CN101457905A - Luminous unit - Google Patents
Luminous unit Download PDFInfo
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- CN101457905A CN101457905A CNA2007101998886A CN200710199888A CN101457905A CN 101457905 A CN101457905 A CN 101457905A CN A2007101998886 A CNA2007101998886 A CN A2007101998886A CN 200710199888 A CN200710199888 A CN 200710199888A CN 101457905 A CN101457905 A CN 101457905A
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- light
- led
- luminescence unit
- diaphragm
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Abstract
The invention relates to a lighting unit, comprising a shell body, a light guide plate and a light emitting diode module. One side of the light guide plate is provided with a light-in face; the light guide plate is arranged at the shell body; the light emitting diode module is adjacently arranged on the light-in face of the light guide plate; and the light emitting diode module is equipped with a substrate, a first sealed light emitting diode, a second sealed light emitting diode and a secondary adhesive; the first sealed light emitting diode and the second sealed light emitting diode are arranged on the substrate; and the secondary adhesive is extended from a first light-out face of the first sealed light emitting diode to a second light-out face of the second sealed light emitting diode.
Description
Technical field
The present invention relates to a kind of luminescence unit, particularly about a kind of luminescence unit with light emitting diode.
Background technology
Light emitting diode is by the made light-emitting component of semi-conducting material, and light-emitting component has two electrode terminals, applies minimum voltage between terminal, by the combination in electronics electricity hole, energy can be excited with the form of light and disengage.Recently, light emitting diode more is employed as liquid crystal indicator (Liquid Crystal Display Apparatus, the light source of backlight module LCD), and have and replace the trend of traditional cold cathodouminescence fluorescent tube as light source gradually.
Please refer to shown in Figure 1ly, it is a schematic diagram of the side direction type illuminating unit in the available liquid crystal display unit.Side direction type illuminating unit 1 comprises a light-emitting diode (LED) module 11, a framework 12, a light source cover 13, a LGP 14 and a reflection diaphragm 15.
Light-emitting diode (LED) module 11 comprises a plurality of encapsulation LEDs 111 and a substrate 112, and described encapsulation LED 111 is arranged on the substrate 112.Framework 12 is a hollow, rectangular framework, the part of substrate 112 pass framework 11 and with one drive circuit plate (not shown) electrically connect, and light source cover 13 is linked to a side of framework 12.
Please refer to shown in Figure 2ly, its side direction type illuminating unit 1 after for assembling is along the generalized section of the straight line A-A of Fig. 1.Encapsulation LED 111 has a chip 111a, a lead frame 111b, a plastic casing 111c and an adhesive body 111d.Chip 111a is arranged at lead frame 111b, and adhesive body 111d is coating chip 111a and is being placed among the plastic casing 111c, the part of plastic casing 111c coated wire frame 111b and expose lead (lead) L.Encapsulation LED 111 surface mount are in substrate 112, and then utilize colloid P that substrate 112 is smooth in light source cover 13, and the light that chip 111a is sent is via the reflective layer reflects of plastic casing 111c inwall, and jet-out plastic housing 111c.
Described encapsulation LED 111 is arranged to row in the face of an incidence surface 141 of LGP 14, when the light that is sent when encapsulation LED 111 enters LGP 14 via incidence surface 141, light can carry out total reflection and reach the effect of mixed light in LGP 14, and when light passes through the printing net-point of LGP 14 bottom surfaces, understand the total reflection phenomenon that produces scattering and destroy light, cause the part light refraction to go out the exiting surface 142 of LGP 14, and form an area source.In addition, be arranged at 15 light utilizations that can improve side direction type illuminating unit 1 of reflection diaphragm of LGP 14 bottom surfaces.
Yet each chip 111a can't produce the identical finished product of luminous frequency spectrum, so the crest wavelength of each chip 111a usually can be not identical in brilliant manufacture process of heap of stone.So for a light-emitting diode (LED) module 11, the light that the described encapsulation LED 111 that it had is sent is often even inadequately, and then the quality of side direction type illuminating unit 1 is affected.
Therefore, how to provide a kind of luminescence unit of more uniformly light-emitting, one of current just important topic.
Summary of the invention
Because above-mentioned problem the objective of the invention is to overcome the deficiencies in the prior art and defective, a kind of luminescence unit of more uniformly light-emitting is proposed.
For reaching above-mentioned purpose, the invention provides a kind of luminescence unit, comprise a housing, a LGP and a light-emitting diode (LED) module.One side of LGP has an incidence surface, LGP is arranged at housing, light-emitting diode (LED) module is adjacent to the incidence surface of LGP, and light-emitting diode (LED) module has a substrate, one first encapsulation LED, one second encapsulation LED and a secondary adhesive body, first encapsulation LED and second encapsulation LED are arranged at substrate, and the secondary adhesive body extends one second exiting surface to second encapsulating light emitting-diode by one first exiting surface of first encapsulation LED.
From the above, the present invention has following useful technique effect: the light-emitting diode (LED) module in the luminescence unit has the secondary adhesive body, at least coat first exiting surface of first encapsulation LED and second exiting surface of second encapsulation LED, to assist a plurality of encapsulation LEDs mixed light of going ahead of the rest.Compared with prior art, the secondary adhesive body in the luminous unit diode (led) module of the present invention is assisted mixed light, so make the luminous more even of luminescence unit.Therefore,, can relax the crest wavelength specification of selecting, and then reduce material cost for the chip in the described encapsulation LED.
Description of drawings
Fig. 1 is a schematic diagram of the side direction type illuminating unit in the available liquid crystal display unit;
Fig. 2 is the generalized section of the side direction type illuminating unit after assembling along the straight line A-A of Fig. 1;
Fig. 3 A is the schematic diagram according to the luminescence unit of first embodiment of the invention;
Fig. 3 B is a schematic top plan view of light-emitting diode (LED) module among Fig. 3 A;
Fig. 3 C is another aspect of secondary adhesive body among Fig. 3 B;
Fig. 4 A and Fig. 4 B are the schematic diagram that corresponding respectively a plurality of the encapsulation LEDs of the secondary adhesive body of different aspects are provided with;
Fig. 5 A is according to the luminescence unit among first embodiment of the invention Fig. 3 C, the schematic diagram that combines of its light-emitting diode (LED) module and housing and LGP;
Fig. 5 B is according to the luminescence unit among first embodiment of the invention Fig. 3 C, and wherein encapsulation LED is a top bright dipping type encapsulation LED;
Fig. 6 A and Fig. 6 B are one group of signal according to the luminescence unit of second embodiment of the invention
Figure.
Symbol description among the figure
1 side direction type illuminating unit
11,30,30a, 30b, 30C, 50,50 ' light-emitting diode (LED) module
111,31,32,51,52 encapsulation LEDs
The 111a chip
The 111b lead frame
The 111c plastic casing
The 111d adhesive body
112,34,34 ', 54 substrates
12 frameworks
13,24,44 light source covers
14,22,42 LGPs
141,221,421 incidence surfaces
142,223,423 exiting surfaces
15,23,43 reflection diaphragms
2,2a, 2b, 4,4 ' luminescence unit
21,41 housings
The 221a micro-structural
222,422 bottom surfaces
33,33a, 33b, 33c, 53 secondary adhesive bodies
311,321,331,331b, 331c exiting surface
55,55 ' optical diaphragm group
551 first mixed light diaphragms
552,552 ' the second mixed light diaphragm
The A-A straight line
The L lead
The P colloid
The R reflection graphic patterns
The S diffusion particle
The specific embodiment
Hereinafter with reference to relevant drawings, a kind of luminescence unit according to a plurality of embodiment of the present invention is described.
First embodiment
Please be simultaneously with reference to shown in Fig. 3 A and Fig. 3 B, wherein Fig. 3 B is a schematic top plan view of light-emitting diode (LED) module among Fig. 3 A.A kind of luminescence unit 2 of first embodiment of the invention comprises a housing 21, a LGP 22 and a light-emitting diode (LED) module 30.Wherein, luminescence unit 2 is an example with the backlight module that is applied to a liquid crystal indicator, but not as limit, luminescence unit 2 also can be applicable to the fields such as light source, normal lighting equipment, large-scale billboards, various display unit and Medical Instruments of electronic installations such as scanner.
One side of LGP 22 has an incidence surface 221, LGP 22 is arranged at housing 21, the material of LGP 22 can for example be Merlon (Polycarbonate, PC), polystyrene (Polystyrene, PS), methyl methacrylate-styrene (Methly-methacrylate-Styrene, MS) or polymethyl methacrylate (PolymethlyMethacrylate, PMMA).
Generally speaking, light-emitting diode (LED) module 30 can be described as a light-emitting section (Light Bar) again, light-emitting diode (LED) module 30 is adjacent to the incidence surface 221 of LGP 22, and has one first encapsulation LED 31, one second encapsulation LED 32, a secondary adhesive body 33 and a substrate 34.Certainly, light-emitting diode (LED) module 30 can have the encapsulation LED (shown in Fig. 3 A and Fig. 3 B) more than three, wherein, the light color that first encapsulation LED 31 and second encapsulation LED 32 are sent can be identical or inequality, for example can send white light, ultraviolet light, ruddiness, green glow or blue light respectively, even the light that first encapsulation LED 31 and second encapsulation LED 32 are sent can be mixed into white light.In addition, first encapsulation LED 31 and second encapsulation LED 32 are arranged on the substrate 34, substrate 34 can be a lead frame or a circuit board, the substrate 34 of present embodiment is an example with a printed circuit board (PCB), and first encapsulation LED 31 and second encapsulation LED 32 can be one dimension or two-dimensional arrangements, are arranged on the substrate 34 of long strip type.
On implementing, processing procedures such as utilisation point glue, wire mark or coating, and secondary adhesive body 33 is extended one second exiting surface 321 to second encapsulation LED 32 by one first exiting surface 311 of first encapsulation LED 31, the above-mentioned processing procedure that utilizes resin to carry out secondary sealing (doublemolding) again can make secondary adhesive body 33 be covered in the exiting surface 311,321 of described encapsulation LED 31,32.In addition, secondary adhesive body 33 can also protect the electrical contact of described encapsulation LED 31,32 and substrate 34 not to be subjected to the harm of aqueous vapor and oxygen.Moreover because secondary adhesive body 33 envelopes described encapsulation LED 31,32, therefore, described encapsulation LED 31,32 light that sent can carry out mixed light earlier earlier in secondary adhesive body 33, and the bright dipping side by secondary adhesive body 33 penetrates again.Moreover the material of secondary adhesive body 33 can be selected the material of refractive index smaller or equal to the packaging body of those encapsulation LEDs 31,32 for use, makes secondary adhesive body 33 can increase the light extraction efficiency of encapsulation LED 31,32.
Please refer to shown in Fig. 3 C, it shows another aspect of secondary adhesive body.Secondary adhesive body 33a covers first encapsulation LED 31 and second encapsulation LED 32 fully and has an exiting surface 331.Described encapsulation LED 31,32 light that sent can carry out mixed light earlier earlier in secondary adhesive body 33a, the exiting surface 331 by secondary adhesive body 33a penetrates again.And the thickness of secondary adhesive body 33a comes thickly than the thickness of secondary adhesive body 33, so the uniformity of mixed light also can be relatively good.In addition, when substrate 34 was a flexible circuit board, secondary adhesive body 33a also can strengthen mechanism's intensity of light-emitting diode (LED) module 30a, for follow-up assembling and location, had the effect that promotes packaging efficiency.
Please be simultaneously with reference to Fig. 4 A and Fig. 4 B, it is the schematic diagram of corresponding respectively a plurality of encapsulation LED 31,32 settings of secondary adhesive body 33b, 33c of different aspects.In the present embodiment, the shape of secondary adhesive body can also have many different change of shape aspects except can be a rectangular column.In Fig. 4 A, the exiting surface 331b of secondary adhesive body 33b can have a micro-structural or a geometry (Fig. 4 B), to promote the efficient of beam projecting secondary adhesive body 33b, wherein the cross sectional shape of micro-structural or geometry be selected from arc, triangle, polygon and difform one of them, cross sectional shape with micro-structural among Fig. 4 A is that the prism structure that a plurality of triangle is formed is an example, and the exiting surface 331c of the secondary adhesive body 33c among Fig. 4 B is that the microlens structure (microlens structure) that a plurality of arc is formed is an example with the cross sectional shape of micro-structural then.
Please refer to Fig. 4 A again, in the present embodiment, secondary adhesive body 33b still can have a plurality of diffusion particle S, diffusion particle S can sneak among the secondary adhesive body 33b, to allow described encapsulation LED 31,32 light that sent to improve the mixed light effect of light-emitting diode (LED) module 30b via penetrating by exiting surface 331b again after the diffusion particle S scattering.Certainly, except diffusion particle S, other is diffusion structure such as bubble or printing net-point for example, also can be formed at the surface of secondary adhesive body 33b or it is inner.In addition, the exiting surface of secondary adhesive body 33b also can have a plurality of phosphor bodies or wavelength modulation material (not shown), to change the wavelength of described encapsulation LED 31,32 emitted lights, for example encapsulation LED 31,32 sends ultraviolet light, converts white light to via the phosphor body that is doped in secondary adhesive body 33b.
Then, please refer to Fig. 5 A, it is the light-emitting diode (LED) module 30a of Fig. 3 C and the schematic diagram that combines of housing 21 and LGP 22.Described encapsulation LED 31,32 can be respectively a top bright dipping type (Top View Type) encapsulation LED.In the present embodiment, incidence surface 221 has a micro-structural 221a, the cross sectional shape of micro-structural 221a be selected from arc, linear, triangle, polygon and difform one of them, be that an irregular coarse surface is an example with micro-structural 221a among Fig. 5 A, to promote the impingement rate of light incident LGP 22.
Shown in Fig. 5 B, described encapsulation LED 31,32 also can be respectively a side bright dipping type (Side View Type) encapsulation LED, and substrate 34 ' is also established by the upright of Fig. 5 A, and is parallel to the exiting surface 223 of LGP 22 instead.In addition, the exiting surface of the encapsulation LED among Fig. 5 B 31,32 is coated by a plurality of secondary adhesive bodies 33,33a.Wherein, the refraction coefficient of secondary adhesive body 33,33a can progressively successively decrease, to increase the light extraction efficiency of encapsulation LED 31,32.
After penetrating by secondary adhesive body 33,33a by described encapsulation LED 31,32 emitted light, inject LGP 22 by the incidence surface 221 of LGP 22 again.Can carry out total reflection after the light incident and reach the effect of further mixed light, when light is incident upon a bottom surface 222 of LGP 22, bottom surface 222 can be provided with the printing net-point (not shown) so that light scattering and destroy the total reflection phenomenon of light, cause the part light refraction to go out the exiting surface 223 of LGP 22, form an area source.Because the light that described encapsulation LED 31,32 is sent via just penetrating behind the secondary adhesive body 33a mixed light, is made further mixed light via LGP 22, so can promote the even light mixing of luminescence unit 2a, 2b earlier again.
Referring again to Fig. 5 A and Fig. 5 B, in the present embodiment, luminescence unit 2a, 2b more can comprise a reflection diaphragm 23 and a light source cover 24, reflection diaphragm 23 is adjacent to the bottom surface 222 of LGP 22, to promote the light utilization of luminescence unit 2a, 2b, 24 of light source covers are arranged at a side of housing 21 and cover light-emitting diode (LED) module 30a, 30b.Wherein, the inwall of light source cover 24 can have the reflecting layer, so that the light of incident LGP 22 not in encapsulation LED 31,32 light that sent, the incident LGP 22 via light source cover 24 reflections, and then improve light utilization.Wherein, light source cover 24 mode that can lock, stick, engage or weld is incorporated on the housing 21.In the present embodiment, the cross section of light source cover 24 forms a recess, can ccontaining light-emitting diode (LED) module 30a, 30b, and can assist light-emitting diode (LED) module 30a, 30b are fixed in housing 21.
Second embodiment
Please refer to Fig. 6 A, it is a schematic diagram of the luminescence unit 4 of second embodiment of the invention.Luminescence unit 4 comprises a housing 41, a LGP 42 and a light-emitting diode (LED) module 50.Wherein, luminescence unit 2 differences of the luminescence unit 4 and first embodiment are, luminescence unit 4 more comprises one first mixed light diaphragm 551 and one second mixed light diaphragm 552, the first mixed light diaphragm 551 and the second mixed light diaphragm 552 form an optical diaphragm group 55, and can be selected from respectively group that a diffusion barrier sheet (diffusion sheet), a diffusion sheet material (diffusion plate), a prism diaphragm (prism sheet), a reversed prism diaphragm (down type prism sheet) and combination thereof constituted one of them.In the present embodiment, the first mixed light diaphragm 551 is a diffusion barrier sheet, and the second mixed light diaphragm 552 then is a prism diaphragm, and the first mixed light diaphragm 551 and the second mixed light diaphragm 552 can be superimposed with each other or bind.Wherein, the prism facets of the second mixed light diaphragm 552 is to LGP 42, to increase the directionality of light-emitting diode (LED) module 50 bright dippings.Also can assist the mixed light of described encapsulation LED 51,52 by the first mixed light diaphragm 551 and the second mixed light diaphragm 552.In addition, a light inlet side of the first mixed light diaphragm 551 more can have at least one reflection graphic patterns R, and corresponding each encapsulation LED 51,52 of reflection graphic patterns R is provided with, and with the light of the direct incident first mixed light diaphragm 551 in reflecting part, can make light intensity comparatively even.
Shown in Fig. 6 B, it discloses the luminescence unit 4 ' of another aspect of present embodiment.Be with Fig. 6 A difference, optical diaphragm group 55 ' comprises two second mixed light diaphragms 552 ' and one first mixed light diaphragm 551, and the first mixed light diaphragm 551 is arranged between the described second mixed light diaphragm 552 ', the first mixed light diaphragm 551 is a diffusion barrier sheet, and the second mixed light diaphragm 552 ' is respectively a reversed prism diaphragm, the second mixed light diaphragm 552 ' and the first mixed light diaphragm 551 bind mutually, and the prism of the described second mixed light diaphragm 552 ' is being example towards described encapsulation LED 51,52.Thus, can sacrifice the characteristic of blooming piece optically focused, and the light by optical diaphragm group 55 ' is more spread, and then promote the even light mixing of light-emitting diode (LED) module 50 '.
In addition, in the present embodiment, light-emitting diode (LED) module 50,50 ' encapsulation LED 51,52 are that two rows are arranged side by side on substrate 54, with increase encapsulation LED module 50,50 ' go out luminous intensity.
In sum, has the secondary adhesive body according to the light-emitting diode (LED) module in a kind of luminescence unit of the present invention, at least coat first exiting surface of first encapsulation LED and second exiting surface of second encapsulation LED, to assist a plurality of encapsulation LEDs mixed light of going ahead of the rest.Compared with prior art, the secondary adhesive body in the luminous unit diode (led) module of the present invention is assisted mixed light, so make the luminous more even of luminescence unit.Therefore,, can relax the crest wavelength specification of selecting, and then reduce material cost for the chip in the described encapsulation LED.
The above only is an illustrative, but not is restricted.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the scope of claims its equivalent modifications of carrying out or change.
Claims (11)
1. a luminescence unit is characterized in that, comprises:
One housing;
One LGP, the one side has an incidence surface, and this LGP is arranged at this housing; And
One light-emitting diode (LED) module, be adjacent to this incidence surface of this LGP, and this light-emitting diode (LED) module has a substrate, one first encapsulation LED, one second encapsulation LED and a secondary adhesive body, this first encapsulation LED and this second encapsulation LED are arranged at this substrate, and this secondary adhesive body extends one second exiting surface to this second encapsulation LED by one first exiting surface of this first encapsulation LED.
2. luminescence unit as claimed in claim 1 wherein, more comprises:
One first mixed light diaphragm, this first mixed light diaphragm is arranged between this light-emitting diode (LED) module and this LGP.
3. luminescence unit as claimed in claim 2, wherein, this first mixed light diaphragm be selected from a prism diaphragm, a diffusion barrier sheet, a diffusion sheet material, a reversed prism diaphragm and group that combination constituted thereof at least one of them.
4. luminescence unit as claimed in claim 2, wherein, a light inlet side of this first mixed light diaphragm has more at least one reflection graphic patterns, and this reflection graphic patterns correspondence respectively this encapsulation LED is provided with.
5. luminescence unit as claimed in claim 2 wherein, more comprises:
One second mixed light diaphragm is superimposed with each other with this first mixed light diaphragm or fits mutually.
6. luminescence unit as claimed in claim 5, wherein, this second mixed light diaphragm be selected from a prism diaphragm, a diffusion barrier sheet, a diffuser plate, a reversed prism diaphragm and group that combination constituted thereof at least one of them.
7. luminescence unit as claimed in claim 1, wherein, this secondary adhesive body has a plurality of diffusion particles, a plurality of bubble or a plurality of printing net-point.
8. luminescence unit as claimed in claim 1 wherein, is doped with a plurality of phosphor bodies or wavelength modulation material in this secondary adhesive body.
9. luminescence unit as claimed in claim 1, wherein, an exiting surface of this secondary adhesive body has a fluorescent layer or a wavelength regulating layer.
10. luminescence unit as claimed in claim 1, wherein, the refraction coefficient of this secondary adhesive body is smaller or equal to the refraction coefficient of the packaging body of this first encapsulation LED or this second encapsulation LED.
11. luminescence unit as claimed in claim 1, wherein, this secondary adhesive body covers this first encapsulation LED and this second encapsulation LED fully.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101998886A CN101457905A (en) | 2007-12-14 | 2007-12-14 | Luminous unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101998886A CN101457905A (en) | 2007-12-14 | 2007-12-14 | Luminous unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101457905A true CN101457905A (en) | 2009-06-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101998886A Pending CN101457905A (en) | 2007-12-14 | 2007-12-14 | Luminous unit |
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| Country | Link |
|---|---|
| CN (1) | CN101457905A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102137217A (en) * | 2010-01-25 | 2011-07-27 | 鸿富锦精密工业（深圳）有限公司 | Image scanning device |
| CN102661575A (en) * | 2012-04-28 | 2012-09-12 | 北京星光影视设备科技股份有限公司 | Light condensation and guide post and LED (Light-Emitting Diode) spotlight thereof |
| CN103901665A (en) * | 2012-12-26 | 2014-07-02 | 乐金显示有限公司 | Backlight unit and liquid crystal display device including the same |
| CN109686833A (en) * | 2018-12-21 | 2019-04-26 | 逄博 | The secondary glue sealing method of Luminous Ring |
| CN111722432A (en) * | 2019-03-20 | 2020-09-29 | 海信视像科技股份有限公司 | LED lamp panel, preparation method, backlight module and display device |
-
2007
- 2007-12-14 CN CNA2007101998886A patent/CN101457905A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102137217A (en) * | 2010-01-25 | 2011-07-27 | 鸿富锦精密工业（深圳）有限公司 | Image scanning device |
| CN102661575A (en) * | 2012-04-28 | 2012-09-12 | 北京星光影视设备科技股份有限公司 | Light condensation and guide post and LED (Light-Emitting Diode) spotlight thereof |
| CN103901665A (en) * | 2012-12-26 | 2014-07-02 | 乐金显示有限公司 | Backlight unit and liquid crystal display device including the same |
| CN103901665B (en) * | 2012-12-26 | 2016-08-17 | 乐金显示有限公司 | Back light unit and include the liquid crystal display of this back light unit |
| CN109686833A (en) * | 2018-12-21 | 2019-04-26 | 逄博 | The secondary glue sealing method of Luminous Ring |
| CN111722432A (en) * | 2019-03-20 | 2020-09-29 | 海信视像科技股份有限公司 | LED lamp panel, preparation method, backlight module and display device |
| CN111722432B (en) * | 2019-03-20 | 2022-12-02 | 海信视像科技股份有限公司 | LED lamp panel, preparation method, backlight module and display device |
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Open date: 20090617 |