CN112820817A - Small-spacing LED module packaging process - Google Patents
Small-spacing LED module packaging process Download PDFInfo
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- CN112820817A CN112820817A CN202011633011.5A CN202011633011A CN112820817A CN 112820817 A CN112820817 A CN 112820817A CN 202011633011 A CN202011633011 A CN 202011633011A CN 112820817 A CN112820817 A CN 112820817A
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- 238000012858 packaging process Methods 0.000 title claims abstract description 32
- 239000004831 Hot glue Substances 0.000 claims abstract description 66
- 239000002131 composite material Substances 0.000 claims abstract description 55
- 230000003287 optical effect Effects 0.000 claims abstract description 53
- 238000007731 hot pressing Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims description 17
- 238000001723 curing Methods 0.000 claims description 16
- 238000007689 inspection Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000001029 thermal curing Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 description 18
- 238000010030 laminating Methods 0.000 description 16
- 239000002313 adhesive film Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 6
- 238000007664 blowing Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 230000003678 scratch resistant effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a small-spacing LED module packaging process which comprises the steps of forming an LED module, attaching a composite film to the LED module, wherein the composite film comprises an optical hot-melt adhesive film and a functional film which are attached to each other, attaching the optical hot-melt adhesive film to the surface of the LED module, carrying out hot pressing on the LED module attached with the composite film, and curing the LED module after the hot pressing. According to the invention, the composite film with the optical hot-melt adhesive film and the functional film is attached to the LED module, so that the optical hot-melt adhesive film fills the space between the point light sources in the LED module under the action of hot pressing, and the mutual interference of light rays emitted by the point light sources is weakened, thus the uniformity of light emitting of the LED module is improved, the LED module has waterproof performance, and meanwhile, the functional film is bonded and fixed, and the functional film protects the surface of the LED module, so that the LED module has the functions of scratch resistance and wear resistance.
Description
Technical Field
The invention relates to an LED packaging process, in particular to a small-spacing LED module packaging process.
Background
The LED module with the small spacing encapsulates the LED chip on the module through the transparent encapsulating material to form the encapsulation protection of the point light source, crosstalk and reflection exist between the point light sources inside the encapsulated module to cause light waste, the module is uneven in light emission, in the related technology, the glue filling mode is adopted to fill the gap between the light sources, the module needs to be correspondingly detected before and after glue filling, the operation is complex, and the defects that the module is easy to scratch and is not waterproof after encapsulation can not be overcome.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a small-space LED module packaging process which can give consideration to the uniform light emitting performance and the scratch-resistant performance of an LED module and is simple and convenient to operate.
The small-space LED module packaging process provided by the embodiment of the invention comprises the following steps:
molding the LED module;
attaching a composite film on the LED module, wherein the composite film comprises an optical hot-melt adhesive film and a functional film which are attached to each other, and the optical hot-melt adhesive film is attached to the surface of the LED module;
carrying out hot pressing on the LED module attached with the composite film;
and curing the LED module after hot pressing.
The small-space LED module packaging process provided by the embodiment of the invention at least has the following beneficial effects:
according to the small-spacing LED module packaging process, the composite film with the optical hot-melt adhesive film and the functional film is attached to the LED module, so that the optical hot-melt adhesive film fills the spacing between point light sources in the LED module under the action of hot pressing, mutual interference of light rays emitted by the point light sources is weakened, uniformity of light emitted by the LED module is improved, the LED module has waterproof performance, the functional film is bonded and fixed, the surface of the LED module is protected by the functional film, and the LED module has scratch-proof and wear-resistant functions.
According to the small-space LED module packaging process provided by the embodiment of the invention, the attaching step of the composite film comprises the following steps: and attaching the functional film to one side of the optical hot-melt adhesive film, and then attaching the other side of the optical hot-melt adhesive film to the surface of the LED module.
According to the small-space LED module packaging process provided by the embodiment of the invention, the attaching step of the composite film comprises the following steps: and attaching the optical hot-melt adhesive film to the surface of the LED module, and then attaching the functional film to the surface of the optical hot-melt adhesive film.
According to the small-space LED module packaging process provided by the embodiment of the invention, after the hot-pressing step, the LED module is baked.
According to the small-space LED module packaging process provided by the embodiment of the invention, air blowing is carried out on the composite film in the hot pressing and/or baking steps.
According to the small-space LED module packaging process provided by the embodiment of the invention, the LED module is subjected to defoaming treatment after the hot-pressing step.
According to the small-space LED module packaging process provided by the embodiment of the invention, the hot pressing and/or the defoaming step are/is carried out in a vacuum environment.
According to the small-space LED module packaging process provided by the embodiment of the invention, the LED module is detected after the hot-pressing step is completed.
According to the small-space LED module packaging process provided by the embodiment of the invention, in the curing step, the LED module is subjected to ultraviolet curing and/or thermal curing.
According to the small-spacing LED module packaging process provided by the embodiment of the invention, after the curing step is completed, final inspection is carried out on the LED module.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the following figures and examples, in which:
FIG. 1 is a schematic flow chart of an embodiment of a small-pitch LED module packaging process of the present invention;
fig. 2 is a schematic flow chart of another embodiment of the small-pitch LED module packaging process of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality is one or more, the meaning of a plurality is two or more, and the above, below, exceeding, etc. are understood as excluding the present numbers, and the above, below, within, etc. are understood as including the present numbers. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The small-spacing LED module is characterized in that a plurality of LED chips are fixed on a circuit board or a circuit board in an array arrangement mode, so that a plurality of point light sources are combined with one another, and the small-spacing LED module has the defects of complex process and complex packaging post-processing. Referring to fig. 1, in an embodiment of the present invention, a small-pitch LED module packaging process is provided, including: firstly, preparing a molded LED module; attaching a composite film on the LED module, wherein the composite film comprises an optical hot-melt adhesive film and a functional film which are attached to each other, and the optical hot-melt adhesive film is attached to the surface of the LED module; then carrying out hot pressing on the LED module attached with the composite film; and finally, curing the hot-pressed LED module to completely fix the composite film on the LED module.
Specifically, the formed LED module is that a plurality of point light sources are fixed on a circuit board or a circuit board, and the point light sources and the circuit board are combined to form a complete light emitting module. The complex film in this embodiment includes optics hot melt adhesive membrane and functional film, and optics hot melt adhesive membrane is attached behind the surface of LED module, realizes promptly that the complex film is to the attached of LED module, and the complex film has taken into account and has filled clearance between the pointolite and explosion-proof, prevent the function of scraping, makes the LED module accomplish the laminating back, can realize simultaneously that the light-emitting is even and prevent scraping, prevent the effect of rubbing. After the composite film is attached, the LED module attached with the composite film is hot-pressed, the optical hot-melt adhesive film is heated and converted into a molten state, the molten optical hot-melt adhesive film flows in the gap between the point light sources and gradually fills the gap, so that the hot-melt adhesive film is flatly laid between the functional film and the LED module, the gap between the point light sources is filled, the light reflection and refraction between the point light sources are weakened, and the energy consumption is reduced, thereby improving the uniformity and brightness of the light emitted by the LED module, the functional film attached to the surface of the hot-melt adhesive film plays a role in protecting the surface of the LED module and a light source, so that the LED module has the functions of scratch resistance and scratch resistance, and light and thin resistance, along with the continuous flow of the optical hot-melt adhesive film between the point light sources, the combination tightness of the optical hot-melt adhesive film and the LED module is improved, the, the distance between the point light source and the functional film is gradually reduced, the optical path can be shortened, and the emergent efficiency of light rays is improved. And curing the LED module after hot pressing to enable the optical hot-melt adhesive film to generate a cross-linking reaction, so that the optical hot-melt adhesive film is completely bonded and fixed with the LED module, and the functional film is bonded and fixed while the gap between the point light sources is filled.
Therefore, in the small-space LED module packaging process in the embodiment of the invention, the composite film comprising the optical hot-melt adhesive film and the functional film is attached to the LED module, so that the optical hot-melt adhesive film fills the space between the point light sources in the LED module under the action of hot pressing, and the mutual interference of light rays emitted by the point light sources is weakened, thereby improving the uniformity of light emitted by the LED module, enabling the LED module to have waterproof performance, achieving the purposes of adhering and fixing the functional film, protecting the surface of the LED module by the functional film, and enabling the LED module to have the functions of scratch resistance and wear resistance.
It should be noted that, the encapsulation process adopted in this embodiment overcomes the defects of low encapsulation efficiency and poor encapsulation effect caused by a complex process of implementing scratch resistance by first performing glue filling and mounting on an LED chip, then adjusting the uniformity of light emission by filling epoxy resin, and then attaching a protective film to the surface of an LED module in a conventional process. The packaging process in the embodiment can realize the filling of the optical hot-melt adhesive film on the LED module through hot pressing, and simultaneously enables the functional film to be formed on the surface of the LED module, and the attaching process has no waiting time.
The Optical hot melt Adhesive film can be a UV-curing Optical transparent hot melt Adhesive film or a thermosetting Optical transparent hot melt Adhesive film (TOCA), the light transmittance of the Adhesive film is higher, the Adhesive film has better ductility, the resilience of the Adhesive film and the warping deformation of the material can be reduced, the self-Adhesive force is strong, the Adhesive film can be firmly adhered to the functional film and the LED module, the LED module and the functional film can be conveniently positioned in an adhering manner, and the adhering stability of the functional film and the LED module is improved. In addition, the size of the optical hot-melt adhesive film can be reasonably selected according to the specific attaching requirement of the LED module, the length and the width of the optical hot-melt adhesive film are not less than the length and the width of the LED module, and the thickness of the optical hot-melt adhesive film is not less than the height of the point light source, so that the LED module can be completely filled with the optical hot-melt adhesive film. The functional film can be an optical polyester film with a scratch-resistant function, an AG anti-glare protective film, an explosion-proof film, an anti-reflection film and the like, or a combined film formed by laminating and attaching the films, so that the LED module has the functions of scratch resistance, anti-glare and the like at the same time after the composite film is attached.
It should be noted that, a release film is usually attached to two sides of the optical hot-melt adhesive film to protect the adhesive film on the inner layer of the optical hot-melt adhesive film, and the release film has a certain elasticity and can be stretched, so as to prevent the optical hot-melt adhesive film from rebounding during the process of attaching to the LED module, which causes the surface of the optical hot-melt adhesive film to form wrinkles, the release film needs to be removed first, and then the adhesive film is attached. Therefore, before the attaching step is performed, the release film on the side of the optical hot-melt adhesive film is removed to expose the adhesive film, and the adhesive film is attached to the LED module or the functional film.
Referring to fig. 2, specifically, the release film on the first side can be torn off, the exposed side of the adhesive film is attached to the LED module, the release film on the second side is torn off, and the functional film is attached to the second side of the adhesive film, so that the attachment of the composite film to the LED module is realized. Or firstly tearing off the release film on the first side of the optical hot-melt adhesive film, attaching the exposed side of the adhesive film and the functional film to each other to form a composite film, then tearing off the release film on the second side of the optical hot-melt adhesive film, and attaching the composite film to the surface of the LED module; the adoption makes up earlier optics hot melt adhesive membrane and functional film earlier attached mode again, can prepare the complex film in advance before carrying out packaging technology, when carrying out the attached of complex film, directly tears the type membrane of removing optics hot melt adhesive membrane side, then with the complex film attached in the surface of LED module can, saved optics hot melt adhesive membrane and the mutual attached time of functional film to further improve the encapsulation efficiency of LED module.
In addition, can roll press optical hot melt adhesive membrane when optical hot melt adhesive membrane is attached, namely, along with the glued membrane is constantly attached to LED module or functional film, set up rolling press device (like rolling head, cylinder roller etc.) and carry out synchronous roll press to the glued membrane in glued membrane non-attached side, with constantly discharge be located glued membrane and LED module or with the functional film between the air, make the glued membrane can smoothly attach in the surface of LED module or functional film, thereby improve the roughness of laminating between complex film and the LED module, avoid appearing fold, the bubble between glued membrane and the LED module, guarantee laminating quality.
Also can be in the laminating in-process, along the glued membrane to the attached direction of LED module or functional film, blow to optics hot melt adhesive membrane gradually, the air current promotes the glued membrane and constantly attaches on LED module or functional film to the air that is located glued membrane and LED module or functional film is discharged at the attached in-process, avoids forming the bubble.
In the hot pressing step, the jig can be used for covering the surfaces of the LED module and the composite film, so that the composite film and the LED module are tightly adhered under the action of pressure, and the optical hot melt adhesive film in the composite film is heated and melted. Specifically, the LED module can be placed on a platform with a flat surface, the jig descends and covers the surface of the composite film in a pressing manner, and the composite film and the LED module are tightly pressed; or the jig and the platform move oppositely at the same time, so that the LED module and the composite film are pressed tightly at the same time, and the hot-pressing efficiency is improved.
The hot pressing step can be carried out in a vacuum environment so as to prevent external air from entering between the LED module and the composite film and forming bubbles between the LED module and the composite film to influence the flatness of the composite film attached to the LED module. The hot pressing step can be carried out in a vacuum hot press, and the LED module and the composite film are pressed in a vacuum environment, so that the composite film is smoothly attached to the surface of the LED module.
In addition, the hot pressing process can blow air to the composite film so as to improve the tightness of the composite film and the LED module. Specifically, the hot-pressing jig can be provided with air holes, the air holes in the hot-pressing jig, which are in contact with the composite film, are gradually opened along the direction from the middle to the edge, the air blowing mode conforms to the rule that the hot-melted adhesive film flows in the LED module after hot melting, and under the air blowing mode, the hot-melted adhesive film flows from the central area of the LED module to the edge and presses the air bubbles between the LED module and the composite film to gradually flow to the outer side of the LED module, so that the bubble discharge effect is realized; and because the air blowing effect of the hot pressing jig, the hot pressing jig cannot be taken away from the composite film when lifted, the positioning of the composite film and the LED module is avoided being influenced, and the laminating precision of the composite film and the LED module is ensured.
Remove the pressure to the LED module after the hot pressing, avoid the LED module to be compressed for a long time and damage, toast the LED module after the hot pressing, under the temperature condition that should toast, optics hot melt adhesive film continuously keeps the flow property, and free flow between the point light source, make the clearance between the pointolite can fully be filled to optics hot melt adhesive film, improve the attached roughness of optics hot melt adhesive film on the one hand, bubble between on the other hand fully discharge LED module and the complex film, optimize the display effect of LED module. It should be noted that, in the baking process, the bubble removal can be assisted by the blowing method, so as to improve the bubble removal effect in the baking process.
In the baked LED module, bubbles are basically discharged, the LED module can be pressurized and defoamed for further optimizing the bubble discharge effect, the pressurizing and defoaming step can be carried out in defoaming equipment, the bubbles between the composite film and the LED module can be further removed through the pressurizing and defoaming, the flatness and the laminating tightness of the lamination between the composite film and the LED module are improved, and the phenomenon that an optical hot melt adhesive film is not leveled or converted is improved. The defoaming process can be executed in a vacuum environment, and bubbles generated in the laminating glue in the laminating process are removed by using pressure and temperature, so that the laminating of the composite film and the LED module is smoother.
After the laminating is completed, the LED module can be detected. For example, after vacuum hot pressing or defoaming is completed, appearance detection and electrical property detection are performed on the LED module, the appearance detection mainly detects whether a joint between the LED module and the composite film has an obvious non-joint part, a crack part and an excessive glue phenomenon, and the electrical property detection mainly detects whether the jointed LED module can normally display content and has no electrical connection failure part. Before solidifying, optics hot melt adhesive film is not totally fixed with complex film, LED module bonding, only has certain bonding self-adhesion, if there is laminating bad region, can tear optics hot melt adhesive film, makes optics hot melt adhesive film break away from complex film or LED module, then can be once more to attached on complex film and LED module optics hot melt adhesive film, and the aforesaid tears the process, does not damage the panel, and the simple operation, carries out prosthetic prerequisite to laminating quality, has reduced the rejection rate.
If no laminating bad area exists in the detection, the LED module can be cured, the curing step can adopt an ultraviolet curing mode to carry out ultraviolet irradiation on the whole body of the body to be cured, so that the optical hot melt adhesive film, the LED module and the composite film are completely bonded and fixed, and the LED module and the composite film have enough laminating strength and laminating stability. The LED module can be cured by adopting a heating curing mode, and the optical hot melt adhesive film is subjected to cross-linking reaction by adopting a thermosetting mode, so that the flexible panel and the protection panel are fixed.
In addition, if the ultraviolet rays are blocked or the ultraviolet irradiation intensity is not enough to completely irradiate all areas of the optical hot melt adhesive film, the optical hot melt adhesive film is completely cured, and in order to further improve the curing effect, heating curing can be assisted after the ultraviolet rays are cured, so that the incompletely cured areas between the LED module and the composite film are cured, and the bonding strength of the LED module and the composite film is improved.
After the curing is completed, the LED module can be finally inspected, whether the joint of the flexible panel and the protection panel meets the joint standard or not is observed, and unqualified products can be separated from the composite film by freezing and adopting a solvent method and reworked.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention. Furthermore, the embodiments of the present invention and the features of the embodiments may be combined with each other without conflict.
Claims (10)
1. Small-interval LED module packaging process, its characterized in that includes:
molding the LED module;
attaching a composite film on the LED module, wherein the composite film comprises an optical hot-melt adhesive film and a functional film which are attached to each other, and the optical hot-melt adhesive film is attached to the surface of the LED module;
carrying out hot pressing on the LED module attached with the composite film;
and curing the LED module after hot pressing.
2. The small pitch LED module packaging process of claim 1, wherein the step of attaching the composite film comprises: and attaching the functional film to one side of the optical hot-melt adhesive film, and then attaching the other side of the optical hot-melt adhesive film to the surface of the LED module.
3. The small pitch LED module packaging process of claim 1, wherein the step of attaching the composite film comprises: and attaching the optical hot-melt adhesive film to the surface of the LED module, and then attaching the functional film to the surface of the optical hot-melt adhesive film.
4. The small-pitch LED module packaging process of any one of claims 1 to 3, wherein the LED module is baked after the hot-pressing step.
5. The process for packaging small-pitch LED modules according to claim 4, wherein the composite film is blown during the hot-pressing and/or baking step.
6. The small-pitch LED module packaging process of claim 1, wherein the LED module is defoamed after the hot-pressing step.
7. The small-pitch LED module packaging process of claim 6, wherein the thermal pressing and/or the de-bubbling are performed in a vacuum environment.
8. The small-pitch LED module packaging process as claimed in any one of claims 5 to 7, wherein the LED module is inspected after the hot-pressing step is completed.
9. The small-pitch LED module packaging process according to any one of claims 5 to 7, wherein in the curing step, the LED module is subjected to ultraviolet curing and/or thermal curing.
10. The small-pitch LED module packaging process as claimed in any one of claims 5 to 7, wherein the LED module is subjected to final inspection after the curing step.
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| CN202011633011.5A CN112820817A (en) | 2020-12-31 | 2020-12-31 | Small-spacing LED module packaging process |
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| CN202011633011.5A CN112820817A (en) | 2020-12-31 | 2020-12-31 | Small-spacing LED module packaging process |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113409690A (en) * | 2021-06-08 | 2021-09-17 | 深圳全息界科技有限公司 | Large-size display screen laminating process |
| CN114714737A (en) * | 2022-04-08 | 2022-07-08 | 深圳全息界科技有限公司 | Stepless color-changing glass preparation process and stepless color-changing glass |
| CN114874711A (en) * | 2022-05-18 | 2022-08-09 | 东莞市溢美材料科技有限公司 | Composite adhesive film production process and application thereof in fingerprint chip packaging field |
| CN115038254A (en) * | 2022-06-24 | 2022-09-09 | 深圳市南极光电子科技股份有限公司 | Mini/Micro backlight lamp panel protective adhesive film pressing process |
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