CN109950181A - A kind of LED charactrons production and processing technology process - Google Patents
A kind of LED charactrons production and processing technology process Download PDFInfo
- Publication number
- CN109950181A CN109950181A CN201910244827.XA CN201910244827A CN109950181A CN 109950181 A CN109950181 A CN 109950181A CN 201910244827 A CN201910244827 A CN 201910244827A CN 109950181 A CN109950181 A CN 109950181A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- baking
- chip
- baking box
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000012545 processing Methods 0.000 title claims abstract description 22
- 238000005516 engineering process Methods 0.000 title claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 43
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000011265 semifinished product Substances 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000012360 testing method Methods 0.000 claims abstract description 13
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000000047 product Substances 0.000 claims description 16
- 230000005611 electricity Effects 0.000 claims description 10
- 239000000084 colloidal system Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000012958 reprocessing Methods 0.000 claims description 4
- 235000009161 Espostoa lanata Nutrition 0.000 claims description 3
- 240000001624 Espostoa lanata Species 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000011218 segmentation Effects 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 3
- 230000009977 dual effect Effects 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000012797 qualification Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000013066 combination product Substances 0.000 description 1
- 229940127555 combination product Drugs 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The present invention discloses a kind of LED charactrons production and processing technology process, including the detection of die bond technique, routing technique, circuit board apparatus, circuit board artificial detection, encapsulation gluing, baking and second test；Front end process is rapidly completed by the die bond and routing technique automated in the present invention, quality approval is being carried out to semi-finished product by machine and artificial dual reinspection, re-using to that can do over again, the quality of charactron is improved in the roasting mode by segmentation, baking is using the roasting mode for being segmented low temperature, the aging for leading to resin glue in uneven heating and heated time are too long effectively is prevented, detection is finally carried out again and guarantees yields and the control to charactron quality.
Description
Technical field
The present invention relates to the production technical field of LED charactrons, a kind of particularly LED charactrons production and processing technology stream
Journey.
Background technique
LED charactrons form color by multiple LED packages together Shan Hong, yellow, blue, green, white, yellowish green etc.
Effect, it is monochromatic, it is segmented the full-color building Guan Keyong, road, river levee profile brightening, LED charactrons uniformly can arrange to form large area
Display area, can display pattern and text, and can play different-format video file, pass through flash, animation, text under computer
The files such as word, or animation software design personalized animation is used, the picture and text effect of various dynamic discolorations is played, can be placed on
It is arranged in a linear in PCB circuit board by RGB sequence, is controlled with special driving chip, constitute varied color and figure
Shape.
The production technology relative maturity of LED charactrons at present, but the process is more complicated for maturation, the degree of automation is not
Height, most die bond technique and routing technique are carried out by the way of artificial, low efficiency, high labor cost, in addition each process it
Between be not continuous production line, need to transport and the preservation of of short duration semi-finished product, this preservation often make this finished product by air
The pollution of middle dust influences service life and the using effect of final finished product, and there are also in process of production in order to avoid above-mentioned
Drawback only carries out detection that is primary or not making circuit board in semi-finished product, causes the yield of finished product low, in the baking of resin glue
It is also the temperature of raising baking in operation to shorten the time of baking, such mode causes resin glue performance in use unstable
It is fixed, it is easily damaged internal crystal and circuit board.
Therefore, the production technology for how improving existing LED charactrons increases artificial reinspection in semi-finished product, is toasting
It is segmented low-temperature bake in operation, that is, be able to satisfy the needs of production capacity and the quality and service life of charactron can be improved, and feels have
High the degree of automation, it is problem to be solved by this invention that production process, which transmits rapid processing by conveyer belt sequence,.
Summary of the invention
In order to overcome above-mentioned technical problem, the purpose of the present invention is to provide a kind of LED charactrons production and processing technologies
Process improves the production technology of existing LED charactrons, increases artificial reinspection in semi-finished product, is segmented in baking operation low
Temperature baking is able to satisfy the needs of production capacity and can improve the quality and service life of charactron, and feels there is high automation journey
Degree, production process transmit rapid processing by conveyer belt sequence.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of LED charactrons production and processing technology process, including the detection of die bond technique, routing technique, circuit board apparatus, electricity
Road plate artificial detection, encapsulation gluing, baking and second test, specific embodiment are as follows:
Step 1: die bond technique: circuit board being fixed on bracket, circuit board and bracket move on a moving belt, pass through
Syringe drips glue to circuit board, and after dripping glue, suction nozzle is moved to chip source position from origin position, and suction nozzle, which drops to, to be picked up
Ejection needle ramps up when fetch bit is set, and nozzle pick chip ramps up, and moves a wafer into circuit board, chip by drop glue and
Circuit board is fixed；
Step 2: routing technique: transmission belt is transmitted in wire bonder after step 1 completion chip and circuit board are fixed, gold
Belong to line clamping needle and clamp the endpoint burning that metal wire is struck sparks under the action of oxygen to metal wire, endpoint is burnt into spherical, clamping
Spheric end is spot welded on chip by needle, and clamping needle is walked by arc metal wire pulling into arcuate structure, and clamping needle is to arc
On circuit boards, clamping needle is pulled up, and pulls apart metal wire tail portion for the other end heating burning welding of structure；
Step 3: circuit board apparatus detects: circuit board and chip are transferred in circuit board detecting equipment by conveyer belt,
The detection of optical property is carried out to circuit board, detection carries out respectively and is passed to subsequent processing to detection qualified products, and detection is not
Qualified products are rejected, and the parameter of detection includes H, G, E, Y, SR, HR, UR, UY, AG, AM, UE, UG, UB, UW (bipolar electrode) UB
UG UW (single electrode)；
Step 4: circuit board artificial detection: underproof semi-finished product are detected to step 3 and are manually rechecked, it is artificial to recheck
Project include conductive whether normal, if electric leakage directly scraps the semi-finished product of non-above-mentioned reason, above-mentioned reason is caused
Substandard product carry out reprocessing of doing over again；
Step 5: encapsulation gluing: resin glue is placed in vacuum tank and utilizes pumping by the applicable resin glue of selection charactron
Air in resin glue is discharged pump, and the resin glue of no air bubble is placed on sealing machine, and is connected on encapsulating mouth
In pipeline, encapsulating is carried out to the die cavity on mold by adhesive filling mould group, then circuit board and chip are inserted into the die cavity for having filled glue
In；
Step 6: baking: the digital pipe mold in step 5 being placed on baking conveyer belt, is rotated by shaft
Into the first baking box, the temperature of the first baking box is set as 100 DEG C, and charactron toasts three hours in the first baking box, then
Conveyer belt is toasted in secondary rotation, and digital pipe mold is transmitted in the second baking box, and the temperature of the second baking box is set as 50 DEG C, number
The outside that pipe has been sent to the second baking box by toasting conveyer belt after toasting three hours in the second baking box, completes baking and makees
Industry；
Step 7: second test: toasting charactron after cooling and be again placed at progress secondary optics in detection device
The detection of energy, detection process and parameter synchronization rapid three scrap processing to underproof charactron is detected, detect qualified charactron
Carry out dustless packaging.
As a further solution of the present invention, when chip expansion that chip tape is tight with frame crystalline substance ring in the step 1
On, chip is placed on frame crystalline substance ring center position, wiped tensioner ring up and down with cotton ball soaked in alcohol at interval of ten seconds, expands the expansion of completion
Ring chip places pressure outer ring up；Chip completes die bond operation for gum when glue in four hours, and elargol must in stirring
It must be slowly stirred at same direction；Place the wafer at the center of standard die bond position.
As a further solution of the present invention, step 3 circuit board detecting parameter H, G, E, Y, SR, HR, UR, UY,
AG, AM, UE, UG, UB, UW (bipolar electrode) UB UG the qualification parameters of UW (single electrode) be sweep current range 0-100mA, SI
Electricity current value range 0-20mA, VFL voltage lower limit value 0-10V, VFH upper voltage limit 0-10V, VR backward voltage when shelves test
Value 0-10V, IR reverse current setting value 0-100uA, VF SV grades of tests when electricity voltage value 0-10V.
As a further solution of the present invention, the circuit board that artificial detection is reprocessed in the step 4 passes through heating and melting
Colloid between circuit board and chip separates chip, stick holding circuit plate from circuit board, and the colloid of circuit board surface is wiped
It wipes away and removes.
As a further solution of the present invention, first baking box and the second baking box sequence are mounted in baking box
Side, baking box upper surface are cabinet platforms, sink among cabinet platform and are provided with baking conveyer belt, by more on cabinet platform
Root lifting column installs the first baking box and the second baking box, is cabinet between the first baking box and the second baking box and cabinet platform
Opening, the normally closed conjunction of box opening, the baking conveyer belt below baking conveyer belt and the second baking box below the first baking box stay
There is ventilation gap.
As a further solution of the present invention, first baking box and the second baking box are all made of the side of electric furnace heating wire energization
Formula heating, the position for toasting conveyor belt two sides and cabinet platform parallel are provided with multiple temperature sensors, temperature sensor difference
It detects the real time temperature of the first baking box and the second baking box and the temperature measured is transmitted to display end.
Beneficial effects of the present invention:
1, the LED charactrons production and processing technology process first to the synthesis technology of circuit board and chip begin through it is complete from
The die bond equipment of dynamicization is accurately positioned and is picked up to circuit board and chip, by its perfect combination, makes full use of the modern times
The accurate positioning of multi-axis machines acts on, and improves the yields that chip and circuit board combine；Pass through full-automatic routing technique again,
The connecting line of circuit board and chip is accurately welded, and uses oxygen welding fast melt metal wire, but do not melt,
Quick links are easy to operate on chip and circuit board after so that metal wire is had the character of liquid, and program setting is perfect.
2, the charactron semi-finished product that die bond is completed carry out a machine examination first, and machine examination is by two leads of connection to circuit board
Optical property detected, the performance of detection is comprehensive, improve charactron finished product qualification rate avoid sealing after can not do over again；People
Work detection is further detecting the underproof semi-finished product of machine examination, and the semi-finished product to leak electricity is occurred in the sum of energization and add again
Work avoids the waste to core starting materials, and further increases yields.
3, baking effectively prevents from causing in uneven heating and heated time are too long using the roasting mode of segmentation low temperature
The baking of the aging of resin glue, segmentation uses reasonable baking temperature, and making two sections of baking time is three hours, is existed in this way
Every three hours go out one-pass finished in continuous production, and the temperature of finished product is relatively low, it is of short duration it is air-cooled after can encapsulate, add
Fast subsequent production speed.
4, the present invention by automation die bond and routing technique front end process is rapidly completed, by machine and manually
Dual reinspection carries out quality approval to semi-finished product, the re-using to that can do over again, and is improving number by the roasting mode of segmentation
The quality of code pipe finally carries out detection again and guarantees yields and the control to charactron quality.
Detailed description of the invention
The present invention will be further described below with reference to the drawings.
Fig. 1 is roasting plant structural schematic diagram of the present invention.
Appended drawing reference: 1, baking box；11, cabinet platform；2, the first baking box；21, box opening；3, the second baking
Case；4, conveyer belt is toasted；
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, all other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
Refering to Figure 1, the present invention is a kind of LED charactrons production and processing technology process, including die bond technique, routing
Technique, circuit board apparatus detection, circuit board artificial detection, encapsulation gluing, baking and second test, specific embodiment are as follows:
Step 1: die bond technique: circuit board being fixed on bracket, circuit board and bracket move on a moving belt, pass through
Syringe drips glue to circuit board, and after dripping glue, suction nozzle is moved to chip source position from origin position, and suction nozzle, which drops to, to be picked up
Ejection needle ramps up when fetch bit is set, and separates mylar and chip, nozzle pick chip ramps up, and moves a wafer into circuit
Above plate, chip is fixed by drop glue and circuit board；
Step 2: routing technique: transmission belt is transmitted in wire bonder after step 1 completion chip and circuit board are fixed, gold
Belong to line clamping needle and clamp the endpoint burning that metal wire is struck sparks under the action of oxygen to metal wire, endpoint is burnt into spherical, clamping
Spheric end is spot welded on chip by needle, and clamping needle is walked by arc metal wire pulling into arcuate structure, and clamping needle is to arc
On circuit boards, clamping needle is pulled up, and pulls apart metal wire tail portion for the other end heating burning welding of structure；First to circuit board
Full-automatic die bond equipment is begun through with the synthesis technology of chip, circuit board and chip are accurately positioned and picked up
Take, by its it is perfect combine, make full use of the accurate positioning of modern multi-axis machines act on, improve the good of chip and circuit board combination
Product rate；Again by full-automatic routing technique, the connecting line of circuit board and chip is accurately welded, and uses oxygen
Gas welding fast melt metal wire, but do not melt, quick links are in chip and circuit board after so that metal wire is had the character of liquid
On, easy to operate, program setting is perfect.
Step 3: circuit board apparatus detects: circuit board and chip are transferred in circuit board detecting equipment by conveyer belt,
The detection of optical property is carried out to circuit board, detection carries out respectively and is passed to subsequent processing to detection qualified products, and detection is not
Qualified products are rejected, and the parameter of detection includes H, G, E, Y, SR, HR, UR, UY, AG, AM, UE, UG, UB, UW (bipolar electrode) UB
UG UW (single electrode)；
Step 4: circuit board artificial detection: underproof semi-finished product are detected to step 3 and are manually rechecked, it is artificial to recheck
Project include conductive whether normal, if electric leakage directly scraps the semi-finished product of non-above-mentioned reason, above-mentioned reason is caused
Substandard product carry out reprocessing of doing over again；The charactron semi-finished product that die bond is completed carry out a machine examination first, and machine examination passes through company
It connects two leads to detect the optical property of circuit board, the performance of detection is comprehensive, and the qualification rate for improving charactron finished product is kept away
It can not do over again after exempting from sealing；Artificial detection is further detecting the underproof semi-finished product of machine examination, by energization and leak electricity
Semi-finished product re-worked, avoid the waste to core starting materials, and further increase yields.
Step 5: encapsulation gluing: resin glue is placed in vacuum tank and utilizes pumping by the applicable resin glue of selection charactron
Air in resin glue is discharged pump, and the resin glue of no air bubble is placed on sealing machine, and is connected on encapsulating mouth
In pipeline, encapsulating is carried out to the die cavity on mold by adhesive filling mould group, then circuit board and chip are inserted into the die cavity for having filled glue
In；Baking effectively prevents from leading to resin glue in uneven heating and heated time are too long using the roasting mode of segmentation low temperature
Aging, the baking of segmentation uses reasonable baking temperature, and making two sections of baking time is three hours, is continuously being given birth in this way
Every three hours go out one-pass finished in production, and the temperature of finished product is relatively low, it is of short duration it is air-cooled after can encapsulate, accelerate subsequent
Speed of production.
Step 6: baking: the digital pipe mold in step 5 being placed on baking conveyer belt 4, is rotated by shaft
Enter into the first baking box 2, the temperature of the first baking box 2 is set as 100 DEG C, and it is small that charactron toasts three in the first baking box 2
When, rotation baking conveyer belt 4, digital pipe mold are transmitted in the second baking box 3 again, and the temperature of the second baking box 3 is set as
50 DEG C, the outside that charactron has been sent to the second baking box 3 by toasting conveyer belt 4 after toasting three hours in the second baking box 3,
Complete baking operation；
Step 7: second test: toasting charactron after cooling and be again placed at progress secondary optics in detection device
The detection of energy, detection process and parameter synchronization rapid three scrap processing to underproof charactron is detected, detect qualified charactron
Carry out dustless packaging.
When chip expansion that chip tape is tight on frame crystalline substance ring in the step 1, chip is placed on frame crystalline substance ring center position
It sets, wiped tensioner ring up and down with cotton ball soaked in alcohol at interval of ten seconds, the tensioner ring chip for expanding completion places pressure outer ring up；
Chip completes die bond operation for gum when glue in four hours, and elargol must be slowly stirred at same direction in stirring；It will be brilliant
Piece is placed on the center of standard die bond position.
Step 3 circuit board detecting parameter H, G, E, Y, SR, HR, UR, UY, AG, AM, UE, UG, UB, UW (bipolar electrode)
UB UG the qualification parameters of UW (single electrode) be electricity current value range 0- when 0-100mA, the SI grades of tests of sweep current range
20mA, VFL voltage lower limit value 0-10V, VFH upper voltage limit 0-10V, VR backward voltage value 0-10V, IR reverse current setting value
0-100uA, VF SV grades of tests when electricity voltage value 0-10V.
The circuit board that artificial detection is reprocessed in the step 4 passes through the colloid between heating and melting circuit board and chip,
Chip is separated, stick holding circuit plate from circuit board, and the colloid of circuit board surface is wiped and is removed.
First baking box 2 and 3 sequence of the second baking box are mounted on 1 top of baking box, and 1 upper surface of baking box is
Cabinet platform 11 sinks to being provided with baking conveyer belt 4 among cabinet platform 11, passes through more lifting columns installations on cabinet platform 11
First baking box 2 and the second baking box 3, are box openings between the first baking box 2 and the second baking box 3 and cabinet platform 11
21, the normally closed conjunction of box opening 21, the baking conveyer belt of 3 lower section of baking conveyer belt 4 and the second baking box of 2 lower section of the first baking box
4 there are ventilation gaps.
The mode that first baking box 2 and the second baking box 3 are all made of electric furnace heating wire energization heats, and toasts 4 liang of conveyer belt
The side position parallel with cabinet platform 11 is provided with multiple temperature sensors, and temperature sensor detects 2 He of the first baking box respectively
The temperature measured is simultaneously transmitted to display end by the real time temperature of the second baking box 3.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of the invention
In example or example.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example.
Moreover, particular features, structures, materials, or characteristics described can be in any one or more of the embodiments or examples to close
Suitable mode combines.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple
Described specific embodiment does various modifications or additions or is substituted in a similar manner, without departing from invention
Structure or beyond the scope defined by this claim, is within the scope of protection of the invention.
Claims (6)
1. a kind of LED charactrons production and processing technology process, which is characterized in that set including die bond technique, routing technique, circuit board
Standby detection, circuit board artificial detection, encapsulation gluing, baking and second test, specific embodiment are as follows:
Step 1: die bond technique: circuit board being fixed on bracket, circuit board and bracket move on a moving belt, pass through injection
Device drips glue to circuit board, and after dripping glue, suction nozzle is moved to chip source position from origin position, and suction nozzle, which drops to, picks up position
Ejection needle ramps up when setting, and nozzle pick chip ramps up, and moves a wafer into circuit board, and chip passes through drop glue and circuit
Plate is fixed；
Step 2: routing technique: transmission belt is transmitted in wire bonder after step 1 completion chip and circuit board are fixed, metal wire
Clamping needle clamps the endpoint burning that metal wire is struck sparks under the action of oxygen to metal wire, and endpoint is burnt into spherical, clamping needle general
Spheric end is spot welded on chip, and clamping needle is walked by arc metal wire pulling into arcuate structure, and clamping needle is to arcuate structure
The other end heating burning welding on circuit boards, clamping needle is pulled up, and pulls apart metal wire tail portion；
Step 3: circuit board apparatus detects: circuit board and chip being transferred in circuit board detecting equipment by conveyer belt, to electricity
Road plate carries out the detection of optical property, and detection carries out respectively and is passed to subsequent processing to detection qualified products, detects unqualified
Product is rejected；
Step 4: circuit board artificial detection: underproof semi-finished product are detected to step 3 and are manually rechecked, the item manually rechecked
Whether mesh includes conductive normal, if electric leakage directly scraps the semi-finished product of non-above-mentioned reason, for caused by above-mentioned reason not
Qualified products carry out reprocessing of doing over again；
Step 5: encapsulation gluing: the applicable resin glue of selection charactron, resin glue is placed in vacuum tank will using aspiration pump
Air discharge in resin glue, the pipeline that the resin glue of no air bubble is placed on sealing machine, and is connected on encapsulating mouth
In, encapsulating is carried out to the die cavity on mold by adhesive filling mould group, then circuit board and chip are inserted into the die cavity for having filled glue；
Step 6: baking: the digital pipe mold in step 5 being placed into baking conveyer belt (4), is rotated by shaft
To in the first baking box (2), the temperature of the first baking box (2) is set as 100 DEG C, charactron baking in the first baking box (2)
Three hours, rotation baking conveyer belt (4), digital pipe mold were transmitted in the second baking box (3) again, the second baking box (3)
Temperature is set as 50 DEG C, and charactron has been sent to second by toasting conveyer belt (4) after baking three hours in the second baking box (3)
Baking operation is completed in the outside of baking box (3)；
Step 7: second test: toasting charactron after cooling and be again placed at progress secondary optics performance in detection device
Detection, detection process and parameter synchronization rapid three scrap processing to underproof charactron is detected, detect qualified charactron and carry out
Dustless packaging.
2. a kind of LED charactrons production and processing technology process according to claim 1, which is characterized in that the step 1
When middle chip expansion that chip tape is tight on frame crystalline substance ring, chip is placed on frame crystalline substance ring center position, uses wine at interval of ten seconds
Smart cotton balls wipes tensioner ring up and down, and the tensioner ring chip for expanding completion places pressure outer ring up；Chip exists for gum when glue
Die bond operation is completed in four hours, elargol must be slowly stirred at same direction in stirring；Place the wafer at standard die bond
The center of position.
3. a kind of LED charactrons production and processing technology process according to claim 1, which is characterized in that the step 3
Electricity current value range 0-20mA, VFL voltage lower limit value 0- when the I grades of tests of 0-100mA, S of circuit board detecting sweep current range
10V, VFH upper voltage limit 0-10V, VR backward voltage value 0-10V, I R reverse current setting value 0-100uA, VF SV grades test
When electricity voltage value 0-10V.
4. a kind of LED charactrons production and processing technology process according to claim 1, which is characterized in that the step 4
The circuit board of middle artificial detection reprocessing divides from circuit board by the colloid between heating and melting circuit board and chip, by chip
From, stick holding circuit plate, and the colloid of circuit board surface is wiped and is removed.
5. a kind of LED charactrons production and processing technology process according to claim 1, which is characterized in that described first dries
Oven (2) and the second baking box (3) are sequentially mounted on above baking box (1), and baking box (1) upper surface is cabinet platform
(11), sink among cabinet platform (11) and be provided with baking conveyer belt (4), pass through more lifting column installations on cabinet platform (11)
First baking box (2) and the second baking box (3) are between the first baking box (2) and the second baking box (3) and cabinet platform (11)
Box opening (21), box opening (21) normally closed conjunction, baking conveyer belt (4) and the second baking box below the first baking box (2)
(3) there are ventilation gaps for the baking conveyer belt (4) below.
6. a kind of LED charactrons production and processing technology process according to claim 1, which is characterized in that described first dries
The mode that oven (2) and the second baking box (3) are all made of electric furnace heating wire energization heats, and toasts conveyer belt (4) two sides and cabinet platform
(11) parallel position is provided with multiple temperature sensors, and temperature sensor detects the first baking box (2) and the second baking respectively
The temperature measured is simultaneously transmitted to display end by the real time temperature of case (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910244827.XA CN109950181B (en) | 2019-03-28 | 2019-03-28 | Production and processing technological process of LED nixie tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910244827.XA CN109950181B (en) | 2019-03-28 | 2019-03-28 | Production and processing technological process of LED nixie tube |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109950181A true CN109950181A (en) | 2019-06-28 |
| CN109950181B CN109950181B (en) | 2021-05-11 |
Family
ID=67012285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910244827.XA Active CN109950181B (en) | 2019-03-28 | 2019-03-28 | Production and processing technological process of LED nixie tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109950181B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111145674A (en) * | 2019-12-27 | 2020-05-12 | 上海辛格林纳新时达电机有限公司 | Display panel detection method, electronic device and storage medium |
| CN113636265A (en) * | 2021-08-14 | 2021-11-12 | 浙江珵美科技有限公司 | Encoder 46TO surface mount packaging device and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101677120A (en) * | 2008-09-16 | 2010-03-24 | 长裕欣业股份有限公司 | Method of producing light emitting diode |
| CN107833875A (en) * | 2017-11-09 | 2018-03-23 | 江苏稳润光电科技有限公司 | A kind of high colour gamut LED backlight and its processing method |
| CN107958948A (en) * | 2017-12-28 | 2018-04-24 | 广东晶科电子股份有限公司 | A kind of LED light emitting diodes and preparation method thereof |
| US20180127648A1 (en) * | 2015-05-15 | 2018-05-10 | National Institute For Materials Science | Phosphor, production method for same, illumination instrument, and image display device |
| CN108447960A (en) * | 2018-02-09 | 2018-08-24 | 永林电子有限公司 | A kind of the centrifugation production method and its LED lamp bead of LED lamp bead |
-
2019
- 2019-03-28 CN CN201910244827.XA patent/CN109950181B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101677120A (en) * | 2008-09-16 | 2010-03-24 | 长裕欣业股份有限公司 | Method of producing light emitting diode |
| US20180127648A1 (en) * | 2015-05-15 | 2018-05-10 | National Institute For Materials Science | Phosphor, production method for same, illumination instrument, and image display device |
| CN107833875A (en) * | 2017-11-09 | 2018-03-23 | 江苏稳润光电科技有限公司 | A kind of high colour gamut LED backlight and its processing method |
| CN107958948A (en) * | 2017-12-28 | 2018-04-24 | 广东晶科电子股份有限公司 | A kind of LED light emitting diodes and preparation method thereof |
| CN108447960A (en) * | 2018-02-09 | 2018-08-24 | 永林电子有限公司 | A kind of the centrifugation production method and its LED lamp bead of LED lamp bead |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111145674A (en) * | 2019-12-27 | 2020-05-12 | 上海辛格林纳新时达电机有限公司 | Display panel detection method, electronic device and storage medium |
| CN111145674B (en) * | 2019-12-27 | 2023-06-13 | 上海辛格林纳新时达电机有限公司 | Display panel detection method, electronic device and storage medium |
| CN113636265A (en) * | 2021-08-14 | 2021-11-12 | 浙江珵美科技有限公司 | Encoder 46TO surface mount packaging device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109950181B (en) | 2021-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103747411B (en) | A kind of speaker assembly production chain | |
| CN107369639B (en) | Wire LED die bonder | |
| CN103887407B (en) | A kind of miniature patch light emitting diode and production technology thereof | |
| CN107305916B (en) | A kind of chip mounter and its processing technology of CSP encapsulation LED | |
| CN109950181A (en) | A kind of LED charactrons production and processing technology process | |
| CN112563391B (en) | LED packaging process | |
| CN108539673A (en) | Cable failure point detects and prosthetic device and method | |
| CN103200789B (en) | A kind of printed wiring board transplanting technique | |
| CN115207190B (en) | COB module repairing method | |
| CN108807640B (en) | SMD packaging integrated assembly line | |
| CN103831524A (en) | Eutectic soldering system and method for LED packaging | |
| CN102335790B (en) | Method for maintaining AQFN (Advanced Quad Flat No-Lead Package) mobile phone motherboard and maintenance table | |
| WO2020248469A1 (en) | Smd led lamp bead emitting polarized light and method for batch manufacturing same | |
| CN109003969A (en) | A kind of COB packaging method shown based on high density, system and COB device | |
| CN100377323C (en) | Method for back-repairing pin packaging free device | |
| CN104682159A (en) | Wired power strip assembling machine | |
| CN106299079A (en) | The method for packing of a kind of composite LED glass base plane and panel | |
| CN107394031A (en) | A kind of LED flip-chip packageds method | |
| CN204441689U (en) | Wired insert row kludge | |
| CN208908220U (en) | A kind of COB package system shown based on high density | |
| JPS63129638A (en) | Apparatus for manufacturing light emitting diode | |
| CN214797448U (en) | Automatic production line for die bonding and resistor bonding | |
| CN106299039B (en) | A kind of packaging process and panel of composite LED glass base plane | |
| CN203649642U (en) | Eutectic welding system for LED packaging | |
| CN103730072A (en) | LED display screen, full-color LED light-emitting panel and manufacturing method of full-color LED light-emitting panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 245000 Huangshan Industrial Park, Anhui Province Patentee after: Huangshan Meitai Electronic Technology Co.,Ltd. Address before: 245000 Huangshan Industrial Park, Anhui Province Patentee before: HUANGSHAN MEITAI ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A production and processing process flow for LED digital tubes Granted publication date: 20210511 Pledgee: Huangshan Taiping Rural Commercial Bank Co.,Ltd. Pledgor: Huangshan Meitai Electronic Technology Co.,Ltd. Registration number: Y2024980002742 |