CN110649010A - OCA film packaging process of display module - Google Patents
OCA film packaging process of display module Download PDFInfo
- Publication number
- CN110649010A CN110649010A CN201910844808.0A CN201910844808A CN110649010A CN 110649010 A CN110649010 A CN 110649010A CN 201910844808 A CN201910844808 A CN 201910844808A CN 110649010 A CN110649010 A CN 110649010A
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- film
- top surface
- light guide
- display module
- optical
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- 238000012858 packaging process Methods 0.000 title claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims abstract description 71
- 239000000084 colloidal system Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000004568 cement Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 239000002356 single layer Substances 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 99
- 238000005538 encapsulation Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 2
- -1 polyethylene terephthalate Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000010030 laminating Methods 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000012528 membrane Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an OCA film packaging process of a display module, which comprises the following steps: (1) providing a display module; (2) providing an OCA optical cement; (3) tearing off the release film, and attaching the bottom surface of the optical colloid to the top surface of the LED chip; pressing down the top surface of the upper release film by using a jig so that the bottom surface of the optical colloid is attached to the top surface of the display substrate and wraps the LED chip; (4) providing a light guide film; tearing off the release film, and attaching the bottom surface of the light guide film to the top surface of the optical colloid; pressing down the top surface of the light guide film by using a jig so that the bottom surface of the light guide film is attached to the top surface of the optical colloid; (5) and curing the optical colloid to obtain the single-layer packaged display module. The OCA packaging process mainly comprises a laminating procedure, the steps are few and simple, the technology of automatic laminating equipment is mature, high-efficiency packaging can be realized, the production requirement is met, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of LED display, in particular to an OCA film packaging process of a display module.
Background
The LED display screen comprises a small-distance LED display screen, a mini LED display screen and a micro LED display screen. The LED display screen is usually constructed by assembling a plurality of independent display modules to form a large-sized LED display screen.
The display module comprises a PCB, a plurality of LED chips which are arranged on one surface of the PCB in a rectangular array manner in a sticking manner, and an IC element arranged on the other surface of the PCB. In order to avoid that the LED chip is directly exposed in the air and is easily polluted or damaged by people, and the function of the chip is affected or damaged, a layer of epoxy resin is usually required to be encapsulated on the surface of the PCB board where the LED chip is attached, and the LED chip and the bonding wire are encapsulated by the epoxy resin to realize encapsulation. However, the packaging method has high requirements on equipment and processes, and has low production efficiency, which is difficult to meet production requirements.
The OCA optical Adhesive (optical Clear Adhesive) is a special Adhesive for cementing transparent optical elements (such as lenses and the like), has the characteristics of colorless transparency, light transmittance of over 90 percent, good cementing strength, capability of being cured at room temperature or intermediate temperature, small curing shrinkage and the like.
The liquid crystal screen of the mobile phone is divided into a glass cover plate, a touch screen and a liquid crystal screen, and the three parts are sequentially attached through OCA optical cement.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide an OCA film encapsulation process for a display module, which has low requirements on equipment and processes, high production efficiency, and meets production requirements according to the deficiencies of the prior art.
The technical scheme of the invention is as follows:
an OCA film packaging process of a display module comprises the following steps:
(1) providing a display module, wherein the display module comprises a display substrate, a drive IC and an LED chip; the plurality of driving ICs are attached to the bottom surface of the display substrate, and the plurality of LED chips are attached to the top surface of the display substrate;
(2) providing an OCA optical cement, wherein the OCA optical cement comprises an upper release film, an optical cement and a lower release film which are sequentially attached from top to bottom;
(3) tearing off the release film, and attaching the bottom surface of the optical colloid to the top surface of the LED chip; pressing down the top surface of the upper release film by using a jig so that the bottom surface of the optical colloid is attached to the top surface of the display substrate and wraps the LED chip;
(4) providing a light guide film; tearing off the release film, and attaching the bottom surface of the light guide film to the top surface of the optical colloid; pressing down the top surface of the light guide film by using a jig so that the bottom surface of the light guide film is attached to the top surface of the optical colloid;
(5) and curing the optical colloid to obtain the single-layer packaged display module.
Further, the method also comprises the following steps:
(6) providing another OCA optical cement, tearing off the release film, and attaching the bottom surface of the optical cement to the top surface of the light guide film; pressing down the top surface of the upper release film by using a jig so that the bottom surface of the optical colloid is attached to the top surface of the light guide film;
(7) providing another light directing film; tearing off the release film, and attaching the bottom surface of the light guide film to the top surface of the optical colloid; pressing down the top surface of the light guide film by using a jig so that the bottom surface of the light guide film is attached to the top surface of the optical colloid; curing the optical colloid;
(8) and (5) repeating the steps (6) to (7) for a plurality of times to obtain the multi-layer packaged display module.
Further, the curing mode is ultraviolet curing, hot-pressing curing or room temperature curing.
Further, the optical colloid is acrylic or silicone.
Further, the light guide film is a PC film, a PET film, or a glass film.
Further, the optical colloid is a transparent colloid, and the light guide film is a semitransparent film.
Further, the display substrate is a rigid Printed Circuit Board (PCB), a TFT (thin film transistor) substrate or a flexible PET (polyethylene terephthalate) substrate.
Compared with the prior art, the invention has the following beneficial effects:
1. the packaging process mainly comprises a laminating procedure, the steps are few and simple, the technology of automatic laminating equipment is mature, high-efficiency packaging can be realized, the production requirement is met, and the production cost is reduced.
2. Utilize the tool to push down from type membrane and leaded light membrane on to, enable the laminating between display substrate, optics colloid, the leaded light membrane more even and inseparable, improve the encapsulation effect.
3. The display module can be set to be a single-layer or multi-layer packaging structure according to the requirements of application scenes, and the use of different scenes is met.
The OCA optical adhesive is a double-sided adhesive with high all-light penetration rate, so that the influence on the light emission of the LED chip is reduced as much as possible, and the display effect is improved.
Drawings
Fig. 1 is a cross-sectional view of the display module and OCA optical cement in step (1).
FIG. 2 is a sectional view of the semi-finished product in step (3).
Fig. 3 is a cross-sectional view of the single-layer-packaged display module in step (5).
Fig. 4 is a cross-sectional view of the three-layer-packaged display module in step (8).
Reference numerals
10-display module, 11-display substrate, 12-drive IC, 13-LED chip, 20-OCA optical cement, 21-upper release film, 22-optical cement, 23-lower release film and 30-light guide film.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings.
In a first embodiment, an OCA film encapsulation process of a display module includes the following steps:
(1) as shown in fig. 1, a display module 10 is provided, the display module 10 includes a display substrate 11, a driving IC 12 and an LED chip 13; the plurality of driver ICs 12 are mounted on the bottom surface of the display substrate 11, and the plurality of LED chips 13 are mounted on the top surface of the display substrate 11. The display substrate 11 is a rigid printed circuit board PCB.
(2) As shown in fig. 1, an OCA optical adhesive 20 is provided, and the OCA optical adhesive 20 includes an upper release film 21, an optical adhesive 22 and a lower release film 23 sequentially attached from top to bottom. The optical colloid 22 is acrylic colloid and is transparent colloid.
(3) Tearing off the release film 23, and attaching the bottom surface of the optical colloid 22 to the top surface of the LED chip 13; the jig is used to press down the top surface of the upper release film 21, so that the bottom surface of the optical colloid 22 is attached to the top surface of the display substrate 11 and covers the LED chip 13, as shown in fig. 2.
(4) Providing a light guiding film 30; tearing off the release film 21, and attaching the bottom surface of the light guide film 30 on the top surface of the optical colloid 22; the jig is used to press down the top surface of the light guide film 30, so that the bottom surface of the light guide film 30 is attached to the top surface of the optical colloid 22. The light guide film 30 is a PET film, and is a translucent film.
(5) As shown in fig. 3, the optical colloid 22 is uv-cured to obtain the single-layer packaged display module 10.
The light guide film 30 is doped with a dye to change the color and transmittance of the film, and doped with a scattering agent to change the optical properties of the film, or subjected to leveling, atomization or antireflection treatment.
In a second embodiment of the present invention, an OCA film encapsulation process of a display module includes the following steps:
(1) as shown in fig. 1, a display module 10 is provided, the display module 10 includes a display substrate 11, a driving IC 12 and an LED chip 13; the plurality of driver ICs 12 are mounted on the bottom surface of the display substrate 11, and the plurality of LED chips 13 are mounted on the top surface of the display substrate 11. The display substrate 11 is a rigid printed circuit board PCB.
(2) As shown in fig. 1, an OCA optical adhesive 20 is provided, and the OCA optical adhesive 20 includes an upper release film 21, an optical adhesive 22 and a lower release film 23 sequentially attached from top to bottom. The optical colloid 22 is acrylic colloid and is transparent colloid.
(3) Tearing off the release film 23, and attaching the bottom surface of the optical colloid 22 to the top surface of the LED chip 13; the jig is used to press down the top surface of the upper release film 21, so that the bottom surface of the optical colloid 22 is attached to the top surface of the display substrate 11 and covers the LED chip 13, as shown in fig. 2.
(4) Providing a light guiding film 30; tearing off the release film 21, and attaching the bottom surface of the light guide film 30 on the top surface of the optical colloid 22; the jig is used to press down the top surface of the light guide film 30, so that the bottom surface of the light guide film 30 is attached to the top surface of the optical colloid 22. The light guide film 30 is a PET film, and is a translucent film.
(5) As shown in fig. 3, the optical colloid 22 is uv-cured to obtain the single-layer packaged display module 10.
(6) Providing another OCA optical cement 20, tearing off the release film 23, and attaching the bottom surface of the optical cement 22 on the top surface of the light guide film 30; the jig is used to press down the top surface of the upper release film 21, so that the bottom surface of the optical colloid 22 is attached to the top surface of the light guide film 30.
(7) Providing another light directing film 30; the release film 21 is removed, and the bottom surface of the light guide film 30 is attached to the top surface of the optical colloid 22. Pressing down the top surface of the light guide film 30 by using a jig so that the bottom surface of the light guide film 30 is attached to the top surface of the optical colloid 22; the optical colloid 22 is cured.
(8) As shown in fig. 4, steps (6) to (7) are repeated once, resulting in a multi-layer packaged display module 10. Wherein the second embodiment results in a three-layer encapsulated display module 10.
The light guide film 30 is doped with a dye to change the color and transmittance of the film, and doped with a scattering agent to change the optical properties of the film, or subjected to leveling, atomization or antireflection treatment.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the invention is not limited by the scope of the appended claims.
Claims (7)
1. An OCA film packaging process of a display module is characterized by comprising the following steps:
(1) providing a display module, wherein the display module comprises a display substrate, a drive IC and an LED chip; the plurality of driving ICs are attached to the bottom surface of the display substrate, and the plurality of LED chips are attached to the top surface of the display substrate;
(2) providing an OCA optical cement, wherein the OCA optical cement comprises an upper release film, an optical cement and a lower release film which are sequentially attached from top to bottom;
(3) tearing off the release film, and attaching the bottom surface of the optical colloid to the top surface of the LED chip; pressing down the top surface of the upper release film by using a jig so that the bottom surface of the optical colloid is attached to the top surface of the display substrate and wraps the LED chip;
(4) providing a light guide film; tearing off the release film, and attaching the bottom surface of the light guide film to the top surface of the optical colloid; pressing down the top surface of the light guide film by using a jig so that the bottom surface of the light guide film is attached to the top surface of the optical colloid;
(5) and curing the optical colloid to obtain the single-layer packaged display module.
2. The OCA film encapsulation process of the display module according to claim 1, further comprising the steps of:
(6) providing another OCA optical cement, tearing off the release film, and attaching the bottom surface of the optical cement to the top surface of the light guide film; pressing down the top surface of the upper release film by using a jig so that the bottom surface of the optical colloid is attached to the top surface of the light guide film;
(7) providing another light directing film; tearing off the release film, and attaching the bottom surface of the light guide film to the top surface of the optical colloid; pressing down the top surface of the light guide film by using a jig so that the bottom surface of the light guide film is attached to the top surface of the optical colloid; curing the optical colloid;
(8) and (5) repeating the steps (6) to (7) for a plurality of times to obtain the multi-layer packaged display module.
3. The OCA film encapsulation process of the display module according to claim 1 or 2, wherein: the curing mode is ultraviolet curing, hot-pressing curing or room temperature curing.
4. The OCA film encapsulation process of the display module according to claim 1 or 2, wherein: the optical colloid is acrylic or silicone.
5. The OCA film encapsulation process of the display module according to claim 1 or 2, wherein: the light guide film is a PC film, a PET film or a glass film.
6. The OCA film encapsulation process of the display module according to claim 1 or 2, wherein: the optical colloid is transparent colloid, and the light guide film is a semitransparent film.
7. The OCA film encapsulation process of the display module according to claim 1 or 2, wherein: the display substrate adopts a rigid Printed Circuit Board (PCB), a Thin Film Transistor (TFT) substrate or a flexible polyethylene terephthalate (PET) substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910844808.0A CN110649010B (en) | 2019-09-07 | 2019-09-07 | OCA film packaging process of display module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910844808.0A CN110649010B (en) | 2019-09-07 | 2019-09-07 | OCA film packaging process of display module |
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| Publication Number | Publication Date |
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| CN110649010A true CN110649010A (en) | 2020-01-03 |
| CN110649010B CN110649010B (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910844808.0A Active CN110649010B (en) | 2019-09-07 | 2019-09-07 | OCA film packaging process of display module |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| CN112820817A (en) * | 2020-12-31 | 2021-05-18 | 深圳全息界科技有限公司 | Small-spacing LED module packaging process |
| CN112885818A (en) * | 2021-01-12 | 2021-06-01 | 盐城东山精密制造有限公司 | Novel Mini LED packaging process |
| CN113130462A (en) * | 2021-04-13 | 2021-07-16 | 广州市鸿利显示电子有限公司 | Display module and preparation method thereof |
| CN114975733A (en) * | 2022-05-23 | 2022-08-30 | 东莞市中麒光电技术有限公司 | Film-covered display module and production process and repair process thereof |
| WO2022193162A1 (en) * | 2021-03-17 | 2022-09-22 | 东莞阿尔泰显示技术有限公司 | Led display module packaging process |
| US12033995B2 (en) | 2020-11-25 | 2024-07-09 | Samsung Electronics Co., Ltd. | Display module |
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| TW201916307A (en) * | 2017-09-28 | 2019-04-16 | 致伸科技股份有限公司 | Optical fingerprint identification unit and manufacturing method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12033995B2 (en) | 2020-11-25 | 2024-07-09 | Samsung Electronics Co., Ltd. | Display module |
| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| CN112820817A (en) * | 2020-12-31 | 2021-05-18 | 深圳全息界科技有限公司 | Small-spacing LED module packaging process |
| CN112885818A (en) * | 2021-01-12 | 2021-06-01 | 盐城东山精密制造有限公司 | Novel Mini LED packaging process |
| WO2022193162A1 (en) * | 2021-03-17 | 2022-09-22 | 东莞阿尔泰显示技术有限公司 | Led display module packaging process |
| CN113130462A (en) * | 2021-04-13 | 2021-07-16 | 广州市鸿利显示电子有限公司 | Display module and preparation method thereof |
| CN113130462B (en) * | 2021-04-13 | 2023-08-04 | 广州市鸿利显示电子有限公司 | Preparation method of display module and display module |
| CN114975733A (en) * | 2022-05-23 | 2022-08-30 | 东莞市中麒光电技术有限公司 | Film-covered display module and production process and repair process thereof |
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| Publication number | Publication date |
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| CN110649010B (en) | 2020-08-11 |
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Address after: 523000 room 901, building 1, No. 19, Keji 4th Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: AET DISPLAYS Ltd. Patentee after: Dongguan Zhongqi Photoelectric Technology Co., Ltd Address before: 523000 zone a, 4th floor, building a, No.1 Rd Rd Rd, Songshanhu hi tech Industrial Development Zone, Dongguan City, Guangdong Province Patentee before: AET DISPLAYS Ltd. Patentee before: Dongguan Zhongqi Photoelectric Technology Co., Ltd |