CN114828458A

CN114828458A - Manufacturing method of double-faced boss copper-embedded plate, PCB and power battery

Info

Publication number: CN114828458A
Application number: CN202210617114.5A
Authority: CN
Inventors: 常玉兵; 余条龙; 陆万忠; 李旋
Original assignee: Shenzhen Sun & Lynn Circuits Co ltd
Current assignee: Shenzhen Sun & Lynn Circuits Co ltd
Priority date: 2022-06-01
Filing date: 2022-06-01
Publication date: 2022-07-29

Abstract

The invention relates to a manufacturing method of a double-faced boss copper-embedded plate, a PCB and a power battery, wherein the method comprises the following steps: the method comprises the steps of manufacturing an FR4 substrate, an FR4 light plate, a PP1 plate, a PP2 plate, a copper plate, riveting the FR4 back surface, the PP2 plate and the FR4 light plate in sequence, embedding a double-faced boss copper plate in a corresponding FR4 substrate groove, riveting the FR4 back surface, the PP2 plate, the FR4 light plate, the PP1 plate and the FR4 front surface, and pressing. According to the scheme provided by the application, the double-sided boss copper plate is embedded into the corresponding FR4 substrate groove, and then the FR4 reverse side, the PP2 sheet, the FR4 light plate, the PP1 sheet and the FR4 are riveted and pressed, so that the double-sided boss embedded copper plate is manufactured, and the problem of plate breakage of the conventional embedded copper plate is effectively solved.

Description

Manufacturing method of double-faced boss copper-embedded plate, PCB and power battery

Technical Field

The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing method of a double-faced boss copper-embedded plate, a PCB and a power battery.

Background

The new energy technology of the automobile is acknowledged as the high and new technology of the 21 st century, the battery industry is taken as an important component in the new energy field of the automobile and becomes a new hotspot of global economic development, the power management battery has the advantages of high working voltage, wide application temperature range, low self-discharge rate, light environmental pollution and the like, but the power management battery needs a protection board to meet the requirements because the self material of the power lithium battery (rechargeable type) determines that the power lithium battery cannot be overcharged, overdischarged, overcurrent, short-circuited and ultra-high temperature charging and discharging, and the power lithium battery protection board is mainly an integrated circuit board which plays a protection role for rechargeable (generally referred to as a lithium battery) as the name.

The existing power battery protection board mainly comprises electronic components and PCBs (printed circuit boards), along with the development of power lithium batteries, the requirements of the PCBs for power battery protection are higher and higher, particularly the heat conduction and heat dissipation performance are high, and the common PCB can not meet the requirements, so that the double-faced boss copper-embedded board can be produced at will, and the requirements of the power lithium battery protection board are met.

The manufacturing process method of the existing lithium battery protection board in the industry at present comprises the following steps: as shown in fig. 14, using a conventional PCB process: production of FR4 board material was used, via and face copper plated to 1.5-2oz, and circuit patterning and SMT component assembly reworked, or as shown in fig. 15, using conventional FPC process: using soft board material production, electroplating the hole copper and the surface copper to 1.5-2oz, and then processing circuit patterns and SMT assembly components, or as shown in FIG. 16, utilizing a conventional copper plate embedding process: the inner layer FR4 and the PP are in the shape of a copper block, the copper block is placed into the copper block for matching and pressing after the inner layer FR4 and the PP are riveted together, and due to the fact that FR4 and the copper block are connected through PP glue filling, the product is easy to break due to too heavy weight, and the number of heat conducting points and heat radiating points of a common embedded copper plate is small;

however, the conventional PCB process has the disadvantages of low thermal conductivity, low heat dissipation, and the like, and is only suitable for small consumer electronic products; the conventional FPC process has the defects of low heat conductivity, low heat dissipation and the like, and is only suitable for small consumer electronic products; the conventional copper plate embedding process is high in heat conduction and heat dissipation performance, can meet the basic requirements of a power lithium battery protection plate, but has the problems of plate breakage, heat conduction points and few heat dissipation points, and needs to be optimized and improved.

Disclosure of Invention

Therefore, it is necessary to provide a method for manufacturing a double-sided boss copper-embedded plate, a PCB and a power battery, aiming at the problem of plate breakage in the conventional copper-embedded plate process.

The invention provides a method for manufacturing a copper plate embedded with a boss on two sides, which comprises the following steps:

production of FR4 substrates: cutting, inner layer pattern etching, inner layer etching QC, drilling, plate milling, browning, inner layer pairing and pressing treatment are sequentially carried out;

making FR4 light panel: cutting, inner layer etching, drilling, routing, browning, inner layer pairing and pressing treatment are sequentially carried out;

preparing PP1 sheets: sequentially performing cutting, drilling, routing, inner layer pairing and pressing treatment;

making PP2 sheets: sequentially performing cutting, drilling, routing, inner layer pairing and pressing treatment;

manufacturing a copper plate: cutting, inner layer pattern etching, inner layer etching QC, laser cutting, browning, inner layer pairing and pressing treatment are sequentially carried out, so that a boss is formed on the copper plate, and the sum of the thicknesses of the front side of the FR4 substrate and the PP1 sheet is consistent with the boss etching height on the copper plate;

sequentially riveting the reverse side of FR4, a PP2 sheet and an FR4 light plate, and embedding a double-sided boss copper plate in a corresponding FR4 substrate groove;

the FR4 back side, the PP2 sheet, the FR4 light panel, the PP1 sheet and the FR4 front side were riveted and pressed.

In one embodiment, the routing groove size cut by routing on the front side and the back side of the FR4 substrate is 0.15mm larger than the single side of the boss size on the copper plate.

In one embodiment, after the FR4 reverse side, the PP2 sheet, the FR4 light panel, the PP1 sheet and the FR4 front side are riveted, the method further comprises: and arranging an aluminum foil on the pressed table board, placing the riveted plate to be pressed on the aluminum foil, arranging rubber blocking pads on two sides of the plate to be pressed, and pressing to obtain the pressed plate.

In one embodiment, the two surfaces of the board to be laminated are stuck with high-temperature resistant protective films; and after the pressing is finished, the step of tearing off the high-temperature resistant protective film is also included.

In one embodiment, the number of bosses on the copper plate is at least 2.

In one embodiment, the minimum dimension of the boss is 1.0mm by 1.0 mm.

In one embodiment, the bosses on the two surfaces of the copper plate are different in size.

In one embodiment, the manufacturing of the boss on the copper plate includes: and (3) adopting a special anti-corrosion dry film for exposure, using a film for light blocking at the boss position, removing the dry films at other positions except the boss through development, respectively etching the upper surface and the lower surface of the copper plate by adopting an acid etching method, and removing the dry films on the boss after etching is finished.

The invention further provides a PCB, wherein at least one circuit layer in the PCB is manufactured by adopting the manufacturing method of the double-sided boss copper-embedded plate as described in any embodiment of the application.

The invention further provides a power battery which comprises the PCB board in the embodiment of the application.

The beneficial effects of the invention include:

according to the manufacturing method of the double-sided boss embedded copper plate, the double-sided boss copper plate is embedded into the corresponding FR4 substrate groove, and then the FR4 back side, the PP2 sheet, the FR4 light plate, the PP1 sheet and the FR4 front side are riveted and pressed, so that the manufacturing of the double-sided boss embedded copper plate is realized, and the problem of plate breakage of the conventional embedded copper plate is effectively solved.

Drawings

Fig. 1 is a schematic flow chart of a method for manufacturing a double-sided boss copper-embedded plate according to an embodiment of the present invention;

FIG. 2 is a schematic view of a copper plate embedding process with a double-sided boss according to an embodiment of the present invention;

FIG. 3 is a schematic diagram illustrating the forming of a routing board on the front side of FR 4;

FIG. 4 is a schematic view of forming a reverse routing board of FR 4;

FIG. 5 is a schematic view of the routing of FR4 optical sheets;

FIG. 6 is a schematic diagram illustrating routing and forming of PP 1;

FIG. 7 is a schematic diagram illustrating routing and forming of PP 2;

FIG. 8 is a schematic view of a copper plate embedded with a boss on both sides;

FIG. 9 is a schematic view of FR4 with its back side riveted with PP2 and light panel

FIG. 10 is a schematic view of the copper plate of FIG. 9 after it has been embedded in the double-sided boss;

FIG. 11 is a schematic view of FR4 with its back side riveted to PP2, light panel, PP1 and FR4 front side;

FIG. 12 is a schematic view of a double-sided boss with copper plate embedded and pressed;

FIG. 13 is a schematic view of the finished product;

FIG. 14 is a schematic view of a conventional PCB process;

FIG. 15 is a schematic view of a conventional FPC board process;

fig. 16 is a schematic view of a conventional copper-clad plate process.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

The double-sided boss copper-embedded plate is a Printed Circuit Board (PCB), is an important electronic component, is a support body of the electronic component, and is a carrier for electrically interconnecting the electronic component. The PCB comprises a circuit layer and a dielectric layer, the circuit layer comprises a circuit used for conducting each electronic device, under the condition that the number of the electronic devices is large, in order to prevent conducting circuits between different electronic devices from influencing each other, a plurality of circuit layers are arranged frequently, the dielectric layer is made of insulating materials and used for isolating different circuit layers, the most common dielectric layer is a PP sheet (prepreg which is a sheet bonding material synthesized by resin and a carrier), and generally speaking, the substrate of the PCB is the same as the dielectric layer. For the PCB with the simplest structure, only one dielectric layer and one or two circuit layers are provided, and the surface of the circuit layer is subjected to resistance welding treatment. For a PCB with a large number of layers, there may be a plurality of circuit layers and a plurality of dielectric layers disposed adjacent to each other, that is, the adjacent layers of the dielectric layers are circuit layers.

The existing total flow of manufacturing the PCB board includes: raw material preparation- > blanking- > inner layer pretreatment- > press film- > exposure- > development- > etching- > membrane removal- > AOI inspection- > press fit- > drilling- > PTH- > outer layer pretreatment- > press film- > exposure- > development- > pattern electroplating- > touch- > outer layer etching- > tin stripping- > solder resist-photosensitive screen printing- > surface treatment- > character and mark symbol- > curing- > appearance processing- > cleaning and drying treatment- > inspection and test- > packaging of a finished product, wherein etching (etching) is a technology for removing a material by using a chemical reaction or a physical impact effect.

Because the existing copper plate embedding process has the problem of plate breakage, as shown in fig. 1, the application provides a manufacturing method of a double-faced boss copper plate embedding, which comprises the following steps:

step 110: production of FR4 substrates: cutting, inner layer pattern etching, inner layer etching QC, drilling, plate milling, browning, inner layer pairing and pressing treatment are sequentially carried out;

step 120: making FR4 light panel: cutting, inner layer etching, drilling, plate milling, browning, inner layer pairing and pressing treatment are sequentially carried out;

step 130: making PP1 sheets: sequentially performing cutting, drilling, routing, inner layer pairing and pressing treatment;

step 140: making PP2 sheets: sequentially performing cutting, drilling, routing, inner layer pairing and pressing treatment;

step 150: manufacturing a copper plate: cutting, inner layer pattern etching, inner layer etching, QC etching, laser cutting, browning, inner layer pairing and pressing treatment are sequentially carried out, so that a boss is formed on the copper plate, and the sum of the thicknesses of the front surface of the FR4 substrate and the PP1 sheet is consistent with the boss etching height on the copper plate;

step 160: sequentially riveting the reverse side of FR4, a PP2 sheet and an FR4 light plate, and embedding a double-sided boss copper plate in a corresponding FR4 substrate groove;

step 170: the FR4 back side, the PP2 sheet, the FR4 light panel, the PP1 sheet and the FR4 front side were riveted and pressed.

Referring to fig. 2, fig. 2 is a process diagram of embedding a copper plate on a double-sided boss in the present application, when manufacturing an FR4 substrate, as shown in fig. 3, first, material cutting, inner layer pattern etching, inner layer etching, QC etching, drilling, routing, browning, inner layer pairing, pressing, and air outlet are sequentially performed on the front side of FR4, wherein the material cutting is performed on the substrate according to a required size, the routing is performed on a preset position of an FR4 substrate, depth control routing is performed, and browning is performed on the surface of a product by using a chemical solution; meanwhile, as shown in fig. 4, cutting, inner layer pattern etching, QC etching, drilling, routing 2-browning, inner layer pairing and pressing are sequentially performed on the reverse side of FR4, the processing technology of the front side of FR4 in the embodiment of the present application is the same as that of the reverse side of FR4, and the description is not repeated here;

after the FR4 substrate is manufactured, the FR4 light panel is manufactured, as shown in fig. 5, in the embodiment of the present application, the FR4 light panel is manufactured by cutting, etching the inner layer, drilling, routing, browning, matching the inner layer and pressing; then, PP1 sheets and PP2 sheets are manufactured, wherein the PP1 sheets are manufactured by sequentially performing cutting, drilling, routing inner layer matching and pressing (routing data are consistent with the front side of FR 4) as shown in figure 6, and the PP2 sheets are manufactured by sequentially performing cutting, drilling, routing, inner layer matching and pressing (routing data are consistent with the back side of FR 4) as shown in figure 7;

then, manufacturing a copper plate, wherein the copper plate is manufactured as shown in figure 8, and the copper plate is sequentially subjected to cutting, inner layer graph etching, inner layer etching, QC (quasi-quality) etching, laser cutting, browning, inner layer pairing and pressing, wherein the sum of the thicknesses of the front side of the FR4 substrate and the PP1 sheet is consistent with the boss etching height of the copper plate;

and then riveting the back surface of the FR4 + the PP2+ the light panel, wherein the riveted structure is shown in fig. 9, after riveting is completed, as shown in fig. 10, a double-sided boss copper plate is embedded into the corresponding FR4 groove, as shown in fig. 11, after embedding is completed, the back surface of the FR4 + the PP2+ the light panel + the PP1+ the front surface of the FR4 are riveted, and finally, as shown in fig. 12, the double-sided boss copper plate is embedded by using a pressing program HTG-001 to form a finished product shown in fig. 13.

By adopting the technical scheme, the double-sided boss copper plate is embedded into the corresponding FR4 substrate groove, and then the back surface of FR4, the front surfaces of the PP2 sheet, the FR4 light plate, the PP1 sheet and the FR4 sheet are riveted and pressed, so that the double-sided boss embedded copper plate is manufactured, and the problem of plate breakage of the conventional embedded copper plate is effectively solved.

In some embodiments, the method further comprises, after face riveting FR4, PP2 sheet, FR4 light panel, PP1 sheet, and FR4, the present application: and arranging an aluminum foil on the pressed table board, placing the riveted plate to be pressed on the aluminum foil, arranging rubber blocking pads on two sides of the plate to be pressed, and pressing to obtain the pressed plate.

Furthermore, both sides of the plate to be pressed are stuck with high-temperature resistant protective films; and after the pressing is finished, the step of tearing off the high-temperature resistant protective film is also included.

In some embodiments, the number of bosses on the copper plate in the present application is at least 2, among others. The minimum dimension of the boss is 1.0 mm.

For example, in an embodiment, the number of the bosses is 25, the bosses are arranged in an array at corresponding positions of the heat dissipation area, and the sizes of the bosses may be the same or different. In an embodiment, the number of the bosses is 50, the bosses are arranged in an array at corresponding positions of the heat dissipation area, and the sizes of the bosses can be the same or different. In an embodiment, the number of the bosses is 80, the bosses are arranged in an array at corresponding positions of the heat dissipation area, and the sizes of the bosses can be the same or different.

It can be understood that the size of the area for arranging the bosses on the copper plate is fixed, and the larger the number of the bosses, the smaller the size of each boss is, and the better the heat dissipation capability of the corresponding product is. On the product of the same heat dissipation capacity, the design of small-size boss helps to reduce the product size.

The minimum size of the boss refers to the size of the boss surface of the boss, the shape of the boss surface is a square shape by default in the scheme, and the technical personnel in the field can also adopt other shapes such as a circle, a triangle and the like, and the invention does not limit the number and the shape of the boss.

It can be understood that, because the invention has a large number of bosses, the alignment of the windows of the PP sheet and the FR4 board with the bosses needs to be ensured to be good and not to be misplaced during the operation of the post-process.

In some embodiments, the manufacturing of the boss on the copper plate in the present application includes: and (3) adopting a special anti-corrosion dry film for exposure, using a film for light blocking at the boss position, removing the dry films at other positions except the boss through development, respectively etching the upper surface and the lower surface of the copper plate by adopting an acid etching method, and removing the dry films on the boss after etching is finished.

The invention further provides a PCB, wherein at least one circuit layer in the PCB is manufactured by adopting the manufacturing method of the double-sided boss copper-embedded plate as described in the embodiment of the application.

The invention also provides a power battery, which comprises the PCB board as described in the embodiment of the application.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A manufacturing method of a double-faced boss copper-embedded plate is characterized by comprising the following steps:

making FR4 light panel: cutting, inner layer etching, drilling, plate milling, browning, inner layer pairing and pressing treatment are sequentially carried out;

making PP1 sheets: sequentially performing cutting, drilling, routing, inner layer pairing and pressing treatment;

manufacturing a copper plate: cutting, inner layer pattern etching, etching QC, laser cutting, browning, inner layer pairing and pressing treatment are sequentially carried out, so that a boss is formed on the copper plate, and the sum of the thicknesses of the front side of the FR4 substrate and the PP1 sheet is consistent with the boss etching height of the copper plate;

2. The method for manufacturing the copper plate embedded with the bosses on the two sides as claimed in claim 1, wherein the sizes of routing grooves cut on the front side and the back side of the FR4 substrate by routing are 0.15mm larger than the size of one side of the bosses on the copper plate.

3. The method for manufacturing the double-sided boss-embedded copper plate as claimed in claim 1, wherein after riveting the FR4 back side, the PP2 sheet, the FR4 light plate, the PP1 sheet and the FR4 front side, the method further comprises the following steps:

and arranging an aluminum foil on the pressed table board, placing the riveted plate to be pressed on the aluminum foil, arranging rubber blocking pads on two sides of the plate to be pressed, and pressing to obtain the pressed plate.

4. The method for manufacturing the copper-clad plate with the bosses on two sides as claimed in claim 3, wherein the two sides of the plate to be laminated are respectively stuck with a high-temperature-resistant protective film; and after the pressing is finished, the step of tearing off the high-temperature resistant protective film is also included.

5. The method for manufacturing a double-sided boss copper-embedded plate as claimed in claim 1, wherein the number of bosses on the copper plate is at least 2.

6. The method of claim 5, wherein the minimum dimension of the bosses is 1.0mm by 1.0 mm.

7. The method of manufacturing a double-sided boss copper-clad plate as claimed in claim 1, wherein the bosses on both surfaces of the copper plate are different in size.

8. The method for manufacturing the copper plate embedded with the bosses on the copper plate as claimed in claim 1, wherein the manufacturing of the bosses on the copper plate comprises the following steps:

and (3) adopting a special anti-corrosion dry film for exposure, using a film for light blocking at the boss position, removing the dry films at other positions except the boss through development, respectively etching the upper surface and the lower surface of the copper plate by adopting an acid etching method, and removing the dry films on the boss after etching is finished.

9. A PCB board, characterized in that at least one circuit layer in the PCB board is manufactured by the manufacturing method of the double-sided boss copper-embedded board as claimed in any one of claims 1 to 8.

10. A power cell, characterized in that the power cell comprises the PCB board of claim 9.