CN108417699A - The plastic package die of LED light source - Google Patents
The plastic package die of LED light source Download PDFInfo
- Publication number
- CN108417699A CN108417699A CN201810480836.4A CN201810480836A CN108417699A CN 108417699 A CN108417699 A CN 108417699A CN 201810480836 A CN201810480836 A CN 201810480836A CN 108417699 A CN108417699 A CN 108417699A
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- China
- Prior art keywords
- light source
- led light
- briquetting
- pumping
- plastic package
- Prior art date
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- 239000004033 plastic Substances 0.000 title claims abstract description 41
- 238000005086 pumping Methods 0.000 claims abstract description 42
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 239000000049 pigment Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000003292 glue Substances 0.000 abstract description 16
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 239000000084 colloidal system Substances 0.000 abstract description 4
- 238000012856 packing Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 238000010257 thawing Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005524 ceramic coating Methods 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 235000009854 Cucurbita moschata Nutrition 0.000 description 1
- 240000001980 Cucurbita pepo Species 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 235000020354 squash Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Led Device Packages (AREA)
Abstract
This application discloses a kind of plastic package dies of LED light source, and in injecting glue, upper mold fastens to form an enclosure space with lower mold, for the accommodating LED light source and film being fixed on lower mold.It is provided with the first pumping preformed hole in the middle part of upper mold, and upper mold lower end is provided with briquetting, the place for being evacuated preformed hole on briquetting with respect to first is equipped with the second pumping preformed hole.For first, second pumping preformed hole for being vacuumized to the enclosure space, briquetting is heated to melt the film for carrying out plastic packaging to the LED module in enclosure space.It can effectively avoid air bubble occur during packing colloid, improve encapsulation yield.
Description
Technical field
This application involves LED display fields, more particularly to a kind of plastic package die of LED light source.
Background technology
It gradually moves to maturity with the research and production of traditional component, electronic industry is being stepped into new material, newly
The new period of product renewing upgrading and deepening development under technique, new technology drive, electronic component industry are integrally showed to piece
Formula, miniaturization development trend, moreover, with electronics and information industry overall development, the development to electronic industry
It is proposed new demand.
With the continuous improvement of various electronic products complete machine progress of miniaturization, to the small size and high-performance of electronic component
More stringent requirements are proposed, and LED display dot spacing light source complete plastic packaging how is met while ensureing properties of product
It is required that at the new project of LED display manufacturing and challenge.
LED display dot spacing has become trend, when carrying out plastic packaging to dot spacing light source, original squash type
Plastic packaging is not applicable, it may appear that the case where glue squeezed slowly, and glue-spreading head collision LED light source damages.
Invention content
The application can effectively avoid encapsulating mainly solving the technical problems that provide a kind of plastic package die of LED light source
There is air bubble during colloid, impurity is more, improves encapsulation yield.
In order to solve the above technical problems, first technical solution that the application uses is：A kind of plastic sealed mould of LED light source
Tool, including：Upper mold and lower mold；In plastic packaging, the upper mold fastens to form an enclosure space with the lower mold, is used for
It is accommodating to be fixed on the LED light source module on the lower mold and the film above the LED light source module, the LED
Light source module group includes pcb board, and the LED light source being arranged on the pcb board；
The upper mold lower end is provided with briquetting, and the first pumping is respectively arranged in the middle part of the upper mold and the briquetting
Preformed hole and the second pumping preformed hole, the first pumping preformed hole and the second pumping preformed hole are connected.
The plastic package die of optional LED light source, the first pumping preformed hole of the upper mold and the second of the briquetting are taken out
Gas preformed hole is connection with one heart；
The upper mold and the briquetting corresponding position are provided with mounting hole, for be packed into fastener to the upper mold and
The briquetting is fastenedly connected.
Optionally, the downside inside the briquetting is equipped with equally distributed multiple heat blocks, and the multiple heat block is electrical
The thickness of connection, the heat block is less than briquetting thickness.
Optionally, the thickness of the film be less than the LED light source module the pcb board and the LED light source it is total
Body thickness.
Optionally, the film is the prepreg being fabricated by organosilicon, resin and pigment.
Optionally, the middle part of the lower mold forms a groove for placing the LED light source module；The groove
Side is equipped with the first step for engaging the pcb board and the second step for engaging the film, and the groove is also set
Multiple support portions are equipped with, the support portion is used to support the LED light source module.
Optionally, the height of the support portion is less than the first step height, and the height category of multiple support portions
In same plane.
Optionally, the support portion is detachable.
Optionally, the height of the first step is less than the thickness of the pcb board.
Optionally, the height of second step is less than the thickness of the film.
The advantageous effect of the application is：It is different from the prior art, the plastic package die of the LED light source of present embodiment includes upper
Upper mold is pressed together on the mode for the lower mold for fixing LED light source module, can effectively improve production by mold and lower mold
Efficiency.Upper mold and lower mold, which fasten, to be formed an enclosure space and is fixed on LED light source module and glue on lower mold for accommodating
Piece.It is provided with the first pumping preformed hole in the middle part of upper mold, and upper mold lower end is provided with briquetting, opposite first on briquetting
The place for being evacuated preformed hole is equipped with the second pumping preformed hole.First pumping preformed hole, the second pumping preformed hole are used for the envelope
Space is closed to vacuumize, briquetting is heated to melt film for filling packaging plastic to enclosure space, film stock thickness it is controllable, make injecting glue
Glue amount be more suitable for, the glue amount on LED light source surface is more evenly distributed；Injecting glue process is more convenient, and product quality is stablized, and raw
It produces efficient, further increases production efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of one embodiment of the application plastic package die；
Fig. 2 is the diagrammatic cross-section of one embodiment of briquetting in Fig. 1；
Fig. 3 is briquetting schematic top plan view in Fig. 1；
Fig. 4 is one embodiment pressing structure schematic diagram of LED light source module plastic package die；
Fig. 5 is LED light source module plastic package die dimensional structure diagram in Fig. 1；
Fig. 6 is the flow diagram of one embodiment of plastic package method of the application LED light source module.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the range of the application protection.
LED source is all referred to as LED by LED light source, that is, LED source, for convenience, full text
Light source.Due to its brightness is big, little power consumption and be used widely, specifically include pcb board, be arranged on the pcb board and pass through
The LED light source (LED lamp bead) of the pcb board and driving chip coupling.Under normal circumstances, driving chip is separately set with LED lamp bead
Set the two sides opposite in pcb board.Single LED lamp integument of LED light collides in order to prevent, and the application uses as follows
Mold carries out plastic packaging solidification to the LED light source, to shorten packaging time and flash-off time, improves production efficiency.
Specifically, as shown in Figure 1, the dies with epoxy compound of the LED light source of the application includes：Upper mold 101 and lower mold 102.
Upper mold 101 fastens with lower mold 102 and forms an enclosure space, for the accommodating LED light source module being fixed on lower mold 102
201 and film 301.The middle part of upper mold 101 is provided with the first pumping preformed hole 1011A, and, the setting of 101 lower end of upper mold
There are briquetting 1012, the middle part of briquetting 1012 to be provided with the second pumping preformed hole 1011B.First pumping preformed hole 1011A and second
Pumping preformed hole 1011B is connected.First pumping preformed hole 1011A and the second pumping preformed hole 1011B are used for enclosure space
It vacuumizes.Briquetting 1012 is heated to melt film 301 for filling packaging plastic to enclosure space.Film is by organosilicon, resin
The prepreg being fabricated with pigment, content proportioning are 50~70 parts of organosilicon, 30~40 parts of resin, 5~10 parts of pigment.
LED light source module 201 includes LED light source 2012 and pcb board 2011, and LED light source 2012 is arranged on pcb board 2011.At one
In preferred embodiment, 1012 shape of briquetting can be at wavy, as long as can cover lower mold 102 and can be uniformly distributed.
As shown in figure 3, the second pumping preformed hole 1011B settings of briquetting 1012 are at middle part, both sides are equipped with mounting hole
1014, the position that mounting hole 1014 is corresponded on upper mold 101 is also equipped with mounting hole, and being packed into after fastener can be to upper mold 101
It is fastenedly connected with briquetting 1012.In order to improve the efficiency of pumping, the first pumping preformed hole 1011A and the second pumping are reserved
The quantity of hole 1011B may be alternatively provided as multiple, the setting position of the first pumping preformed hole 1011A and the second pumping preformed hole 1011B
Set corresponding, and the first pumping preformed hole 1011A and the second pumping preformed hole 1011B can also may be used respectively at array arrangement
Arrange at line, also with the upper mold 101 shape at other rule or irregular figure arrangement, do not limit herein.
Since LED light source module encapsulates to realize, the glue in general lower mold needs to be maintained at heating when packaged
State solidifies, and liquid is kept when not being packaged.And it is in the prior art LED light source is fixed on pcb board, cause
The lower mold of pcb board intrusion is in the glue of heating and melting, pressure in upper mold control fasten, after glue solidifies, taking-up again into
Row demoulding, completing the mode of plastic packaging cannot freeze rapidly, not only time-consuming longer, but also deformation occurs also due to expanding with heat and contract with cold.
To solve the above-mentioned problems, in present embodiment, briquetting 1012 is internally provided with heat block 1013.Preferably at one
Embodiment in, multiple heat blocks 1013 are provided in briquetting 1012.Further as shown in Fig. 2, heat block 1013 is arranged
It in briquetting 1012, is distributed at uniform array, and is set to the lower surface inside briquetting 1012.Multiple heat blocks 1013 electrically connect
It connects, height is less than 1012 thickness of briquetting.The size of 1013 area of heat block and 301 heating surface area of film being pre-designed and glue
301 melting point of piece is corresponding.The area of the heat block 1013 should not be too large or small, in case it is unbalanced to cause briquetting 1012 to conduct heat
The case where.
The mode that upper mold 101 in present embodiment mutually fastens compression molding with lower mold 102 can effectively improve
Production efficiency, and by way of 301 heating and melting of film of 1012 pairs of briquetting, can make film 301 is heated rapidly to melt, stream
Enter in the slot of LED light source module 201 of lower mold 102, completes encapsulation, the quality of film 301 is fixed mixing ratio design, is melted
Meet encapsulation dosage afterwards, and 2~3% containing hydrogen silicone oil is participated in 301 material of film, and cures rapidly after encapsulation.Phase
Than in traditional injecting glue mode, substantially reducing hardening time, glue quantity is controlled, reduces waste, further improves production
Efficiency.
Further, in order to preferably place LED light source 2011, so as not to be caused when fastening upper mold 101 to LED light
The damage in source 2011, in present embodiment, the middle part of lower mold 102 forms a groove for placing LED light source module 201
1021, the avris of groove 1021 is equipped with first step 1023 and second step 1024.Preferably, which is surrounded
Size and pcb board 2011 match, the size that second step 1024 is encircled a city matches with film 301.First step
1023 height is slightly smaller than the thickness of pcb board 2011, height slightly 301 thickness of Minifilm of second step 1024, to prevent
There is blow-by state.
Further, for the component at 2011 back of pcb board of empty avoiding LED light source 2012, prevent upper mold 101 under
Mold 102 causes to damage after fastening to above-mentioned component, in present embodiment, in lower mold 102 for placing LED light source module
201 middle part is formed with a groove 1021, and support portion 1022 is provided in the groove 1021, and support portion 1022 is used to support LED
The pcb board 2011 of light source module group.Preferably, the height of the support portion 1022 is equal with the height of first step 1023.
In any of the above-described embodiment, which is removable for carrying the support portion 1022 of LED light source module
It unloads.
In addition, the inner surface of upper mold 101 or/and lower mold 102 is also coated with teflon coatings or ceramic coating etc. no
Adhesive coating layer in other embodiments can also realize the inner surface chromium plating process of upper mold 101 or/and lower mold 102
Do not glue function.
In conjunction with the plastic package die in Fig. 5, in a specific embodiment, increase/reduction support portion 1022 is first passed through
It to determine the number of support portion, is placed on support portion 1022 by LED light source module 201, is caught in first step 1023, completed
Positioning.Then film 301 is placed into 201 top of LED light source module, is caught in second step 1024.Then upper mold 101 is fastened
A confined space is formed on lower mold 102 and the LED light source module 201 and film 301.Passing through the first pumping preformed hole
The effect of the pumping preformed holes of 1011A and second 1011B, which is evacuated, and air is again introduced into order to prevent, this
In embodiment, after carrying out vacuum pumping to the confined space, by be evacuated reserved lid to all pumping preformed holes 1011 into
Row sealing.It is selected using 1012 heating and melting film 301 of the briquetting indentation packaging plastic on upper mold 101 to above-mentioned confined space
It is quantitative with film, filling confined space is met after thawing.After the completion of injecting glue, naturally dry makes the packaging plastic curing molding,
As shown in Figure 4.
It is the flow diagram of one embodiment of plastic package method of the application LED light source module refering to Fig. 6, Fig. 6.Wherein,
The plastic package method is used for the plastic package die of the LED light source applied to any of the above-described embodiment.The plastic package method of present embodiment
Include the following steps：
501：LED light source 2012 is fixed on the lower mold 102 of LED plastic package dies.
For the component at 2011 back of pcb board of empty avoiding LED light source 2012, prevent upper mold 101 from being buckled with lower mold 102
Above-mentioned component is caused in damage present embodiment after conjunction, the middle part for being used to place LED light source 2012 in lower mold is formed with
One groove 1021 is provided with support portion 1022 in the groove 1021, and support portion 1022 is used to support LED light source 2012.Preferably,
The support portion 1022 can be increased or decreased according to the component locations at 2011 back of pcb board.
In any of the above-described embodiment, what which was used to carry LED light source 2012 is additionally provided with positioning on one side
Column (not shown), the location hole that positioning column is used to be inserted into LED light source 2012 position LED light source 2012.
Specifically, engaged with the location hole of the pcb board 2011 of LED light source 2012 one-to-one correspondence by positioning column, and fixed,
LED light source 2012 is fixed in groove 1021 by the pcb board 2011.
502：Film 301 is fastened on the lower mold 102 of the plastic package die of LED light source.
Film 301 is placed on LED light source module 201, is caught in second step 1024.
In addition 2~3% that containing hydrogen silicone oil content is sum are added in 301 material of film.
503：The briquetting 1012 of upper mold 101 is pressed together on film 301, an enclosure space is formed with lower mold 102.
The inner surface of upper mold 101 or/and lower mold 102 is also coated with the not snearing such as teflon coatings or ceramic coating
Layer, in other embodiments, the inner surface chromium plating process of upper mold 101 or/and lower mold 102 can not also be glued to realize
Function.
504：It is pre- by the first pumping preformed hole 1011A and the second pumping that are arranged on upper mold 101 and briquetting 1012
Box out 1011B, and enclosure space is evacuated, and reserves port lid pair first by pumping and be evacuated the pumpings of preformed hole 1011A and second
Gas preformed hole 1011B is sealed.
In such a way that above-mentioned first pumping preformed hole 1011A and the second pumping preformed hole 1011B are vacuumized, make subsequently to note
Glue process and heating process all carry out in a vacuum, can effectively avoid air bubble occur during packing colloid, improve envelope
Fill yield.
505：Briquetting 1012 is heated, film 301, the film 301 after thawing, at liquid inflow enclosure space are melted.
Wherein, which is that packing colloid solidifies plate.
Containing hydrogen silicone oil content is added in 301 material of film as the 2~3% of sum convenient for its coagulation forming.
506：After thawing, briquetting 1012 is powered off, promotes upper mold 101, natural cooling solidification, demoulding.
It these are only presently filed embodiment, be not intended to limit the scope of the claims of the application, it is every to utilize the application
Equivalent structure or equivalent flow shift made by specification and accompanying drawing content is applied directly or indirectly in other relevant technologies
Field includes similarly in the scope of patent protection of the application.
Claims (10)
1. a kind of plastic package die of LED light source, which is characterized in that including：Upper mold and lower mold；In plastic packaging, the upper mold
Tool fastens to form an enclosure space with the lower mold, for the accommodating LED light source module being fixed on the lower mold and
Film above the LED light source module, the LED light source module includes pcb board, and is arranged on the pcb board
LED light source；
The upper mold lower end is provided with briquetting, and it is reserved that the first pumping is respectively arranged in the middle part of the upper mold and the briquetting
Hole and the second pumping preformed hole, the first pumping preformed hole and the second pumping preformed hole are connected.
2. the plastic package die of LED light source according to claim 1, which is characterized in that the first pumping of the upper mold is pre-
It is connection with one heart to box out with the second pumping preformed hole of the briquetting；
The upper mold and the briquetting corresponding position are provided with mounting hole, for being packed into fastener to the upper mold and described
Briquetting is fastenedly connected.
3. the plastic package die of LED light source according to claim 1, which is characterized in that the downside inside the briquetting is equipped with
Equally distributed multiple heat blocks, the multiple heat block are electrically connected, and the thickness of the heat block is less than briquetting thickness.
4. the plastic package die of LED light source according to claim 1, which is characterized in that the thickness of the film is less than described
The pcb board of LED light source module and the general thickness of the LED light source.
5. the plastic package die of LED light source according to claim 1, which is characterized in that the film is by organosilicon, resin
The prepreg being fabricated with pigment.
6. the plastic package die of LED light source according to claim 1, which is characterized in that the middle part of the lower mold forms one
Groove for placing the LED light source module；The side of the groove be equipped with for engage the pcb board first step and
Second step for engaging the film, the groove are additionally provided with multiple support portions, and the support portion is used to support described
LED light source module.
7. the plastic package die of LED light source according to claim 6, which is characterized in that the height of the support portion is less than institute
First step height is stated, and the height of multiple support portions belongs to same plane.
8. the plastic package die of LED light source according to claim 6, which is characterized in that the support portion is detachable.
9. the plastic package die of LED light source according to claim 6, which is characterized in that the height of the first step is less than
The thickness of the pcb board.
10. the plastic package die of LED light source according to claim 6, which is characterized in that the height of second step is less than described
The thickness of film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810480836.4A CN108417699A (en) | 2018-05-18 | 2018-05-18 | The plastic package die of LED light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810480836.4A CN108417699A (en) | 2018-05-18 | 2018-05-18 | The plastic package die of LED light source |
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| CN108417699A true CN108417699A (en) | 2018-08-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201810480836.4A Pending CN108417699A (en) | 2018-05-18 | 2018-05-18 | The plastic package die of LED light source |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807649A (en) * | 2018-06-13 | 2018-11-13 | 深圳市德彩光电有限公司 | A kind of LED light source plastic package method |
| CN109257888A (en) * | 2018-08-22 | 2019-01-22 | 维沃移动通信有限公司 | A kind of circuit board double-faced packaging method, structure and mobile terminal |
| CN111935917A (en) * | 2020-09-01 | 2020-11-13 | 潍坊歌尔微电子有限公司 | Product glue filling auxiliary device and glue filling method |
| CN112186088A (en) * | 2020-09-30 | 2021-01-05 | 深圳Tcl新技术有限公司 | Laminating equipment and LED packaging process |
| CN112331091A (en) * | 2020-04-28 | 2021-02-05 | 广东三橙电子科技有限公司 | LED module packaging method and LED module |
| WO2021103547A1 (en) * | 2019-11-27 | 2021-06-03 | 深圳市洲明科技股份有限公司 | Positioning clamp, and assembly method for led display module |
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