CN214256716U

CN214256716U - Heat sensor substrate and heat sensor

Info

Publication number: CN214256716U
Application number: CN202022591841.8U
Authority: CN
Inventors: 徐纯刚; 吴付领; 李强
Original assignee: Shenzhen Kerui High Tech Materials Co ltd
Current assignee: Shenzhen Kerui High Tech Materials Co ltd
Priority date: 2020-11-10
Filing date: 2020-11-10
Publication date: 2021-09-21
Anticipated expiration: 2030-11-10

Abstract

The utility model discloses a heat sensor base plate, including the copper-clad plate, the copper-clad plate includes insulating layer and conducting layer, the heat sensor base plate still includes the heat-conducting plate, the heat-conducting plate is equipped with the mounting groove, the shape and the mounting groove shape of copper-clad plate are the same, the copper-clad plate is inlayed and is formed the composite sheet in the mounting groove, the composite sheet surface is equipped with the plating layer, form the electronic circuit on plating layer and the conducting layer, through above-mentioned design, heat-sensitive element welded fastening is on the pad that the plating layer formed, heat-sensitive element passes through the plating layer and leads directly with the heat path of heat-conducting plate, the heat-conducting plate can transmit the temperature on every side to heat-sensitive element very fast, the sensitivity that the temperature was caught to the heat sensor that makes heat sensor base plate preparation is high. The utility model discloses still relate to a thermal sensor who contains above-mentioned thermal sensor base plate.

Description

Heat sensor substrate and heat sensor

Technical Field

The present invention relates to a thermal sensor, and more particularly, to a substrate for a thermal sensor.

Background

At present, the commonly used heat sensor substrate is made by adopting an insulation PCB copper clad laminate or a metal core PCB copper clad laminate such as FR4 and BT and the like through PCB design and production process. The insulating PCB copper clad plates such as FR4 and BT have lower comprehensive thermal conductivity due to the base material being a resin composite material, and the manufactured thermal sensor has lower thermal sensitivity; the metal core PCB copper-clad plate, because metal core PCB copper-clad plate core is the metal, therefore synthesize insulating PCB copper-clad plate such as thermal conductivity FR4, BT, etc., great promotion, the thermal sensitivity of the heat sensor of preparation is higher, but the thermal sensitivity still can not reach the high sensitive requirement of cell-phone heat sensor capture temperature.

SUMMERY OF THE UTILITY MODEL

In order to overcome the disadvantages of the prior art, an object of the present invention is to provide a thermal sensor substrate with high sensitivity for capturing temperature.

In order to overcome the defects of the prior art, the second object of the present invention is to provide a thermal sensor with high sensitivity for capturing temperature.

The utility model discloses an one of the purpose adopts following technical scheme to realize:

the heat sensor substrate comprises a copper-clad plate, wherein the copper-clad plate comprises an insulating layer and a conducting layer, the heat sensor substrate further comprises a heat conducting plate, the heat conducting plate is provided with an installation groove, the shape of the copper-clad plate is the same as that of the installation groove, the copper-clad plate is embedded in the installation groove to form a composite plate, an electroplated layer is arranged on the surface of the composite plate, and the electroplated layer and the conducting layer are manufactured into an electronic circuit.

Further, the plating layer is a copper layer.

Further, the thickness of the electroplated layer is more than 2 um.

Further, the heat conducting plate is a copper plate.

Further, the conducting layer is a copper foil.

Further, the copper plate and the copper foil of the conductive layer are integrated by the plating layer.

Furthermore, the surface of the copper clad plate and the surface of the heat conducting plate are positioned on the same plane.

Further, the electronic circuit of the thermal sensor substrate is a single-sided electronic circuit.

Further, the electronic circuit of the thermal sensor substrate is a double-sided electronic circuit.

The second purpose of the utility model is realized by adopting the following technical scheme:

a heat sensor comprises a heat-sensitive element and a heat sensor substrate, wherein the heat-sensitive element is welded and fixed on a bonding pad formed by an electroplating layer on a metal heat-conducting plate.

Compared with the prior art, the utility model discloses the heat sensor base plate still includes the heat-conducting plate, the heat-conducting plate is equipped with the mounting groove, the shape and the mounting groove shape of copper-clad plate are the same, the copper-clad plate is inlayed and is formed the composite sheet in the mounting groove, the composite sheet surface is equipped with the plating layer, form the electronic circuit on plating layer and the conducting layer, through the above-mentioned design, on the pad that the heat-sensitive element welded fastening was formed in the plating layer, the heat-sensitive element passes through the plating layer and leads directly with the heat-sensitive element, the heat-conducting plate can be with the very fast transmission of temperature on every side to the heat-sensitive element, the sensitivity that makes the heat sensor of heat sensor base plate preparation catch the temperature is high.

Drawings

FIG. 1 is a schematic view of the structure of the heat sensor of the present invention;

FIG. 2 is a schematic structural view of a heat conductive plate of the thermal sensor of FIG. 1;

FIG. 3 is a schematic structural diagram of a copper-clad plate of the thermal sensor of FIG. 1;

fig. 4 is a schematic structural view of the copper clad plate of fig. 3 laminated on a heat conducting plate to form a composite plate.

In the figure: 10. a heat conducting plate; 11. mounting grooves; 20. copper-clad plate; 30. electroplating layer; 40. a thermosensitive element; 50. an electronic circuit.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Fig. 1 shows a thermal sensor of the present invention, which includes a thermal sensor substrate and a thermosensitive element 40 fixed to the thermal sensor substrate.

The thermal sensor substrate includes a heat-conducting plate 10, a copper-clad plate 20, and an electroplated layer 30.

The heat-conducting plate 10 is constructed as shown in fig. 2, and the heat-conducting plate 10 is provided with mounting grooves 11. The heat-conducting plate 10 is a metal plate having a thermal conductivity of 200W/m.k or more, such as an aluminum plate or a copper plate (preferably, a copper plate having a thermal conductivity of 380W/m.k or more).

The structure of the copper-clad plate 20 is shown in fig. 3, and the copper-clad plate 20 includes an insulating layer and a conductive layer. In this embodiment, the conductive layer is a copper foil. The shape of the copper-clad plate 20 corresponds to the shape of the mounting groove 11, and the thickness of the copper-clad plate 20 is the same as the depth of the mounting groove 11.

When the heat sensor substrate is manufactured, the copper-clad plate 20 is manufactured into small pieces, the copper-clad plate 20 is embedded into the mounting groove 11 of the heat conducting plate 10, and a pressing mold is adopted to press and flatten the copper-clad plate 20 and the heat conducting plate 10 to form a composite plate, as shown in figure 4. At this time, the upper surface of the copper-clad plate 20 and the upper surface of the exposed heat-conducting plate 10 are in the same plane. In the present embodiment, the copper clad plate 20 is mounted on both sides of the heat conducting plate 10. According to the subsequent heat sensor circuit, a splicing hole is drilled in the copper-clad plate 20 area of the composite plate, and the splicing hole penetrates through the copper-clad plate 20 and the heat-conducting plate 10. And thoroughly removing dirt and burrs from the composite board after drilling, then thoroughly cleaning the composite board, and electroplating a copper foil layer with the thickness of 18-25 um on the surface of the composite board by adopting a copper deposition and copper electroplating process to form an electroplated layer 30 on the surface of the composite board. The electroplated layer 30 covers and combines the heat conducting plate 10 area of the composite plate surface and the conducting layer area of the copper-clad plate 20 together, so that the heat conducting plate 10 area of the composite plate surface, the conducting layer area of the copper-clad plate 20 and the electroplated layer 30 form a whole. And (3) manufacturing a single-sided or double-sided electronic circuit 50 on the surface of the composite board by adopting the manufacturing process of the PCB according to the circuit required by the subsequent heat sensor after electroplating, and finishing manufacturing the substrate of the heat sensor.

The pins of the thermal element 40 are arranged in the plug holes, and the thermal element 40 is welded and fixed on the bonding pads formed by the electroplated layer 30 to form the thermal sensor. Because the heat conducting plate 10 area of the composite plate surface, the conducting layer area of the copper-clad plate 20 and the electroplated layer 30 form a whole, the heat-sensitive element 40 is directly communicated with the heat path of the heat conducting plate 10 through the electroplated layer 30, the heat conducting plate 10 can quickly transfer the surrounding temperature to the heat-sensitive element 40, so that the sensitivity of the heat sensor manufactured by the heat sensor substrate for capturing the temperature is high, the heat sensitivity greatly exceeds that of the heat sensor manufactured by an insulated PCB (printed circuit board) copper-clad plate or a metal core PCB copper-clad plate such as FR4 and BT, and the like, and the reliable guarantee is provided for the high-sensitivity capturing temperature of the 5G mobile phone heat sensor.

The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, all according to the equivalent modifications and evolutions of the present invention, which are made to the above embodiments by the essential technology, and all belong to the protection scope of the present invention.

Claims

1. The heat sensor substrate comprises a copper-clad plate, wherein the copper-clad plate comprises an insulating layer and a conducting layer, and is characterized in that: the heat sensor substrate further comprises a heat conducting plate, the heat conducting plate is provided with a mounting groove, the shape of the copper-clad plate is the same as that of the mounting groove, the copper-clad plate is embedded in the mounting groove to form a composite plate, an electroplated layer is arranged on the surface of the composite plate, and the electroplated layer and the conductive layer are manufactured into an electronic circuit.

2. The thermal sensor substrate according to claim 1, wherein: the electroplated layer is a copper layer.

3. The thermal sensor substrate according to claim 2, wherein: the thickness of the electroplated layer is more than 2 um.

4. The thermal sensor substrate according to claim 2, wherein: the heat conducting plate is a copper plate.

5. The thermal sensor substrate according to claim 4, wherein: the conducting layer is a copper foil.

6. The thermal sensor substrate according to claim 5, wherein: the copper plate and the copper foil of the conductive layer are integrated through the plating layer.

7. The thermal sensor substrate according to claim 1, wherein: the surface of the copper clad plate and the surface of the heat conducting plate are positioned on the same plane.

8. The thermal sensor substrate according to claim 1, wherein: the electronic circuit of the thermal sensor substrate is a single-sided electronic circuit.

9. The thermal sensor substrate according to claim 1, wherein: the electronic circuit of the thermal sensor substrate is a double-sided electronic circuit.

10. A thermal sensor comprising a thermally sensitive element, characterized in that: the thermal sensor further comprises a thermal sensor substrate according to any one of claims 1 to 9, the heat-sensitive element being solder-fixed to a pad formed of an electroplating layer on the metal heat-conducting plate.