CN111312702A - Production process of film-coated LED display module and film-coated LED display module - Google Patents
Production process of film-coated LED display module and film-coated LED display module Download PDFInfo
- Publication number
- CN111312702A CN111312702A CN202010351081.5A CN202010351081A CN111312702A CN 111312702 A CN111312702 A CN 111312702A CN 202010351081 A CN202010351081 A CN 202010351081A CN 111312702 A CN111312702 A CN 111312702A
- Authority
- CN
- China
- Prior art keywords
- light
- film
- transmitting
- circuit board
- display module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000012790 adhesive layer Substances 0.000 claims abstract description 95
- 239000003292 glue Substances 0.000 claims abstract description 87
- 239000010410 layer Substances 0.000 claims abstract description 78
- 238000003825 pressing Methods 0.000 claims abstract description 35
- 239000011324 bead Substances 0.000 claims abstract description 30
- 238000002844 melting Methods 0.000 claims abstract description 26
- 230000008018 melting Effects 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 239000007787 solid Substances 0.000 claims abstract description 16
- 230000008569 process Effects 0.000 claims abstract description 11
- 238000009966 trimming Methods 0.000 claims abstract description 9
- 230000002265 prevention Effects 0.000 claims description 12
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 5
- 239000000806 elastomer Substances 0.000 claims description 5
- 239000003112 inhibitor Substances 0.000 claims 1
- 238000001723 curing Methods 0.000 description 24
- 239000000463 material Substances 0.000 description 18
- 239000000047 product Substances 0.000 description 15
- 238000004806 packaging method and process Methods 0.000 description 9
- 238000007639 printing Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- 238000007711 solidification Methods 0.000 description 5
- 230000008023 solidification Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000011031 large-scale manufacturing process Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 238000005265 energy consumption Methods 0.000 description 3
- 210000002489 tectorial membrane Anatomy 0.000 description 3
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007592 spray painting technique Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a production process of a film-coated LED display module and the film-coated LED display module; the process comprises the following steps: sequentially stacking a circuit board provided with LED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein the light-transmitting adhesive layer contains light-curing adhesive; applying pressure under a preset temperature environment to obtain a film-coated LED display module; after the film-coated LED display module is irradiated and cured, trimming the film-coated LED display module according to the product requirement; the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer; the preset temperature is higher than the melting point of the light-transmitting adhesive layer and lower than the melting point of the light-transmitting film; the film-coated LED display module comprises a circuit board, a light-transmitting glue layer and a light-transmitting film, wherein the melting point of the light-transmitting glue layer is lower than that of the light-transmitting film; the light-transmitting adhesive layer contains light-curing adhesive, and/or two surfaces of the light-transmitting adhesive layer are coated with the light-curing adhesive; the process and the display module can ensure that the thickness of the formed glue layer is uniform, and the process is simple, high in production efficiency, low in cost and environment-friendly.
Description
Technical Field
The invention relates to the technical field of display modules, in particular to a film-coated LED display module and a production process thereof.
Background
With the continuous development of the light emitting diode display industry, the light emitting diode device is changed from the original DIP structure to the chip structure at a high speed, the light emitting device with the chip structure has the advantages of light weight, smaller size, automatic installation, large light emitting angle, uniform color, less attenuation and the like, and is more and more accepted by people; if the mechanical strength, reliability, moisture resistance, impact resistance, temperature change resistance, weather resistance and global planarization of the product are to be improved under the condition of not changing the overall structure of the product, the product cannot crack, deform and yellow under different climatic conditions, and particularly, a small-spacing high-density light-emitting diode display screen has no better solution in the industry at present.
In the existing manufacturing of light emitting diode display modules or display screens, products adopting a PLCC4 structure or IMD (in-mold decoration) structure (such as 3528,2121,1010, 4-in-1 and other specifications) are mounted on a circuit board through SMT (surface mount technology), the products are single bodies independently exist on the circuit board, gaps exist among the products, the large gap is dozens of millimeters, and the small gap is a few tenths of millimeters; when the device is used for pasting, due to the fact that a product with a PLCC4 or IMD structure is at a high temperature (the temperature is higher than 200 ℃), the device is composed of different materials, the thermal expansion and the cold contraction are different, gaps are easily formed among the materials, when a client uses the device, moisture in air can easily permeate into the light-emitting diode through the gaps, and when water vapor entering the light-emitting diode is used at the later stage, the moisture can damage the internal structure of the light-emitting diode, the problems of colloid burst, delamination, silver colloid separation, short circuit of a positive electrode and a negative electrode, electrochemical reaction and the like occur, the serious problems of non-luminescence, series brightness, uneven brightness, short circuit, fire and the like are directly presented, and particularly the serious problems are more obvious in humid seasons.
After the light-emitting diodes are attached to the circuit board and assembled into the LED display screen, gaps exist among the single light sources, so that the problems of dust accumulation, moisture accumulation, sweat accumulation and pollution after being touched by hands and the like are more likely to occur, and particularly, after the light-emitting diodes are accumulated for a certain time, the influence on the product is fatal; and is prone to safety issues (metal pins are exposed to the outside).
In addition, at the present stage, the commercial display intelligent terminal which is provided with the LED and can be touched in a close range is more focused on man-machine interaction, like a single light-emitting component, the surface with the unevenness is not suitable for man-machine interaction, and a circuit is exposed and has potential safety hazards.
The display screen composed of the light emitting diodes is used for performing the performance renting, the service environment of a client is very bad in mode and service time, lamp beads are easy to damage and knock off in the process of carrying and installation, the screen detached in rainy days can be directly placed into an aviation box after moisture is removed, the storage time of each time is different, the screen can be placed in a warehouse one month or stored in the warehouse for half a year, moisture in the air is accumulated and adsorbed, when the display screen is used next time, the temperature in the light emitting diodes reaches about 100 ℃ only by lighting the display screen, the moisture permeating into a lamp body is vaporized, and then huge stress is released, so that the internal structure of the light emitting diodes is damaged, and the defects such as glue explosion, delamination, wire breaking, short circuit and the like are overcome.
In order to solve the problem, some LED modules adopt the mode of product encapsulating to encapsulate, form the glue film in order to realize dampproofing and waterproofing through encapsulating on the circuit board that has LED lamp pearl. At present, a method for encapsulating an LED module by glue is to coat glue on a tiled release film/release paper, then clamp a circuit board with LED lamp beads by a clamp and press the circuit board on the glue downwards, then perform high temperature curing, and finally remove the release film/release paper.
In the packaging method, because the back surface (the surface back to the LED lamp beads) of the circuit board is provided with a large number of electronic elements, the circuit board is difficult to ensure the level when the circuit board is clamped by a clamp, and because the LED lamp beads and the electronic elements are distributed on the circuit board, the circuit board is easy to bend and deform under the action of gravity and cannot ensure the level, so that the intervals between the release film/the release paper and the circuit board are not uniform, namely the thickness of the formed adhesive layer is not uniform, and the product quality is influenced.
In addition, in the existing packaging method, epoxy resin or silica gel materials are generally adopted for packaging, and the epoxy resin or silica gel materials have various advantages, such as strong waterproof and moistureproof capabilities of the epoxy resin, but poor ultraviolet resistance, and severe yellowing phenomenon can be caused when the epoxy resin or the silica gel materials are irradiated under a 2000mW ultraviolet lamp for 72H; in addition, the stress is large, and severe quality damage is easily caused to products under high-temperature and low-temperature circulation; the problems of yellowing and stress can be solved by packaging with the silica gel material, but the oxygen permeability and the air permeability caused by the molecular structure of the silica gel are very poor, and water vapor can easily permeate into the silica gel material, so that the silica gel material cannot achieve the moisture-proof capability. In addition, regardless of the scheme of adopting the two materials, high-temperature curing is required after packaging, the curing time is long, and a large amount of harmful gas is released, so the defects of high cost, low production efficiency and the like exist, large-scale production cannot be realized, and the environment is easily polluted. Therefore, the inventor of the application provides a production process, a circuit board, a solid light-transmitting adhesive layer and a light-transmitting film are sequentially stacked, wherein the melting point of the light-transmitting adhesive layer is lower than that of the light-transmitting film, when the light-transmitting adhesive layer is heated to be molten and the light-transmitting film is not molten, pressure is applied to press the light-transmitting adhesive layer, the solid light-transmitting adhesive layer and the light-transmitting film together, the light-transmitting adhesive layer and the light-transmitting film can be subjected to subsequent processing after being cooled to be solidified again, although long-time waiting for glue solidification is not needed, the.
Disclosure of Invention
In order to solve at least one technical problem in the prior art, the present invention provides a film-coated LED display module and a manufacturing method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
a production process of a film-covered LED display module comprises the following steps:
the LED lamp bead-mounted circuit board, the solid light-transmitting adhesive layer and the light-transmitting film are sequentially stacked, wherein one side of the circuit board, which is provided with the LED lamp beads, faces the light-transmitting adhesive layer;
applying pressure to the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain a film-coated LED display module;
after the film-coated LED display module is irradiated and cured, trimming the film-coated LED display module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
In some embodiments, when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the circuit board, the light-transmitting adhesive layer and the light-transmitting film are sequentially stacked in the first fixing clamp from bottom to top, so that the surface of the circuit board, which is provided with the LED lamp beads, faces upwards;
when pressing, the first upper pressing die is used for pressing the light-transmitting film downwards.
Furthermore, a first positioning groove matched with the circuit board is formed in the top of the first fixing clamp, and a first avoidance hole/first avoidance groove for the components of the circuit board to extend into is formed in the bottom of the first positioning groove.
In some embodiments, when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the light-transmitting film, the light-transmitting adhesive layer and the circuit board are sequentially stacked in the second fixing clamp from bottom to top, so that the surface of the circuit board, which is provided with the LED lamp beads, faces downwards;
when pressing, the second upper pressing die is used for pressing the circuit board downwards.
Furthermore, a second positioning groove matched with the light-transmitting film and the light-transmitting glue layer is formed in the top of the second fixing clamp, and a second avoidance hole/a second avoidance groove for the components of the circuit board to extend into is formed in the bottom of the second upper pressing die.
In the production process of the film-coated LED display module, before pressure is applied, the fixed clamp and the workpiece are placed in a vacuum box, and the vacuum box is vacuumized.
A film-coated LED display module comprises a circuit board, a light-transmitting adhesive layer and a light-transmitting film, wherein the upper surface of the circuit board is provided with LED lamp beads, the light-transmitting adhesive layer covers the upper surface of the circuit board, and the light-transmitting film covers the upper surface of the light-transmitting adhesive layer; the melting point of the light-transmitting glue layer is lower than that of the light-transmitting film; the light-transmitting adhesive layer contains light-curing adhesive and/or the two sides of the light-transmitting adhesive layer are coated with light-curing adhesive.
In the film-covered LED display module, the light-transmitting glue layer is an elastomer with (C2H4) x. (C4H6O2) y as a base material.
The film-covered LED display module according to claim 7, wherein the light-transmitting film is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film.
In the film-coated LED display module, the light-transmitting adhesive layer and/or the light-transmitting film contain a blue-light preventing agent;
and/or a blue light prevention layer is arranged between the light-transmitting adhesive layer and the light-transmitting film;
and/or the upper surface of the light-transmitting film is provided with a blue-light-proof layer.
Has the advantages that:
the invention provides a production process of a film-coated LED display module and the film-coated LED display module, which are characterized in that a circuit board, a solid light-transmitting adhesive layer and a light-transmitting film are stacked, then the light-transmitting adhesive layer is melted at high temperature and downwards pressed to press the circuit board, the light-transmitting adhesive layer and the light-transmitting film to obtain the film-coated LED display module, the curing of the light-transmitting adhesive layer is accelerated in a radiation curing mode, and finally, finishing is carried out, so that the film-coated LED display module has the following advantages:
1. the thickness of the glue layer can be ensured to be uniform at all positions;
2. compared with the prior art, the control of the thickness of the glue layer is more convenient, and the process is simpler;
3. the light-cured adhesive can be promoted to be cured by irradiation, and compared with the prior art that high-temperature curing or normal-temperature standing curing is required for a long time, the light-cured adhesive needs less time and less energy consumption, so that the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize; the production efficiency is higher than that of a mode of directly waiting for the cooling and solidification of the light-transmitting adhesive layer;
4. compared with the mode of using glue to make the glue layer in the prior art, the solid light-transmitting glue layer is heated to be molten and then pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly.
Drawings
Fig. 1 is a flowchart of a production process of a film-covered LED display module according to a first embodiment of the present invention.
Fig. 2 is a flowchart of another manufacturing process of a film-covered LED display module according to a first embodiment of the present invention.
Fig. 3 is a flowchart of a third manufacturing process of a film-covered LED display module according to a first embodiment of the present invention.
Fig. 4 is a schematic structural view of the first fixing jig.
Fig. 5 is a flowchart of a production process of a film-covered LED display module according to a second embodiment of the present invention.
Fig. 6 is a flowchart of another manufacturing process of a film-covered LED display module according to a second embodiment of the present invention.
Fig. 7 is a flowchart of a third manufacturing process of a film-covered LED display module according to a second embodiment of the present invention.
Fig. 8 is a schematic structural view of a second fixing jig.
Fig. 9 is a flow chart of a production process of the film-covered LED display module provided by the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.
Referring to fig. 9, the production process of the film-coated LED display module provided by the present invention comprises stacking a circuit board with LED beads, a solid light-transmitting adhesive layer, and a light-transmitting film in sequence, wherein the side of the circuit board with the LED beads faces the light-transmitting adhesive layer; applying pressure to the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain a film-coated LED display module; after the film-coated LED display module is irradiated and cured, trimming the film-coated LED display module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
The laminated LED display module is obtained through the production process, the uniformity of the thickness of the glue layer can be guaranteed, the control of the thickness of the glue layer is more convenient, the process is simpler, and the subsequent processing production efficiency is higher and the cost is lower by irradiating and curing after the lamination.
The following is a detailed description of the manufacturing process of the film-coated LED display module by the first embodiment and the second embodiment.
Example one
The production process of the film-coated LED display module provided by the embodiment comprises the following steps:
the LED lamp bead packaging structure comprises a circuit board 2 provided with LED lamp beads 2.2, a solid light-transmitting adhesive layer 3 and a light-transmitting film 4 which are sequentially stacked, wherein one side of the circuit board 2 provided with the LED lamp beads 2.2 faces the light-transmitting adhesive layer 3;
pressing the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 which are stacked in a preset temperature environment to obtain a film-coated LED display module;
after the film-coated LED display module is irradiated and cured, trimming the film-coated LED display module according to the product requirement;
the melting point of the light-transmitting film 4 is higher than that of the light-transmitting glue layer 3; the preset temperature is higher than the melting point of the light-transmitting glue layer 3 and lower than the melting point of the light-transmitting film 4.
Further, as shown in fig. 1 and 4, when the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are stacked, the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are sequentially stacked in the first fixing clamp 1 from bottom to top, so that the surface of the circuit board 2, which is provided with the LED lamp beads 2.2, faces upwards;
when pressing, the light transmissive film 4 is pressed downward by the first upper stamper 5.
The principle of the method is as follows: the circuit board 2 is kept horizontal through the action of the first fixing clamp 1, the solid light-transmitting adhesive layer 3 is in a molten state at a preset temperature, the light-transmitting film 4 is still in a solid state at the moment, and when the first upper pressing die presses the light-transmitting film 4 downwards, the molten light-transmitting adhesive layer 3 can be pressed into gaps among the LED lamp beads to completely cover the upper surface of the circuit board 2; after the film-coated LED display module is taken out, the light-cured adhesive is cured through irradiation, so that the light-transmitting adhesive layer 3 is rapidly cured, and the film-coated LED display module can be trimmed after curing, so that the film-coated LED display module meets the size requirement.
The circuit board 2 is kept horizontal in the pressure applying process, so that the thickness of the glue layer can be ensured to be uniform at all positions; compared with the mode of forming a glue layer by coating glue (the thickness precision of the glue layer is difficult to ensure) in the prior art, the glue layer with the corresponding thickness can be obtained by processing the light-transmitting glue layer 3 into the required size when the light-transmitting glue layer is solid, the control of the thickness of the glue layer is more convenient, and the process is simpler; the light-cured adhesive can be promoted to be cured through irradiation, and subsequent processing can be carried out, compared with the prior art that high-temperature curing or normal-temperature standing curing is required for a long time, the required time is less, the energy consumption is less, the production efficiency is higher, the cost is lower, and large-scale production is easier to realize (in fact, even if irradiation curing is not adopted, only the transparent adhesive layer 3 needs to be cooled to be lower than a melting point, the transparent adhesive layer 3 is re-solidified, the subsequent processing can be carried out, the required time is shorter than that of the prior art, and the required time is further shortened due to the use of irradiation curing); compared with the mode of using glue to make the glue layer in the prior art, the solid light-transmitting glue layer is heated to be molten and then pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly.
The light-curing glue can be UV light-curing glue, infrared light-curing glue, blue light-curing glue and the like, and correspondingly, a UV lamp, an infrared lamp, a blue light lamp and the like are adopted for irradiation when the irradiation is carried out.
The preset temperature may be set according to specific materials of the light transmissive adhesive layer 3 and the light transmissive film 4, for example, when the light transmissive adhesive layer 3 is an elastomer based on (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short), and the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film, the preset temperature may be set to 60 ℃ to 160 ℃.
The first fixing clamp 1 is structurally shown in fig. 4, the top of the first fixing clamp is provided with a first positioning groove 1.1 matched with the circuit board 2, and the bottom of the first positioning groove 1.1 is provided with a first avoiding hole/first avoiding groove 1.2 for the component 2.1 of the circuit board to extend into. After the circuit board 2 is placed into the first positioning groove 1.1, the bottom of the circuit board 2 is supported by the bottom of the first positioning groove 1.1, and the first avoidance hole/the first avoidance groove 1.2 into which the component 2.1 extends is formed, so that the circuit board 2 can be kept horizontal, and bending or inclination is avoided.
The depth of the first positioning groove 1.1 can be greater than, less than or equal to the thickness of the circuit board 2, as required.
In some preferred embodiments, the depth of the first positioning groove 1.1 is greater than the thickness of the circuit board 2. After the circuit board 2 is placed into the first positioning groove 1.1, the upper part of the first positioning groove 1.1 can be used as an accommodating space of the light-transmitting adhesive layer 3, so that the light-transmitting adhesive layer 3 which is molten during pressurization is prevented from being extruded from the side edge, and the light-transmitting adhesive layer 3 can be fully filled in gaps between the LED lamp beads.
In some embodiments, the light-transmissive film 4 is larger than the first positioning groove 1.1, and when the light-transmissive film 4 is laid on the light-transmissive adhesive layer 3, the whole edge of the light-transmissive film 4 is positioned outside the notch of the first positioning groove 1.1 (as shown in fig. 4); because the light-transmitting film 4 covers the whole notch of the first positioning groove 1.1, the phenomenon that the light-transmitting adhesive layer 3 which is molten during pressurization is extruded can be further avoided, and therefore the gap between the LED lamp beads can be fully filled by the light-transmitting adhesive layer 3. At this time, trimming the LED module includes cutting the transparent film 4. And because the size of the light-transmitting film 4 is larger, accurate positioning is not needed when the light-transmitting film is laid, and the process is simpler.
In some preferred embodiments, before the first upper die is used to press the transparent film 4 downwards, the first fixing jig 1 and the workpiece (the circuit board 2, the transparent adhesive layer 3 and the transparent film 4) are placed in a vacuum box, and the vacuum box is evacuated, and the flow of the method is shown in fig. 2. By evacuation, air between the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 can be evacuated, avoiding air bubbles in the glue layer formed at the end. In other embodiments, the first fixing jig 1 is previously placed/set in the vacuum chamber, and then the circuit board 2, the light-transmitting adhesive layer 3, and the light-transmitting film 4 are placed.
Further, during operation, after the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 are placed, the vacuum box can be heated to enable the internal temperature to reach the preset temperature.
Further, the first upper pressing die may be a first upper pressing die separately provided in the vacuum chamber and driven to move up and down by a cylinder, a motor, or the like; or a movable upper cover of the vacuum box, and the movable upper cover is driven to move up and down by air pressure, an air cylinder, a motor and the like.
When patterns need to be formed on the light-transmitting film 4, embossing can be arranged on the lower surface of the first upper die so as to press the patterns on the light-transmitting film 4; and/or spraying or printing patterns on the light-transmitting film 4 after the light-transmitting adhesive layer 3 is cooled (which can be carried out before or after trimming the film-covered LED display module);
when the surface of the light-transmitting film 4 is required to be smooth and flat, the lower surface of the first upper pressing die is smooth and flat.
In some preferred embodiments, as shown in fig. 3, at the beginning, the method further comprises the steps of:
cleaning and drying the circuit board provided with the LED lamp beads;
so as to ensure the cleanness of the circuit board and avoid the influence of impurities adhered on the circuit board on the adhesive force between the light-transmitting glue layer 3 and the circuit board.
In some preferred embodiments, before the light-transmitting film with a melting point higher than that of the glue layer is laid on the light-transmitting glue layer, an adhesion promoter is coated or an ionization surface treatment is performed on the side of the light-transmitting film 4 facing the light-transmitting glue layer 3 to improve the adhesion between the light-transmitting film 4 and the light-transmitting glue layer 3.
It should be noted that, when applying pressure, the pressure is kept for a preset time, and the specific preset time can be adjusted according to the actual pressing effect.
Example two
Compared with the first embodiment, the main difference of the present embodiment is that the placement order of the circuit board, the transparent adhesive layer, and the transparent film is different, and the principle and advantages of the present embodiment are the same as those of the first embodiment.
The production process of the film-coated LED display module provided by the embodiment comprises the following steps:
the LED lamp bead packaging structure comprises a circuit board 2 provided with LED lamp beads 2.2, a solid light-transmitting adhesive layer 3 and a light-transmitting film 4 which are sequentially stacked, wherein one side of the circuit board 2 provided with the LED lamp beads 2.2 faces the light-transmitting adhesive layer 3;
pressing the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 which are stacked in a preset temperature environment to obtain a film-coated LED display module;
after the film-coated LED display module is irradiated and cured, trimming the film-coated LED display module according to the product requirement;
the melting point of the light-transmitting film 4 is higher than that of the light-transmitting glue layer 3; the preset temperature is higher than the melting point of the light-transmitting glue layer 3 and lower than the melting point of the light-transmitting film 4.
Further, as shown in fig. 5 and 8, when the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are stacked, the light-transmitting film 4, the light-transmitting adhesive layer 3 and the circuit board 2 are sequentially stacked in the second fixing clamp 6 from bottom to top, so that the surface of the circuit board 2, which is provided with the LED lamp beads 2.2, faces downwards;
when pressing, the circuit board 2 is pressed downward with the second upper die 7.
The light-curing glue can be UV light-curing glue, infrared light-curing glue, blue light-curing glue and the like, and correspondingly, a UV lamp, an infrared lamp, a blue light lamp and the like are adopted for irradiation when the irradiation is carried out.
The preset temperature may be set according to specific materials of the light transmissive adhesive layer 3 and the light transmissive film 4, for example, when the light transmissive adhesive layer 3 is an elastomer based on (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short), and the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film, the preset temperature may be set to 60 ℃ to 160 ℃.
The second fixing clamp is structurally shown in fig. 8, a second positioning groove 6.1 matched with the light-transmitting film 4 and the light-transmitting glue layer 3 is formed in the top of the second fixing clamp, and a second avoiding hole/a second avoiding groove 7.1 for the component 2.1 of the circuit board to extend into is formed in the bottom of the second upper pressing die 7. Through setting up second and keeping away position hole/second and keeping away position groove 7.1, can guarantee that second goes up moulding-die 7 and directly contacts with the base plate of circuit board to guarantee that circuit board 2 keeps the level, avoid taking place crooked or slope.
The size of the substrate of the circuit board 2 can be smaller than, equal to or larger than the second positioning groove 6.1; if the size of the substrate of the circuit board 2 is larger than the second positioning slot 6.1, a third positioning slot 6.2 matched with the substrate of the circuit board 2 can be arranged at the upper side of the second positioning slot 6.1 to position the substrate.
In some preferred embodiments, the second fixing jig 6 and the workpiece (the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4) are placed in a vacuum box before the circuit board 2 is pressed downward by the second upper die 7, and the vacuum box is evacuated, and the flow of the method is shown in fig. 6. By evacuation, air between the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 can be evacuated, avoiding air bubbles in the glue layer formed at the end. In other embodiments, the second fixing jig 6 is previously placed/set in the vacuum chamber, and then the circuit board 2, the light-transmitting adhesive layer 3, and the light-transmitting film 4 are placed.
Further, during operation, after the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 are placed, the vacuum box can be heated to enable the internal temperature to reach the preset temperature.
Further, the second upper die 7 may be a second upper die 7 separately provided in a vacuum chamber and driven to move up and down by a cylinder, a motor, or the like; or a movable upper cover of the vacuum box, and the movable upper cover is driven to move up and down by air pressure, an air cylinder, a motor and the like.
When patterns need to be formed on the light-transmitting film 4, embossing can be arranged at the bottom of the second positioning groove 6.1 so as to press the patterns on the light-transmitting film 4; and/or spraying or printing patterns on the light-transmitting film 4 after the light-transmitting adhesive layer 3 is cooled (which can be carried out before or after trimming the film-covered LED display module);
when the surface of the light-transmitting film 4 is required to be smooth and flat, the bottom of the second positioning groove 6.1 is smooth and flat.
In some preferred embodiments, as shown in fig. 7, at the beginning, the method further comprises the steps of:
cleaning and drying the circuit board 2 provided with the LED lamp beads 2.2;
so as to ensure the cleanness of the circuit board and avoid the influence of impurities adhered on the circuit board on the adhesive force between the light-transmitting glue layer 3 and the circuit board.
In some preferred embodiments, before laying a piece of light-transmitting film 4 horizontally in the second fixing jig 6, an adhesion promoter is applied or an ionization surface treatment is performed on the side of the light-transmitting film 4 facing the light-transmitting adhesive layer 3 to improve the adhesion between the light-transmitting film 4 and the light-transmitting adhesive layer 3.
It should be noted that, when applying pressure, the pressure is kept for a preset time, and the specific preset time can be adjusted according to the actual pressing effect.
Referring to fig. 4 and 8, the invention further provides a film-coated LED display module, which includes a circuit board 2 with LED lamp beads on the upper surface, a light-transmitting adhesive layer 3 covering the upper surface of the circuit board, and a light-transmitting film 4 covering the upper surface of the light-transmitting adhesive layer 3; the melting point of the light-transmitting glue layer 3 is lower than that of the light-transmitting film 4; the light-transmitting adhesive layer 3 contains light-curing adhesive and/or the two sides of the light-transmitting adhesive layer are coated with light-curing adhesive. The circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 can be packaged together by adopting the production process of the film-coated LED display module.
The base material of the circuit board can be but is not limited to a PCB (printed Circuit Board), a glass plate, a sapphire plate, a plastic plate, PET (polyethylene terephthalate), an FPC (Flexible printed Circuit) board and the like, and a circuit can be printed or sprayed on the base and LED (light-emitting diode) lamp beads and other components are mounted on the base so as to obtain the circuit board.
In some embodiments, the light-transmissive adhesive layer 3 is an elastomer with (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short) as a base material, and the light-transmissive adhesive layer 3 may be colorless or colored, and may be transparent or translucent. The high-temperature-resistant and high-temperature-resistant composite material has good elasticity in a solid state, generates small stress under high-temperature and low-temperature circulation, is not easy to separate from the circuit board 2 and fall off due to temperature change, and has better weather resistance. If the glue layer is colored, materials with corresponding colors can be added into the base material.
The light-transmitting film 4 is transparent as required.
In some embodiments, the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film, and the light transmissive film 4 may be colorless or colored (red, green, blue, black, etc.), may be transparent or translucent, and may be surface reflective or surface non-reflective. The light transmissive film may also be textured or non-textured.
If the light-transmitting film 4 is colored, materials with corresponding colors can be added into the film, or a coating is formed on the surface of the film in a coating, spraying, pressing and other modes; if the surface is required to be reflective or not reflective, a reflective or non-reflective coating can be formed on the surface of the film in a coating, spray painting, pressing and other modes; if patterns are required, embossing can be arranged on the lower surface of the first upper pressing die or the bottom of the second positioning groove 6.1 during packaging so as to press the patterns on the light-transmitting film 4; and/or spraying or printing patterns on the light-transmitting film 4 after the light-transmitting glue layer 3 is cooled.
In order to make the LED module have blue light prevention performance, a blue light prevention agent (which is available in the prior art and can be purchased directly from the market) may be contained in the transparent adhesive layer 3 and/or the transparent film 4;
and/or a blue light prevention layer is arranged between the light-transmitting glue layer 3 and the light-transmitting film 4; the blue light prevention layer can be adhered to the upper surface of the light-transmitting glue layer 3 or the lower surface of the light-transmitting film 4 in advance in an adhering or coating mode or a single prefabricated blue light prevention layer is formed, and the blue light prevention layer (two surfaces of the blue light prevention layer need to be coated with glue) is paved on the light-transmitting glue layer 3 in the packaging process, and then the light-transmitting film 4 is paved, so that the blue light prevention layer and the light-transmitting film are pressed together;
and/or the upper surface of the light-transmitting film 4 is provided with a blue-light-proof layer; the blue light prevention layer can be adhered to the upper surface of the light transmission film 4 in advance through adhesion or coating, or the blue light prevention layer can be adhered to the light transmission film 4 through adhesion or coating after the light transmission adhesive layer 3 is cooled during packaging (which can be performed before or after the LED module is trimmed).
From the above, this tectorial membrane LED display module production technology and tectorial membrane LED display module, through making circuit board, solid-state printing opacity glue film and printing opacity membrane range upon range of the placing, then make printing opacity glue film melting and exert pressure downwards under high temperature and make circuit board, printing opacity glue film, printing opacity membrane pressfitting obtain tectorial membrane LED display module to through the solidification of the mode of irradiation solidification acceleration printing opacity glue film, maintain at last, have following advantage:
1. the thickness of the glue layer can be ensured to be uniform at all positions;
2. compared with the prior art, the control of the thickness of the glue layer is more convenient, and the process is simpler;
3. the light-cured adhesive can be promoted to be cured by irradiation, and compared with the prior art that high-temperature curing or normal-temperature standing curing is required for a long time, the light-cured adhesive needs less time and less energy consumption, so that the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize; the production efficiency is higher than that of a mode of directly waiting for the cooling and solidification of the light-transmitting adhesive layer;
4. compared with the mode of manufacturing the glue layer by using glue in the prior art, the solid light-transmitting glue layer is heated to be molten and then is pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly;
5. the formed adhesive layer is ensured to have no bubbles through vacuum pumping;
6. the transparent adhesive layer takes (C2H4) x (C4H6O2) y as a base material, the stress generated under high-temperature and low-temperature circulation is small, the transparent adhesive layer is not easy to separate from the circuit board due to temperature change and fall off, and the weather resistance is better;
7. by adding the blue light resistant agent or the blue light resistant layer, blue light emitted by the LED module can be reduced, and the eye health of a user can be protected.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, which are substantially the same as the present invention.
Claims (10)
1. A production process of a film-coated LED display module is characterized by comprising the following steps:
the LED lamp bead-mounted circuit board, the solid light-transmitting adhesive layer and the light-transmitting film are sequentially stacked, wherein one side of the circuit board, which is provided with the LED lamp beads, faces the light-transmitting adhesive layer;
applying pressure to the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain a film-coated LED display module;
after the film-coated LED display module is irradiated and cured, trimming the film-coated LED display module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
2. The production process of the film-covered LED display module according to claim 1, wherein when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the circuit board, the light-transmitting adhesive layer and the light-transmitting film are sequentially stacked in the first fixing clamp from bottom to top, so that the surface of the circuit board, which is provided with the LED lamp beads, faces upwards;
when pressing, the first upper pressing die is used for pressing the light-transmitting film downwards.
3. The production process of the film-covered LED display module according to claim 2, wherein a first positioning groove matched with the circuit board is formed at the top of the first fixing clamp, and a first avoidance hole/a first avoidance groove for an element of the circuit board to extend into is formed at the bottom of the first positioning groove.
4. The production process of the film-covered LED display module according to claim 1, wherein when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the light-transmitting film, the light-transmitting adhesive layer and the circuit board are sequentially stacked in the second fixing clamp from bottom to top, so that the surface of the circuit board, which is provided with the LED lamp beads, faces downwards;
when pressing, the second upper pressing die is used for pressing the circuit board downwards.
5. The production process of the film-covered LED display module according to claim 4, wherein a second positioning groove matched with the light-transmitting film and the light-transmitting glue layer is formed in the top of the second fixing clamp, and a second position avoiding hole/a second position avoiding groove for components of the circuit board to extend into is formed in the bottom of the second upper pressing die.
6. The process for producing a film-covered LED display module according to any one of claims 1 to 5, wherein before the pressing, the fixing jig and the workpiece are placed in a vacuum chamber, and the vacuum chamber is evacuated.
7. A film-coated LED display module is characterized by comprising a circuit board, a light-transmitting adhesive layer and a light-transmitting film, wherein the upper surface of the circuit board is provided with LED lamp beads, the light-transmitting adhesive layer covers the upper surface of the circuit board, and the light-transmitting film covers the upper surface of the light-transmitting adhesive layer; the melting point of the light-transmitting glue layer is lower than that of the light-transmitting film; the light-transmitting adhesive layer contains light-curing adhesive and/or the two sides of the light-transmitting adhesive layer are coated with light-curing adhesive.
8. The film covered LED display module of claim 7, wherein the light transmissive glue layer is an elastomer based on (C2H4) x. (C4H6O2) y.
9. The film-covered LED display module according to claim 7, wherein the light-transmitting film is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film.
10. The film covered LED display module of claim 7, wherein the light transmissive glue layer and/or the light transmissive film comprises a blue-light inhibitor;
and/or a blue light prevention layer is arranged between the light-transmitting adhesive layer and the light-transmitting film;
and/or the upper surface of the light-transmitting film is provided with a blue-light-proof layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010351081.5A CN111312702A (en) | 2020-04-28 | 2020-04-28 | Production process of film-coated LED display module and film-coated LED display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010351081.5A CN111312702A (en) | 2020-04-28 | 2020-04-28 | Production process of film-coated LED display module and film-coated LED display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111312702A true CN111312702A (en) | 2020-06-19 |
Family
ID=71146393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010351081.5A Pending CN111312702A (en) | 2020-04-28 | 2020-04-28 | Production process of film-coated LED display module and film-coated LED display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111312702A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| CN112767848A (en) * | 2021-01-12 | 2021-05-07 | 深圳市艾比森光电股份有限公司 | LED display module and manufacturing method thereof |
| CN112820817A (en) * | 2020-12-31 | 2021-05-18 | 深圳全息界科技有限公司 | Small-spacing LED module packaging process |
| CN113041717A (en) * | 2021-03-24 | 2021-06-29 | 美埃(中国)环境科技股份有限公司 | Photocuring filter element and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012164742A (en) * | 2011-02-04 | 2012-08-30 | Showa Denko Kk | Lighting device and method of manufacturing lighting device |
| CN203589073U (en) * | 2013-09-30 | 2014-05-07 | 潘兴华 | Blue ray-resistant LED light source |
| CN103820043A (en) * | 2014-02-27 | 2014-05-28 | 深圳市友联亨达光电有限公司 | UV curing-type thermal-melt optical clear adhesive (TOCA) and bonding method |
| CN108133670A (en) * | 2017-11-27 | 2018-06-08 | 长春希达电子技术有限公司 | Integration packaging LED display module packaging method and LED display module |
| CN108777118A (en) * | 2018-07-06 | 2018-11-09 | 深圳市艾森视讯科技有限公司 | A kind of LED display modules and mosaic display screen |
| CN108807649A (en) * | 2018-06-13 | 2018-11-13 | 深圳市德彩光电有限公司 | A kind of LED light source plastic package method |
| CN110183979A (en) * | 2019-06-24 | 2019-08-30 | 弗洛里光电材料（苏州）有限公司 | Multilayer complex films and its application |
-
2020
- 2020-04-28 CN CN202010351081.5A patent/CN111312702A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012164742A (en) * | 2011-02-04 | 2012-08-30 | Showa Denko Kk | Lighting device and method of manufacturing lighting device |
| CN203589073U (en) * | 2013-09-30 | 2014-05-07 | 潘兴华 | Blue ray-resistant LED light source |
| CN103820043A (en) * | 2014-02-27 | 2014-05-28 | 深圳市友联亨达光电有限公司 | UV curing-type thermal-melt optical clear adhesive (TOCA) and bonding method |
| CN108133670A (en) * | 2017-11-27 | 2018-06-08 | 长春希达电子技术有限公司 | Integration packaging LED display module packaging method and LED display module |
| CN108807649A (en) * | 2018-06-13 | 2018-11-13 | 深圳市德彩光电有限公司 | A kind of LED light source plastic package method |
| CN108777118A (en) * | 2018-07-06 | 2018-11-09 | 深圳市艾森视讯科技有限公司 | A kind of LED display modules and mosaic display screen |
| CN110183979A (en) * | 2019-06-24 | 2019-08-30 | 弗洛里光电材料（苏州）有限公司 | Multilayer complex films and its application |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| CN112820817A (en) * | 2020-12-31 | 2021-05-18 | 深圳全息界科技有限公司 | Small-spacing LED module packaging process |
| CN112767848A (en) * | 2021-01-12 | 2021-05-07 | 深圳市艾比森光电股份有限公司 | LED display module and manufacturing method thereof |
| CN112767848B (en) * | 2021-01-12 | 2022-07-26 | 深圳市艾比森光电股份有限公司 | LED display module and manufacturing method thereof |
| CN113041717A (en) * | 2021-03-24 | 2021-06-29 | 美埃(中国)环境科技股份有限公司 | Photocuring filter element and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111312702A (en) | Production process of film-coated LED display module and film-coated LED display module | |
| JP5422599B2 (en) | Light emitting diode package structure and manufacturing method thereof | |
| US7781794B2 (en) | Resin sheet for encapsulating optical semiconductor element and optical semiconductor device | |
| CN111430344A (en) | COB display module and packaging method thereof | |
| CN104024050A (en) | Light-up window for a vehicle | |
| EP3300126B1 (en) | Process method for refining photoconverter to bond-package led and refinement equipment system | |
| US9012248B2 (en) | Method for packaging light emitting diode | |
| CN108987602B (en) | Packaging structure of organic electroluminescent device and manufacturing method | |
| CN112331091A (en) | LED module packaging method and LED module | |
| CN112951808B (en) | LED light-emitting module packaging method and device | |
| CN109841164A (en) | Small spacing LED display module and preparation method thereof | |
| KR20110048588A (en) | Conversion film and preparation method thereof | |
| US20200335482A1 (en) | System and method for chip-on-board light emitting diode | |
| CN109177008B (en) | Glue filling method | |
| CN111682094B (en) | LED light-emitting back plate and production method thereof | |
| EP3300127B1 (en) | Process method using thermoplastic resin photoconverter to bond-package led by rolling | |
| US8906715B2 (en) | Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the same | |
| CN113224040A (en) | Chip-on-board package display element and method of manufacturing the same | |
| CN104933972A (en) | Ultrathin interactive logo for household electrical appliance and manufacturing method for same | |
| US10276759B2 (en) | Process method using deformable organic silicone resin photoconverter to bond-package LED | |
| CN111081900A (en) | Silicon-based OLED display panel attaching method | |
| CN103378260A (en) | Method for manufacturing packaging structure of light emitting diode | |
| CN210837762U (en) | OLED display panel | |
| CN100521268C (en) | Package member and manufacturing method therefor | |
| US8403202B1 (en) | Method for soldering surface mounting LED to circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |