CN109686833A - The secondary glue sealing method of Luminous Ring - Google Patents
The secondary glue sealing method of Luminous Ring Download PDFInfo
- Publication number
- CN109686833A CN109686833A CN201811571531.0A CN201811571531A CN109686833A CN 109686833 A CN109686833 A CN 109686833A CN 201811571531 A CN201811571531 A CN 201811571531A CN 109686833 A CN109686833 A CN 109686833A
- Authority
- CN
- China
- Prior art keywords
- luminous ring
- epoxy resin
- frame
- early
- products
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C7/00—Sorting by hand only e.g. of mail
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The present invention relates to a kind of preparation methods of display element.Purpose is to provide a kind of secondary glue sealing method of Luminous Ring, and this method can discover whether quality flaw during sealing, moves forward so that quality inspection be worked；To reduce the generation of substandard product to the greatest extent, product qualification rate is improved, reduces production cost.Technical solution is: the secondary glue sealing method of Luminous Ring follows the steps below: 1) after carrying out impurity removing processing to the frame of Luminous Ring, pasting encapsulating high temperature gummed tape in the front of frame, then the back side is laid flat on the table upward；2) first time epoxy resin is injected from the back side of frame, injection rate is that then the 30-35% of frame reflection cavity volume carries out deaeration processing, then carrying out baking makes epoxy resin cure form the positive light-emitting surface of Luminous Ring, obtains early-products；3) first time quality inspection is carried out to early-products, is the visual examination for light emitting region, rejects the part early-products containing sundries.
Description
Technical field
The present invention relates to a kind of preparation methods of display element, the specifically method of the secondary sealing of Luminous Ring.
Background technique
Display element is the important component in each electronic product, for the real-time of electronic product Various types of data information image
Decorative model outside display and product has the function of key.With the rapid development of scientific and technological progress, each electron-like is newly produced
Product continue to bring out, and need corresponding matched display element also more and more.However display element encounter in the production process it is micro-
Small sundries problem has become the factor for influencing product quality.Due to being needed in light-emitting component manufacturing process using epoxy resin pair
Pcb board and electronic component carry out disposable sealing, if being mixed into the ash in the attachment, air that material itself has in sealing
The sundries such as the particulate generated in dirt, human body bring soft flocks and manufacture course of products, display element shines when energization is examined
Corresponding blackspot, filiform, choice refreshments etc. will be generated on face, and illumination effect and image product are brought and seriously affected.Especially
It is the cyclic annular display element of Luminous Ring etc, the front of entire annular is light-emitting surface, sundries is brought at one into as long as having, product
Visual effect will be severely impacted, thus product (pcb board including wherein circular ring shape) can only be scrapped.At this point, product
Entire manufacturing process has been completed, and all early investments waste.
Summary of the invention
The purpose of the present invention is overcoming the shortcomings of in above-mentioned background technique, a kind of secondary glue sealing method of Luminous Ring is provided, is somebody's turn to do
Method should be able to can discover whether quality flaw during sealing, move forward so that quality inspection be worked；To reduce to the greatest extent and keep away
Exempt from the generation of substandard product, improve product qualification rate, reduces production cost.
Present invention provide the technical scheme that
The secondary glue sealing method of Luminous Ring, follows the steps below:
1) after carrying out impurity removing processing to the frame of Luminous Ring, encapsulating high temperature gummed tape is pasted in the front of frame, is then carried on the back
It lays flat on the table up；
2) from the back side of frame inject first time epoxy resin, injection rate be frame reflection cavity volume 30-35% then
Deaeration processing is carried out, then carrying out baking makes epoxy resin cure form the positive light-emitting surface of Luminous Ring, obtains early-products；
3) first time quality inspection is carried out to early-products, is the visual examination for light emitting region, rejects the part containing sundries
Early-products；
4) the qualified early-products back side is laid flat on the table upward, then second of injection epoxy resin is taken off
Bubble processing；
5) pcb board (7) is pressed into epoxy resin layer with the electronic component for connecting pcb board one by one, epoxy resin is made to cover PCB
The back side of plate, and the gap in pcb board and early-products between light-emitting surface is stuffed entirely with, then carrying out baking consolidates epoxy resin
Change, obtains semi-finished product；
6) then the encapsulating high temperature gummed tape for tearing semi-finished product off carries out second of quality inspection, including photoelectric properties and appearance detection；
Qualified semi-finished product are sent into subsequent processing operation.
First time quality inspection in the step 3) is rejected the early-products for accompanying visual sundries using visual view mode.
Second of injection epoxy resin in the step 4), injection rate are the 45-50% of frame reflection cavity volume；Then
Carry out deaeration processing.
Second of quality inspection in the step 6) is that will shine after Luminous Ring turn-on power, to the Integral luminous of Luminous Ring
Effect is tested.
Deaeration processing in the step 2), step 4) is carried out in vacuum drying oven.
The beneficial effects of the present invention are:
Method provided by the invention can reject the early-products that sundries is had in Luminous Ring light-emitting surface, thus significantly
Reduce the probability that finished product light-emitting surface has sundries, and the qualification rate for significantly improving product (according to measuring and calculating, improves product qualification rate
15% or so)；And the early-products being removed are free of the pcb board (printed wiring board) and associated electronic components (such as LED of high value
Light-emitting component), thus extremely low (being only the frame and epoxy resin glue of some low values) is lost, and considerably reduce and be produced into
This, remarkable in economical benefits.
Detailed description of the invention
Fig. 1 is the schematic view of the front view of Luminous Ring frame in the present invention.
Fig. 2 is the overlooking structure diagram (sectional structure) of Luminous Ring frame in the present invention.
Fig. 3 is the right side structural representation (sectional structure) of Luminous Ring frame in the present invention.
Fig. 4 is the schematic view of the front view that the Luminous Ring frame after first time epoxy resin is injected in the present invention.
Fig. 5 is the overlooking structure diagram that the Luminous Ring frame after first time epoxy resin is injected in the present invention.
Fig. 6 is the schematic view of the front view of the Luminous Ring frame after injecting second of epoxy resin in the present invention.
Fig. 7 is the overlooking structure diagram of the Luminous Ring frame after injecting second of epoxy resin in the present invention.
Specific embodiment
Below in conjunction with Figure of description, the invention will be further described, but the invention is not limited to following embodiments.
Fig. 1 is to Luminous Ring frame shown in Fig. 3, including differing in size and coaxially arranged inner ring 3 and outer ring 1, and
Radial several reinforcing ribs 2 being arranged between inner ring and outer ring and be linked together inner ring and outer ring；It is also aobvious in figure
Show: these reinforcing ribs are located at the intermediate position of Luminous Ring frame axial direction, so that the space between inner ring and outer ring forms hair
The reflection cavity of ring of light frame.After epoxy resin sealing, all reinforcing ribs coat all epoxy resin in reflection cavity.
Defect existing for epoxy resin sealing disposably is carried out to Luminous Ring in view of existing, present invention employs below
Secondary glue sealing method:
1) dust removal processing first is carried out to the frame of Luminous Ring；Encapsulating high temperature gummed tape is pasted in the front of frame later, then
The back side is laid flat on the table (as shown in Figure 2 upward；Encapsulating tape is omitted in figure)；Luminous Ring is positive to be needed to keep smooth,
The Luminous Ring frame back side for pasting encapsulating tape thus can lie in upward on sizeable plate to (plate is then placed on work
Make on platform), in favor of the movement of Luminous Ring frame (as being sent into baking oven baking).
2) first time epoxy resin (first time sealing) is injected from the back side of frame, injection rate is frame reflection cavity volume
30-35%；Then frame is sent into vacuum drying oven and carries out deaeration processing and baking, epoxy resin is made to solidify to form envelope for the first time
Glue-line 5 (is located at the positive light-emitting surface of Luminous Ring), obtains early-products (referring to fig. 4, Fig. 5).
3) first time quality inspection is carried out to early-products, rejects the part early-products containing sundries；The secondary quality inspection can be used visually
View mode, by the early-products for accompanying visual sundries reject (sundries include the material itself fallen into colloid have it is subtle attached
The particulate etc. generated in object, the dust in air, human body bring soft flocks and manufacture course of products；Tiny is not visible miscellaneous
Influence of the object to light-emitting surface can be bordering on ignorance).
4) the remaining qualified early-products back side is laid flat on the table upward, from the back side of qualified early-products, for the second time
It injects epoxy resin (second of sealing), then frame is sent into vacuum drying oven and carries out deaeration processing and baking.
5) by pcb board 7 with connect the electronic component (show in Fig. 7 pcb board, omit electronic component) of pcb board according to normal
Technique is advised to require to be located in the epoxy resin layer top of early-products one by one in indentation epoxy resin liquid 6；So that epoxy resin liquid
Body layer all covers the upper and lower surface of pcb board, and the gap in the pcb board of circular ring shape 7 and early-products between light-emitting surface is whole
Filling,；Finally carrying out baking makes epoxy resin cure form second of adhesive layer 6, obtains semi-finished product (referring to Fig. 6, Fig. 7).
6) the encapsulating high temperature gummed tape for tearing semi-finished product off, then carries out second of quality inspection；Second of quality inspection is by Luminous Ring
So that it is shone after powering on, tests to the Integral luminous effect of Luminous Ring；It can be by reviewer's sight check.Second
When sealing, even if subtle attachment, the dust in air, human body bring soft flocks and product manufacturing mistake that material itself has
The sundries such as the particulate generated in journey fall into also little on the influence of the display effect of product in colloid.
A small amount of rejected product is rejected, and qualified semi-finished product are then sent into subsequent processing operation.
In Fig. 2, Fig. 5, Fig. 7, the front of Luminous Ring frame is downward.
Finally it should be noted that the above enumerated are only specific embodiments of the present invention.It is clear that the invention is not restricted to
Above embodiments can also have many variations.Those skilled in the art can directly lead from present disclosure
Out or all deformations for associating, it is considered as protection scope of the present invention.
Claims (5)
1. the secondary glue sealing method of Luminous Ring, follows the steps below:
1) after carrying out impurity removing processing to the frame of Luminous Ring, encapsulating high temperature gummed tape is pasted in the front of frame, then back side court
On lay flat on the table；
2) first time epoxy resin is injected from the back side of frame, injection rate is the 30-35% of frame reflection cavity volume；Then it carries out
Deaeration processing, then carrying out baking makes epoxy resin cure form the positive light-emitting surface of Luminous Ring, obtains early-products；
3) first time quality inspection is carried out to early-products, is the visual examination for light emitting region, rejected the part containing sundries and just make
Product；
4) the qualified early-products back side is laid flat on the table upward, then second of injection epoxy resin carries out at deaeration
Reason；
5) pcb board (7) is pressed into epoxy resin layer with the electronic component for connecting pcb board one by one, makes epoxy resin covering pcb board
The back side, and the gap in pcb board and early-products between light-emitting surface is stuffed entirely with, then carrying out baking makes epoxy resin cure,
Obtain semi-finished product；
6) then the encapsulating high temperature gummed tape for tearing semi-finished product carries out second of quality inspection, including photoelectric properties and appearance detection；It will close
Lattice semi-finished product are sent into subsequent processing operation.
2. the secondary glue sealing method of Luminous Ring according to claim 1, it is characterised in that: the first time matter in the step 3)
Inspection is rejected the early-products for accompanying visual sundries using visual view mode.
3. the secondary glue sealing method of Luminous Ring according to claim 2, it is characterised in that: second of note in the step 4)
Enter epoxy resin, injection rate is the 45-50% of frame reflection cavity volume；Then deaeration processing is carried out.
4. the secondary glue sealing method of Luminous Ring according to claim 3, it is characterised in that: second of matter in the step 6)
Inspection is to test shining after Luminous Ring turn-on power to the Integral luminous effect of Luminous Ring.
5. the secondary glue sealing method of Luminous Ring according to claim 4, it is characterised in that: in the step 2), step 4)
Deaeration processing is carried out in vacuum drying oven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811571531.0A CN109686833B (en) | 2018-12-21 | 2018-12-21 | Secondary sealing method for luminous ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811571531.0A CN109686833B (en) | 2018-12-21 | 2018-12-21 | Secondary sealing method for luminous ring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109686833A true CN109686833A (en) | 2019-04-26 |
| CN109686833B CN109686833B (en) | 2020-10-16 |
Family
ID=66188646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811571531.0A Active CN109686833B (en) | 2018-12-21 | 2018-12-21 | Secondary sealing method for luminous ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109686833B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270901A (en) * | 2001-03-12 | 2002-09-20 | Citizen Electronics Co Ltd | Light emitting diode and its manufacturing method |
| JP2007109911A (en) * | 2005-10-14 | 2007-04-26 | Renesas Technology Corp | Light emitting diode and its manufacturing method |
| CN101355125A (en) * | 2007-07-27 | 2009-01-28 | 李氏工业有限公司 | Method for encapsulating LED wafer |
| CN101457905A (en) * | 2007-12-14 | 2009-06-17 | 启萌科技有限公司 | Luminous unit |
| CN101799135A (en) * | 2010-02-21 | 2010-08-11 | 迪亚士照明有限公司 | Process for manufacturing flexible lamp belts |
| CN103594604A (en) * | 2013-10-30 | 2014-02-19 | 王定锋 | LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof |
-
2018
- 2018-12-21 CN CN201811571531.0A patent/CN109686833B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270901A (en) * | 2001-03-12 | 2002-09-20 | Citizen Electronics Co Ltd | Light emitting diode and its manufacturing method |
| JP2007109911A (en) * | 2005-10-14 | 2007-04-26 | Renesas Technology Corp | Light emitting diode and its manufacturing method |
| CN101355125A (en) * | 2007-07-27 | 2009-01-28 | 李氏工业有限公司 | Method for encapsulating LED wafer |
| CN101457905A (en) * | 2007-12-14 | 2009-06-17 | 启萌科技有限公司 | Luminous unit |
| CN101799135A (en) * | 2010-02-21 | 2010-08-11 | 迪亚士照明有限公司 | Process for manufacturing flexible lamp belts |
| CN103594604A (en) * | 2013-10-30 | 2014-02-19 | 王定锋 | LED support with electrodes being fully wrapped and packaged, SMD LED lamp and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109686833B (en) | 2020-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111460710B (en) | Composite material solidification deformation simulation modeling method based on wire laying track | |
| CN101803958A (en) | Integrated fiber post for dental restoration and preparation method thereof | |
| CN103200789A (en) | Printed circuit board transplanting technology | |
| CN109686833A (en) | The secondary glue sealing method of Luminous Ring | |
| CN107889353B (en) | Method for processing rigid-flex board with reinforcing structure on outer-layer flexible golden finger | |
| US9302455B1 (en) | Fast cure process | |
| CN207256921U (en) | Lipstick cap automatic setup system | |
| CN109950181B (en) | Production and processing technological process of LED nixie tube | |
| TWM430127U (en) | Metal housing with plastic member of composite parts | |
| CN105140326B (en) | A kind of structural member with photovoltaic module and preparation method thereof | |
| CN209126055U (en) | Lens mold detection device | |
| CN105328863B (en) | A kind of high-precision automatic assembling and packaging system for injecting products | |
| CN112937072A (en) | Method for maintaining defects before full-lamination curing of liquid optical cement | |
| CN112406002B (en) | Forming production method of light guide plate | |
| CN108549764A (en) | A kind of Automobile instrument structure optimization method based on Moldflow analyses | |
| CN207088431U (en) | A kind of car headlamp lampshade injection molding detection means | |
| CN208240720U (en) | A kind of integrated assembly line of SMD encapsulation | |
| CN207077835U (en) | One kind exempts from gluing composite board | |
| CN106783654B (en) | Method for manufacturing protection structure for testing bare chip | |
| CN115020390A (en) | COB packaging mode | |
| CN214354708U (en) | High-transparency protective film | |
| CN205280610U (en) | Whole membrane outward appearance of silica gel key detects machine | |
| CN202934727U (en) | Right angular flange combined mold used in vacuum resin infusion process | |
| CN218180699U (en) | A verifying attachment for socks | |
| CN206718519U (en) | A kind of vacuum for being used to prepare fiberglass imports former |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200908 Address after: No. 1418-27, Moganshan Road, Hangzhou, Zhejiang Province Applicant after: HANGZHOU SANGAO OPTOELECTRONIC TECHNOLOGY Co.,Ltd. Address before: The City Industrial Park, No. 1418-27 Hangzhou City, Zhejiang province Gongshu District Moganshan Road 310000 Applicant before: Pang Bo |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |