CN102689065B - A kind of welding method of circuit board element - Google Patents
A kind of welding method of circuit board element Download PDFInfo
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- CN102689065B CN102689065B CN201210182031.4A CN201210182031A CN102689065B CN 102689065 B CN102689065 B CN 102689065B CN 201210182031 A CN201210182031 A CN 201210182031A CN 102689065 B CN102689065 B CN 102689065B
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Abstract
The embodiment of the invention discloses a kind of welding method of circuit board element, for merging or minimizing production process, enhance productivity.The embodiment of the present invention comprises: the position of pasting inserted on circuit boards by the components and parts according to inserting subsides, and print tin steel-screen is produced corresponding leakage tin hole; Using and print tin steel-screen, Yin Xi is carried out to circuit board, making tin cream stick to corresponding pad with on the top of inserting subsides hole and hole wall thereof by leaking tin hole; Insert needing to plug in the components and parts pasted in corresponding slotting subsides hole, make to stick to insert the tin cream pasted above hole and on hole wall be pushed through insert the pin place of the components and parts of subsides; The circuit board inserting components and parts is put into solder reflow device weld, components and parts are formed with pad in circuit board front and welds, and make the tin cream being pushed through circuit board reverse side component's feet place form tin welding spot.
Description
Technical field
The present invention relates to the production technical field of electronic product and small-sized solar cell panel, especially a kind of welding method of circuit board element.
Background technology
Updating nowadays due to electronics manufacturing, has become the active demand of every profession and trade to the improvement of manufacturing process; Such as, position is exposed to the component's feet of PCBA reverse side and adds tin-welding process, wherein, PCBA is the abbreviation of English Printed Circuit Board+Assembly, that is printing board PCB hollow plate is through the upper part of SMT (Surface Mount Technology, electronic circuit surface installation technique), then through DIP (Dual Inline-pin Package, dual in-line package technology) the whole processing procedure of plug-in unit, is called for short PCBA.At present, its common implementation of this technique has three kinds:
Mode one: at PCBA reverse side, adopts the Wave soldering apparatus pad corresponding to plug-in components pin to add tin welding;
Mode two: at PCBA reverse side, uses electric iron to add tin welding to plug-in components pin.
Mode three: utilize that existing equipment carries out reverse side secondary print tin again to the PCBA after front mounts (comprise short leads ends subclass components and parts, or claim SMD components and sheet components and parts, as rivet-like terminal components and parts), secondary crosses stove.
Practice finds, mode one and the technical scheme described in mode two there will be following problem: have more scaling powder remaining after adding tin, affect product appearance; Adding tin process can cause tin amount uneven, causes the bad phenomenon such as rosin joint, missing solder; And if when these three kinds of modes are applied in production in enormous quantities, also need to drop into more personnel, manufacturing equipment, tool fixture etc., cost comparatively greatly, thus affects production efficiency.
Summary of the invention
Embodiments provide a kind of welding method of circuit board element, for merging or minimizing production process, enhance productivity.
In view of this, the embodiment of the present invention provides:
A welding method for circuit board element, comprising:
The position of pasting inserted on circuit boards by components and parts according to inserting subsides, and print tin steel-screen is produced corresponding leakage tin hole;
Using described print tin steel-screen, Yin Xi is carried out to described circuit board, making tin cream stick to corresponding pad with on the top of inserting subsides hole and hole wall thereof by leaking tin hole;
Insert needing to plug in the components and parts pasted in corresponding slotting subsides hole, make to stick to insert the tin cream pasted above hole and on hole wall be pushed through insert the pin place of the components and parts of subsides;
The circuit board inserting components and parts is put into solder reflow device weld, described components and parts are formed with pad in circuit board front and welds, and make the tin cream being pushed through circuit board reverse side component's feet place form tin welding spot.
Wherein, described position of inserting subsides at circuit board according to the components and parts will inserting subsides specifically comprises:
According to insert subsides components and parts pad on circuit board correspondence position size and shape, insert the relative position pasted between the size and shape in hole and each pad.
Described producing on print tin steel-screen leaks tin hole accordingly, comprising:
Need to insert the pad pasting components and parts for each, on print tin steel-screen, respective production goes out corresponding two or more leakage tin hole.
The described components and parts inserting subsides that will need insert in the slotting subsides hole of correspondence, comprising:
Chip mounter or inserter is used to insert needing the pin plugging in the components and parts pasted in corresponding slotting subsides hole.
Described pad is circular pad, and described slotting subsides hole is that circular inserting pastes hole.
Described print tin steel-screen has the leakage tin hole of all kinds of electronic devices and components of more than one attachment.
Described tin welding spot is dome shape tin welding spot, is connected with welding lead or formed with circuit.
As can be seen from the above technical solutions, the welding method of a kind of circuit board element that the embodiment of the present invention provides, wherein, according to by the pin shape of slotting subsides components and parts and size, insert the shape and size of pasting hole, the shape of pad and size, print tin steel-screen makes corresponding leakage tin hole, after operation of print tin being implemented to circuit board with it, ensure outside the normal tin amount on pad, some tin cream is suspended on the top of slotting subsides hole periphery edge and inserts on subsides hole wall, and this part tin cream is not dripped, after slotting subsides components and parts, the tin cream that this part tin cream can be pushed through circuit board reverse side component's feet place forms uniform tin welding spot, thus complete and position is exposed to the component's feet of circuit board reverse side add tin-welding process.This method is removed or is incorporated multiple tracks complicated procedures of forming, simple, with low cost, effectively raises production efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme of the embodiment of the present invention, be briefly described describing the required accompanying drawing used to embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The flow chart of the welding method of a kind of circuit board element that Fig. 1 provides for the embodiment of the present invention;
The welding process schematic diagram of the welding method of the circuit board element that Fig. 2 a-2e provides for the embodiment of the present invention.
Embodiment
Embodiments provide a kind of welding method of circuit board element, for merging or minimizing production process, enhance productivity.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Below be described in detail respectively.
Please refer to Fig. 1, the flow chart of the welding method of a kind of circuit board element that Fig. 1 provides for the embodiment of the present invention, incorporated by reference to the welding process schematic diagram of the welding method of the circuit board element provided for the embodiment of the present invention with reference to figure 2a-2e, Fig. 2 a-2e, wherein, the method comprises:
S101, insert the position of pasting on circuit boards according to the components and parts will inserting subsides, print tin steel-screen is produced and leaks tin hole accordingly;
Be understandable that, plugging in the circuit board pasted can be common printing board PCB, also can be PCBA, wherein, PCBA is the abbreviation of English Printed Circuit Board+Assembly, that is PCB hollow plate part on SMT, then through the whole processing procedure of DIP plug-in unit and the circuit board made.
SMT is surface installation technique (surface mounting technology), is the abbreviation of Surface Mounted Technology, is most popular a kind of technology and technique in current Electronic Assemblies industry.SMT is that one (will be called for short SMC/SMD without pin or short leg surface-assembled components and parts, Chinese claims sheet components and parts) be arranged on the surface of PCB or the surface of other substrate, by the circuit load technology of the method such as Reflow Soldering or immersed solder in addition welding assembly.
Preferably, can according to insert subsides components and parts pad on circuit board correspondence position size and shape, insert the relative position etc. pasted between the size and shape in hole and each pad, print tin steel-screen is produced corresponding leakage tin hole.
Preferably, described pad can be circular pad, and the slotting subsides hole in the middle of described pad can be that circular inserting pastes hole;
It should be noted that, described pad also can be non-circular pad, described slotting subsides hole also can be that circular inserting pastes holes, and this according to the size shape of actual pad and can insert the size shape of pasting hole or other actual conditions design, and does not do concrete restriction herein.
Conveniently understand, paste hole for circular pad and circular inserting below, the method is described:
Please refer to Fig. 2 a, Fig. 2 a is making schematic diagram print tin steel-screen leaking tin hole, and wherein, 1 is print tin steel-screen, and 2 for leaking tin hole, and 3 is pad, and 4 is circuit board, and the hole in the middle of pad 3 is exactly the slotting subsides hole 31 that subsides inserted by components and parts;
In some embodiments, can according to the size of pad 3, insert and paste the size in hole 31, and the spacing between each pad, on print tin steel-screen 1, make and leak tin hole 2 accordingly;
Be understandable that, each is needed to insert the pad 3 pasting components and parts, print tin steel-screen 1 can produce corresponding two or more leakage tin hole 2; In the present embodiment, as shown in Figure 2 a, each is needed to insert the pad 3 pasting components and parts, on print tin steel-screen, 1 produces two corresponding leakage tin holes 2, under this enforcement scene, leaking tin hole 2 can in upper and lower two relative arc setting, and its arc height is about 1/3 of corresponding circular pad 3 diameter; And leave not perforate part between two leakage tin holes 2, namely two leak between tin holes 2 not connected, and from diagram, the gross area of two leakage tin holes 2 and not perforate part, is equivalent to the area of corresponding pad 3.
Be understandable that, in existing circuit board making process, print tin steel-screen is used to the tin of paste slurry to print on pcb board, circuit board popular at present mostly uses surface mounting technology except power panel, its pcb board there is a lot of Surface Mount pad, namely that without via hole, and the leakage tin hole printed on tin steel-screen is just in time the pad on corresponding pcb board, during print tin, the tin of semiliquid semi-solid state slurry is printed onto on pcb board by the leakage tin hole on print tin steel-screen by the hard brush of level, up components and parts are pasted again, then after reflow soldering by chip mounter; Under normal circumstances, steel mesh can also have the leakage tin hole of other all kinds of electronic devices and components of more than one attachment except having the leakage tin hole shown in the present embodiment simultaneously, do not do concrete restriction herein.
S102, use print tin steel-screen, carry out Yin Xi to circuit board, make tin cream stick to the pad of correspondence with on the top in slotting subsides hole and hole wall thereof by leaking tin hole;
In embodiments of the present invention, use the print tin steel-screen 1 made by step S101, the operation of print tin is carried out to circuit board 4;
As Fig. 2 b, Fig. 2 b is the schematic diagram of the circuit board after print tin, after Yin Xi, pad can leave normal tin amount, and make a part of tin cream 6 stick to corresponding pad 3 with on the top of inserting subsides hole 31 and hole wall thereof by leaking tin hole, and naturally do not drip, it overlooks enlarged drawing and A-A direction enlarged drawing after can printing tin see pad 3 shown in Fig. 2 b.
S103, to insert needing to plug in the components and parts pasted in corresponding slotting subsides hole, make to stick to insert the tin cream pasted above hole and on hole wall be pushed through insert the pin place of the components and parts of subsides;
Being understandable that, in some embodiments, is use chip mounter or inserter to insert in corresponding slotting subsides hole 31 by needing the pin plugging in the components and parts 5 pasted;
As Fig. 2 c, Fig. 2 c inserts the schematic diagram before pasting, wherein, in embodiments of the present invention, plug in the components and parts 5 pasted and paste components and parts so that rivet-like is slotting; Incorporated by reference to reference to figure 2d, Fig. 2 d is the schematic diagram plugging in the circuit board after pasting, insert after pasting, make to stick to insert the tin cream pasted above hole 31 and on hole wall be pushed through insert the pin place of the components and parts 5 of subsides, it can paste the rear enlarged drawing inserting subsides 31A-A direction, hole see inserting shown in Fig. 2 d, and from diagram, stick to insert the tin cream 6 pasted above hole 31 and on hole wall be pushed through insert the pin place of the components and parts 5 of subsides after, form irregular tin cream group.
S104, put into solder reflow device weld inserting the circuit board of components and parts, components and parts are formed with pad in circuit board front and welds, and make the tin cream formation tin welding spot being pushed through circuit board reverse side component's feet place.(because these contents described of S101-S104 are corresponding exclusive rights 1, therefore delete " comparatively smooth dome shape ", mention in the following specifically describes.)
When after the slotting subsides completing components and parts, circuit board 4 is put into solder reflow device weld, circuit board is taken out after crossing Reflow Soldering, components and parts 5 (insert as rivet-like and paste components and parts) define effective weld by tin cream 6 with pad 3 in circuit board 4 front, and the tin cream 6 being pushed through circuit board reverse side component's feet place forms tin welding spot 7, as shown in Figure 2 e, Fig. 2 e was circuit board schematic diagram after Reflow Soldering and inserted the enlarged drawing pasting 31A-A direction, hole, wherein, tin welding spot 7 is comparatively smooth dome shape, can be directly used in welding lead or be formed with other circuit to be connected.
Be understandable that, Reflow Soldering is also known as reflow welding, solder joint is formed by the prepositioned solder of refuse, a kind of welding method of adding any extra solder is not needed in welding process, the process of Reflow Soldering comprises preheating, intensification, backflow, cooling, its effect is melted by solder(ing) paste, and surface-assembled components and parts and circuit board are firmly welded together.Usually the solder reflow device used is called reflow soldering, is placed in surface mount production line chip mounter equipment below.
As can be seen from the above technical solutions, embodiments provide a kind of welding method of circuit board element, according to by the pin shape of slotting subsides components and parts and size, insert the shape and size of pasting hole, the shape of pad and size, print tin steel-screen makes corresponding leakage tin hole, after operation of print tin being implemented to circuit board with it, ensure outside the normal tin amount on pad, some tin cream is suspended on the top of slotting subsides hole periphery edge and inserts on subsides hole wall, and this part tin cream is not dripped, after slotting subsides components and parts, the tin cream that this part tin cream can be pushed through circuit board reverse side component's feet place forms uniform tin welding spot, thus complete and position is exposed to the component's feet of circuit board reverse side add tin-welding process.This method is removed or is incorporated multiple tracks complicated procedures of forming, simple, with low cost, effectively raises utilization rate of equipment and installations and production efficiency.
Above the welding method of a kind of circuit board element provided by the present invention is described in detail, for one of ordinary skill in the art, according to the thought of the embodiment of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (5)
1. a welding method for circuit board element, is characterized in that, comprising:
The position of pasting inserted on circuit boards by components and parts according to inserting subsides, and print tin steel-screen is produced corresponding leakage tin hole; Described circuit board is PCB or PCBA;
Using described print tin steel-screen, Yin Xi is carried out to described circuit board, making tin cream stick to corresponding pad with on the top of inserting subsides hole and hole wall thereof by leaking tin hole;
Insert needing to plug in the components and parts pasted in corresponding slotting subsides hole, make to stick to insert the tin cream pasted above hole and on hole wall be pushed through insert the pin place of the components and parts of subsides;
The circuit board inserting components and parts is put into solder reflow device weld, described components and parts are formed with pad in circuit board front and welds, and make the tin cream being pushed through circuit board reverse side component's feet place form tin welding spot; Described tin welding spot is dome shape tin welding spot, is connected with welding lead or formed with circuit;
Described position of inserting subsides at circuit board according to the components and parts will inserting subsides specifically comprises:
According to insert subsides components and parts pad on circuit board correspondence position size and shape, insert the relative position pasted between the size and shape in hole and each pad;
Described producing on print tin steel-screen leaks tin hole accordingly, comprising:
Each is needed to insert the pad pasting components and parts, on print tin steel-screen, respective production goes out corresponding two leakage tin holes, described two to leak tin holes be upper and lower two relative arc settings, and leaving not perforate part between described two leakage tin holes, the height leaking tin hole described in each is 1/3 of corresponding pad diameter.
2. method according to claim 1, is characterized in that,
Described producing on print tin steel-screen leaks tin hole accordingly, also comprises:
Need to insert the pad pasting components and parts for each, on print tin steel-screen, respective production goes out corresponding plural leakage tin hole.
3. method according to claim 1, is characterized in that,
The described components and parts inserting subsides that will need insert in the slotting subsides hole of correspondence, comprising:
Chip mounter or inserter is used to insert needing the pin plugging in the components and parts pasted in corresponding slotting subsides hole.
4. the method according to any one of claims 1 to 3, is characterized in that,
Described pad is circular pad, and described slotting subsides hole is that circular inserting pastes hole.
5. the method according to any one of claims 1 to 3, is characterized in that,
Described print tin steel-screen has the leakage tin hole of all kinds of electronic devices and components of more than one attachment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210182031.4A CN102689065B (en) | 2012-06-05 | 2012-06-05 | A kind of welding method of circuit board element |
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| CN201210182031.4A CN102689065B (en) | 2012-06-05 | 2012-06-05 | A kind of welding method of circuit board element |
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| CN102689065A CN102689065A (en) | 2012-09-26 |
| CN102689065B true CN102689065B (en) | 2015-08-19 |
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| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
| CN104125721B (en) * | 2014-08-04 | 2017-02-01 | 太仓市同维电子有限公司 | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards |
| CN105234517B (en) * | 2015-10-31 | 2017-10-31 | 成都海沃斯电气技术有限公司 | The saturating welding hole of double-sided PCB board welds saturating tin method |
| CN105338757A (en) * | 2015-12-04 | 2016-02-17 | 深圳威迈斯电源有限公司 | Printed circuit board manufacturing method and printed circuit board |
| CN105578795A (en) * | 2015-12-16 | 2016-05-11 | 深圳市大德激光技术有限公司 | Automatic drag soldering method used for flexible bonding pads |
| CN106937490A (en) * | 2015-12-30 | 2017-07-07 | 马夸特开关(上海)有限公司 | A kind of process for printed circuit plate weld |
| CN106229370B (en) * | 2016-08-31 | 2017-10-24 | 福建省晶鼎光电股份有限公司 | Solar panel and its manufacture method |
| CN107665963A (en) * | 2017-10-23 | 2018-02-06 | 陈志勇 | Paster battery |
| CN107889374A (en) * | 2017-11-14 | 2018-04-06 | 北京计算机技术及应用研究所 | A kind of compensation reflow soldering method of the solder of via devices |
| CN109447280A (en) * | 2018-09-20 | 2019-03-08 | 国营芜湖机械厂 | A method of it is shaped for gull wing component fast and high quality |
| CN112153826A (en) * | 2019-06-28 | 2020-12-29 | 株洲中车时代电气股份有限公司 | Contact pin welding method |
| CN111315152A (en) * | 2019-11-27 | 2020-06-19 | 浪潮商用机器有限公司 | Welding method of PIH (plasma enhanced H) element |
| CN111482670B (en) * | 2020-05-27 | 2022-10-11 | 东莞市点精电子有限公司 | Electronic component soldering method |
| CN111654981A (en) * | 2020-07-02 | 2020-09-11 | 四川耀讯电子科技有限公司 | SMT reflow soldering process of PCBA flexible circuit board |
| CN112911826B (en) * | 2021-01-14 | 2022-05-24 | 苏州浪潮智能科技有限公司 | Uniform welding assembly for direct-insert pins |
| CN113923890B (en) * | 2021-09-16 | 2022-09-27 | 景旺电子科技(龙川)有限公司 | Circuit board mounting method and circuit board |
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