CN203649642U - Eutectic welding system for LED packaging - Google Patents
Eutectic welding system for LED packaging Download PDFInfo
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- CN203649642U CN203649642U CN201320728227.9U CN201320728227U CN203649642U CN 203649642 U CN203649642 U CN 203649642U CN 201320728227 U CN201320728227 U CN 201320728227U CN 203649642 U CN203649642 U CN 203649642U
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Abstract
The utility model relates to the field of LED processing, and discloses a eutectic welding system for LED packaging. The eutectic welding system comprises a blank support assembling and disassembling device, a chip locating and supplying mechanism, a chip welding and carrying device, a chip angle correction device, a welding platform conveying mechanism, a eutectic welding platform, a photoelectric test device and a finished product support assembling and disassembling device. The blank support assembling and disassembling device is arranged at one end of a feeding carrying pawl of the welding platform conveying mechanism, the eutectic welding platform is arranged in the middle of the welding platform conveying mechanism, the other end of the welding platform conveying mechanism is connected with the photoelectric test device, and an outlet of the photoelectric test device is connected with the finished product support assembling and disassembling device. The chip locating and supplying mechanism is arranged below one movable position of a chip carrying suction nozzle of the chip welding and carrying device, the chip angle correction device is arranged below the other movable position of the chip carrying suction nozzle, one movable position of a chip welding suction nozzle of the chip welding and carrying device is arranged above the chip angle correction device, and the other movable position of the chip welding suction nozzle is arranged above the eutectic welding platform. The eutectic welding system has the advantage of adopting an electromagnetic wave fast heating mode to carry out eutectic welding on a chip.
Description
Technical field
The utility model relates to LED manufacture field, especially relates to a kind of eutectic welding system that adopts the LED encapsulation that electromagnetic wave Fast Heating carries out eutectic welding chip.
Background technology
In recent years, along with the development of LED industry, the application aspect of material, chip, encapsulation and LED illumination has formed an industrial chain with high content of technology, market prospects are wide, and especially high-power, high-brightness LED module has become international semiconductor illumination and shown the hot spot for competition in field.
A new generation's great power LED module packaging technical and equipment are manufactured the research emphasis of Ge great LED leading enterprise and research institution in the world especially, and its barrier in the core technology of high-power, high-brightness LED industry development is shaped gradually.LED packaging technology is the accurate assembly technology of the one of chip attach is fixing and seal protection.LED sealed in unit comprises a set of production technologies such as cleaning, die bond, die bond baking, bonding wire, dot fluorescent powder, mounted lens, embedding lens, testing package; Its core is die bond and bonding (bonding wire) technique.Aspect the chip manufacturing of LED, tube core (module) encapsulation and product apply three, packaging technology and equipment are closer to market, more direct to the impetus of industry.Wherein, eutectic solder technology is one of core technology of crux the most in upside-down mounting high-power LED chip package technique of future generation, and the quality of eutectic welding technology can directly have influence on luminous efficiency, life-span, heat dispersion and the end product quality of great power LED module.
Summary of the invention
The utility model object is to provide a kind of eutectic welding system that adopts the LED encapsulation that electromagnetic wave Fast Heating carries out eutectic welding chip.
The utility model is realized by following technical measures, an eutectic welding system for LED encapsulation, comprises blank support handler, chip positioning feed mechanism, chips welding carrying device, chip angle means for correcting, welding stage connecting gear, eutectic welding stage, opto-electronic testing apparatus and finished product support handler; Described blank support handler is arranged on one end of welding stage connecting gear material loading conveyance pawl, the middle part of described welding stage connecting gear is provided with eutectic welding stage, the other end of described welding stage connecting gear connects opto-electronic testing apparatus, and the outlet of described opto-electronic testing apparatus connects finished product support handler; Described chip positioning feed mechanism is arranged on the below of a moving position of the chip conveyance suction nozzle of chips welding carrying device, the below of another moving position of described chip conveyance suction nozzle is provided with chip angle means for correcting, one moving position of the chips welding suction nozzle of described chips welding carrying device is also arranged on the top of chip angle means for correcting, and a moving position of described chips welding suction nozzle is arranged on the top of eutectic welding stage.
As a kind of optimal way, described chips welding carrying device comprises the track screw mandrel being connected in conveyance frame, be slidably arranged in chip conveyance suction nozzle fixed part and chips welding suction nozzle fixed part on described track screw mandrel, described chip conveyance suction nozzle fixed part below is fixedly installed chip conveyance suction nozzle, and described chips welding suction nozzle fixed part below is fixedly installed chips welding suction nozzle; Described chip conveyance suction nozzle fixed part is driven and on track screw mandrel, is slided between chip feedway and chip positioning device by conveyance drive motors, and described chips welding suction nozzle fixed part slides between chip positioning device and die-bonding device on track screw mandrel by welding drive motors driving.
As a kind of optimal way, described conveyance drive motors comprises chip conveyance Z axis motor and chip conveyance Y-axis motor.
As a kind of optimal way, described welding drive motors comprises chips welding Z axis motor and chips welding Y-axis motor.
As a kind of optimal way, in described conveyance frame, be also provided with the chip conveyance detection CCD camera lens that is positioned at chip feedway top, described chip conveyance detects on CCD camera lens and is provided with the coaxial lens barrel of CCD, and the coaxial lens barrel side of described CCD is also provided with CCD fine setting micrometer and CCD coaxial-illuminating light source.
As a kind of optimal way, in described conveyance frame, be also provided with the chips welding detection CCD camera lens that is positioned at die-bonding device top, described chips welding detects on CCD camera lens and is provided with the coaxial lens barrel of CCD, and the coaxial lens barrel side of described CCD is also provided with CCD fine setting micrometer and CCD coaxial-illuminating light source.
As a kind of optimal way, described eutectic welding stage comprises support, on described support, be arranged with the inner orbit and the outside track that slide for support in parallel, below between described inner orbit and outside track is provided with electromagnetic heater, be provided with welding carrying suction nozzle corresponding to electromagnetic heater on described inner orbit and outside track.
As a kind of optimal way, on described support, be provided with conveyor frame, in described conveyor frame, be arranged with the inner orbit and the outside track that slide for support in parallel, described inner orbit slides and is provided with material loading conveyance pawl near one end of support charging crane, the other end of described inner orbit slides and is provided with feeding conveyance pawl and feeding rod, and described material loading conveyance pawl and feeding conveyance pawl are strip shape gob that can folding.
As a kind of optimal way, described opto-electronic testing apparatus comprises testing base, described testing base is provided with test tracks, in described test tracks, slide and be provided with testing jig, the top, middle part of described test tracks is across being provided with an integrating sphere device for optical measurement, described testing jig top is provided with a test board parallel with test tracks, on described test board, be laid with multiple test syringe needles, described testing jig top is provided with at least three cantilever beams of vertical checkout plate, the free end of each cantilever beam is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle form, can block and establish ceramics bracket, when described ceramics bracket is fastened between barb and test syringe needle, the pad of described test syringe needle and ceramics bracket bottom is corresponding and electric connection one by one, described testing jig is slidably to the thieff hatch of the bottom of integrating sphere device.
A kind of eutectic welding method of LED encapsulation, blank support handler sends blank support to welding stage connecting gear, blank support is sent to eutectic welding stage by the material loading conveyance pawl of welding stage connecting gear, chip positioning feed mechanism carries out chip correction by chip conveyance suction nozzle conveyance to the chip angle means for correcting of chips welding carrying device after the chip positioning on blue film is separated, the chips welding suction nozzle high-ranking officers of chips welding carrying device chip conveyance is just in time to the blank support on eutectic welding stage, eutectic welding stage is sent to opto-electronic testing apparatus and carries out photoelectricity test adopting electromagnetic wave heating to carry out support that eutectic is welded with chip, support through photoelectricity test is stand-by by the unloading of finished product support handler.
The utility model is a kind of system that adopts the LED encapsulation that electromagnetic wave Fast Heating carries out eutectic welding chip.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the structural representation of the utility model embodiment chips welding carrying device;
Fig. 3 is the structural representation of the utility model embodiment eutectic welding stage;
Fig. 4 is the structural representation of the utility model embodiment opto-electronic testing apparatus;
Fig. 5 is the C partial enlarged drawing of Fig. 4.
The specific embodiment
Below in conjunction with embodiment and contrast accompanying drawing the utility model is described in further detail.
A kind of eutectic welding system of LED encapsulation, with reference to figure 1, an eutectic welding system for LED encapsulation, comprises blank support handler 1, chip positioning feed mechanism 4, chips welding carrying device 2, chip angle means for correcting 3, welding stage connecting gear 6, eutectic welding stage 7, opto-electronic testing apparatus 5 and finished product support handler 8; Described blank support handler 1 is arranged on one end of welding stage connecting gear 6 material loading conveyance pawls, the middle part of described welding stage connecting gear 6 is provided with eutectic welding stage 7, the other end of described welding stage connecting gear 6 connects opto-electronic testing apparatus 5, and the outlet of described opto-electronic testing apparatus 5 connects finished product support handler 8; Described chip positioning feed mechanism 4 is arranged on the below of a moving position of the chip conveyance suction nozzle of chips welding carrying device 2, the below of another moving position of described chip conveyance suction nozzle is provided with chip angle means for correcting 3, one moving position of the chips welding suction nozzle of described chips welding carrying device 2 is also arranged on the top of chip angle means for correcting 3, and a moving position of described chips welding suction nozzle is arranged on the top of eutectic welding stage 7.
The eutectic welding system of LED encapsulation of the present utility model, with reference to figure 2, on the basis of previous technique scheme, chips welding carrying device specifically comprises the track screw mandrel 213 being connected in conveyance frame, be slidably arranged in chip conveyance suction nozzle fixed part 211 and chips welding suction nozzle fixed part 216 on track screw mandrel 213, chip conveyance suction nozzle fixed part 211 belows are fixedly installed chip conveyance suction nozzle 212, and chips welding suction nozzle fixed part 216 belows are fixedly installed chips welding suction nozzle 215; Chip conveyance suction nozzle fixed part 211 is driven and on track screw mandrel 213, is slided between chip feedway and chip positioning device by conveyance drive motors, and chips welding suction nozzle fixed part 216 is driven and slided between chip positioning device and die-bonding device on track screw mandrel 213 by welding drive motors.Conveyance drive motors comprises chip conveyance Z axis motor 206 and chip conveyance Y-axis motor.Welding drive motors comprises chips welding Z axis motor 205 and chips welding Y-axis motor 201.In conveyance frame, be also provided with the chip conveyance detection CCD camera lens 208 that is positioned at chip feedway top.Chip conveyance detects on CCD camera lens 208 and is provided with the coaxial lens barrel 209 of CCD, and coaxial lens barrel 209 sides of CCD are also provided with CCD fine setting micrometer 207 and CCD coaxial-illuminating light source 210.In conveyance frame, be also provided with the chips welding detection CCD camera lens 204 that is positioned at die-bonding device top.Chips welding detects on CCD camera lens 204 and is provided with the coaxial lens barrel 203 of CCD, and coaxial lens barrel 203 sides of CCD are also provided with CCD fine setting micrometer 202 and CCD coaxial-illuminating light source 214.
The eutectic welding system of LED encapsulation of the present utility model, with reference to figure 3, on the basis of previous technique scheme, eutectic welding stage specifically comprises support 704, on described support 704, be arranged with the inner orbit 610 and the outside track 607 that slide for support 300 in parallel, below between described inner orbit 610 and outside track 607 is provided with electromagnetic heater 701, be provided with welding carrying suction nozzle 215 corresponding to electromagnetic heater 701 on described inner orbit 610 and outside track 607.On support 704, be provided with conveyor frame 609, in described conveyor frame 609, be arranged with the inner orbit 610 and the outside track 607 that slide for support 300 in parallel, described inner orbit 610 slides and is provided with material loading conveyance pawl 601 near one end of support charging crane, the other end of described inner orbit 610 slides and is provided with feeding conveyance pawl and feeding rod 604 and feeding rod 605, and described material loading conveyance pawl 601 and feeding conveyance pawl 604 are strip shape gob that can folding.Utilize the strip shape gob of material loading conveyance pawl 601 can stably clamp the support 300 of being sent here by support charging crane, electromagnetic heater 701 places delivered to by support 300 by material loading conveyance pawl 601, after by electromagnetic heater 701, chip being welded, delivers to next operation again by feeding conveyance pawl 604.The corresponding material loading conveyance of outside track 607 pawl 601 places are provided with charging resistance gauge 602, and described outside track 607 corresponding feeding conveyance pawl 604 places are provided with feeding resistance gauge 606.Charging resistance gauge 602 and feeding resistance gauge 606, for making support 300 be fitted in outside track 607, are avoided its perk.Inner orbit 610 and outside track 607 are positioned at welding stage place across being provided with welding compressing tablet 608, are set to the bar-shaped trough entering for chip in the middle of welding compressing tablet 608.In conveyor frame 609, be provided with the inner orbit Y-axis motor 612 that drives inner orbit 610 translations and the outside track Y-axis motor 611 that drives outside track 607 translations.Slide and be provided with the welding bench 705 of Motionless electromagnetic heater 701 in support 704 tops, the heater Z axis motor 703 that drives electromagnetic heater 701 to move up and down is installed on described welding bench 705, the eutectic welding stage X-axis motor 707 and the eutectic welding stage Y-axis motor 702 that drive welding bench 705 translation are all around installed on described support 704.On support 704, be provided with the upper and lower change gear 706 of support conveyance.On inner orbit 610 and outside track 607, be provided with chips welding corresponding to electromagnetic heater 701 detects CCD camera lens 204.Chips welding detect CCD camera lens 204 be positioned at welding chip directly over, for taking the position of chip and support, by control device order welding carrying suction nozzle 215, chip is adjusted to correct position.Chips welding detects on CCD camera lens 204 and is provided with the coaxial lens barrel 203 of CCD, and coaxial lens barrel 204 sides of described CCD are also provided with CCD fine setting micrometer 202 and CCD coaxial-illuminating light source 214.CCD fine setting micrometer 202 is for adjusting camera lens, and CCD coaxial-illuminating light source 214 is for light filling.
The eutectic welding system of LED encapsulation of the present utility model, with reference to figure 4 and Fig. 5, on the basis of previous technique scheme, opto-electronic testing apparatus specifically comprises testing base 502, in described testing base 502, be provided with test tracks 504, in described test tracks 504, slide and be provided with testing jig 507, the top, middle part of described test tracks 504 is across being provided with an integrating sphere device 501 for optical measurement, described testing jig 507 tops are provided with a test board 510 parallel with test tracks 504, on described test board 510, be laid with multiple test syringe needles 511, described testing jig 507 tops are provided with four cantilever beams 509 of vertical checkout plate, the free end of four cantilever beams 509 is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle 511 form, can block and establish ceramics bracket 300, when described ceramics bracket 300 is fastened between barb and test syringe needle 511, the pad of described test syringe needle 511 and ceramics bracket 300 bottoms is corresponding and be electrically connected one by one, described testing jig 507 is slidably to the thieff hatch of the bottom of integrating sphere device 501.The ceramics bracket 300 that has welded chip 100 is fastened between barb and test syringe needle 511, the pad of now testing syringe needle 511 and ceramics bracket 300 bottoms is corresponding and be electrically connected one by one, in the time that testing jig 507 slides in the thieff hatch of bottom of integrating sphere device 501, chip 100 on ceramics bracket 300 is lighted successively by test syringe needle 511, by calculating its light flux values, thereby form the photoelectricity test report of each chip.Testing jig 507 is driven and is slided in test tracks 504 by a testing of electric motors 503.In testing jig 507, be provided with testing host (not shown), described testing host is electrically connected each test syringe needle 511.For controlling the energising order of each test syringe needle.On testing jig, be provided with the COM1 508 that is electrically connected testing host.For being connected with extraneous control device.
The eutectic welding method of LED of the present utility model is specially: blank support handler 1 sends blank support to welding stage connecting gear 6, blank support is sent to eutectic welding stage 7 by the material loading conveyance pawl of welding stage connecting gear 6, chip positioning feed mechanism 4 carries out chip correction by chip conveyance suction nozzle conveyance to the chip angle means for correcting 3 of chips welding carrying device 2 after the chip positioning on blue film is separated, the chips welding suction nozzle high-ranking officers of chips welding carrying device 2 chip conveyance is just in time to the blank support on eutectic welding stage 7, eutectic welding stage 7 is sent to opto-electronic testing apparatus 5 and carries out photoelectricity test adopting electromagnetic wave heating to carry out support that eutectic is welded with chip, support through photoelectricity test unloads stand-by by finished product support handler 8.
More than that the eutectic welding system of the utility model LED encapsulation is set forth; be used for helping to understand the utility model; but embodiment of the present utility model is not restricted to the described embodiments; anyly do not deviate from the change done under the utility model principle, modification, substitute, combination, simplify; all should be equivalent substitute mode, within being included in protection domain of the present utility model.
Claims (9)
1. an eutectic welding system for LED encapsulation, is characterized in that: comprise blank support handler, chip positioning feed mechanism, chips welding carrying device, chip angle means for correcting, welding stage connecting gear, eutectic welding stage, opto-electronic testing apparatus and finished product support handler; Described blank support handler is arranged on one end of welding stage connecting gear material loading conveyance pawl, the middle part of described welding stage connecting gear is provided with eutectic welding stage, the other end of described welding stage connecting gear connects opto-electronic testing apparatus, and the outlet of described opto-electronic testing apparatus connects finished product support handler; Described chip positioning feed mechanism is arranged on the below of a moving position of the chip conveyance suction nozzle of chips welding carrying device, the below of another moving position of described chip conveyance suction nozzle is provided with chip angle means for correcting, one moving position of the chips welding suction nozzle of described chips welding carrying device is also arranged on the top of chip angle means for correcting, and a moving position of described chips welding suction nozzle is arranged on the top of eutectic welding stage.
2. the eutectic welding system that LED encapsulates according to claim 1, it is characterized in that: described chips welding carrying device comprises the track screw mandrel being connected in conveyance frame, be slidably arranged in chip conveyance suction nozzle fixed part and chips welding suction nozzle fixed part on described track screw mandrel, described chip conveyance suction nozzle fixed part below is fixedly installed chip conveyance suction nozzle, and described chips welding suction nozzle fixed part below is fixedly installed chips welding suction nozzle; Described chip conveyance suction nozzle fixed part is driven and on track screw mandrel, is slided between chip feedway and chip positioning device by conveyance drive motors, and described chips welding suction nozzle fixed part slides between chip positioning device and die-bonding device on track screw mandrel by welding drive motors driving.
3. the eutectic welding system that LED encapsulates according to claim 2, is characterized in that: described conveyance drive motors comprises chip conveyance Z axis motor and chip conveyance Y-axis motor.
4. the eutectic welding system that LED encapsulates according to claim 2, is characterized in that: described welding drive motors comprises chips welding Z axis motor and chips welding Y-axis motor.
5. the eutectic welding system that LED encapsulates according to claim 2, it is characterized in that: in described conveyance frame, be also provided with the chip conveyance detection CCD camera lens that is positioned at chip feedway top, described chip conveyance detects on CCD camera lens and is provided with the coaxial lens barrel of CCD, and the coaxial lens barrel side of described CCD is also provided with CCD fine setting micrometer and CCD coaxial-illuminating light source.
6. the eutectic welding system that LED encapsulates according to claim 2, it is characterized in that: in described conveyance frame, be also provided with the chips welding detection CCD camera lens that is positioned at die-bonding device top, described chips welding detects on CCD camera lens and is provided with the coaxial lens barrel of CCD, and the coaxial lens barrel side of described CCD is also provided with CCD fine setting micrometer and CCD coaxial-illuminating light source.
7. the eutectic welding system that LED encapsulates according to claim 1, it is characterized in that: described eutectic welding stage comprises support, on described support, be arranged with the inner orbit and the outside track that slide for support in parallel, below between described inner orbit and outside track is provided with electromagnetic heater, be provided with welding carrying suction nozzle corresponding to electromagnetic heater on described inner orbit and outside track.
8. the eutectic welding system that LED encapsulates according to claim 7, it is characterized in that: on described support, be provided with conveyor frame, in described conveyor frame, be arranged with the inner orbit and the outside track that slide for support in parallel, described inner orbit slides and is provided with material loading conveyance pawl near one end of support charging crane, the other end of described inner orbit slides and is provided with feeding conveyance pawl and feeding rod, and described material loading conveyance pawl and feeding conveyance pawl are strip shape gob that can folding.
9. the eutectic welding system that LED encapsulates according to claim 1, it is characterized in that: described opto-electronic testing apparatus comprises testing base, described testing base is provided with test tracks, in described test tracks, slide and be provided with testing jig, the top, middle part of described test tracks is across being provided with an integrating sphere device for optical measurement, described testing jig top is provided with a test board parallel with test tracks, on described test board, be laid with multiple test syringe needles, described testing jig top is provided with at least three cantilever beams of vertical checkout plate, the free end of each cantilever beam is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle form, can block and establish ceramics bracket, when described ceramics bracket is fastened between barb and test syringe needle, the pad of described test syringe needle and ceramics bracket bottom is corresponding and electric connection one by one, described testing jig is slidably to the thieff hatch of the bottom of integrating sphere device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320728227.9U CN203649642U (en) | 2013-11-18 | 2013-11-18 | Eutectic welding system for LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320728227.9U CN203649642U (en) | 2013-11-18 | 2013-11-18 | Eutectic welding system for LED packaging |
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| Publication Number | Publication Date |
|---|---|
| CN203649642U true CN203649642U (en) | 2014-06-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320728227.9U Expired - Fee Related CN203649642U (en) | 2013-11-18 | 2013-11-18 | Eutectic welding system for LED packaging |
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| CN (1) | CN203649642U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103831524A (en) * | 2013-11-18 | 2014-06-04 | 深圳盛世天予科技发展有限公司 | Eutectic soldering system and method for LED packaging |
| CN111390319A (en) * | 2020-04-23 | 2020-07-10 | 大连优迅科技有限公司 | Chip eutectic welding equipment |
-
2013
- 2013-11-18 CN CN201320728227.9U patent/CN203649642U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103831524A (en) * | 2013-11-18 | 2014-06-04 | 深圳盛世天予科技发展有限公司 | Eutectic soldering system and method for LED packaging |
| CN111390319A (en) * | 2020-04-23 | 2020-07-10 | 大连优迅科技有限公司 | Chip eutectic welding equipment |
| CN111390319B (en) * | 2020-04-23 | 2021-04-16 | 大连优迅科技股份有限公司 | Chip eutectic welding equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140618 Termination date: 20151118 |
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| EXPY | Termination of patent right or utility model |