CN105304390A - LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip - Google Patents
LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip Download PDFInfo
- Publication number
- CN105304390A CN105304390A CN201510740924.XA CN201510740924A CN105304390A CN 105304390 A CN105304390 A CN 105304390A CN 201510740924 A CN201510740924 A CN 201510740924A CN 105304390 A CN105304390 A CN 105304390A
- Authority
- CN
- China
- Prior art keywords
- led
- layer
- silver slurry
- backlight module
- led panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/83—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard characterised by legends, e.g. Braille, liquid crystal displays, light emitting or optical elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2231/00—Applications
- H01H2231/002—Calculator, computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED strip, a manufacturing method of the LED strip, as well as a backlight module and keyboard using the LED strip. The LED strip comprises a base material layer, an electroconductive layer, a line film coating layer and a gum layer, wherein the front side of the base material layer is connected with the back side of the electroconductive layer, the electroconductive layer is a silver paste line layer made in a brushing way, the front side of the electroconductive layer comprises a non-welding region and multiple welding regions, each welding region is provided with LED silver paste welding points raised out of the electroconductive layer, LED lights are welded on the LED silver paste welding points, the non-welding region is connected to the back side of the line film coating layer, and the front side of the line film coating layer is connected with the gum layer. Compared with the prior art, the LED strip provided by the invention has the advantages that since the electroconductive layer is made of silver paste and is provided with the raised LED silver paste welding points, impedance of a loop where the LED lights are located can be improved without series connection with a protective resistor, less elements are used, the manufacturing cost is low, manufacturing process steps are reduced, and the product percent of pass can be improved.
Description
Technical field
The present invention relates to a kind of LED panel for backlight module and preparation method thereof, apply its backlight module and keyboard.
Background technology
Existing computor-keyboard is typically provided with backlight module, backlight module comprises anti-dazzling screen, light guide plate, reflector plate and backlight, backlight adopts LED panel usually, LED panel comprises substrate layer, conductive layer and welding LED on the electrically conductive, conductive layer due to existing LED panel adopts fine copper to make, and LED is directly welded on the electrically conductive, resistance is less, be burned to prevent LED, weld again on the electrically conductive after needing each LED to be connected in series with protective resistance, therefore existing LED panel is not only welded with LED, also be welded with protective resistance, electronic devices and components quantity is more, complex procedures, manufacturing cost is high, product fraction defective is high.
Therefore, be necessary to provide a kind of new LED panel to solve the problems referred to above.
Summary of the invention
The object of the present invention is to provide a kind of low cost of manufacture, operation simply for backlight module LED panel and preparation method thereof, apply its backlight module and keyboard.
To achieve these goals, the technical solution adopted in the present invention is as follows:
A kind of LED panel for backlight module, comprise substrate layer, conductive layer, circuit coating layer and gum layer, the front of described substrate layer is connected with the reverse side of described conductive layer, described conductive layer is the silver slurry line layer of printing, the front of described conductive layer comprises non-solder region and some welding regions, welding region described in each is provided with the LED silver slurry pad protruding described conductive layer, described LED silver slurry pad welds LED, described non-solder region is connected with the reverse side of described circuit coating layer, the front of described circuit coating layer is connected with described gum layer.
Preferably, described substrate layer adopts PETG to make, and the thickness of described substrate layer is 0.075mm.
Preferably, described circuit coating layer and described gum layer all do not have conductivity.
Preferably, be provided with two described LED silver slurry pads in welding region described in each, in welding region described in each, a welding LED, has certain interval between described LED and described conductive layer.
Preferably, all described LED arranged in parallel, and being centrally located on same straight line of all described LED.
Preferably, all described LED are connected in parallel, and the impedance of LED place circuit loop described in each is 25-35 Ω.
The present invention also provides the manufacture method of LED panel described in more than one, comprises the following steps:
A) provide described substrate layer, adopt low resistance silver slurry, form described silver slurry line layer by steel wire half tone in the printing of the front of described substrate layer, the thickness of described silver slurry line layer is 8-10 μm;
B) on the non-solder region of described silver slurry line layer, described circuit coating layer is covered;
C) ATE test is carried out to described silver slurry line layer;
D) adopt 3D to spray silver-colored machine to be sprayed on by low resistance silver slurry and described welding region to be formed described LED silver slurry pad, the diameter of described LED silver slurry pad is 0.4-0.6mm;
E) surface mounting technology is adopted LED to be welded on described LED silver slurry pad;
F) adopt 3D glue sprayer liquid ultraviolet cured adhesive to be sprayed on the edge of described LED, then carry out Ultraviolet radiation and make liquid ultraviolet light polymerization adhesive curing, the position of fixing described LED, form LED panel elementary semi-finished products;
G) outline die is carried out to described LED panel elementary semi-finished products and structure hole die-cut, form LED panel secondary semi-finished product.
H) the secondary semi-finished product of described LED panel are tested and FQC visual examination, test and check and all qualified become final LED panel finished product.
The present invention also provides a kind of backlight module adopting described LED panel to make, it comprises described LED panel, described backlight module also comprises anti-dazzling screen, laser engraving light guide plate and reflector plate, and described anti-dazzling screen, described laser engraving light guide plate, described reflector plate and described LED panel are fitted assembling successively.
The present invention also provides a kind of keyboard adopting described manufacturing backlight module, and described keyboard comprises described backlight module.
Compared with prior art; the beneficial effect that the present invention is used for the LED panel of backlight module is: described LED panel adopts silver slurry to make conductive layer and arranges the LED silver slurry pad of protrusion; the impedance in loop, LED place can be improved; do not need protective resistance of connecting; components and parts are less; low cost of manufacture, decreases production process, improves conforming product rate.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED panel one of the present invention preferred embodiment;
Fig. 2 is the radial cross-section of LED panel of the present invention.
In figure, each mark is as follows: 1, substrate layer; 2, conductive layer; 3, circuit coating layer; 4, gum layer; 5, LED silver slurry pad; 6, LED.
Embodiment
Below in conjunction with specific embodiment, the present invention is described further.
Refer to shown in Fig. 1 and Fig. 2, the invention provides a kind of LED panel for backlight module, comprise substrate layer 1, conductive layer 2, circuit coating layer 3 and gum layer 4, the front of described substrate layer 1 is connected with the reverse side of described conductive layer 2, described conductive layer 2 is the silver slurry line layer of printing, the front of described conductive layer 2 comprises non-solder region and some welding regions, welding region described in each is provided with the LED silver slurry pad 5 protruding described conductive layer 2, described LED silver slurry pad 5 welds LED 6, described non-solder region is connected with the reverse side of described circuit coating layer 3, the front of described circuit coating layer 3 is connected with described gum layer 4.
In the present invention, described substrate layer 1 adopts PETG (being called for short PET) to make, the thickness of described substrate layer 1 is 0.075mm, described circuit coating layer 3 and described gum layer 4 all do not have conductivity, described circuit coating layer 3 plays a part to cover and insulation simultaneously, prevents that conductive layer 2 is exposed directly or indirectly to be contacted with other circuit.
In the present embodiment, be provided with a welding LED 6 between two described LED silver slurry pad 5, two described LED silver slurry pads 5 in welding region described in each, described LED 6 and described silver are starched between line layer certain interval.In the present embodiment; the thickness of described silver slurry line layer is 8-10 μm; the diameter of described LED silver slurry pad 5 is 0.4-0.6mm; because described LED silver slurry pad 5 protrudes described silver slurry line layer; the conductive area of LED silver slurry pad 5 is less, and according to formula resistance=resistivity * length/conductive area, the resistance of LED silver slurry pad 5 is larger; therefore do not need to arrange protective resistance, directly LED 6 is welded on LED silver slurry pad 5 and LED 6 also can be prevented to be burned.
In addition, all described LED 6 arranged in parallel, and all described LED 6 be centrally located on same straight line, described in each, the impedance of LED 6 place circuit loop is 25-35 Ω, when embody rule, the size of described impedance can be starched the length width of each circuit on the thickness of line layer, silver slurry line layer and the thickness of LED silver slurry pad 5 and diameter and be set by adjusting silver.Damage rear other LED 6 that affects to prevent a LED lamp 6 to use, all described LED 6 are connected in parallel.
The present invention also provides a kind of manufacture method of described LED panel, comprises the following steps:
A) provide described substrate layer 1, adopt low resistance silver slurry, form described silver slurry line layer by steel wire half tone in the printing of the front of described substrate layer 1,
B) on the non-solder region of described silver slurry line layer, described circuit coating layer 3 is covered;
C) ATE test is carried out to described silver slurry line layer;
D) adopt 3D to spray silver-colored machine low resistance silver slurry is sprayed on described welding region is formed described LED silver slurry pad 5;
E) surface mounting technology is adopted LED 6 to be welded on described LED silver slurry pad 5;
F) adopt 3D glue sprayer liquid ultraviolet cured adhesive to be sprayed on the edge of described LED 6, then carry out Ultraviolet radiation and make liquid ultraviolet light polymerization adhesive curing, the position of fixing described LED 6, form LED panel elementary semi-finished products;
G) outline die is carried out to described LED panel elementary semi-finished products and structure hole die-cut, form LED panel secondary semi-finished product.
H) the secondary semi-finished product of described LED panel are tested and FQC (processing procedure finished goods is checked and verified) visual examination, test and check and all qualified become final LED panel finished product.
Wherein, steps d) described in 3D spray silver-colored machine and step f) described in 3D glue sprayer be flush coater, step h) described in test comprise that Tail (outlet tail) bends test, the test of LED place resist bending, hot and humid test, high/low temperature loop test and LED thrust are tested, the various different concrete testing procedure tested is as follows:
1.Tail bends test: the part between the two adjacent LEDs lamp 6 of LED panel is first bent 180 °, bending place is pushed down again with 2.5kg counterweight, counterweight is removed after 60 seconds, measure the impedance in loop, corresponding LED 6 place, if carry out the impedance after this test relatively carry out this test before impedance rate of change be less than 150%, test passes.
2.LED place resist bending test: use universal instrument LED 6 to be lighted, confirm that detected LED 6 is luminous normal, the pole that diameter is more than or equal to 15mm is placed again at the back side of this LED 6, this LED 6 region is rotated 10 times around pole, then take off, re-use universal instrument lightening LED lamp 6, if LED 6 can normally be lighted, test passes.
3. hot and humid test: LED panel being placed on temperature is 70 DEG C, humidity is in the environment of 90%RH, to it for 5V direct current, whether after lasting 96 hours, whether adopt ring to survey machine testing LED panel material smooth without buckling phenomenon, detecting LED panel has short circuit and open circuit conditions, whether detect supply power voltage is normally 5V simultaneously, whether LED 6 glow color is normal white, if the smooth nothing of material is bending, without short interruption, voltage 5V and glow color is white, then test passes.
4. high/low temperature loop test: LED panel is placed on temperature and is-40-70 DEG C, humidity is in the environment of 0-90%RH, to it for 5V direct current, last 96 hours, temperature and humidity in 96 hours in environment residing for LED panel changes in above-mentioned scope, whether 96 as a child utilized ring survey machine testing LED panel material smooth without buckling phenomenon, detect LED panel and whether have short circuit and open circuit conditions, whether detect supply power voltage is normally 5V simultaneously, whether LED 6 glow color is normal white, if the smooth nothing of material bends, without short interruption, voltage 5V and glow color are white, then test passes.
5.LED thrust is tested: use universal instrument LED 6 to be lighted, confirm that detected LED 6 is luminous normal, push away the surrounding of LED 6 respectively with the power of 2.5KG with thrust meter, kept for 5 seconds, remove thrust meter, re-use universal instrument lightening LED lamp 6, if the surrounding of LED 6 do not split and LED 6 still normally to light glow color without exception, then test passes.
The present invention also provides a kind of backlight module adopting described LED panel to make, it comprises described LED panel, described backlight module also comprises anti-dazzling screen, laser engraving light guide plate and reflector plate, and described anti-dazzling screen, described laser engraving light guide plate, described reflector plate and described LED panel are fitted successively to assemble and formed described backlight module.
Wherein, the making step of described anti-dazzling screen comprises: cut the former material of anti-dazzling screen, then prints light screening material and glue, forms anti-dazzling screen finished product after shape is rushed in baking.The making step of described laser engraving light guide plate comprises: roll extrusion light guiding points on the former material of light guide plate, forms light guide plate finished product after rushing shape.The making step of described reflector plate comprises: cut rear printing glue to the former material of reflector plate, and baking backlash shape, forms reflector plate finished product.
The present invention also provides a kind of keyboard adopting described manufacturing backlight module, and described keyboard comprises described backlight module.
When embody rule, the thickness of substrate layer 1 of the present invention can the parameter such as intensity needed for LED panel adjust, the impedance of described LED 6 place circuit loop can reset according to parameters such as the supply power voltages of the power of LED 6 and its place circuit loop, and the thickness of described silver slurry line layer and the diameter of described LED silver slurry pad 5 can do corresponding change according to the resistance value of described LED 6 place circuit loop setting.
In sum; the LED panel that the present invention is used for backlight module adopts silver slurry to make conductive layer 2 and arranges the LED silver slurry pad 5 of protrusion; the impedance in loop, LED 6 place can be improved; do not need protective resistance of connecting; components and parts are less; low cost of manufacture, decreases production process, improves conforming product rate.
Schematically above be described the present invention and execution mode thereof, this description does not have restricted, and also just one of the embodiments of the present invention shown in accompanying drawing, actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, designing the frame mode similar to this technical scheme and embodiment without creationary, all should protection scope of the present invention be belonged to.
Claims (9)
1. the LED panel for backlight module, it is characterized in that, comprise substrate layer, conductive layer, circuit coating layer and gum layer, the front of described substrate layer is connected with the reverse side of described conductive layer, described conductive layer is the silver slurry line layer of printing, the front of described conductive layer comprises non-solder region and some welding regions, welding region described in each is provided with the LED silver slurry pad protruding described conductive layer, described LED silver slurry pad welds LED, described non-solder region is connected with the reverse side of described circuit coating layer, the front of described circuit coating layer is connected with described gum layer.
2. as claimed in claim 1 for the LED panel of backlight module, it is characterized in that, described substrate layer adopts PETG to make, and the thickness of described substrate layer is 0.075mm.
3., as claimed in claim 1 for the LED panel of backlight module, it is characterized in that, described circuit coating layer and described gum layer all do not have conductivity.
4. as claimed in claim 1 for the LED panel of backlight module, it is characterized in that, be provided with two described LED silver slurry pads in welding region described in each, in welding region described in each, a welding LED, has certain interval between described LED and described conductive layer.
5., as claimed in claim 1 for the LED panel of backlight module, it is characterized in that, all described LED arranged in parallel, and being centrally located on same straight line of all described LED.
6., as claimed in claim 1 for the LED panel of backlight module, it is characterized in that, all described LED are connected in parallel, and the impedance of LED place circuit loop described in each is 25-35 Ω.
7. a manufacture method for LED panel as described in as arbitrary in claim 1 to 6, is characterized in that, comprise the following steps:
A) provide described substrate layer, adopt low resistance silver slurry, form described silver slurry line layer by steel wire half tone in the printing of the front of described substrate layer, the thickness of described silver slurry line layer is 8-10 μm;
B) on the non-solder region of described silver slurry line layer, described circuit coating layer is covered;
C) ATE test is carried out to described silver slurry line layer;
D) adopt 3D to spray silver-colored machine to be sprayed on by low resistance silver slurry and described welding region to be formed described LED silver slurry pad, the diameter of described LED silver slurry pad is 0.4-0.6mm;
E) surface mounting technology is adopted LED to be welded on described LED silver slurry pad;
F) adopt 3D glue sprayer liquid ultraviolet cured adhesive to be sprayed on the edge of described LED, then carry out Ultraviolet radiation and make liquid ultraviolet light polymerization adhesive curing, the position of fixing described LED, form LED panel elementary semi-finished products;
G) outline die is carried out to described LED panel elementary semi-finished products and structure hole die-cut, form LED panel secondary semi-finished product.
H) the secondary semi-finished product of described LED panel are tested and FQC visual examination, test and check and all qualified become final LED panel finished product.
8. one kind adopts the backlight module of described LED panel making as arbitrary in claim 1 to 6, it is characterized in that, comprise described LED panel, described backlight module also comprises anti-dazzling screen, laser engraving light guide plate and reflector plate, and described anti-dazzling screen, described laser engraving light guide plate, described reflector plate and described LED panel are fitted assembling successively.
9. adopt a keyboard for manufacturing backlight module as claimed in claim 8, it is characterized in that, described keyboard comprises described backlight module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510740924.XA CN105304390B (en) | 2015-11-04 | 2015-11-04 | LED panels and preparation method thereof, backlight module and keyboard using it |
| PCT/CN2015/097548 WO2017075864A1 (en) | 2015-11-04 | 2015-12-16 | Led decorative strip, manufacturing method thereof, and backlight module and keyboard using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510740924.XA CN105304390B (en) | 2015-11-04 | 2015-11-04 | LED panels and preparation method thereof, backlight module and keyboard using it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105304390A true CN105304390A (en) | 2016-02-03 |
| CN105304390B CN105304390B (en) | 2018-02-02 |
Family
ID=55201505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510740924.XA Expired - Fee Related CN105304390B (en) | 2015-11-04 | 2015-11-04 | LED panels and preparation method thereof, backlight module and keyboard using it |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105304390B (en) |
| WO (1) | WO2017075864A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068844A (en) * | 2017-04-10 | 2017-08-18 | 上海温良昌平电器科技股份有限公司 | A kind of LED modules and its preparation technology for automobile front |
| CN107124816A (en) * | 2017-04-10 | 2017-09-01 | 上海温良昌平电器科技股份有限公司 | The straight-through radiating copper base of one kind and its preparation technology |
| CN107132608A (en) * | 2017-05-31 | 2017-09-05 | 深圳市汇创达科技股份有限公司 | A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie |
| CN107144913A (en) * | 2017-05-31 | 2017-09-08 | 深圳市汇创达科技股份有限公司 | A kind of processing method of split type guide-lighting module counterdie, guide-lighting module and counterdie |
| CN109855063A (en) * | 2019-03-11 | 2019-06-07 | 河南博美通电子科技有限公司 | A kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste |
| CN109890133A (en) * | 2019-03-11 | 2019-06-14 | 河南博美通电子科技有限公司 | A kind of flexible circuit board structure and preparation process based on conductive paste |
| CN110831342A (en) * | 2019-11-15 | 2020-02-21 | 上海摩软通讯技术有限公司 | Preparation method of miniLED backlight module |
| WO2021217418A1 (en) * | 2020-04-28 | 2021-11-04 | 南昌欧菲显示科技有限公司 | Light-emitting module and ar glasses |
| CN113840470A (en) * | 2020-06-24 | 2021-12-24 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324571A (en) * | 2005-05-20 | 2006-11-30 | Fujikura Ltd | Wiring board and its manufacturing method |
| CN102802362A (en) * | 2011-05-25 | 2012-11-28 | 何忠亮 | Production process of composite circuit board and novel composite circuit board |
| CN104284514A (en) * | 2013-07-09 | 2015-01-14 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
| CN205194592U (en) * | 2015-11-04 | 2016-04-27 | 昆山兴协和光电科技有限公司 | LED trim, use its backlight unit and keyboard |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7128442B2 (en) * | 2003-05-09 | 2006-10-31 | Kian Shin Lee | Illumination unit with a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant |
| EP1947693B1 (en) * | 2007-01-18 | 2015-03-25 | Polytron Technologies, Inc. | Plane structure of light-emitting diode lighting apparatus |
| CN101365302A (en) * | 2007-08-08 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Flexible film circuit board pasting method |
| CN202697035U (en) * | 2012-08-01 | 2013-01-23 | 田茂福 | LED circuit board with conducting adhesive lines, and LED lamp band |
| CN203839257U (en) * | 2014-04-09 | 2014-09-17 | 群光电能科技股份有限公司 | Flexible circuit board applied to keyboard backlight module |
| CN104134564A (en) * | 2014-08-06 | 2014-11-05 | 昆山兴协和光电科技有限公司 | Notebook computer keyboard lamp bar and manufacturing method thereof |
| CN204227209U (en) * | 2014-11-12 | 2015-03-25 | 联想(北京)有限公司 | Light module and electronic equipment |
-
2015
- 2015-11-04 CN CN201510740924.XA patent/CN105304390B/en not_active Expired - Fee Related
- 2015-12-16 WO PCT/CN2015/097548 patent/WO2017075864A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006324571A (en) * | 2005-05-20 | 2006-11-30 | Fujikura Ltd | Wiring board and its manufacturing method |
| CN102802362A (en) * | 2011-05-25 | 2012-11-28 | 何忠亮 | Production process of composite circuit board and novel composite circuit board |
| CN104284514A (en) * | 2013-07-09 | 2015-01-14 | 三星电机株式会社 | Printed circuit board and method of manufacturing the same |
| CN205194592U (en) * | 2015-11-04 | 2016-04-27 | 昆山兴协和光电科技有限公司 | LED trim, use its backlight unit and keyboard |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068844A (en) * | 2017-04-10 | 2017-08-18 | 上海温良昌平电器科技股份有限公司 | A kind of LED modules and its preparation technology for automobile front |
| CN107124816A (en) * | 2017-04-10 | 2017-09-01 | 上海温良昌平电器科技股份有限公司 | The straight-through radiating copper base of one kind and its preparation technology |
| CN107068844B (en) * | 2017-04-10 | 2024-01-30 | 上海温良昌平电器科技股份有限公司 | LED module for automobile front headlight and preparation process thereof |
| CN107132608A (en) * | 2017-05-31 | 2017-09-05 | 深圳市汇创达科技股份有限公司 | A kind of processing method of integrated guide optical mode group counterdie, guide-lighting module and counterdie |
| CN107144913A (en) * | 2017-05-31 | 2017-09-08 | 深圳市汇创达科技股份有限公司 | A kind of processing method of split type guide-lighting module counterdie, guide-lighting module and counterdie |
| CN109855063A (en) * | 2019-03-11 | 2019-06-07 | 河南博美通电子科技有限公司 | A kind of non-resistance flexible light band circuit structure and preparation process based on conductive paste |
| CN109890133A (en) * | 2019-03-11 | 2019-06-14 | 河南博美通电子科技有限公司 | A kind of flexible circuit board structure and preparation process based on conductive paste |
| CN110831342A (en) * | 2019-11-15 | 2020-02-21 | 上海摩软通讯技术有限公司 | Preparation method of miniLED backlight module |
| WO2021217418A1 (en) * | 2020-04-28 | 2021-11-04 | 南昌欧菲显示科技有限公司 | Light-emitting module and ar glasses |
| CN113840470A (en) * | 2020-06-24 | 2021-12-24 | 庆鼎精密电子（淮安）有限公司 | Circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105304390B (en) | 2018-02-02 |
| WO2017075864A1 (en) | 2017-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105304390A (en) | LED strip, manufacturing method of LED strip as well as backlight module and keyboard using LED strip | |
| CN103377782B (en) | Resistance device | |
| JPH11191577A (en) | Tape carrier, semiconductor assembly and semiconductor device, and manufacturing method therefor and electronic equipment | |
| CN103152977A (en) | Integrated circuit board and production method thereof | |
| CN205194592U (en) | LED trim, use its backlight unit and keyboard | |
| CN109109481B (en) | Printing method of solder paste | |
| CN101271238A (en) | Method for confirming conductive adhesive coating condition using substrates with examination mark and substrates thereof | |
| CN212752725U (en) | Short circuit prevention circuit board | |
| CN206164830U (en) | Loudspeaker module group | |
| CN102076181A (en) | Manufacturing method of graded golden finger | |
| JPS58172561A (en) | Inspection of printed circuit board and checker jig | |
| CN110390890A (en) | The production method of lamp bar and lamp bar | |
| US10524359B2 (en) | Method and system for manufacturing a workpiece using a polymer layer | |
| CN105530753A (en) | PCB manufacturing method and PCB | |
| CN114793391B (en) | PCB packaging error solution method | |
| KR101237483B1 (en) | Method for manufacturing a printed circuit board | |
| US11678434B2 (en) | Method and circuit for controlling quality of metallization of a multilayer printed circuit board | |
| CN205611042U (en) | Table pastes device and printed circuit board | |
| CN115696765A (en) | Manufacturing method for improving precision and pull-off strength of PCB bonding pad | |
| KR101957636B1 (en) | Electronic component module manufacturing apparatus | |
| JP2009194129A (en) | Thin film chip resistor manufacturing method | |
| TWI233999B (en) | Testing jig for connector socket of electronic component | |
| JP5282873B2 (en) | A pair of probes for substrate inspection and a jig for substrate inspection | |
| JP2009014561A (en) | Simple strain measuring tool and inspection device | |
| KR20110075668A (en) | 3 electrode structure for measuring contact resistance of anisotropic conductive film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180202 Termination date: 20191104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |