CN109109481B - Printing method of solder paste - Google Patents
Printing method of solder paste Download PDFInfo
- Publication number
- CN109109481B CN109109481B CN201810871869.1A CN201810871869A CN109109481B CN 109109481 B CN109109481 B CN 109109481B CN 201810871869 A CN201810871869 A CN 201810871869A CN 109109481 B CN109109481 B CN 109109481B
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- Prior art keywords
- pad area
- solder paste
- solder
- steel mesh
- printing
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 126
- 238000007639 printing Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 35
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 67
- 239000010959 steel Substances 0.000 claims abstract description 67
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000004132 cross linking Methods 0.000 claims description 2
- 230000005284 excitation Effects 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 240000005561 Musa balbisiana Species 0.000 description 1
- 235000018290 Musa x paradisiaca Nutrition 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
Abstract
The invention provides a printing method of solder paste, and the preparation method specifically comprises the steps of providing a printed circuit board, wherein the upper surface of the printed circuit board is provided with a first pad area, a second pad area and a non-pad area, and the thickness of the solder paste required by the first pad area is larger than that of the second pad area; preparing a first solder mask layer on the non-pad area; preparing a second solder mask layer on the first solder mask layer; removing the second solder mask layer around the second pad region to form a first printed region; covering a steel mesh; coating solder paste on the steel mesh, moving a scraper on the steel mesh, deforming and sinking when passing through the first printing area and attaching to the first solder mask layer, coating the solder paste on the first pad area and the second pad area after passing through the steel mesh by pressing the scraper, and sinking the periphery of the second pad area and the second pad area downwards to ensure that the thickness of the solder paste covering the second pad area is smaller than that of the solder paste covering the first pad area; and taking down the steel mesh, and finally preparing the solder paste with different thicknesses on the same printed circuit board.
Description
Technical Field
The invention relates to a printed circuit board assembly process, in particular to a printing method of solder paste.
Background
In the process of manufacturing electronic products, various components need to be soldered to a printed circuit board by using a Surface Mount Technology (SMT), and a commonly used surface mount process flow is as follows: the method comprises the steps of firstly coating solder paste on one surface of a printed circuit board, on which components need to be mounted, on the part, on which the components need to be mounted, of the printed circuit board, then mounting the components needing to be welded on the corresponding position of the printed circuit board, carrying out reflow soldering after the mounting of the components is completed, completing the mounting of the components on one surface of the printed circuit board, and completing the surface mounting after the inspection is qualified.
The steel mesh is a special die for surface mounting technology, and the main function of the steel mesh is to help the deposition of solder paste, so that an accurate amount of solder paste is transferred to the position of a corresponding bonding pad on a printed circuit board. Because different components and parts welding is different to the demand of tin cream thickness, can use the ladder steel mesh in the process of tin cream printing usually, the thickness of the different regional steel sheets on the ladder steel mesh is different, so the thickness of tin cream is also different on the pad at last.
But the manufacturing process of the step steel mesh is complex and the cost is high; the printing effect is not good, and if the area of the thin area of the stepped steel mesh is too small, the area is easy to have the phenomenon of residual solder paste.
Disclosure of Invention
The invention aims to provide a solder paste printing method which is low in cost and has a good printing effect.
In order to solve the technical problems, the invention adopts the following technical scheme: a printing method of solder paste for printing solder paste in a printed circuit board assembly process, comprising the steps of:
(1) providing a printed circuit board, wherein the upper surface of the printed circuit board is provided with a first pad area, a second pad area and a non-pad area, and the thickness of the printed solder paste required by the first pad area is larger than that of the second pad area;
(2) preparing a first solder mask layer on the non-pad area;
(3) preparing a second solder mask layer on the first solder mask layer;
(4) removing the second solder mask layer around the second pad region to form a first printed region;
(5) covering a layer of steel mesh on the second solder mask layer;
(6) coating solder paste on the steel mesh, moving the steel mesh by using a scraper, wherein the steel mesh deforms and sinks and clings to the first solder mask when the scraper passes through the first printing area, pressing the scraper to enable the solder paste on the steel mesh to pass through the steel mesh and be coated on the first pad area and the second pad area, and the peripheries of the second pad area and the second pad area are sunken downwards, so that the thickness of the solder paste covering the second pad area is smaller than that of the solder paste covering the first pad area;
(7) and removing the steel mesh.
According to the design concept of the invention, the steel mesh further comprises a body and a positioning frame arranged outside the body, and the steel mesh is positioned through the positioning frame.
According to the design concept of the present invention, in step S5, the steel net includes a first printing hole and a second printing hole penetrating through the body, and the first printing hole and the second printing hole correspond to the first pad region and the second pad region in position and size.
According to the design concept of the present invention, in step S2, the first solder mask layer and the second solder mask layer in step S3 are prepared by crosslinking liquid solder mask oil into a solid state under the excitation of ultraviolet light.
According to the design concept of the invention, the solder mask oil comprises epoxy resin, a photosensitizer, a solvent, a filler and a pigment.
According to the design concept of the invention, the ultraviolet wavelength of the ultraviolet irradiation is 365nm, and the power is 5-10W.
According to the design concept of the present invention, in step S6, the angle between the scraper and the steel mesh is 45-60 °.
According to the design concept of the invention, in the step S6, the rolling diameter of the solder paste is 9-15 mm.
According to the design concept of the invention, in step S2, the thickness of the first solder resist layer is greater than 0.1 mm.
Compared with the prior art, the invention has the following beneficial effects:
according to the method for printing the solder pastes with different thicknesses on the printed circuit board, the thickness of the prepared solder paste is adjusted through the two solder resist oil layers by using the common steel mesh, and a better printing effect can be achieved without manufacturing a stepped steel mesh, so that the process cost is reduced, and the limitation of the stepped steel mesh on the layout of components is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view illustrating a process of printing solder paste on a printed circuit board according to an embodiment of the present invention;
fig. 2 to 9 are schematic structural views of solder paste printed on a printed circuit board according to an embodiment of the invention;
FIG. 10 is a schematic structural view of a conventional steel net covered on a PCB according to an embodiment of the present invention;
in the figure:
10. a printed circuit board; 20a, a first pad region; 20b, a second pad region; 20c, non-pad regions; 30. a first solder resist layer; 40. a second solder resist layer; 40a, a first printing area; 50. a steel mesh; 50a, a first printing hole; 50b, a second printing hole; 50c, a steel mesh body; 60. and (7) solder paste.
Detailed Description
In order to make the objects, technical solutions and advantageous technical effects of the present invention more clearly and completely apparent, the technical solutions in the embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a method for printing solder paste includes the following steps:
step S1: providing a printed circuit board 10, wherein the upper surface of the printed circuit board 10 has a first pad area 20a, a second pad area 20b and a non-pad area 20c, and the thickness of the solder paste required for printing of the first pad area 20a is greater than that of the second pad area 20 b;
step S2: preparing a first solder resist layer 30 on the non-pad region 20 c;
step S3: preparing a second solder resist layer 40 on the first solder resist layer 30;
step S4: removing the second solder resist layer 40 around the second pad region 20b to form a first printed region 40 a;
step S5: covering a layer of steel mesh 50 on the second solder mask layer 40;
step S6: coating solder paste 60 on the steel mesh 50, moving on the steel mesh 50 by using a scraper, wherein the steel mesh 50 deforms and sinks to be closely attached to the first solder mask layer 30 when the scraper passes through the first printing area 40a, pressing the scraper to make the solder paste 60 on the steel mesh 50 pass through the steel mesh 50 and coat on the first pad area 20a and the second pad area 20b, and the periphery of the second pad area 20b and the second pad area 20b is recessed downwards, so that the thickness of the solder paste 60 covering the periphery of the second pad area 20b and the second pad area 20b is smaller than that of the solder paste 60 covering the first pad area 20 a;
step S7: the steel net 50 is removed.
According to the method for printing the solder paste, the thickness of the prepared solder paste is adjusted by using the common steel mesh and the two solder resist oil layers, and a good printing effect can be achieved without manufacturing a stepped steel mesh, so that the process cost is reduced, and the limitation of the stepped steel mesh on the layout of components is solved.
The printing method of the solder paste will be described in detail with reference to the accompanying drawings.
Referring to fig. 2, step S1 is executed to provide a printed circuit board 10. Because the thicknesses of the solder pastes 60 required for mounting different electronic components are different, the upper surface of the printed circuit board 10 has a first pad area 20a, a second pad area 20b and a non-pad area 20c, and the thickness of the solder paste 60 required for printing the first pad area 20a is greater than that of the second pad area 20 b;
referring to fig. 3, step S2 is executed to prepare a first solder mask layer 30 on the non-pad area 20 c. (ii) a The first solder mask layer 30 is prepared from solder mask oil, the solder mask oil comprises epoxy resin, a photosensitizer, a solvent, a filler and a pigment, and the specific preparation process comprises the following steps: laser printing is adopted, and a film is used as a printing medium to manufacture a solder mask; cleaning the surface of the printed circuit board 10 to be printed, washing with water and then drying in the air; uniformly coating the solder mask oil on the surface of the printed circuit board 10 in a screen printing or roll coating manner; overlapping the printed solder mask with the printed circuit board 10, leaving no gap between the printed circuit board 10 and the solder mask, and exposing under an ultraviolet lamp with the wavelength of 365nm and the power of 5-10W; and after the liquid solder mask oil is cured, taking down the solder mask sheet, wiping the uncured liquid solder mask oil on the shielded first pad area 20a and the shielded second pad area 20b by using absolute alcohol or banana oil, washing by using clear water, and air-drying to prepare the first solder mask layer 30. Preferably, the thickness of the prepared first solder resist oil layer is more than 0.1 mm.
Referring to fig. 4, step S3 is performed and the process of preparing the second solder mask layer 40 is identical to the process of preparing the first solder mask layer 30 in step S2.
Referring to fig. 5 and 6, step S4 is performed to remove the second solder resist layer 40 around the second pad region 20b after curing, so as to form the first printing region 40 a.
Referring to fig. 7 and 10, step S5 is executed to cover a steel mesh 50 on the second solder mask layer 40. The steel net 50 further includes a body 50c and a positioning frame (not shown) disposed outside the body 50c, and the steel net 50 is positioned by the positioning frame. The further steel net 50 includes a first printing hole 50a and a second printing hole 50b penetrating the body, and the first printing hole 50a and the second printing hole 50b correspond to the first pad region 20a and the second pad region 20b in position and size.
Referring to fig. 8, step S6 is performed to coat the solder paste 60 on the steel net 50, and the scraper moves forward at a certain speed and angle to generate a certain pressure on the solder paste 60, so as to push the solder paste 60 to roll forward. A scraper moves on the steel mesh 50, when the scraper passes through the first printing area 40a, the steel mesh 50 is deformed by the pressure of the scraper and sinks and clings to the first solder mask layer 30, the scraper is pressed to enable the solder paste 60 on the steel mesh 50 to pass through the steel mesh 50 and be coated on the first pad area 20a and the second pad area 20b, the periphery of the second pad area 20b and the second pad area 20b is sunken downwards, and the thickness of the solder paste 60 covering the second pad area 20b is smaller than that of the solder paste 60 covering the first pad area 20 a;
when the pressure of the scraper is the pressure when the scraper just scrapes off the solder paste on the steel mesh 50, the angle between the scraper and the steel mesh 50 is 45-60 degrees, and the rolling diameter of the solder paste 60 is 9-15 mm, the solder paste 60 is uniformly coated, and the effect is better.
Referring to fig. 8, step S7 is performed to remove the steel net 50.
As described above, according to the method for printing solder paste on a printed circuit board of the present invention, the first solder resist layer 30 and the second solder resist layer 40 are prepared, the second solder resist layer 40 of the first printing area 40a where the thickness of the thin solder paste is to be printed is removed, and the steel mesh 50 is deformed to be closely attached to the first solder resist layer 30 by the steel blade pressure, so as to achieve the purpose of preparing solder paste 60 with different thicknesses on the same printed circuit board 10. In the method, only the common steel mesh 50 is used, the thickness of the prepared solder paste 60 is adjusted through the first solder mask layer 30 and the second solder mask layer 40, and a better printing effect can be achieved without manufacturing a step steel mesh. The process cost is reduced, and the limitation of the ladder steel mesh on the layout of the components is solved.
Claims (9)
1. A printing method of solder paste is used for printing the solder paste in the assembly process of a printed circuit board, and is characterized in that the printing method of the solder paste comprises the following steps:
step S1: providing a printed circuit board, wherein the upper surface of the printed circuit board is provided with a first pad area, a second pad area and a non-pad area, and the thickness of the printed solder paste required by the first pad area is larger than that of the second pad area;
step S2: preparing a first solder mask layer on the non-pad area;
step S3: preparing a second solder mask layer on the first solder mask layer;
step S4: removing the second solder mask layer around the second pad region to form a first printed region;
step S5: covering a layer of steel mesh on the second solder mask layer;
step S6: coating solder paste on the steel mesh, moving the steel mesh by using a scraper, wherein the steel mesh deforms and sinks and clings to the first solder mask when the scraper passes through the first printing area, pressing the scraper to enable the solder paste on the steel mesh to pass through the steel mesh and be coated on the first pad area and the second pad area, and the peripheries of the second pad area and the second pad area are sunken downwards, so that the thickness of the solder paste covering the second pad area is smaller than that of the solder paste covering the first pad area;
step S7: and removing the steel mesh.
2. The method of claim 1, wherein the steel mesh further comprises a body and a positioning frame disposed outside the body, and the steel mesh is positioned by the positioning frame.
3. The method of claim 2, wherein in step S5, the steel net includes a first printing hole and a second printing hole penetrating the body, and the first printing hole and the second printing hole correspond to the first pad region and the second pad region in position and size.
4. A method for printing solder paste according to claim 1, wherein the first solder resist layer in step S2 and the second solder resist layer in step S3 are prepared by crosslinking liquid solder resist oil into a solid state under uv excitation.
5. A printing method of solder paste according to claim 4, wherein the solder resist oil includes epoxy resin, a sensitizer, a solvent, a filler and a pigment.
6. A printing method of solder paste according to claim 4, wherein the wavelength of the ultraviolet light is 365nm and the power is 5-10W.
7. The method of claim 1, wherein in step S6, the angle between the scraper and the steel net is 45-60 °.
8. The method of claim 1, wherein in step S6, the rolling diameter of the solder paste is 9-15 mm.
9. A method for printing solder paste according to claim 1, wherein in step S2, the thickness of the first solder resist layer is greater than 0.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810871869.1A CN109109481B (en) | 2018-08-02 | 2018-08-02 | Printing method of solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810871869.1A CN109109481B (en) | 2018-08-02 | 2018-08-02 | Printing method of solder paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109109481A CN109109481A (en) | 2019-01-01 |
| CN109109481B true CN109109481B (en) | 2020-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810871869.1A Active CN109109481B (en) | 2018-08-02 | 2018-08-02 | Printing method of solder paste |
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| CN (1) | CN109109481B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113145960B (en) * | 2021-05-06 | 2022-11-11 | 昆山联滔电子有限公司 | Electronic product welding method |
| CN114501846B (en) * | 2022-02-08 | 2023-06-02 | 湖南越摩先进半导体有限公司 | Method for installing components on circuit board and circuit board |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH047893A (en) * | 1990-04-25 | 1992-01-13 | Mitsubishi Electric Corp | Printing method for solder paste |
| DE19923166A1 (en) * | 1999-05-20 | 2000-12-07 | Lpkf Laser & Electronics Ag | Producing template for applying solder paste to circuit boards involves forming compound foil with different thicknesses by sticking first foil onto further foil(s) with pre-formed cut-outs |
| JP2009237132A (en) * | 2008-03-26 | 2009-10-15 | Dainippon Printing Co Ltd | Color filter, method of manufacturing color filter, and liquid crystal display device |
| JP2011114113A (en) * | 2009-11-26 | 2011-06-09 | Fujikura Ltd | Carrier board for printing flexible printed board and solder paste print method using the same |
| JP5914997B2 (en) * | 2011-06-07 | 2016-05-11 | 凸版印刷株式会社 | Decorative body manufacturing method |
| TWI508279B (en) * | 2012-01-19 | 2015-11-11 | Joled Inc | Display and method of manufacturing the same, unit, transfer printing method, organic electroluminescence unit and method of manufacturing the same, and electronic apparatus |
| JP6155468B2 (en) * | 2013-12-06 | 2017-07-05 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting method and electronic component mounting system |
| CN105172400B (en) * | 2015-10-27 | 2017-11-03 | 华东光电集成器件研究所 | The method for printing screen of different thicknesses of layers |
| CN106793534A (en) * | 2015-11-20 | 2017-05-31 | 富泰华工业（深圳）有限公司 | Circuit board steel mesh printing process |
| JP6323482B2 (en) * | 2016-03-07 | 2018-05-16 | 富士ゼロックス株式会社 | Heating device manufacturing method, printed material manufacturing method, and screen printing device |
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Effective date of registration: 20201112 Address after: No.50, Hu Ming Road, Huwei village, Heshang Town, Changle District, Fuzhou City, Fujian Province Applicant after: Li Xiaopeng Address before: 518000 Guangdong, Shenzhen, Luohu District, Dongmen street, 123 Shennan Road, Shenzhen, department store building, east side, 1-B02 Applicant before: SHENZHEN FULAIGUO TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20240131 Address after: 315400, No. 2059, Shinan West Road, Yuyao City, Ningbo City, Zhejiang Province Patentee after: NINGBO YIJIA ELECTRONICS Co.,Ltd. Country or region after: China Address before: 350000, 50 Huming Road, Huwei Village, Heshang Town, Changle District, Fuzhou City, Fujian Province Patentee before: Li Xiaopeng Country or region before: China |