CN114501846B - Method for installing components on circuit board and circuit board - Google Patents
Method for installing components on circuit board and circuit board Download PDFInfo
- Publication number
- CN114501846B CN114501846B CN202210117406.2A CN202210117406A CN114501846B CN 114501846 B CN114501846 B CN 114501846B CN 202210117406 A CN202210117406 A CN 202210117406A CN 114501846 B CN114501846 B CN 114501846B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- components
- solder paste
- solder
- metal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention belongs to the technical field of installation of components of a circuit board, and discloses a method for installing components on the circuit board and the circuit board, wherein the method for installing the components on the circuit board comprises the following steps: s1, windowing on a solder mask of a circuit board, and fixedly arranging a metal frame on the solder mask; s2, spraying solder paste at the position of the window opposite to the opening by using the 3D printing nozzle; s3, fixing the components on the solder paste. According to the method for installing the components on the circuit board, firstly, the window is formed in the solder mask layer, the metal frame is fixedly arranged on the solder mask layer, the metal frame is made of metal materials, so that warping deformation of the circuit board is prevented from being caused in the high-low temperature process of the subsequent process, then, solder paste is sprayed at the position of the window opposite to the window by using the 3D printing nozzle, the solder paste can be sprayed at any position by using the 3D printing nozzle, the surface of the circuit board does not need to be kept flat, and finally, the components are fixed on the solder paste, so that the fixation of the components is realized.
Description
Technical Field
The invention relates to the technical field of circuit board component installation, in particular to a method for installing components on a circuit board and the circuit board.
Background
And fixing components such as a resistor or a capacitor on the solder mask of the circuit board through solder paste, thereby realizing the corresponding functions of the circuit board. In the existing method for installing components on a circuit board, as shown in fig. 1, S100, a window is opened on a steel mesh, and the position of the window on the steel mesh is the same as the position of the window on a solder mask layer of the circuit board; s200, placing the steel mesh on the solder mask layer, and coating printing tin paste on the surface of the steel mesh by using a tin paste printing roller to fill tin paste into the window of the steel mesh and the window of the solder mask layer; s300, removing the steel mesh, only reserving solder paste at the windowing position of the steel mesh and solder paste at the windowing position of the solder mask layer, and shaping and solidifying the solder paste by using reflow soldering; and S400, finally, fixing the components on the solder paste to realize the installation of the components. However, in step S300, the solder paste is shaped and cured by reflow soldering, and at this time, the circuit board is affected by the high temperature of the reflow soldering, and the circuit board is expanded by heating to generate a certain buckling deformation, which affects the subsequent re-soldering of other devices or large-size chips on the circuit board, thereby reducing the reliability of the circuit board.
Disclosure of Invention
The invention aims to provide a method for mounting components on a circuit board, which can prevent the circuit board from buckling and deforming and is convenient for mounting the components.
To achieve the purpose, the invention adopts the following technical scheme:
a method of mounting components on a circuit board, comprising:
s1, windowing on a solder mask of a circuit board, and fixedly arranging a metal frame on the solder mask;
s2, spraying solder paste on the position of the window by using a 3D printing nozzle;
s3, fixing the components on the solder paste.
Preferably, after step S2, the solder paste is set and cured by high temperature of reflow soldering.
Preferably, in step S3, the solder paste is heated to adhere the component to the solder paste.
Preferably, in step S1, the metal frame is first placed on the solder resist layer, and is disposed along an edge of the solder resist layer, and is fixed to the solder resist layer by welding.
Preferably, the metal frame is placed on the solder resist layer so as to avoid the position of the window.
Preferably, the width of the window is D1, and the diameter D2 of the outlet end of the 3D printing nozzle is set before step S2, so that D2 is less than or equal to D1.
Preferably, the height of the solder paste sprayed by the 3D printing nozzle is set.
Preferably, the method further comprises S4, and the mounted components are tested.
The invention also provides a circuit board, and the components are installed by using the method for installing the components on the circuit board.
Preferably, the metal frame is in a ring structure or a rectangular structure.
The invention has the beneficial effects that:
according to the method for installing the components on the circuit board, firstly, the window is formed in the solder mask layer, the metal frame is fixedly arranged on the solder mask layer, the metal frame is made of metal materials, so that warping deformation of the circuit board is prevented from being caused in the high-low temperature process of the subsequent process, then, solder paste is sprayed at the position of the window opposite to the window by using the 3D printing nozzle, the solder paste can be sprayed at any position by using the 3D printing nozzle, the surface of the circuit board does not need to be kept flat, and finally, the components are fixed on the solder paste, so that the fixation of the components is realized. According to the method for mounting the components on the circuit board, the metal frame is used for preventing the circuit board from buckling deformation, and the 3D printing spray nozzle is used for spraying the solder paste, so that compared with the traditional roller printing solder paste mode, the 3D printing spray nozzle is used for spraying the solder paste, the flatness of the surface of the circuit board can be ignored, and the solder paste can be sprayed at any position.
Drawings
FIG. 1 is a flow chart of a method for mounting components on a circuit board provided in the background art;
FIG. 2 is a flow chart of a method for mounting components on a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic view of a first view angle structure of a metal frame disposed on a solder mask layer according to an embodiment of the present invention;
FIG. 4 is a schematic view of a second view angle structure of a metal frame disposed on a solder mask layer according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a state of spraying solder paste at a position of a window opposite to a 3D printing nozzle according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a state of setting and curing solder paste by using high temperature of reflow soldering according to an embodiment of the present invention.
In the figure:
1. a solder mask layer; 11. windowing;
2. a metal frame;
3. 3D prints the shower nozzle;
4. and (5) solder paste.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In describing embodiments of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, or may include both the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the embodiments of the present invention, the terms "upper", "lower", "right", and the like are used for convenience of description and simplicity of operation based on the azimuth or positional relationship shown in the drawings, and are not to be construed as limiting the present invention, as the means or elements referred to must have a specific azimuth, be constructed and operated in a specific azimuth. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The present embodiment provides a method for mounting components on a circuit board, as shown in fig. 2 to 6, including:
s1, opening a window 11 on a solder mask layer 1 of a circuit board, and fixedly arranging a metal frame 2 on the solder mask layer 1;
s2, spraying solder paste 4 at the position of the window 11 opposite to the window by using the 3D printing spray head 3;
s3, fixing the components on the solder paste 4.
It should be noted that the wires on the circuit board are covered with the solder resist layer 1 to prevent short circuits and damage to the device. The window 11 is to remove the solder mask layer 1 on the wire so that the wire can be exposed to tin.
According to the method for installing the components on the circuit board, firstly, the window 11 is formed in the solder mask layer 1, the metal frame 2 is fixedly arranged on the solder mask layer 1, the metal frame 2 is made of metal materials, so that warping deformation of the circuit board is prevented from being caused in the high-low temperature process of the subsequent process, then the solder paste 4 is sprayed at the position of the window 11 by utilizing the 3D printing nozzle 3, the solder paste 4 can be sprayed at any position by utilizing the 3D printing nozzle 3, the surface of the circuit board does not need to be kept flat, and finally, the components are fixed on the solder paste 4, so that the fixation of the components is realized. The method for mounting components on the circuit board provided by the embodiment prevents the circuit board from buckling deformation by utilizing the metal frame 2. Because after the metal frame 2 is used, a steel mesh cannot be paved, and components are inconvenient to install, the 3D printing nozzle 3 is utilized to spray the solder paste 4, and the 3D printing nozzle 3 is utilized to spray the solder paste 4, so that the flatness of the surface of the circuit board can be ignored, and the solder paste 4 can be sprayed at any position.
Specifically, as shown in fig. 2 to 4, in step S1, the metal frame 2 is first placed on the solder resist layer 1 and disposed along the edge of the solder resist layer 1, and then the metal frame 2 is fixed to the solder resist layer 1 by welding. In this embodiment, the circuit board is a cuboid structure, the solder mask layer 1 is a cuboid structure, the metal frame 2 is a hollow rectangular structure, the metal frame 2 is firstly placed on the solder mask layer 1 and then fixed on the solder mask layer 1 by welding, the metal frame 2 is made of metal materials, has a certain hardness, is not easy to bend and deform, plays a role in pressing the warp and deformation of the circuit board in the high and low temperature process of the subsequent process, and has a heat dissipation effect because the metal frame 2 is made of metal materials, and a radiator can be fixedly arranged on the metal frame 2 in the subsequent installation, so that the heat dissipation effect is further achieved. In other embodiments, the metal frame may have any structure, as long as it can press the buckling deformation of the circuit board, for example, a hollow circular ring structure. More specifically, when placing the metal frame 2 on the solder resist layer 1, attention is paid to the position of avoiding the window 11 so as not to affect the mounting of subsequent components.
Specifically, the width of the window 11 is D1, and the diameter D2 of the outlet end of the 3D printing nozzle 3 is set so that D2 is less than or equal to D1 before the solder paste 4 is sprayed on the position of the window 11 by using the 3D printing nozzle 3 in step S2, so that the excess solder paste 4 is prevented from leaking out on the solder mask layer 1. The height of the solder paste 4 sprayed by the 3D printing spray head 3 is set, so that the height of the solder paste 4 sprayed by the 3D printing spray head 3 is ensured, and the precision of subsequent installed components is improved. The specific height is determined through repeated tests according to the type, the size and the like of the components. If the 3D printing nozzle 3 sprays out the solder paste 4 too much, the redundant solder paste 4 is extruded and leaked on the solder mask layer 1, so that the installation of subsequent other parts is affected, if the 3D printing nozzle 3 sprays out the solder paste 4 too little, the installed components and parts are possibly infirm, the components and parts are easy to shake, and the service performance of the circuit board is reduced.
Specifically, as shown in fig. 2 and 6, after step S2, the solder paste 4 is shaped and cured by the high temperature of reflow soldering, so as to ensure that the subsequent components are convenient to mount. Because the metal frame 2 is arranged on the solder mask layer 1, the circuit board hardly generates obvious buckling deformation, thereby creating good conditions for the smooth proceeding of the subsequent process and preventing the influence of the high temperature of reflow soldering on the circuit board.
Specifically, in step S3, the solder paste 4 is heated to adhere the components to the solder paste 4. The solder paste 4 is a novel solder material which is produced by SMT, and is a paste-like mixture formed by mixing solder powder, flux, other surfactants, thixotropic agents, and the like. The solder paste 4 is heated, so that components are adhered to the solder paste 4, and the components and the circuit board are mounted.
Specifically, as shown in fig. 2, the method for installing components on the circuit board further includes S4, testing the installed components, so as to ensure that the installed components can be used normally.
The embodiment also provides a circuit board, and the components are mounted on the solder mask layer 1 by using the method for mounting the components on the circuit board.
Specifically, the metal frame 2 is of a ring-shaped structure or a rectangular structure, and in this embodiment, the metal frame 2 of a hollow rectangular structure is used and soldered to the solder resist layer 1 of the circuit board.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the invention. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (9)
1. A method of mounting components on a circuit board, comprising:
s1, opening a window (11) on a solder mask layer (1) of a circuit board, and fixedly arranging a metal frame (2) on the solder mask layer (1);
s2, spraying solder paste (4) on the position of the window (11) by using a 3D printing spray head (3);
s3, fixing the components on the solder paste (4);
in the step S1, firstly, the metal frame (2) is placed on the solder mask layer (1) and is arranged along the edge of the solder mask layer (1) and fixed on the solder mask layer (1) through welding;
the solder paste (4) is a pasty mixture formed by mixing soldering tin powder, soldering flux, a surfactant and a thixotropic agent.
2. The method of mounting components on a circuit board according to claim 1, wherein after step S2, the solder paste (4) is set and cured by a high temperature of reflow soldering.
3. The method of mounting components on a circuit board according to claim 1, wherein in step S3, the solder paste (4) is heated to adhere the components to the solder paste (4).
4. Method for mounting components on a circuit board according to claim 1, characterized in that the position of the window (11) is avoided when the metal frame (2) is placed on the solder mask layer (1).
5. The method for mounting components on a circuit board according to claim 1, wherein the width of the window (11) is D1, and the diameter D2 of the outlet end of the 3D printing head (3) is set to be D2 equal to or smaller than D1 before step S2.
6. The method for mounting components on a circuit board according to claim 5, wherein the height of the solder paste (4) sprayed by the 3D printing head (3) is set.
7. The method of mounting components on a circuit board according to claim 1, further comprising S4, testing the mounted components.
8. A circuit board, characterized in that components are mounted using the method for mounting components on a circuit board according to any one of claims 1 to 7.
9. Circuit board according to claim 8, characterized in that the metal frame (2) is of annular or rectangular construction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210117406.2A CN114501846B (en) | 2022-02-08 | 2022-02-08 | Method for installing components on circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210117406.2A CN114501846B (en) | 2022-02-08 | 2022-02-08 | Method for installing components on circuit board and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114501846A CN114501846A (en) | 2022-05-13 |
| CN114501846B true CN114501846B (en) | 2023-06-02 |
Family
ID=81478857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210117406.2A Active CN114501846B (en) | 2022-02-08 | 2022-02-08 | Method for installing components on circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114501846B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109109481A (en) * | 2018-08-02 | 2019-01-01 | 深圳市福来过科技有限公司 | A kind of printing process of tin cream |
| CN113966097A (en) * | 2021-09-30 | 2022-01-21 | 苏州浪潮智能科技有限公司 | Circuit board component assembling method, main board and server |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0559881U (en) * | 1992-01-20 | 1993-08-06 | 富士通株式会社 | Warpage prevention tool for printed circuit boards |
| JPH05218629A (en) * | 1992-02-03 | 1993-08-27 | Fujitsu Ltd | Dispensing method of creamy solder |
| JPH0677635A (en) * | 1992-08-26 | 1994-03-18 | Ace Denshi Kogyo Kk | Manufacture of soldering pad part for printed circuit board |
| JPH0644200U (en) * | 1992-11-19 | 1994-06-10 | 住友ベークライト株式会社 | Substrate fixing jig |
| JP2000208918A (en) * | 1999-01-18 | 2000-07-28 | Ueda Japan Radio Co Ltd | Formation of patterned solder bump of printed wiring board |
| US6173887B1 (en) * | 1999-06-24 | 2001-01-16 | International Business Machines Corporation | Method of making electrically conductive contacts on substrates |
| JP2004096042A (en) * | 2002-09-04 | 2004-03-25 | Fuji Electric Holdings Co Ltd | Supply method of connection material onto circuit board and supply device thereof |
| CN2580728Y (en) * | 2002-11-05 | 2003-10-15 | 华硕电脑股份有限公司 | Structure of frame shape clamp |
| CN201608985U (en) * | 2009-12-28 | 2010-10-13 | 深南电路有限公司 | Combination of frame-type fixture and circuit board |
| JP2015149452A (en) * | 2014-02-07 | 2015-08-20 | 株式会社タムラ製作所 | Warp suppressing device and reflow device |
| JP6318738B2 (en) * | 2014-03-17 | 2018-05-09 | 日本電気株式会社 | Substrate fixing jig, substrate fixing method and solder printing method |
| CN107182172B (en) * | 2017-07-10 | 2019-09-27 | 成都联创鸿发科技有限公司 | The process of 3D printing soldering paste body on printed circuit board |
-
2022
- 2022-02-08 CN CN202210117406.2A patent/CN114501846B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109109481A (en) * | 2018-08-02 | 2019-01-01 | 深圳市福来过科技有限公司 | A kind of printing process of tin cream |
| CN113966097A (en) * | 2021-09-30 | 2022-01-21 | 苏州浪潮智能科技有限公司 | Circuit board component assembling method, main board and server |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114501846A (en) | 2022-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6420255B1 (en) | Mounting substrate with a solder resist layer and method of forming the same | |
| US20070246516A1 (en) | Universal mold for injection molding of solder | |
| US20070090170A1 (en) | Method of making a circuitized substrate having a plurality of solder connection sites thereon | |
| CN114501846B (en) | Method for installing components on circuit board and circuit board | |
| US7416106B1 (en) | Techniques for creating optimized pad geometries for soldering | |
| CN111836479A (en) | Pad processing device and pad maintenance method | |
| US20100147928A1 (en) | Method for the manual placement of bottom terminated leadless device electronic packages using a mated stencil pair | |
| US20050254224A1 (en) | Method for attaching a shield can to a pcb and a shield can therefor | |
| EP1445999B1 (en) | A method of providing a PWB with a shield can and a PWB therefor | |
| US7159758B1 (en) | Circuit board processing techniques using solder fusing | |
| TW201338645A (en) | Printed circuit board and method for manufacturing printed circuit board | |
| WO2004071144A1 (en) | A shield can for shielding electronic components on a pwb | |
| JP2006332120A (en) | Soldering method and printed wiring board employing it | |
| CN109195356A (en) | A kind of Through-hole reflow used for printed circuit board connects technique | |
| CN102056405B (en) | Surface mount structure and circuit board with same | |
| CN100444706C (en) | Method of mounting electronic part on wiring board | |
| CN212305766U (en) | PCB, PCB with welding agent brushed in advance and electronic module | |
| EP1446000B1 (en) | A shield can for shielding electronic components on a PWB | |
| JP4212880B2 (en) | Circuit board assembly | |
| JPH0229396A (en) | Method and apparatus for mounting electronic component | |
| JP2768358B2 (en) | Printed circuit board for mounting multi-terminal components | |
| CN111885816A (en) | PCB (printed circuit board) and manufacturing method thereof, electronic module and assembling method thereof | |
| JPH11121915A (en) | Method for mounting electronic components and flux for mounting electronic components | |
| JP2008124282A (en) | Mask for solder printing | |
| JP3848109B2 (en) | Board mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |