CN109950181B - Production and processing technological process of LED nixie tube - Google Patents
Production and processing technological process of LED nixie tube Download PDFInfo
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- CN109950181B CN109950181B CN201910244827.XA CN201910244827A CN109950181B CN 109950181 B CN109950181 B CN 109950181B CN 201910244827 A CN201910244827 A CN 201910244827A CN 109950181 B CN109950181 B CN 109950181B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000012545 processing Methods 0.000 title claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 52
- 238000001514 detection method Methods 0.000 claims abstract description 29
- 239000011265 semifinished product Substances 0.000 claims abstract description 21
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- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000000047 product Substances 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 238000012360 testing method Methods 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 19
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- 235000009161 Espostoa lanata Nutrition 0.000 claims description 3
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Abstract
The invention discloses a production and processing process flow of an LED nixie tube, which comprises a die bonding process, a routing process, circuit board equipment detection, circuit board manual detection, packaging gluing, baking and secondary testing; the invention rapidly finishes the front-end process through the automatic die bonding and routing processes, carries out quality approval on semi-finished products through double rechecks of machines and manpower, reuses reworkable products, improves the quality of the nixie tube through a segmented baking mode, effectively prevents resin glue from aging due to uneven heating and overlong heating time by adopting a segmented low-temperature baking mode, and finally detects and guarantees the yield and controls the quality of the nixie tube.
Description
Technical Field
The invention relates to the technical field of production of LED nixie tubes, in particular to a production and processing process flow of an LED nixie tube.
Background
The LED nixie tube is formed by packaging a plurality of light emitting diodes together, has the effects of single red, yellow, blue, green, white, yellow green and the like in color, can be used for lightening the outlines of buildings, roads and river banks, can be uniformly distributed to form a large-area display area, can display patterns and characters, can play video files with different formats, and can play files such as flash, animation, characters and the like under a computer or design personalized animation by using animation design software to play various dynamic color-changing image-text effects, can be placed on a PCB circuit board to be linearly arranged according to the sequence of red, green and blue, and is controlled by a special driving chip to form infinitely-changing colors and patterns.
At present, the production process of the LED nixie tube is relatively mature, but the mature process is relatively complex, the automation degree is not high, most of the die bonding process and the routing process are carried out in a manual mode, the efficiency is low, the labor cost is high, in addition, the processes are not continuous production lines, transportation and short-time preservation of semi-finished products are needed, the preservation often causes the finished products to be polluted by dust in the air, the service life and the use effect of the final finished products are influenced, in addition, in the production process, in order to avoid the defects, only one-time or no detection of a circuit board is carried out in the semi-finished products, the yield of the finished products is low, in the baking operation of the resin adhesive, the baking temperature is also improved to shorten the baking time, and the mode causes that the performance of the resin adhesive is unstable in use, and the internal crystals and the circuit.
Therefore, how to improve the production process of the existing LED nixie tube, increase manual reinspection in the semi-finished product, and carry out segmented low-temperature baking in the baking operation can meet the requirement of productivity, improve the quality and the service life of the nixie tube, and realize high automation degree, and the production process is the problem to be solved by the invention through sequential transmission and rapid processing of a conveyor belt.
Disclosure of Invention
In order to overcome the technical problems, the invention aims to provide a production and processing process flow of the LED nixie tube, the existing production process of the LED nixie tube is improved, manual reinspection is added in a semi-finished product, and segmented low-temperature baking is carried out in baking operation, so that the requirements of productivity can be met, the quality and the service life of the nixie tube can be improved, the nixie tube is provided with high automation degree, and the production process is sequentially transmitted through a conveyor belt for rapid processing.
The purpose of the invention can be realized by the following technical scheme:
a production and processing technological process of an LED nixie tube comprises a die bonding technology, a routing technology, a circuit board equipment detection, a circuit board manual detection, packaging gluing, baking and secondary testing, and comprises the following specific technological processes:
step one, a die bonding process: fixing the circuit board on a support, moving the circuit board and the support on a conveyor belt, dripping glue above the circuit board through an injector, moving a suction nozzle to the position of a wafer source from an original position after the glue dripping is finished, pushing a thimble to rise when the suction nozzle descends to a picking position, picking up the wafer by the suction nozzle to rise upwards, moving the wafer to the position above the circuit board, and fixing the wafer with the circuit board through the glue dripping;
step two, a routing process: after the wafer and the circuit board are fixed in the first step, the transmission belt is conveyed into a wire bonder, a metal wire clamping needle clamps the metal wire, the metal wire is ignited under the action of oxygen to burn an end point of the metal wire, the end point is burnt into a spherical shape, the spherical end point is welded on the wafer through the clamping needle, the metal wire is pulled into an arc-shaped structure through an arc-shaped moving position by the clamping needle, the other end of the arc-shaped structure is heated, burnt and welded on the circuit board through the clamping needle, and the clamping needle is upwards stretched to tear off the tail part of the;
step three, detecting circuit board equipment: the method comprises the steps that a circuit board and a wafer are transmitted into a circuit board detection device through a conveyor belt, optical performance detection is carried out on the circuit board, detection is respectively carried out, qualified products are circulated to the next process, unqualified products are detected and removed, and detected parameters comprise H, G, E, Y, SR, HR, UR, UY, AG, AM, UE, UG, UB and UW (double electrode) UB \ UG \ UW (single electrode);
step four, manually detecting the circuit board: manually rechecking the unqualified semi-finished products detected in the step three, wherein the items of manual rechecking comprise whether the electric conduction is normal or not and whether the electric leakage exists or not, reworking and reprocessing the electric conduction semi-finished products and discarding the non-conduction semi-finished products directly;
step five, packaging and gluing: selecting resin glue suitable for a nixie tube, placing the resin glue in a vacuum box, discharging air in the resin glue by using an air suction pump, placing the resin glue without air bubbles on a packaging machine, connecting the resin glue to a pipeline on a glue filling nozzle, filling glue into a mold cavity on a mold through a glue filling module, and inserting a circuit board and a wafer into the mold cavity filled with the glue;
step six, baking: placing the nixie tube mold in the fifth step on a baking conveyor belt, enabling the nixie tube mold to enter a first baking box through rotation of a rotating shaft, setting the temperature of the first baking box to be 100 ℃, baking the nixie tube in the first baking box for three hours, rotating the baking conveyor belt again, conveying the nixie tube mold into a second baking box, setting the temperature of the second baking box to be 50 ℃, and after the nixie tube is baked in the second baking box for three hours, conveying the nixie tube to the outside of the second baking box through the baking conveyor belt to finish baking operation;
step seven, secondary test: and placing the baked and cooled nixie tube again in the detection equipment for detecting the secondary optical performance, wherein the detection process and parameters are the same as the third step, scrapping the unqualified nixie tube, and carrying out dust-free packaging on the qualified nixie tube.
As a further scheme of the invention, in the first step, when the wafer is expanded, the wafer adhesive tape is tightly stretched on the frame wafer ring, the wafer is placed at the middle position of the frame wafer ring, the upper and lower expansion rings are wiped by alcohol cotton balls every ten seconds, and the wafer surface of the expanded expansion ring is upwards placed on the pressing outer ring; the back glue finishes the die bonding operation within four hours when the wafer is prepared with glue, and the silver glue must be slowly stirred in the same direction when being stirred; the wafer is placed in the center of the standard die attach location.
As a further scheme of the invention, the qualified parameters of the circuit board detection parameters H, G, E, Y, SR, HR, UR, UY, AG, AM, UE, UG, UB and UW (double electrode) UB \ UG \ UW (single electrode) in the third step are that the scanning current range is 0-100mA, the electric quantity current value range during SI gear test is 0-20mA, the lower limit value of VFL voltage is 0-10V, the upper limit value of VFH voltage is 0-10V, the reverse voltage value of VR is 0-10V, the set value of IR reverse current is 0-100uA, and the electric quantity voltage value during VF \ SV gear test is 0-10V.
As a further scheme of the present invention, in the fourth step, the manually inspected and reprocessed circuit board is heated to melt the colloid between the circuit board and the wafer, the wafer is separated from the circuit board, the circuit board is retained, and the colloid on the surface of the circuit board is wiped off.
As a further scheme of the invention, the first baking box and the second baking box are sequentially installed above the baking box body, the upper surface of the baking box body is a box body platform, a baking conveyor belt is arranged in the middle of the box body platform in a sinking manner, the first baking box and the second baking box are installed on the box body platform through a plurality of lifting columns, box body openings are formed between the first baking box and the box body platform and between the first baking box and the second baking box and the box body platform, the box body openings are normally closed, and a ventilation gap is reserved between the baking conveyor belt below the first baking box and the baking conveyor belt below the second baking box.
As a further scheme of the invention, the first baking box and the second baking box are heated by electrifying electric furnace wires, a plurality of temperature sensors are arranged at the two sides of the baking conveyor belt and in parallel with the box body platform, and the temperature sensors respectively detect the real-time temperatures of the first baking box and the second baking box and transmit the measured temperatures to the display end.
The invention has the beneficial effects that:
1. according to the LED nixie tube production and processing process flow, firstly, a synthesis process of a circuit board and a wafer is started to accurately position and pick up the circuit board and the wafer through full-automatic die bonding equipment, the circuit board and the wafer are perfectly combined, the accurate positioning effect of modern multi-axis equipment is fully utilized, and the yield of the combination of the wafer and the circuit board is improved; and then, the connecting line of the circuit board and the wafer is accurately welded through a full-automatic routing process, and the metal wire is quickly melted by using oxygen welding, but is not melted, so that the metal wire is quickly connected to the wafer and the circuit board after having liquid properties, the operation is simple, and the program setting is complete.
2. Firstly, carrying out one-time machine inspection on a semi-finished product of the crystal-solidified nixie tube, wherein the machine inspection is used for detecting the optical performance of the circuit board by connecting two lead wires, the detection performance is comprehensive, the qualification rate of the finished product of the nixie tube is improved, and the nixie tube cannot be reworked after glue sealing is carried out; the manual detection further detects the unqualified semi-finished product of machine inspection, and the semi-finished product that will circular telegram and appear leaking electricity is reprocessed, avoids the waste to the core raw and other materials to further increase the yields.
3. The baking adopts a segmented low-temperature baking mode, the aging of resin glue caused by uneven heating and overlong heating time is effectively prevented, the segmented baking adopts reasonable baking temperature, the two segments of baking time are three hours, and a finished product is produced every three hours in continuous production, so that the temperature of the finished product is relatively low, and the finished product can be packaged after short air cooling, thereby accelerating the subsequent production speed.
4. The invention rapidly finishes the front-end process through the automatic die bonding and routing processes, carries out quality approval on the semi-finished product through double rechecks of a machine and manpower, reuses reworking, improves the quality of the nixie tube through a segmented baking mode, and finally detects to ensure the yield and control the quality of the nixie tube.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the construction of the toasting apparatus according to the present invention.
Reference numerals: 1. baking the box body; 11. a box platform; 2. a first oven; 21. the box body is provided with an opening; 3. a second oven; 4. baking the conveyor belt;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the invention is a process flow for producing and processing an LED nixie tube, which includes die bonding, wire bonding, circuit board equipment detection, circuit board manual detection, packaging and gluing, baking and secondary testing, and the specific process flow is as follows:
step one, a die bonding process: fixing the circuit board on a support, moving the circuit board and the support on a conveyor belt, dripping glue above the circuit board through an injector, moving a suction nozzle to the position of a wafer source from an original position after the glue dripping is finished, pushing a push needle to rise when the suction nozzle descends to a pickup position to separate a polyester film from the wafer, lifting the wafer picked by the suction nozzle to the top of the circuit board, and fixing the wafer with the circuit board through the glue dripping;
step two, a routing process: after the wafer and the circuit board are fixed in the first step, the transmission belt is conveyed into a wire bonder, a metal wire clamping needle clamps the metal wire, the metal wire is ignited under the action of oxygen to burn an end point of the metal wire, the end point is burnt into a spherical shape, the spherical end point is welded on the wafer through the clamping needle, the metal wire is pulled into an arc-shaped structure through an arc-shaped moving position by the clamping needle, the other end of the arc-shaped structure is heated, burnt and welded on the circuit board through the clamping needle, and the clamping needle is upwards stretched to tear off the tail part of the; firstly, a synthesis process of a circuit board and a wafer starts to accurately position and pick up the circuit board and the wafer through full-automatic die bonding equipment, the circuit board and the wafer are perfectly combined, the accurate positioning function of modern multi-axis equipment is fully utilized, and the good product rate of the combination of the wafer and the circuit board is improved; and then, the connecting line of the circuit board and the wafer is accurately welded through a full-automatic routing process, and the metal wire is quickly melted by using oxygen welding, but is not melted, so that the metal wire is quickly connected to the wafer and the circuit board after having liquid properties, the operation is simple, and the program setting is complete.
Step three, detecting circuit board equipment: the method comprises the steps that a circuit board and a wafer are transmitted into a circuit board detection device through a conveyor belt, optical performance detection is carried out on the circuit board, detection is respectively carried out, qualified products are circulated to the next process, unqualified products are detected and removed, and detected parameters comprise H, G, E, Y, SR, HR, UR, UY, AG, AM, UE, UG, UB and UW (double electrode) UB \ UG \ UW (single electrode);
step four, manually detecting the circuit board: manually rechecking the unqualified semi-finished products detected in the step three, wherein the items of manual rechecking comprise whether the electric conduction is normal or not and whether the electric leakage exists or not, reworking and reprocessing the electric conduction semi-finished products and discarding the non-conduction semi-finished products directly; firstly, carrying out one-time machine inspection on a semi-finished product of the crystal-solidified nixie tube, wherein the machine inspection is used for detecting the optical performance of the circuit board by connecting two lead wires, the detection performance is comprehensive, the qualification rate of the finished product of the nixie tube is improved, and the nixie tube cannot be reworked after glue sealing is carried out; the manual detection further detects the unqualified semi-finished product of machine inspection, and the semi-finished product that will circular telegram and appear leaking electricity is reprocessed, avoids the waste to the core raw and other materials to further increase the yields.
Step five, packaging and gluing: selecting resin glue suitable for a nixie tube, placing the resin glue in a vacuum box, discharging air in the resin glue by using an air suction pump, placing the resin glue without air bubbles on a packaging machine, connecting the resin glue to a pipeline on a glue filling nozzle, filling glue into a mold cavity on a mold through a glue filling module, and inserting a circuit board and a wafer into the mold cavity filled with the glue; the baking adopts a segmented low-temperature baking mode, the aging of resin glue caused by uneven heating and overlong heating time is effectively prevented, the segmented baking adopts reasonable baking temperature, the two segments of baking time are three hours, and a finished product is produced every three hours in continuous production, so that the temperature of the finished product is relatively low, and the finished product can be packaged after short air cooling, thereby accelerating the subsequent production speed.
Step six, baking: placing the nixie tube mold in the fifth step on a baking conveyor belt 4, enabling the nixie tube mold to enter a first baking box 2 through rotation of a rotating shaft, setting the temperature of the first baking box 2 to be 100 ℃, baking the nixie tube in the first baking box 2 for three hours, rotating the baking conveyor belt 4 again, conveying the nixie tube mold to a second baking box 3, setting the temperature of the second baking box 3 to be 50 ℃, and conveying the nixie tube to the outside of the second baking box 3 through the baking conveyor belt 4 after baking the nixie tube in the second baking box 3 for three hours to finish baking operation;
step seven, secondary test: and placing the baked and cooled nixie tube again in the detection equipment for detecting the secondary optical performance, wherein the detection process and parameters are the same as the third step, scrapping the unqualified nixie tube, and carrying out dust-free packaging on the qualified nixie tube.
In the first step, when the wafer is expanded, the wafer adhesive tape is tightly stretched on the frame wafer ring, the wafer is placed in the middle of the frame wafer ring, the upper and lower expansion rings are wiped by alcohol cotton balls every ten seconds, and the wafer surface of the expanded expansion ring is placed upwards to press the outer ring downwards; the back glue finishes the die bonding operation within four hours when the wafer is prepared with glue, and the silver glue must be slowly stirred in the same direction when being stirred; the wafer is placed in the center of the standard die attach location.
Qualified parameters of circuit board detection parameters H, G, E, Y, SR, HR, UR, UY, AG, AM, UE, UG, UB and UW (double electrode) UB \ UG \ UW (single electrode) in the third step are that the scanning current range is 0-100mA, the electric quantity current value range is 0-20mA during SI gear test, the VFL voltage lower limit value is 0-10V, the VFH voltage upper limit value is 0-10V, the VR reverse voltage value is 0-10V, the IR reverse current set value is 0-100uA, and the electric quantity voltage value is 0-10V during VF \ SV gear test.
And in the fourth step, the manually detected and reprocessed circuit board melts the colloid between the circuit board and the wafer by heating, separates the wafer from the circuit board, retains the circuit board, and wipes off the colloid on the surface of the circuit board.
First toast case 2 and the 3 order of second toast the case and install in toasting 1 top of the box, toast 1 upper surface of box and be box platform 11, it is provided with toasting conveyer belt 4 to sink in the middle of box platform 11, toast case 2 and second through the first case 3 of toasting of many lift posts installation on box platform 11, it is box opening 21 between first case 2 and the second toast case 3 and the box platform 11, box opening 21 is closed always, toast conveyer belt 4 and the second toast the conveyer belt 4 of case 3 below and leave the ventilation gap in first case 2 below of toasting.
First toast case 2 and second toast case 3 and all adopt the mode heating of electric stove silk circular telegram, toast 4 both sides of conveyer belt and the parallel position of box platform 11 and be provided with a plurality of temperature sensor, and temperature sensor detects the real-time temperature of first toasting case 2 and second toasting case 3 respectively and will record the temperature transmission to showing the end.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely exemplary and illustrative of the present invention and various modifications, additions and substitutions may be made by those skilled in the art to the specific embodiments described without departing from the scope of the invention as defined in the following claims.
Claims (6)
1. The production and processing process flow of the LED nixie tube is characterized by comprising a die bonding process, a routing process, circuit board equipment detection, circuit board manual detection, packaging and gluing, baking and secondary testing, wherein the specific process flow comprises the following steps:
step one, a die bonding process: fixing the circuit board on a support, moving the circuit board and the support on a conveyor belt, dripping glue above the circuit board through an injector, moving a suction nozzle to the position of a wafer source from an original position after the glue dripping is finished, pushing a thimble to rise when the suction nozzle descends to a picking position, picking up the wafer by the suction nozzle to rise upwards, moving the wafer to the position above the circuit board, and fixing the wafer with the circuit board through the glue dripping;
step two, a routing process: after the wafer and the circuit board are fixed in the first step, the transmission belt is conveyed into a wire bonder, a metal wire clamping needle clamps the metal wire, the metal wire is ignited under the action of oxygen to burn an end point of the metal wire, the end point is burnt into a spherical shape, the spherical end point is welded on the wafer through the clamping needle, the metal wire is pulled into an arc-shaped structure through an arc-shaped moving position by the clamping needle, the other end of the arc-shaped structure is heated, burnt and welded on the circuit board through the clamping needle, and the clamping needle is upwards stretched to tear off the tail part of the;
step three, detecting circuit board equipment: the circuit board and the wafer are conveyed into a circuit board detection device through a conveyor belt, the circuit board is detected in optical performance, the detection is respectively carried out, the detected qualified products are circulated to the next procedure, and the detected unqualified products are removed;
step four, manually detecting the circuit board: manually rechecking the unqualified semi-finished products detected in the step three, wherein the items of manual rechecking comprise whether the electric conduction is normal or not and whether the electric leakage exists or not, reworking and reprocessing the electric conduction semi-finished products and discarding the non-conduction semi-finished products directly;
step five, packaging and gluing: selecting resin glue suitable for a nixie tube, placing the resin glue in a vacuum box, discharging air in the resin glue by using an air suction pump, placing the resin glue without air bubbles on a packaging machine, connecting the resin glue to a pipeline on a glue filling nozzle, filling glue into a mold cavity on a mold through a glue filling module, and inserting a circuit board and a wafer into the mold cavity filled with the glue;
step six, baking: placing the nixie tube mold in the fifth step on a baking conveyor belt (4), enabling the nixie tube mold to enter a first baking box (2) through rotation of a rotating shaft, setting the temperature of the first baking box (2) to be 100 ℃, baking the nixie tube in the first baking box (2) for three hours, rotating the baking conveyor belt (4) again, conveying the nixie tube mold to a second baking box (3), setting the temperature of the second baking box (3) to be 50 ℃, baking the nixie tube in the second baking box (3) for three hours, and conveying the nixie tube to the outside of the second baking box (3) through the baking conveyor belt (4) to finish baking operation;
step seven, secondary test: and placing the baked and cooled nixie tube again in the detection equipment for detecting the secondary optical performance, wherein the detection process and parameters are the same as the third step, scrapping the unqualified nixie tube, and carrying out dust-free packaging on the qualified nixie tube.
2. The LED nixie tube production and processing process flow according to claim 1, wherein in the first step, when the wafer is expanded, the wafer is tightly stretched on the frame wafer ring, the wafer is placed in the center of the frame wafer ring, the upper and lower expansion rings are wiped by alcohol cotton balls every ten seconds, and the wafer surface of the expanded expansion ring is placed upwards to press the outer ring; the back glue finishes the die bonding operation within four hours when the wafer is prepared with glue, and the silver glue must be slowly stirred in the same direction when being stirred; the wafer is placed in the center of the standard die attach location.
3. The production and processing process flow of the LED nixie tube as claimed in claim 1, wherein the circuit board in the third step detects a scanning current range of 0-100mA, a power current range of 0-20mA in SI grade test, a VFL voltage lower limit value of 0-10V, a VFH voltage upper limit value of 0-10V, a VR reverse voltage value of 0-10V, an IR reverse current set value of 0-100uA, and a VF/SV grade test power voltage value of 0-10V.
4. The LED nixie tube production process of claim 1, wherein the step four of manually inspecting the reprocessed circuit board melts the glue between the circuit board and the wafer by heating, separates the wafer from the circuit board, retains the circuit board, and wipes off the glue on the surface of the circuit board.
5. The LED nixie tube production and processing technological process of claim 1, wherein the first baking box (2) and the second baking box (3) are sequentially installed above the baking box body (1), the upper surface of the baking box body (1) is a box body platform (11), a baking conveyor belt (4) is arranged in the middle of the box body platform (11) in a sinking mode, the first baking box (2) and the second baking box (3) are installed on the box body platform (11) through a plurality of lifting columns, a box body opening (21) is formed between the first baking box (2) and the second baking box (3) and the box body platform (11), the box body opening (21) is normally closed, and a ventilation gap is reserved between the baking conveyor belt (4) below the first baking box (2) and the baking conveyor belt (4) below the second baking box (3).
6. The LED nixie tube production and processing technological process according to claim 1, wherein the first baking box (2) and the second baking box (3) are heated by electrifying an electric furnace wire, a plurality of temperature sensors are arranged on two sides of the baking conveyor belt (4) and at positions parallel to the box body platform (11), and the temperature sensors respectively detect real-time temperatures of the first baking box (2) and the second baking box (3) and transmit the detected temperatures to the display end.
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| CN201910244827.XA CN109950181B (en) | 2019-03-28 | 2019-03-28 | Production and processing technological process of LED nixie tube |
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| CN101677120A (en) * | 2008-09-16 | 2010-03-24 | 长裕欣业股份有限公司 | Method of producing light emitting diode |
| CN107833875A (en) * | 2017-11-09 | 2018-03-23 | 江苏稳润光电科技有限公司 | A kind of high colour gamut LED backlight and its processing method |
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