CN108724566A - The encapsulating die and glue-pouring method of LED light source - Google Patents
The encapsulating die and glue-pouring method of LED light source Download PDFInfo
- Publication number
- CN108724566A CN108724566A CN201810417916.5A CN201810417916A CN108724566A CN 108724566 A CN108724566 A CN 108724566A CN 201810417916 A CN201810417916 A CN 201810417916A CN 108724566 A CN108724566 A CN 108724566A
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- Prior art keywords
- hole
- light source
- led light
- upper mold
- lower mold
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 61
- 238000004806 packaging method and process Methods 0.000 claims abstract description 23
- 239000004033 plastic Substances 0.000 claims abstract description 23
- 229920003023 plastic Polymers 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000011324 bead Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 2
- 239000007924 injection Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 11
- 239000000084 colloidal system Substances 0.000 abstract description 6
- 238000012856 packing Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000007711 solidification Methods 0.000 description 9
- 230000008023 solidification Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 238000005524 ceramic coating Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/38—Heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/42—Casting under special conditions, e.g. vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
Abstract
This application discloses a kind of encapsulating die of LED light source and glue-pouring methods, and in injecting glue, the upper mold at least partly fastens with the lower mold and forms an enclosure space for the accommodating LED light source being fixed on the lower mold completely；The both sides of the upper mold are provided with exhaust hole, and the through-hole lid consistent with the exhaust hole size and quantity, and the exhaust hole is for vacuumizing the enclosure space；The through-hole lid is for being after evacuation sealed the exhaust hole；Hole for injecting glue is provided between the ambilateral exhaust hole of upper mold, the hole for injecting glue to the enclosure space for filling packaging plastic.It can effectively avoid air bubble occur during packing colloid, improve encapsulation yield.
Description
Technical field
The application LED display fields, more particularly to the encapsulating die and glue-pouring method of a kind of LED light source.
Background technology
The packaged type of LED light source on the market mainly has the direct insertion LED light of belt supporting frame, patch type SMD LED light at present
And integral LED module lamp.
Direct insertion LED light is made of luminescence chip, copper or iron material holder, epoxy resin, its main feature is that forming various, replacement
It is convenient, light emitting angle variation range is big, can do point light source, more whens, constitute die set light source or linear light source.Fixture LED lamp forms
Needed when module single inserting welding, install it is relatively complicated and of high cost.Patch type SMD LED light is a kind of plastic packaging band lead
Chip carrier, its main feature is that small, thin, application range is big；Encapsulation is secured, and good heat dissipation has higher reliability, thus obtains
Most commonly used application, such as by the LED light of SMD encapsulation on a display screen.But SMD LED light applies to display screen
When, is directly exposed to outer, therefore is inevitably likely to occur the case where being collided with, to solve the above-mentioned problems, at present
The method used is to carry out solidification sealing to SMD LED light to prevent single LED lamp from being collided with.
However, existing solidification sealing mode is after completing encapsulating in a mold, to be consolidated in the form of naturally dry
Change, hardening time is up to a few houres, and time-consuming, has seriously affected production efficiency.But during existing encapsulation dress, it may appear that empty
Gas bubble causes to encapsulate bad.
Invention content
The application, can mainly solving the technical problems that provide a kind of encapsulating die and glue-pouring method of LED light source
It effectively avoids air bubble occur during packing colloid, improves encapsulation yield.
In order to solve the above technical problems, first technical solution that the application uses is：A kind of encapsulating of LED light source is provided
Mold, the encapsulating die include upper mold and lower mold, and in injecting glue, the upper mold and the lower mold be at least partly
It fastens completely and forms an enclosure space for the accommodating LED light source being fixed on the lower mold；The upper mold with it is described under
The both sides of mold opposite side are provided with exhaust hole, and the through-hole lid consistent with the exhaust hole size and quantity,
The exhaust hole is for vacuumizing the enclosure space；The through-hole lid for after evacuation to the exhaust hole into
Row sealing；Hole for injecting glue is provided between the ambilateral exhaust hole of upper mold, the hole for injecting glue is used for the closing
Space fills packaging plastic.
Wherein, it is additionally provided with bottoming hole between the ambilateral exhaust hole of the upper mold, for heating rod to be inserted into
The bottoming hole is to heat the packaging plastic of injection.
Wherein, the both sides of the upper mold one side opposite with the lower mold are provided with platform, the thickness of the platform
More than the pcb board of the LED light source and the general thickness of LED light.
Wherein, the thickness of the platform is less than pre- with the difference of the pcb board of the LED light source and the general thickness of LED light
If value.
Wherein, the upper mold further includes injecting glue conduit, and the injecting glue conduit is for accessing the hole for injecting glue to the LED
Light source injects packaging plastic.
Wherein, the lower mold is formed with a sunk area for placing in the middle part of the LED light source, the depressed area
Support portion is provided in domain, the support portion is used to support the LED light source.
Wherein, the deep equality of the height of the support portion and the sunk area.
Wherein, the lower mold is additionally provided with positioning column on one side with carry the LED light source, and the positioning column is for inserting
The location hole for entering the LED light source positions the LED light source.
Wherein, the quantity of the positioning column is 4.
In order to solve the above technical problems, second technical solution that the application uses is：A kind of encapsulating of LED light source is provided
Method, the glue-pouring method include：
The LED light source is fixed on the lower mold of LED encapsulating dies；
The upper mold of the LED encapsulating dies is fastened on the LED light source, it is empty to form a closing with the lower mold
Between；
By the way that the both sides exhaust hole in the upper mold and the lower mold opposite side is arranged by the sealing space
It is evacuated, and the exhaust hole is sealed by through-hole lid；Wherein, the through-hole lid size and quantity with it is described
Exhaust hole is consistent；
Packaging plastic is filled to the enclosure space by the hole for injecting glue of the upper mold；The wherein described hole for injecting glue is arranged in institute
It states between the ambilateral exhaust hole of upper mold.
The advantageous effect of the application is：Be different from the prior art, the encapsulating die of present embodiment include upper mold and
Upper mold is fastened on the mode for the lower mold for fixing LED lamp source, can effectively improve production efficiency by lower mold.Upper mold
Both sides be provided with exhaust hole, can and the through-hole lid consistent with the exhaust hole size and quantity, the exhaust
Through-hole is for vacuumizing the enclosure space；The through-hole lid is used to after evacuation be sealed the exhaust hole,
So that follow-up injecting glue process and heating process is all carried out in a vacuum, can effectively avoid air gas occur during packing colloid
Bubble improves encapsulation yield.In addition, being provided with hole for injecting glue between the ambilateral exhaust hole of upper mold, the hole for injecting glue is used for
Packaging plastic is filled to the enclosure space, keeps injecting glue process more convenient, further increases production efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of one embodiment of the application encapsulating die；
Fig. 2 is the profile schematic diagram of one embodiment of hole for injecting glue in Fig. 1；
Fig. 3 is the structural schematic diagram that Fig. 1 encapsulating die encapsulatings complete latter embodiment；
Fig. 4 is the structural schematic diagram that one embodiment of LED light source after injecting glue is completed in Fig. 3；
Fig. 5 is the structural schematic diagram of LED light source depanning latter embodiment in Fig. 3；
Fig. 6 is the flow diagram of one embodiment of glue-pouring method of the application LED light source.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the range of the application protection.
LED light source, that is, LED source, in order to describe aspect, LED source is all referred to as LED by full text
Light source.Due to its brightness is big, little power consumption and be used widely, specifically include pcb board, be arranged on the pcb board and pass through
The LED lamp bead of the pcb board and driving chip coupling.Under normal circumstances, driving chip is disposed on pcb board with LED lamp bead
Opposite two sides.Single LED lamp integument of SMD LED light collides in order to prevent, and the application uses mold as follows
Encapsulating solidification is carried out to the LED light source, to shorten flash-off time, improves production efficiency.
Specifically, as shown in Figure 1, the dies with epoxy compound of the application includes upper mold 101 and lower mold 102.Upper mold 101
Both sides are provided with exhaust hole 1011.Preferably, in order to be vented faster, also for the beauty for keeping the encapsulating die, by this
The side on 101 both sides of the upper mold is arranged in exhaust hole, as shown in fig. 1, does not limit herein.In addition, the exhaust hole
Diameter of 1011 size also with general exhaust pipe matches.In one preferred embodiment, the exhaust hole 1011
Diameter is slightly larger than the diameter of vacuum tube.
Centre position between the exhaust hole 1011 of 101 both sides of upper mold is provided with hole for injecting glue 1012, in order to improve note
The quantity of the efficiency of glue, the hole for injecting glue 1012 is also multiple, which can also arrange at array arrangement at line,
Can with the upper mold 101 shape at other rule or irregular figure arrangement, as shown in Fig. 2, the hole for injecting glue 1012 at
The arrangement of array.The diameter of the hole for injecting glue 1012 also matches with the diameter of general injected rubber hose and slightly larger than injected rubber hose
Diameter does not limit herein.
Since LED light source is in order to realize that encapsulation, the glue in general lower mold need to be maintained at heated condition when packaged,
And liquid is kept when not being packaged.And it is in the prior art lamp bead is fixed on pcb board, be inverted pcb board invade lower die
Tool is in the glue of heating and melting, and upper mold control fastening in pressure, after glue solidification, taking-up is demoulded again, completes filling
The mode of glue cannot freeze rapidly, not only time-consuming longer, but also deformation occur also due to expanding with heat and contract with cold.
To solve the above-mentioned problems, in present embodiment, the side that upper mold 101 or/and lower mold 102 are arranged is also set up
There is bottoming hole.In one preferred embodiment, to accelerate the speed of heating, upper mold 101 or/and lower mold 102 are set
The side set is respectively provided with bottoming hole.Further as shown in Figure 1, lower mold 102 is additionally provided with multiple bottoming holes 1021, upper mold
101 side is provided with multiple bottoming holes 1014.The bottoming hole 1021 or 1014 is heated for packaging plastic for placing heating rod
's.The depth of bottoming hole is generally determined with the length of corresponding heating rod.The diameter of the bottoming hole be not easy it is excessive, in order to avoid cause
Heating rod conducts the unbalanced situation of heat；It is not easy to too small, otherwise may fail to lay down the slightly larger heating rod of diameter, and cause
The mold does not have the problem of versatility.
The mode that upper mold 101 in present embodiment mutually fastens compression molding with lower mold 102 can effectively improve
Production efficiency, and by the packaging plastic of bottoming hole pair heat mode of heating, can make packaging plastic rapidly be heated curing molding, one
As only a few minutes is needed to can be completed, compared to traditional naturally dry mode for needing hardening time a few houres, greatly shorten
Hardening time, further improve production efficiency.
Further, in order to preferably place LED light source, so as not to be caused when fastening upper mold 101 to the LED light source
Damage, in present embodiment, platform 1013 is arranged in the both sides in the one side opposite with lower mold 102 of upper mold 101.It is excellent
Selection of land, the platform 1013 of the both sides it is highly consistent, it is not tight to prevent upper mold 101 and lower mold 102 from fastening.The platform 1013
Thickness be more than the LED light source pcb board add LED lamp bead general thickness.In one preferred embodiment, in order to
Reduce the overall volume after upper mold 101 and lower mold 102 fasten, the thickness of the platform 1013 be not easy to it is blocked up, slightly larger than should
The pcb board of LED light source adds the general thickness of LED lamp bead, the i.e. pcb board and LED of the thickness of platform 1013 and the LED light source
The difference of the general thickness of lamp bead is less than preset value.The preset value can sets itself according to actual needs, do not limit herein.
Further for the component at the pcb board back of empty avoiding LED light source, prevent upper mold 101 from being buckled with lower mold 102
Above-mentioned component is caused to damage after conjunction, in present embodiment, is formed in the middle part of LED light source in lower mold 102 for placing
One sunk area 1022 is provided with support portion 1023 in the sunk area 1022, and the support portion 1023 is used to support the LED
The pcb board of light source.Preferably, the deep equality of the height of the support portion 1023 and the sunk area 1022.
In any of the above-described embodiment, what which was used to carry the LED light source is additionally provided with positioning on one side
Column 1024, the location hole that the positioning column 1024 is used to be inserted into the LED light source position the LED light source.Wherein, should
The quantity of positioning column 1024 is 4.
In addition, the inner surface of upper mold 101 or/and lower mold 102 is also coated with teflon coatings or ceramic coating etc. no
Adhesive coating layer in other embodiments can also realize the inner surface chromium plating process of upper mold 101 or/and lower mold 102
Do not glue function.
In conjunction with the encapsulating die in Fig. 1, in a specific embodiment, positioning column 1024 and LED light source are first passed through
The location hole of pcb board correspond engaging, and it is fixed, LED light source is fixed in sunk area 1023 by the pcb board.
Then upper mold 101 is fastened on lower substrate 102 and the LED light source and forms a confined space.Passing through gas vent 1011
The confined space is evacuated, air is again introduced into order to prevent, true to the confined space arrange in present embodiment
After sky, all exhaust holes 1011 are sealed by through-hole lid.Pass through note using the hole for injecting glue 1012 on upper mold 101
Glue conduit is pressed into packaging plastic to above-mentioned confined space, until the confined space fills.Wherein, which is liquid glue
Water.After the completion of injecting glue, is heated using heating rod by heating through-hole 1021 or/and 1014 pairs of packaging plastics, make the envelope
Fill adhesive curing molding.As shown in figure 3, LED light source shown in the dotted line frame being formed between upper mold 301 and lower mold 302
40。
Further, as shown in figure 4, the LED light source includes pcb board 401, the LED lamp bead 402 in pcb board both sides is set
And control chip 404, and the packaging plastic 403 that is covered in the LED lamp bead 402.
Patch is encapsulated in order to prevent draws component and occur by striker situation occurs when mounting can not by chip mounter
Therefore the case where completion, increases the technique edges for assisting production plug-in unit limp to weld wave crest on pcb board both sides or four sides,
The width of the technique edges be not easy to it is wide, usually 1.5~5 millimeters, technique edges 405 as shown in Figure 4, therefore will be after solidification
The semi-finished product with technique edges 405 after LED light source takes out, and to the LED light source after the solidification carry out accurate cutting at
Type cuts off the technique edges, obtain LED light source finished product, as shown in Figure 5.
It is different from the prior art, the encapsulating die of present embodiment includes upper mold and lower mold, and upper mold is fastened
On the lower mould profile for fixing LED lamp source, production efficiency can be effectively improved.It is logical that the both sides of upper mold are provided with exhaust
Hole, can and the through-hole lid consistent with the exhaust hole size and quantity, the exhaust hole be used for the closing
Space vacuumizes；The through-hole lid for being sealed after evacuation to the exhaust hole, make follow-up injecting glue process and
Heating process all carries out in a vacuum, can effectively avoid air bubble occur during packing colloid, improve encapsulation yield.Separately
Outside, hole for injecting glue is provided between the ambilateral exhaust hole of upper mold, the hole for injecting glue is for filling the enclosure space
Packaging plastic keeps injecting glue process more convenient, further increases production efficiency.
It is the flow diagram of one embodiment of glue-pouring method of the application LED light source refering to Fig. 6, Fig. 6.Wherein, the filling
Gluing method for realizing any of the above-described embodiment LED light source.The glue-pouring method of present embodiment includes the following steps：
601：The LED light source is fixed on the lower mold of LED encapsulating dies.
For the component at the pcb board back of empty avoiding LED light source, to above-mentioned first device after preventing upper mold from being fastened with lower mold
Part causes in damage present embodiment, a sunk area is formed in the middle part of the LED light source for placing in lower mold, this is recessed
It falls into region and is provided with support portion, support portion is used to support the LED light source.Preferably, the height of the support portion with it is described recessed
Fall into the deep equality in region.
In any of the above-described embodiment, what which was used to carry the LED light source is additionally provided with positioning column on one side,
The location hole that the positioning column is used to be inserted into the LED light source positions the LED light source.Wherein, the number of the positioning column
Amount is 4.
Specifically, engaged with the location hole of the pcb board of LED light source one-to-one correspondence by positioning column, and fixed, by this
LED light source is fixed in sunk area by pcb board.
602：The upper mold of the LED encapsulating dies is fastened on the LED light source, an envelope is formed with the lower mold
Close space.
Above-mentioned to be fastened on upper mold on the lower mould profile for fixing LED lamp source, upper mold fastens the mode of lower mold,
Production efficiency can be effectively improved.
In addition, the inner surface of upper mold or/and lower mold is also coated with the non-sticking linings such as teflon coatings or ceramic coating,
In other embodiments, function cannot can not also be realized viscously to the inner surface chromium plating process of upper mold or/and lower mold.
603：By the way that the both sides exhaust hole in the upper mold and the lower mold opposite side is arranged by the sealing
Space is evacuated, and is sealed to the exhaust hole by through-hole lid；Wherein, the through-hole lid size and quantity with
The exhaust hole is consistent.
In such a way that above-mentioned gas vent vacuumizes, follow-up injecting glue process and heating process is made all to carry out in a vacuum,
It can effectively avoid air bubble occur during packing colloid, improve encapsulation yield.
Preferably, in order to be vented faster, also for the beauty for keeping the encapsulating die, which is arranged at this
The downside of upper mold.It does not limit herein.In addition, diameter of the size of the exhaust hole also with general exhaust pipe matches.
In one preferred embodiment, the diameter of the exhaust hole is slightly larger than the diameter of vacuum tube.
In present embodiment, to the confined space carry out vacuum pumping after, by through-hole lid to all exhaust holes into
Row sealing.
604：Packaging plastic is filled to the enclosure space by the hole for injecting glue of the upper mold；The wherein described hole for injecting glue setting
Between the ambilateral exhaust hole of the upper mold.
Wherein, which is liquid glue.
Specifically, the centre position of the ambilateral exhaust hole of upper mold is provided with hole for injecting glue, in order to improve the efficiency of injecting glue,
The quantity of the hole for injecting glue is also multiple, which can also arrange at array arrangement at line, also with the shape of the upper mold
Shape is at other regular or irregular figure arrangements, as shown in Fig. 2, arrangement of the hole for injecting glue at array.The hole for injecting glue it is straight
Diameter size also matches with the diameter of general injected rubber hose and slightly larger than the diameter of injected rubber hose, does not limit herein.
After the completion of injecting glue, the packaging plastic is heated by the heating through-hole on the lower mold using heating rod, is made
The packaging plastic curing molding.
Specifically, since LED light source is in order to realize that encapsulation, the glue in general lower mold need to be maintained at heated condition,
And liquid is kept when not being packaged.And it is in the prior art lamp bead is fixed on pcb board, be inverted pcb board invade lower die
Tool is in the glue of heating and melting, and upper mold control fastening in pressure, after glue solidification, taking-up is demoulded again, completes filling
The mode of glue cannot freeze rapidly, not only time-consuming longer, but also deformation occur also due to expanding with heat and contract with cold.
To solve the above-mentioned problems, in present embodiment, upper mold or/and lower mold are additionally provided with multiple bottoming holes.It should
It is that packaging plastic heats that bottoming hole, which is for placing heating rod,.The depth of bottoming hole is generally determined with the length of corresponding heating rod
It is fixed.The diameter of the bottoming hole be not easy it is excessive, in order to avoid cause heating rod conduct the unbalanced situation of heat；Be not easy to it is too small, otherwise
The slightly larger heating rod of diameter may be failed to lay down, and the lower mold is caused not have the problem of versatility.
Patch is encapsulated in order to prevent draws component and occur by striker situation occurs when mounting can not by chip mounter
Therefore the case where completion, increases for auxiliary production plug-in unit limp on pcb board both sides or four sides, welds the technique edges of wave crest,
The width of the technique edges was not easy to money, usually 1.5~5 millimeters.Therefore it is to carry after the LED light source after solidification being taken out
The semi-finished product of technique edges, and accurate cutting is carried out to be molded to the LED light source after the solidification, that is, the technique edges are cut off, LED is obtained
Light source finished product.
It is different from the prior art, LED light source is fixed on the lower mold of LED encapsulating dies by present embodiment；By institute
The upper mold for stating LED encapsulating dies is fastened on the LED light source, and an enclosure space is formed with the lower mold, can be effective
Improve production efficiency；By the way that the both sides exhaust hole in the upper mold and the lower mold opposite side is arranged by the sealing
Space is evacuated, and is sealed to the exhaust hole by through-hole lid, makes follow-up injecting glue process and heating process all
It carries out in a vacuum, can effectively avoid air bubble occur during packing colloid, improve encapsulation yield.Pass through the upper mold
Hole for injecting glue packaging plastic is filled to the enclosure space；The wherein described hole for injecting glue is arranged in the ambilateral exhaust of the upper mold
Between through-hole, keeps injecting glue process more convenient, further increase production efficiency.
It these are only presently filed embodiment, be not intended to limit the scope of the claims of the application, it is every to utilize the application
Equivalent structure or equivalent flow shift made by specification and accompanying drawing content is applied directly or indirectly in other relevant technologies
Field includes similarly in the scope of patent protection of the application.
Claims (10)
1. a kind of encapsulating die of LED light source, which is characterized in that the encapsulating die includes upper mold and lower mold, is being noted
When glue the upper mold and the lower mold at least partly fasten completely formed an enclosure space for it is accommodating be fixed on it is described under
LED light source on mold；The both sides of the upper mold are provided with exhaust hole, and with the exhaust hole size and quantity
Consistent through-hole lid, the exhaust hole is for vacuumizing the enclosure space；The through-hole lid is for right after evacuation
The exhaust hole is sealed；It is provided with hole for injecting glue, the hole for injecting glue between the ambilateral exhaust hole of upper mold
For filling packaging plastic to the enclosure space.
2. encapsulating die according to claim 1, which is characterized in that the side of the upper mold or/and the lower mold
It is provided with bottoming hole, for heating rod to be inserted into the bottoming hole to be heated to the packaging plastic of injection.
3. encapsulating die according to claim 1, which is characterized in that the upper mold one side opposite with the lower mold
Both sides be provided with platform, the thickness of the platform is more than the pcb board of the LED light source and the general thickness of LED lamp bead.
4. encapsulating die according to claim 3, which is characterized in that the PCB of the thickness of the platform and the LED light source
The difference of the general thickness of plate and LED lamp bead is less than preset value.
5. LED encapsulating dies according to claim 1, which is characterized in that the upper mold further includes injecting glue conduit, the note
Glue conduit injects packaging plastic for accessing the hole for injecting glue to the LED light source.
6. encapsulating die according to claim 1, which is characterized in that the lower mold is used to place the LED light source
Middle part be formed with a sunk area, support portion is provided in the sunk area, the support portion is used to support the LED light
Source.
7. encapsulating die according to claim 6, which is characterized in that the height of the support portion and the sunk area
Deep equality.
8. encapsulating die according to claim 1 or 6, which is characterized in that the lower mold is for carrying the LED light source
Be additionally provided with positioning column on one side, the location hole that the positioning column is used to be inserted into the LED light source determines the LED light source
Position.
9. encapsulating die according to claim 8, which is characterized in that the quantity of the positioning column is 4.
10. a kind of glue-pouring method of LED light source, which is characterized in that the glue-pouring method includes：
The LED light source is fixed on the lower mold of LED encapsulating dies；
The upper mold of the LED encapsulating dies is fastened on the LED light source, an enclosure space is formed with the lower mold；
The sealing space is pumped by the both sides exhaust hole for being arranged in the upper mold and the lower mold opposite side
Vacuum, and the exhaust hole is sealed by through-hole lid；Wherein, the through-hole lid size and quantity and the exhaust
Through-hole is consistent；
Packaging plastic is filled to the enclosure space by the hole for injecting glue of the lower mold or/and the upper mold；The wherein described note
Glue hole is arranged between the ambilateral exhaust hole of the upper mold.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810417916.5A CN108724566A (en) | 2018-05-04 | 2018-05-04 | The encapsulating die and glue-pouring method of LED light source |
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| CN201810417916.5A CN108724566A (en) | 2018-05-04 | 2018-05-04 | The encapsulating die and glue-pouring method of LED light source |
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| CN108724566A true CN108724566A (en) | 2018-11-02 |
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