CN109195356A - A kind of Through-hole reflow used for printed circuit board connects technique - Google Patents
A kind of Through-hole reflow used for printed circuit board connects technique Download PDFInfo
- Publication number
- CN109195356A CN109195356A CN201811197827.0A CN201811197827A CN109195356A CN 109195356 A CN109195356 A CN 109195356A CN 201811197827 A CN201811197827 A CN 201811197827A CN 109195356 A CN109195356 A CN 109195356A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- reflow
- printed circuit
- hole
- zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of Through-hole reflows used for printed circuit board to connect technique, includes the following steps first to carry out whole plate printing, then installation elements device using certain thickness ladder steel mesh, is finally delivered to reflow ovens and carries out reflow soldering；Wherein, the temperature in reflow ovens is respectively: preheating zone is 100~140 DEG C；Recirculating zone is 178~210 DEG C, 40~60s of time；Cooling zone is 25~160 DEG C.Through-hole reflow provided by the invention solves the deficiency of wave-soldering, while welding quality can be improved, reduce process flow and reduce cost.
Description
Technical field
The present invention relates to a kind of Through-hole reflows used for printed circuit board to connect technique, belongs to welding technology field.
Background technique
In electronics industry, electronic component is welded by using wave-soldering.But wave-soldering exists following insufficient: (1) not
It is suitble to high density, the welding of thin space element；(2) easily there is bridge joint, solder skip phenomenon, need to spray scaling powder at this time；(3) printed board
Because buckling deformation phenomenon is easily occurred by larger thermal shock.
Summary of the invention
The Through-hole reflow used for printed circuit board of wave-soldering can be replaced to connect technique the purpose of the present invention is to provide a kind of.
The purpose of the present invention is what is be achieved through the following technical solutions:
A kind of Through-hole reflow used for printed circuit board connects technique, includes the following steps:
First carry out whole plate printing using certain thickness ladder steel mesh, then installation elements device, be finally delivered to reflow ovens into
Row reflow soldering；
Wherein, the temperature in reflow ovens is respectively: preheating zone is 100~140 DEG C；Recirculating zone is 178~210 DEG C, when
Between 40~60s；Cooling zone is 25~160 DEG C.
Further, the mounting related components, which refer to, first installs SMD components with chip mounter, then installs plug-in components.
Further, time of the temperature of the recirculating zone greater than 178 DEG C is 30~40s.
Through-hole reflow provided by the invention solves the deficiency of wave-soldering, while welding quality can be improved, reduce technique
Process and reduce cost.
Specific embodiment
One kind provided in this embodiment Through-hole reflow used for printed circuit board connects technique, includes the following steps:
Whole plate printing first is carried out using certain thickness ladder steel mesh, SMD components first are installed with chip mounter, then install
Plug-in components；It is finally delivered to reflow ovens and carries out reflow soldering；
Wherein, the temperature in reflow ovens is respectively: preheating zone is 100~140 DEG C, printed board and the preheating of soldering paste,
Avoid printed board and soldering paste in recirculating zone by thermal shock；It, then can be by this temperature when there is the device of non-refractory in printed board
The temperature in area reduces, a surface damage component；
Recirculating zone is 178~210 DEG C, 40~60s of time；
Cooling zone is 25~160 DEG C.
Further, the mounting related components refer to
Further, time of the temperature of the recirculating zone greater than 178 DEG C is 30~40s.
The above is only the preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, any
The transformation and replacement carried out based on technical solution provided by the present invention and inventive concept should all be covered in protection model of the invention
In enclosing.
Claims (3)
1. a kind of Through-hole reflow used for printed circuit board connects technique, it is characterised in that include the following steps:
Whole plate printing, then installation elements device first are carried out using certain thickness ladder steel mesh, reflow ovens is finally delivered to and is returned
Fluid welding connects；
Wherein, the temperature in reflow ovens is respectively: preheating zone is 100~140 DEG C；Recirculating zone is 178~210 DEG C, the time 40
~60s；Cooling zone is 25~160 DEG C.
2. Through-hole reflow used for printed circuit board according to claim 1 connects technique, it is characterised in that: the installation member
Device, which refers to, first installs SMD components with chip mounter, then installs plug-in components.
3. Through-hole reflow used for printed circuit board according to claim 1 connects technique, it is characterised in that: the recirculating zone
Temperature greater than 178 DEG C time be 30~40s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811197827.0A CN109195356A (en) | 2018-10-15 | 2018-10-15 | A kind of Through-hole reflow used for printed circuit board connects technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811197827.0A CN109195356A (en) | 2018-10-15 | 2018-10-15 | A kind of Through-hole reflow used for printed circuit board connects technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195356A true CN109195356A (en) | 2019-01-11 |
Family
ID=64944648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811197827.0A Withdrawn CN109195356A (en) | 2018-10-15 | 2018-10-15 | A kind of Through-hole reflow used for printed circuit board connects technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109195356A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111633290A (en) * | 2020-06-15 | 2020-09-08 | 深圳市登峰电源有限公司 | Welding process of circuit welding plate |
-
2018
- 2018-10-15 CN CN201811197827.0A patent/CN109195356A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111633290A (en) * | 2020-06-15 | 2020-09-08 | 深圳市登峰电源有限公司 | Welding process of circuit welding plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190111 |