CN100495751C

CN100495751C - A line welder with LED defect detection device

Info

Publication number: CN100495751C
Application number: CNB200710093098XA
Authority: CN
Inventors: 文玉梅; 李平; 李恋; 文静
Original assignee: Chongqing University
Current assignee: Chongqing University
Priority date: 2007-12-03
Filing date: 2007-12-03
Publication date: 2009-06-03
Anticipated expiration: 2027-12-03
Also published as: CN101170155A

Abstract

The invention discloses a welding wire machine of LED defects detectors, which includes a system control module, a welding device, a mechanical device, an optical device and a LED defects detector, wherein, the LED defects detector includes a detection control and signal connection processing device, a detection exciting light source, an exciting light focusing and location lens, a detection device and a relative position adjustment device. The exciting light irradiates the LED chip after convergence and location. The detector extracts the detection signals and input the obtained detection signals to the detection control and signal collection processing device, which collects, processes and analyzes the detection signals and realize the drive control to the relative position adjustment device. The good technical effect of the invention is: to repair welding for insufficient solder in time, reduce material waste in later period encapsulation and at last improve the finished products rate of the LED chip encapsulation.

Description

A kind of bonding equipment with the LED defect detecting device

[technical field]

The present invention relates to a kind of bonding equipment of led chip encapsulation, particularly a kind of bonding equipment with the LED defect detecting device.

[background technology]

LED (Light Emitting Diode, light-emitting diode) has characteristics such as volume is little, power consumptive province, life-span length, reliability height, is widely used in fields such as indicator light, signal lamp, display screen, Landscape Lighting.Because the Market competition of light-emitting diode, it is produced and encapsulation process must be attached great importance to rate of finished products and quality, so the online defects detection and the quality control of production and encapsulation process are very important.

The technical process of led chip encapsulation is that outer lead is connected on the electrode of led chip, protects led chip simultaneously, and plays and improve the effect that light takes out efficient.Pressure welding is the key link of LED packaging technology, its objective is external electrode is guided on the led chip, finishes the connection work of outer lead in the product.Partial L ED chip is peeled off reason such as unclean and can be caused welding difficulty and rosin joint owing to photomask surface glue, and after encapsulating and encapsulation, along with transportation with the vibration when using, LED very easily occurring opens circuit, thereby influences final product quality.In addition, also may there be substandard products (being that chip functions lost efficacy) in led chip to be packaged.If there is not the LED defect detecting device, just can't block function lose efficacy and the follow-up packaging process of the underproof led chip of welding quality, cause the waste of material, increase the LED production cost.At present in the LED packaging industrial at home and abroad also without any the bonding equipment that has led function state and welding quality checkout gear.

[summary of the invention]

The object of the present invention is to provide a kind of bonding equipment of the band LED defect detecting device that can in the LED encapsulation process, use.The bonding equipment of this kind band LED defect detecting device, it comprises system control module, welder, mechanical device and Optical devices in the common bonding equipment, and the difference of it and common bonding equipment is: it also increases a LED defect detecting device on bonding equipment.

Described LED defect detecting device comprises: detect control and signal acquisition and processing apparatus, detection exciting light source, exciting light focusing and positioning lens, checkout gear and relative position adjusting device; The system control module that detects control and signal acquisition and processing apparatus and bonding equipment communicates to connect; Detect exciting light source and provide exciting light for detection, exciting light focuses on and positioning lens converges back also positioning irradiation on led chip with exciting light, the relative position adjusting device is installed on the displacement work table of mechanical device, adjust the package support of led chip or the relative position of substrate and checkout gear, checkout gear extracts detection signal and the detection signal that obtains is input to detection control and signal acquisition and processing apparatus, detects control and signal acquisition and processing apparatus collection, processing and analyzing and testing signal and realization are to the drive controlling of relative position adjusting device and detection exciting light source.

Described clamping mechanical device and checkout gear are placed on the displacement work table respectively or on the relative position adjusting device and interchangeable position.

Described exciting light focuses on and positioning lens can be served as by the built-in lens in the Optical devices.

Described checkout gear is made of magnetic core and the coil on magnetic core.

Described coil or be single group coil, or constitute by primary coil and secondary coil.

Described checkout gear also can be made of the pair of metal probe.

Useful technique effect of the present invention is: can be in time in LED pressure welding process, apace, filter out the underproof led chip of disabler and welding quality in advance, can in time carry out repair welding to the rosin joint situation, to reduce the waste of material in the later stage encapsulation process, finally improve the rate of finished products of led chip encapsulation.

[description of drawings]

Accompanying drawing 1, typical bonding equipment structural representation;

Accompanying drawing 2 adopts a kind of structure chart of external lens as the bonding equipment embodiment of exciting light focusing and positioning lens;

Accompanying drawing 3 adopts the another kind of structure chart of external lens as the bonding equipment embodiment of exciting light focusing and positioning lens;

Accompanying drawing 4 adopts a kind of structure chart of the built-in lens of the bonding equipment of being with Optical devices as the bonding equipment embodiment of exciting light focusing and positioning lens;

Accompanying drawing 5 adopts the another kind of structure chart of the built-in lens of the bonding equipment of being with Optical devices as the bonding equipment embodiment of exciting light focusing and positioning lens;

Accompanying drawing 6, the index path of LED defect detecting device;

Accompanying drawing 7, a kind of structure chart of checkout gear;

Accompanying drawing 8, the another kind of structure chart of checkout gear;

In the accompanying drawing: system control module 1, Optical devices 2, welder 3, mechanical device 4, displacement work table 5, displacement drive 6, soldering tip moving positioning device 7, clamping mechanical device 8, led chip 9, LED defect detecting device 10, detect control and signal acquisition and processing apparatus 11, detect exciting light source 12, exciting light focuses on and positioning lens 13, checkout gear 14, relative position adjusting device 15, built-in lens 16, magnetic core 17, coil 18, magnetic core 19, primary coil 20, secondary coil 21.

[embodiment]

Referring to accompanying drawing 1, general typical bonding equipment comprises: system control module 1, Optical devices 2, welder 3 and mechanical device 4 four parts constitute; Wherein mechanical device 4 comprises: displacement work table 5, displacement drive 6, soldering tip moving positioning device 7 and clamping mechanical device 8; System control module 1 communicates to connect with Optical devices 2, welder 3 and mechanical device 4 respectively, and system control module 1 receives and handle the signal that Optical devices 2 are gathered, and welder 3 and mechanical device 4 are made control corresponding.

The course of work of LED defect detecting device 10 can be sketched and be: checkout gear 14 detects control and signal acquisition and processing apparatus 11 to the signal input that collects, 11 pairs of control and signal acquisition and processing apparatus detect exciting light source 12 and relative position adjusting device 15 is done corresponding control by detecting, and the system control module 1 of the bonding equipment that simultaneously the signal input is attached thereto, also do corresponding control by Optical devices 2, welder 3 and the mechanical device 4 of 1 pair of bonding equipment of system control module.

Wherein LED defect detecting device 10 comprises: detect control and signal acquisition and processing apparatus 11, detection exciting light source 12, exciting light focusing and positioning lens 13, checkout gear 14 and relative position adjusting device 15; The system control module 1 that detects control and signal acquisition and processing apparatus 11 and bonding equipment communicates to connect; Detect exciting light source 12 and provide exciting light for detection, exciting light focuses on and positioning lens 13 converges back also positioning irradiation on led chip 9 with exciting light, relative position adjusting device 15 is installed on the displacement work table 5 of mechanical device 4, adjust the package support of led chip 9 or the relative position of substrate and checkout gear 14, checkout gear 14 extracts detection signal and a detection signal that obtains is input to detection control and signal acquisition and processing apparatus 11, detects control and signal acquisition and processing apparatus 11 collections, processing and analyzing and testing signal and realization are to the drive controlling of relative position adjusting device 15 and detection exciting light source 12.

Described clamping mechanical device 8 and checkout gear 14 are placed on the displacement work table 5 respectively or on the relative position adjusting device 15 and interchangeable position.

Described exciting light focuses on and positioning lens 13 can be served as that (now typical bonding equipment all has Optical devices 2 by the built-in lens 16 in the Optical devices 2, have only and formerly serve old-fashioned bonding equipment and be not with Optical devices 2, must install Optical devices 2 earlier additional if these old-fashioned bonding equipments will be implemented the solution of the present invention, otherwise can't adopt the solution of the present invention).

Described checkout gear 14 is made of magnetic core 17 and the coil 18 on magnetic core.

Described coil 18 or be single group coil, or constitute by primary coil 20 and secondary coil 21.

Described checkout gear 14 can be made of the pair of metal probe.

Embodiment 1:

Referring to accompanying drawing 1, accompanying drawing 2, a kind of implementation of the present invention is: on existing typical bonding equipment, increase a LED defect detecting device 10.

Relative position adjusting device 15 on the bonding equipment in the accompanying drawing 2, be placed on the displacement work table 5, checkout gear 14 is installed on the relative position adjusting device 15, come motion detection device 14 by relative position adjusting device 15, adjust the package support of led chip 9 or the relative position of substrate and checkout gear 14; Checkout gear 14 obtains detection signal and the detection signal that obtains is input to and detects control and signal acquisition and processing apparatus 11, realizes to collection, analysis and the processing of detection signal and to the drive controlling of relative position adjusting device 15 by detecting control and signal acquisition and processing apparatus 11.

Referring to accompanying drawing 3, checkout gear 14 can also be fixed on the displacement work table 5, clamping mechanical device 8 is placed on the relative position adjusting device 15, comes mobile clamping mechanical device 8 to adjust the package support of led chip 9 or the relative position of substrate and checkout gear 14 by relative position adjusting device 15.

Referring to accompanying drawing 7, to the LED encapsulation of metallic support supporting led chip and extraction electrode, described checkout gear 14 can be made of magnetic core 17 and the single group coil 18 on magnetic core 17;

Referring to accompanying drawing 8, to the LED encapsulation of substrate supporting led chip and extraction electrode, described checkout gear 14 can be made of

magnetic core

19 and 21 liang of groups of primary coil 20 and the secondary coil coil on magnetic core 19;

Described checkout gear 14 also can be made of a pair of test pen.

Index path referring to the LED defect detecting device shown in the accompanying drawing 6, detect exciting light source 12 and launch exciting light and focus on and positioning lens 13 converges the back positioning irradiation on detected led chip 9, can detect functional status and the welding quality of LED at this moment through exciting light.

Embodiment 2:

Referring to Fig. 1, accompanying drawing 4, accompanying drawing 5, another kind of implementation of the present invention is: the present embodiment difference from Example 1 is: utilize the built-in lens 16 of Optical devices 2 to focus on and positioning lens 13 as exciting light in the present embodiment.

Light path in the present embodiment still is the light path shown in the accompanying drawing 3, detect exciting light source 12 launch exciting light through exciting light focus on and positioning lens 13 (being the built-in lens 16 of typical bonding equipment) converge after positioning irradiation on detected led chip 9, can detect functional status and the welding quality of LED then.

Claims

1, a kind of bonding equipment with the LED defect detecting device comprises system control module (1), welder (3), mechanical device (4) and Optical devices (2), it is characterized in that: increase a LED defect detecting device (10) on bonding equipment;

Described LED defect detecting device (10) comprising: detect control and signal acquisition and processing apparatus (11), detection exciting light source (12), exciting light focusing and positioning lens (13), checkout gear (14) and relative position adjusting device (15); The system control module (1) that detects control and signal acquisition and processing apparatus (11) and bonding equipment communicates to connect; Detect exciting light source (12) for detection provides exciting light, exciting light focuses on and positioning lens (13) converges back also positioning irradiation on led chip (9) with exciting light; Relative position adjusting device (15) is installed on the displacement work table (5) of mechanical device (4), is used to adjust the package support of led chip (9) or the relative position of substrate and checkout gear (14); Checkout gear (14) extracts detection signal and the detection signal that obtains is input to detection and controls and signal acquisition and processing apparatus (11), detects control and signal acquisition and processing apparatus (11) collection, processing and analyzing and testing signal and the realization drive controlling to relative position adjusting device (15) and detection exciting light source (12).

2, the bonding equipment of band LED defect detecting device according to claim 1, it is characterized in that: be used for the clamping mechanical device (8) and the checkout gear (14) of clamping led chip (9), be placed in respectively that displacement work table (5) is gone up and relative position adjusting device (15) on.

3, the bonding equipment of band LED defect detecting device according to claim 1, it is characterized in that: be used for the clamping mechanical device (8) and the checkout gear (14) of clamping led chip (9), be placed in respectively that relative position adjusting device (15) is gone up and displacement work table (5) on.

4, the bonding equipment of band LED defect detecting device according to claim 1, it is characterized in that: described exciting light focuses on and positioning lens (13) is served as by the built-in lens (16) in the Optical devices (2).

5, the bonding equipment of band LED defect detecting device according to claim 1 is characterized in that: described checkout gear (14) is made of magnetic core (17) and the coil (18) on magnetic core.

6, the bonding equipment of band according to claim 5 LED defect detecting device is characterized in that: described coil (18) or be single group coil, or by primary coil (20) and secondary coil (21) formation.

7, the bonding equipment of band LED defect detecting device according to claim 1, it is characterized in that: described checkout gear (14) is made of the pair of metal probe.