by compression molding the lens resin, and lead with the LED chip sealed with the lens resin Cutting the frame.

An LED package manufacturing method according to another aspect of the present invention is an LED package manufacturing method, a die pad for electrical connection to a first electrode of an LED chip included in each of a plurality of LED packages, and A step of processing the lead frame so as to have a lead for electrical connection to the second electrode of the LED chip; and filling the hole between the die pad and the lead by a single transfer molding And forming an annular dam portion on the outside of the region corresponding to the plurality of LED packages on the surface of the lead frame using the resin, and a plurality of LED chip mounting regions A step of mounting the LED chip on each of them, and a lens resin is supplied to the inside of the annular dam portion by transfer molding. And sealing the LED chip, and cutting the lead frame in a state where the LED chip is sealed with the lens resin.

  Other objects and features of the present invention are illustrated in the following examples.

  According to the present invention, it is possible to provide an LED package substrate that can be manufactured at low cost, an LED package, an LED package substrate manufacturing method, and an LED package manufacturing method.

FIG. 3 is a configuration diagram of a lead frame in Example 1, (a) a plan view, and (b) a cross-sectional view. It is a schematic sectional drawing of the metal mold | die used for the primary shaping | molding in Example 1, (a) Before resin sealing, (b) It is the state after resin sealing. It is a block diagram of the board | substrate for LED packages after the primary shaping | molding in Example 1, (a) Top view, (b) It is sectional drawing. It is sectional drawing of the board | substrate for LED packages after the chip mounting in Example 1, (a) The state before supply of secondary molding resin, (b) The state after supply of secondary molding resin. It is a schematic sectional drawing of the metal mold | die used for the secondary shaping | molding in Example 1, (a) Before resin sealing, (b) It is the state after resin sealing. 3 is a cross-sectional view of the LED package substrate after secondary molding in Example 1. FIG. It is a block diagram of the board | substrate for LED packages after the primary shaping | molding in Example 2, (a) Top view, (b) It is sectional drawing. It is a modification of the board | substrate for LED packages in Example 2, (a) Sectional drawing in case the resin for reflectors is not provided, (b) Sectional drawing in case the projection part is provided in the back surface.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same members are denoted by the same reference numerals, and redundant description is omitted.

  First, with reference to FIG. 1 thru | or FIG. 6, the board | substrate for LED packages in Example 1 of this invention and its manufacturing method are demonstrated. FIG. 1 is a configuration diagram of a lead frame in the present embodiment, FIG. 1 (a) is a plan view, and FIG. 1 (b) is a cross-sectional view cut along a BB plane in FIG. 1 (a). The LED package substrate of the present embodiment is used to manufacture an LED package as a final product, and is configured to mount or mount a plurality of LED chips on a resin-molded lead frame. .

  The lead frame 10 is configured, for example, by forming a plating layer (for example, Ni-Ag plating) made of nickel, palladium, silver, gold, or the like on the surface of a copper-based frame material. The plate thickness of the lead frame 10 is, for example, 0.5 mm, and a lead frame having a plate thickness of about 0.2 mm or 0.3 mm may be used. As will be described later, a plurality of LED chips are mounted on the lead frame 10 after sealing the resin for the reflector, and a dicing (separation) process for cutting the lead frame 10 after sealing the resin for the lens is performed. Thus, a plurality of LED packages as final products are completed.

  The lead frame 10 includes a die pad 12 (base-side lead) configured (processed) so as to be electrically connected to a first electrode (anode electrode) of an LED chip described later. Further, the lead frame 10 includes a lead 13 (terminal side lead) configured (processed) so as to be electrically connected to a second electrode (cathode electrode) different from the first electrode of the LED chip. The LED chip is mounted on the die pad 12. A perforation hole 16 is provided around the die pad 12 and the lead 13 (between the die pad 12 and the lead 13), and the die pad 12 and the lead 13 are separated from each other after being separated into individual pieces. In the present embodiment, the pad portion 14 is constituted by the die pad 12 and the lead 13. Note that the present embodiment is not limited to this, and conversely to the above configuration, the cathode electrode of the LED chip may be connected to the die pad 12 and the anode electrode may be connected to the lead 13. . Further, a protective element such as a Zener diode may be connected to these in parallel.

  As shown in FIG. 1A, the lead frame 10 of this embodiment is composed of a plurality of pad portions 14 (unit elements 150), and within the range of the lead frame 10 shown in FIG. , LED packages of a plurality of rows and a plurality of columns (a total of 25 vertical and 5 horizontal) are manufactured.

  Next, a mold used when the lead frame 10 in this embodiment is resin-sealed with a primary molding resin will be described. FIG. 2 is a schematic cross-sectional view of a mold used for primary molding in the present embodiment, and shows a state in which a lead frame is clamped by the mold. FIG. 2A shows a state before resin sealing, and FIG. 2B shows a state after resin sealing. In the present embodiment, the same structure is also arranged on the left side of the alternate long and short dash line 160 in FIG. 2, so that the resin sealing for the two lead frames 10 is performed by one molding.

  As shown in FIGS. 2A and 2B, in this embodiment, the mold (transfer molding mold) used in the primary molding is an upper mold 50 (one mold) and a lower mold 60 ( The other mold) is provided. The upper mold 50 is provided with a plurality of convex portions 51 provided at the same interval as the pad portion 14 (see FIG. 1A). Each of the convex portions 51 has the same height as the lower surface (parting surface) of the upper mold 50 by being arranged and projected in a matrix in a rectangular cavity 57 (concave portion). A rectangular annular cavity 58 that is higher (deeper) than the height (depth) of the cavities 57 is provided around the cavities 57 arranged in the peripheral region (end). ing. Between the cavity 57 and the cavity 58, through gates 52 (concave portions) are formed in front of the convex portion 51 on the two sides of the gate side and the air vent side, and the resin 71 may flow between them. It is configured to be able to. With such a configuration, the upper mold 50 determines the shape of the resin 71 (primary molding resin) to be filled in the lead frame 10.

  The resin 57 (resins 71a, 71b, 71c, 71d) is filled into the cavities 57, 58, the through hole 16, and the through gate 52 of the upper mold 50 by performing resin sealing by transfer molding. Is done. The resin 71a filled in the cavity 57 has a function as a reflector that reflects light from an LED chip described later. As will be described later, the resin 71b filled in the cavity 58 has a function as a dam portion that stops when a lens resin 76 (lens molding resin having translucency) as a secondary molding resin is molded. The resin 71 c filled in the hole 16 has a function of reliably insulating the die pad 12 and the lead 13. The plurality of convex portions 51 serve as a clamping surface (LED chip mounting region 18) for clamping the pad portion 14 of the lead frame 10.

  A cull 55 and a runner 54 are formed in the upper mold 50, and the runner 54 communicates with a gate 56 formed in the upper mold 50. The upper mold 50 presses the lead frame 10 from the upper surface side (one side) so that the pad portion 14 (the die pad 12 and the lead 13) and the convex portion 51 overlap each other at the time of resin sealing. On the other hand, the lower mold 60 presses the lead frame 10 from the lower surface side (the other side) during resin sealing. As described above, the mold of this embodiment is mainly composed of the upper mold 50 and the lower mold 60. At the time of resin sealing (at the time of resin molding), the lead frame 10 is clamped (sandwiched) between the upper mold 50 and the lower mold 60, and the cavities 57, 58 and the inside of the hole 16 are formed as a primary molding resin. Of resin 71 (71a, 71b, 71c).

  Reference numeral 70 denotes a resin tablet obtained by molding a thermosetting resin or the like into a tablet (column) shape. At the time of resin sealing, as shown in FIG. 2 (a), the pot 63 of the lower mold 60 is preheated, and the resin tablet 70 is put therein to melt. Then, as shown in FIG. 2B, the molten resin 71 is pumped by moving the plunger 64 configured to be slidable up and down along the pot 63 by a transfer mechanism (not shown). The space between the upper mold 50 and the lower mold 60 is filled with the resin 71. Instead of the resin tablet 70, a liquid thermosetting resin can be supplied by a dispenser (not shown). Further, granular, granular or gel resins can be used.

  When the resin 71 is pumped by the plunger 64, the melted resin 71 is supplied to the punch hole 16 and the cavities 57 and 58 through the cull 55, the runner 54, and the gate 56. That is, the resin 71 is sequentially supplied from the hole 16 and the cavities 57 and 58 close to the gate 56 toward the hole 16 and the cavities 57 and 58 far from the gate 56. In this way, the resin tablet 70 is melted to become the resin 71 and is injected into the space formed by the upper mold 50 and the lower mold 60. As a result, as shown in FIG. 2B, the space between the upper mold 50 and the lower mold 60 (specifically, the cavities 57 and 58, the punching hole 16, and the through gate 52) is Filled with resin 71 (resins 71a, 71b, 71c, 71d).

  After the resin 71 is filled, the resin 71 waits for a predetermined time to cure the resin 71, and the upper mold 50 and the lower mold 60 are closed. Then, after the resin molded LED package substrate is carried out, the parting surface of the mold is cleaned, and one resin molding process is completed. After the above steps, the LED package substrate of this embodiment is formed as shown in FIG.

  FIG. 3 is a configuration diagram of the LED package substrate after the primary molding in this example, FIG. 3 (a) is a plan view, and FIG. 3 (b) is cut along the BB plane in FIG. 3 (a). FIG.

  The resin 71 (white resin) as the primary molding resin is a thermosetting resin made of a silicone resin or an epoxy resin containing white powder such as titanium oxide or alumina and silica. As described above, the upper package is integrally formed on the lead frame 10 by pouring and curing the resin 71 by transfer molding. As described above, the LED package substrate in the present embodiment is a map type LED package substrate that is molded together with the resin 71.

  Of the resin 71 (primary molding resin) transferred to the lead frame 10, the resin 71 a formed by the cavity 57 of the upper mold 50 (the surface of the lead frame 10 so as to surround the periphery of the LED chip mounting region 18). The resin 71a) formed above functions as a reflector that reflects light emitted from an LED chip, which will be described later, upward. The resin 71a also has a function of improving the strength of the LED package. However, the resin 71 is clamped by the convex portion 51 of the upper mold 50 so that an LED chip to be described later is mounted in a plurality of regions, and a predetermined region on the lead frame 10 (LED chip mounting region 18). Is not formed. The LED chip mounting area 18 is an area where the surface of the lead frame 10 is exposed after the primary molding. In addition, the transfer hole of the resin 71 is collectively sealed with the resin 71 c by forming the pad portion 14 by transfer molding.

  In this embodiment, the resin 71 is transfer molded to form a dam portion (resin 71b) at the end on the surface of the lead frame 10 so as to surround the reflector (resin 71a) and the LED chip mounting region 18. ing. As will be described later, the dam portion functions as a dam portion that stops when supplying (molding) the lens resin 76 that is a secondary molding resin. As will be described later, the lens resin 76 forms the lens portion 76a by supplying a liquid resin to the inside of the dam portion and performing compression molding using a mold. By providing the dam part, the liquid resin can be stopped inside the dam part. For this reason, it is preferable that the dam part (resin 71b) is molded so as to surround the reflector (resin 71a) or the LED chip mounting region 18. More preferably, the dam part (resin 71b) is formed higher than the reflector (resin 71a).

  In this embodiment, the dam portion (resin 71b) is provided with a reduced diameter portion 72 as shown in FIG. In FIG. 3A, when the resin 71 is molded, the resin 71 flows from the left side (gate side) to the right side (air vent side). At this time, the resin 71 is divided into a cavity 57 for molding the reflector and a cavity 58 for molding the dam part. At this time, since the cavity 58 is formed deeper, the resin 71 flows easily, and a part of the resin 71 that flows inside the mold cavity 58 flows backward into the mold cavity 57, that is, on the right side (air vent side). ) To the left (runner side). When the reverse flow phenomenon of the resin occurs, air stays inside the resin 71a (cavity 57), and voids are easily generated. In the present embodiment, in order to prevent such a phenomenon, it is possible to form the reduced diameter portion 72 that narrows in the width direction in order to increase the flow resistance in a predetermined region of the dam portion. In the present embodiment, among the four sides constituting the dam portion, the reduced diameter portion 72 is provided in the central portion of the upper side and the lower side in FIG. 3A. However, the present invention is not limited to this. It may be provided in this area.

  As shown in FIG. 3A, in this embodiment, a map type LED package substrate in which the reflectors of all LED chip mounting regions 18 in the lead frame 10 are integrally formed of a resin 71a is manufactured. However, the present embodiment is not limited to this, and can also be applied to a matrix type LED package substrate.

  Next, a step of mounting a semiconductor chip (IC chip) on the LED package substrate after the primary molding and a step of supplying a secondary molding resin will be described. 4A and 4B are cross-sectional views of the LED package substrate after the primary molding. FIG. 4A is a state before supplying the lens resin after chip mounting, and FIG. 4B is a state after supplying the lens resin. Each state is shown.

  As shown in FIG. 4A, the LED chip 40 (semiconductor chip) is mounted on the lead frame 10 after the primary molding in the LED chip mounting region 18. The LED chip 40 is mounted on the die pad 12 in the LED chip mounting area 18. The LED chip 40 is an element that includes a pair of electrodes, an anode electrode and a cathode electrode, and emits light by applying a predetermined voltage with a forward bias between these electrodes. The LED chip 40 is mounted on the die pad 12 (first electrode) and is electrically connected to the lead 13 (second electrode) using a bonding wire 42 such as a gold wire.

  Further, as the LED chip 40, a flip chip type chip may be used. In this case, the LED chip is disposed so as to straddle the punched hole 16 filled with the resin 71c, and two electrodes formed on the lower surface of the LED chip are bonded to the die pad 12 and the lead 13, respectively. For this reason, the bonding wire 42 becomes unnecessary.

  After mounting the LED chip 40 on the lead frame 10, as shown in FIG. 4B, the lens as a secondary molding resin before being loaded into a molding die for molding a secondary molding resin described later. Resin 76 (liquid resin) is supplied (dispensed) to an inner region (inside the dam portion) surrounded by the dam portion (resin 71b) of the LED package substrate.

  As the lens resin 76, a translucent silicone resin is used. Silicone resin has durability against discoloration or deterioration due to light or heat when the emission wavelength of LED chip 40 is a short wavelength such as blue light or when the LED chip is a high-brightness LED and generates a large amount of heat. Is excellent. However, the present embodiment is not limited to this, and for example, a thermosetting resin having translucency such as an epoxy resin, a urethane resin, or an acrylic resin may be used. Various additives such as fillers, fluorescent materials and internal mold release agents can be added to these resins.

  The lens resin 76 covers the LED chip 40 and constitutes a lens portion of the LED package by compression molding described later. Since the LED package substrate of this embodiment is provided with a dam portion, a necessary and sufficient amount can be supplied even with a resin having a low viscosity.

  Next, with reference to FIG. 5, the metal mold | die used when resin-sealing the board | substrate for LED packages in a present Example with secondary molding resin (lens resin 76) is demonstrated. FIG. 5 is a schematic cross-sectional view of a mold used for secondary molding (compression molding) in the present embodiment, and shows a state in which the LED package substrate is clamped by the mold. FIG. 5A shows a state before compression molding, and FIG. 5B shows a state after compression molding.

  As shown in FIGS. 5A and 5B, in the present embodiment, the mold used in the secondary molding (compression molding) is an upper mold 80 (one mold) and a lower mold 90. (Other mold) is provided. The upper mold 80 includes a cavity piece 81. The cavity piece 81 is provided with hemispherical concave portions 82 for molding the lens portion of the LED package at the same interval as the pad portion 14. With such a configuration, the upper mold 80 determines the shape of the lens resin 76 as the secondary molding resin.

  When the upper mold 80 and the lower mold 90 are in contact with each other via an O-ring 93, the internal space can be decompressed. The upper mold 80 presses the LED package substrate from the upper surface side (one surface side). The lower mold 90 presses the LED package substrate from the lower surface side (the other surface side). At the time of secondary molding (compression molding), the upper mold 80 clamps the LED package substrate via the release film 95. The lower mold 90 is provided with a vacuum path 96. At the time of clamping, voids are likely to occur in the recess 82 of the upper mold 80. Therefore, the mold according to the present embodiment is configured so that evacuation can be performed via the vacuum path 96 in order to prevent the generation of such voids.

  In this embodiment, a region 98 composed of the release film 95 and the side surface of the dam portion (resin 71b) is formed. During compression molding, the lens resin 76 is prevented from leaking (overflowing) outside the dam due to the presence of the dam. However, since the resin dam portion is clamped, it is not always necessary to prevent leakage to the region 98 in order to prevent damage. Outside the region 98, the lead frame 10 is clamped by the upper mold 80 and the lower mold 90. Thereby, even when such an overflow occurs, the leaked lens resin 76 accumulates in the region 98, thereby preventing the influence of the leaked resin.

  As described above, the mold for molding the secondary molding resin according to the present embodiment is mainly composed of the upper mold 80 and the lower mold 90. At the time of resin sealing (at the time of compression molding), the LED package substrate is clamped (sandwiched) by the upper mold 80 and the lower mold 90, and a lens resin 76 as a secondary molding resin is formed by compression molding.

  FIG. 6 is a cross-sectional view of the LED package substrate after secondary molding (after compression molding of the lens resin 76) in the present embodiment. By compression-molding the lens resin 76 using the mold shown in FIG. 5, the LED chip 40 is sealed with the lens resin 76, and the lens portion 76a of the LED package is formed.

  According to the present embodiment, it is possible to provide an LED package substrate capable of forming a lens portion at low cost by compression molding and a method for manufacturing the same.

  Next, with reference to FIG. 7, the board | substrate for LED packages in Example 2 of this invention is demonstrated. FIG. 7 is a configuration diagram of the LED package substrate after the primary molding in this example, FIG. 7 (a) is a plan view, and FIG. 7 (b) is cut along the BB plane in FIG. 7 (a). Each of the cross-sectional views is shown.

  The LED package substrate of the present embodiment is different from the LED package substrate of Embodiment 1 in that the dam portion surrounding the reflector resin is integrated without being separated from the reflector resin. Even in the configuration of the present embodiment, the dam portion can be formed when the resin for the reflector is formed. In addition, since a lens resin (liquid resin) can be supplied to an LED package substrate without using a mold, an LED package substrate capable of forming a lens portion at low cost by compression molding and a manufacturing method thereof are provided. It is possible.

  Further, the present embodiment is not limited to the configuration shown in FIG. 7, and may be configured as shown in FIGS. 8A and 8B, for example. FIG. 8 is a modification of the LED package substrate in the present embodiment. FIG. 8A is a cross-sectional view when no reflector resin is provided, and FIG. 8B is the back surface of the LED package substrate. Sectional views when protrusions are provided are shown respectively.

  As shown in FIG. 8A, even when the reflector resin is not formed on the LED package substrate, the dam portion (resin 71f) can be formed on the end portion (peripheral portion) of the lead frame 10. In this case, the dam portion (resin 71f) is molded together with the resin 71b filled in the punching hole 16 of the lead frame 10 through a through gate (not shown). In this case, a thin LED package can be formed by directly forming a lens portion as indicated by a broken line in FIG.

  Further, as shown in FIG. 8B, a protrusion (resin 71g) can be formed on the back surface (surface opposite to the LED chip mounting region 18) of the LED package substrate. By forming such a protruding portion (resin 71g) on the back surface of the LED package substrate (for example, a position facing the resin 71b forming the dam portion), warpage of the LED package substrate can be prevented, It becomes possible to facilitate the stacking of the LED package substrates. The protrusion (resin 71g) is molded together with the resins 71a, 71b, 71c. In addition, a projection part is not limited to an annular | circular shape, A dotted | punctate (dot shape) and a rectangular ring may be sufficient.

  According to each said Example, the manufacturing method of the board | substrate for LED packages which can be manufactured at low cost, and a board | substrate for LED packages can be provided.

  The embodiment of the present invention has been specifically described above. However, the present invention is not limited to the matters described as the above-described embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

  For example, a reflector and a dam portion can be formed on the lower surface of the lead frame 10 using a lower mold in which cavities are formed in a mold of a primary molding resin.

  Although the present Example demonstrated the structural example which performs secondary shaping | molding using compression molding, it is not limited to this. Secondary molding is performed by transfer molding using a transfer molding die in which a cavity having a shape (for example, a concave shape as shown in FIG. 5B) that can include a portion molded by the resin 71 is formed. Also good. At this time, it is preferable to perform transfer molding by supplying a part of the lens resin in advance to the inside of the dam part and supplying another part of the lens resin to the pot. According to this method, since the lens resin 76 can be supplied in advance to the inside of the dam part, it is only necessary to supply a small amount of resin for pressurizing the cavity into the pot. For this reason, the number of pots, the size of the pot, and the like can be reduced, and the amount of resin to be discarded in the cal, runner and the like can be reduced. Further, most of the lens resin (for example, 90%) required for molding the lens is supplied in advance to the inside of the dam part and carried into the mold, and the rest (in this case, 10%) is supplied to the pot for pressurization and transfer molded. You can also. As a result, the size for batch molding can be easily increased by reducing the amount supplied to the pot. In this case, the movable part such as the cavity piece 81 can be eliminated so that a release film is not required, and the die structure can be simplified and the running cost can be reduced.

  Further, as indicated by a broken line in FIGS. 3A and 3B, a concave portion 99 that communicates the inside and outside of the region surrounded by the dam portion may be formed on the upper surface of the dam portion. In this case, the lower surface of the recess 99 is formed to be higher than the liquid level of the supplied lens resin 76. According to this, when the secondary molding resin is molded by the compression molding die, the lens resin 76 and the air can be functioned as a through gate that discharges outside the dam portion through the recess 99. In this case, the amount of resin can be adjusted and air can be discharged. Further, when the secondary molding resin is molded by the transfer molding die, the gate side functions as a gate (through gate) for injecting the lens resin 76 into the dam portion through the recess 99. Thereby, for example, as shown in FIG. 3A, the resin flow in the dam portion is made uniform by disposing at the same interval as the through gate 52 (the same interval as the convex portion 51). Therefore, high-quality molding is possible by preventing air traps and the like. On the air vent side, it functions as a through gate that discharges air and the lens resin 76 to the outside of the dam portion through the recess 99.

  As the lens resin 76, a granular resin such as a powder can be used in addition to the liquid resin. For example, in the case of granule resin, it can be piled up in a shape determined by the angle of repose in a stationary state and supplied onto the substrate, but the shape may collapse due to vibration or impact during transportation and jump out to the mold clamping surface. Conceivable. On the other hand, even if it is a granular resin, it can be prevented from popping out by the dam part, so it can be stably molded by preventing contamination in the molding device, increasing the speed of conveyance and improving productivity. Can also be improved.

  In addition, the board | substrate for packages other than an LED package can also be shape | molded by the method similar to the above-mentioned method using a lead frame. In this case, for example, as shown in FIG. 8A, the gap between the lead frames can be filled with the primary molding resin to insulate and improve the strength. Next, after mounting a chip other than an LED (for example, an optical chip such as a light receiving element), a secondary molding resin is supplied into the dam portion, and the chip can be sealed by compression molding or transfer molding. Thereby, even if it is a package other than an LED package, there can exist an effect similar to the Example mentioned above.

DESCRIPTION OF SYMBOLS 10 Lead frame 12 Die pad 13 Lead 14 Pad part 16 Punch hole 18 LED chip mounting area 40 LED chip 50, 80 Upper mold 60, 90 Lower mold 71 Resin 76 Lens resin 93 O-ring 95 Release film

Claims (8)

A method for manufacturing a substrate for an LED package used for manufacturing a plurality of LED packages,
A lead frame having a die pad for electrical connection to the first electrode of the LED chip included in each of the plurality of LED packages, and a lead for electrical connection to the second electrode of the LED chip Processing steps,
Resin is filled in the hole between the die pad and the lead by one transfer molding, and the resin is used to correspond to the plurality of LED packages at the end on the surface of the lead frame. Forming an annular dam portion outside the region, and a method for manufacturing a substrate for an LED package. The resin molds a reflector on the surface of the lead frame so as to surround the LED chip,
The method for manufacturing a substrate for an LED package according to claim 1, wherein the dam portion is formed higher than the reflector so as to surround the reflector. The LED package substrate does not have a reflector that reflects light from the LED chip,
2. The method for manufacturing a substrate for an LED package according to claim 1, wherein the dam portion is configured to block a lens resin that seals the LED chip. The said dam part is shape | molded only in the outer side of the area | region corresponding to the said LED package, The manufacturing method of the board | substrate for LED packages of any one of Claim 1 thru | or 3 characterized by the above-mentioned. The said dam part has a recessed part which connects the inside and outside of this dam part, The manufacturing method of the board | substrate for LED packages of any one of Claim 1 thru | or 4 characterized by the above-mentioned . An LED package manufacturing method comprising:
A lead frame having a die pad for electrical connection to the first electrode of the LED chip included in each of the plurality of LED packages, and a lead for electrical connection to the second electrode of the LED chip Processing steps;
Resin is filled in the hole between the die pad and the lead by one transfer molding, and the resin is used to correspond to the plurality of LED packages at the end on the surface of the lead frame. Forming an annular dam on the outside of the region;
Mounting the LED chip in each of a plurality of LED chip mounting regions;
Supplying lens resin to the inside of the annular dam part before carrying the lead frame mounted with the LED chip into a mold;
Sealing the LED chip by compression molding the lens resin;
Cutting the lead frame in a state where the LED chip is sealed with the lens resin;
A method for manufacturing an LED package, comprising: An LED package manufacturing method comprising:
A lead frame having a die pad for electrical connection to the first electrode of the LED chip included in each of the plurality of LED packages, and a lead for electrical connection to the second electrode of the LED chip Processing steps;
Resin is filled in the hole between the die pad and the lead by one transfer molding, and the resin is used to correspond to the plurality of LED packages at the end on the surface of the lead frame. Forming an annular dam on the outside of the region;
Mounting the LED chip in each of a plurality of LED chip mounting regions;
Supplying lens resin to the inside of the annular dam by transfer molding to seal the LED chip;
Cutting the lead frame in a state where the LED chip is sealed with the lens resin;
A method for manufacturing an LED package, comprising: A part of the lens resin is supplied in advance to the inside of the annular dam part, and another part of the lens resin is supplied to the pot to perform the transfer molding, thereby sealing the LED chip. The manufacturing method of the LED package of Claim 7 characterized by the above-mentioned.