CN103579473A - Welding and temperature detecting method for LED element - Google Patents
Welding and temperature detecting method for LED element Download PDFInfo
- Publication number
- CN103579473A CN103579473A CN201210280747.8A CN201210280747A CN103579473A CN 103579473 A CN103579473 A CN 103579473A CN 201210280747 A CN201210280747 A CN 201210280747A CN 103579473 A CN103579473 A CN 103579473A
- Authority
- CN
- China
- Prior art keywords
- led element
- welding
- cover body
- heater
- line layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 230000002950 deficient Effects 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 210000002683 foot Anatomy 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 5
- ATJFFYVFTNAWJD-RNFDNDRNSA-N tin-123 Chemical compound [123Sn] ATJFFYVFTNAWJD-RNFDNDRNSA-N 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
Images
Classifications
-
- H01L33/62—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
The invention relates to a welding and temperature detecting method for an LED element. High temperature detection of an LED backlight module is integrated into a welding and manufacturing technique of the LED element. Thus, whether a bonding wire in the LED element is broken can be synchronously detected through high temperature when the welding and manufacturing technique of the LED element is finished. By means of the method, the manufacturing time for the LED backlight module is shortened.
Description
Technical field
The present invention relates to about a kind of welding method of manufacturing technology, particularly relate to and a kind ofly can to LED element, carry out welding and the temperature checking method of a kind of LED element of temperature detection simultaneously.
Background technology
Light-emitting diode (Light-Emitting Diode, LED) is the light-emitting component of current extensive use, has the advantages such as volume is little, use bright length of longevity, thereby be widely used among the mankind's daily life due to it.
Light-emitting diode is applied among backlight module in large quantities, refer to Fig. 1, it is the stereogram of existing known a kind of light-emitting diode (LED) backlight module, as shown in Figure 1, this light-emitting diode (LED) backlight module 1 ' be to comprise: cover body 11 ', line layer 12 ', a plurality of LED element 13 ' and reflector 14 '.Wherein this cover body 11 ' have cover body bottom 111 ', this line layer 12 ' by thermal plastic insulation 18 ' and be arranged at this cover body bottom 111 ' on.The plurality of LED element 13 ' be placed in cover body 11 ' interior and be welded in this line layer 12 ' on.
Conventionally, during this light-emitting diode (LED) backlight module 1 ' shipment, must sample and carry out the detection of product high temperature, with confirm to be welded in line layer 12 ' above-mentioned LED element 13 ' still can be normally luminous under the environment of high temperature.Yet, for this light-emitting diode (LED) backlight module 1 ' buyer for, sampling Detection can not effectively be guaranteed the normal luminous state of its each light-emitting diode (LED) backlight module 1 of buying ' can maintain under the environment of high temperature; Therefore, existing known sampling Detection cannot meet light-emitting diode (LED) backlight module 1 ' buyer's demand.
Because above-mentioned reason, the inventor of this case does one's utmost ground study and composition, and finally develops a kind of welding and temperature checking method of LED element.
Summary of the invention
Object of the present invention, be to provide a kind of welding and temperature checking method of LED element, be the high temperature of LED-backlit module is detected and is integrated into the welding manufacturing process of LED element within, can be when completing the welding manufacturing process of LED element, whether utilize high temperature to inspect the gold thread of LED element internal (bonding wire) and rupture, such mode contributes to shorten the manufacturing process time of LED-backlit module.
The object of the invention to solve the technical problems realizes by the following technical solutions.Welding and the temperature checking method of the LED element proposing according to the present invention, it comprises the following steps:
(1) use thermal plastic insulation (18) line layer (12) to be pasted on the circuit setting unit (111) of cover body (11);
(2) carry out the forming manufacture technique of this cover body (11);
(3) tin manufacturing process in execution, makes a plurality of welding foots of a plurality of LED elements (13) all be furnished with scolding tin;
(4), corresponding to a plurality of pads on this line layer (12), the plurality of LED element (13) is arranged on line layer (12);
(5) this cover body (11) is placed on heater (2);
(6) be energized to line layer (12);
(7) heat this heater (2) to welding temperature, with the scolding tin on the above-mentioned pad of melting;
(8) make heater (2) maintain this detected temperatures and through one period of weld time, above-mentioned LED element (13) be welded on line layer (12);
(9) this heater of continuous heating (2) is to detected temperatures;
(10) make heater (2) maintain this detected temperatures and through one period of detection time;
(11) judge whether all normal luminous and flashings not of above-mentioned LED element (13), if so, execution step (12), if not, execution step (13);
(12) be judged to be non-defective unit, step finishes; And
(13) be judged to be defective products, step finishes.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The welding of aforesaid LED element and temperature checking method, this heater (2) that wherein step (5) is used is heating plate.
The welding of aforesaid LED element and temperature checking method, this heater (2) that wherein step (8) to step (10) is used is heating plate.
The welding of aforesaid LED element and temperature checking method, wherein the temperature range of this welding temperature is 170 ° of C～220 ° C.
The welding of aforesaid LED element and temperature checking method, wherein the temperature range of this detected temperatures is 150 ° of C～200 ° C, and the time range of this detection time is 5 seconds～10 seconds.
The welding of aforesaid LED element and temperature checking method, wherein step (6) is that the mode that passes into this line layer (12) by the electrical current that is 100 μ A～150 μ A completes by current value range.
The welding of aforesaid LED element and temperature checking method, wherein this cover body 11 can be following any: the crowded type cover body that the ㄇ shape sheet metal cover body that backlight module is used, the L shaped plate that backlight module is used gold cover body and backlight module are used.
By technique scheme, the welding of LED element of the present invention and temperature checking method at least have advantage and the beneficial effect that can shorten LED-backlit module manufacturing process time.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, and for above and other object of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 is the stereogram of existing known a kind of light-emitting diode (LED) backlight module;
Fig. 2 is a kind of stereogram of LED-backlit module;
Fig. 3 is the stereogram of the ㄇ shape sheet metal cover body that uses of backlight module;
Fig. 4 is the stereogram of the crowded type cover body that uses of backlight module;
Fig. 5 A and Fig. 5 B are the welding of a kind of LED element of the present invention and the flow chart of temperature checking method; And
Fig. 6 A-Fig. 6 C is the welding of LED element and the schematic diagram of fabrication technology of temperature checking method.
1:LED backlight module
11: cover body 12: line layer
13:LED element 111: circuit setting unit
18: thermal plastic insulation 121: main line
122: pad 11a: ㄇ shape cover body
11b: squeeze type cover body 111a: circuit setting unit
112a: base 113a: bending edge
111b: circuit setting unit 1 112b: base
123: scolding tin
S01～S10: method step S12～S13: method step
2: heater
1 ': light emitting diode illuminating apparatus
11 ': cover body 12 ': line layer
13 ': LED element 14 ': emission layer
111 ': cover body bottom
Embodiment
For further setting forth the present invention, reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, welding and its embodiment of temperature checking method, manufacture method, step, feature and effect thereof to the LED element proposing according to the present invention, be described in detail as follows.
Before the welding and temperature checking method of explanation LED element proposed by the invention, first introduce LED-backlit module.Referring to Fig. 2, is a kind of stereogram of LED-backlit module, and as shown in Figure 2, this LED-backlit module 1 comprises: cover body 11, line layer 12 and a plurality of LED elements 13.Wherein this cover body 11 is the L shaped plate gold cover body that backlight module is often used, and it has circuit setting unit 111, and 12 of line layers are arranged on this circuit setting unit 111 by thermal plastic insulation 18.Line layer 12 is comprised of main line 121 and a plurality of pad 122 haply, and the plurality of LED element 13 is to be soldered on pad 122.
Please continue to refer to Fig. 3 and Fig. 4, it is the stereogram of the crowded type cover body that uses of the ㄇ shape sheet metal cover body that uses of backlight module and backlight module.The L shaped plate gold cover body that although the cover body 11 in Fig. 2 is backlight module often to be used, but, in fact, ㄇ shape sheet metal cover body 11a shown in Fig. 3 is also often used as the cover body 11(of LED-backlit module 1 as shown in Figure 2), and the crowded type cover body 11b shown in Fig. 4 is also often used the cover body 11 as LED-backlit module 1; Therefore, three kinds of cover bodies such as the L shaped cover body of the ㄇ shape cover body of this sheet metal cover body, sheet metal cover body and crowded type cover body all must be considered as to the cover body described in method step of the present invention.Wherein, the ㄇ shape cover body 11a shown in Fig. 3 has circuit setting unit 111a, base 112a and bending edge 113a; And the crowded type cover body 11b shown in Fig. 4 also has circuit setting unit 111b, and there is base 112b.
Referring to Fig. 5 A and Fig. 5 B, is the welding of a kind of LED element of the present invention and the flow chart of temperature checking method; And please refer to Fig. 6 A-Fig. 6 C, be the welding of this LED element and the schematic diagram of fabrication technology of temperature checking method.The welding of LED element of the present invention and temperature checking method comprise 13 basic steps:
As shown in Fig. 5 A and Fig. 6 A, first the method performs step (S01) and step (S02), use thermal plastic insulation 18 that line layer 12 is pasted on the circuit setting unit 111 of cover body 11, and carry out the forming manufacture technique of this cover body 11, make cover body 11 be bent into L-type or ㄇ type.Unceasingly, the method execution step (S03), as shown in Figure 6B, tin manufacturing process in execution, makes a plurality of welding foots 131 of a plurality of LED elements 13 all be furnished with scolding tin 123; Then execution step (S04) and step (S05), as shown in Figure 6 C, corresponding to a plurality of pads on this line layer 12, be arranged at the plurality of LED element 13 on line layer 12, and this cover body 11 be placed on heater 2.
Unceasingly, the method flow performing step (S06) and step (S07), be energized to line layer 12, and heat this heater 2 to welding temperature, with the scolding tin on the above-mentioned pad of melting.Wherein, step (S 06) is that the mode that passes into this line layer 12 by the electrical current that is 100 μ A to 150 μ A completes by current value range.At the energising initial stage, because above-mentioned LED element 13 is not soldered to the pad on line layer 12, therefore above-mentioned LED element 13 can't be luminous.
The method flow performing step (S08), makes heater 2 maintain this detected temperatures and through one period of weld time, above-mentioned LED element 13 is welded on line layer 12 unceasingly.Under the welding temperature between lasting 25 seconds 170 ℃～220 ℃, the complete melting of scolding tin 123 on above-mentioned welding foot 131, is welded on line layer 12 above-mentioned LED element 13; Now, because the welding foot of above-mentioned LED element 13 engages with scolding tin 123, therefore above-mentioned LED element 13 because of line layer 12 energisings luminous.In addition, must supplementary notes, this heater 2 that abovementioned steps is used is heating plate, and the heating plate just of the heater 2 shown in Fig. 6 C.
Complete after the welding of LED element 13, the method is execution step (S09) and step (S10) then, and this heater 2 of continuous heating is to detected temperatures, and makes heater 2 maintain this detected temperatures and through one period of detection time; Wherein, step (S09) is heating plate with this heater 2 that step (S10) is used, and under the detected temperatures between 150 ℃～200 ℃, continue to detect 5 seconds to 10 seconds, all normal luminous and do not glimmer to judge whether above-mentioned LED element 13 by step (S11) again, if find, part LED element 13 cannot be normally luminous, or part LED element 13 is flashings, the gold thread (bonding wire) that represents part LED element 13 inside ruptures, therefore this LED-backlit module 1 must be considered as to defective products (step (S13)).Otherwise if the whole normal luminous and flashing not of above-mentioned LED element 13, execution step (S12), is judged to be non-defective unit.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be not depart from technical solution of the present invention content, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (7)
1. the welding of LED element and a temperature checking method, is characterized in that it comprises the following steps:
(1) use thermal plastic insulation (18) line layer (12) to be pasted on the circuit setting unit (111) of cover body (11);
(2) carry out the forming manufacture technique of this cover body (11);
(3) tin manufacturing process in execution, makes a plurality of welding foots of a plurality of LED elements (13) all be furnished with scolding tin;
(4), corresponding to a plurality of pads on this line layer (12), the plurality of LED element (13) is arranged on line layer (12);
(5) this cover body (11) is placed on heater (2);
(6) be energized to line layer (12);
(7) heat this heater (2) to welding temperature, with the scolding tin on the above-mentioned pad of melting;
(8) make heater (2) maintain this detected temperatures and through one period of weld time, above-mentioned LED element (13) be welded on line layer (12);
(9) this heater of continuous heating (2) is to detected temperatures;
(10) make heater (2) maintain this detected temperatures and through one period of detection time;
(11) judge whether all normal luminous and flashings not of above-mentioned LED element (13), if so, execution step (12), if not, execution step (13);
(12) be judged to be non-defective unit, step finishes; And
(13) be judged to be defective products, step finishes.
2. the welding of LED element according to claim 1 and temperature checking method, is characterized in that this heater (2) that step (5) is used is heating plate.
3. the welding of LED element according to claim 1 and temperature checking method, is characterized in that this heater (2) that step (8) to step (10) is used is heating plate.
4. the welding of LED element according to claim 1 and temperature checking method, the temperature range that it is characterized in that this welding temperature is 170 ° of C～220 ° C.
5. the welding of LED element according to claim 1 and temperature checking method, the temperature range that it is characterized in that this detected temperatures is 150 ° of C～200 ° C, and the time range of this detection time is 5 seconds～10 seconds.
6. the welding of LED element according to claim 1 and temperature checking method, is characterized in that step (6) is that the mode that passes into this line layer (12) by the electrical current that is 100 μ A～150 μ A completes by current value range.
7. the welding of LED element according to claim 1 and temperature checking method, it is characterized in that this cover body 11 can be following any: the crowded type cover body that the ㄇ shape sheet metal cover body that backlight module is used, the L shaped plate that backlight module is used gold cover body and backlight module are used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210280747.8A CN103579473A (en) | 2012-08-08 | 2012-08-08 | Welding and temperature detecting method for LED element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210280747.8A CN103579473A (en) | 2012-08-08 | 2012-08-08 | Welding and temperature detecting method for LED element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103579473A true CN103579473A (en) | 2014-02-12 |
Family
ID=50050818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210280747.8A Pending CN103579473A (en) | 2012-08-08 | 2012-08-08 | Welding and temperature detecting method for LED element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103579473A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659168A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | Crystal fixing method for LED and manufacturing method for high-power LED lamps |
| CN108738354A (en) * | 2016-02-11 | 2018-11-02 | Zkw集团有限责任公司 | Method and ICT devices for the module comprising at least two LED for checking lighting device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170155A (en) * | 2007-12-03 | 2008-04-30 | 重庆大学 | A line welder with LED bug detection device |
| CN101552313A (en) * | 2009-05-22 | 2009-10-07 | 重庆大学 | Magnetic field excitation LED on-line detection method |
| KR20110131426A (en) * | 2010-05-31 | 2011-12-07 | (주)씨에스이엔지 | A faulty-tester of the led chip |
| US20120122250A1 (en) * | 2010-11-16 | 2012-05-17 | Samsung Led Co., Ltd. | Apparatus and method for manufacturing led package |
-
2012
- 2012-08-08 CN CN201210280747.8A patent/CN103579473A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101170155A (en) * | 2007-12-03 | 2008-04-30 | 重庆大学 | A line welder with LED bug detection device |
| CN101552313A (en) * | 2009-05-22 | 2009-10-07 | 重庆大学 | Magnetic field excitation LED on-line detection method |
| KR20110131426A (en) * | 2010-05-31 | 2011-12-07 | (주)씨에스이엔지 | A faulty-tester of the led chip |
| US20120122250A1 (en) * | 2010-11-16 | 2012-05-17 | Samsung Led Co., Ltd. | Apparatus and method for manufacturing led package |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104659168A (en) * | 2015-02-12 | 2015-05-27 | 矽照光电（厦门）有限公司 | Crystal fixing method for LED and manufacturing method for high-power LED lamps |
| CN108738354A (en) * | 2016-02-11 | 2018-11-02 | Zkw集团有限责任公司 | Method and ICT devices for the module comprising at least two LED for checking lighting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101182584B1 (en) | Manufacturing appratus and manufacturing method of led package | |
| US10944023B2 (en) | Micro-LED transfer method and manufacturing method | |
| US20090134422A1 (en) | Led package module and manufacturing method thereof | |
| CN106061077B (en) | Exposure device and its inspection method | |
| CN103579473A (en) | Welding and temperature detecting method for LED element | |
| CN103137832A (en) | Light-emitting diode integrated manufacturing process | |
| CN105977363A (en) | LED substandard lamp bead recycling and re-use method | |
| CN105280511A (en) | Method of fabricating light source | |
| JP2010245348A (en) | Testing device and testing method | |
| TW201715244A (en) | Testing apparatus for LED device and testing method for LED device | |
| CN102654558A (en) | Light-emitting diode (LED) testing device | |
| KR101332184B1 (en) | System and method for manufacturing combi-type ic card | |
| CN213583780U (en) | Lamp strip made of RGB light source and white light source | |
| CN111837244A (en) | Substrate for electronic component and method for manufacturing the same | |
| CN104034509A (en) | COB (Chip On Board) light source performance testing method | |
| CN202165891U (en) | Light-emitting diode (LED) face light source | |
| CN102117880B (en) | Surface-mounted LED (Light Emitting Diode) packaging body and manufacturing method thereof | |
| CN204441330U (en) | Extraordinary LED360 ° of light-emitting component | |
| CN107068844B (en) | LED module for automobile front headlight and preparation process thereof | |
| TWI416642B (en) | With double-sided electrode semiconductor grain detection method and testing machine | |
| JP3066205U (en) | Light-emitting diode package structure that can eliminate non-uniform light emission | |
| CN103962679A (en) | Missing solderdetection device | |
| CN202927509U (en) | Light-emitting diode (LED) lamp module with LED chip arranged on heat dissipating carrier circuit directly in packaging mode | |
| CN113574673B (en) | LED display module, repairing method thereof and display equipment | |
| TWI485371B (en) | Inspection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140212 |