CN103604372A - Product full range observation and measurement method based on multiple cameras and device thereof - Google Patents

Product full range observation and measurement method based on multiple cameras and device thereof Download PDF

Info

Publication number
CN103604372A
CN103604372A CN201310542681.XA CN201310542681A CN103604372A CN 103604372 A CN103604372 A CN 103604372A CN 201310542681 A CN201310542681 A CN 201310542681A CN 103604372 A CN103604372 A CN 103604372A
Authority
CN
China
Prior art keywords
camera
product
observation
method based
multiple cameras
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310542681.XA
Other languages
Chinese (zh)
Inventor
卢冬青
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GOWEAL ELECTRONIC TECHNOLOGIES (SHANGHAI) Co Ltd
Original Assignee
GOWEAL ELECTRONIC TECHNOLOGIES (SHANGHAI) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GOWEAL ELECTRONIC TECHNOLOGIES (SHANGHAI) Co Ltd filed Critical GOWEAL ELECTRONIC TECHNOLOGIES (SHANGHAI) Co Ltd
Priority to CN201310542681.XA priority Critical patent/CN103604372A/en
Publication of CN103604372A publication Critical patent/CN103604372A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The invention relates to a product full range observation and measurement method based on multiple cameras and a device thereof. The method is characterized in that the method comprises the following steps: a product is placed just under a top camera, and multi-angle and multi-range inspection can be carried out through the top camera, a right camera, a front camera, a left camera and a back camera, the top camera, the right camera, the front camera, the left camera and the back camera can be subjected to position adjustment and independent focusing independently and are suitable for the observation of full-size products, and the top camera, the right camera, the front camera, the left camera and the back camera have independent light sources and are matched with illumination requirements needed by the product. Compared with the prior art, the method and the device have the advantages of low cost and convenient use.

Description

The comprehensive observation of a kind of product based on polyphaser and measuring method and device
Technical field
The present invention relates to product observation and measuring method and device, especially relate to the comprehensive observation of a kind of product based on polyphaser multi-angle and measuring method and device.
Background technology
In semiconductor packages industry, sticky brilliant object is that many separated crystal grain (Die) are placed on to lead frame (lead frame) or substrate (PCB) fixing with elargol (epoxy) adhesion.Lead frame or substrate provide the position (die pad Die pad) of an adhesion of crystal grain, and are preset with extended leg or the weld pad (pad) of extensible IC crystal grain circuit.And the object of bonding wire be the contact on crystal grain is connected on lead frame or substrate with superfine gold thread (18 ~ 50 μ m) within pin, thereby when the circuit signal of IC crystal grain is transferred to extraneous bonding wire, take crystal grain upper contact as the first solder joint, and the solder joint on interior pin is the second solder joint.First sinter the end points of gold thread into bead, then by little ball bond on the first solder joint (this is called the first weldering, first bond).Then according to the path lashing wire line designing, finally by gold thread pressure welding on the second solder joint.
The quality of the stickup of chip and the welding quality of bonding wire have conclusive impact to the stability of the electrical specification of semiconductor product and electron device, and therefore, there is strict control device in semiconductor packages enterprise to the quality of packaging technology.Wherein the test item for the stickup situation of chip and the welding quality of bonding wire reaches tens of more than.The optical check platform of specialty, by optical microscope, chip surface is amplified, to reach the many quality determinatives such as situation to chip surface quality, chip attach situation, bonding wire, carry out the inspection of real-time Multi-orientation multi-angle, thereby adjust in time the parameter of paster, welding gear operation, get rid of the problem that causes quality abnormal in production.
Yet, traditional optical checking equipment, only there is a top (Top View) to be installed over against optical microscope or the camera of chip, adopt this inspection method, can only carry out two dimension (plane) inspection to chip and bonding wire, cannot check the side of adhering chip (three-dimensional solid), as: the shape of elargol height, bonding wire and height, the size and shape etc. that is bonded to bead on the first solder joint and the second solder joint comprehensively check, also just cannot fully understand and get rid of the problem that causes quality abnormal in production.
Efficiently solve another limitation of traditional optical checking equipment, be mainly reflected in and can not be applicable to full-scale die size, mutually involving of the position of its enlargement ratio, illumination condition and capture, can not effectively use manually or the observation of the single side face of the one-sided prism of motorized motions. ?
Summary of the invention
The object of the invention is in order to solve the limitation of above-mentioned traditional optical checkout facility, a kind of comprehensive observation of the product based on polyphaser multi-angle and measuring method and device easy to use are provided.
Object of the present invention can be achieved through the following technical solutions:
The present invention includes: top camera (Top View) and forming around the oblique camera of the equally distributed inclination of top camera.Comprise: right camera (Right View), front camera (Front View), left camera (Left View), rear camera (Bear View), also comprise: supporting camera lens and light source, top camera adjustments frame, 4, XY slide unit, 4 of Z axis, 4 of camera fixed heads, 4 of camera fixed mounts.
Compared with prior art, the present invention has the following advantages:
5 independently camera can be simultaneously chip and bonding wire be carried out to end face, leading flank, trailing flank, left surface, right flank and carry out omnibearing inspection.Be applicable to full-scale die size, and be not subject to mutually the involving of position of enlargement ratio, illumination condition and capture.Effectively avoided the limitation of traditional one camera and single microscopical observation product.
5 independently camera there is the light source that can independently adjust, 5 cameras also can independently focus on, the independent camera position of adjusting, easy to use, are easy to obtain optimum image effect.Sightingpiston and the size of multi-angle camera have been opened, result according to the different azimuth of different product forms the difference that illumination is required, set respectively different observation conditions and camera setting, and illumination parameter, to reaching best product image and observing effect.
Accompanying drawing explanation
Fig. 1 is the structural representation of the omnibearing observation of a kind of product based on polyphaser multi-angle of the present invention and measuring method and device.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail:
As Fig. 1 shows, the comprehensive observation of a kind of product based on polyphaser and measuring method and device.This device comprises that top camera 1(is containing microscope and light source), right camera 2, front camera 3, left camera 4, rear camera 5, top camera adjustments frame 6, XY slide unit 7, Z axis 8, camera fixed head 9 and camera fixed mount 10, described XY slide unit 7, Z axis 8, camera fixed head 9 and camera fixed mount 10 are that 4 side cameras are established for coordinating.
The course of work of the present invention is as follows:
Adjustment when device is used first and changes product:
Put into product to top camera 1, adjust the operating distance of top microscope with camera, make camera 1 focusing correct images in top the most clear, adjust height and the brightness of top camera light source, make the image effect of top camera 1 optimum.
Adjust right camera 2, front camera 3, left camera 4, rear camera 5, to needed enlargement factor.
Adjust right camera 2, front camera 3, left camera 4, rear camera 5, affiliated XY slide unit 7, makes four cameras, aims at respectively the right, front, the left side, back of chip to deserved surrounding prism.
Adjust the affiliated Z axis 8 of four cameras, obtain correct focusing, make the image of right camera 2, front camera 3, left camera 4, rear camera 5, four cameras the most clear.And adjust the light source separately of four cameras, make each contented image effect best.
During normal use, only product need to be put into top camera under, can check product.

Claims (1)

1. the comprehensive observation of product and measuring method and the device kind based on polyphaser, is characterized in that:
Product is put under the camera of top, by top camera, right camera, front camera, left camera, rear camera, can carries out multi-angle, multi-faceted inspection; Top camera, right camera, front camera, left camera, rear camera can independently carry out position adjustment, independent focusing, the observation of applicable full-scale product; Top camera, right camera, front camera, left camera, rear camera have independently light source, coordinate the required illumination requirement of product.
CN201310542681.XA 2013-11-06 2013-11-06 Product full range observation and measurement method based on multiple cameras and device thereof Pending CN103604372A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310542681.XA CN103604372A (en) 2013-11-06 2013-11-06 Product full range observation and measurement method based on multiple cameras and device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310542681.XA CN103604372A (en) 2013-11-06 2013-11-06 Product full range observation and measurement method based on multiple cameras and device thereof

Publications (1)

Publication Number Publication Date
CN103604372A true CN103604372A (en) 2014-02-26

Family

ID=50122618

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310542681.XA Pending CN103604372A (en) 2013-11-06 2013-11-06 Product full range observation and measurement method based on multiple cameras and device thereof

Country Status (1)

Country Link
CN (1) CN103604372A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104198386A (en) * 2014-09-11 2014-12-10 上海功源电子科技有限公司 Method and device for displaying and acquiring multi-camera images based on dual displays
CN105869179A (en) * 2016-06-06 2016-08-17 青岛晶维科创医药工程有限公司 Crystal particle three-dimensional imaging system and method
CN107200154A (en) * 2017-04-27 2017-09-26 安徽信陆电子科技有限公司 Light source position adjustment mechanism
CN111175454A (en) * 2020-01-19 2020-05-19 温州市唐豪网络科技有限公司 Scanning device based on digital information transportation

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104198386A (en) * 2014-09-11 2014-12-10 上海功源电子科技有限公司 Method and device for displaying and acquiring multi-camera images based on dual displays
CN105869179A (en) * 2016-06-06 2016-08-17 青岛晶维科创医药工程有限公司 Crystal particle three-dimensional imaging system and method
CN107200154A (en) * 2017-04-27 2017-09-26 安徽信陆电子科技有限公司 Light source position adjustment mechanism
CN111175454A (en) * 2020-01-19 2020-05-19 温州市唐豪网络科技有限公司 Scanning device based on digital information transportation
CN111175454B (en) * 2020-01-19 2020-12-04 宁波镇海昕龙网络科技有限公司 Scanning device based on digital information transportation

Similar Documents

Publication Publication Date Title
KR101505702B1 (en) Electronic component inspecting method and apparatus used in the method
TWI467681B (en) Method for manufacturing semiconductor device
KR100958204B1 (en) Method and apparatus for inspecting of flat display panel
WO2011007651A1 (en) Substrate inspecting apparatus
CN103604372A (en) Product full range observation and measurement method based on multiple cameras and device thereof
KR100766394B1 (en) Auto denting test equipment
CN106645169A (en) Image acquisition system for edge line detection of liquid crystal screen
CN100473978C (en) Denting test equipment of anisotropic conductive film
TWI512276B (en) Method of measuring optical axis of light-emitting diode module
TW201606382A (en) Apparatus for measuring the position for applying optical film
JP2015143628A (en) Electronic component inspection device
JP6785407B2 (en) Bump electronic component mounting device and bump electronic component mounting method
CN203719630U (en) Device for multidimensionally observing and measuring products based on multiple cameras
JP2579869B2 (en) Optical inspection equipment
US20130004269A1 (en) System and Method for Picking and Placement of Chip Dies
CN107091658A (en) A kind of product observation and measuring method based on five cameras
TWM447988U (en) Inspection device
CN112735307A (en) Device and method for acquiring indentation image of conductive particle
KR101379324B1 (en) Defect position display apparatus of printed circuit board
TWI603410B (en) Testing system for re-constructed wafer and the method thereof
TWI765517B (en) Die bonding device and method of manufacturing semiconductor device
TWI723492B (en) Adhesion device, micro light emitting diode optical inspection and repairing equipment and optical inspection and repairing method
JPH03211849A (en) Device for mounting flip chip
JP6952623B2 (en) Manufacturing method of die bonding equipment and semiconductor equipment
KR101328609B1 (en) Trace inspection device

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20140226