CN113825306B - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN113825306B CN113825306B CN202111167422.4A CN202111167422A CN113825306B CN 113825306 B CN113825306 B CN 113825306B CN 202111167422 A CN202111167422 A CN 202111167422A CN 113825306 B CN113825306 B CN 113825306B
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- aluminum
- heat conduction
- circuit board
- anodic oxidation
- insulating substrate
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- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 108
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 238000009413 insulation Methods 0.000 claims abstract description 46
- 239000011347 resin Substances 0.000 claims abstract description 38
- 229920005989 resin Polymers 0.000 claims abstract description 38
- 230000003647 oxidation Effects 0.000 claims abstract description 36
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 36
- 239000011148 porous material Substances 0.000 claims abstract description 14
- 229910000676 Si alloy Inorganic materials 0.000 claims description 16
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 238000011049 filling Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000011417 postcuring Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 1
- 229910000838 Al alloy Inorganic materials 0.000 abstract description 42
- 238000010292 electrical insulation Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- VRAIHTAYLFXSJJ-UHFFFAOYSA-N alumane Chemical compound [AlH3].[AlH3] VRAIHTAYLFXSJJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Abstract
The embodiment of the invention discloses a circuit board and a preparation method thereof. The circuit board comprises an insulating substrate, a conductive circuit and an aluminum or aluminum alloy heat conduction piece which penetrates through the insulating substrate; at least one surface of the aluminum or aluminum alloy heat conducting piece is provided with an aluminum anodic oxidation insulating layer and a heat conducting boss, and the heat conducting boss is exposed to the aluminum anodic oxidation insulating layer; the pores of the aluminum anodized insulation layer are filled with resin, and the conductive circuit is formed on the surfaces of the aluminum anodized insulation layer and the insulation substrate. In the invention, the aluminum anodic oxidation insulating layer and the heat conduction boss are formed on the surface of the aluminum or aluminum alloy heat conduction piece, so that the surface of the circuit board has larger wiring area while the heat radiation performance is improved, and the miniaturization of the circuit board is facilitated; the pores of the aluminum anodic oxidation insulating layer are filled with resin, which is beneficial to enhancing the electrical insulation performance of the aluminum anodic oxidation insulating layer and the binding force of the aluminum anodic oxidation insulating layer and the conductive circuit.
Description
Technical Field
The invention relates to the field of circuit boards; more particularly, to a circuit board in which aluminum or aluminum alloy heat conductive members are embedded in an insulating substrate and a method of manufacturing the same.
Background
In the prior art, a metal heat conducting piece is generally embedded in the mounting position of the component of the circuit board, and the metal heat conducting piece can be arranged to penetrate through the insulating substrate of the circuit board, so that a heat conducting channel penetrating through the insulating substrate is formed, and the rapid heat dissipation of the component is realized.
In many cases, a metal heat conducting member with a larger size is required to be embedded to realize rapid heat dissipation of the component, but because the metal heat conducting member has electric conduction performance, the electric conduction circuit can only be manufactured on the insulating substrate of the circuit board, which not only affects the surface wiring of the circuit board, but also causes the obvious increase of the area of the circuit board when the size of the metal heat conducting member is larger, which is unfavorable for miniaturization of the circuit board.
Disclosure of Invention
Aiming at the defects of the prior art, the main purpose of the invention is to provide a circuit board with an aluminum or aluminum alloy heat conduction member embedded in an insulating substrate and a preparation method thereof, which can improve the heat dissipation performance of the circuit board without affecting the surface wiring of the circuit board.
In order to achieve the above-mentioned main object, a first aspect of the present invention discloses a circuit board including an insulating substrate, an electrically conductive line, and an aluminum or aluminum alloy heat conductive member disposed through the insulating substrate; at least one surface of the aluminum or aluminum alloy heat conducting piece is provided with an aluminum anodic oxidation insulating layer and a heat conducting boss, and the heat conducting boss is exposed to the aluminum anodic oxidation insulating layer; the pores of the aluminum anodized insulation layer are filled with resin, and the conductive circuit is formed on the surfaces of the aluminum anodized insulation layer and the insulation substrate.
According to a specific embodiment of the first aspect of the present invention, the thickness of the aluminum anodized insulation layer is 10 μm to 80 μm.
According to a specific embodiment of the first aspect of the present invention, the heat conducting boss is formed with a heat conducting pad, and the heat conducting pad is flush with the surface of the electric conducting circuit, so as to facilitate the mounting of the components.
According to a specific embodiment of the first aspect of the present invention, the insulating substrate comprises a plurality of insulating core boards, and the insulating core boards and the insulating substrate and the aluminum or aluminum alloy heat conducting member are bonded and connected by adhesive materials.
According to a specific embodiment of the first aspect of the present invention, the top surface and the bottom surface of the aluminum or aluminum alloy heat conducting member are provided with an aluminum anodized insulation layer and a heat conducting boss.
According to another embodiment of the first aspect of the present invention, the top surface of the aluminum or aluminum alloy heat conducting member is provided with an oxidation insulating layer and a heat conducting boss; the bottom surface of the circuit board is provided with a heat dissipation metal layer, and the bottom surface of the aluminum or aluminum alloy heat conduction piece is thermally connected with the heat dissipation metal layer.
In order to achieve the above main object, a second aspect of the present invention provides a method for manufacturing a circuit board, comprising the steps of:
s1, carrying out local anodic oxidation treatment on at least one surface of an aluminum or aluminum alloy heat conduction member so as to form an aluminum anodic oxidation insulating layer and a heat conduction boss on the surface;
s2, filling resin in the aluminum anodic oxidation insulating layer;
s3, fixing the aluminum or aluminum alloy heat conduction member obtained in the step S2 into an insulating substrate of the circuit board;
s4, forming a copper-clad layer on the surface of the circuit board obtained in the step S3;
s5, manufacturing conductive lines on the surfaces of the aluminum anodic oxidation insulating layer and the insulating substrate.
According to a specific embodiment of the second aspect of the present invention, step S2 includes:
s21, immersing the aluminum or aluminum alloy heat conduction piece subjected to local anodic oxidation into liquid resin, or coating the surface of the aluminum anodic oxidation insulating layer with the liquid resin, so that the liquid resin enters into the pores of the aluminum anodic oxidation insulating layer;
s22, pre-curing the liquid resin, and grinding to remove redundant resin on the surface of the circuit board after pre-curing;
s23, performing post-curing treatment on the resin in the aluminum anodized insulation layer.
According to a specific embodiment of the second aspect of the present invention, step S3 includes:
s311, carrying out windowing treatment on the insulating core plate and the prepreg;
s312, laminating the multi-layer insulating core boards, and placing prepregs between the insulating core boards;
s313, placing the aluminum or aluminum alloy heat conducting piece obtained in the step S2 at the windowing positions of the insulating core plate and the prepreg, and pressing the multi-layer insulating core plates to form an insulating substrate and fixing the aluminum or aluminum alloy heat conducting piece in the insulating substrate.
According to a specific embodiment of the second aspect of the present invention, step S3 includes:
s321, windowing is carried out on an insulating substrate of a circuit board;
s322, placing the aluminum or aluminum alloy heat conducting piece obtained in the step S2 at a windowing position of the insulating substrate, and filling hole plugging resin in a hole between the aluminum or aluminum alloy heat conducting piece and the insulating substrate so as to fix the aluminum or aluminum alloy heat conducting piece into the insulating substrate.
The invention has the following beneficial effects: the conductive circuit is formed on the surfaces of the aluminum anodic oxidation insulating layer and the insulating substrate, so that the surface of the circuit board has a larger wiring area, and the circuit board is convenient to miniaturize; the heat conduction boss is exposed to the aluminum anodic oxidation insulating layer, so that heat conduction connection can be directly formed with components, and the circuit board has excellent heat dissipation performance. Further, the pores of the aluminum anodized insulation layer are filled with resin to enhance the binding force between the aluminum anodized insulation layer and the conductive circuit and improve the electrical insulation property of the aluminum anodized insulation layer.
The objects, technical solutions and advantages of the present invention will be more clearly described below, and the present invention will be further described in detail with reference to the accompanying drawings and the detailed description.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board in embodiment 1 of the present invention;
fig. 2 is a schematic view showing a laminated structure of an insulating core board and a prepreg in embodiment 1 of the present invention;
fig. 3 is a schematic structural view of fixing an aluminum or aluminum alloy heat conductive member in an insulating core board by press-fitting in embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of the embodiment 1 of the present invention after a copper-clad layer is formed on the surface of a circuit board;
fig. 5 is a schematic diagram of the structure of the circuit board of embodiment 1 after etching the conductive traces;
fig. 6 is a schematic structural diagram of a circuit board in embodiment 2 of the present invention;
fig. 7 is a schematic diagram of a structure of an insulating substrate after opening a window in embodiment 2 of the present invention;
fig. 8 is a schematic view showing a structure in which an aluminum or aluminum alloy heat conductive member is fixed in an insulating core board through a resin plug hole in embodiment 2 of the present invention;
fig. 9 is a schematic diagram of the structure of a circuit board in embodiment 3 of the present invention.
It should be noted that, in order to clearly illustrate the structure to be expressed, different parts in the drawings may not be depicted in the same scale. Therefore, unless explicitly indicated, the descriptions of the drawings do not constitute limitations on the size or scale of the portions of the heat dissipating substrate.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other variations that are based thereon. Accordingly, other embodiments, which can be known to those skilled in the art based on the following examples, are within the scope of the present invention.
Example 1
As shown in fig. 1, the circuit board of embodiment 1 includes an insulating substrate 10 and an aluminum or aluminum alloy heat conducting member 20 disposed through the insulating substrate 10, and a bottom surface of the insulating substrate 10 (i.e., a bottom surface of the circuit board) may be provided with a heat dissipating metal layer 40, and the bottom surface of the aluminum or aluminum alloy heat conducting member 20 is thermally connected with the heat dissipating metal layer 40.
In the present invention, the insulating substrate 10 includes a plurality of insulating core boards 11, and the insulating core boards 11 and the insulating substrate 10 and the aluminum or aluminum alloy heat conductive member 20 are bonded and connected by the prepreg 12. Among them, the aluminum or aluminum alloy heat conductive member 20 is preferably an aluminum silicon alloy heat conductive member, such as 4045 or 4047 aluminum silicon alloy heat conductive member; the insulating core 11 may be an FR-4 core, but the invention is not limited thereto.
In embodiment 1, the aluminum or aluminum alloy heat conductive member 20 is formed with an aluminum anodized insulation layer 21 and a heat conductive boss 22 exposed to the aluminum anodized insulation layer 21 on the top surface. The thickness of the aluminum anodized insulation layer 21 may be 10 μm to 80 μm, more specifically 20 μm to 60 μm.
The aluminum anodized insulation layer 21 and the surface of the insulation substrate 10 are formed with conductive lines 30, the conductive lines 30 include a first line region 31 formed on the surface of the aluminum anodized insulation layer 21 and a second line region 32 formed on the surface of the insulation substrate 10, and the thickness of the first line region 31 is smaller than the thickness of the second line region. Further, the heat conducting boss 22 may be formed with a heat conducting pad 23, and the heat conducting pad 23 may be flush with the surface of the conductive circuit 30 and completely cover the heat conducting boss 22, so as to facilitate mounting of components on the circuit board; after mounting, the components are thermally connected to the heat conductive pads 23 and electrically connected to the conductive traces 30.
In general, the aluminum anodized insulation layer 21 forms a porous honeycomb structure, and the inventors found that the honeycomb structure would decrease the bonding force of the aluminum anodized insulation layer 21 to the conductive line. In the present invention, the bonding force between the aluminum-aluminum anodized insulation layer 21 and the first circuit region 31 and the electrical insulation property of the anodized insulation layer 21 are enhanced by filling the pores of the aluminum anodized insulation layer 21 with a resin.
Specifically, in the method for manufacturing a circuit board of embodiment 1, the top surface of the aluminum or aluminum alloy heat conductive member 20 is first partially anodized to form an aluminum anodized insulation layer 21 and a heat conductive boss 22 on the surface, and then the aluminum anodized insulation layer 21 is filled with a resin.
Wherein, the filling of the resin in the aluminum anodized insulation layer 21 may include the steps of: firstly, immersing the aluminum or aluminum alloy heat conducting piece 20 subjected to local anodic oxidation into liquid resin, or coating the surface of the aluminum anodic oxidation insulating layer 21 with the liquid resin, so that the liquid resin enters into the pores of the aluminum anodic oxidation insulating layer 21; then, the liquid resin is pre-cured, and the redundant resin (the resin covered on the surface of the heat conduction boss 22) on the surface of the circuit board is removed by grinding after the pre-curing; finally, the resin in the aluminum anodized insulation layer 21 is post-cured.
In the circuit board manufacturing method of embodiment 1, after the resin filling treatment of the aluminum anodized insulation layer 21, the aluminum or aluminum alloy heat conductive member 20 is fixed into the insulation substrate 10 by a press-fit method. Specifically, as shown in fig. 3, the insulating core boards 11 and the prepregs 12 are subjected to windowing treatment, then the multi-layer insulating core boards 11 are laminated, and the prepregs 12 are placed between the insulating core boards 12; then, the aluminum or aluminum alloy heat conducting member 20 is placed at the windowing position of the insulating core plate 11 and the prepreg 12, the multi-layer insulating core plate 11 is pressed, after the pressing, the prepreg 12 bonds the insulating core plate 11 together to form the insulating substrate 10, and meanwhile, the prepreg 12 also flows to fill the gap between the insulating substrate 10 and the aluminum or aluminum alloy heat conducting member 20, so that the aluminum or aluminum alloy heat conducting member 20 is fixed in the insulating substrate 10. After lamination, the two side surfaces of the circuit board can be ground to remove the prepreg flowing to the surface of the circuit board.
In the method for manufacturing a circuit board of embodiment 1, after fixing the aluminum or aluminum alloy heat conductive member 20 to the insulating substrate 10, a step of forming a copper-clad layer 112 on the surface of the circuit board and a step of manufacturing the conductive traces 30 on the surfaces of the aluminum anodized insulating layer 21 and the insulating substrate 10 are further included. Among them, in order to facilitate formation of the copper-clad layer 112 on the surface of the circuit board, both side surfaces of the insulating substrate 10 may have copper foil layers 111.
In an embodiment of the present invention, as shown in fig. 4, the circuit board may be sequentially subjected to full-board electroless plating and electroplating to form the copper-clad layer 112 on the top and bottom surfaces of the circuit board. Then, as shown in fig. 5, the copper foil layer 111 and the copper-clad layer 112 on the top surface of the circuit board are subjected to patterned etching, thereby forming the conductive traces 30 and the heat conductive pads 23; the copper foil layer 111 and the copper-clad layer 112 on the bottom surface of the circuit board may not be etched, and both may constitute the heat dissipation metal layer 40.
In the embodiment of the invention, the pores of the aluminum anodized insulation layer 21 are filled with resin, so that after the whole board is subjected to electroless plating and electroplating, no liquid residues such as plating solution and cleaning solution exist in the pores of the aluminum anodized insulation layer 21, and good binding force is formed between the aluminum anodized insulation layer 21 and the conductive circuit. In contrast, if the pores of the aluminum anodized insulation layer 21 are not filled with the resin, liquids such as a plating solution and a cleaning solution are extremely likely to remain in the pores of the aluminum anodized insulation layer 21, and thus defects such as delamination and/or bubbling of the conductive line formed on the surface of the aluminum anodized insulation layer 21 occur.
Example 2
As shown in fig. 6, the circuit board of embodiment 2 includes an insulating substrate 10 and an aluminum or aluminum alloy heat conductive member 20 embedded in the insulating substrate 10. The insulating substrate 10 includes a plurality of insulating core boards 11, the insulating core boards 11 are bonded and connected by prepregs 121, and the insulating substrate 10 and the aluminum or aluminum alloy heat conducting member 20 are bonded and connected by hole plugging resin 122. Other descriptions of the circuit board structure in embodiment 2 can be referred to in the foregoing embodiment 1, and will not be repeated.
In embodiment 2, an insulating substrate 10 is manufactured by laminating an insulating core board 11 and a prepreg 121, wherein the top surface and the bottom surface of the insulating substrate 10 are provided with copper foil layers 111; then, as shown in fig. 7, the insulating substrate 10 is subjected to a windowing process to form a window 13 accommodating the aluminum or aluminum alloy heat conductive member 20; next, the aluminum or aluminum alloy heat conductive member 20 is placed at the windowed position of the insulating substrate 10, and the hole plugging resin 122 is filled in the hole between the aluminum or aluminum alloy heat conductive member 20 and the insulating substrate 10 to fix the aluminum or aluminum alloy heat conductive member 20 into the insulating substrate 10; then, copper-clad layers may be formed on both side surfaces of the circuit board, and conductive traces 30 may be formed on the surfaces of the aluminum anodized insulation layer 21 and the insulation substrate 10. Other descriptions of the method for manufacturing a circuit board in embodiment 2 can be referred to in the foregoing embodiment 1, and will not be repeated.
Example 3
As shown in fig. 9, the circuit board of embodiment 3 includes an insulating substrate 10 and an aluminum or aluminum alloy heat conductive member 20 embedded in the insulating substrate 10, the top and bottom surfaces of the aluminum or aluminum alloy heat conductive member 20 each have an oxidized insulating layer 21 and a heat conductive boss 22, and the top and bottom surfaces of the circuit board each have an electrically conductive line 30 formed on the surfaces of the insulating substrate 10 and the oxidized insulating layer 21. Other descriptions of embodiment 3 can be referred to the foregoing embodiments 1 and 2, and will not be repeated.
The technical features of the various embodiments of the present invention may be combined with or replaced with each other. In the invention, the surface of the aluminum or aluminum alloy heat conducting piece is provided with the oxidation insulating layer and the heat conducting boss, so that the surface of the circuit board has larger wiring area while the heat radiation performance is improved, and the miniaturization of the circuit board is facilitated. Further, the pores of the aluminum anodized insulation layer are filled with resin to enhance the electrical insulation performance of the aluminum anodized insulation layer and the binding force of the aluminum anodized insulation layer and the conductive circuit.
While the invention has been described above by way of examples, it should be appreciated that the above examples are illustrative only of the possible embodiments of the invention and should not be construed as limiting the scope of the invention, and that equivalent variations according to the invention will be covered by the scope of the appended claims.
Claims (9)
1. A circuit board comprises an insulating substrate, a conductive circuit and an aluminum-silicon alloy heat conduction piece which penetrates through the insulating substrate; the method is characterized in that: at least one surface of the aluminum-silicon alloy heat conduction piece is provided with an aluminum anodic oxidation insulating layer and a heat conduction boss, and the heat conduction boss is exposed to the aluminum anodic oxidation insulating layer; the pores of the aluminum anodic oxidation insulating layer are filled with resin, and the conductive circuit is formed on the surfaces of the aluminum anodic oxidation insulating layer and the insulating substrate; a heat conduction welding pad is formed on the heat conduction boss and is flush with the surface of the electric conduction circuit;
the conductive circuit comprises a first circuit area formed on the surface of the aluminum anodized insulation layer and a second circuit area formed on the surface of the insulation substrate, and the thickness of the first circuit area is smaller than that of the second circuit area.
2. The circuit board of claim 1, wherein: the thickness of the aluminum anodized insulation layer is 10-80 mu m.
3. The circuit board of claim 1, wherein: the insulating substrate comprises a plurality of layers of insulating core plates, and the insulating core plates and the insulating substrate and the aluminum silicon alloy heat conduction piece are bonded and connected through adhesive materials.
4. The circuit board of claim 1, wherein: the top surface and the bottom surface of the aluminum-silicon alloy heat conduction piece are respectively provided with the aluminum anodic oxidation insulating layer and the heat conduction boss.
5. The circuit board of claim 1, wherein: the top surface of the aluminum-silicon alloy heat conduction piece is provided with the aluminum anodic oxidation insulating layer and the heat conduction boss; the bottom surface of the circuit board is provided with a heat dissipation metal layer, and the bottom surface of the aluminum-silicon alloy heat conduction piece is in thermal connection with the heat dissipation metal layer.
6. The preparation method of the circuit board is characterized by comprising the following steps:
s1, carrying out local anodic oxidation treatment on at least one surface of an aluminum-silicon alloy heat conduction member to form an aluminum anodic oxidation insulating layer and a heat conduction boss on the surface;
s2, filling resin in the aluminum anodic oxidation insulating layer;
s3, fixing the aluminum-silicon alloy heat conduction piece obtained in the step S2 into an insulating substrate of a circuit board, wherein copper foil layers are arranged on the surfaces of two sides of the insulating substrate;
s4, forming a copper-clad layer on the surface of the circuit board obtained in the step S3;
s5, manufacturing conductive circuits on the surfaces of the aluminum anodic oxidation insulating layer and the insulating substrate, and manufacturing a heat conduction pad on the heat conduction boss; the conductive circuit comprises a first circuit area formed on the surface of the aluminum anodized insulation layer and a second circuit area formed on the surface of the insulation substrate, and the thickness of the first circuit area is smaller than that of the second circuit area.
7. The method of manufacturing a circuit board according to claim 6, wherein step S2 includes:
s21, immersing the aluminum-silicon alloy heat conduction member subjected to local anodic oxidation into liquid resin, or coating the surface of the aluminum anodic oxidation insulating layer with the liquid resin to enable the liquid resin to enter into the pores of the aluminum anodic oxidation insulating layer;
s22, pre-curing the liquid resin, and grinding to remove redundant resin on the surface of the circuit board after pre-curing;
s23, performing post-curing treatment on the resin in the aluminum anodic oxidation insulating layer.
8. The method of manufacturing a circuit board according to claim 6, wherein step S3 includes:
s311, carrying out windowing treatment on the insulating core plate and the prepreg;
s312, laminating the multi-layer insulating core boards, and placing prepregs between the insulating core boards;
s313, placing the aluminum-silicon alloy heat conduction piece obtained in the step S2 at the windowing positions of the insulating core plate and the prepreg, and pressing the multi-layer insulating core plates to form an insulating substrate and fixing the aluminum-silicon alloy heat conduction piece in the insulating substrate.
9. The method of manufacturing a circuit board according to claim 6, wherein step S3 includes:
s321, windowing is carried out on an insulating substrate of a circuit board;
s322, placing the aluminum-silicon alloy heat conduction piece obtained in the step S2 at a windowing position of the insulating substrate, and filling hole plugging resin in a hole between the aluminum-silicon alloy heat conduction piece and the insulating substrate so as to fix the aluminum-silicon alloy heat conduction piece into the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111167422.4A CN113825306B (en) | 2021-10-07 | 2021-10-07 | Circuit board and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111167422.4A CN113825306B (en) | 2021-10-07 | 2021-10-07 | Circuit board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN113825306A CN113825306A (en) | 2021-12-21 |
| CN113825306B true CN113825306B (en) | 2024-02-23 |
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| CN114513894A (en) * | 2022-01-25 | 2022-05-17 | 工业和信息化部电子第五研究所华东分所 | High heat dissipation type printed circuit board and car cooling system |
| CN114828458A (en) * | 2022-06-01 | 2022-07-29 | 深圳市深联电路有限公司 | Manufacturing method of double-faced boss copper-embedded plate, PCB and power battery |
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| CN111642059A (en) * | 2020-05-09 | 2020-09-08 | 昆山沪利微电有限公司 | Heat dissipation PCB and manufacturing method thereof |
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