CN204217201U - Bury copper billet heat radiation PCB structure - Google Patents
Bury copper billet heat radiation PCB structure Download PDFInfo
- Publication number
- CN204217201U CN204217201U CN201420591413.7U CN201420591413U CN204217201U CN 204217201 U CN204217201 U CN 204217201U CN 201420591413 U CN201420591413 U CN 201420591413U CN 204217201 U CN204217201 U CN 204217201U
- Authority
- CN
- China
- Prior art keywords
- copper billet
- pcb board
- bonding sheet
- heat radiation
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to circuit board technology field, refer in particular to and bury copper billet heat radiation PCB structure, it includes pcb board, copper billet, copper billet includes pedestal, the upper surface of pedestal has protruded out boss makes copper billet forming station stepped structure, pcb board offers the step groove mated with copper billet, copper billet pressing is embedded in step groove, the faying face of the step groove of the utility model copper billet and pcb board is step surface, increase the adhesive surface between copper billet and pcb board, thus the adhesion increased between copper billet and pcb board, and can screens be formed, effectively prevent copper billet from coming off, step faying face location is convenient simultaneously, accurately, ensure that copper billet is concordant with pcb board to greatest extent, evenness is better, conveniently paste part.
Description
Technical field:
The utility model relates to circuit board technology field, refers in particular to and buries copper billet heat radiation PCB structure.
Background technology:
PCB (Printed Circuit Board, printed circuit board (PCB)) is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.At present, along with the fast development of PCB industry, its application is also more and more extensive.Electronic equipment is little of electronic watch, calculator, general-purpose computer, and arrive greatly computer, communication electronic device, military issue weapons system, as long as there are the electronic devices and components such as integrated circuit, the electric interconnection between them all will use PCB.
At present, pcb board 1 ' imbeds the mode of copper billet 2 ', mainly pcb board 1 ' is opened one and copper billet 2 ' groove of the same size, then imbeds in the groove of pcb board 1 ' by copper billet 2 ' pressing, play the effect of heat radiation.But the face that the copper billet 2 ' of this kind of structure is combined with groove is all upright vertical plane, copper billet 2 ' is poor with the adhesion of pcb board 1 ', and copper billet 2 ' exists the risk come off; Meanwhile, after pressing there is difference of height with the end face of pcb board 1 ' in copper billet 2 ', brings difficulty to assembling.
Utility model content:
The purpose of this utility model be exactly the deficiency that exists for prior art and provide a kind of can increase copper billet and pcb board adhesion, prevent copper billet from coming off, improve the copper billet that buries of the evenness of copper billet and pcb board and to dispel the heat PCB structure.
To achieve these goals, the technical solution adopted in the utility model is: bury copper billet heat radiation PCB structure, it includes pcb board, copper billet, copper billet includes pedestal, the upper surface of pedestal has protruded out boss makes copper billet forming station stepped structure, pcb board offers the step groove mated with copper billet, copper billet pressing is embedded in step groove.
Described pcb board includes from top to bottom at least one central layer, upper strata bonding sheet, lower floor's bonding sheet, at least one central layer of pressing successively, each central layer, upper strata bonding sheet and lower floor's bonding sheet offers window respectively and is combined to form described step groove.
Window and the boss of described upper strata bonding sheet match, and window and the pedestal of lower floor's bonding sheet match, and upper strata bonding sheet is bonded on pedestal upper surface.
The upper surface of described boss offers groove.
The utility model beneficial effect is: what the utility model provided buries copper billet heat radiation PCB structure, it includes pcb board, copper billet, copper billet includes pedestal, the upper surface of pedestal has protruded out boss makes copper billet forming station stepped structure, pcb board offers the step groove mated with copper billet, copper billet pressing is embedded in step groove, the faying face of the step groove of the utility model copper billet and pcb board is step surface, increase the adhesive surface between copper billet and pcb board, thus the adhesion increased between copper billet and pcb board, and can screens be formed, effectively prevent copper billet from coming off, step faying face location is convenient simultaneously, accurately, ensure that copper billet is concordant with pcb board to greatest extent, evenness is better, conveniently paste part.
Accompanying drawing illustrates:
Fig. 1 is the structural representation that tradition buries copper billet heat radiation PCB structure.
Fig. 2 is structural representation of the present utility model.
Fig. 3 is decomposing schematic representation of the present utility model.
Fig. 4 is the structural representation of another execution mode of the utility model.
Embodiment:
Below in conjunction with accompanying drawing, the utility model is further described, see shown in Fig. 2 ~ 3, the utility model includes pcb board 1, copper billet 2, copper billet 2 includes pedestal 21, the upper surface of pedestal 21 has protruded out boss 22 makes copper billet 2 forming station stepped structure, pcb board 1 offers the step groove 10 mated with copper billet 2, copper billet 2 pressing is embedded in step groove 10.
Pcb board 1 includes from top to bottom at least one central layer 11, upper strata bonding sheet 12, lower floor's bonding sheet 13, at least one central layer 11 of pressing successively, each central layer 11, upper strata bonding sheet 12 and lower floor's bonding sheet 13 offers window respectively and is combined to form described step groove 10.
Window and the boss 22 of upper strata bonding sheet 12 match, and window and the pedestal 21 of lower floor's bonding sheet 13 match, and upper strata bonding sheet 12 adopts small one and large one mode with the window of lower floor's bonding sheet 13, are conducive to controlling gummosis.Upper strata bonding sheet 12 is bonded on pedestal 21 upper surface, and pedestal 21 upper surface of copper billet 2 and pcb board 1 bonded areas share 1 bonding sheet, avoids the too thick or starved of thickness.
The utility model copper billet 2 is step surface with the faying face of the step groove 10 of pcb board 1, increase the adhesive surface between copper billet 2 and pcb board 1, thus the adhesion increased between copper billet 2 and pcb board 1, and can screens be formed, effectively prevent copper billet 2 from coming off, step faying face location is convenient simultaneously, accurately, guarantee copper billet 2 is concordant with pcb board 1 to greatest extent, evenness is better, conveniently pastes part.
To do another execution mode of the present utility model, as shown in Figure 4, with a upper execution mode unlike, the upper surface of boss 22 offers groove 23.
Certainly, the above is only better embodiment of the present utility model, therefore all equivalences done according to structure, feature and the principle described in the utility model patent claim change or modify, and are included in the utility model patent claim.
Claims (4)
1. bury copper billet heat radiation PCB structure, include pcb board (1), copper billet (2), it is characterized in that: described copper billet (2) includes pedestal (21), the upper surface of pedestal (21) has protruded out boss (22) makes copper billet (2) forming station stepped structure, pcb board (1) offers the step groove (10) mated with copper billet (2), copper billet (2) pressing is embedded in step groove (10).
2. according to claim 1ly bury copper billet heat radiation PCB structure, it is characterized in that: described pcb board (1) includes from top to bottom at least one central layer (11) of pressing successively, upper strata bonding sheet (12), lower floor's bonding sheet (13), at least one central layer (11), each central layer (11), upper strata bonding sheet (12) and lower floor's bonding sheet (13) offers window respectively and is combined to form described step groove (10).
3. according to claim 2ly bury copper billet heat radiation PCB structure, it is characterized in that: window and the boss (22) on described upper strata bonding sheet (12) match, window and the pedestal (21) of lower floor's bonding sheet (13) match, and upper strata bonding sheet (12) is bonded on pedestal (21) upper surface.
4. according to claims 1 to 3 any one, bury copper billet heat radiation PCB structure, it is characterized in that: the upper surface of described boss (22) offers groove (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420591413.7U CN204217201U (en) | 2014-10-13 | 2014-10-13 | Bury copper billet heat radiation PCB structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420591413.7U CN204217201U (en) | 2014-10-13 | 2014-10-13 | Bury copper billet heat radiation PCB structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204217201U true CN204217201U (en) | 2015-03-18 |
Family
ID=52985829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420591413.7U Expired - Fee Related CN204217201U (en) | 2014-10-13 | 2014-10-13 | Bury copper billet heat radiation PCB structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204217201U (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104869751A (en) * | 2015-05-19 | 2015-08-26 | 广州杰赛科技股份有限公司 | PCB and production process thereof |
| CN105592621A (en) * | 2014-10-23 | 2016-05-18 | 深南电路有限公司 | PCB manufacturing method and PCB |
| CN107683016A (en) * | 2017-11-21 | 2018-02-09 | 生益电子股份有限公司 | A kind of quick heat radiating PCB |
| CN107734838A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN108520916A (en) * | 2018-05-21 | 2018-09-11 | 武汉华星光电半导体显示技术有限公司 | A kind of flexible base board and its bubble repair structure |
| CN108684136A (en) * | 2018-05-22 | 2018-10-19 | 景旺电子科技(龙川)有限公司 | One kind burying copper billet heat-radiating substrate and preparation method thereof |
| CN109565930A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| CN109862721A (en) * | 2019-04-02 | 2019-06-07 | 东莞职业技术学院 | A kind of production method and the antenna integrated PCB of power amplifier of the antenna integrated PCB of power amplifier |
| CN110381666A (en) * | 2019-06-27 | 2019-10-25 | 沪士电子股份有限公司 | A kind of groove type buries the multi-layer PCB board production method of copper billet |
| CN111885857A (en) * | 2020-08-25 | 2020-11-03 | 景旺电子科技(珠海)有限公司 | Printed circuit board and manufacturing method thereof |
| CN112233988A (en) * | 2019-11-19 | 2021-01-15 | 江苏上达电子有限公司 | High-heat-dissipation packaging substrate process |
| CN112261800A (en) * | 2020-10-26 | 2021-01-22 | 景旺电子科技(龙川)有限公司 | Manufacturing method of high-heat-dissipation PCB |
| CN114828458A (en) * | 2022-06-01 | 2022-07-29 | 深圳市深联电路有限公司 | Manufacturing method of double-faced boss copper-embedded plate, PCB and power battery |
-
2014
- 2014-10-13 CN CN201420591413.7U patent/CN204217201U/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105592621A (en) * | 2014-10-23 | 2016-05-18 | 深南电路有限公司 | PCB manufacturing method and PCB |
| CN105592621B (en) * | 2014-10-23 | 2019-02-05 | 深南电路有限公司 | A kind of PCB production method and PCB |
| CN104869751A (en) * | 2015-05-19 | 2015-08-26 | 广州杰赛科技股份有限公司 | PCB and production process thereof |
| CN107683016A (en) * | 2017-11-21 | 2018-02-09 | 生益电子股份有限公司 | A kind of quick heat radiating PCB |
| CN107734838A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107734838B (en) * | 2017-11-21 | 2019-12-20 | 生益电子股份有限公司 | PCB capable of fast radiating |
| CN108520916A (en) * | 2018-05-21 | 2018-09-11 | 武汉华星光电半导体显示技术有限公司 | A kind of flexible base board and its bubble repair structure |
| CN108684136B (en) * | 2018-05-22 | 2019-12-06 | 景旺电子科技(龙川)有限公司 | copper block embedded heat dissipation substrate and manufacturing method thereof |
| CN108684136A (en) * | 2018-05-22 | 2018-10-19 | 景旺电子科技(龙川)有限公司 | One kind burying copper billet heat-radiating substrate and preparation method thereof |
| CN109565930A (en) * | 2018-10-31 | 2019-04-02 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| CN109862721A (en) * | 2019-04-02 | 2019-06-07 | 东莞职业技术学院 | A kind of production method and the antenna integrated PCB of power amplifier of the antenna integrated PCB of power amplifier |
| CN109862721B (en) * | 2019-04-02 | 2021-12-31 | 东莞职业技术学院 | Manufacturing method of power amplifier antenna integrated PCB and power amplifier antenna integrated PCB |
| CN110381666A (en) * | 2019-06-27 | 2019-10-25 | 沪士电子股份有限公司 | A kind of groove type buries the multi-layer PCB board production method of copper billet |
| CN112233988A (en) * | 2019-11-19 | 2021-01-15 | 江苏上达电子有限公司 | High-heat-dissipation packaging substrate process |
| CN112233988B (en) * | 2019-11-19 | 2023-10-03 | 江苏上达电子有限公司 | Packaging substrate technology |
| CN111885857A (en) * | 2020-08-25 | 2020-11-03 | 景旺电子科技(珠海)有限公司 | Printed circuit board and manufacturing method thereof |
| CN112261800A (en) * | 2020-10-26 | 2021-01-22 | 景旺电子科技(龙川)有限公司 | Manufacturing method of high-heat-dissipation PCB |
| CN114828458A (en) * | 2022-06-01 | 2022-07-29 | 深圳市深联电路有限公司 | Manufacturing method of double-faced boss copper-embedded plate, PCB and power battery |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20151013 |
|
| EXPY | Termination of patent right or utility model |