CN216122991U - Resistance welding windowing structure used before electroplating nickel and gold on pcb (printed circuit board) - Google Patents
Resistance welding windowing structure used before electroplating nickel and gold on pcb (printed circuit board) Download PDFInfo
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- CN216122991U CN216122991U CN202122430669.2U CN202122430669U CN216122991U CN 216122991 U CN216122991 U CN 216122991U CN 202122430669 U CN202122430669 U CN 202122430669U CN 216122991 U CN216122991 U CN 216122991U
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Abstract
The utility model discloses a solder resist windowing structure before electroplating nickel and gold on a pcb (printed circuit board), which relates to the technical field of pcb manufacturing and comprises the following steps: the circuit board comprises a circuit board substrate and an insulating layer covering the circuit board substrate, wherein a plurality of exposed bonding pads are arranged on the insulating layer, insulating slide rails are arranged on the exposed bonding pads, sliding grooves are formed in the upper surfaces of the insulating slide rails, preset holes which penetrate through the insulating slide rails and correspond to the exposed bonding pads are formed in the bottoms of the sliding grooves, sliding seats are connected in the sliding grooves in a sliding mode, through holes are formed in the sliding seats, and the through holes can correspond to the preset holes through sliding of the sliding seats. According to the utility model, the insulating slide rail is arranged above the exposed bonding pad, the slide rail is provided with the slide groove, the slide seat is arranged in the slide groove, and the slide seat is provided with the through hole connected with the exposed bonding pad, so that the phenomenon that the trailing phenomenon is easy to occur in the solder resisting windowing process can be avoided according to the type of the mounted electronic component, the short circuit of the pcb caused by the trailing phenomenon can be avoided, and the production cost of the pcb is reduced to a certain extent.
Description
Technical Field
The utility model relates to the technical field of pcb manufacturing, in particular to a solder mask windowing structure before electroplating nickel and gold on a pcb.
Background
Along with the popularization and wide application of electronic products, the production and manufacturing technology of printed circuit boards is also continuously updated and developed, various electronic components and chips are arranged on the printed circuit boards, part of the chips need to be isolated from the outside so as to prevent the electric performance from being reduced due to the corrosion of impurities in the air to the chip circuits, and two ways are adopted for welding the electronic components, wherein one way is to arrange through holes on a pcb and tin-weld pins of the electronic components through the through holes and through the other side of the pcb; another way is to solder mask the pcb, i.e. remove the green oil in the area to be soldered to leak out of the pad and solder the electronic component directly onto the pad. However, the solder mask window structure is more critical in the solder mask window design process, otherwise a tailing phenomenon, namely a general tombstone effect, occurs in the window opening area. The appearance of trailing phenomenon leads to pcb's short circuit easily, causes the damage of pcb board, also seriously influences pcb's outward appearance simultaneously, and then has increased the production of defective products rate, also increases the input and the cost of production, and in addition, the pcb board adopts to hinder welds windowing technique welding electronic components inefficiency, and appears the rosin joint phenomenon easily.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a solder mask windowing structure before plating nickel and gold on a pcb, which aims to solve one of the problems in the background art, avoid the tailing phenomenon of the solder mask windowing structure from easily causing short circuit of the pcb, further increase the production cost of the pcb, and simultaneously improve the welding efficiency of electronic components and ensure the welding quality of the electronic components.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a soldering-resistant windowing structure of a pcb board before being plated with nickel and gold comprises: circuit board base plate and cover insulating layer on the circuit board base plate, a plurality of exposed pads have on the insulating layer, be provided with insulating slide rail on the exposed pad, the upper surface of insulating slide rail has the spout, the bottom of spout has runs through insulating slide rail and with the hole of predetermineeing that exposed pad corresponds, sliding connection has the sliding seat in the spout, the through-hole has on the sliding seat, through the slip of sliding seat, the through-hole can with it corresponds to predetermine the hole.
Furthermore, a conductive column connected with the exposed bonding pad is arranged in the preset hole.
Furthermore, the cross section area of one end of the conductive column close to the exposed bonding pad completely covers the area of the exposed bonding pad, and the conductive column is fixedly connected with the corresponding exposed bonding pad.
Furthermore, each sliding seat is provided with two mutually independent through holes, and one end of each through hole close to the corresponding conductive column falls in the circle where the end face of the corresponding conductive column is located.
Further, each of the insulating sliding rails covers one or more of the exposed bonding pads.
Further, the inner wall of the sliding groove is a concave part, and the bottom end of the sliding seat is provided with a convex part matched with the concave part.
Compared with the prior art, the utility model discloses a solder-resisting windowing structure before plating nickel and gold on a pcb, by arranging the insulating slide rail above the exposed bonding pad, the slide rail is provided with the slide groove, the slide seat is arranged in the slide groove, the slide seat is provided with the through hole connected with the exposed bonding pad, and further according to the type of the mounted electronic component, a certain number of sliding seats are arranged in the sliding chute, pins of the electronic components are inserted into the through holes on the sliding seats and connected with the exposed bonding pads, finally, the sliding seats and the through holes are packaged to realize the connection of the electronic components and the circuit board substrate, and simultaneously, this hinder and weld windowing structure can avoid hindering and weld the emergence that the tailing phenomenon appears in the windowing in-process easily, and then can stop because the short circuit of the pcb board that the tailing phenomenon leads to reduces the manufacturing cost of pcb board to a certain extent.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a solder mask windowing structure of a pcb board provided by the utility model before being electroplated with nickel and gold;
FIG. 2 is a schematic structural diagram of a solder mask windowing structure provided by the utility model at another viewing angle before a pcb board is electroplated with nickel and gold;
FIG. 3 is a cross-sectional view A-A of FIG. 2 according to the present invention;
fig. 4 is a partial enlarged view of C in fig. 3 according to the present invention.
Wherein: 1 is a circuit board substrate; 2 is an insulating layer; 3 is an exposed bonding pad; 4 is an insulating slide rail; 5 is a chute; 6 is a sliding seat; 7 is a through hole; and 8, a conductive column.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an embodiment of the present invention discloses a solder mask windowing structure before plating a pcb with nickel and gold, including: the circuit board comprises a circuit board substrate 1 and an insulating layer 2 covering the circuit board substrate 1, wherein the insulating layer 2 is a green oil layer, the insulating layer 2 is provided with a plurality of exposed bonding pads 3, the exposed bonding pads 3 are used for welding electronic components, the exposed bonding pads 3 are provided with insulating slide rails 4, the areas of the exposed bonding pads 3 can be completely covered by the insulating slide rails 4, the upper surface of each insulating slide rail 4 is provided with a slide groove 5, the bottom of each slide groove 5 is provided with a preset hole which penetrates through the corresponding insulating slide rail 4 and corresponds to the corresponding exposed bonding pad 3, a slide seat 6 is connected in the slide groove 5 in a sliding mode, the slide seat 6 is provided with a through hole 7, through sliding of the slide seat 6, the through hole 7 can correspond to the preset hole, the inner wall of the slide groove 5 is a concave part, the bottom end of the slide seat 6 is provided with a convex part which is matched with the concave part, preferably, the slide groove 5 is of an inverted T-shaped structure, the slide seat 6 is of an I-shaped structure, through the arrangement, the sliding seat 6 can be ensured to slide stably along the sliding rail.
In this embodiment, a conductive post 8 connected to the exposed pad 3 is disposed in the predetermined hole, the cross-sectional area of one end of the conductive post 8 close to the exposed pad 3 completely covers the area of the exposed pad 3, and the conductive post 8 is fixedly connected to the corresponding exposed pad 3, wherein the cross-sectional shape of the predetermined hole is rectangular or trapezoidal, each sliding seat 6 is provided with two through holes 7 independent of each other, one end of the through hole 7 close to the conductive post 8 falls within a circle where the end surface of the conductive post 8 is located, by the configuration of the structure, it is ensured that the pin of the electronic component to be mounted can contact with the conductive post 8 after being inserted from the through hole 7, in addition, according to the number of pins of the electronic component to be mounted, a plurality of sliding seats 6 can be disposed side by side to provide the corresponding number of through holes 7 for the pins of the electronic component, and finally the sliding seats 6 are packaged in the sliding chute 5 by hot melt adhesive, and meanwhile, the through holes 7 into which the pins of the electronic component are inserted are also packaged and fixed, so that the connection firmness of the pins of the electronic component and the conductive posts 8 is ensured.
In the above embodiments, each insulating slide rail 4 covers one or more exposed pads 3, i.e. the length and position of the insulating slide rail 4 can be adjusted according to the position of the exposed pad 3.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. The utility model provides a structure of windowing is hindered to hinder before nickel gold plating of pcb board, its characterized in that includes: circuit board base plate and cover insulating layer on the circuit board base plate, a plurality of exposed pads have on the insulating layer, be provided with insulating slide rail on the exposed pad, the upper surface of insulating slide rail has the spout, the bottom of spout has runs through insulating slide rail and with the hole of predetermineeing that exposed pad corresponds, sliding connection has the sliding seat in the spout, the through-hole has on the sliding seat, through the slip of sliding seat, the through-hole can with it corresponds to predetermine the hole.
2. The structure of claim 1, wherein the predetermined holes are provided with conductive posts connected to the exposed bonding pads.
3. The structure of claim 2, wherein a cross-sectional area of one end of the conductive post, which is close to the exposed pad, completely covers an area of the exposed pad, and the conductive post is fixedly connected to the corresponding exposed pad.
4. The solder mask window structure of the pcb board before being electroplated with Ni and Au as claimed in claim 3, wherein each sliding seat has two independent through holes, and one end of the through hole close to the conductive post falls within the circle of the end face of the conductive post.
5. A solder mask window structure of a pcb board before being electroplated with ni-au according to claim 1, wherein each of the insulating slide rails covers one or more of the exposed pads.
6. The structure of claim 1, wherein the inner wall of the sliding groove is a concave part, and the bottom end of the sliding seat is provided with a convex part matched with the concave part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122430669.2U CN216122991U (en) | 2021-10-09 | 2021-10-09 | Resistance welding windowing structure used before electroplating nickel and gold on pcb (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122430669.2U CN216122991U (en) | 2021-10-09 | 2021-10-09 | Resistance welding windowing structure used before electroplating nickel and gold on pcb (printed circuit board) |
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| Publication Number | Publication Date |
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| CN216122991U true CN216122991U (en) | 2022-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122430669.2U Active CN216122991U (en) | 2021-10-09 | 2021-10-09 | Resistance welding windowing structure used before electroplating nickel and gold on pcb (printed circuit board) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116867179A (en) * | 2023-09-05 | 2023-10-10 | 上海贺鸿电子科技股份有限公司 | BGA solder mask windowing structure with fixing and detachable functions |
-
2021
- 2021-10-09 CN CN202122430669.2U patent/CN216122991U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116867179A (en) * | 2023-09-05 | 2023-10-10 | 上海贺鸿电子科技股份有限公司 | BGA solder mask windowing structure with fixing and detachable functions |
| CN116867179B (en) * | 2023-09-05 | 2023-11-21 | 上海贺鸿电子科技股份有限公司 | BGA solder mask windowing structure with fixing and detachable functions |
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