CN107068844B - LED module for automobile front headlight and preparation process thereof - Google Patents
LED module for automobile front headlight and preparation process thereof Download PDFInfo
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- CN107068844B CN107068844B CN201710229303.4A CN201710229303A CN107068844B CN 107068844 B CN107068844 B CN 107068844B CN 201710229303 A CN201710229303 A CN 201710229303A CN 107068844 B CN107068844 B CN 107068844B
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- led
- copper foil
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- substrate
- copper
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 75
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000011889 copper foil Substances 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 239000004743 Polypropylene Substances 0.000 claims abstract description 20
- -1 polypropylene Polymers 0.000 claims abstract description 20
- 229920001155 polypropylene Polymers 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 238000003486 chemical etching Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 238000009877 rendering Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 3
- 239000000919 ceramic Substances 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The invention relates to the field of LED lamps, in particular to an LED module for an automobile headlamp and a preparation process thereof. Including copper substrate layer, polypropylene layer, copper foil layer, LED chip, components and parts, its characterized in that: the LED packaging structure is characterized in that a polypropylene layer and a copper foil layer are sequentially arranged above the copper substrate layer from bottom to top, an LED boss is arranged on the copper substrate layer, the top of the LED boss sequentially penetrates through the polypropylene layer and the copper foil layer from bottom to top and is exposed out of the copper foil layer, a wire line is arranged on the upper surface of the copper foil layer, a plurality of components and two LED chips are arranged on the copper foil layer outside the wire line, and the components and the LED chips are fixed on the copper foil layer in a solder paste hot melting mode. Compared with the prior art, the service life of the LED product can be effectively prolonged; the heat generated in the use process of the LED is effectively and timely LED out, and the overall temperature of the module is reduced; the quality of the LED module products is improved; the ceramic substrate support in the traditional process is reduced, so that the overall production cost is effectively reduced.
Description
Technical Field
The invention relates to the field of LED lamps, in particular to an LED module for an automobile headlamp and a preparation process thereof.
Background
The LED car lamp has the unique advantages of energy conservation, long service life, strong shock resistance, high lighting speed, low loss and small load, and the market has comprehensively LED into car tail lamps, steering lamps and brake lamp fog lamps for use. Along with the gradual leading-in use of the LED headlight, the requirement on the heat dissipation of the LED module is higher and higher, and the heat dissipation requirement in the use process of the LED headlight cannot be met by using the traditional circuit substrate production and welding mode.
The traditional module technology is influenced by the insulating layer of the circuit substrate and the adhesive in the welding process, so that heat generated in the using process of the LED can not be directly LED out, the service life of the LED is reduced, the module materials are oxidized repeatedly at high temperature, the quality of the LED component is reduced, and the heat accumulation causes damage to electronic components and chips to cause electronic faults.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, designs the LED module for the automobile headlamp and the preparation process thereof, and can effectively and timely lead out the heat generated in the use process of the LED, thereby prolonging the service life of the LED.
In order to achieve the above purpose, an LED lamp for an automobile headlamp module is designed, which comprises a copper substrate layer, a polypropylene layer, a copper foil layer, an LED chip and components and parts, and is characterized in that: the LED packaging structure is characterized in that a polypropylene layer and a copper foil layer are sequentially arranged above the copper substrate layer from bottom to top, an LED boss is arranged on the copper substrate layer, the top of the LED boss sequentially penetrates through the polypropylene layer and the copper foil layer from bottom to top and is exposed out of the copper foil layer, a wire line is arranged on the upper surface of the copper foil layer, a plurality of components and two LED chips are arranged on the copper foil layer outside the wire line, the components and the LED chips are fixed on the copper foil layer in a solder paste hot melting mode, the two LED chips are connected with the anode and the cathode of the wire line through a bonding alloy wire respectively, and an ink layer is coated on the copper foil layer outside the components, the LED chips and the wire line.
Holes formed along with the LED bosses are formed in the copper foil.
And the copper substrate layer is provided with a plurality of structural holes, and the structural holes sequentially penetrate through the polypropylene layer, the copper foil layer and the printing ink layer from bottom to top.
And the LED chip is in circuit connection with the wire line.
A process for manufacturing an LED lamp for an automotive headlamp module as set forth in claim 1, characterized by comprising the steps of:
1) Step 1, manufacturing a copper substrate, namely cutting a copper foil from a position corresponding to an LED boss of the copper substrate on the copper foil to form a hollowed-out shape, and then combining the copper substrate, polypropylene and the copper foil to form a whole;
2) Step 2, manufacturing a wire circuit, namely attaching anti-corrosion ink to the surface of the substrate after the step 1, and manufacturing the wire circuit by matching an image transfer mode with a chemical etching mode;
3) Step 3, printing solder resist ink, namely printing ink on the position, which is not required to be welded, on the substrate subjected to the step 2, so as to avoid welding;
4) Step 4, forming, namely processing needed mechanism holes and shapes on the substrate which is finished in the step 3 in a punching or CNC mode;
5) Step 5, surface treatment, namely performing surface treatment on the substrate after the step 4 is completed;
6) Step 6, printing solder paste, and printing the solder paste on the surface of the substrate after the step 5 is completed;
7) Step 7, welding the components and the chips, and accurately placing the components and the LED chips on the solder paste layer in an optical point finding mode;
8) Step 8, solidifying, namely melting the solder paste layer on the substrate which is finished in the step 7 in a high-temperature vacuum reflow mode, so that the surface-assembled components and the LED chip are firmly bonded with the module;
9) Step 9, bonding wires are used for connecting the anode and the cathode of the substrate which completes the step 8 with the corresponding electrodes of the LED chip in a bonding wire mode, so that the LED chip is connected with the module forming circuit;
10 Step 10, spot fluorescent powder; the substrate dimming parameters and the color temperature color rendering indexes after the step 9 are finished;
11 Step 11, glue filling and plastic packaging are carried out, and the LED chip luminous area and components of the substrate which are subjected to the step 10 are subjected to plastic packaging;
12 Step 12, integrally curing, namely completely curing the plastic package part of the substrate after the step 11 is completed;
13 Step 13, testing and grading, and sorting the packaged products through an optical instrument.
The copper foil cut in the step 1 may be one of die cutting and laser cutting.
In the step 2, the copper substrate, the polypropylene and the copper foil are combined and integrated by adopting a heating and pressurizing mode.
Compared with the prior art, the service life of the LED product can be effectively prolonged; the heat generated in the use process of the LED is effectively and timely LED out, and the overall temperature of the module is reduced; the quality of the LED module products is improved; the ceramic substrate support in the traditional process is reduced, so that the overall production cost is effectively reduced.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic structural view of a copper substrate according to the present invention.
Fig. 3 is a schematic view of the structure of the copper substrate, polypropylene and copper foil after lamination in the present invention.
Fig. 4 is a schematic diagram of a substrate structure after etching a conductive line according to the present invention.
FIG. 5 is a schematic view of the structure of the substrate after formation of the structure holes according to the present invention.
FIG. 6 is a schematic view of the structure of a substrate after printing ink according to the present invention.
Fig. 7 is a schematic view of a substrate structure of the present invention after mounting LED chips and components.
FIG. 8 is a schematic view of the structure of the substrate after bonding wires according to the present invention.
Referring to fig. 1 to 8, wherein 1 is a copper substrate, 2 is an LED boss, 3 is polypropylene, 4 is copper foil, 5 is a hole, 6 is a mechanism hole, 7 is a wire line, 8 is an ink layer, 9 is a component, 10 is an LED chip, and 11 is a bond alloy wire.
Detailed Description
Embodiment one:
as shown in fig. 2, the copper base material layer 1 is used as a main material for LED heat conduction, and a resist ink is attached to the surface of the copper base material layer, and the LED boss 2 to be welded with the LED position is manufactured by matching an image transfer mode with a chemical etching mode. Meanwhile, as shown in fig. 3, punching or laser cutting is respectively performed on the polypropylene layer 3 and the copper foil layer 4 to punch out the position corresponding to the 'LED boss 2' to form hollowed-out parts. Then as shown in fig. 4, the copper base material layer 1, the polypropylene layer 3 and the copper foil layer 4 are combined in sequence, and then the three are combined into a whole in a heating and pressurizing mode, and the combined product uses the middle polypropylene layer 3 as an insulating layer to separate the position of the LED boss from the copper foil layer 4 of the surface circuit, so that a structure with direct independent heat dissipation and wire circuit separation is realized. As shown in fig. 5, a resist ink is attached to the surface of the copper foil layer 4, and a chemical etching method is used in combination with an image transfer method to produce a wiring line 7. As shown in fig. 6, the positions on the copper foil layer 4 where soldering is not required are printed with ink, and the soldering positions are fixed, so that other defects caused by tin connection in the soldering process are avoided, and the substrate layer is protected. Finally, the mechanism holes and the appearance are manufactured in sequence in a punching or CNC mode, and meanwhile surface treatment is carried out to avoid the influence of oxidation on welding caused by exposure of the welding copper surface in the air, so that the welding quality is improved.
As shown in fig. 7, solder paste is printed on the ink layer 8, the components 8 and the LED chip 9 are accurately placed on the printed solder paste by means of optical pointing, and the printed solder paste is melted by means of high-temperature vacuum reflow, so that the placed components 8 and LED chip 9 are firmly bonded with the substrate.
As shown in fig. 8, the positive and negative electrodes of the copper-based circuit board are connected with the corresponding electrodes of the LED chip by bonding wires, so that the chip and the copper-based circuit board are electrically connected. And finally, sequentially carrying out dot fluorescent powder, glue filling/plastic packaging and curing on the manufactured substrate, and carrying out test grading to finally form the structure shown in figure 1.
When the LED lamp is used, the service life of an LED product can be effectively prolonged; the heat generated in the use process of the LED is effectively and timely LED out, and the overall temperature of the module is reduced; the quality of the LED module products is improved; the ceramic substrate support in the traditional process is reduced, so that the overall production cost is effectively reduced.
Claims (6)
1. An LED module for automobile front headlight, includes copper substrate layer, polypropylene layer, copper foil layer, LED chip and components and parts, its characterized in that: the utility model discloses a LED (light emitting diode) device, including copper base plate layer (1), polypropylene layer (3) and copper foil layer (4) are equipped with in proper order from supreme down in top of copper base plate layer (1), one side on copper base plate layer (1) length direction is equipped with LED boss (2), the top of LED boss (2) is followed supreme in proper order down and is run through polypropylene layer (3) and copper foil layer (4) and expose outside copper foil layer (4), offer hole (5) in LED boss (2) along with shape on copper foil (4), the upper surface of copper foil layer (4) is equipped with wire circuit (7), is equipped with a plurality of components and parts (10) and two LED chips (9) on copper foil layer (4) that are located outside wire circuit (7), two LED chips (9) set up the top of LED boss (2), component (10) are in one side of keeping away from on copper foil layer (4) LED boss (2), wire circuit (7) are in between LED chips (9) and component (10), component (10) and LED chip (9) are connected in a mode of two copper foil circuit (7) through two copper foil circuit (7) lead wire circuit (11) respectively, one piece of positive and negative electrode chip (11) lead wire electrode pad (11) respectively The copper foil layer (4) outside the LED chip (9) and the lead wire circuit (7) is coated with an ink layer (8).
2. An LED module for an automotive headlamp as set forth in claim 1, wherein: a plurality of structure holes (6) are formed in the copper substrate layer (1), and the structure holes (6) sequentially penetrate through the polypropylene layer (3), the copper foil layer (4) and the printing ink layer (8) from bottom to top.
3. An LED module for an automotive headlamp as set forth in claim 1, wherein: the LED chip (9) and the wire line (7) form circuit connection.
4. A process for manufacturing an LED module for automotive headlights according to claim 1, characterized by comprising the steps of:
1) Step 1, manufacturing a copper substrate, namely cutting a copper foil from a position corresponding to an LED boss of the copper substrate on the copper foil to form a hollowed-out shape, and then combining the copper substrate, polypropylene and the copper foil to form a whole;
2) Step 2, manufacturing a wire circuit, namely attaching anti-corrosion ink to the surface of the substrate after the step 1, and manufacturing the wire circuit by matching an image transfer mode with a chemical etching mode;
3) Step 3, printing solder resist ink, namely printing ink on the position, which is not required to be welded, on the substrate subjected to the step 2, so as to avoid welding;
4) Step 4, forming, namely processing needed mechanism holes and shapes on the substrate which is finished in the step 3 in a punching or CNC mode;
5) Step 5, surface treatment, namely performing surface treatment on the substrate after the step 4 is completed;
6) Step 6, printing solder paste, and printing the solder paste on the surface of the substrate after the step 5 is completed;
7) Step 7, welding the components and the chips, and accurately placing the components and the LED chips on the solder paste layer in an optical point finding mode;
8) Step 8, solidifying, namely melting the solder paste layer on the substrate which is finished in the step 7 in a high-temperature vacuum reflow mode, so that the surface-assembled components and the LED chip are firmly bonded with the module;
9) Step 9, bonding wires are used for connecting the anode and the cathode of the substrate which completes the step 8 with the corresponding electrodes of the LED chip in a bonding wire mode, so that the LED chip is connected with the module forming circuit;
10 Step 10, spot fluorescent powder; the substrate dimming parameters and the color temperature color rendering indexes after the step 9 are finished;
11 Step 11, glue filling and plastic packaging are carried out, and the LED chip luminous area and components of the substrate which are subjected to the step 10 are subjected to plastic packaging;
12 Step 12, integrally curing, namely completely curing the plastic package part of the substrate after the step 11 is completed;
13 Step 13, testing and grading, and sorting the packaged products through an optical instrument.
5. The process for manufacturing an LED module for an automotive headlamp of claim 4, wherein: the copper foil cut in the step 1 may be one of die cutting and laser cutting.
6. The process for manufacturing an LED module for an automotive headlamp of claim 4, wherein: in the step 2, the copper substrate, the polypropylene and the copper foil are combined and integrated by adopting a heating and pressurizing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710229303.4A CN107068844B (en) | 2017-04-10 | 2017-04-10 | LED module for automobile front headlight and preparation process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710229303.4A CN107068844B (en) | 2017-04-10 | 2017-04-10 | LED module for automobile front headlight and preparation process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107068844A CN107068844A (en) | 2017-08-18 |
| CN107068844B true CN107068844B (en) | 2024-01-30 |
Family
ID=59601814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710229303.4A Active CN107068844B (en) | 2017-04-10 | 2017-04-10 | LED module for automobile front headlight and preparation process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107068844B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN215935154U (en) * | 2021-07-27 | 2022-03-01 | 深圳Tcl数字技术有限公司 | Circuit board and LED backlight board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002289923A (en) * | 2001-03-28 | 2002-10-04 | Toyoda Gosei Co Ltd | Light-emitting diode and its manufacturing method |
| JP2009158506A (en) * | 2007-12-25 | 2009-07-16 | Panasonic Electric Works Co Ltd | Light-emitting device |
| CN103672810A (en) * | 2013-12-04 | 2014-03-26 | 浙江欧珑电气有限公司 | LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator |
| JP2014120529A (en) * | 2012-12-13 | 2014-06-30 | Denki Kagaku Kogyo Kk | Circuit board, led module and led package, and method of manufacturing circuit board |
| CN105304390A (en) * | 2015-11-04 | 2016-02-03 | 昆山兴协和光电科技有限公司 | LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip |
| CN206820023U (en) * | 2017-04-10 | 2017-12-29 | 上海温良昌平电器科技股份有限公司 | A kind of LED module for automobile front |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8288792B2 (en) * | 2008-03-25 | 2012-10-16 | Bridge Semiconductor Corporation | Semiconductor chip assembly with post/base/post heat spreader |
-
2017
- 2017-04-10 CN CN201710229303.4A patent/CN107068844B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002289923A (en) * | 2001-03-28 | 2002-10-04 | Toyoda Gosei Co Ltd | Light-emitting diode and its manufacturing method |
| JP2009158506A (en) * | 2007-12-25 | 2009-07-16 | Panasonic Electric Works Co Ltd | Light-emitting device |
| JP2014120529A (en) * | 2012-12-13 | 2014-06-30 | Denki Kagaku Kogyo Kk | Circuit board, led module and led package, and method of manufacturing circuit board |
| CN103672810A (en) * | 2013-12-04 | 2014-03-26 | 浙江欧珑电气有限公司 | LED (light-emitting diode)-PCB (printed circuit board) combined double-faced conductive radiator |
| CN105304390A (en) * | 2015-11-04 | 2016-02-03 | 昆山兴协和光电科技有限公司 | LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip |
| CN206820023U (en) * | 2017-04-10 | 2017-12-29 | 上海温良昌平电器科技股份有限公司 | A kind of LED module for automobile front |
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| Publication number | Publication date |
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| CN107068844A (en) | 2017-08-18 |
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