CN214957433U

CN214957433U - Electroplating USB TYPE C terminal

Info

Publication number: CN214957433U
Application number: CN202120306999.8U
Authority: CN
Inventors: 甄容军; 甄容志; 刘柱辉; 李华; 陈森影; 刘忠豪; 甄志敏; 陈伟彬
Original assignee: Dongguan Huanqiao Metal Products Co ltd
Current assignee: Dongguan Huanqiao Metal Products Co ltd
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2021-11-30
Anticipated expiration: 2031-02-03

Abstract

The utility model relates to an electroplate hardware technical field, concretely relates to electroplate USBTYPE C terminal, including first connecting plate, second connecting plate and a plurality of PIN foot, the head end of a plurality of PIN feet all has the contact zone that is used for realizing switching on with the plug-in connector, and the tail end all has the welding region that is used for switching on with the circuit board; the surface of the contact area is electroplated with a first nickel-plated layer, the surface of the welding area is electroplated with a second nickel-plated layer, the front surface of the contact area is electroplated with a gold-plated layer, the back surface and two side surfaces of the contact area are both electroplated with gold-flashing layers, and the surface of the second nickel-plated layer is electroplated with a misty tin layer. The electroplating USB TYPE C terminal of the utility model has simple structure and convenient use; by electroplating the nickel-plated layer and the gold-plated layer, the conductivity and the corrosion resistance of the terminal can be improved, the performance of the terminal can be effectively improved, and the service life of the terminal is prolonged; and local tinning and gilding are adopted, so that the electroplating area is reduced, and the production cost is reduced.

Description

Electroplating USB TYPE C terminal

Technical Field

The utility model relates to an electroplate hardware technical field, concretely relates to electroplate USBTYPE C terminal.

Background

With the continuous development of electronic products, the use frequency of the electronic products is higher and higher, such as smart phones and tablet computers; when the electronic interface of these electronic products is used, it needs to be charged and data transmitted frequently, so it is often plugged into and pulled out from the data line, in order to increase the service life of the terminal of the electronic interface, the surface of the terminal is usually plated with an electroplating layer, but the existing terminal has a large electroplating area and high cost.

Disclosure of Invention

In order to overcome the defects and deficiencies existing in the prior art, the utility model aims to provide an electroplating USB TYPE C terminal.

The purpose of the utility model is realized through the following technical scheme: an electroplated USB TYPE C terminal comprises a first connecting plate, a second connecting plate and a plurality of PIN PINs connected between the first connecting plate and the second connecting plate, wherein the head ends of the PIN PINs are provided with contact areas used for being conducted with a plug connector, and the tail ends of the PIN PINs are provided with welding areas used for being conducted with a circuit board; the surface of the contact area is electroplated with a first nickel-plated layer, the surface of the welding area is electroplated with a second nickel-plated layer, the front surface of the contact area is electroplated with a gold-plated layer, the back surface and two side surfaces of the contact area are both electroplated with gold-flashing layers, and the surface of the second nickel-plated layer is electroplated with a misty tin layer.

Further, it is a plurality of the PIN foot is including setting up in two first PIN feet of both sides and setting up two second PIN feet, two third PIN feet and two fourth PIN feet between two first PIN feet in proper order, and the distance of second PIN foot head end and third PIN foot head end is greater than the distance between third PIN foot and the fourth PIN foot head end.

Further, the first nickel plating layer and the second nickel plating layer are both nickel metal layers or nickel alloy layers.

Further, the gold plating layer is a gold metal layer or a gold alloy layer.

Further, the thickness of the first nickel plating layer is 2-5 microns.

Further, the thickness of the second nickel plating layer is 2-5 microns.

Further, the thickness of the gold plating layer is 0.75-2.00 micrometers.

Further, the thickness of the gold flash layer is 0.075-0.200 microns.

Further, the thickness of the fog tin layer is 2-3 microns.

The beneficial effects of the utility model reside in that: the electroplating USB TYPE C terminal of the utility model adopts the first connecting plate, the second connecting plate and a plurality of PIN feet, and has simple structure and convenient use; the nickel-plated layer is adopted for priming, so that the oxidation resistance, the corrosion resistance and the wear resistance of the terminal can be improved, the nickel-plated layer can also be used as a barrier layer between the terminal and the gold-plated layer, the influence of mutual diffusion of metals on the weldability and the service life of the terminal is prevented, and meanwhile, the mechanical strength of the gold-plated layer is greatly increased, and the corrosion resistance and the wear resistance are improved; the tin fog layer can improve the welding performance and the corrosion resistance of a welding area; the gold plating layer can improve the conductivity, corrosion resistance and weldability of the terminal and can also improve the adhesion of adjacent plating layers; and local tinning and gilding are adopted, so that the electroplating area is reduced, and the production cost is reduced.

The electroplating USB TYPE C terminal of the utility model has simple structure and convenient use; by electroplating the nickel-plated layer and the gold-plated layer, the conductivity and the corrosion resistance of the terminal can be improved, the performance of the terminal can be effectively improved, and the service life of the terminal is prolonged; and local tinning and gilding are adopted, so that the electroplating area is reduced, and the production cost is reduced.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a front view of the present invention.

Fig. 3 is a partial cross-sectional view of the front of the contact zone of the present invention.

Fig. 4 is a partial cross-sectional view of the back and two sides of the contact zone of the present invention.

Fig. 5 is a partial cross-sectional view of the weld zone of the present invention.

The reference signs are: the circuit board comprises a first connecting board 11, a second connecting board 12, a contact region 13, a welding region 14, a first PIN foot 15, a second PIN foot 16, two third PIN feet 17, a fourth PIN foot 18, a first nickel-plated layer 21, a second nickel-plated layer 22, a gold-plated layer 23, a gold-flash layer 24 and a tin-fog layer 25.

Detailed Description

In order to facilitate the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying fig. 1-5, which are not intended to limit the present invention.

Referring to fig. 1-5, an electroplating USB TYPE C terminal includes a first connecting plate 11, a second connecting plate 12 and a plurality of PIN PINs connected between the first connecting plate 11 and the second connecting plate 12, the head ends of the PIN PINs have contact areas 13 for conducting with a mating connector, the tail ends have welding areas 14 for conducting with a circuit board, the surface of the contact areas 13 is electroplated with a first nickel-plating layer 21, the surface of the welding areas 14 is electroplated with a second nickel-plating layer 22, the front surface of the contact areas 13 is electroplated with a gold-plating layer 23, the back surface and two side surfaces of the contact areas 13 are electroplated with gold-flashing layers 24, and the surface of the second nickel-plating layer 22 is electroplated with a tin-fog layer 25. The surfaces to which the above-described plating refers include front, back, and side surfaces.

In this embodiment, a plurality of the PIN feet include two first PIN feet 15 that set up in both sides and set up two second PIN feet 16, two third PIN feet 17 and two fourth PIN feet 18 between two first PIN feet 15 in proper order, and the distance between 16 head ends of second PIN foot and the head end of third PIN foot 18 is greater than the distance between 18 head ends of third PIN foot and fourth PIN foot 18.

In this embodiment, the first nickel plating layer 21 and the second nickel plating layer 22 are both nickel metal layers or nickel alloy layers. The nickel metal layer or the nickel alloy layer can improve the oxidation resistance, the corrosion resistance and the wear resistance of the terminal, can also be used as a barrier layer between the terminal and the gold-plated layer 23 to prevent metal interdiffusion to influence the weldability and the service life of the terminal, and meanwhile, the nickel-plated layer is used for priming, so that the mechanical strength of the gold-plated layer 23 is greatly improved, and the corrosion resistance and the wear resistance are improved.

In this embodiment, the gold plating layer 23 is a gold metal layer or a gold alloy layer. The gold metal layer or gold alloy layer can improve the conductivity, corrosion resistance and weldability of the terminal, and can also improve the adhesion of adjacent plating layers.

In this embodiment, the thickness of the first nickel plating layer 21 is 2 to 5 μm.

In this embodiment, the thickness of the second nickel plating layer 22 is 2 to 5 μm.

In this embodiment, the thickness of the gold-plating layer 23 is 0.75 to 2.00 μm.

In this embodiment, the thickness of the flash gold layer 24 is 0.075-0.200 μm.

In this embodiment, the thickness of the tin fog layer 25 is 2 to 3 micrometers.

The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.

Claims

1. The utility model provides an electroplate USBTYPE C terminal which characterized in that: the PIN connector comprises a first connecting plate, a second connecting plate and a plurality of PIN PINs connected between the first connecting plate and the second connecting plate, wherein the head ends of the PIN PINs are provided with contact areas used for being conducted with the plug connector, and the tail ends of the PIN PINs are provided with welding areas used for being conducted with a circuit board; the surface of the contact area is electroplated with a first nickel-plated layer, the surface of the welding area is electroplated with a second nickel-plated layer, the front surface of the contact area is electroplated with a gold-plated layer, the back surface and two side surfaces of the contact area are both electroplated with gold-flashing layers, and the surface of the second nickel-plated layer is electroplated with a misty tin layer.

2. The electroplated USB TYPE C terminal of claim 1, wherein: a plurality of the PIN foot is including setting up in two first PIN feet of both sides and setting up two second PIN feet, two third PIN feet and two fourth PIN feet between two first PIN feet in proper order, and the distance of second PIN foot head end and third PIN foot head end is greater than the distance between third PIN foot and the fourth PIN foot head end.

3. The electroplated USB TYPE C terminal of claim 1, wherein: the first nickel plating layer and the second nickel plating layer are both nickel metal layers or nickel alloy layers.

4. The electroplated USB TYPE C terminal of claim 1, wherein: the gold-plated layer is a gold metal layer or a gold alloy layer.

5. The electroplated USB TYPE C terminal of claim 1, wherein: the thickness of the first nickel plating layer is 2-5 microns.

6. The electroplated USB TYPE C terminal of claim 1, wherein: the thickness of the second nickel plating layer is 2-5 microns.

7. The electroplated USB TYPE C terminal of claim 1, wherein: the thickness of the gold-plated layer is 0.75-2.00 micrometers.

8. The electroplated USB TYPE C terminal of claim 1, wherein: the thickness of the gold flash layer is 0.075-0.200 microns.

9. The electroplated USB TYPE C terminal of claim 1, wherein: the thickness of the fog tin layer is 2-3 microns.