CN101345363A - Terminal structure for preventing tin climbing - Google Patents
Terminal structure for preventing tin climbing Download PDFInfo
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- CN101345363A CN101345363A CNA2007101284246A CN200710128424A CN101345363A CN 101345363 A CN101345363 A CN 101345363A CN A2007101284246 A CNA2007101284246 A CN A2007101284246A CN 200710128424 A CN200710128424 A CN 200710128424A CN 101345363 A CN101345363 A CN 101345363A
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Abstract
The invention provides a terminal structure which can prevent tin bonding; the terminal passes through the slot of an insulated base and extends out of the exterior of the insulated base so as to form a welding part; the appearance of the terminal is processed as an electro-plating layer; the terminal is provided with a naked area which is formed by the laser etching at the internal side of the welding part; furthermore, the naked area is provided with a tin collecting trough which prevents the tin bonding during the welding process of the welding part. Tin liquid is collected when the welding is carried out at the welding part, thus achieving the object of preventing the tin bonded to the terminal and avoiding the short circuit phenomenon of the terminal or the structural change of the terminal.
Description
Technical field
The present invention relates to a kind of terminal structure, be meant a kind of connector terminal structure especially.
Background technology
Electronics technology fast development now, various electronic products, audio-visual devices, desktop computer or notebook computer be prevalent in each corner in the society already, and effective utilization more and more adds powerful, the speed of service is also quick day by day, its main cause is that the dealer drops into mental and physical efforts in a large number and researches and develops and promote due to the product function, and be the operating capability of strengthening electronic product, then in electronic product, set up more electronic component, electronic installation, and because various electronic components, the increase of electronic installation, promptly must cooperate multilayer circuit board for various electronic components, electronic installation layout is set, yet, various electronic components, electronic installation is desired to be installed on the circuit board, all must utilize the mode solid welding of welding on circuit board.(but this is example with the connector to general electronic installation, but electronic installation is not limited to connector) be welded on the mode on the circuit board: the one, the mode (Through Hole) of passing circuit board with terminal, with terminal rectilinear pierce through the oversampling circuit plate after, link with the circuit board solid welding again, bonder terminal and circuit on the circuit board are are electrically connected; Another kind of mode then is to utilize surface adhering technology (Surface Mounting Technology, be called for short SMT), terminal is horizontal mode to being positioned at the contact (Pad) on the circuit board, can be with terminal and circuit board solder joint, be for the terminal of connector and circuit junction on the circuit board and be electrically connected.And for convenience with a large amount of electronic installation solid weldings on circuit board, utilize surface adhering technology (SMT) that positive and negative two faces of circuit board are followed electronic installation at present mostly, its processing procedure is elder generation's more coated conducting mediums (be generally and use tin cream) on circuit board, again electronic installation is placed on the circuit board, the last barbecue that will cross high temperature furnace again makes the conducting medium fusing and attached on terminal and the circuit board, after the conducting medium condensation, terminal is fixed on the contact of circuit board is electrical connection.
Because the terminal of connector is to be fixed on the circuit board, therefore the insulation shell of connector must have holding channel to be set in the connector by terminal, if the holding channel opening of insulation shell is very near circuit board, then when circuit board when crossing high temperature furnace, conducting medium becomes and can produce siphonage along the holding channel of terminal and insulation shell, and this phenomenon (being commonly referred to as solder overflow) often all can cause the short-circuit of terminals or cause the structural strength of terminal to change; Moreover, no matter the volume of various electronic equipment mobile phones or computer, more and more littler trend is all arranged, therefore the dealer has also relatively designed some and can effectively save the space and reach light, thin, short, little connector, or connector device is located at positive and negative two of circuit board, and will need the circuit board spaces that are used for device connector reduced originally more, even it is little a lot of that whole electronic installation, connector and several terminals can become, also just more increased the degree of difficulty of electronic installation and circuit board weld job certainly.
And the dealer is when terminal and circuit board carry out weld job, can produce the phenomenon of the tin that overflows, then develop " terminal structure of electronic installation " novel patent case as TaiWan, China certificate number: M262869 number, application case number No. 93213913, described patent case is to offer novel patent application on September 1st, 2004, and check and approve neck card back bulletin on the patent gazette on April 21st, 2005, see also shown in Figure 10, it is the three-dimensional exploded view of existing electronic installation, be to be to be provided with the storage tank A1 that can wear the location in insulating base frame A for terminal B, and terminal B is for having weld part B1 and docking section B3 respectively, and be provided with short slot B11 at weld part B1, B3 place, docking section then forms groove B31, it is characterized in that:
Described terminal B forms the segment difference section B2 of one or more tool height shapes for utilizing impact style, can utilize segment difference section B2 to block the solder overflow that the gap produced of terminal B and storage tank A1.
Yet still there are many disappearances what follows in the terminal B of above-mentioned patent case when reality is used, as:
(1) terminal B is provided with segment difference section B2 at weld part B1 and B3 cohesive position place, docking section, but terminal B must have suitable thickness, just can punching press form segment difference section B2, but connector is a main shaft with light, thin, short, little design concept now, so the also necessary attenuation of the thickness of terminal B just can wear several terminals B in the connector insulating base frame A that diminishes.But, once the thickness attenuation of terminal B, punching press to be processed to form then suitable difficulty of segment difference section B2, promptly can't meet the designing requirement of connector.
(2) the segment difference section B2 of terminal B utilizes stamped to form, but the volume of terminal B and little, and excessive because of the punching press power easily in the punching press processing procedure is even the segment difference section B2 of terminal B fracture then causes the lifting of product disqualification rate.
(3) terminal B forms segment difference section B2 in the dual-side punching press, and it is average to add the segment difference section B2 symmetry that must make terminal B both sides man-hour, otherwise can cause the left and right inequality of terminal B to influence the degree of balance of terminal B, and makes terminal B become substandard product.
" reducing the structure of solder overflow of electronic device terminals " patent of invention case for another No. 469679, TaiWan, China notification number, application case number No. 89119947, described patent case is to offer application for a patent for invention on September 27th, 2000, and check and approve bulletin on the patent gazette in December 21 calendar year 2001, see also shown in Figure 11, it is the side cutaway view of another existing electronic installation, it is provided with that holding channel C1 passes through for terminal D and fixing at insulation shell C, terminal D then utilizes fixed connecting end D1 to be with circuit board E and is electrically connected, and at least one section surface of fixed connecting end D1 of terminal D exposes outside insulation shell C and circuit board E, it is characterized in that:
The fixed connecting end D1 of described terminal D is provided with solder collecting hole D3 in the opening part outside near the inboard holding channel C1 of insulation shell C, rely on solder collecting hole D3 can concentrate the tin liquor E1 that produces siphonage, and can make tin liquor E1 accumulation and be condensate in this solder collecting hole D3 place, and avoid tin liquor E1 to spread towards the butt end D2 direction of terminal D.
The terminal D of right above-mentioned patent case, be to be located in the holding channel C1 of insulation shell C, only utilize the fixed connecting end D1 edge that exposes outside the insulation shell C to weld, and tin liquor E1 is spread to solder collecting hole D3 in holding channel C1 with fixed connecting end D1, but still have many disappearances, as:
(1) the holding channel C1 of insulation shell C has quite long distance, then the fixed connecting end D1 of terminal D also has equivalent length to penetrate in the holding channel C1, then tin liquor E1 will have holding channel C1 to spread to solder collecting hole D3 place toward in outward, the consumption of tin liquor E1 causes processing cost to improve more than the consumption of general welding.
(2) the holding channel C1 of insulation shell C has long distance, after the fixed connecting end D1 for terminal D penetrates, when fixed connecting end D1 welds with tin liquor E1, tin liquor E1 enters the phenomenon that is easy to generate obstruction in the holding channel C1, assembles, and the crowded crooked situation of terminal D generation that pushes away, cause the quality of product and disqualification rate is promoted.
Again as shown in figure 12, it is the side cutaway view of another existing electronic installation, the terminal G that its connector insulation shell F accommodates in holding channel F1, it is the mode of passing through the perforation H1 of circuit board H with fixed connecting end G1, again with tin cream H2 solid welding fixed connecting end G1 with the perforation H1 above, and mainly be that holding channel F1 is shortened, and make the opening of holding channel F1 leave circuit board H one segment distance, too serious with the phenomenon of avoiding excessive tin; Right because the volume of electronic installation is more and more littler, and insulation shell F does not have too many space to stand away for holding channel F1 and circuit board H yet, still there be inconvenience and the disappearance when using in this kind structure.
The terminal of above-mentioned existing electronic installation improves the structure of the tin that overflows, for utilizing impact style to form the segment difference section in the terminal both sides, but must consider balance and processing problems, then take too many space as for the mode of utilizing holding channel to prolong excessive tin, quite consuming time taking a lot of work when not only making, also can produce the excessive problem of volume during use, need be improved in fact, this is the inventor and the target place of being engaged in this journey improvement that the dealer desires most ardently.
Summary of the invention
At the deficiencies in the prior art, the objective of the invention is to: a kind of terminal structure that prevents to climb tin is provided, can when welding, gathers tin liquor, prevent from terminal, to produce and climb tin, improve the production qualification rate.
For achieving the above object, the technical solution used in the present invention is:
A kind of terminal structure that prevents to climb tin, described terminal is located in the slot of an insulating base, and extend the outside weld part that forms of insulating base frame, described terminal appearance has been processed to form electrodeposited coating, it is characterized in that: described terminal is provided with the naked dead zone that utilizes the laser-induced thermal etching moulding in the inboard of weld part, and naked dead zone is to have the collection molten tin bath that can prevent to climb tin for weld part when welding.
Compared with prior art, the beneficial effect that the present invention has is: weld part gathers tin liquor when welding, prevents to produce on several terminals to climb tin, and can avoid several terminals generation short circuit phenomenon or cause the structure of several terminals to change.
Description of drawings
Fig. 1 is a three-dimensional exploded view of the present invention;
Fig. 2 is the side cutaway view before the etching of the present invention;
Fig. 3 is the side cutaway view after the etching of the present invention;
Fig. 4 is a stereo appearance figure of the present invention;
Fig. 5 is the side cutaway view of weld part before welding of terminal of the present invention;
Fig. 6 is the side cutaway view of weld part after welding of terminal of the present invention;
Fig. 7 is the side cutaway view of preferred embodiment of the present invention;
Fig. 8 is the side cutaway view of yet another embodiment of the invention;
Fig. 9 is the stereo appearance figure of another embodiment of the present invention;
Figure 10 is the three-dimensional exploded view of existing electronic installation;
Figure 11 is the side cutaway view of another existing electronic installation;
Figure 12 is the side cutaway view of another existing electronic installation;
Description of reference numerals: 1-insulating base frame; The 11-accommodation space; The 112-wall; The 111-slot; The 12-clamping slot; The 2-terminal; The 21-docking section; The 24-Gold plated Layer; The 22-weld part; The naked dead zone of 25-; The 23-nickel coating; 251-collection molten tin bath; The 3-circuit board; The 31-contact; The 32-tin liquor; The 311-perforation; 4-laser-induced thermal etching machine; The A-insulating base frame; The A1-storage tank; The B-terminal; The B1-weld part; The B3-docking section; The B11-short slot; The B31-groove; The B2-segment difference section; The C-insulation shell; The C1-holding channel; The D-terminal; The D1-fixed connecting end; The D3-solder collecting hole; The D2-butt end; The E-circuit board; The E1-tin liquor; The F-insulation shell; The F1-holding channel; The G-terminal; The G1-fixed connecting end; The H-circuit board; The H1-perforation; The H2-tin cream.
Embodiment
See also Fig. 1～shown in Figure 3, be the side cutaway view before three-dimensional exploded view of the present invention, the etching, the side cutaway view after the etching, find out that by knowing shown in the figure terminal structure of the present invention is to comprise that insulating base frame 1, several terminals 2 etc. form, wherein:
Described insulating base frame 1 is to have accommodation space 11 in inside, and is to be provided with several slots 111 in accommodation space 11, and with respect to the outside of several slots 111 at the wall 112 past insulating base frames 1 of accommodation space 11, then is respectively equipped with several clamping slots 12.
Described several terminals 2 is to be provided with docking section 21, and is provided with weld part 22 by docking section 21 toward the opposite side extension.
Above-mentioned each member is when assembling, be to penetrate with docking section 21 for several terminals 2 respectively with several slots 111 in insulating base frame 1 accommodation space 11, and several terminals 2 and inlay card are in the clamping slot 12 of the wall 112 of accommodation space 11, and weld part 22 is extended laterally by insulating base frame 1 bottom, be that group constitutes connector of the present invention, the weld part 22 that can utilize several terminals 2 is respectively to being positioned at several contacts 31 on the circuit board 3, again several terminals 2 is welded on the circuit board 3, is installed on the circuit board 3 for insulating base frame 1.
See also Fig. 2～shown in Figure 6 again, be side cutaway view, the side cutaway view after the etching, stereo appearance figure, the side cutaway view of weld part before welding of terminal, the side cutaway view of weld part after welding of terminal before the etching of the present invention, find out by knowing shown in the figure, several terminals 2 of the present invention during fabrication can be according to the following step:
(1) respectively at each terminal 2 outside one deck nickel of electroplating, to form nickel coating 23.
(2) again at nickel coating 23 outside one deck gold of electroplating, then form Gold plated Layer 24.
(3) can utilize laser-induced thermal etching machine 4, on the Gold plated Layer 24 of an inboard segment distance, carry out laser-induced thermal etching processing operation at the weld part 22 of each terminal 2.
(4) be to form naked dead zone 25 in Gold plated Layer 24 positions of weld part 22 inboard segment distances, and in naked dead zone 25, form collection molten tin bath 251.
(5) after being assembled in several terminals 2 on the insulating base frame 1 respectively, the weld part 22 that utilizes several terminals 2 again is respectively to being positioned at several contacts 31 of circuit board 3, and between several weld parts 22 and several contacts 31, utilizes tin liquor 32 to weld.
(6) tin liquor 32 at several contact 31 places is promptly climbed toward the inboard along each weld part 22.
When (seven) treating that tin liquor 32 rises to naked dead zone 25, tin liquor 32 promptly is subjected to collecting the iris action of molten tin bath 251, and be collected in the molten tin bath 251 pile up, condensation, can prevent effectively that tin liquor 32 from up climbing, spreading to clamping groove 12 places of weld part 22 with insulating base frame 1.
(8) utilize the collection molten tin bath 251 of naked dead zone 25, be collected in the molten tin bath 251, blocking-up tin liquor 32 and rise to the docking section 21 of each terminal 2 because of siphonage makes tin liquor 32.
And the several terminals 2 on the insulating base frame 1, its weld part 22 be can be horizontal the laterally flat shape of stretching, be welded on several contacts 31 on the circuit board 3 to adopt surface adhesion type (SMT); And the weld part 22 of several terminals 2 also can be rectilinear downward extension, then can adopt 311 (please the consulting shown in Figure 7 simultaneously) of respectively boring a hole of passing several contact 31 places on the circuit board 3 of through type, is several weld parts 22 to be welded on contact 31 places.
See also Fig. 8, shown in Figure 9, be the side cutaway view of yet another embodiment of the invention, the stereo appearance figure of another embodiment, find out by knowing shown in the figure, and above-mentioned several terminals 2, its outside is electrodepositable one deck nickel coating 23, can be in weld part 22 inboard segment distance positions of several terminals 2, utilize laser-induced thermal etching machine 4 to carry out etching and processing, also can form naked dead zone 25 at nickel coating 23 places, and can utilize the naked dead zone 25 of nickel coating 23, make weld part 22 when weld job, gather tin liquor 32, avoid tin liquor 32 to spread toward terminal 2 tops.
And above-mentioned several terminals 2 uses when the insulating base frame 1 of different types, but the pattern of coordinated insulation pedestal 1 and change the structural shape of several terminals 2, and utilize naked dead zone 25 on the several terminals 2 when carrying out weld job, reach the purpose that prevents to climb the tin situation, and making several terminals 2 can be used in the pin of different electronic installations, tool prevents to climb the function of tin when weld job.
Moreover, the terminal structure that prevents to climb tin of the invention described above, it is electrodeposited coating (nickel coating 23 or Gold plated Layer 24) at several terminals 2, and utilize the weld part 22 inboard electrodeposited coatings of 4 pairs of several terminals 2 of laser-induced thermal etching machine to carry out laser-induced thermal etching, to form naked dead zone 25 at electrodeposited coating, can be positioned at several contacts 31 of circuit board 3 at 22 pairs of the weld parts of several terminals 2, and when carrying out weld job, tin liquor 32 is climbed to the inside by weld part 22, and gather in naked dead zone 25, and the purpose that can utilize naked dead zone 25 blocking-up tin liquors 32 to spread toward the docking section 21 of each terminal 2, non-so promptly limit to claim of the present invention, several terminals 2 is processed with laser-induced thermal etching machine 4 weld part 22 inboard shapes, can be at weld part 22 inboard segment distance places, form the characteristic of naked dead zone 25, can make naked dead zone 25 when weld job, produce siphonage and can gather tin liquor 32, effectively to avoid spreading of tin liquor 32, so the simple and easy modification and the equivalent structure that use specification of the present invention and graphic content to do such as change, all should in like manner be included in the claim of the present invention, close and give Chen Ming.
The terminal structure that the invention described above prevents to climb tin when reality is used, for having following advantage, as:
(1) several terminals 2 of the present invention utilizes external electric coating for laser-induced thermal etching, and formation can be gathered the naked space 25 of tin liquor 32, process operation simple and can not damage terminal 2 structures, and several terminals 2 can coordinated insulation pedestal 1 minification, still can make several terminals 2 possess original architectural feature, and can meet light, thin, short, the little design concept of electric product.
(2) several terminals 2 utilizes laser-induced thermal etching machine 4 to carry out the etching and processing operation, can not process, can keep several terminals 2 original structural strengths, and can promote product percent of pass the structure of terminal 2, and processing procedure is simple and easy, both saved time easily and fast and the saving of labor, quite meets economic benefit.
(3) several terminals 2 can form naked dead zone 25 for laser-induced thermal etching for utilizing external electric coating (nickel coating 23 or Gold plated Layer 24), its naked dead zone 25 is to be molded over weld part 22 inboards, when carrying out weld job, produce siphonage by naked dead zone 25 and draw welding tin liquid 32, still can make a large amount of tin liquors 32 remain on weld part 22 inboards, can avoid tin liquor 32 to spread, scatter, and make the welding effect between weld part 22 and circuit board 3 each contact 31 better toward the docking section 21 of several terminals 2.
(4) weld part 22 of several terminals 2, be to can be the transverse horizontal extension, and can be welded on the circuit board 3 in surface adhesion type (SMT) mode, and the weld part 22 of several terminals 2 also can be rectilinear downward extension, can penetrate the perforation 311 at several contact 31 places on the circuit board 3, and be welded on the circuit board 3, the weld part 22 of a factor terminal 2 all extends outside the insulating base frame 1, direct several contacts 31 on the contraposition circuit board 3, and the tin liquor 32 that does not cause welding rises on the several terminals 2, can prevent that several terminals 2 from producing short circuit or damaging structure.
So; the present invention prevents to climb the processing procedure of tin when welding for the several terminals that is primarily aimed at electronic installation (as: connector); and can form naked dead zone in the laser-induced thermal etching mode at the electrodeposited coating (nickel coating or Gold plated Layer) of several terminals is main key protection point; be only to make several terminals in the naked dead zone of the inboard formation of weld part; and can when welding, produce siphonage with naked dead zone, prevent that tin liquor from rising to the advantage of docking section.
More than explanation is just illustrative for the purpose of the present invention, and it is nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited, can make many modifications, variation or equivalence, but but all will fall within the claim restricted portion of the present invention.
Claims (5)
1, a kind of terminal structure that prevents to climb tin, described terminal is located in the slot of an insulating base, and extends the outside weld part that forms of insulating base frame, and described terminal appearance has been processed to form electrodeposited coating, it is characterized in that:
Described terminal is provided with the naked dead zone that utilizes the laser-induced thermal etching moulding in the inboard of weld part, and naked dead zone is to have the collection molten tin bath that can prevent to climb tin for weld part when welding.
2, according to the described terminal structure that prevents to climb tin of claim 1, it is characterized in that: described electrodeposited coating is the nickel coating of electroplating in the terminal appearance, and described naked dead zone is to utilize the laser-induced thermal etching mode to be molded on the nickel coating.
3, according to the described terminal structure that prevents to climb tin of claim 1, it is characterized in that: described electrodeposited coating is included in the nickel coating of terminal appearance plating and the Gold plated Layer of re-plating outside nickel coating, and described naked dead zone is to utilize the laser-induced thermal etching mode to be molded on the Gold plated Layer.
4, according to the described terminal structure that prevents to climb tin of claim 1, it is characterized in that: the weld part of described terminal is the horizontal insulating base frame outside of extending.
5, according to the described terminal structure that prevents to climb tin of claim 1, it is characterized in that: the weld part of described terminal is to be the rectilinear insulating base frame bottom outside of extending.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101284246A CN101345363A (en) | 2007-07-10 | 2007-07-10 | Terminal structure for preventing tin climbing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101284246A CN101345363A (en) | 2007-07-10 | 2007-07-10 | Terminal structure for preventing tin climbing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101345363A true CN101345363A (en) | 2009-01-14 |
Family
ID=40247293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101284246A Pending CN101345363A (en) | 2007-07-10 | 2007-07-10 | Terminal structure for preventing tin climbing |
Country Status (1)
| Country | Link |
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| CN (1) | CN101345363A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102025051A (en) * | 2009-09-18 | 2011-04-20 | 广濑电机株式会社 | Electrical connector for circuit board |
| CN102290652A (en) * | 2011-06-08 | 2011-12-21 | 昆山德力康电子科技有限公司 | Board-to-board connector |
| CN102851714A (en) * | 2012-09-14 | 2013-01-02 | 北京小米科技有限责任公司 | Production method and products of metal exposed terminals |
| CN104513994A (en) * | 2013-09-29 | 2015-04-15 | 泰科电子(上海)有限公司 | Method for forming tin coating on conductive substrate, and electric contact terminal made through using method |
| CN107069284A (en) * | 2017-03-31 | 2017-08-18 | 海能达通信股份有限公司 | Connector and its connection male, connection female seat |
| CN107142506A (en) * | 2017-04-21 | 2017-09-08 | 昆山优诚电子材料有限公司 | Improve the aqueous hole sealing agent that terminal Gold plated Layer SMT climbs tin effect and corrosion resistance |
-
2007
- 2007-07-10 CN CNA2007101284246A patent/CN101345363A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102025051A (en) * | 2009-09-18 | 2011-04-20 | 广濑电机株式会社 | Electrical connector for circuit board |
| CN102025051B (en) * | 2009-09-18 | 2014-06-04 | 广濑电机株式会社 | Electrical connector for circuit board |
| CN102290652A (en) * | 2011-06-08 | 2011-12-21 | 昆山德力康电子科技有限公司 | Board-to-board connector |
| CN102851714A (en) * | 2012-09-14 | 2013-01-02 | 北京小米科技有限责任公司 | Production method and products of metal exposed terminals |
| CN102851714B (en) * | 2012-09-14 | 2016-02-03 | 小米科技有限责任公司 | Production method of the outer drain terminal of a kind of metal and products thereof |
| CN104513994A (en) * | 2013-09-29 | 2015-04-15 | 泰科电子(上海)有限公司 | Method for forming tin coating on conductive substrate, and electric contact terminal made through using method |
| CN107069284A (en) * | 2017-03-31 | 2017-08-18 | 海能达通信股份有限公司 | Connector and its connection male, connection female seat |
| CN107142506A (en) * | 2017-04-21 | 2017-09-08 | 昆山优诚电子材料有限公司 | Improve the aqueous hole sealing agent that terminal Gold plated Layer SMT climbs tin effect and corrosion resistance |
| CN107142506B (en) * | 2017-04-21 | 2019-05-17 | 昆山优诚电子材料有限公司 | Improve the aqueous hole sealing agent that terminal Gold plated Layer SMT climbs tin effect and corrosion resistance |
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Open date: 20090114 |