CN107734838A - A kind of PCB of quick heat radiating - Google Patents
A kind of PCB of quick heat radiating Download PDFInfo
- Publication number
- CN107734838A CN107734838A CN201711165590.3A CN201711165590A CN107734838A CN 107734838 A CN107734838 A CN 107734838A CN 201711165590 A CN201711165590 A CN 201711165590A CN 107734838 A CN107734838 A CN 107734838A
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- China
- Prior art keywords
- pcb
- conductive metal
- thermal conductive
- metal block
- stepped high
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to field of circuit boards, disclose a kind of PCB of quick heat radiating, including step trough, and stepped high-thermal conductive metal block, it is arranged in step trough, and solder cream is set between the top surface of the stepped high-thermal conductive metal block and the high power component for being arranged at the PCB surface；Solder cream is set between the shoulder and metal level adjacent thereto of the stepped high-thermal conductive metal block.The present invention sets step trough inside PCB and is embedded to stepped high-thermal conductive metal block, heat caused by high power component and PCB inner metal layers can be transferred in air by stepped high-thermal conductive metal block in time, improve PCB heat dispersion, simple in construction, processing and installation is more convenient.
Description
Technical field
The present invention relates to field of circuit boards, more particularly to a kind of PCB of quick heat radiating.
Background technology
PCB (Printed Circuit Board), i.e. printed circuit board, it is the supplier of electronic component electrical connection.
Multi-layer PCB is made up of core plate and prepreg of pressing.With the development of electronics techniques, the Surface Mount of component,
Trend toward miniaturization is more and more obvious, and the density of product is continuously increased, and component dominant frequency improves constantly, the power consumption of single component by
It is cumulative big, cause being increased sharply for heat flow density.Therefore to ensure the service life of electronic equipment, must just solve high power member
The heat dissipation problem of device.
The heat dissipation problem of high power component mounting position can mainly solve in terms of two, on the one hand, use is lower
Driving voltage, parasitic resistance/capacitance etc. it is smaller so that the heat consumption of device accordingly reduces；On the other hand, by special
Radiator structure assists the device to radiate.Gold is from top to bottom arranged in sequence with as prior art provides a kind of radiating PCB, the PCB
Belong to layer, insulating barrier and heat dissipating layer, the bottom of heat dissipating layer is provided with radiating and cheated, for heat to be scattered and disappeared rapidly.Insulating barrier and heat dissipating layer
It is interior that there is tree-shaped radiating core made of copper, it is made up of core branch, core bar and core root, core branch and core root are all in umbrella, are symmetrically distributed in core
The upper and lower ends of bar.Core branch and core root are respectively buried in insulating barrier and heat dissipating layer.Radiating hole is positioned at the underface of core root.But
Following defect be present in this kind of technology：
1) radiating core is copper product, it is impossible to directly contacted with metal level, and the thermal conductivity of insulating barrier is poor, therefore electronics
Heat on element is difficult to be delivered on radiating core by insulating barrier, therefore, although adding radiating core in the pcb, its thermal diffusivity
It can not be improved significantly；
2) even if the Heat Conduction Material of selection insulation is as prepreg, such as heat dissipating silicone grease, heat-conducting silica gel sheet, because it makes
It is different from traditional prepreg method with method, therefore the difficulty of lamination can be increased；
3) tree-shaped radiating core, which will carry out a series of processing and sizing, can just be embedded in insulating barrier and heat dissipating layer, prepare work
Skill is sufficiently complex, and it is low to produce speed in enormous quantities.
It is therefore desirable to a kind of PCB of quick heat radiating, to solve drawbacks described above, to accelerate the radiating of electronic component.
The content of the invention
It is an object of the invention to provide a kind of PCB of quick heat radiating, can solve the problem that existing PCB heat dispersions are low and asks
Topic.
To use following technical scheme up to this purpose, the present invention：
A kind of PCB of quick heat radiating, including step trough and stepped high-thermal conductive metal block, stepped high-thermal conductive metal block
It is arranged in step trough, solder cream is set between the top surface and high power component of stepped high-thermal conductive metal block；It is stepped high
Solder cream is set between the shoulder of heat-conducting metal block metal level adjacent thereto.
Step trough is opened up inside PCB and stepped high-thermal conductive metal block is set, is connected with stepped high-thermal conductive metal block
Tactile high power component can be rapidly by heat diffusion to stepped high-thermal conductive metal block, therefore, stepped high-thermal conductive metal
Block serves the effect of quick heat radiating.
Preferably, the material of stepped high-thermal conductive metal block is copper.Using copper material as stepped high-thermal conductive metal block
Main body, be the heat conduction and electric conductivity that make use of copper excellent, stepped high-thermal conductive metal block made of copper can by high power member
Heat on device is delivered on fin rapidly.
Preferably, solder cream is tin cream.The selection of solder cream needs to ensure high power component and stepped high heat conduction gold
Belong to caking property, electric conductivity and the thermal conductivity between block, to meet these demands, from tin cream as solder cream.Due to tin cream
Fusing point is about 150 DEG C to 220 DEG C, and the heating of high power component does not reach this temperature much, therefore does solder from tin cream
Cream will not also melt.
Preferably, in stepped high-thermal conductive metal block embedment step trough.Stepped high-thermal conductive metal block is embedded to step trough
It is interior so that during stepped high-thermal conductive metal block and PCB pressings, PCB inside can be fixed on, so as to eliminate rank
Extra technique for fixing between ladder type high-thermal conductive metal block and PCB step trough, without extra binding material.
Preferably, the top surface of stepped high-thermal conductive metal block and PCB either flush, and stepped high-thermal conductive metal block
Bottom surface is concordant with PCB bottom surface.The setting facilitates PCB to cover layers of copper, ensure that PCB globality.
Preferably, the top surface of stepped high-thermal conductive metal block is covered with layers of copper, and the bottom surface of stepped high-thermal conductive metal block is covered with
Layers of copper.Stepped high-thermal conductive metal block is encapsulated in PCB by the setting, ensure that PCB structural strength.
Preferably, the bottom surface of the bottom surface layers of copper of stepped high-thermal conductive metal block is provided with fin.The mesh of fin is set
Be the contact area that can increase heat and air, realize more preferable temperature difference transmission, accelerate shedding for heat.
Preferably, in addition to via hole, it is conducted with metal level.Via hole belongs to a kind of electroplating ventilating hole, one work
With being to be used to radiate, it can be by the heat transfer in PCB inner metal layers into via hole, and by the via hole to PCB
Outer surface transmit, play a part of auxiliary heat dissipation；Another effect of via hole is between two layers of connection PCB or multilayer
Copper foil circuit.
Preferably, fin covering via hole.The setting also plays the effect of auxiliary heat dissipation, because via hole is more narrow
Narrow, heat is not easy therefrom to pass, therefore sets fin in its one end, equivalent to area of dissipation is added, accelerates conducting
Heat in hole sheds, and prevents PCB over-heat insides, PCB is damaged.
The PCB of quick heat radiating beneficial effect is in the present invention：
1) a kind of PCB heat dissipation structure is devised, step trough is set inside PCB and is embedded to stepped high heat conduction gold
Belong to block, heat caused by high power component and PCB inner metal layers can be passed through into stepped high-thermal conductive metal block in time
It is transferred in air, improves PCB heat dispersion；
2) stepped high-thermal conductive metal block is placed in step trough by the present invention, can save PCB exterior space so that
PCB overall dimensions reduce, so that PCB overall structure is compacter.
Brief description of the drawings
(stepped high-thermal conductive metal block is not shown in the cross-sectional view that Fig. 1 is the PCB of quick heat radiating in the embodiment of the present invention one
With high power component)；
Fig. 2 is the cross-sectional view of the PCB of quick heat radiating in the embodiment of the present invention one；
Fig. 3 is the signal that high power component is conducted heat by stepped high-thermal conductive metal block in the embodiment of the present invention one
Figure；
Fig. 4 is the schematic diagram that metal level is conducted heat by stepped high-thermal conductive metal block in the embodiment of the present invention one；
Fig. 5 is the cross-sectional view of the PCB of quick heat radiating in the embodiment of the present invention two；
Fig. 6 is the cross-sectional view of the PCB of quick heat radiating in the embodiment of the present invention three；
Fig. 7 is a kind of PCB of quick heat radiating cross-sectional view in the present invention.
In figure：
1st, step trough；2nd, metal level；3rd, stepped high-thermal conductive metal block；4th, solder cream；5th, high power component；6th, radiate
Piece；7th, via hole.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one：
The present embodiment provides a kind of PCB of quick heat radiating, wherein, PCB is by three core plates compactings into (but quantity and unlimited
In this), the schematic diagram slotted on PCB is as shown in Figure 1.On the PCB, step trough 1 is milled out by milling machine, is drilled out and led by rig
Through hole 7, wherein, the two is set along PCB thickness direction, one of metal level 2 inside the shoulder and PCB of step trough 1
It is contour.Via hole 7 and PCB metal level 2 conducts, and is plated through-hole.In addition, PCB top surface is default to be provided with Gao Gong
Rate component 5, the aperture position of step trough 1 are corresponding with the bottom position of the high power component 5 of default installation.
Via hole 7 is set, auxiliary heat dissipation can be played by the heat transfer in PCB inner metal layers 2 into via hole 7
Effect.The via hole can ensure be conducted between PCB each layer metal level 2, and and can enough carries out thermal conductivity
It is logical.
Referring to Fig. 2, stepped high-thermal conductive metal block 3 is embedded in step trough 1.Stepped high-thermal conductive metal block 3 is embedded to rank
In terraced groove 1 so that during stepped high-thermal conductive metal block 3 and PCB pressings, PCB inside can be fixed on, so as to save
Technique for fixing extra between stepped high-thermal conductive metal block 3 and PCB step trough is removed, without extra binding material.
Solder cream 4, after hot pressing, the energy of solder cream 4 are set between the shoulder of stepped high-thermal conductive metal block 3 and metal level 2 adjacent thereto
Enough flow to the neck of stepped high-thermal conductive metal block 3.Specifically, in the present embodiment, step trough 1 and stepped high heat conduction gold
Category block 3 is convex, and high power component 5 is fixedly connected with the convex portion of stepped high-thermal conductive metal block 3.Due to high power member device
Part 5 is arranged on PCB top, only when stepped high-thermal conductive metal block 3 directly contacts with high power component 5 or passes through heat
When good conductor connects, the heat in high power component 5 just can be smoothly passed in stepped high-thermal conductive metal block 3.Therefore, will
High power component 5 is fixedly connected with the convex portion of stepped high-thermal conductive metal block 3 by solder cream 4, stepped high-thermal conductive metal
The surface area of the bottom of block 3 is larger, and heat dispersion is more preferable.Preferably, the top surface of stepped high-thermal conductive metal block 3 and PCB top surface
Concordantly, and stepped high-thermal conductive metal block 3 bottom surface it is concordant with PCB bottom surface.The setting facilitates PCB to cover copper operation, ensure that
PCB globality.Further, layers of copper is covered in the top surface of stepped high-thermal conductive metal block 3 and bottom surface, can be by step type
High-thermal conductive metal block 3 is encapsulated into PCB, ensure that PCB structural strength.
Solder cream 4 is preferably tin cream in the present embodiment, and solder cream 4 ensures high power component 5 and stepped high heat conduction gold
Belong to caking property, electric conductivity and the thermal conductivity between block 3, to meet these demands, from tin cream as solder cream 4, reason is main
Have：
(1) fusing point of tin cream is about 150 DEG C to 220 DEG C, and the heating of high power component 5 does not reach this temperature much
Degree, therefore leading solder cream 4 from tin cream will not also melt.
(2) material of tin cream is simple metal, and compared with other media, such as conductive bond piece, tin cream do not contain resin etc.
Any nonmetallic materials so that tin cream thermal conductivity is more excellent.
It is the heat conduction and electric conductivity that make use of copper excellent using main body of the copper material as stepped high-thermal conductive metal block 3
Can, the heat on high power component 5 can be delivered to rapidly on fin 6 by stepped high-thermal conductive metal block 3 made of copper.
In order to which stepped high-thermal conductive metal block 3 and PCB is fixed, increase solder cream 4 between, it is adhered to ladder
The shoulder of groove 1.By being embedded to solder cream 4 in the pcb, PCB internal layer circuit conducting is realized, is had the advantage that：
(1) the conventional mode for realizing that metal level 2 is electrically connected with stepped high-thermal conductive metal block 3 and thermal conductivity is led to, be PCB with
Drilled on stepped high-thermal conductive metal block 3 and the via hole is realized, and this implementation processing difficulties, and hardly possible be present
The problem of plating.Above mentioned problem can be avoided by the way of solder cream 4 is embedded to.
(2) this technique does not have to consumption resin and electroplating liquid medicine etc., can save processing materials cost and relevant device cost.
(3) this technological process is simple, can greatly shorten the process-cycle.
The top surface that Fig. 2 can be seen that stepped high-thermal conductive metal block 3 is covered with layers of copper, and bottom surface is covered with layers of copper, by step type
High-thermal conductive metal block is encapsulated in PCB, ensure that PCB structural strength.Stepped high-thermal conductive metal block 3 and PCB is contour, and
PCB bottom surface is fixedly connected with fin 6.The setting one is to ensure the entirety of stepped high-thermal conductive metal block 3 and PCB
Property, stepped high-thermal conductive metal block 3 is embedded in PCB inside, therefore PCB can be installed stably；Second, in order that
Heat is scattered and disappeared rapidly from the outer surface of stepped high-thermal conductive metal block 3.Increase fin 6, heat and air can be increased
Contact area, realize more preferable temperature difference transmission.
Fin 6 covers stepped high-thermal conductive metal block 3 and via hole 7 to PCB in the present embodiment, can be by heat
Passed in time from PCB.Because via hole 7 is more narrow, heat is not easy therefrom to pass, therefore is set in its one end
Fin 6, can effectively it transfer heat on fin 6.
Referring to Fig. 3 and Fig. 4, conducted heat for high power component 5 and metal level 2 by stepped high-thermal conductive metal block 3
Schematic diagram.Fig. 3 shows the heat transfer that high power component 5 is carried out by stepped high-thermal conductive metal block 3, and this part is height
The major heat transfer paths of power component 5.Because the bottom of high power component 5 passes through solder cream 4 and stepped high heat conduction
Metal derby 3 contacts, and the two has the temperature difference again, therefore heat can mainly be conducted heat by way of heat transfer.Most of heat
Amount passes to stepped high-thermal conductive metal block 3 by the bottom of high power component 5.So, due to stepped high-thermal conductive metal
Block 3 close to high power component 5 side temperature is high, opposite side temperature is low, therefore heat can be continuously high from temperature
Side is delivered to opposite side.The heat and can of the low side of the stepped temperature of high-thermal conductive metal block 3 is delivered to enough by heat transfer
Form is delivered in fin 6, and heat mainly can be disseminated to air by fin 6 by heat transfer and the form of thermal convection current
In.
Fig. 4 shows the heat transfer that metal level 2 is carried out by stepped high-thermal conductive metal block 3, in addition, metal level 2 may be used also
To carry out heat transfer by via hole 7.Metal level 2 inside PCB can also produce a small amount of heat when in running order.This portion
Divide heat to be delivered to along metal level 2 in solder cream 4, then be delivered to the neck and shoulder of stepped high-thermal conductive metal block 3.
The neck and shoulder temperature of stepped high-thermal conductive metal block 3 are higher, and the spot temperature close to fin 6 is relatively low, and therefore, heat can
To be continuously delivered to opposite side from the high side of temperature.Transmission form after heat arrival fin 6 in Fig. 3 with transmitting
Form is identical.
Embodiment two：
The present embodiment provides the PCB of another quick heat radiating.Its cross-sectional view is as shown in figure 5, for simplicity, only describe
The distinctive points of embodiment two and embodiment one.Difference part is：
The present embodiment is to be combined the structure of stepped high-thermal conductive metal block 3 and fin 6, i.e., by fin 6
Laminated structure be arranged on stepped high-thermal conductive metal block 3, it is equally distributed sheet knot to make stepped high-thermal conductive metal block 3
Structure.Other structures are identical with embodiment one, will not be repeated here.
Embodiment three：
The present embodiment provides a kind of PCB of quick heat radiating, and its cross-sectional view is as shown in fig. 6, for simplicity, only description is real
Apply the distinctive points of example three and embodiment one.Difference part is：
The bottom surface of stepped high-thermal conductive metal block 3 protrudes PCB bottom surface, and fin 6 is close into stepped high-thermal conductive metal
Block 3 is set.Other structures are identical with embodiment one, will not be repeated here.
In known structure, using by after heat conductive metal layer 2, conducted into air by fin 6, still, produced
The medium transmitted scriptures of heat it is more, the heat that fin 6 is dissipated is fewer, is that the medium transmitted scriptures because among can be by major part
Heat absorption, can not but radiate.Therefore, the structure in the present embodiment, more rapidly and directly conduct heat away can be gone out.
In addition, PCB can also be formed by four core plate pressings, its concrete structure is as shown in fig. 7, will not be repeated here.In
In all embodiments of the present invention, each metal level 2 is preferably copper, or other conductive metal materials such as silver, aluminium, tungsten.
Applicant states that the present invention has carried out exemplary description by above-described embodiment, it is clear that present invention specific implementation
It is not subject to the restrictions described above, as long as employing changing for the various unsubstantialities of design and the technical scheme progress of the present invention
Enter, or it is not improved the design of the present invention and technical scheme are directly applied into other occasions, the equal protection models in the present invention
Within enclosing.
Claims (9)
- A kind of 1. PCB of quick heat radiating, it is characterised in that including：Step trough (1)；Stepped high-thermal conductive metal block (3), it is arranged in the step trough (1), the stepped high-thermal conductive metal block (3) Solder cream (4) is set between top surface and the high power component (5) for being arranged at the PCB surface；Solder cream (4) is set between the shoulder and metal level adjacent thereto (2) of the stepped high-thermal conductive metal block (3).
- 2. the PCB of quick heat radiating according to claim 1, it is characterised in that the stepped high-thermal conductive metal block (3) Material is copper.
- 3. the PCB of quick heat radiating according to claim 1, it is characterised in that the solder cream (4) is tin cream.
- 4. the PCB of quick heat radiating according to claim 1, it is characterised in that the stepped high-thermal conductive metal block (3) is buried Enter in the step trough (1).
- 5. the PCB of quick heat radiating according to claim 1, it is characterised in that the stepped high-thermal conductive metal block (3) The either flush of top surface and the PCB, and the bottom surface of the stepped high-thermal conductive metal block (3) is concordant with the bottom surface of the PCB.
- 6. the PCB of quick heat radiating according to claim 1, it is characterised in that the stepped high-thermal conductive metal block (3) Top surface is covered with layers of copper, and the bottom surface of the stepped high-thermal conductive metal block (3) is covered with layers of copper.
- 7. the PCB of quick heat radiating according to claim 6, it is characterised in that the bottom of the stepped high-thermal conductive metal block The bottom surface of face layers of copper is provided with fin (6).
- 8. the PCB of quick heat radiating according to claim 7, it is characterised in that also including via hole (7), itself and the gold Category layer (2) conducts.
- 9. the PCB of quick heat radiating according to claim 8, it is characterised in that the fin (6) covers the via hole (7)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165590.3A CN107734838B (en) | 2017-11-21 | 2017-11-21 | PCB capable of fast radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165590.3A CN107734838B (en) | 2017-11-21 | 2017-11-21 | PCB capable of fast radiating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107734838A true CN107734838A (en) | 2018-02-23 |
| CN107734838B CN107734838B (en) | 2019-12-20 |
Family
ID=61217873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711165590.3A Active CN107734838B (en) | 2017-11-21 | 2017-11-21 | PCB capable of fast radiating |
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| Country | Link |
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| CN (1) | CN107734838B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040629A (en) * | 2019-06-04 | 2020-12-04 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN113079635A (en) * | 2021-03-09 | 2021-07-06 | 赣州新联兴科技有限公司 | High-frequency high-speed PCB for 5G base station and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101066009A (en) * | 2004-11-30 | 2007-10-31 | Lm爱立信电话有限公司 | Printed board assembly with improved heat dissipation |
| CN201349023Y (en) * | 2009-01-16 | 2009-11-18 | 佛山市国星光电股份有限公司 | Substrate of heat radiating circuit |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Bury copper billet heat radiation PCB structure |
-
2017
- 2017-11-21 CN CN201711165590.3A patent/CN107734838B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101066009A (en) * | 2004-11-30 | 2007-10-31 | Lm爱立信电话有限公司 | Printed board assembly with improved heat dissipation |
| CN201349023Y (en) * | 2009-01-16 | 2009-11-18 | 佛山市国星光电股份有限公司 | Substrate of heat radiating circuit |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Bury copper billet heat radiation PCB structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040629A (en) * | 2019-06-04 | 2020-12-04 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN113079635A (en) * | 2021-03-09 | 2021-07-06 | 赣州新联兴科技有限公司 | High-frequency high-speed PCB for 5G base station and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107734838B (en) | 2019-12-20 |
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