CN106550538A - Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit - Google Patents
Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit Download PDFInfo
- Publication number
- CN106550538A CN106550538A CN201510604486.4A CN201510604486A CN106550538A CN 106550538 A CN106550538 A CN 106550538A CN 201510604486 A CN201510604486 A CN 201510604486A CN 106550538 A CN106550538 A CN 106550538A
- Authority
- CN
- China
- Prior art keywords
- metal derby
- circuit
- internal layer
- core material
- polylith
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
Abstract
Embodiments provide the board structure of circuit and processing method of a kind of metal derby and internal layer circuit conducting, for solving the problems, such as the above-mentioned multiple technologies of metal derby of the prior art and the board structure of circuit presence of internal layer circuit conducting, to reduce production cost, improve radiating effect and effectiveness, more conducively circuit board miniaturization and integrated from now on.Present invention method includes：S1, offer polylith core material and metal derby；S2, polylith core material is processed, obtains inner figure and groove；S3, metal derby is positioned in groove, the first conductive adhesive piece is placed between metal derby and inner figure, after being pressed, obtain the circuit board of metal derby and internal layer circuit conducting.
Description
Technical field
The present invention relates to circuit board technology field, and in particular to the electricity that a kind of metal derby is turned on internal layer circuit
Road plate structure and machining method.
Background technology
At present, in prior art metal derby and internal layer circuit connection, be using drilling blind hole, through hole and
The scheme of blind slot, realizes the conducting with internal layer circuit eventually through electrodeposited coating, as shown in figure 1, by logical
Electrodeposited coating 104 in hole 101, blind hole 102 and blind slot 103, realizes metal derby 107 and internal layer circuit
105 conducting.
Prior art metal derby is had the disadvantages that with the connection of internal layer circuit：
1st, blind slot is drilled and is processed, is required to using an operation realize leading for metal derby and internal layer circuit
It is logical, cause relatively costly.
2nd, drill and process blind slot and metal derby can be lost, be unfavorable for printed circuit board (Printed Circuit
Board, PCB) or components and parts radiating.
3rd, drilling can have certain restriction to drill bit size, and ordinary circumstance can only use more than diameter 0.7mm
Drill bit processing, be unfavorable for the processing of precise circuit from now on, affect miniaturization and integrated.
4th, the connection of internal layer circuit and metal derby, remaining guiding path are more, can affect effectiveness.
The content of the invention
Embodiments provide board structure of circuit and the processing side of a kind of metal derby and internal layer circuit conducting
Method, it is above-mentioned for solve that the board structure of circuit that metal derby of the prior art and internal layer circuit turn on is present
Multiple technologies problem, it is to reduce production cost, improve radiating effect and effectiveness, more conducively modern
Circuit board miniaturization and integrated afterwards.
First aspect present invention provides the processing side of a kind of metal derby and the board structure of circuit of internal layer circuit conducting
Method, it is characterised in that comprise the following steps：
S1, offer polylith core material and metal derby；
S2, the polylith core material is processed, obtains inner figure and groove, the groove with
The metal derby matches；
S3, the metal derby is positioned in the groove, the metal derby and the inner figure it
Between place the first conductive adhesive piece, after being pressed, obtain the electricity of the metal derby and internal layer circuit conducting
Road plate.
Second aspect present invention provides the board structure of circuit of a kind of metal derby and internal layer circuit conducting, its feature
It is, including：
Polylith core material, metal derby and the first conductive adhesive piece；
The polylith core material has inner figure, and the inner figure has part conductive with described first
Adhesive sheet connects, and the first conductive adhesive piece is connected with the metal derby.
Therefore, metal derby and inner figure are turned on by the embodiment of the present invention by conductive adhesive piece, phase
Than achieving following technique effect with prior art：
In the present invention, conductive adhesive piece is placed by the contact surface in metal derby and inner figure, realize gold
The conducting of category block and inner figure, it is not necessary to drilled and processed the operation of blind slot, reduce processing
Step, has saved cost；Meanwhile, no operation for being drilled on metal derby and being processed blind slot makes
Obtain metal derby not to be lost, therefore improve the thermal diffusivity of circuit board；Need not drill, then not receive drill bit
The interference of the restriction of size, does not have circuit inside metal derby, can cause circuit board miniaturization and integrated
It is higher；Internal layer circuit is only connected by conductive adhesive piece with metal derby, is not had unnecessary guiding path, is subtracted
Little signal transmission distance, improves the efficiency of transmission of signal.
Description of the drawings
Fig. 1 is the schematic diagram of a kind of existing metal derby and the board structure of circuit of internal layer circuit conducting；
Processing methods of the Fig. 2 for the board structure of circuit of the metal derby and internal layer circuit conducting of the embodiment of the present invention
Flow chart；
Fig. 3 provides the schematic diagram of metal derby and polylith core material for the embodiment of the present invention；
Fig. 4 obtains the schematic diagram of inner figure and groove for the embodiment of the present invention；
Fig. 5 is one embodiment of embodiment of the present invention metal derby and the board structure of circuit of internal layer circuit conducting
Schematic diagram；
Fig. 6 obtains the schematic diagram of prepreg and the first conductive adhesive piece for the embodiment of the present invention；
Fig. 7 is another enforcement of embodiment of the present invention metal derby and the board structure of circuit of internal layer circuit conducting
Illustrate and be intended to.
Specific embodiment
Embodiments provide board structure of circuit and the processing side of a kind of metal derby and internal layer circuit conducting
Method, it is above-mentioned for solve that the board structure of circuit that metal derby of the prior art and internal layer circuit turn on is present
Multiple technologies problem, it is to reduce production cost, improve radiating effect and effectiveness, more conducively modern
Circuit board miniaturization and integrated afterwards.
In order to be illustrated more clearly that embodiment of the present invention technical scheme, below will be to embodiment and prior art
Needed for description, accompanying drawing to be used is briefly described, it should be apparent that, drawings in the following description are only
Only it is some embodiments of the present invention, for those of ordinary skill in the art, is not paying creativeness
On the premise of work, can be with according to these other accompanying drawings of accompanying drawings acquisition.
Below by specific embodiment, it is described in detail respectively.
Embodiment one,
Fig. 2 is referred to, the embodiment of the present invention provides the board structure of circuit of a kind of metal derby and internal layer circuit conducting
Processing method, the method may include following steps：
Step S1, offer polylith core material and metal derby；
As shown in figure 3, the embodiment of the present invention provides polylith core material 301, and the metal derby of convex
302。
In the embodiment of the present invention, core material 301 can be double face copper, or be based on two-sided
The multi-layer sheet that copper-clad plate pressing is obtained, the material of metal derby 302 is the heat conduction systems such as copper, aluminum, molybdenum or molybdenum copper
Metal of the number more than 25w/mk.
It should be noted that the shape of metal derby 302 can also be square, or other shapes, specifically
Do not limit.
Step S2, polylith core material is processed, obtains inner figure and groove,
In the embodiment of the present invention, the processing of predefined internal layer circuit is carried out to polylith core material 301,
Inner figure 402 as shown in Figure 4 is obtained, metal derby 302 is corresponded to polylith core material 301
Position carries out groove milling, obtains groove 401, the metal derby in the groove 401 of core material 301 and Fig. 3
302 match.
S3, metal derby is positioned in groove, first is placed between metal derby and inner figure conductive viscous
Contact pin, after being pressed, obtains the circuit board of metal derby and internal layer circuit conducting.
In the embodiment of the present invention, metal derby 302 is positioned in groove 401, metal derby 302 with it is interior
The first conductive adhesive piece 501 is placed between layer pattern 402, the first conductive adhesive piece 501 is that volume resistance is little
In the adhesive sheet of 0.5 Ω/cm, after being pressed, the circuit board of metal derby and internal layer circuit conducting is obtained.
Optionally, as shown in fig. 6, before being pressed, there is provided many with what core material 301 was matched
Block prepreg 602, carries out slot treatment to polylith prepreg 602 according to groove 302, after processing
Polylith prepreg 502 be positioned between multilamellar core material 301.
Optionally, before the first conductive adhesive piece 501 is placed, there is provided the second conductive adhesive piece 601, root
Second conductive adhesive piece 601 is processed according to contact surface of the metal derby 302 with inner figure 402, obtained
To the first conductive adhesive piece 501.
In sum, metal derby and inner figure are turned on by the embodiment of the present invention by conductive adhesive piece, phase
Than achieving following technique effect with prior art：
In the present invention, conductive adhesive piece is placed by the contact surface in metal derby and inner figure, realize gold
The conducting of category block and inner figure, it is not necessary to drilled and processed the operation of blind slot, reduce processing
Step, has saved cost；Meanwhile, no operation for being drilled on metal derby and being processed blind slot makes
Obtain metal derby not to be lost, therefore improve the thermal diffusivity of circuit board；Need not drill, then not receive drill bit
The interference of the restriction of size, does not have circuit inside metal derby, can cause circuit board miniaturization and integrated
It is higher；Internal layer circuit is only connected by conductive adhesive piece with metal derby, is not had unnecessary guiding path, is subtracted
Little signal transmission distance, improves the efficiency of transmission of signal.
Below with a concrete scene embodiment to the board structure of circuit of metal derby and internal layer circuit conducting plus
Work method is described in detail, specific as follows：
As shown in Figure 3, there is provided three pieces of core materials 301, core material can be double face copper, also may be used
Being based on the double face copper multi-layer sheet that obtains of pressing, there is provided convex metal block 302, metal derby 302
Material is metal of the heat conductivitys such as copper, aluminum, molybdenum or molybdenum copper more than 25w/mk.
The processing of predefined internal layer circuit is carried out to three pieces of core materials 301, is obtained as shown in Figure 4
Inner figure 402, milling is carried out to the position that three pieces of core materials 301 correspond to convex metal block 302
Groove, obtains groove 401, and groove 401 and the metal derby 302 in Fig. 3 of core material 301 are to match
's.
As shown in Figure 6, there is provided two pieces of prepregs 602 matched with core material 301, according to groove
302 pairs of prepregs 602 carry out slot treatment, by process after two pieces of prepregs 502 be positioned over three pieces
Between core material 301, there is provided one piece of second conductive adhesive piece 601, the first conductive adhesive piece 601 is body
Adhesive sheet of the product resistance less than 0.5 Ω/cm, according to metal derby 302 and the contact surface pair of inner figure 402
Second conductive adhesive piece 601 is processed, and obtains the first conductive adhesive piece 501, metal derby 302 is placed
In groove 401, the first conductive adhesive piece 501 is placed between metal derby 302 and inner figure 402,
Pressed, obtained the circuit board of metal derby and internal layer circuit conducting.
It should be noted that the shape of metal derby 302 can also be square, or other shapes, specifically
Do not limit, when metal derby 302 is square, the circuit board that the metal derby for obtaining is turned on internal layer circuit
As shown in Figure 7.
Embodiment two,
Refer to shown in Fig. 5, the embodiment of the present invention provides the circuit of a kind of metal derby and internal layer circuit conducting
Hardened structure, it may include：
Polylith core material 301, metal derby 302 and the first conductive adhesive piece 501；
Polylith core material 301 has inner figure 402, and inner figure 402 has part conductive with first viscous
Contact pin 501 connects, and the first conductive adhesive piece 501 is connected with metal derby 302.
Optionally, board structure of circuit also includes：
There is between multilamellar core material 301 polylith prepreg 502.
It should be noted that the material of metal derby is the heat conductivitys such as copper, aluminum, molybdenum or molybdenum copper is more than 25w/mk
Metal.
It should be noted that metal derby is shaped as convex or square etc..
It should be noted that conductive adhesive piece is adhesive sheet of the volume resistance less than 0.5 Ω/cm.
In sum, metal derby and inner figure are turned on by the embodiment of the present invention by conductive adhesive piece, phase
Than achieving following technique effect with prior art：
In the present invention, conductive adhesive piece is placed by the contact surface in metal derby and inner figure, realize gold
The conducting of category block and inner figure, it is not necessary to drilled and processed the operation of blind slot, reduce processing
Step, has saved cost；Meanwhile, no operation for being drilled on metal derby and being processed blind slot makes
Obtain metal derby not to be lost, therefore improve the thermal diffusivity of circuit board；Need not drill, then not receive drill bit
The interference of the restriction of size, does not have circuit inside metal derby, can cause circuit board miniaturization and integrated
It is higher；Internal layer circuit is only connected by conductive adhesive piece with metal derby, is not had unnecessary guiding path, is subtracted
Little signal transmission distance, improves the efficiency of transmission of signal.
A kind of circuit board for realizing metal derby and internal layer circuit conducting that above embodiment of the present invention is provided
Structure and machining method is described in detail, but the explanation of above example is only intended to help and understands this
The method and its core concept of invention, should not be construed as limiting the invention.The technology of the art
Personnel, according to the present invention thought, the invention discloses technical scope in, the change that can be readily occurred in
Or replace, should all be included within the scope of the present invention.
Claims (9)
1. the processing method of the board structure of circuit of a kind of metal derby and internal layer circuit conducting, it is characterised in that
Comprise the following steps：
S1, offer polylith core material and metal derby；
S2, the polylith core material is processed, obtains inner figure and groove, the groove with
The metal derby matches；
S3, the metal derby is positioned in the groove, the metal derby and the inner figure it
Between place the first conductive adhesive piece, after being pressed, obtain the electricity of the metal derby and internal layer circuit conducting
Road plate.
2. processing method according to claim 1, it is characterised in that described to the polylith internal layer
Central layer is processed, and obtaining inner figure and groove includes：
The processing of predefined internal layer circuit is carried out to the polylith core material, inner figure is obtained；
Groove milling is carried out to the position that the polylith core material corresponds to the metal derby, groove is obtained.
3. the processing method according to the claim 1, it is characterised in that described to obtain the gold
Before the circuit board that category block is turned on the internal layer circuit, also include：
The polylith prepreg that offer is matched with the multilamellar core material；
Slot treatment is carried out to the polylith prepreg according to the groove, by process after the polylith
Prepreg is positioned between the multilamellar core material.
4. processing method according to claim 1, it is characterised in that methods described also includes：
Second conductive adhesive piece is provided；
According to the metal derby and the contact surface of the inner figure to the second conductive adhesive piece at
Reason, obtains the first conductive adhesive piece.
5. the board structure of circuit that a kind of metal derby is turned on internal layer circuit, it is characterised in that include：
Polylith core material, metal derby and the first conductive adhesive piece；
The polylith core material has inner figure, and the inner figure has part conductive with described first
Adhesive sheet connects, and the first conductive adhesive piece is connected with the metal derby.
6. board structure of circuit according to claim 5, it is characterised in that the board structure of circuit is also
Including：
There is between the multilamellar core material polylith prepreg.
7. board structure of circuit according to claim 5, it is characterised in that the material of the metal derby
It is more than the metal of 25w/mk for heat conductivitys such as copper, aluminum, molybdenum or molybdenum copper.
8. board structure of circuit according to claim 5, it is characterised in that the shape of the metal derby
For convex or square etc..
9. board structure of circuit according to claim 5, it is characterised in that the conductive adhesive piece is
Adhesive sheet of the volume resistance less than 0.5 Ω/cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510604486.4A CN106550538A (en) | 2015-09-21 | 2015-09-21 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510604486.4A CN106550538A (en) | 2015-09-21 | 2015-09-21 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106550538A true CN106550538A (en) | 2017-03-29 |
Family
ID=58365289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510604486.4A Pending CN106550538A (en) | 2015-09-21 | 2015-09-21 | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683016A (en) * | 2017-11-21 | 2018-02-09 | 生益电子股份有限公司 | A kind of quick heat radiating PCB |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896421A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896423A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN108235600A (en) * | 2017-12-28 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The preparation method of printed wiring board |
| CN108282969A (en) * | 2018-03-26 | 2018-07-13 | 生益电子股份有限公司 | A kind of PCB production methods and PCB for realizing internal layer connection |
| CN108391368A (en) * | 2018-03-06 | 2018-08-10 | 东莞森玛仕格里菲电路有限公司 | One kind burying copper billet board manufacturing method |
| CN108419382A (en) * | 2018-03-14 | 2018-08-17 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN108430166A (en) * | 2018-03-14 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN108430174A (en) * | 2018-03-26 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN110708864A (en) * | 2019-10-16 | 2020-01-17 | 生益电子股份有限公司 | Printed circuit board containing heat dissipation medium and preparation method thereof |
| CN112888182A (en) * | 2020-02-04 | 2021-06-01 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
| CN113068321A (en) * | 2020-01-02 | 2021-07-02 | 北大方正集团有限公司 | Mounting process of conductive adhesive, production process of circuit board and circuit board |
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| CN103561542A (en) * | 2013-11-15 | 2014-02-05 | 乐凯特科技铜陵有限公司 | Method for manufacturing circuit board capable of rapidly dissipating heat |
| CN103906377A (en) * | 2012-12-28 | 2014-07-02 | 深南电路有限公司 | Method for manufacturing circuit board bearing large current, and circuit board bearing large current |
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| CN102686029A (en) * | 2012-04-24 | 2012-09-19 | 宜兴硅谷电子科技有限公司 | Method for manufacturing blind slot of circuit board |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107683016A (en) * | 2017-11-21 | 2018-02-09 | 生益电子股份有限公司 | A kind of quick heat radiating PCB |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896421A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
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| CN108391368A (en) * | 2018-03-06 | 2018-08-10 | 东莞森玛仕格里菲电路有限公司 | One kind burying copper billet board manufacturing method |
| CN108430166A (en) * | 2018-03-14 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN108419382A (en) * | 2018-03-14 | 2018-08-17 | 生益电子股份有限公司 | A kind of production method and PCB of PCB |
| CN108430174A (en) * | 2018-03-26 | 2018-08-21 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN108282969B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of PCB production method and PCB for realizing internal layer connection |
| CN108430174B (en) * | 2018-03-26 | 2019-07-23 | 生益电子股份有限公司 | A kind of production method and mixed pressure PCB of mixed pressure PCB |
| CN108282969A (en) * | 2018-03-26 | 2018-07-13 | 生益电子股份有限公司 | A kind of PCB production methods and PCB for realizing internal layer connection |
| CN110708864A (en) * | 2019-10-16 | 2020-01-17 | 生益电子股份有限公司 | Printed circuit board containing heat dissipation medium and preparation method thereof |
| CN113068321A (en) * | 2020-01-02 | 2021-07-02 | 北大方正集团有限公司 | Mounting process of conductive adhesive, production process of circuit board and circuit board |
| CN112888182A (en) * | 2020-02-04 | 2021-06-01 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
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Application publication date: 20170329 |
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