CN114975733A - Film-covered display module and production process and repair process thereof - Google Patents

Film-covered display module and production process and repair process thereof Download PDF

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Publication number
CN114975733A
CN114975733A CN202210567045.1A CN202210567045A CN114975733A CN 114975733 A CN114975733 A CN 114975733A CN 202210567045 A CN202210567045 A CN 202210567045A CN 114975733 A CN114975733 A CN 114975733A
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CN
China
Prior art keywords
film
glue
adhesive layer
layer
display module
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Pending
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CN202210567045.1A
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Chinese (zh)
Inventor
拜存顺
薛水源
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Dongguan HCP Technology Co Ltd
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Dongguan HCP Technology Co Ltd
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Application filed by Dongguan HCP Technology Co Ltd filed Critical Dongguan HCP Technology Co Ltd
Priority to CN202210567045.1A priority Critical patent/CN114975733A/en
Publication of CN114975733A publication Critical patent/CN114975733A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Abstract

The invention provides a film-coated display module and a production process and a repair process thereof, wherein the film-coated display module comprises a film and a substrate, and one surface of the substrate is provided with a plurality of LED substrates. The covering film comprises a film structure and a glue layer covering one side of the film structure. The glue film includes first glue film and encloses the second glue film of locating first glue film, and first glue film and second glue film cover the plane of membrane structure towards chip one side. The adhesive force of the second adhesive layer is larger than that of the first adhesive layer, and the film structure is adhered to the substrate through the first adhesive layer and the second adhesive layer. Compared with the prior art, the film-coated display module can avoid edge warping, white edges and the like at the edge of the film structure, and can greatly reduce the risk of degumming.

Description

Film-covered display module and production process and repair process thereof
Technical Field
The invention relates to the technical field of electronic component packaging, in particular to a film-coated display module and a production process and a repair process thereof.
Background
The display module generally includes a PCB board, and a plurality of LED chips mounted on one side of the PCB board in a rectangular array. In order to avoid that the LED chip is directly exposed in the air and is easily polluted or damaged by people, and the function of the chip is affected or destroyed, a film is generally required to be coated on the side of the PCB where the LED chip is attached for packaging. The packaging mode has higher requirements on equipment and process.
Generally, the cover film includes a base layer and a plurality of functional layers provided on the base layer. The display module is packaged on the film by the adhesive layer arranged on the substrate layer, so that the film-coated display module is obtained. The current film-coated display module has the following problems: (1) after the display module and the film are attached, the edge of the film is easy to stick up, white and the like, the packaging effect is poor, and the display effect is finally influenced. (2) The working temperature of the LED chip is generally 50-70 ℃, the adhesive force of most adhesive layers in the temperature range is weak, and a large degumming risk exists.
Disclosure of Invention
Based on the above problems, an object of the present invention is to provide a novel film-coated display module, and a production process and a repair process thereof, wherein the film-coated display module has a good packaging effect and a low risk of degumming.
In order to achieve the above object, a first aspect of the present invention provides a film-covered display module, which includes a cover film and a substrate, wherein one surface of the substrate has a plurality of LED chips, the cover film includes a film structure and a glue layer covering one side of the film structure, the glue layer includes a first glue layer and a second glue layer surrounding the first glue layer, the first glue layer and the second glue layer cover a plane of the film structure facing one side of the chip, a bonding force of the second glue layer is greater than that of the first glue layer, and the film structure is adhered to the substrate via the first glue layer and the second glue layer.
Compared with the prior art, the glue layer between the film structure and the substrate in the film-covered display module comprises the first glue layer and the second glue layer arranged around the first glue layer, meanwhile, the first glue layer and the second glue layer cover the plane of the film structure facing one side of the chip, the adhesive force of the second glue layer is larger than that of the first glue layer, in other words, the second glue layer with higher adhesive force is arranged at the periphery of the film structure, so that the edge of the film structure can be prevented from being easily warped, white edges and the like. In addition, the adhesive force of the second adhesive layer is larger, so that the degumming risk can be greatly reduced.
Preferably, the film structure is formed by stacking a plurality of layers, the film structure comprises a substrate layer, the adhesive layer is arranged on one side of the substrate layer, and the functional layer is arranged on the opposite side of the substrate layer.
Preferably, the functional layer is at least one of an anti-fingerprint layer, a reflective layer and a hardened layer.
Preferably, the first adhesive layer is made of OCA optical cement.
Preferably, the second adhesive layer is made of a reworkable optical structure adhesive. When needing to reprocess display module, heat first glue film and second glue film, mainly make the cohesive force of first glue film reduce, combine the exogenic action to peel off membrane structure and base plate, and then reprocess the LED chip on the base plate.
Preferably, the distance from the edge of the first adhesive layer to the edge of the second adhesive layer on the side far away from the first adhesive layer is 1-3 mm.
The invention provides a production process of a film-coated display module, wherein the film-coated display module comprises a film structure and a substrate, and the production process comprises the following steps:
(1) arranging a first adhesive layer in the middle of one side of the film structure, wherein the part of the same side of the film structure, which is not provided with the first adhesive layer, is a non-adhesive area;
(2) filling a second adhesive layer in the adhesive-free area, or arranging a second adhesive layer in the area of the substrate corresponding to the adhesive-free area, wherein the adhesive force of the second adhesive layer is greater than that of the first adhesive layer;
(3) and attaching the film structure and the substrate by the first adhesive layer and the second adhesive layer, and curing the first adhesive layer and the second adhesive layer to obtain the film-coated display module.
The production process of the film-coated display module is simple and effective to operate, and the packaging effect and the degumming risk can be ensured by arranging the first adhesive layer and the second adhesive layer.
Preferably, the second adhesive layer is filled in the non-adhesive area or the area of the substrate corresponding to the non-adhesive area by glue spraying, glue dispensing, glue scraping or glue spreading.
Preferably, the size of the non-adhesive area from the first adhesive layer to the edge of the film structure is 1-3 mm.
Preferably, the attaching conditions are as follows: the temperature is 60-120 ℃, and the pressure is 0.2-0.8 MPa.
Preferably, the curing conditions are as follows: the humidity is more than or equal to 60%, and the curing is carried out for 45-50 h at room temperature.
The third aspect of the present invention provides a repair process for a film-covered display module, which is used for repairing the film-covered display module, and includes the steps of:
(1) heating the film-coated display module until the bonding force of the first adhesive layer is reduced, so that the first adhesive layer and the second adhesive layer between the film structure and the substrate fall off to realize the peeling of the film structure and the substrate;
(2) repairing the bad LED chips on the substrate;
(3) providing a new membrane structure, wherein the middle part of one side of the new membrane structure is also provided with a first adhesive layer, and a non-adhesive area is arranged around the first adhesive layer;
(4) refilling a new second glue layer in the glue-free area of the new film structure, or arranging a new second glue layer in the area of the substrate corresponding to the glue-free area;
(5) and attaching the new film structure and the substrate by the first adhesive layer and the second adhesive layer, and curing the first adhesive layer and the second adhesive layer to obtain the repaired film-coated display module.
The film-coated display module repair process is simple and effective in operation, the packaging effect can be guaranteed and the degumming risk can be reduced through the arrangement of the first adhesive layer and the second adhesive layer, and the display module can be repaired.
Preferably, the heating temperature in the step (1) is 70-95 ℃.
Preferably, the second adhesive layer is filled in the non-adhesive area or the area of the substrate corresponding to the non-adhesive area by glue spraying, glue dispensing, glue scraping or glue spreading.
Preferably, the attaching conditions are as follows: the temperature is 60-120 ℃, and the pressure is 0.2-0.8 MPa.
Preferably, the curing conditions are as follows: the humidity is more than or equal to 60%, and the curing is carried out for 45-50 h at room temperature.
Drawings
Fig. 1 is a schematic view of a film-coated display module according to the present invention.
DESCRIPTION OF SYMBOLS IN THE DRAWINGS
100-a film-coated display module; 10-coating a film; 11-a membrane structure; 111-a substrate layer; 113-a functional layer; 113 a-an anti-fingerprint layer; 113 b-a reflective layer; 113 c-a hardened layer; 13-glue layer; 131-a first glue layer; 133-a second glue layer; 30-a substrate; 31-LED chip
Detailed Description
The invention provides a film-coated display module with good packaging effect and low degumming risk. As shown in fig. 1, the film-covered display module 100 includes a cover film 10 and a substrate 30, one surface of the substrate 30 has a plurality of LED chips 31, the cover film 10 includes a film structure 11 formed by stacking a plurality of layers and a glue layer 13 covering one side of the film structure 11, the glue layer 13 includes a first glue layer 131 and a second glue layer 133 surrounding the first glue layer 131, the first glue layer 131 and the second glue layer 133 cover a plane of the film structure 11 facing one side of the substrate 30, and the film structure 11 is adhered to the substrate 30 by the first glue layer 131 and the second glue layer 133. The distance from the edge of the first adhesive layer 131 to the edge of the second adhesive layer 133 on the side far away from the first adhesive layer 131 is 1-3 mm.
Continuing with FIG. 1, the film structure 11 includes a substrate layer 111 with a glue layer 13 disposed on one side of the substrate layer 111 and a functional layer 113 disposed on an opposite side. The functional layer 113 is at least one of an anti-fingerprint layer, a reflective layer, and a hardened layer, and as shown in fig. 1, a hardened layer 113c, a reflective layer 113b, and an anti-fingerprint layer 113a are sequentially provided on the base layer 111. The substrate layer 111 may be a PET layer. The film structure 11 can be prepared by conventional method of combining the substrate and the functional layer, which is not the focus of the present invention and thus will not be described herein.
Further, the material of the first adhesive layer 131 is PSA adhesive, preferably OCA optical adhesive. The bonding power of the OCA optical cement is greatly influenced by the temperature, the film structure 11 can be attached to the substrate 30 through the bonding power at normal temperature, the temperature of the film-coated display module 100 can reach 50-70 ℃ in the working state, the bonding power of the OCA optical cement is greatly reduced, and a higher degumming risk exists if the OCA optical cement is used for bonding the film structure 11 and the substrate 30 independently. The adhesive force of the second adhesive layer 133 is greater than that of the first adhesive layer 131, the second adhesive layer 133 is made of an optical structure adhesive, and the main components of the optical structure adhesive can include but are not limited to silica gel, hot melt adhesive, UV adhesive and the like, the optical structure adhesive is not sensitive to temperature, has the adhesive force of 2-3 Mpa at-40-200 ℃, is moderate in adhesive force and has repairability, the film structure 11 and the substrate 30 can be firmly bonded together without external force, the degumming risk does not exist, and the repairability optical structure adhesive can be peeled off only when the optical structure adhesive is subjected to a certain degree of external force. If the optical structure adhesive is used alone, although the two requirements of glue-shedding prevention and reworkability can be met, the optical structure adhesive covers the entire surface of the film structure 11, and the external force action to be applied is not small when the film structure is reworked, so that the second adhesive layer with high adhesive force and low temperature sensitivity of the adhesive force is arranged on the periphery of the first adhesive layer 131 with high temperature sensitivity by combining the first adhesive layer 131 and the second adhesive layer 133. The packaging effect of the film-coated display module 100 can be improved, the degumming risk is reduced, and the repair difficulty is small. In addition, the thickness of the second adhesive layer 133 is preferably consistent with the thickness of the first adhesive layer 131 to enhance the connection reliability.
The substrate 30 of the invention can be a conventional PCB substrate, and the LED chip is usually welded on the PCB substrate by laser welding, reflow soldering, etc., and then the film 10 is bonded on the surface of the PCB substrate having the LED chip, so as to obtain the film-coated display module, wherein the LED chip can be a MiniLED chip or a Micro LED chip.
The production process of the film-coated display module comprises the following steps:
(1) arranging a first adhesive layer in the middle of one side of the film structure, wherein the part of the film structure, which is not provided with the first adhesive layer, on the same side is a non-adhesive area;
(2) filling a second adhesive layer in the adhesive-free area, or arranging the second adhesive layer in the area of the substrate corresponding to the adhesive-free area, wherein the adhesive force of the second adhesive layer is greater than that of the first adhesive layer;
(3) and (3) attaching the film structure and the substrate by the first adhesive layer and the second adhesive layer, and curing the first adhesive layer and the second adhesive layer to obtain the film-coated display module.
In the production process of the film-coated display module, in the step (1), the periphery of the first adhesive layer is cut, and after the first adhesive layer is attached to the film structure, an exposed area can be reserved on the periphery of the film structure, wherein the exposed area is a non-adhesive area. In the step (2), the second adhesive layer is filled in the non-adhesive area or the area of the substrate corresponding to the non-adhesive area by glue spraying, glue dispensing, glue scraping or glue coating. The size of the non-glue area from the first glue layer to the edge of the film structure is 1-3 mm. The filling amount of the second adhesive layer is required to meet the condition that the thickness of the second adhesive layer is consistent with that of the first adhesive layer after the second adhesive layer is attached. In the step (3), the bonding conditions are as follows: the temperature is 60-120 ℃, and the pressure is 0.2-0.8 MPa. During curing, one side of the attached membrane structure is placed downwards on a smooth plane, and the membrane structure is cured for 45-50 h, preferably 48h, at room temperature in an environment with humidity not less than 60%.
The film-coated display module can also be repaired to obtain the repaired film-coated display module, and the repairing process comprises the following steps:
(1) heating the film-coated display module until the bonding force of the first adhesive layer is reduced, so that the first adhesive layer and the second adhesive layer between the film structure and the substrate fall off to realize the peeling of the film structure and the substrate;
(2) repairing the bad LED chips on the substrate;
(3) providing a new membrane structure, wherein the middle part of one side of the new membrane structure is also provided with a first adhesive layer, and a non-adhesive area is arranged around the first adhesive layer;
(4) refilling a new second glue layer in the glue-free area of the new film structure, or arranging a new second glue layer in the area of the substrate corresponding to the glue-free area;
(5) and (3) attaching the new film structure and the substrate by means of the first adhesive layer and the second adhesive layer, and curing the first adhesive layer and the second adhesive layer to obtain the repaired film-coated display module.
In the repair process of the film-coated display module, in the step (1), the film-coated display module is heated until the adhesive force of the first adhesive layer is reduced, and the specific heating temperature can be 70-95 ℃; the second adhesive layer is not sensitive to temperature, has 2-3 Mpa of adhesive force at-40-200 ℃, is moderate in adhesive force and has repairability, and external force is applied to the film structure after heating, so that the film structure and the substrate are peeled. After the peeling, the substrate can be sealed with a new cover film again, that is, the operations of steps (2) to (5) can be performed.
And (4) filling the second adhesive layer in the non-adhesive area or the area of the substrate corresponding to the non-adhesive area by spraying, dispensing, scraping or gluing. The size of the non-glue area from the first glue layer to the edge of the film structure is 1-3 mm. The filling amount of the second adhesive layer is required to meet the condition that the thickness of the second adhesive layer is consistent with that of the first adhesive layer after the second adhesive layer is attached. In the step (5), the bonding conditions are as follows: the temperature is 60-120 ℃, and the pressure is 0.2-0.8 MPa. During curing, one side of the attached membrane structure is placed downwards on a smooth plane, and the membrane structure is cured for 45-50 h, preferably 48h, at room temperature in an environment with humidity not less than 60%.
To better illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described with reference to specific examples. It should be noted that the following implementation of the method is a further explanation of the present invention, and should not be taken as a limitation of the present invention.
Example 1
The production process of the film-coated display module can comprise the following steps:
(1) arranging a first adhesive layer in the middle of one side of the film structure, and arranging a non-adhesive area around the first adhesive layer by cutting the periphery of the first adhesive layer;
(2) filling a second adhesive layer in the adhesive-free area by adopting an adhesive spraying mode, wherein the filling amount of the second adhesive layer is required to meet the requirement that the thickness of the adhered second adhesive layer is consistent with that of the first adhesive layer;
(3) and (3) laminating the film structure and the substrate by the first adhesive layer and the second adhesive layer, wherein one side of the substrate provided with the MiniLED faces the film structure, the laminating temperature is 100 ℃, the pressure is 0.5MP, one side of the laminated film structure is downwards placed on a smooth plane, and the laminated film structure is cured at room temperature for 48 hours in an environment with the humidity of more than or equal to 60% to obtain the film-coated display module.
The film-coated display module prepared by the production process comprises a plurality of layers of films and a substrate, wherein one surface of the substrate facing the films is provided with a plurality of LED chips, and the plurality of layers of films can comprise a film structure formed by stacking a plurality of layers and a glue layer covering one side of the film structure. The film structure comprises a PET layer, and a hardening layer, a reflecting layer and an anti-fingerprint layer which are sequentially arranged on the PET layer. The glue film includes first glue film and encloses to locate first glue film and the second glue film unanimous with first glue film thickness, and first glue film and second glue film cover the plane of membrane structure towards LED chip one side, and the membrane structure is by first glue film and second glue film adhesion in the base plate. The material of first glue film is OCA optical cement. The adhesive force of the second adhesive layer is larger than that of the first adhesive layer, the second adhesive layer is made of reworkable optical structure adhesive, and the main component of the second adhesive layer is silica gel. This tectorial membrane formula display module can reprocess, still can avoid the membrane structure edge to appear sticking up phenomenons such as limit, white limit, and can also greatly reduced risk of coming unstuck.
Further, when the display module needs to be repaired, the following steps may be performed to obtain a repaired coated display module.
(1) Heating the film-coated display module to 80 ℃, and peeling the film structure and the substrate by combining the action of external force;
(2) repairing the bad LED chips on the substrate;
(3) providing a new membrane structure, wherein the middle part of one side of the new membrane structure is also provided with a first adhesive layer, and a non-adhesive area is arranged around the first adhesive layer;
(4) refilling a new second glue layer in the glue-free area by adopting a glue spraying mode;
(5) and (3) bonding the new film structure and the substrate by the first adhesive layer and the second adhesive layer at the bonding temperature of 100 ℃ and the pressure of 0.5MP, placing one side of the bonded film structure downwards on a smooth plane, and curing at room temperature for 48 hours in an environment with the humidity of more than or equal to 60% to obtain the repaired film-coated display module.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it is not limited to the embodiments, and those skilled in the art should understand that the technical solutions of the present invention can be modified or substituted with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims (16)

1. The utility model provides a tectorial membrane formula display module, a serial communication port, including tectorial membrane and base plate, the one side of base plate has a plurality of LED chips, the tectorial membrane includes the membrane structure and covers in the glue film of membrane structure one side, the glue film includes first glue film and encloses to be located the second glue film of first glue film, first glue film with the second glue film covers the membrane structure towards the plane of chip one side, the cohesive force of second glue film is greater than first glue film, the membrane structure borrows by first glue film with the second glue film adhesion is in the base plate.
2. A film covered display module according to claim 1, wherein the film structure is formed by stacking a plurality of layers, the film structure comprising a substrate layer, the adhesive layer being disposed on one side of the substrate layer and a functional layer disposed on an opposite side of the substrate layer.
3. A coated display module according to claim 2, wherein the functional layer is at least one of an anti-fingerprint layer, a reflective layer and a hardened layer.
4. The film-covered display module according to claim 1, wherein the first adhesive layer is made of OCA optical adhesive.
5. The laminated display module of claim 4, wherein the second adhesive layer is a reworkable optical structure adhesive.
6. A coated display module as claimed in claim 1, wherein the distance from the edge of the first glue layer to the edge of the second glue layer on the side far from the first glue layer is 1-3 mm.
7. A production process of a film-covered display module, the film-covered display module comprising a film structure and a substrate, characterized by comprising the steps of:
(1) arranging a first adhesive layer in the middle of one side of the film structure, wherein the part of the same side of the film structure, which is not provided with the first adhesive layer, is a non-adhesive area;
(2) filling a second adhesive layer in the adhesive-free area, or arranging a second adhesive layer in the area of the substrate corresponding to the adhesive-free area, wherein the adhesive force of the second adhesive layer is greater than that of the first adhesive layer;
(3) and attaching the film structure and the substrate by the first adhesive layer and the second adhesive layer, and curing the first adhesive layer and the second adhesive layer to obtain the film-coated display module.
8. A production process of a film-covered display module according to claim 7, wherein the second glue layer is filled in the glue-free area or an area of the substrate corresponding to the glue-free area by glue spraying, glue dispensing, glue scraping or glue spreading.
9. A production process of a film-covered display module according to claim 7, wherein the size of the glue-free area from the first glue layer to the edge of the film structure is 1-3 mm.
10. A production process of a film-covered display module according to claim 7, wherein the attaching conditions are as follows: the temperature is 60-120 ℃, and the pressure is 0.2-0.8 MPa.
11. A process for producing a laminated display module according to claim 7, wherein the curing conditions are: the humidity is more than or equal to 60%, and the curing is carried out for 45-50 h at room temperature.
12. A repair process of a coated display module, which is used for repairing the coated display module of any one of claims 1 to 6, and is characterized by comprising the following steps:
(1) heating the film-coated display module until the bonding force of the first adhesive layer is reduced, so that the first adhesive layer and the second adhesive layer between the film structure and the substrate fall off to realize the peeling of the film structure and the substrate;
(2) repairing the bad LED chips on the substrate;
(3) providing a new membrane structure, wherein the middle part of one side of the new membrane structure is also provided with a first adhesive layer, and a non-adhesive area is arranged around the first adhesive layer;
(4) refilling a new second glue layer in the glue-free area of the new film structure, or arranging a new second glue layer in the area of the substrate corresponding to the glue-free area;
(5) and attaching the new film structure and the substrate by the first adhesive layer and the second adhesive layer, and curing the first adhesive layer and the second adhesive layer to obtain the repaired film-coated display module.
13. A repair process of a coated display module according to claim 12, wherein the heating temperature in the step (1) is 70-95 ℃.
14. A repairing process for a film-covered display module according to claim 12, wherein the second glue layer is filled in the glue-free area or the area of the substrate corresponding to the glue-free area by spraying, dispensing, scraping or gluing.
15. A repair process for a film-covered display module according to claim 12, wherein the conditions for bonding are as follows: the temperature is 60-120 ℃, and the pressure is 0.2-0.8 MPa.
16. A repair process for a film-covered display module according to claim 12, wherein the curing conditions are as follows: the humidity is more than or equal to 60%, and the curing is carried out for 45-50 h at room temperature.
CN202210567045.1A 2022-05-23 2022-05-23 Film-covered display module and production process and repair process thereof Pending CN114975733A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210567045.1A CN114975733A (en) 2022-05-23 2022-05-23 Film-covered display module and production process and repair process thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210567045.1A CN114975733A (en) 2022-05-23 2022-05-23 Film-covered display module and production process and repair process thereof

Publications (1)

Publication Number Publication Date
CN114975733A true CN114975733A (en) 2022-08-30

Family

ID=82985758

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210567045.1A Pending CN114975733A (en) 2022-05-23 2022-05-23 Film-covered display module and production process and repair process thereof

Country Status (1)

Country Link
CN (1) CN114975733A (en)

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