CN112911826B - Uniform welding assembly for direct-insert pins - Google Patents
Uniform welding assembly for direct-insert pins Download PDFInfo
- Publication number
- CN112911826B CN112911826B CN202110050041.1A CN202110050041A CN112911826B CN 112911826 B CN112911826 B CN 112911826B CN 202110050041 A CN202110050041 A CN 202110050041A CN 112911826 B CN112911826 B CN 112911826B
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- Prior art keywords
- pin
- direct
- metal sleeve
- extrusion
- hole
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- 238000003466 welding Methods 0.000 title claims abstract description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 48
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 238000001125 extrusion Methods 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 238000005476 soldering Methods 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 28
- 238000002844 melting Methods 0.000 claims abstract description 5
- 230000008018 melting Effects 0.000 claims abstract description 5
- 238000003780 insertion Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000004907 flux Effects 0.000 abstract description 7
- 230000035515 penetration Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a direct-insert pin uniform welding assembly which comprises a direct-insert pin and an extrusion pin, wherein the direct-insert pin is arranged on a component and is used for being inserted into a through hole in a PCB (printed circuit board) from top to bottom; the direct-insert pin comprises a metal sleeve and a solder column, the solder column is positioned in the metal sleeve and consists of soldering tin and soldering flux and can be melted into liquid when being heated, and a tin liquid through hole is formed in the side wall of the metal sleeve along the circumferential direction and the melted liquid can flow out from the tin liquid through hole; during assembly, the direct-insert pin is inserted into the through hole of the PCB, the extrusion pins are inserted into the metal sleeve from bottom to top, and the direct-insert pin is used for extruding molten tin formed by melting the solder columns from the molten tin through hole and enabling the molten tin to uniformly flow into a gap between the metal sleeve and the through hole of the PCB.
Description
Technical Field
The invention relates to the technical field of circuit board assembly, in particular to a direct-insert pin uniform welding assembly.
Background
Wave soldering is mainly used for welding plug-in components, and is characterized in that molten soft soldering flux (lead-tin alloy) is sprayed into a solder wave with design requirements through an electric pump or an electromagnetic pump, so that a printed board with components mounted in advance passes through the solder wave, and the soldering of mechanical and electrical connection between a soldering end or a pin of the components and a pad of the printed board is realized.
The solder rises from the lower part of a PCB (Printed Circuit Board), the tin penetration height of the through hole is ideally 100%, and if the tin penetration height is lower than 75%, the tin penetration is considered to be poor; poor tin penetration of wave soldering of the through holes is a serious quality problem, the physical reliability of connection of electronic components and PCBs is damaged, if poor tin penetration can cause great reduction of mechanical strength of soldering points, even conductive performance can be influenced, and the reliability of the soldering points is seriously reduced.
The reasons for poor tin penetration of the in-line pin mainly include the following reasons: 1. the direct-insert pins are connected to the large-area heat dissipation copper sheets, so that the pins are too fast in heat dissipation and low in tin climbing rate; 2. the cleaning degree of the solder paste and the soldering flux in the wave-soldering machine; 3. the length of the straight pin is too long to climb tin.
In the existing PCB design, the heat dissipation efficiency is reduced by reducing the number of layers of the large copper sheet connected with the direct-insert pins, so that the tin penetration rate is improved. And the solder paste and the soldering flux in the wave soldering machine are replaced regularly, so that the cleanliness of the wave soldering machine is kept. 3. And selecting different connectors according to the thickness of the PCB card.
The number of layers of the pins is reduced, and for some high-current connectors, the number of layers of the connecting copper sheets cannot be reduced due to the fact that the passing current ratio is large, and the later-stage manual repair welding can only be conducted. The periodic replacement of solder paste and flux in the wave soldering machine can cause waste of solder and environmental pollution. Different connectors are selected according to the thickness of the PCB, so that great limitation is generated when materials are selected, and the materials are not universal.
For those skilled in the art, how to ensure the soldering height of the solder is a technical problem to be solved at present.
Disclosure of Invention
The invention provides a direct-insert pin uniform welding assembly, which extrudes tin liquid in an extrusion mode to ensure uniform tin distribution, and the specific scheme is as follows:
a direct-insert pin uniform welding assembly comprises a direct-insert pin and an extrusion pin, wherein the direct-insert pin is arranged on a component and is used for being inserted into a through hole in a PCB from top to bottom;
the direct-insert pin comprises a metal sleeve and a solder column, the solder column is positioned in the metal sleeve, and a tin liquid through hole is formed in the side wall of the metal sleeve along the circumferential direction;
the extruding pin can be inserted into the metal sleeve from bottom to top and is used for extruding the molten tin formed by heating and melting the solder column out of the molten tin through hole.
Optionally, a fastener is fixedly installed inside the metal sleeve, and the fastener can be in fit clamping connection with the extrusion pins.
Optionally, a plurality of the fasteners are axially disposed inside the metal sleeve.
Optionally, the fastener is cylindrical, two elastic blocks are arranged on the inner wall of the fastener in a protruding mode, a clamping groove is formed in the circumferential direction of the outer surface of the extrusion pin in a recessed mode, and the elastic blocks are connected with the clamping groove in a matched and clamped mode.
Optionally, the upper end of the pressing pin is provided with a conical sharp block with the diameter gradually decreasing upwards.
Optionally, the extrusion pins are arranged on the needle bed in an array, and the positions of the extrusion pins correspond to the positions of the in-line pins one to one.
Optionally, the length of the in-line pin is less than or equal to the thickness of the PCB, and the overall length of the pressing pin inserted into the in-line pin is greater than the thickness of the PCB.
Optionally, the bottom end of the extrusion pin is clamped in a clamping groove arranged on the needle bed.
The invention provides a direct-insert pin uniform welding assembly which comprises a direct-insert pin and an extrusion pin, wherein the direct-insert pin is arranged on a component and is used for being inserted into a through hole in a PCB (printed circuit board) from top to bottom; the direct-insert pin comprises a metal sleeve and a solder column, the solder column is positioned in the metal sleeve and consists of soldering tin and soldering flux and can be melted into liquid when being heated, and a tin liquid through hole is formed in the side wall of the metal sleeve along the circumferential direction and the melted liquid can flow out from the tin liquid through hole; during assembly, the direct-insert pin is inserted into the through hole of the PCB, the extrusion pins are inserted into the metal sleeve from bottom to top, and the direct-insert pin is used for extruding molten tin formed by melting the solder columns from the molten tin through hole and enabling the molten tin to uniformly flow into a gap between the metal sleeve and the through hole of the PCB.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an overall block diagram of a straight pin uniform soldering assembly according to the present invention;
fig. 2 is a schematic cross-sectional view of a straight pin and its internal structure.
The figure includes:
the soldering tin soldering device comprises a straight pin 1, a metal sleeve 11, a tin liquid through hole 111, a soldering tin column 12, a buckling piece 13, an elastic block 131, an extrusion pin 2, a clamping groove 21, a conical pointed block 22, a needle bed 23 and a clamping groove 24.
Detailed Description
The core of the invention is to provide a direct-insert pin uniform welding assembly, which extrudes tin liquid in an extrusion mode to ensure uniform tin distribution.
In order to make those skilled in the art better understand the technical solution of the present invention, the straight pin uniform soldering assembly of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, which is an overall structure diagram of the in-line pin uniform soldering assembly provided by the present invention, a in the figure represents a PCB board, and B represents components; the invention discloses a direct-insertion pin uniform welding assembly, which comprises a direct-insertion pin 1 and extrusion pins 2, wherein the direct-insertion pin 1 is arranged on a component, a plurality of direct-insertion pins 1 are arranged on the component according to different requirements, the direct-insertion pins 1 are generally arranged in two rows, as shown in figure 1, each row is provided with a plurality of direct-insertion pins 1, and the direct-insertion pins 1 are used as a signal transmission structure between the component and a PCB.
The direct-insert pin 1 is used for being inserted into a through hole in a PCB from top to bottom, a copper sheet coating is arranged on the inner wall of the through hole in the PCB, and a certain gap is formed between the direct-insert pin 1 and the copper sheet. The directions indicated above and below are explained in the directions shown in the drawings, and do not limit the directions of actual operation.
As shown in fig. 2, it is a schematic cross-sectional view of a straight pin 1 and its internal structure; the in-line pin 1 comprises a metal sleeve 11 and a solder column 12, wherein the metal sleeve 11 is an external structure of the whole in-line pin 1, the metal sleeve 11 is a cylindrical structure made of metal and is hollow inside, and the solder column 12 is a columnar structure made of soldering tin and soldering flux and can be converted into tin liquid when the solder column 12 is heated. The outer diameter of the solder column 12 is smaller than the inner diameter of the metal sleeve 11, the solder column 12 is located inside the metal sleeve 11, and when the solder column 12 is melted, the tin liquid is filled in the inner cavity of the metal sleeve 11.
The side wall of the metal sleeve 11 is circumferentially provided with tin liquid through holes 111, the tin liquid through holes 111 are arranged at different axial heights of the metal sleeve 11, and tin liquid can flow out from different axial positions of the metal sleeve 11.
The extrusion pin 2 is of a columnar structure, the outer diameter of the extrusion pin 2 is smaller than the inner diameter of the metal sleeve 11, the extrusion pin 2 can be inserted into the metal sleeve 11 from bottom to top, and the extrusion pin 2 and the components are respectively positioned on two different side faces of the PCB; when the pressing pin is inserted into the metal sleeve 11, the space inside the metal sleeve 11 is occupied, so that the molten tin formed by melting the solder column 12 by heat is extruded from the molten tin through hole 111; because the metal sleeve 11 is inserted into the through hole of the PCB, after the tin liquid flows out of the tin liquid through hole 111, the tin liquid enters the gap between the metal sleeve 11 and the through hole on the PCB, namely the gap between the direct-insert pin 1 and the through hole on the PCB, and the tin liquid can be uniformly distributed at each position outside the direct-insert pin 1 by reasonably setting the opening position of the tin liquid through hole 111, so that the tin liquid is uniformly distributed; as shown in fig. 1, a plurality of circles of tin liquid through holes 111 are arranged at different height positions, each circle of tin liquid through hole 111 is composed of a plurality of small holes, and each tin liquid through hole 111 can discharge tin liquid.
Compared with the traditional wave soldering mode for components, the direct-insert pin 1 provided by the invention has the advantages that the tin is automatically soldered, and the molten tin overflows by the extrusion of the extrusion pins 2, so that the problem of insufficient tin climbing can be effectively solved, the molten tin is uniformly distributed at each position of the whole direct-insert pin 1 in the circumferential direction, and the yield of soldering is improved. For traditional wave-soldering form, need not soak the tin liquid with the PCB board, avoid polluting the tin liquid, ensure the cleanliness factor of the tin liquid that the welding adopted.
On the basis of the scheme, the buckling piece 13 is fixedly installed in the metal sleeve 11, the buckling piece 13 can be matched and clamped with the extruding pin 2, the position between the buckling piece 13 and the metal sleeve 11 is kept relatively fixed, the buckling piece 13 is used as one part of the metal sleeve 11, when the extruding pin 2 is matched and clamped with the buckling piece 13 to be fixed, the extruding pin 2 is limited in the metal sleeve 11, the extruding pin 2 is not pulled out after extruding the tin liquid, and the space in the metal sleeve 11 is occupied.
Preferably, a plurality of fasteners 13 are axially arranged inside the metal sleeve 11, each fastener 13 can be fixed relative to the pressing pins 2, the pressing pins 2 can be inserted into different depth positions according to the required amount of the extruded tin liquid, and the flexibility is higher.
Preferably, as shown in fig. 1, the fastener 13 of the present invention is cylindrical, two elastic blocks 131 are protruded from the inner wall of the fastener, the elastic blocks 131 are disposed oppositely, the outer surface of the extrusion pin 2 is recessed circumferentially to form a slot 21, and the elastic blocks 131 are engaged with the slot 21. The interval between two elastic blocks 131 slightly is less than the external diameter of extrusion stitch 2, and when extrusion stitch 2 inserted, the elastic block 131 of both sides was taken place elastic deformation by the extrusion, and two elastic blocks 131 are separated to both sides, and when draw-in groove 21 arrived the position at elastic block 131 place, during elastic block 131 kick-backed stretches into draw-in groove 21, will extrude stitch 2 locking.
Preferably, the upper end of the extrusion pin 2 is provided with a tapered point block 22 with a diameter gradually decreasing upwards, that is, the end of the extrusion pin 2 inserted into the metal sleeve 11 is of a tapered structure, so that the insertion into the metal sleeve 11 can be aligned more easily.
On the basis of any one of the technical schemes and the mutual combination thereof, the extrusion pins 2 are arranged on the needle bed 23 in an array manner, the positions of the extrusion pins 2 correspond to the positions of the straight pins 1 one by one, when the tin liquid needs to be extruded, all the extrusion pins 2 are synchronously aligned and inserted through the needle bed 23, and the one-time operation is realized.
As shown in fig. 1, the length of the in-line pin 1 is less than or equal to the thickness of the PCB, the overall length formed by the extrusion pin 2 inserted into the in-line pin 1 is greater than the thickness of the PCB, and the insufficient part of the in-line pin 1 is filled up by the extrusion pin 2.
Specifically, the bottom end of the extrusion pin 2 in the invention is clamped in the clamping groove 24 arranged on the needle bed 23, after the extrusion pin 2 is clamped with the fastener 13, the needle bed 23 is pulled outwards to separate from the extrusion pin 2, the extrusion pin 2 is left in the metal sleeve 11, and if the overall length formed by inserting the extrusion pin 2 into the straight pin 1 is too large, the overlong part can be cut off.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The direct-insert pin uniform welding assembly is characterized by comprising a direct-insert pin (1) and an extrusion pin (2), wherein the direct-insert pin (1) is arranged on a component and is used for being inserted into a through hole in a PCB (printed circuit board) from top to bottom;
the direct-insertion pin (1) comprises a metal sleeve (11) and a solder column (12), the solder column (12) is located in the metal sleeve (11), and a tin liquid through hole (111) is formed in the side wall of the metal sleeve (11) along the circumferential direction;
the extruding pin (2) can be inserted into the metal sleeve (11) from bottom to top and is used for extruding the molten tin formed by heating and melting the solder column (12) out of the molten tin through hole (111).
2. The in-line pin uniform welding assembly according to claim 1, wherein a fastener (13) is fixedly mounted inside the metal sleeve (11), and the fastener (13) can be matched and clamped with the extruded pin (2).
3. The in-line pin leveling solder assembly according to claim 2, wherein a plurality of the snap-together members (13) are axially disposed inside the metal sleeve (11).
4. The straight pin uniform welding assembly according to claim 2, wherein the fastening member (13) is cylindrical, two elastic blocks (131) are convexly arranged on the inner wall of the fastening member, a clamping groove (21) is circumferentially arranged on the outer surface of the extrusion pin (2) in a concave manner, and the elastic blocks (131) are matched and clamped with the clamping groove (21).
5. The in-line pin leveling weld assembly according to claim 4, wherein the upper end of the press pin (2) is provided with a tapered tip (22) that tapers in diameter upward.
6. The in-line pin uniform welding assembly according to any one of claims 1 to 5, characterized in that the extrusion pins (2) are arranged in an array on a needle bed (23), and the positions of the extrusion pins (2) correspond to the positions of the in-line pins (1) in a one-to-one manner.
7. The in-line pin uniform soldering assembly according to claim 6, wherein the length of the in-line pin (1) is less than or equal to the thickness of the PCB plate, and the overall length of the extrusion pins (2) inserted into the in-line pin (1) is greater than the thickness of the PCB plate.
8. The in-line pin uniform welding assembly according to claim 6, characterized in that the bottom ends of the extrusion pins (2) are clamped in clamping grooves (24) arranged on the needle bed (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110050041.1A CN112911826B (en) | 2021-01-14 | 2021-01-14 | Uniform welding assembly for direct-insert pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110050041.1A CN112911826B (en) | 2021-01-14 | 2021-01-14 | Uniform welding assembly for direct-insert pins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112911826A CN112911826A (en) | 2021-06-04 |
| CN112911826B true CN112911826B (en) | 2022-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110050041.1A Active CN112911826B (en) | 2021-01-14 | 2021-01-14 | Uniform welding assembly for direct-insert pins |
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| Country | Link |
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| CN (1) | CN112911826B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113600955B (en) * | 2021-07-22 | 2022-07-22 | 苏州浪潮智能科技有限公司 | Printed circuit board pin welding auxiliary device |
| CN113921224B (en) * | 2021-09-10 | 2023-12-12 | 厦门伊科电子有限公司 | SMD inductor |
| CN113828888B (en) * | 2021-10-12 | 2023-03-14 | 天长市祥威机电设备有限公司 | Coil pin tin dispensing equipment |
| CN114025482B (en) * | 2021-10-29 | 2023-07-14 | 苏州浪潮智能科技有限公司 | Welding structure and circuit board |
| CN114043028B (en) * | 2021-11-05 | 2023-04-07 | 苏州浪潮智能科技有限公司 | Direct-insertion part tin-coating optimized welding method and system |
| CN115740675A (en) * | 2022-11-24 | 2023-03-07 | 惠州市乐亿通科技有限公司 | Auxiliary welding method for PCB and electronic device plug by using white vinegar |
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| CN102291945A (en) * | 2011-08-11 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Through-hole reflow soldering method |
| CN102689065A (en) * | 2012-06-05 | 2012-09-26 | 深圳珈伟光伏照明股份有限公司 | Method for welding circuit board components |
| CN103152996A (en) * | 2013-02-06 | 2013-06-12 | 南京同创电子信息设备制造有限公司 | Through hole reflowing process used for dense-spacing long gold-plated pins |
| CN108834331A (en) * | 2018-07-09 | 2018-11-16 | 中国船舶重工集团公司第七0九研究所 | A kind of method of Pin-through-hole reflow soldering |
-
2021
- 2021-01-14 CN CN202110050041.1A patent/CN112911826B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291945A (en) * | 2011-08-11 | 2011-12-21 | 广东威创视讯科技股份有限公司 | Through-hole reflow soldering method |
| CN102689065A (en) * | 2012-06-05 | 2012-09-26 | 深圳珈伟光伏照明股份有限公司 | Method for welding circuit board components |
| CN103152996A (en) * | 2013-02-06 | 2013-06-12 | 南京同创电子信息设备制造有限公司 | Through hole reflowing process used for dense-spacing long gold-plated pins |
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| CN112911826A (en) | 2021-06-04 |
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