CN112331091A - LED module packaging method and LED module - Google Patents
LED module packaging method and LED module Download PDFInfo
- Publication number
- CN112331091A CN112331091A CN202011487413.9A CN202011487413A CN112331091A CN 112331091 A CN112331091 A CN 112331091A CN 202011487413 A CN202011487413 A CN 202011487413A CN 112331091 A CN112331091 A CN 112331091A
- Authority
- CN
- China
- Prior art keywords
- light
- transmitting
- film
- led module
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED module packaging method and an LED module; the method comprises the following steps: sequentially stacking a circuit board provided with LED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein the surface of the circuit board provided with the LED lamp beads faces the light-transmitting adhesive layer; pressing the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain an LED module; after the light-transmitting adhesive layer is solidified again, trimming the LED module according to the product requirement; the melting point of the light-transmitting film is higher than that of the light-transmitting glue layer; the preset temperature is higher than the melting point of the light-transmitting adhesive layer and lower than the melting point of the light-transmitting film; the LED module comprises a circuit board, a light-transmitting glue layer and a light-transmitting film, wherein the melting point of the light-transmitting glue layer is lower than that of the light-transmitting film. The LED module and the method can ensure that the thickness of the formed glue layer is uniform, and have the advantages of simple process, high production efficiency, low cost and environmental protection.
Description
Technical Field
The invention relates to the technical field of display modules, in particular to an LED module packaging method and an LED module.
Background
With the continuous development of the light emitting diode display industry, the light emitting diode device is changed from the original DIP structure to the chip structure at a high speed, the light emitting device with the chip structure has the advantages of light weight, smaller size, automatic installation, large light emitting angle, uniform color, less attenuation and the like, and is more and more accepted by people; if the mechanical strength, reliability, moisture resistance, impact resistance, temperature change resistance, weather resistance and global planarization of the product are to be improved under the condition of not changing the overall structure of the product, the product cannot crack, deform and yellow under different climatic conditions, and particularly, a small-spacing high-density light-emitting diode display screen has no better solution in the industry at present.
In the existing manufacturing of light emitting diode display modules or display screens, products adopting a PLCC4 structure or IMD (in-mold decoration) structure (such as 3528,2121,1010, 4-in-1 and other specifications) are mounted on a circuit board through SMT (surface mount technology), the products are single bodies independently exist on the circuit board, gaps exist among the products, the large gap is dozens of millimeters, and the small gap is a few tenths of millimeters; when the device is used for pasting, due to the fact that a product with a PLCC4 or IMD structure is at a high temperature (the temperature is higher than 200 ℃), the device is composed of different materials, the thermal expansion and the cold contraction are different, gaps are easily formed among the materials, when a client uses the device, moisture in air can easily permeate into the light-emitting diode through the gaps, and when water vapor entering the light-emitting diode is used at the later stage, the moisture can damage the internal structure of the light-emitting diode, the problems of colloid burst, delamination, silver colloid separation, short circuit of a positive electrode and a negative electrode, electrochemical reaction and the like occur, the serious problems of non-luminescence, series brightness, uneven brightness, short circuit, fire and the like are directly presented, and particularly the serious problems are more obvious in humid seasons.
After the light-emitting diodes are attached to the circuit board and assembled into the LED display screen, gaps exist among the single light sources, so that the problems of dust accumulation, moisture accumulation, sweat accumulation and pollution after being touched by hands and the like are more likely to occur, and particularly, after the light-emitting diodes are accumulated for a certain time, the influence on the product is fatal; and is prone to safety issues (metal pins are exposed to the outside).
In addition, at the present stage, the commercial display intelligent terminal which is provided with the LED and can be touched in a close range is more focused on man-machine interaction, like a single light-emitting component, the surface with the unevenness is not suitable for man-machine interaction, and a circuit is exposed and has potential safety hazards.
The display screen composed of the light emitting diodes is used for performing the performance renting, the service environment of a client is very bad in mode and service time, lamp beads are easy to damage and knock off in the process of carrying and installation, the screen detached in rainy days can be directly placed into an aviation box after moisture is removed, the storage time of each time is different, the screen can be placed in a warehouse one month or stored in the warehouse for half a year, moisture in the air is accumulated and adsorbed, when the display screen is used next time, the temperature in the light emitting diodes reaches about 100 ℃ only by lighting the display screen, the moisture permeating into a lamp body is vaporized, and then huge stress is released, so that the internal structure of the light emitting diodes is damaged, and the defects such as glue explosion, delamination, wire breaking, short circuit and the like are overcome.
In order to solve the problem, some LED modules adopt the mode of product encapsulating to encapsulate, form the glue film in order to realize dampproofing and waterproofing through encapsulating on the circuit board that has LED lamp pearl. At present, a method for encapsulating an LED module by glue is to coat glue on a tiled release film/release paper, then clamp a circuit board with LED lamp beads by a clamp and press the circuit board on the glue downwards, then perform high temperature curing, and finally remove the release film/release paper.
In the packaging method, because the back surface (the surface back to the LED lamp beads) of the circuit board is provided with a large number of electronic elements, the circuit board is difficult to ensure the level when the circuit board is clamped by a clamp, and because the LED lamp beads and the electronic elements are distributed on the circuit board, the circuit board is easy to bend and deform under the action of gravity and cannot ensure the level, so that the intervals between the release film/the release paper and the circuit board are not uniform, namely the thickness of the formed adhesive layer is not uniform, and the product quality is influenced.
In addition, in the existing packaging method, epoxy resin or silica gel materials are generally adopted for packaging, and the epoxy resin or silica gel materials have various advantages, such as strong waterproof and moistureproof capabilities of the epoxy resin, but poor ultraviolet resistance, and severe yellowing phenomenon can be caused when the epoxy resin or the silica gel materials are irradiated under a 2000mW ultraviolet lamp for 72H; in addition, the stress is large, and severe quality damage is easily caused to products under high-temperature and low-temperature circulation; the problems of yellowing and stress can be solved by packaging with the silica gel material, but the oxygen permeability and the air permeability caused by the molecular structure of the silica gel are very poor, and water vapor can easily permeate into the silica gel material, so that the silica gel material cannot achieve the moisture-proof capability. In addition, regardless of the scheme of adopting the two materials, high-temperature curing is required after packaging, the curing time is long, and a large amount of harmful gas is released, so the defects of high cost, low production efficiency and the like exist, large-scale production cannot be realized, and the environment is easily polluted.
Disclosure of Invention
In order to solve at least one of the above technical problems in the prior art, an object of the present invention is to provide an LED module packaging method and an LED module.
In order to achieve the purpose, the invention adopts the following technical scheme:
an LED module packaging method comprises the following steps:
sequentially stacking a circuit board provided with LED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein the surface of the circuit board provided with the LED lamp beads faces the light-transmitting adhesive layer;
pressing the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain an LED module;
after the light-transmitting adhesive layer is solidified again, trimming the LED module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
In some embodiments, when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the circuit board, the light-transmitting adhesive layer and the light-transmitting film are sequentially stacked in the first fixing clamp from bottom to top, so that the surface of the circuit board, which is provided with the LED lamp beads, faces upwards;
when pressing, the first upper pressing die is used for pressing the light-transmitting film downwards.
In other embodiments, when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the light-transmitting film, the light-transmitting adhesive layer and the circuit board are sequentially stacked in the second fixing clamp from bottom to top, so that the surface of the circuit board, which is provided with the LED lamp beads, faces downwards;
when pressing, the second upper pressing die is used for pressing the circuit board downwards.
In the LED module packaging method, before pressure is applied, the fixing clamp and the workpiece are placed in a vacuum box, and the vacuum box is vacuumized.
In the LED module packaging method, patterns are pressed on the light-transmitting film during pressing, and/or the patterns are sprayed or printed on the light-transmitting film after the light-transmitting adhesive layer is solidified again.
In the LED module packaging method, when pressure is applied, the pressure is kept for a preset time; the preset time is 1-60 minutes.
The LED module packaging method further comprises the following steps:
and a glass layer or an acrylic layer is adhered to the upper surface of the light-transmitting film.
In the LED module packaging method, the glass layer is 3D glass.
The LED module packaging method further comprises the following steps:
and sticking a contrast enhancement adhesive film on the upper surface of the glass layer or the acrylic layer.
An LED module comprises a circuit board, a light-transmitting adhesive layer and a light-transmitting film, wherein the upper surface of the circuit board is provided with LED lamp beads, the light-transmitting adhesive layer covers the upper surface of the circuit board, and the light-transmitting film covers the upper surface of the light-transmitting adhesive layer; the melting point of the light-transmitting glue layer is lower than that of the light-transmitting film.
In the LED module, the light-transmitting glue layer is an elastomer with (C2H4) x. (C4H6O2) y as a base material.
In the LED module, the light-transmitting film is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film, C2F4 film, Pe film or PVC film.
In the LED module, the light-transmitting glue layer and/or the light-transmitting film contain a blue-light preventing agent;
and/or a blue light prevention layer is arranged between the light-transmitting adhesive layer and the light-transmitting film;
and/or the upper surface of the light-transmitting film is provided with a blue-light-proof layer.
The LED module also comprises a glass layer or an acrylic layer adhered to the upper surface of the light-transmitting film.
In the LED module, the glass layer is 3D glass.
The LED module further comprises a contrast enhancement adhesive film covering the upper surface of the glass layer or the acrylic layer.
Has the advantages that:
according to the LED module packaging method and the LED module, the circuit board, the solid light-transmitting adhesive layer and the light-transmitting film are stacked, then the light-transmitting adhesive layer is melted at high temperature and downward pressure is applied to press the circuit board, the light-transmitting adhesive layer and the light-transmitting film, so that the LED module is obtained, and the LED module packaging method has the following advantages:
1. the thickness of the glue layer can be ensured to be uniform at all positions;
2. compared with the prior art, the control of the thickness of the glue layer is more convenient, and the process is simpler;
3. after packaging, the subsequent processing can be carried out only by cooling and solidifying the light-transmitting adhesive layer, and compared with the prior art in which high-temperature solidification needs to be carried out for a long time, the required time is less, the energy consumption is less, so that the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize;
4. compared with the mode of using glue to make the glue layer in the prior art, the solid light-transmitting glue layer is heated to be molten and then pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly.
Drawings
Fig. 1 is a flowchart of an LED module packaging method according to an embodiment of the present invention.
Fig. 2 is a flowchart of another LED module packaging method according to an embodiment of the present invention.
Fig. 3 is a flowchart of a third method for packaging an LED module according to an embodiment of the present invention.
Fig. 4 is a schematic structural view of the first fixing jig.
Fig. 5 is a flowchart of an LED module packaging method according to a second embodiment of the present invention.
Fig. 6 is a flowchart of another LED module packaging method according to a second embodiment of the present invention.
Fig. 7 is a flowchart of a third method for packaging an LED module according to the second embodiment of the present invention.
Fig. 8 is a schematic structural view of a second fixing jig.
Fig. 9 is a flowchart of an LED module packaging method provided by the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.
Referring to fig. 9, in the LED module packaging method provided by the present invention, a circuit board with LED beads, a solid light-transmitting adhesive layer, and a light-transmitting film are sequentially stacked, wherein the surface of the circuit board with the LED beads faces the light-transmitting adhesive layer; pressing the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain an LED module; after the light-transmitting adhesive layer is solidified again, trimming the LED module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
The LED module is obtained by the packaging method, the uniformity of the thickness of the glue layer can be ensured, the control of the thickness of the glue layer is more convenient, the process is simpler, and the subsequent processing and production efficiency is higher and the cost is lower only by cooling and solidifying the light-transmitting glue layer after packaging.
The following is a detailed description of the method for packaging the two-pair LED module according to the first embodiment and the second embodiment.
Example one
The method for packaging the LED module provided by the embodiment comprises the following steps:
sequentially stacking a circuit board 2 provided with LED lamp beads 2.2, a solid light-transmitting adhesive layer 3 and a light-transmitting film 4, wherein the surface of the circuit board 2 provided with the LED lamp beads 2.2 faces the light-transmitting adhesive layer 3;
pressing the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 which are stacked in a preset temperature environment to obtain an LED module;
after the light-transmitting adhesive layer 3 is re-solidified (cooled to be lower than the melting point, the light-transmitting adhesive layer is re-solidified), trimming the LED module according to the product requirement;
the melting point of the light-transmitting film 4 is higher than that of the light-transmitting glue layer 3;
the preset temperature is higher than the melting point of the light-transmitting glue layer 3 and lower than the melting point of the light-transmitting film 4.
Further, as shown in fig. 1 and 4, when the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are stacked, the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are sequentially stacked in the first fixing clamp 1 from bottom to top, so that the surface of the circuit board, on which the LED lamp beads are mounted, faces upwards;
when pressing, the light transmissive film 4 is pressed downward by the first upper stamper 5.
The principle of the method is as follows: the circuit board 2 is kept horizontal through the action of the first fixing clamp 1, the solid light-transmitting adhesive layer 3 is in a molten state at a preset temperature, the light-transmitting film 4 is still in a solid state at the moment, and when the first upper pressing die presses the light-transmitting film 4 downwards, the molten light-transmitting adhesive layer 3 can be pressed into gaps among the LED lamp beads to completely cover the upper surface of the circuit board 2; after the LED module is taken out, the LED module can be trimmed after the light-transmitting adhesive layer 3 is cooled and returns to a solid state, so that the LED module meets the size requirement.
The circuit board 2 is kept horizontal in the pressure applying process, so that the thickness of the glue layer can be ensured to be uniform at all positions; compared with the mode of forming a glue layer by coating glue (the thickness precision of the glue layer is difficult to ensure) in the prior art, the glue layer with the corresponding thickness can be obtained by processing the light-transmitting glue layer 3 into the required size when the light-transmitting glue layer is solid, the control of the thickness of the glue layer is more convenient, and the process is simpler; after packaging, the subsequent processing can be carried out only by cooling the transparent adhesive layer (because the transparent adhesive layer can be changed into a solid state again as long as the temperature is reduced below the melting point), compared with the prior art that high-temperature curing is carried out for a long time, the required time is less, the energy consumption is less, the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize; compared with the mode of using glue to make the glue layer in the prior art, the solid light-transmitting glue layer is heated to be molten and then pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly.
The preset temperature may be set according to specific materials of the light transmissive adhesive layer 3 and the light transmissive film 4, for example, when the light transmissive adhesive layer 3 is an elastomer based on (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short), and the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film, C2F4 film, Pe film or PVC film, the preset temperature may be set to 40 ℃ to 250 ℃.
The first fixing clamp 1 is structurally shown in fig. 4, the top of the first fixing clamp is provided with a first positioning groove 1.1 matched with the circuit board 2, and the bottom of the first positioning groove 1.1 is provided with a first avoiding hole/first avoiding groove 1.2 for the component 2.1 of the circuit board to extend into. After the circuit board 2 is placed into the first positioning groove 1.1, the bottom of the circuit board 2 is supported by the bottom of the first positioning groove 1.1, and the first avoidance hole/the first avoidance groove 1.2 into which the component 2.1 extends is formed, so that the circuit board 2 can be kept horizontal, and bending or inclination is avoided.
The depth of the first positioning groove 1.1 can be greater than, less than or equal to the thickness of the circuit board 2, as required.
In some preferred embodiments, the depth of the first positioning groove 1.1 is greater than the thickness of the circuit board 2. After the circuit board 2 is placed into the first positioning groove 1.1, the upper part of the first positioning groove 1.1 can be used as an accommodating space of the light-transmitting adhesive layer 3, so that the light-transmitting adhesive layer 3 which is molten during pressurization is prevented from being extruded from the side edge, and the light-transmitting adhesive layer 3 can be fully filled in gaps between the LED lamp beads.
In some embodiments, the light-transmissive film 4 is larger than the first positioning groove 1.1, and when the light-transmissive film 4 is laid on the light-transmissive adhesive layer 3, the whole edge of the light-transmissive film 4 is positioned outside the notch of the first positioning groove 1.1 (as shown in fig. 4); because the light-transmitting film 4 covers the whole notch of the first positioning groove 1.1, the phenomenon that the light-transmitting adhesive layer 3 which is molten during pressurization is extruded can be further avoided, and therefore the gap between the LED lamp beads can be fully filled by the light-transmitting adhesive layer 3. At this time, trimming the LED module includes cutting the transparent film 4. And because the size of the light-transmitting film 4 is larger, accurate positioning is not needed when the light-transmitting film is laid, and the process is simpler.
In some preferred embodiments, before the first upper die is used to press the transparent film 4 downwards, the first fixing jig 1 and the workpiece (the circuit board 2, the transparent adhesive layer 3 and the transparent film 4) are placed in a vacuum box, and the vacuum box is evacuated, and the flow of the method is shown in fig. 2. By evacuation, air between the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 can be evacuated, avoiding air bubbles in the glue layer formed at the end. In other embodiments, the first fixing jig 1 is previously placed/set in the vacuum chamber, and then the circuit board 2, the light-transmitting adhesive layer 3, and the light-transmitting film 4 are placed.
Further, during operation, after the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 are placed, the vacuum box can be heated to enable the internal temperature to reach the preset temperature.
Further, the first upper die 5 may be an upper die separately provided in a vacuum chamber and driven to move up and down by a cylinder, a motor, or the like; or a movable upper cover of the vacuum box, and the movable upper cover is driven to move up and down by air pressure, an air cylinder, a motor and the like.
When patterns need to be formed on the light-transmitting film 4, embossing can be arranged on the lower surface of the first upper die so as to press the patterns on the light-transmitting film 4; and/or spraying or printing patterns on the light-transmitting film 4 after the light-transmitting adhesive layer 3 is cooled (which can be carried out before or after trimming the LED module);
when the surface of the light-transmitting film 4 is required to be smooth and flat, the lower surface of the first upper pressing die is smooth and flat.
In some preferred embodiments, as shown in fig. 3, at the beginning, the method further comprises the steps of:
cleaning and drying the circuit board provided with the LED lamp beads;
so as to ensure the cleanness of the circuit board and avoid the influence of impurities adhered on the circuit board on the adhesive force between the light-transmitting glue layer 3 and the circuit board.
In some preferred embodiments, an adhesion promoter is applied to the side of the light-transmissive film 4 facing the light-transmissive glue layer 3 before the light-transmissive films are stacked, to improve adhesion between the light-transmissive film 4 and the light-transmissive glue layer 3.
It should be noted that, during the pressing, the pressing needs to be kept for a preset time to ensure the reliable adhesion among the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4; the predetermined time is generally 1 to 60 minutes.
In some preferred embodiments, the LED module packaging method further includes the steps of:
and a glass layer or acrylic layer is adhered to the upper surface (i.e. the surface back to the light-transmitting film 4) of the light-transmitting film.
In practical application, the texture of the light-transmitting adhesive layer 3 is softer, and after the light-transmitting adhesive layer is subjected to thermal expansion and cold contraction, shrinkage lines can be generated, the hardness of the light-transmitting film 4 is lower, and when the light-transmitting adhesive layer 3 generates the shrinkage lines, the light-transmitting film 4 can generate corresponding wrinkles together, so that the product quality is influenced. Here, through pasting glass layer or ya keli layer at printing opacity membrane upper surface, because glass or ya keli layer are harder, be difficult for the shrink, can make printing opacity membrane 4 unable corrugate after pasting with printing opacity membrane 4 to printing opacity membrane 4 can hold printing opacity glue film 3, makes printing opacity glue film 3 unable shrink line that forms, has guaranteed product quality. In addition, the glass layer or the acrylic layer is high in strength, wear-resistant and high in light transmittance, and can be directly used for teaching handwriting.
Among them, the glass layer is preferably 3D glass, but is not limited thereto.
In order to improve the limiting effect of the glass layer or the acrylic layer on the light-transmitting film 4, the glass layer or the acrylic layer can be adhered to the upper surface of the light-transmitting film 4 by using heat curing glue or light curing glue, the adhesive force is strong, so that the glass layer or the acrylic layer can reliably pull the light-transmitting film 4, and the light-transmitting film 4 is prevented from wrinkling.
The glass layer or the acrylic layer may be colorless or colored (black, gray, etc.), and may be transparent or translucent.
In some preferred embodiments, the LED module packaging method further includes the steps of:
and sticking a contrast enhancement adhesive film on the upper surface of the glass layer or the acrylic layer.
The contrast of the LED module can be improved by providing a contrast enhancement adhesive film, for example, the contrast enhancement adhesive film can be a contrast enhancement adhesive film CEF of 3M company, but is not limited thereto.
Example two
Compared with the first embodiment, the main difference of the present embodiment is that the stacking order of the circuit board, the transparent adhesive layer, and the transparent film is different, and the principle and advantages of the present embodiment are the same as those of the first embodiment.
The method for packaging the LED module provided by the embodiment comprises the following steps:
sequentially stacking a circuit board 2 provided with LED lamp beads 2.2, a solid light-transmitting adhesive layer 3 and a light-transmitting film 4, wherein the surface of the circuit board 2 provided with the LED lamp beads 2.2 faces the light-transmitting adhesive layer 3;
pressing the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 which are stacked in a preset temperature environment to obtain an LED module;
after the light-transmitting adhesive layer 3 is re-solidified (cooled to be lower than the melting point, the light-transmitting adhesive layer is re-solidified), trimming the LED module according to the product requirement;
the melting point of the light-transmitting film 4 is higher than that of the light-transmitting glue layer 3;
the preset temperature is higher than the melting point of the light-transmitting glue layer 3 and lower than the melting point of the light-transmitting film 4.
Further, as shown in fig. 5 and 8, when the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are stacked, the light-transmitting film 4, the light-transmitting adhesive layer 3 and the circuit board 2 are sequentially stacked in the second fixing clamp 6 from bottom to top, so that the surface of the circuit board 2, which is provided with the LED lamp beads 2.2, faces downwards;
when pressing, the circuit board 2 is pressed downward with the second upper die 7.
The preset temperature may be set according to specific materials of the light transmissive adhesive layer 3 and the light transmissive film 4, for example, when the light transmissive adhesive layer 3 is an elastomer based on (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short), and the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film, C2F4 film, Pe film or PVC film, the preset temperature may be set to 40 ℃ to 250 ℃.
The second fixing clamp is structurally shown in fig. 8, a second positioning groove 6.1 matched with the light-transmitting film 4 and the light-transmitting glue layer 3 is formed in the top of the second fixing clamp, and a second avoiding hole/a second avoiding groove 7.1 for the component 2.1 of the circuit board 2 to extend into is formed in the bottom of the second upper pressing die 7. Through setting up second and keeping away position hole/second and keeping away position groove 7.1, can guarantee that second goes up moulding-die 7 and directly contacts with the base plate of circuit board to guarantee that circuit board 2 keeps the level, avoid taking place crooked or slope.
The size of the substrate of the circuit board 2 can be smaller than, equal to or larger than the second positioning groove 6.1; if the size of the substrate of the circuit board 2 is larger than the second positioning slot 6.1, a third positioning slot 6.2 matched with the substrate of the circuit board 2 can be arranged at the upper side of the second positioning slot 6.1 to position the substrate.
In some preferred embodiments, the second fixing jig 6 and the workpiece (the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4) are placed in a vacuum box before the circuit board 2 is pressed downward by the second upper die 7, and the vacuum box is evacuated, and the flow of the method is shown in fig. 6. By evacuation, air between the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 can be evacuated, avoiding air bubbles in the glue layer formed at the end. In other embodiments, the second fixing jig 6 is previously placed/set in the vacuum chamber, and then the circuit board 2, the light-transmitting adhesive layer 3, and the light-transmitting film 4 are placed.
Further, during operation, after the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 are placed, the vacuum box can be heated to enable the internal temperature to reach the preset temperature.
Further, the second upper die 7 may be a second upper die 7 separately provided in a vacuum chamber and driven to move up and down by a cylinder, a motor, or the like; or a movable upper cover of the vacuum box, and the movable upper cover is driven to move up and down by air pressure, an air cylinder, a motor and the like.
When patterns need to be formed on the light-transmitting film 4, embossing can be arranged at the bottom of the second positioning groove 6.1 so as to press the patterns on the light-transmitting film 4; and/or spraying or printing patterns on the light-transmitting film 4 after the light-transmitting adhesive layer 3 is cooled and solidified (which can be carried out before or after trimming the LED module);
when the surface of the light-transmitting film 4 is required to be smooth and flat, the bottom of the second positioning groove 6.1 is smooth and flat.
In some preferred embodiments, as shown in fig. 7, at the beginning, the method further comprises the steps of:
cleaning and drying the circuit board 2 provided with the LED lamp beads 2.2;
so as to ensure the cleanness of the circuit board and avoid the influence of impurities adhered on the circuit board on the adhesive force between the light-transmitting glue layer 3 and the circuit board.
In some preferred embodiments, an adhesion promoter is applied to the side of the light-transmissive film 4 facing the light-transmissive glue layer 3 before the light-transmissive film 4 is stacked, to improve the adhesion between the light-transmissive film 4 and the light-transmissive glue layer 3.
It should be noted that, during the pressing, the pressing needs to be kept for a preset time to ensure the reliable adhesion among the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4; the predetermined time is generally 1 to 60 minutes.
In some preferred embodiments, the LED module packaging method further includes the steps of:
and a glass layer or acrylic layer is adhered to the upper surface (i.e. the surface back to the light-transmitting film 4) of the light-transmitting film.
In practical application, the texture of the light-transmitting adhesive layer 3 is softer, and after the light-transmitting adhesive layer is subjected to thermal expansion and cold contraction, shrinkage lines can be generated, the hardness of the light-transmitting film 4 is lower, and when the light-transmitting adhesive layer 3 generates the shrinkage lines, the light-transmitting film 4 can generate corresponding wrinkles together, so that the product quality is influenced. Here, through pasting glass layer or ya keli layer at printing opacity membrane upper surface, because glass or ya keli layer are harder, be difficult for the shrink, can make printing opacity membrane 4 unable corrugate after pasting with printing opacity membrane 4 to printing opacity membrane 4 can hold printing opacity glue film 3, makes printing opacity glue film 3 unable shrink line that forms, has guaranteed product quality. In addition, the glass layer or the acrylic layer is high in strength, wear-resistant and high in light transmittance, and can be directly used for teaching handwriting.
Among them, the glass layer is preferably 3D glass, but is not limited thereto.
In order to improve the limiting effect of the glass layer or the acrylic layer on the light-transmitting film 4, the glass layer or the acrylic layer can be adhered to the upper surface of the light-transmitting film 4 by using heat curing glue or light curing glue, the adhesive force is strong, so that the glass layer or the acrylic layer can reliably pull the light-transmitting film 4, and the light-transmitting film 4 is prevented from wrinkling.
The glass layer or the acrylic layer may be colorless or colored (black, gray, etc.), and may be transparent or translucent.
In some preferred embodiments, the LED module packaging method further includes the steps of:
and sticking a contrast enhancement adhesive film on the upper surface of the glass layer or the acrylic layer.
The contrast of the LED module can be improved by providing a contrast enhancement adhesive film, for example, the contrast enhancement adhesive film can be a contrast enhancement adhesive film CEF of 3M company, but is not limited thereto.
Referring to fig. 4 and 8, the invention further provides an LED module, which includes a circuit board 2 with LED lamp beads 2.2 mounted on the upper surface, a light-transmitting adhesive layer 3 covering the upper surface of the circuit board, and a light-transmitting film 4 covering the upper surface of the light-transmitting adhesive layer 3; the melting point of the light-transmitting glue layer 3 is lower than that of the light-transmitting film 4. The circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 can be packaged together by the LED module packaging method.
The base material of the circuit board can be but is not limited to a PCB (printed Circuit Board), a glass plate, a sapphire plate, a plastic plate, PET (polyethylene terephthalate), an FPC (Flexible printed Circuit) board and the like, and a circuit can be printed or sprayed on the base and LED (light-emitting diode) lamp beads and other components are mounted on the base so as to obtain the circuit board.
In some embodiments, the light-transmissive adhesive layer 3 is an elastomer with (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short) as a base material, and the light-transmissive adhesive layer 3 may be colorless or colored, and may be transparent or translucent. The high-temperature-resistant and high-temperature-resistant composite material has good elasticity in a solid state, generates small stress under high-temperature and low-temperature circulation, is not easy to separate from the circuit board 2 and fall off due to temperature change, and has better weather resistance. If the glue layer is colored, materials with corresponding colors can be added into the base material.
The light-transmitting film 4 is transparent as required.
In some embodiments, the light-transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film, C2F4 film, Pe film, or PVC film, but is not limited thereto, and the light-transmissive film 4 may be colorless or colored (red, green, blue, black, etc.), may be transparent or translucent, and may be surface-reflective or surface-non-reflective. The light transmissive film may also be textured or non-textured.
If the light-transmitting film 4 is colored, materials with corresponding colors can be added into the film, or a coating is formed on the surface of the film in a coating, spraying, pressing and other modes; if the surface is required to be reflective or not reflective, a reflective or non-reflective coating can be formed on the surface of the film in a coating, spray painting, pressing and other modes; if patterns are required, embossing can be arranged on the lower surface of the first upper pressing die or the bottom of the second positioning groove 6.1 during packaging so as to press the patterns on the light-transmitting film 4; and/or spraying or printing patterns on the light-transmitting film 4 after the light-transmitting glue layer 3 is cooled and solidified.
In order to make the LED module have blue light prevention performance, a blue light prevention agent (which is available in the prior art and can be purchased directly from the market) may be contained in the transparent adhesive layer 3 and/or the transparent film 4;
and/or a blue light prevention layer is arranged between the light-transmitting glue layer 3 and the light-transmitting film 4; the blue light prevention layer can be adhered to the upper surface of the light-transmitting glue layer 3 or the lower surface of the light-transmitting film 4 in advance in an adhering or coating mode or a single prefabricated blue light prevention layer is formed, and the blue light prevention layer (two surfaces of the blue light prevention layer need to be coated with glue) is paved on the light-transmitting glue layer 3 in the packaging process, and then the light-transmitting film 4 is paved, so that the blue light prevention layer and the light-transmitting film are pressed together;
and/or the upper surface of the light-transmitting film 4 is provided with a blue-light-proof layer; the blue light prevention layer can be adhered to the upper surface of the light transmission film 4 in advance through adhesion or coating, or the blue light prevention layer can be adhered to the light transmission film 4 through adhesion or coating after the light transmission adhesive layer 3 is cooled and solidified during packaging (which can be performed before or after trimming the LED module).
In some preferred embodiments, the LED module further includes a glass layer or an acrylic layer adhered to the upper surface of the light-transmissive film 4.
Through at 4 upper surface pastes glass layer or ya keli layer of printing opacity membrane, because glass or ya keli layer are harder, be difficult for the shrink, can make printing opacity membrane 4 unable corrugate after pasting with printing opacity membrane 4 to printing opacity membrane 4 can hold printing opacity glue film 3, makes printing opacity glue film 3 unable shrink line that forms, has guaranteed product quality. In addition, the glass layer or the acrylic layer is high in strength, wear-resistant and high in light transmittance, and can be directly used for teaching handwriting.
Among them, the glass layer is preferably 3D glass, but is not limited thereto.
In order to improve the limiting effect of the glass layer or the acrylic layer on the light-transmitting film 4, the glass layer can be adhered to the upper surface of the light-transmitting film 4 by using heat curing glue or light curing glue, the adhesive force is strong, so that the glass layer or the acrylic layer can reliably pull the light-transmitting film 4, and the light-transmitting film 4 is prevented from wrinkling.
The glass layer or the acrylic layer may be colorless or colored (black, gray, etc.), and may be transparent or translucent.
In some preferred embodiments, the LED module further comprises a contrast enhancement adhesive film covering the upper surface of the glass layer or the acrylic layer.
The contrast of the LED module can be improved by providing a contrast enhancement adhesive film, for example, the contrast enhancement adhesive film can be a contrast enhancement adhesive film CEF of 3M company, but is not limited thereto.
Therefore, the LED module packaging method and the LED module have the advantages that the circuit board, the solid light-transmitting adhesive layer and the light-transmitting film are stacked, the light-transmitting adhesive layer is melted at high temperature, and downward pressure is applied to the circuit board, the light-transmitting adhesive layer and the light-transmitting film to press the circuit board, the light-transmitting adhesive layer and the light-transmitting film to obtain the LED module, and the LED module has the advantages that:
1. the thickness of the glue layer can be ensured to be uniform at all positions;
2. compared with the prior art, the control of the thickness of the glue layer is more convenient, and the process is simpler;
3. after packaging, the subsequent processing can be carried out only by cooling and solidifying the light-transmitting adhesive layer, and compared with the prior art in which high-temperature solidification needs to be carried out for a long time, the required time is less, the energy consumption is less, so that the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize;
4. compared with the mode of manufacturing the glue layer by using glue in the prior art, the solid light-transmitting glue layer is heated to be molten and then is pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly;
5. the formed adhesive layer is ensured to have no bubbles through vacuum pumping;
6. the transparent adhesive layer takes (C2H4) x (C4H6O2) y as a base material, the stress generated under high-temperature and low-temperature circulation is small, the transparent adhesive layer is not easy to separate from the circuit board due to temperature change and fall off, and the weather resistance is better;
7. the blue light emitted by the LED module can be reduced by adding the blue light preventing agent or the blue light preventing layer, so that the eye health of a user can be protected;
8. the glass layer or the acrylic layer is adhered to the upper surface of the light-transmitting film, so that shrinkage grains and wrinkling of the light-transmitting film can be effectively prevented from being generated on the light-transmitting glue layer, and the product quality is improved;
9. the contrast of the LED module can be improved by arranging the contrast enhancement adhesive film on the upper surface of the glass layer or the acrylic layer.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, which are substantially the same as the present invention.
Claims (16)
1. An LED module packaging method is characterized by comprising the following steps:
sequentially stacking a circuit board provided with LED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein the surface of the circuit board provided with the LED lamp beads faces the light-transmitting adhesive layer;
pressing the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain an LED module;
after the light-transmitting adhesive layer is solidified again, trimming the LED module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
2. The method for packaging an LED module according to claim 1, wherein when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the circuit board, the light-transmitting adhesive layer and the light-transmitting film are sequentially stacked in the first fixing jig from bottom to top, so that the surface of the circuit board, on which the LED lamp beads are mounted, faces upward;
when pressing, the first upper pressing die is used for pressing the light-transmitting film downwards.
3. The method for packaging an LED module according to claim 1, wherein when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the light-transmitting film, the light-transmitting adhesive layer and the circuit board are sequentially stacked in the second fixing jig from bottom to top, so that the surface of the circuit board, on which the LED lamp beads are mounted, faces downwards;
when pressing, the second upper pressing die is used for pressing the circuit board downwards.
4. The method for encapsulating the LED module according to any one of claims 1 to 3, wherein before the pressing, the fixing jig and the workpiece are placed in a vacuum chamber, and the vacuum chamber is evacuated.
5. The method for encapsulating an LED module according to any of claims 1 to 3, wherein the transparent film is embossed during the pressing, and/or the transparent adhesive layer is re-solidified and then the pattern is sprayed or printed on the transparent film.
6. The method for encapsulating the LED module according to any one of claims 1 to 3, wherein the applying of the pressure is maintained for a predetermined time; the preset time is 1-60 minutes.
7. The method for encapsulating the LED module according to any one of claims 1 to 3, further comprising the steps of:
and a glass layer or an acrylic layer is adhered to the upper surface of the light-transmitting film.
8. The method for encapsulating the LED module according to claim 7, wherein the glass layer is 3D glass.
9. The method for encapsulating the LED module according to claim 7, further comprising the steps of:
and sticking a contrast enhancement adhesive film on the upper surface of the glass layer or the acrylic layer.
10. An LED module is characterized by comprising a circuit board, a light-transmitting adhesive layer and a light-transmitting film, wherein the upper surface of the circuit board is provided with LED lamp beads, the light-transmitting adhesive layer covers the upper surface of the circuit board, and the light-transmitting film covers the upper surface of the light-transmitting adhesive layer; the melting point of the light-transmitting glue layer is lower than that of the light-transmitting film.
11. The LED module as claimed in claim 10, wherein the light-transmissive adhesive layer is an elastomer based on (C2H4) x. (C4H6O2) y.
12. The LED module according to claim 10, wherein the light-transmissive film is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film, C2F4 film, Pe film or PVC film.
13. The LED module of claim 10, wherein the light-transmissive glue layer and/or the light-transmissive film comprises a blue-light inhibitor;
and/or a blue light prevention layer is arranged between the light-transmitting adhesive layer and the light-transmitting film;
and/or the upper surface of the light-transmitting film is provided with a blue-light-proof layer.
14. The LED module of claim 10, further comprising a glass layer or acrylic layer adhered to the top surface of the light transmissive film.
15. The LED module of claim 14, wherein the glass layer is 3D glass.
16. The LED module of claim 14, further comprising a contrast-enhancing adhesive film covering the upper surface of the glass layer or the acrylic layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2020103522259 | 2020-04-28 | ||
| CN202010352225.9A CN111429816A (en) | 2020-04-28 | 2020-04-28 | L ED module packaging method and L ED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112331091A true CN112331091A (en) | 2021-02-05 |
Family
ID=71554732
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010352225.9A Pending CN111429816A (en) | 2020-04-28 | 2020-04-28 | L ED module packaging method and L ED module |
| CN202011487413.9A Pending CN112331091A (en) | 2020-04-28 | 2020-12-16 | LED module packaging method and LED module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010352225.9A Pending CN111429816A (en) | 2020-04-28 | 2020-04-28 | L ED module packaging method and L ED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN111429816A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112951808A (en) * | 2021-03-25 | 2021-06-11 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112820817A (en) * | 2020-12-31 | 2021-05-18 | 深圳全息界科技有限公司 | Small-spacing LED module packaging process |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201946238U (en) * | 2010-07-30 | 2011-08-24 | 北京韦侨顺科贸有限公司 | LED lattice display panel |
| WO2014167458A1 (en) * | 2013-04-08 | 2014-10-16 | Koninklijke Philips N.V. | Led with high thermal conductivity particles in phosphor conversion layer and the method of fabricating the same |
| CN203941668U (en) * | 2014-06-13 | 2014-11-12 | 深圳金丽豪科技有限公司 | A kind of LED module displays plate |
| CN203966485U (en) * | 2014-07-18 | 2014-11-26 | 黄加安 | A kind of new-type display screen structure |
| CN105206734A (en) * | 2015-09-09 | 2015-12-30 | 梁高华 | LED support and manufacturing method thereof |
| CN107633777A (en) * | 2017-10-12 | 2018-01-26 | 深圳市创显光电有限公司 | A kind of led display devices and its manufacture method |
| CN207282092U (en) * | 2017-10-12 | 2018-04-27 | 深圳市创显光电有限公司 | A kind of led display devices |
| CN108074499A (en) * | 2017-12-27 | 2018-05-25 | 周卫江 | A kind of LED module and its method for packing |
| CN207458485U (en) * | 2017-11-10 | 2018-06-05 | 深圳市创显光电有限公司 | A kind of solid LED display module |
| CN108133670A (en) * | 2017-11-27 | 2018-06-08 | 长春希达电子技术有限公司 | Integration packaging LED display module packaging method and LED display module |
| CN108417699A (en) * | 2018-05-18 | 2018-08-17 | 深圳市德彩光电有限公司 | The plastic package die of LED light source |
| CN108777118A (en) * | 2018-07-06 | 2018-11-09 | 深圳市艾森视讯科技有限公司 | A kind of LED display modules and mosaic display screen |
| CN108807649A (en) * | 2018-06-13 | 2018-11-13 | 深圳市德彩光电有限公司 | A kind of LED light source plastic package method |
| CN110068880A (en) * | 2019-04-28 | 2019-07-30 | 深圳市洲明科技股份有限公司 | Display screen and preparation method thereof |
| CN110230025A (en) * | 2019-06-13 | 2019-09-13 | 武汉理工大学 | A kind of preparation method of aluminium alloy casting die composite coating |
| CN110867507A (en) * | 2018-08-28 | 2020-03-06 | 隆达电子股份有限公司 | Light emitting device and backlight module |
-
2020
- 2020-04-28 CN CN202010352225.9A patent/CN111429816A/en active Pending
- 2020-12-16 CN CN202011487413.9A patent/CN112331091A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201946238U (en) * | 2010-07-30 | 2011-08-24 | 北京韦侨顺科贸有限公司 | LED lattice display panel |
| WO2014167458A1 (en) * | 2013-04-08 | 2014-10-16 | Koninklijke Philips N.V. | Led with high thermal conductivity particles in phosphor conversion layer and the method of fabricating the same |
| CN203941668U (en) * | 2014-06-13 | 2014-11-12 | 深圳金丽豪科技有限公司 | A kind of LED module displays plate |
| CN203966485U (en) * | 2014-07-18 | 2014-11-26 | 黄加安 | A kind of new-type display screen structure |
| CN105206734A (en) * | 2015-09-09 | 2015-12-30 | 梁高华 | LED support and manufacturing method thereof |
| CN107633777A (en) * | 2017-10-12 | 2018-01-26 | 深圳市创显光电有限公司 | A kind of led display devices and its manufacture method |
| CN207282092U (en) * | 2017-10-12 | 2018-04-27 | 深圳市创显光电有限公司 | A kind of led display devices |
| CN207458485U (en) * | 2017-11-10 | 2018-06-05 | 深圳市创显光电有限公司 | A kind of solid LED display module |
| CN108133670A (en) * | 2017-11-27 | 2018-06-08 | 长春希达电子技术有限公司 | Integration packaging LED display module packaging method and LED display module |
| CN108074499A (en) * | 2017-12-27 | 2018-05-25 | 周卫江 | A kind of LED module and its method for packing |
| CN108417699A (en) * | 2018-05-18 | 2018-08-17 | 深圳市德彩光电有限公司 | The plastic package die of LED light source |
| CN108807649A (en) * | 2018-06-13 | 2018-11-13 | 深圳市德彩光电有限公司 | A kind of LED light source plastic package method |
| CN108777118A (en) * | 2018-07-06 | 2018-11-09 | 深圳市艾森视讯科技有限公司 | A kind of LED display modules and mosaic display screen |
| CN110867507A (en) * | 2018-08-28 | 2020-03-06 | 隆达电子股份有限公司 | Light emitting device and backlight module |
| CN110068880A (en) * | 2019-04-28 | 2019-07-30 | 深圳市洲明科技股份有限公司 | Display screen and preparation method thereof |
| CN110230025A (en) * | 2019-06-13 | 2019-09-13 | 武汉理工大学 | A kind of preparation method of aluminium alloy casting die composite coating |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112951808A (en) * | 2021-03-25 | 2021-06-11 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
| CN112951808B (en) * | 2021-03-25 | 2022-12-30 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111429816A (en) | 2020-07-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111312702A (en) | Production process of film-coated LED display module and film-coated LED display module | |
| CN111430344A (en) | COB display module and packaging method thereof | |
| CN109841165B (en) | Small-spacing LED display module and manufacturing method thereof | |
| TWI393241B (en) | Lighting device, display, and method for manufacturing the same | |
| US6638780B2 (en) | Method for manufacturing light emitting diode devices | |
| CN112331091A (en) | LED module packaging method and LED module | |
| CN104024050A (en) | Light-up window for a vehicle | |
| CN107068902B (en) | A kind of display device | |
| CN103915473A (en) | Flexible display panel composite protecting film, and manufacturing method and stripping method thereof | |
| TWI719823B (en) | On-board packaging display element and manufacturing method thereof | |
| KR20110048588A (en) | Conversion film and preparation method thereof | |
| CN110808244A (en) | LED display unit surface packaging method based on modeling technology | |
| CN111682094B (en) | LED light-emitting back plate and production method thereof | |
| CN109177008B (en) | Glue filling method | |
| US20200335482A1 (en) | System and method for chip-on-board light emitting diode | |
| CN112820817A (en) | Small-spacing LED module packaging process | |
| JP2024019355A (en) | Release film integrated type sealing material for self-luminous type display body | |
| CN101924192B (en) | Organic light-emitting diode packaging structure and manufacturing method thereof | |
| CN102537753B (en) | Reflection diaphragm and manufacture method thereof and former | |
| CN104933972A (en) | Ultrathin interactive logo for household electrical appliance and manufacturing method for same | |
| CN219123261U (en) | LED display module and LED display screen | |
| CN116013912A (en) | Display module packaging method and display module | |
| CN111081900A (en) | Silicon-based OLED display panel attaching method | |
| CN109786575A (en) | Organic encapsulation layer, the forming method of display base plate, display base plate, display device | |
| CN100521268C (en) | Package member and manufacturing method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210205 |
|
| RJ01 | Rejection of invention patent application after publication |