CN107734839A - A kind of PCB - Google Patents
A kind of PCB Download PDFInfo
- Publication number
- CN107734839A CN107734839A CN201711165611.1A CN201711165611A CN107734839A CN 107734839 A CN107734839 A CN 107734839A CN 201711165611 A CN201711165611 A CN 201711165611A CN 107734839 A CN107734839 A CN 107734839A
- Authority
- CN
- China
- Prior art keywords
- heat
- metal derby
- pcb
- hole
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to PCB construction technical field, discloses a kind of PCB, including the substrate with step trough；Metal derby, it is arranged in the step trough, and the metal derby is identical with the shape of the step trough, and heat-conducting medium is set between the top surface and component of the metal derby；Heat emission hole, it is opened on the substrate, and the heat emission hole can carry out heat transfer with the metal derby.The present invention is by PCB internal notches and being embedded to the metal derby that is directly contacted with component, and open up the heat emission hole for being capable of heat transfer with metal derby, heat caused by component itself and the heat fast dissipation in PCB inner metal layers can be fallen in time, PCB heat dispersion is improved, extends the service life of PCB and component.
Description
Technical field
The present invention relates to PCB construction technical field, more particularly to a kind of PCB.
Background technology
Printed circuit board (Printed circuit board, abbreviation PCB), it is the offer of electronic component electrical connection
Person.With the development of electronics techniques, the design of component is towards Surface Mount, miniaturization and high density direction on pcb board
Development trend is more and more obvious, and component dominant frequency improves constantly, and the power consumption of single component gradually increases, and causes heat flow density
It is increased sharply.Therefore to ensure the service life of electronic equipment, must just solve the heat dissipation problem of high power component.Current one
As common radiator structure can not meet the radiating requirements of high power component, it is therefore desirable to a kind of heat dissipation structure comes
Realize effective radiating of high power component.
The content of the invention
It is an object of the invention to provide a kind of PCB, can effectively solve the problem that the problem of existing PCB heat dispersions are poor.
To use following technical scheme up to this purpose, the present invention：
A kind of PCB, including：
Substrate with step trough；
Metal derby, it is arranged in the step trough, and the metal derby is identical with the shape of the step trough, the metal
Heat-conducting medium is set between the top surface and component of block；
Heat emission hole, it is opened on the substrate, and the heat emission hole can carry out heat transfer with the metal derby.
Preferably, the heat emission hole includes blind hole, the bottom of the blind hole extends to the metal derby；And/or
The heat emission hole includes through hole, and the through hole is set through the metal derby.
Preferably, the heat emission hole is plated through-hole.
It is to carry out heat transfer with metal derby to realize that heat emission hole is arranged into blind hole or through hole and metallization, on the one hand may be used
So that the heat in metal level is conducted to metal derby, and then the fast dissipation that heat is realized into air is conducted by metal derby；
On the other hand, the heat transfer in metal level can be directly dissipated in air into heat emission hole, plays the work of auxiliary heat dissipation
With.
Preferably, the step trough is included compared with sulculus and larger slot, the heat emission hole is multiple and respectively positioned at described
Compared with the both sides of sulculus.
The setting can ensure to radiate hole machined when be straight hole processing form, reduce difficulty of processing, and with straight hole
Form carries out heat transfer with metal derby can improve conduction velocity, accelerate radiating rate；Set multiple heat emission holes can in time by
Quickly conduction dissipates heat in metal level, improves radiating efficiency, so as to improve PCB functional reliability, extends making for PCB
Use the life-span.
Preferably, the lower surface of the metal derby is concordant with the lower surface of the substrate.The structure setting on the one hand can
The inside of substrate is fixed on to ensure metal derby in the form of being embedded to, reduces PCB overall structure size, makes PCB structure
It is compacter, so as to ensure that PCB globality, facilitate PCB processing installation and be easy to lay layers of copper in PCB outer surface,
It is simultaneously also more attractive in appearance；On the other hand heat can be made to be dissipated from the bottom surface of metal derby rapidly.In addition, compared to prior art
In in the attachment of PCB lower surface or place the product of metal heat-conducting block, PCB integral thickness of the invention greatly reduces, and structure is more
Step up to gather.
Preferably, also including fin, it is positioned over the lower surface of the metal derby.This structure of increase fin,
The contact area of metal derby and extraneous air can be increased, realize more preferable temperature difference transmission, so as to more preferably realize heat faster
Dissipation.
Preferably, bonded between the metal derby metal level adjacent thereto by prepreg.Making PCB
When multiple core plates between formed by prepreg pressing, also glued here when fixed metal derby using identical
Material is tied, it is more complete in structure, and be easy to draw materials, cost of manufacture reduces.
Preferably, also including via hole, the via hole is located at the outside of the metal derby.Via hole belongs to a kind of electricity
Plated-through-hole, one effect are to be used to radiate, and it can conduct the heat in each metal levels of PCB into via hole, and will
Heat in interior metal layer is conducted to outer layer metal layer, plays a part of auxiliary heat dissipation；Another effect is to be used to turn on gold
Belong to layer, the copper foil circuit between two layers for connection PCB or multilayer.
Preferably, the material of the metal derby is copper.The main body of metal derby is made of copper, and being primarily due to copper has
Excellent heat conduction and electric conductivity, heat can be rapidly transferred to be dissipated on fin.
Preferably, the heat-conducting medium is tin cream.The selection of heat-conducting medium needs to ensure between metal derby and component
Conduct, heat transfer and it is firm bond, tin cream meets these requirements, and because the fusing point of tin cream is higher, about 150 DEG C -220
DEG C, the problems such as and heating temp of component does not reach this temperature, therefore tin cream is not in melting in use.
Compared with prior art, advantages of the present invention and beneficial effect are：
(1) metal derby is embedded to inside PCB, its one end is connected with component, and the other end is connected with fin, can be timely
Heat caused by component is conducted by metal derby, realizes the fast dissipation of heat, improve PCB heat dispersion and
The functional reliability of component, extend the service life of component；In addition, the structure of flush type reduces PCB overall knot
Structure size, PCB globality is ensure that, facilitate PCB processing installation and be easy to lay layers of copper in PCB outer surface, while
It is more attractive in appearance.
(2) heat emission hole and metal derby can carry out heat transfer, on the one hand by the heat in PCB each layer metal level conduct to
Metal derby, and then conducted by metal derby to the fast dissipation that heat is realized on fin, PCB functional reliability is improved, is prolonged
Long PCB service life；On the other hand the heat transfer in metal level can be directly dissipated in air into heat emission hole, risen
To the effect of auxiliary heat dissipation, the design structure of the heat emission hole is simple, handling ease, enhances the heat dispersion of the PCB.
(3) via hole is set through substrate, can not only be conducted the metal level inside PCB, is also acted auxiliary and is dissipated
The effect of heat, lift PCB heat dispersion.
(4) in the selection of Heat Conduction Material, metal derby choosing is made of copper, and its excellent heat conductivility can accelerate heat
Dissipate；Heat-conducting medium between component and metal derby selects tin cream, the heat conductivility that can ensure to need, electric conductivity and viscous
Knot is firmly required, and copper and tin cream are drawn materials easily.
Brief description of the drawings
Fig. 1 is the PCB of the embodiment of the present invention one structural representation；
Fig. 2 is the PCB of the embodiment of the present invention one component radiating schematic diagram；
Fig. 3 is the PCB of the embodiment of the present invention one metal level radiating schematic diagram；
Fig. 4 is the PCB of the embodiment of the present invention two structural representation；
Fig. 5 is the PCB of the embodiment of the present invention two component radiating schematic diagram；
Fig. 6 is the PCB of the embodiment of the present invention two metal level radiating schematic diagram.
In figure：
1st, substrate；2nd, metal derby；3rd, component；4th, heat-conducting medium；5th, heat emission hole；6th, metal level；7th, fin；8th, half is solid
Change piece；9th, via hole.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one
The present embodiment provides a kind of PCB, and the PCB is formed by three core plate pressings, but quantitatively not limited to this, such as also
Can be that two or four grade multiple core plates pressings form.As shown in Figure 1-Figure 3, its side is sticked component 3 to its structure, and
Heat emission hole 5 and via hole 9 are offered, step trough is offered in PCB substrate 1, including it is convex compared with sulculus and larger slot, the two composition
The step trough of font.The inside of step trough is embedded with metal derby 2, and the shape of metal derby 2 is identical with the shape of step trough, is
Convex shape.Wherein, heat emission hole 5 is blind hole form, and the bottom of blind hole extends to metal derby 2, in the present embodiment, it is necessary to heat emission hole
5 realize with metal derby 2 and conduct and heat transfer, and the method that the present embodiment uses is that heat emission hole 5 metallizes, and its specific practice is
In the hole wall copper plate of heat emission hole 5.The one side of heat emission hole 5 of metallization can conduct the heat in metal level 6 to metal derby
2, and then the fast dissipation that heat is realized into air is conducted by metal derby 2；On the other hand, can be by the heat in metal level 6
Amount, which is delivered in heat emission hole 5, to be directly dissipated in air, plays a part of auxiliary heat dissipation.
Further, heat emission hole 5 is arranged to the both sides of relatively sulculus that is multiple and being located at step trough respectively in the present embodiment.
The setting can ensure be when heat emission hole 5 is processed straight hole processing form, reduce difficulty of processing, and in the form of straight hole with gold
Category block 2, which carries out heat transfer, can improve conduction velocity, accelerate radiating rate；Set multiple heat emission holes 5 can be in time by metal level 6
In heat quickly conduction dissipate, improve radiating efficiency, so as to improve PCB functional reliability, extend PCB use the longevity
Life.
Thickness direction of the via hole 9 along PCB sets and runs through whole PCB and be located at the outside of metal derby 2, and it can make
PCB more metal layers 6 conduct.Via hole 9 belongs to a kind of electroplating ventilating hole, and its effect in the present embodiment is to be used for
Radiating, it can conduct the heat in each metal levels 6 of PCB into via hole 9, and the heat in interior metal layer 6 is passed
Outer layer metal layer 6 is directed at, plays a part of auxiliary heat dissipation；Another effect of via hole 9 is to be used to turn on metal level 6, is used for
Copper foil circuit between two layers of connection PCB or multilayer.
In the present embodiment, step trough and metal derby 2 are convex, are led between the convex portion top surface and component 3 of metal derby 2
Cross heat-conducting medium 4 to connect, lower surface is concordant with the lower surface of substrate 1, on the one hand so setting realizes metal derby 2 and component
3 direct contact, heat fast dissipation caused by component 3 can be fallen, metal derby 2 on the other hand can be ensured with embedment
Form is fixed on the inside of substrate 1, reduces PCB overall structure size, makes PCB structure compacter, so as to ensure that
PCB globality, facilitate PCB processing installation and be easy to lay layers of copper in PCB outer surface, at the same it is also more attractive in appearance；In addition
The lower surface of metal derby 2 is arranged to rather than depression concordant with the lower surface of substrate 1, can make heat rapidly from metal derby 2
Bottom surface dissipate.Compared in the prior art in the attachment of the lower surface of substrate or the product of placement metal heat-conducting block, the present invention
PCB integral thickness greatly reduce, structure is compacter.
Metal derby 2 can be by way of embedment or the mode of insertion is arranged in substrate 1.Specifically, embedded mode
For metal derby embedment is offered in the core plate and prepreg that overlap each other of groove, HTHP pressing, prepreg 8 exists
It can be filled into the gap between metal derby 2 and adjacent metal 6 in bonding processes, so that by its adhesive solidification together；
Metal derby 2 is embedded in step trough, gold by embedded mode to open up step trough on the substrate 1 after pressing by external mechanical force
Belong to block 2 to be interference fitted with step trough, so as to be fixed in substrate 1.The present embodiment preferentially selects embedded mode, and this is due to embedment
Mode disposably can complete the pressing of core plate and the fixation of metal derby 2 simultaneously, and bonding processes are simple, and cost of manufacture reduces, system
The PCB obtained is more complete in structure.
The PCB provided in the present embodiment also includes fin 7, and it is positioned over the lower surface of metal derby 2, under metal derby 2
Surface and via hole 9 contact with fin 7, this structure of increase fin 7, can increase metal derby 2 and extraneous air
Contact area, more preferable temperature difference transmission is realized, heat is quickly dissipated away from PCB in time；Because via hole 9 is narrower
Narrow, capacity of heat transmission is limited, therefore is set to contact with fin 7, can effectively conduct heat on fin 7,
Accelerate the dissipation of heat, play a part of auxiliary heat dissipation.
In the present embodiment, the material of metal derby 2 is preferably copper.The main body of metal derby 2 is made of copper, and is primarily due to copper
With excellent heat conduction and electric conductivity, heat can be conducted rapidly and be dissipated.It is understood that metal derby 2
Material can also be the good conductor of the heat such as silver, aluminium or tungsten, and silver-colored heat conductivility is best, but cost is higher, processing technology difficulty
Also it is higher, it can be used in high-accuracy electronic product；The heat conductivility of aluminium and tungsten is slightly poorer than copper, still can be little for heat dissipation capacity
Component uses.
In addition, above-mentioned heat-conducting medium 4 from ensure to conduct between metal derby 2 and component 3, heat transfer and firm viscous
Knot, the preferred tin cream of the present embodiment, because the fusing point of tin cream is higher, about 150 DEG C -220 DEG C, and the heating temp of component 3 reaches
Less than this temperature, therefore the problems such as tin cream as heat-conducting medium 4 is not in melting in use.
The operation principle of the present embodiment one is illustrated below：
Fig. 2 is the radiating principle schematic diagram of component 3.The convex portion upper surface of component 3 and metal derby 2 passes through heat-conducting medium
4 connections, temperature rise when being worked due to component 3, are produced heat, cause component 3 and metal derby 2 to have the temperature difference, therefore
Heat caused by component 3 is conducted by heat-conducting medium 4 to metal derby 2, to be delivered to the heat of metal derby 2 and conducts again to fin
In 7, heat is dissipated in air by fin 7.Because metal derby 2 is high close to the side temperature of component 3, and close to fin
The temperature of 7 sides is low, therefore heat continuously can be delivered to opposite side from the high side of temperature.Therefore component 3 produces
Heat constantly can just be dissipated by metal derby 2 and fin 7.
Fig. 3 is the radiating principle schematic diagram of metal level 6.Heat part conduction in metal level 6 to heat emission hole 5 and turns on
On the inwall in hole 9, dissipated so as to which heat exchange occur with air；Another part heat conducted through heat emission hole 5 to metal derby 2 and then
Conduction to fin 7 is dissipated in air；Some is conducted to dissipating on fin 7 through via hole 9.Metal level 6
Generally copper foil, therefore its heat conduction rate is consistent substantially with metal derby 2.It should be noted that above two-way radiation processes
It can occur simultaneously, point of no priority.
Embodiment two
The present embodiment provides a kind of PCB, and the PCB is formed by three core plate pressings, but quantitatively not limited to this, such as also
Can be that two or four grade multiple core plates pressings form.For simplicity, the difference of embodiment two and embodiment one is only described
Point.Difference part is：
Referring to Fig. 4-Fig. 6, the heat emission hole 5 in the present embodiment is through-hole form, and through hole sets and extended to through metal derby 2
Fin 7.The setting of through hole can increase the contact area with metal derby 2, can quickly conduct more heats to metal
Block 2, and it is in contact with fin 7, and heat can be directly conducted to fin 7 via the layers of copper of through-hole wall and be consumed
Dissipate.
The operation principle of the present embodiment two is illustrated below：
Fig. 5 is the radiating principle schematic diagram of component 3.The convex portion upper surface of component 3 and metal derby 2 passes through heat-conducting medium
4 connections, because the two has the temperature difference, therefore heat is conducted to metal derby 2 by heat-conducting medium 4 caused by component 3, is delivered to
A heat part for metal derby 2 is conducted to fin 7 and is dissipated in air directly down, and a part passes through the inwall of heat emission hole 5
Layers of copper and air heat exchange occur dissipate；Some is conducted to dissipating on fin 7 through heat emission hole 5.Due to
Metal derby 2 is high close to the side temperature of component 3, and the temperature close to the side of fin 7 is low, therefore heat can be continuously
The side high from temperature is delivered to opposite side.Therefore heat caused by component 3 just can constantly pass through metal derby 2, fin 7
Dissipated with heat emission hole 5.
Fig. 6 is the radiating principle schematic diagram of metal level 6.Heat part conduction in metal level 6 to heat emission hole 5 and turns on
On the inwall in hole 9, heat exchange occurs with air and dissipates；Another part is conducted into metal derby 2 through heat emission hole 5, is then conducted
It is dissipated to fin 7 in air；Some is conducted to dissipating on fin 7 through heat emission hole 5 and via hole 9.Gold
Belong to layer 6 and be generally copper foil, therefore its heat conduction rate is consistent substantially with metal derby 2.It should be noted that above two-way radiates
Process can occur simultaneously, point of no priority.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating example of the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the field, may be used also on the basis of the above description
To make other changes in different forms.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (10)
- A kind of 1. PCB, it is characterised in that including：Substrate (1) with step trough；Metal derby (2), it is arranged in the step trough, and the metal derby (2) is identical with the shape of the step trough, the gold Heat-conducting medium (4) is set between the top surface and component (3) of category block (2)；Heat emission hole (5), it is opened on the substrate (1), and the heat emission hole (5) can carry out hot biography with the metal derby (2) Lead.
- 2. PCB according to claim 1, it is characterised in that the heat emission hole (5) includes blind hole, the bottom of the blind hole Extend to the metal derby (2)；And/orThe heat emission hole (5) includes through hole, and the through hole is set through the metal derby (2).
- 3. PCB according to claim 1, it is characterised in that the heat emission hole (5) is plated through-hole.
- 4. PCB according to claim 1, it is characterised in that the step trough is included compared with sulculus and larger slot, the radiating Hole (5) is multiple and respectively positioned at the both sides compared with sulculus.
- 5. PCB according to claim 1, it is characterised in that the lower surface of the metal derby (2) and the substrate (1) Lower surface is concordant.
- 6. PCB according to claim 1, it is characterised in that also including fin (7), it is positioned over the metal derby (2) Lower surface.
- 7. PCB according to claim 1, it is characterised in that between the metal derby (2) metal level (6) adjacent thereto Bonded by prepreg (8).
- 8. PCB according to claim 1, it is characterised in that also including via hole (9), the via hole (9) is positioned at described The outside of metal derby (2).
- 9. PCB according to claim 1, it is characterised in that the material of the metal derby (2) is copper.
- 10. PCB according to claim 1, it is characterised in that the heat-conducting medium (4) is tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165611.1A CN107734839A (en) | 2017-11-21 | 2017-11-21 | A kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165611.1A CN107734839A (en) | 2017-11-21 | 2017-11-21 | A kind of PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107734839A true CN107734839A (en) | 2018-02-23 |
Family
ID=61216564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711165611.1A Pending CN107734839A (en) | 2017-11-21 | 2017-11-21 | A kind of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107734839A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108601203A (en) * | 2018-04-26 | 2018-09-28 | 生益电子股份有限公司 | A kind of PCB and PCBA |
| CN111867236A (en) * | 2020-08-20 | 2020-10-30 | 景旺电子科技(龙川)有限公司 | Circuit board and manufacturing method thereof |
| CN112040629A (en) * | 2019-06-04 | 2020-12-04 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN112888182A (en) * | 2020-02-04 | 2021-06-01 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
| CN113015339A (en) * | 2021-03-01 | 2021-06-22 | 鹤山市世拓电子科技有限公司 | Manufacturing method of embedded ceramic circuit board and embedded ceramic circuit board |
Citations (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5394301A (en) * | 1993-02-03 | 1995-02-28 | Robert Bosch Gmbh | Arrangement for dissipating heat from power components assembled on a printed-circuit board |
| JP2002217328A (en) * | 2001-01-19 | 2002-08-02 | Kyocera Corp | Package for containing semiconductor element |
| JP2003007937A (en) * | 2001-06-26 | 2003-01-10 | Fujikura Ltd | Electronic part mounting module and manufacturing method thereof |
| CN1428829A (en) * | 2001-12-18 | 2003-07-09 | Lg电子株式会社 | Method for mfg. semiconductor assembly |
| CN1489432A (en) * | 2002-08-23 | 2004-04-14 | 阿尔卑斯电气株式会社 | Radiating structure for electronic circuit device capalbe of efficiently radiating heat for heating element |
| CN1838868A (en) * | 2005-03-25 | 2006-09-27 | 华为技术有限公司 | Printed circuit board assembly and its processing method |
| CN101066008A (en) * | 2004-11-30 | 2007-10-31 | Lm爱立信电话有限公司 | Printed board assembly with improved heat dissipation |
| CN101066009A (en) * | 2004-11-30 | 2007-10-31 | Lm爱立信电话有限公司 | Printed board assembly with improved heat dissipation |
| CN101109501A (en) * | 2006-07-19 | 2008-01-23 | Alti电子株式会社 | Cooling device for light emitting diode (led) module and method for fabricating the same |
| CN101394052A (en) * | 2007-09-18 | 2009-03-25 | 日本航空电子工业株式会社 | Heat transfer member and connector |
| CN101460018A (en) * | 2007-12-14 | 2009-06-17 | 华为技术有限公司 | Printed circuit board, manufacturing method and radio-frequency apparatus thereof |
| CN201349024Y (en) * | 2009-01-16 | 2009-11-18 | 佛山市国星光电股份有限公司 | Substrate of heat radiating circuit |
| CN201349023Y (en) * | 2009-01-16 | 2009-11-18 | 佛山市国星光电股份有限公司 | Substrate of heat radiating circuit |
| CN102098870A (en) * | 2011-03-10 | 2011-06-15 | 沈李豪 | Composite printed circuit board (PCB) and manufacturing method thereof |
| CN201986260U (en) * | 2011-03-10 | 2011-09-21 | 沈李豪 | Composite PCB |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
| CN102333414A (en) * | 2011-09-02 | 2012-01-25 | 深圳创动科技有限公司 | Heat dissipation structure, manufacturing method for the same and electronic device with the same |
| CN202231950U (en) * | 2011-09-02 | 2012-05-23 | 深圳创动科技有限公司 | Radiating structure and electronic equipment employing same |
| CN102510663A (en) * | 2011-09-29 | 2012-06-20 | 华为技术有限公司 | Printed board component and processing method thereof |
| CN202444696U (en) * | 2012-02-27 | 2012-09-19 | 孙井斌 | High-thermal conductivity combined circuit board |
| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
| JP2013098185A (en) * | 2011-10-27 | 2013-05-20 | Ain:Kk | Wiring board with heat sink and method for manufacturing the same |
| CN203015266U (en) * | 2012-11-09 | 2013-06-19 | 欧司朗有限公司 | Circuit board used for lighting device and lighting device having same circuit board |
| CN104284533A (en) * | 2008-09-28 | 2015-01-14 | 华为技术有限公司 | Multilayer circuit board, manufacturing method of multilayer circuit board and communication device |
| DE102014202196B3 (en) * | 2014-02-06 | 2015-03-12 | Ifm Electronic Gmbh | Printed circuit board and circuit arrangement |
| CN204634147U (en) * | 2015-03-13 | 2015-09-09 | 刘亚 | A kind of concentrated cooling circuit board |
| CN105578735A (en) * | 2016-03-14 | 2016-05-11 | 龙南骏亚电子科技有限公司 | High-heat-conduction multilayer circuit board |
| CN105764247A (en) * | 2016-05-09 | 2016-07-13 | 深圳市博敏电子有限公司 | High-temperature-resistance large-power intense-current printed circuit board and manufacturing method thereof |
| CN106550538A (en) * | 2015-09-21 | 2017-03-29 | 深南电路股份有限公司 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
| CN106879169A (en) * | 2017-04-25 | 2017-06-20 | 安徽宏鑫电子科技有限公司 | A kind of printed circuit board |
| CN107343353A (en) * | 2016-05-03 | 2017-11-10 | 无锡深南电路有限公司 | A kind of thick copper pcb board and its radiating processing method |
| CN206650917U (en) * | 2017-04-07 | 2017-11-17 | 联能科技（深圳）有限公司 | A kind of radiating printed circuit board structure |
-
2017
- 2017-11-21 CN CN201711165611.1A patent/CN107734839A/en active Pending
Patent Citations (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5394301A (en) * | 1993-02-03 | 1995-02-28 | Robert Bosch Gmbh | Arrangement for dissipating heat from power components assembled on a printed-circuit board |
| JP2002217328A (en) * | 2001-01-19 | 2002-08-02 | Kyocera Corp | Package for containing semiconductor element |
| JP2003007937A (en) * | 2001-06-26 | 2003-01-10 | Fujikura Ltd | Electronic part mounting module and manufacturing method thereof |
| CN1428829A (en) * | 2001-12-18 | 2003-07-09 | Lg电子株式会社 | Method for mfg. semiconductor assembly |
| CN1489432A (en) * | 2002-08-23 | 2004-04-14 | 阿尔卑斯电气株式会社 | Radiating structure for electronic circuit device capalbe of efficiently radiating heat for heating element |
| CN101066008A (en) * | 2004-11-30 | 2007-10-31 | Lm爱立信电话有限公司 | Printed board assembly with improved heat dissipation |
| CN101066009A (en) * | 2004-11-30 | 2007-10-31 | Lm爱立信电话有限公司 | Printed board assembly with improved heat dissipation |
| CN1838868A (en) * | 2005-03-25 | 2006-09-27 | 华为技术有限公司 | Printed circuit board assembly and its processing method |
| CN101109501A (en) * | 2006-07-19 | 2008-01-23 | Alti电子株式会社 | Cooling device for light emitting diode (led) module and method for fabricating the same |
| CN101394052A (en) * | 2007-09-18 | 2009-03-25 | 日本航空电子工业株式会社 | Heat transfer member and connector |
| CN101460018A (en) * | 2007-12-14 | 2009-06-17 | 华为技术有限公司 | Printed circuit board, manufacturing method and radio-frequency apparatus thereof |
| CN104284533A (en) * | 2008-09-28 | 2015-01-14 | 华为技术有限公司 | Multilayer circuit board, manufacturing method of multilayer circuit board and communication device |
| CN201349024Y (en) * | 2009-01-16 | 2009-11-18 | 佛山市国星光电股份有限公司 | Substrate of heat radiating circuit |
| CN201349023Y (en) * | 2009-01-16 | 2009-11-18 | 佛山市国星光电股份有限公司 | Substrate of heat radiating circuit |
| CN102098870A (en) * | 2011-03-10 | 2011-06-15 | 沈李豪 | Composite printed circuit board (PCB) and manufacturing method thereof |
| CN201986260U (en) * | 2011-03-10 | 2011-09-21 | 沈李豪 | Composite PCB |
| CN102333414A (en) * | 2011-09-02 | 2012-01-25 | 深圳创动科技有限公司 | Heat dissipation structure, manufacturing method for the same and electronic device with the same |
| CN202231950U (en) * | 2011-09-02 | 2012-05-23 | 深圳创动科技有限公司 | Radiating structure and electronic equipment employing same |
| CN102307429A (en) * | 2011-09-02 | 2012-01-04 | 东莞生益电子有限公司 | Embedded high-thermal conductive PCB and manufacturing method thereof |
| CN102510663A (en) * | 2011-09-29 | 2012-06-20 | 华为技术有限公司 | Printed board component and processing method thereof |
| CN103096638A (en) * | 2011-10-27 | 2013-05-08 | 北大方正集团有限公司 | Press-in type high thermal conductive printed circuit board (PCB) and manufacture method thereof |
| JP2013098185A (en) * | 2011-10-27 | 2013-05-20 | Ain:Kk | Wiring board with heat sink and method for manufacturing the same |
| CN202444696U (en) * | 2012-02-27 | 2012-09-19 | 孙井斌 | High-thermal conductivity combined circuit board |
| CN203015266U (en) * | 2012-11-09 | 2013-06-19 | 欧司朗有限公司 | Circuit board used for lighting device and lighting device having same circuit board |
| DE102014202196B3 (en) * | 2014-02-06 | 2015-03-12 | Ifm Electronic Gmbh | Printed circuit board and circuit arrangement |
| CN204634147U (en) * | 2015-03-13 | 2015-09-09 | 刘亚 | A kind of concentrated cooling circuit board |
| CN106550538A (en) * | 2015-09-21 | 2017-03-29 | 深南电路股份有限公司 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
| CN105578735A (en) * | 2016-03-14 | 2016-05-11 | 龙南骏亚电子科技有限公司 | High-heat-conduction multilayer circuit board |
| CN107343353A (en) * | 2016-05-03 | 2017-11-10 | 无锡深南电路有限公司 | A kind of thick copper pcb board and its radiating processing method |
| CN105764247A (en) * | 2016-05-09 | 2016-07-13 | 深圳市博敏电子有限公司 | High-temperature-resistance large-power intense-current printed circuit board and manufacturing method thereof |
| CN206650917U (en) * | 2017-04-07 | 2017-11-17 | 联能科技（深圳）有限公司 | A kind of radiating printed circuit board structure |
| CN106879169A (en) * | 2017-04-25 | 2017-06-20 | 安徽宏鑫电子科技有限公司 | A kind of printed circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108601203A (en) * | 2018-04-26 | 2018-09-28 | 生益电子股份有限公司 | A kind of PCB and PCBA |
| CN112040629A (en) * | 2019-06-04 | 2020-12-04 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method thereof |
| CN112888182A (en) * | 2020-02-04 | 2021-06-01 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
| CN111867236A (en) * | 2020-08-20 | 2020-10-30 | 景旺电子科技(龙川)有限公司 | Circuit board and manufacturing method thereof |
| CN113015339A (en) * | 2021-03-01 | 2021-06-22 | 鹤山市世拓电子科技有限公司 | Manufacturing method of embedded ceramic circuit board and embedded ceramic circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107734839A (en) | A kind of PCB | |
| CN107896423B (en) | PCB capable of fast radiating | |
| CN107896421A (en) | A kind of PCB of quick heat radiating | |
| CN107734837B (en) | PCB capable of fast radiating | |
| CN206564724U (en) | A kind of cooling circuit board, circuit board assemblies and electronic equipment | |
| CN208819865U (en) | Switching tube and its chip assembly | |
| CN105099564A (en) | Encapsulation structure and optical module | |
| CN209767915U (en) | PCB board with rapid heat dissipation | |
| CN107734838B (en) | PCB capable of fast radiating | |
| CN209787545U (en) | Printed circuit board | |
| CN208317104U (en) | The two-sided PCB circuit board radiator structure of multi-layered high-density | |
| CN107896422A (en) | A kind of PCB of quick heat radiating | |
| CN206931586U (en) | A kind of chip-packaging structure | |
| CN206323638U (en) | A kind of high thermal conductivity buries copper billet circuit board | |
| CN107683016A (en) | A kind of quick heat radiating PCB | |
| CN108200714A (en) | A kind of PCB and its manufacturing method | |
| CN107172803A (en) | A kind of electronic equipment of high radiating | |
| CN207766643U (en) | A kind of high-speed high frequency circuit board with SHD figure layers | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN207692149U (en) | A kind of multi-layer PCB board with conductive structure | |
| CN207692144U (en) | A kind of two-sided copper foil circuit adds aluminium to radiate layer circuit board | |
| CN108055765A (en) | The manufacturing method and PCB of a kind of PCB | |
| CN206134677U (en) | High resistance precision chip resistor of metal sheet structure high power | |
| CN209488905U (en) | One kind being based on consent type aluminum substrate | |
| CN205179511U (en) | Power electronic component circuit board of high heat dissipating ability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180223 |
|
| RJ01 | Rejection of invention patent application after publication |