CN219876283U - Bridge wire bonding pad structure of electronic detonator - Google Patents
Bridge wire bonding pad structure of electronic detonator Download PDFInfo
- Publication number
- CN219876283U CN219876283U CN202321022885.6U CN202321022885U CN219876283U CN 219876283 U CN219876283 U CN 219876283U CN 202321022885 U CN202321022885 U CN 202321022885U CN 219876283 U CN219876283 U CN 219876283U
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- CN
- China
- Prior art keywords
- bridge wire
- bonding pad
- hole
- bar
- short
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005476 soldering Methods 0.000 abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000026683 transduction Effects 0.000 abstract description 2
- 238000010361 transduction Methods 0.000 abstract description 2
- 239000000155 melt Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A bridge wire bonding pad structure of an electronic detonator belongs to the bonding pad design technology. The bonding pad on the double-layer and above PCB board comprises two symmetrical halves, each half upper end is a horizontal short bar, the outer ends of the short bars are vertically folded downwards and extend to form a vertical long bar with steps, the inner ends of the two short bars are opposite at intervals, the distance between the two vertical long bars is equal to the distance between two feet of a bridge wire, a through hole is formed in the inner right angle of the connecting part of each short bar and the corresponding long bar, and a through hole is also formed in the right angle of the step of each long bar. The aperture of the through hole should be 0.25 mm-0.35 mm, and most preferably 0.3mm. When the soldering paste melts, the bridge wire bonding pad leaks tin at the position of the through hole to generate stress release of corresponding points, and the transduction element (bridge wire) is positioned at the accurate position of the device under the stress release of a plurality of points. The utility model can effectively prevent the position deviation during the reflow soldering of the bridge wire.
Description
Technical Field
The utility model belongs to the pad design technology.
Background
The SMT process flow comprises silk screen printing, reflow soldering, cleaning, detecting and repairing. The screen printing is to print soldering paste on a bonding pad of the PCB, and after the soldering paste is mounted, the soldering paste is melted through reflow soldering, so that the surface-mounted component and the PCB are firmly bonded together.
In the production process of the electronic detonator module, the applicant of the patent can lead the upper, lower, left and right positions of the device to deviate due to melting of soldering paste, and the PCB is scrapped.
The patent application document with the application number of CN201210011644 discloses a method for designing bonding pads of a chip component, and proposes to divide a bonding pad solder mask layer into N equal parts, and arrange through hole arrays at adjacent positions of the divided bonding pad solder mask layers, so as to prevent the chip component from shifting during the reflow soldering process. However, the applicant found that if the through hole array is arranged according to the technical scheme, the problem of position deviation during reflow soldering of the bridge wire of the electronic detonator module cannot be effectively solved.
Disclosure of Invention
The utility model aims at: a bridge wire bonding pad structure of an electronic detonator is provided to prevent the position deviation during the reflow soldering of the bridge wire.
The bridge wire bonding pad structure of the utility model is as follows: the bonding pad on the double-layer and above PCB board comprises two symmetrical halves, each half upper end is a horizontal short bar, the outer ends of the short bars are vertically folded downwards and extend to form a vertical long bar with steps, the inner ends of the two short bars are opposite at intervals, the distance between the two vertical long bars is equal to the distance between two feet of a bridge wire, a through hole is formed in the inner right angle of the connecting part of each short bar and the corresponding long bar, and a through hole is also formed in the right angle of the step of each long bar.
The results of multiple experiments show that when solder paste is melted, tin leaks from the bridge wire bonding pad at the through hole to release stress of corresponding points, and the transduction element (bridge wire) is positioned at the accurate position of the device under the stress release of a plurality of points.
Through multiple experiments, the aperture (diameter) of the through hole is 0.25-0.35 mm, so that the purpose of the utility model can be achieved, and the aperture of 0.3mm is the best.
The utility model has the beneficial effects that: can prevent the position deviation during the reflow soldering of the bridge wire.
Drawings
Fig. 1 is a schematic diagram of a bridge wire front view structure in an embodiment.
Fig. 2 is a schematic diagram of a front view of a bridge wire bonding pad according to an embodiment.
Fig. 3 is a schematic diagram of a front view structure of a bridge wire and a bonding pad after reflow soldering according to an embodiment.
Detailed Description
See the embodiments of fig. 1-3. The bonding pad on the double-layer PCB 1 is composed of two symmetrical halves, the upper end of each half is a horizontal short bar 2, the outer ends of the short bars 2 are vertically folded downwards to extend into vertical long bars 3 with steps, the inner ends of the two short bars 2 are opposite at intervals, the distance between the two vertical long bars 3 is equal to the distance between two feet 5 of the bridge wire 4, a through hole 6 is formed in the inner right angle of the connecting part of each short bar 2 and the corresponding long bar 3, and a through hole 7 is also formed in the right angle of the step of each long bar 3. The diameters of the through holes 6 and 7 are 0.3mm, and the distance a is 2.4mm in fig. 2. The vertical distance between the through holes 6 and the centers of the through holes 7 on each half pad is 1.70mm, and the center distance between the two through holes 6 is 1.20mm.
The above embodiment is merely one specific example of the present utility model, but the scope of the present utility model is not limited to the illustrated embodiment.
Claims (2)
1. Bridge wire bonding pad structure of electronic detonator, this bridge wire bonding pad has double-deck and above PCB board, its characterized in that: the bonding pad on the double-layer and above PCB board comprises two symmetrical halves, each half upper end is a horizontal short bar, the outer ends of the short bars are vertically folded downwards and extend to form a vertical long bar with steps, the inner ends of the two short bars are opposite at intervals, the distance between the two vertical long bars is equal to the distance between two feet of a bridge wire, a through hole is formed in the inner right angle of the connecting part of each short bar and the corresponding long bar, a through hole is also formed in the right angle of the step of each long bar, and the aperture of the through hole is 0.25-0.35 mm.
2. The bridge wire bonding pad structure of an electronic detonator as claimed in claim 1 wherein: the aperture of the through hole is 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321022885.6U CN219876283U (en) | 2023-05-01 | 2023-05-01 | Bridge wire bonding pad structure of electronic detonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321022885.6U CN219876283U (en) | 2023-05-01 | 2023-05-01 | Bridge wire bonding pad structure of electronic detonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876283U true CN219876283U (en) | 2023-10-20 |
Family
ID=88337657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321022885.6U Active CN219876283U (en) | 2023-05-01 | 2023-05-01 | Bridge wire bonding pad structure of electronic detonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876283U (en) |
-
2023
- 2023-05-01 CN CN202321022885.6U patent/CN219876283U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |