JPH10200258A - Manufacture of mulitlayer printed wiring board - Google Patents
Manufacture of mulitlayer printed wiring boardInfo
- Publication number
- JPH10200258A JPH10200258A JP9001054A JP105497A JPH10200258A JP H10200258 A JPH10200258 A JP H10200258A JP 9001054 A JP9001054 A JP 9001054A JP 105497 A JP105497 A JP 105497A JP H10200258 A JPH10200258 A JP H10200258A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- inner layer
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は産業用および民生用
などの各種電子機器に広く用いられている多層プリント
配線板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer printed wiring board which is widely used for various electronic devices for industrial use and consumer use.
【０００２】[0002]
【従来の技術】近年、パーソナルコンピュータ、ワード
プロセッサー、ビデオ一体型カメラや携帯電話器などの
普及に伴い、多層プリント配線板の需要はますます増加
する傾向にあるが、それら電子機器の小型・軽量・多機
能化などの理由から多層プリント配線板へは、配線収容
性、表面実装密度をより向上させるための非貫通のバイ
アホールによる層間電気的接続方法であるインターステ
ィシャルバイアホール（以下ＩＶＨと称す）が要求され
始めている。それに応える一手段として導電性ペースト
により全層間をＩＶＨで電気的に接続できる樹脂多層プ
リント配線板がある。2. Description of the Related Art In recent years, with the spread of personal computers, word processors, video-integrated cameras, mobile phones, and the like, the demand for multilayer printed wiring boards has been increasing. For reasons such as multi-functionality, multi-layer printed wiring boards are provided with interstitial via holes (hereinafter referred to as IVH), which is an interlayer electrical connection method using non-penetrating via holes in order to further improve wiring accommodation and surface mounting density. ) Has begun to be required. As a means for responding to this, there is a resin multilayer printed wiring board in which all layers can be electrically connected by IVH using a conductive paste.
【０００３】以下に従来の多層プリント配線板における
製造方法について説明する。図２（ａ）〜（ｃ）は従来
の多層プリント配線板の製造方法を示すものである。図
２（ａ）〜（ｃ）において、１１は銅はく、１２はプリ
プレグ、１３は内層材、１３ａは内層用の導体パター
ン、１３ｂは導電性のペースト等を充填された穴を有す
る内層用の絶縁基板、１４は内部に導体パターンを有す
る多層銅張積層板である。Hereinafter, a method for manufacturing a conventional multilayer printed wiring board will be described. 2 (a) to 2 (c) show a conventional method for manufacturing a multilayer printed wiring board. 2 (a) to 2 (c), 11 is copper foil, 12 is prepreg, 13 is an inner layer material, 13a is a conductor pattern for the inner layer, and 13b is an inner layer having a hole filled with a conductive paste or the like. The insulating substrate 14 is a multilayer copper-clad laminate having a conductor pattern inside.
【０００４】以上のように構成された多層プリント配線
板の積層方法について、以下説明する。まず図２（ａ）
に示すように、穴加工し、その穴内に導電性を有するペ
ースト等を充填したアラミド不織布基材エポキシ樹脂積
層板などを絶縁基板とし、その両側に銅はくをラミネー
トした銅張積層板の銅はく表面にスクリーン印刷法や写
真法などの手段を用いて、内層用の導体パターン１３ａ
を形成し、多層プリント配線板用の内層材１３を得る。[0004] A method of laminating a multilayer printed wiring board configured as described above will be described below. First, FIG.
As shown in the figure, an aramid nonwoven fabric base epoxy resin laminate or the like filled with conductive paste or the like in the hole is used as an insulating substrate and copper foil is laminated on both sides of the copper clad laminate. The conductor pattern 13a for the inner layer is formed on the surface of the foil by using a method such as a screen printing method or a photographic method.
Is formed to obtain an inner layer material 13 for a multilayer printed wiring board.
【０００５】次に、図２（ｂ）に示すように、絶縁基板
１３ｂ上に形成された内層用の導体パターン１３ａを有
する内層材１３と、アラミド不織布にエポキシ樹脂など
を含浸させ、樹脂を半硬化状態にした後、穴加工し、そ
の穴内に導電性を有するペースト等を充填したプリプレ
グ１２と、最外層の導体パターンを形成するための銅は
く１１を重ね合わせ、熱プレス機（図中略す）にステン
レス板（図中略す）などで挟んでセットし、加熱・加圧
して、内層材１３とプリプレグ１２と銅はく１１を溶
融、冷却、固化させ、図２（ｃ）に示すような多層銅張
積層板１４を得る。Next, as shown in FIG. 2B, an inner layer material 13 having an inner layer conductor pattern 13a formed on an insulating substrate 13b and an aramid nonwoven fabric are impregnated with an epoxy resin or the like, and the resin is cut in half. After the cured state, a hole is formed, a prepreg 12 filled with a conductive paste or the like in the hole, and a copper foil 11 for forming a conductor pattern of the outermost layer are overlapped with each other. (Not shown) between stainless steel plates (not shown in the figure) or the like, and set by heating and pressing to melt, cool, and solidify the inner layer material 13, prepreg 12, and copper foil 11, as shown in FIG. 2 (c). A multilayer copper-clad laminate 14 is obtained.
【０００６】その後、写真法等の公知の方法により、回
路形成およびソルダレジスト形成を行い多層プリント配
線板を得る。Thereafter, a circuit and a solder resist are formed by a known method such as a photographic method to obtain a multilayer printed wiring board.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上記従
来の方法により製造されたアラミド不織布エポキシ樹脂
含浸基材を用いた多層プリント配線板では、それ自体に
比較的高い剛性があり折り曲げることができない。また
折り曲げた場合には、基材及び導体パターンが切断され
るという欠点を有している。そのため折り曲げる必要の
ある場合には、複数枚のプリント配線板上にコネクター
を実装し、リード線を装着し、リード線の部分で折り曲
げるという形態を採らざるを得ず、コネクター及びその
実装コスト、リード線及びその装着コストが必要であ
る。However, a multilayer printed wiring board using an aramid nonwoven fabric epoxy resin-impregnated base material manufactured by the above-mentioned conventional method itself has relatively high rigidity and cannot be bent. In addition, when it is bent, it has a disadvantage that the base material and the conductor pattern are cut. Therefore, if it is necessary to bend the connector, mount it on multiple printed wiring boards, attach the leads, and bend at the lead wires. Wire and its mounting cost are required.
【０００８】本発明は上記従来の問題点を解決するもの
で、コネクターやリード線が不必要で、さらに一部分に
可撓性を有する多層プリント配線板の製造方法を提供す
ることを目的とする。An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a method of manufacturing a multilayer printed wiring board which does not require a connector or a lead wire and has a partly flexible structure.
【０００９】[0009]
【課題を解決するための手段】この目的を達成するため
に本発明は、アラミド不織布に熱硬化性樹脂を含浸，半
硬化して貫通孔を設け、この貫通孔に導電性ペーストを
充填し層間導通用接着シートを形成する工程と、導電性
ペーストを充填した穴を有する絶縁基板の両面に銅はく
を積層し熱圧着した後、その両面の銅はくを回路形成し
て導体パターンを有した内層材を形成する工程と、前記
内層材と層間導通用接着シートを交互に複数枚積層し最
外層に銅はくを熱圧着する工程を有する多層プリント配
線板の製造方法において、内層材または銅はくおよび層
間導通用接着シートの所定部分を切断除去したのち積層
し熱圧着する方法を用いて多層プリント配線板を製造す
るものである。In order to achieve this object, the present invention relates to an aramid non-woven fabric impregnated with a thermosetting resin and semi-cured to form a through-hole. Forming a conductive adhesive sheet, laminating copper foil on both sides of an insulating substrate having holes filled with a conductive paste and thermocompression bonding, forming a circuit on the copper foil on both sides to form a conductive pattern; Forming a laminated inner layer material, and a method of manufacturing a multilayer printed wiring board having a step of laminating a plurality of the inner layer material and the adhesive sheet for interlayer conduction alternately and thermally bonding copper foil to the outermost layer, wherein the inner layer material or A multilayer printed wiring board is manufactured by a method of cutting and removing a predetermined portion of a copper foil and an adhesive sheet for interlayer conduction, and then laminating and thermocompression bonding.
【００１０】上記方法により、一部分に可撓性をもたせ
た多層プリント配線板が得られる。According to the above method, a multilayer printed wiring board having a partly flexibility can be obtained.
【００１１】[0011]
【発明の実施の形態】本発明の請求項１に記載の発明
は、アラミド不織布に熱硬化性樹脂を含浸，半硬化して
貫通孔を設け、この貫通孔に導電性ペーストを充填し層
間導通用接着シートを形成する工程と、導電性ペースト
を充填した穴を有する絶縁基板の両面に銅はくを積層し
熱圧着した後、その両面の銅はくを回路形成して導体パ
ターンを有した内層材を形成する工程と、前記内層材と
層間導通用接着シートを交互に複数枚積層し最外層に銅
はくを積層し熱圧着する工程を有する多層プリント配線
板の製造方法において、内層材または銅はくおよび層間
導通用接着シートの所定部分を切断除去したのち積層し
熱圧着する多層プリント配線板の製造方法としたもので
あり、多層プリント配線板の一部分を薄板化することに
より、その部分を容易に折り曲げることができ、さら
に、本発明の多層プリント配線板が高強度材料であるア
ラミド繊維を使用していることから、多層プリント配線
板に折り曲げ時の基材及び導体パターンの切断やクラッ
クの発生しない高い信頼性を有する可撓性を付与するこ
とができるという作用を有する。BEST MODE FOR CARRYING OUT THE INVENTION According to the first aspect of the present invention, a through-hole is provided by impregnating and semi-curing a thermosetting resin into an aramid non-woven fabric. A step of forming a general-purpose adhesive sheet, and after laminating and thermocompression bonding copper foils on both sides of an insulating substrate having holes filled with a conductive paste, forming a circuit on the copper foils on both sides and having a conductor pattern A method for manufacturing a multilayer printed wiring board, comprising: a step of forming an inner layer material; and a step of alternately laminating a plurality of the inner layer material and an adhesive sheet for interlayer conduction, laminating copper foil on an outermost layer, and thermocompression bonding. Or a method for manufacturing a multilayer printed wiring board in which copper foil and a predetermined portion of the adhesive sheet for interlayer conduction are cut and removed, and then laminated and thermocompressed, and by thinning a part of the multilayer printed wiring board, Part In addition, since the multilayer printed wiring board of the present invention uses aramid fiber, which is a high-strength material, cutting and cracking of the base material and the conductor pattern when the multilayer printed wiring board is bent can be formed. This has the effect that flexibility with high reliability can be provided.
【００１２】請求項２に記載の発明は、内層材または層
間導通用接着シートの所定部分を切断除去したのち切断
面を硬化する請求項１に記載の多層プリント配線板の製
造方法としたものであり、切断面を硬化することにより
積層および熱圧着時に半硬化状態の樹脂の流動化による
はみ出しを防止し可撓性部分の信頼性を向上するという
作用を有する。According to a second aspect of the present invention, there is provided the method for manufacturing a multilayer printed wiring board according to the first aspect, wherein a predetermined portion of the inner layer material or the adhesive sheet for interlayer conduction is cut and removed, and then the cut surface is cured. In addition, by curing the cut surface, it has the effect of preventing the semi-cured resin from overflowing due to fluidization during lamination and thermocompression bonding, thereby improving the reliability of the flexible portion.
【００１３】請求項３に記載の発明は、内層材または層
間導通用接着シートの所定部分をレーザーにて切断除去
する請求項１に記載の多層プリント配線板の製造方法と
したものであり、所定部分の切断をレーザーで行うと同
時に切断面をレーザーの熱で硬化することにより積層お
よび熱圧着時に半硬化状態の樹脂の流動化によるはみ出
しを防止し可撓性部分の信頼性および生産性を向上する
という作用を有する。According to a third aspect of the present invention, there is provided the method for manufacturing a multilayer printed wiring board according to the first aspect, wherein a predetermined portion of the inner layer material or the adhesive sheet for interlayer conduction is cut and removed by a laser. Laser cutting of the part and curing of the cut surface with the heat of the laser at the same time prevents the overflow of the semi-cured resin during lamination and thermocompression bonding, thereby improving the reliability and productivity of the flexible part. It has the effect of doing.
【００１４】請求項４に記載の発明は、切断除去した部
分を挟んで対向する回路形成部のうち少なくとも一方に
部品実装用の貫通孔を設ける請求項１に記載の多層プリ
ント配線板の製造方法としたものであり、ディスクリー
ト部品のリード線を挿入できる貫通孔を形成することに
より、高密度実装部分と低密度実装部分に分けることが
でき、必要に応じて実装形態を展開できるという作用を
有する。According to a fourth aspect of the present invention, there is provided the method of manufacturing a multilayer printed wiring board according to the first aspect, wherein a through hole for mounting a component is provided in at least one of the circuit forming portions opposed to each other with the cut and removed portion interposed therebetween. By forming a through-hole into which the lead wire of the discrete component can be inserted, it can be divided into a high-density mounting part and a low-density mounting part, and has the effect that the mounting form can be developed as necessary. .
【００１５】以下、本発明の一実施の形態について、図
面を参照しながら説明する。図１（ａ）〜（ｃ）は本発
明の一実施の形態における多層プリント配線板の製造方
法を示す断面図である。図１において、１は所定の形状
に切断された銅はく、２は導電性のペースト等が充填さ
れた穴を有し、所定の形状に切断した層間導通用接着シ
ート（以下プリプレグと称す）、３は内層材、３ａは内
層用の導体パターン、３ｂは導電性のペースト等が充填
された穴を有する内層用の絶縁基板、４は積層後の多層
銅張積層板、５は切断面である。An embodiment of the present invention will be described below with reference to the drawings. 1A to 1C are cross-sectional views illustrating a method for manufacturing a multilayer printed wiring board according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a copper foil cut into a predetermined shape, 2 denotes an adhesive sheet for interlayer conduction (hereinafter, referred to as a prepreg) having a hole filled with a conductive paste or the like and cut into a predetermined shape. 3 is an inner layer material, 3a is a conductor pattern for the inner layer, 3b is an insulating substrate for the inner layer having holes filled with a conductive paste or the like, 4 is a multilayer copper-clad laminate after lamination, and 5 is a cut surface. is there.
【００１６】以上のように構成された多層プリント配線
板の製造方法について、図１を用いて説明する。A method for manufacturing a multilayer printed wiring board having the above-described structure will be described with reference to FIG.
【００１７】まず図１（ａ）に示すように、導電性のペ
ースト等を充填された穴を有するアラミド不織布基材エ
ポキシ樹脂積層板を絶縁基板とする銅張積層板の銅はく
表面にスクリーン印刷法や写真法などの従来の方法を用
いて、内層用の絶縁基板３ｂ上に内層用の導体パターン
３ａを形成し、導体パターン３ａを上下面に有する多層
プリント配線板用の内層材３を得る。First, as shown in FIG. 1A, a screen is formed on the copper foil of a copper-clad laminate having an aramid nonwoven fabric base epoxy resin laminate having holes filled with a conductive paste or the like as an insulating substrate. Using a conventional method such as a printing method or a photographic method, a conductor pattern 3a for the inner layer is formed on the insulating substrate 3b for the inner layer, and the inner layer material 3 for the multilayer printed wiring board having the conductor pattern 3a on the upper and lower surfaces is formed. obtain.
【００１８】次に図１（ｂ）に示すように、内層材３
と、アラミド不織布にエポキシ樹脂を含浸させ、樹脂部
分を半硬化状態にした後、穴加工し、その穴内に導電性
を有するペースト等を充填する。次にレーザー光を用い
て所定の形状に切断したプリプレグ２と、外層の導体パ
ターンを形成するための所定の形状に切断した銅はく１
を重ね合わせ、熱プレス機にステンレス板などで挟んで
セットし、加熱・加圧して内層材３とプリプレグ２と銅
はく１を溶融・冷却・固化して、図１（ｃ）に示すよう
な内部に導体パターン３ａを有し、導電性を有するペー
スト等により各層を電気的に接続し、さらに、一部分が
フィルム状でかつ可撓性を有する多層銅張積層板４を得
る。この時切断面５はレーザーの加工時の熱により溶融
硬化していることにより積層時の樹脂流れを防止するこ
とができ極めて精度の高い可撓性部分を切断と同時に形
成することができる。Next, as shown in FIG.
Then, the aramid nonwoven fabric is impregnated with an epoxy resin, the resin portion is semi-cured, holes are formed, and the holes are filled with a conductive paste or the like. Next, a prepreg 2 cut into a predetermined shape using a laser beam, and a copper foil 1 cut into a predetermined shape for forming a conductor pattern of an outer layer.
Are stacked, set in a hot press with a stainless steel plate or the like, and heated and pressed to melt, cool and solidify the inner layer material 3, prepreg 2 and copper foil 1, as shown in FIG. 1 (c). Each layer is electrically connected by a conductive paste or the like having a conductive pattern 3a inside, and a multilayer copper-clad laminate 4 partially film-shaped and having flexibility is obtained. At this time, since the cut surface 5 is melted and hardened by heat at the time of laser processing, resin flow during lamination can be prevented, and a highly accurate flexible portion can be formed simultaneously with cutting.
【００１９】また、回路形成部の少なくとも一方に貫通
孔を形成することにより、リード線を有する部品の実装
に対応することもできる。Further, by forming a through hole in at least one of the circuit forming portions, it is possible to cope with mounting of a component having a lead wire.
【００２０】本実施の形態による多層プリント配線板、
すなわち多層銅張積層板と従来の多層銅張積層板の特性
を比較すると、従来方法ではプリント配線板を直角に折
り曲げた場合、外層部の導体パターンが切断されたり、
積層板にクラックが発生していたが、本実施の形態では
導体パターンの切断や積層板へのクラック発生は認めら
れなかった。また、折り曲げを１０００回繰り返しても
導体パターンの切断や積層板へのクラックは、全く発生
しないという優れた効果が得られた。The multilayer printed wiring board according to the present embodiment,
That is, comparing the characteristics of the multilayer copper-clad laminate and the conventional multilayer copper-clad laminate, when the printed wiring board is bent at a right angle in the conventional method, the conductor pattern of the outer layer portion is cut,
Although cracks occurred in the laminate, in the present embodiment, cutting of the conductor pattern and cracks in the laminate were not observed. In addition, even when the bending was repeated 1000 times, an excellent effect was obtained in that the conductor pattern was not cut or the laminate was not cracked at all.
【００２１】以上のように本実施の形態によれば、一部
分に可撓性を有し折り曲げ可能な多層プリント配線板を
提供することができる。As described above, according to the present embodiment, it is possible to provide a bendable multilayer printed wiring board that is partially flexible.
【００２２】[0022]
【発明の効果】以上のように本発明は、内層材と一部を
切断したプリプレグと銅はくとを重ね合わせ、加熱・加
圧、積層することにより、コネクターやリード線を用い
ることなく、容易に折り曲げることが可能で、さらに繰
り返し折り曲げても導体の切断や積層板へのクラック発
生のない優れたアラミド不織布のエポキシ樹脂含浸基材
の多層プリント配線板を実現できるものである。As described above, according to the present invention, the inner layer material, the partially cut prepreg and the copper foil are overlapped, heated, pressed, and laminated without using a connector or a lead wire. It is possible to realize a multilayer printed wiring board made of an epoxy resin-impregnated base material of an aramid nonwoven fabric, which can be easily bent and which does not cut the conductor and does not crack the laminate even when repeatedly bent.
【図１】（ａ）〜（ｃ）本発明の実施の形態における多
層プリント配線板の製造方法を示す断面図FIGS. 1A to 1C are cross-sectional views illustrating a method for manufacturing a multilayer printed wiring board according to an embodiment of the present invention.
【図２】（ａ）〜（ｃ）従来の多層プリント配線板の製
造方法を示す断面図FIGS. 2A to 2C are cross-sectional views illustrating a method for manufacturing a conventional multilayer printed wiring board.
【符号の説明】 １ 銅はく ２ 層間導通用接着シート（プリプレグ） ３ 内層材 ３ａ 内層用の導体パターン ３ｂ 内層用の絶縁基板 ４ 多層銅張積層板 ５ 切断面[Description of Signs] 1 Copper foil 2 Adhesive sheet for interlayer conduction (prepreg) 3 Inner layer material 3a Inner layer conductor pattern 3b Inner layer insulating substrate 4 Multi-layer copper-clad laminate 5 Cut surface
Claims (4)
半硬化して貫通孔を設け、この貫通孔に導電性ペースト
を充填し層間導通用接着シートを形成する工程と、導電
性ペーストを充填した穴を有する絶縁基板の両面に銅は
くを積層し熱圧着した後その両面の銅はくを回路形成し
て両面に導体パターンを有した内層材を形成する工程
と、前記内層材と層間導通用接着シートを交互に複数枚
積層し最外層に銅はくを積層し熱圧着する工程を有する
多層プリント配線板の製造方法において、内層材または
銅はくおよび層間導通用接着シートの所定部分を切断除
去したのち積層し熱圧着する多層プリント配線板の製造
方法。1. An aramid nonwoven fabric impregnated with a thermosetting resin,
Providing a through-hole by semi-curing, filling the through-hole with a conductive paste to form an adhesive sheet for interlayer conduction, and laminating copper foil on both sides of an insulating substrate having a hole filled with the conductive paste. A step of forming an inner layer material having a conductor pattern on both sides by forming a circuit on the copper foil on both sides after thermocompression bonding, and alternately laminating a plurality of the inner layer material and an adhesive sheet for interlayer conduction to form an outermost layer with copper In a method for manufacturing a multilayer printed wiring board having a step of laminating and thermocompression bonding, a multilayer printed wiring board to be laminated and thermocompression bonded after cutting and removing a predetermined portion of an inner layer material or a copper foil and an adhesive sheet for interlayer conduction. Production method.
定部分を切断除去したのち切断面を硬化する請求項１に
記載の多層プリント配線板の製造方法。2. The method for producing a multilayer printed wiring board according to claim 1, wherein a predetermined portion of the inner layer material or the adhesive sheet for interlayer conduction is cut and removed, and then the cut surface is cured.
定部分をレーザーにて切断除去する請求項１に記載の多
層プリント配線板の製造方法。3. The method for producing a multilayer printed wiring board according to claim 1, wherein a predetermined portion of the inner layer material or the adhesive sheet for interlayer conduction is cut and removed by a laser.
形成部のうち少なくとも一方に部品実装用の貫通孔を設
ける請求項１に記載の多層プリント配線板の製造方法。4. The method for manufacturing a multilayer printed wiring board according to claim 1, wherein a through hole for mounting a component is provided in at least one of the circuit forming portions facing each other with the cut and removed portion interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00105497A JP3879158B2 (en) | 1997-01-08 | 1997-01-08 | Multilayer printed wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP00105497A JP3879158B2 (en) | 1997-01-08 | 1997-01-08 | Multilayer printed wiring board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10200258A true JPH10200258A (en) | 1998-07-31 |
| JP3879158B2 JP3879158B2 (en) | 2007-02-07 |
Family
ID=11490842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP00105497A Expired - Fee Related JP3879158B2 (en) | 1997-01-08 | 1997-01-08 | Multilayer printed wiring board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3879158B2 (en) |
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| KR100954488B1 (en) | 2003-06-26 | 2010-04-22 | 엘지디스플레이 주식회사 | A multi-layer pcb and the fabricating method |
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| WO2013115627A1 (en) * | 2012-02-03 | 2013-08-08 | 주식회사 엘지화학 | Adhesive film |
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- 1997-01-08 JP JP00105497A patent/JP3879158B2/en not_active Expired - Fee Related
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| US7947332B2 (en) | 2004-06-23 | 2011-05-24 | Hitachi Chemical Company, Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| WO2006001305A1 (en) * | 2004-06-23 | 2006-01-05 | Hitachi Chemical Co., Ltd. | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board |
| WO2006016474A1 (en) * | 2004-08-12 | 2006-02-16 | Sony Chemical & Information Device Corporation | Method for manufacturing multilayer flex rigid wiring board |
| US7479297B2 (en) | 2004-08-25 | 2009-01-20 | Seiko Epson Corporation | Method of manufacturing a multi-layered wiring board |
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| US9119335B2 (en) | 2009-11-20 | 2015-08-25 | Murata Manufacturing Co., Ltd. | Method for manufacturing rigid-flexible multilayer wiring board and collective board |
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| US9343696B2 (en) | 2012-02-03 | 2016-05-17 | Lg Chem, Ltd. | Adhesive film |
| CN114828446A (en) * | 2021-01-27 | 2022-07-29 | 深南电路股份有限公司 | Method for manufacturing circuit board and adhesive sheet |
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|---|---|
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