CN1838868A - Printed circuit board assembly and its processing method - Google Patents
Printed circuit board assembly and its processing method Download PDFInfo
- Publication number
- CN1838868A CN1838868A CNA2005100568631A CN200510056863A CN1838868A CN 1838868 A CN1838868 A CN 1838868A CN A2005100568631 A CNA2005100568631 A CN A2005100568631A CN 200510056863 A CN200510056863 A CN 200510056863A CN 1838868 A CN1838868 A CN 1838868A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- metalwork
- copper layer
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention relates to a high-power printed circuit board with heat emission function used in radio frequency circuit, which can solve the problem of connecting copper layer and metallic element with electricity. Said invention comprises: a printed circuit board coated with copper layer; and the metallic elements adhered with said circuit board; the conductive holes through said copper layer and the metallic element, while the inner wall is coated with metallic film to electrically connect the copper layer and the metallic element. said producing method comprises: a, using adhesive to compress said printed circuit board and metallic element into said integration; b, drilling conductive hole to through the copper layer and the metallic element; c, plating metallic film on the inner wall of holes to electrically connect the copper layer and metallic element.
Description
Technical field
The present invention relates to circuit board, relate in particular to a kind of high-power printed circuit board assembly and processing method thereof of possessing heat sinking function that is applied in the radio circuit.
Background technology
Industry often adopts complete machine air blast cooling, high power device attached heat sinks, circuit board to be installed on the housing radiator when solving the circuit board heat dissipation problem at present, or, form the efficiently radiates heat that the circuit board assemblies with heat sinking function is realized circuit board with this several method applied in any combination.
Use the printed circuit board that power supply or power amplification function are provided through regular meeting in the electronic product, the operating power of the whole plate of such circuit board is general bigger, can reach more than the 100W, and perhaps some the components and parts power ratio on the circuit board is bigger, reaches more than the 100W.Under such condition of work, at first to provide sufficient radiating condition for circuit board or components and parts, guaranteeing on circuit board itself, the plate that other components and parts and high performance components are operated under the specified safe working temperature, method commonly used be for metalwork of this class printed circuit connection here as fin.Because the heat of printed circuit is mainly from high-power components, for satisfying the heat radiation of high-power components, on printed circuit board, window for the high-power components setting, high-power components can directly weld through windowing or utilize electrically and thermally conductive adhesive to be bonded on the fin, more helps the efficiently radiates heat of entire circuit plate.In addition, fin is generally metalwork, can form effective electrical connection, therefore except effectively conducting the heat, can also provide ground connection for printed circuit board, this requirement is used particularly important at radio circuit, the common way of printed circuit plate earthing is the cabling that the bottom surface localized design of printed circuit board is essential, remainder is done the copper design of large tracts of land shop, by being connected of printed circuit board bottom surface copper layer and fin, provides the earth-return of high power device.
The printed circuit board assembly structure that radio frequency amplifier section on the existing wireless base station product is used as described in Figure 1, the printed circuit board 1 that comprises bottom surface covering copper layer 3, metalwork 2 by articulamentum 4 fixedly connected printed circuit boards 1, high-power components 5 directly welds by windowing on the printed circuit board 1 or electrically and thermally conductive adhesive is bonded on the metalwork 2, satisfy the needs of heat radiation, the pin 6 of high-power components 5 is welded on the pad set on the printed circuit board 1, realizes being electrically connected.
The articulamentum 4 of this method is a scolder, satisfying required heat conduction, conduction and mechanical fixation by welding is connected, realized between the bottom surface copper layer of printed circuit board and the metalwork electrically conducting reliably, scolder is generally the high-temperature solder of electronics assembling usefulness, fusing point carries out the assembling welding of device on the circuit board again after the welding of finishing between printed circuit board and the metalwork more than 210 degree.
When using scolder welding printed circuit board and metalwork, need weld, clear up, check a plurality of necessary procedure such as combination rate, many, the complex process of product sequence, work flow is grown, need be taken production line for a long time, causes the rising of product cost.A kind of method of alternative welding is to use conducting resinl hot pressing bonding, though can save certain processing step, the price of electrically and thermally conductive adhesive is higher than scolder, and the adhesion technique requirement is also very high, and the cost of product is still uncontrollable.
In the prior art, also have a kind of printed circuit board and metalwork method of attachment, utilize dielectric, adhesives in the high-temperature vacuum environment printed circuit board to be pressed on the metalwork exactly, as shown in Figure 2, articulamentum 4 is the sheet material that dielectric, adhesives form.This method processing technology is simple relatively, and cost is relatively low, especially compares with using electrically and thermally conductive adhesive, and cost has descended a lot.But the subject matter that this method exists is do not have electrically conducting between copper layer and the metalwork, can't satisfy the circuit design requirement, especially the application need of radio circuit.
Summary of the invention
The invention provides a kind of printed circuit board assembly and processing method thereof, when solving that printed circuit board and metalwork are bonding in the prior art, the problem that copper layer and metalwork can't be electrically connected.
A kind of printed circuit board assembly, comprise: described assembly comprises the printed circuit board that is coated with the copper layer and the metalwork bonding with this printed circuit board, also comprises: the conductive hole that passes described copper layer and metalwork, the inwall metal-plated membrane of this conductive hole is electrically connected described copper layer and metalwork.
Described conductive hole is through hole or blind hole.
The described bonding resin bonding that is.
A kind of processing method of printed circuit board assembly, described assembly comprise printed circuit board and the metalwork that is coated with the copper layer, it is characterized in that, described processing method comprises the following steps:
A, utilize adhesives that described printed circuit board and metalwork are pressed into described assembly;
B, in described assembly, bore conductive hole, and make this conductive hole by described copper layer and metalwork;
C, on the inwall of described conductive hole metal-coated membrane, described copper layer and metalwork are electrically connected.
Described adhesives is a resin.
Described being pressed together in the vacuum high-temperature environment carried out.
With described conduction hole drill is blind hole or through hole; From described printed circuit board side or metalwork sidetracking conductive hole.
Described processing method also comprises step: process described printed circuit board and described metalwork.
Processing is got the printed circuit plate substrate earlier during printed circuit board, then at covering copper layer on this base material with carry out graphics process on the copper layer; Perhaps, get metal material processing during processing metal spare earlier and become fin, then this fin is carried out surface treatment.
Use technical solution of the present invention, owing to printed circuit board with as adopting hot pressing technique to realize connecting between the metalwork of radiator and ground connection approach, compare with welding procedure, welding between printed circuit board and the metal base, check, operation such as clear have been cancelled, greatly simplify work flow, improved working (machining) efficiency; Compare with conductive adhesive technology, reduce and connect material cost, and realize being electrically connected between printed circuit board and the metal base by conducting through hole or blind hole, under the situation of lower cost, satisfied the heat radiation of high-power circuit plate and the requirement that is electrically connected.
Description of drawings
Fig. 1 is the structural representation of existing weld assembly;
Fig. 2 is the structural representation with hot pressing assembly of conductive hole structure of the present invention.
Embodiment
The printed circuit board assembly that has a heat sink of the present invention as shown in Figure 2, the printed circuit board 1 that comprises the copper layer 3 that the bottom surface covers, metalwork 2 by articulamentum 4 fixedly connected printed circuit boards 1, this articulamentum 4 is by dielectric, adhesives is in the high-temperature vacuum environment, printed circuit board pressed on the metalwork form, high-power components 5 directly welds or is bonded on the metalwork 2 with electrically and thermally conductive adhesive by windowing on the printed circuit board 1, to satisfy the needs of heat radiation, the pin 6 of high-power components 5 is welded on the pad set on the printed circuit board 1, realizes being electrically connected.For reaching the needs of metalwork 2 and copper layer 3 direct electric electrically conducting, this printed circuit board assembly also comprises conductive hole 7, and this conductive hole 7 passes copper layer 2 and metalwork 3 simultaneously, and metal-plated membrane 9 on the inwall, utilize the conductive characteristic of metal film 9, make metalwork 2 and copper layer 3 realize being electrically connected reliably.
The structure of conductive hole can be a through hole 7, also can select blind hole 8, compares the processing through hole, and the loss to drill bit during processing blind hole is little, can preferentially adopt.
The quantity and the position of conductive hole are set as required, and the direction of punching is not limit, and be when still selecting blind hole structure, because the thickness and the strength ratio printed circuit board 1 of metalwork 2 are all high, therefore comparatively convenient from the operation of printed circuit board 1 side.
The present embodiment has increased the conductive hole structure on the assembly of printed circuit board and the formation of metalwork hot pressing, this conductive hole is communicated with copper layer and metalwork, inwall carries out electroplating processes, make the inwall of conductive hole form layer of metal film, metal film provides electric path for copper layer and metalwork, like this, has both guaranteed electricity between printed circuit board and the metal base, heat, mechanical connection, solved existing scheme work flow complexity again, the problem that cost is high.
The processing method of printed circuit board assembly of the present invention comprises the following steps:
S1, making printed circuit board;
Get the base material of printed circuit board, covering copper layer on base material carries out surfacial pattern and handles the complete cabling of formation on the copper layer.
S2, processing metal spare;
Get metal material and utilize means such as punching press to be processed into the fin of size match, fin is carried out surface treatment to meet the requirements of fineness.
S3, utilize materials such as resin in the vacuum high-temperature environment, printed circuit board and metalwork hot pressing to be in the same place;
Form articulamentum after the assembly pressing.
S4, brill conductive hole;
The quantity of conductive hole determines that as required the direction of boring can be carried out from printed circuit board side or metalwork side, and conductive hole is through hole or blind hole, and processing blind hole is saved drill bit than the processing through hole.
S5, carry out electroplating processes again after the inwall of conductive hole cleared up;
Conductive hole inwall after the electroplating processes forms layer of metal film, has electrically connected copper layer and metalwork.
Use technical solution of the present invention, owing to printed circuit board with as adopting hot pressing technique to realize connecting between the metalwork of radiator and ground connection approach, compare with welding procedure, welding between printed circuit board and the metal base, check, operation such as clear have been cancelled, greatly simplify work flow, improved working (machining) efficiency; Compare with conductive adhesive technology, reduce and connect material cost, and realize being electrically connected between printed circuit board and the metal base by conducting through hole or blind hole, under the situation of lower cost, satisfied the heat radiation of high-power circuit plate and the requirement that is electrically connected.
The above only is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1, a kind of printed circuit board assembly comprises: be coated with the printed circuit board of copper layer, the metalwork of bonding this printed circuit board, it is characterized in that, also comprise: pass the conductive hole of described copper layer and metalwork, the inwall metal-plated membrane of this conductive hole is electrically connected described copper layer and metalwork.
2, assembly as claimed in claim 1 is characterized in that, described conductive hole is through hole or blind hole.
3, assembly as claimed in claim 1 or 2 is characterized in that, the described bonding resin bonding that is.
4, a kind of processing method of printed circuit board assembly, described assembly comprise printed circuit board and the metalwork that is coated with the copper layer, it is characterized in that, described processing method comprises the following steps:
A, utilize adhesives that described printed circuit board and metalwork are pressed into described assembly;
B, in described assembly, bore conductive hole, and make this conductive hole by described copper layer and metalwork;
C, on the inwall of described conductive hole metal-coated membrane, described copper layer and metalwork are electrically connected.
5, processing method as claimed in claim 4 is characterized in that, described adhesives is a resin.
6, processing method as claimed in claim 5 is characterized in that, described being pressed together in the vacuum high-temperature environment carried out.
7, processing method as claimed in claim 4 is characterized in that, described step b: with described conduction hole drill is blind hole or through hole.
8, as claim 4,5,6 or 7 described processing methods, it is characterized in that described step b: from described printed circuit board side or metalwork sidetracking conductive hole.
9, processing method as claimed in claim 5 is characterized in that, also comprises step before the step a: process described printed circuit board and described metalwork.
10, processing method as claimed in claim 9 is characterized in that, processing is got the printed circuit plate substrate earlier during printed circuit board, then at covering copper layer on this base material with carry out graphics process on the copper layer; Perhaps, get metal material processing during processing metal spare earlier and become fin, then this fin is carried out surface treatment.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100568631A CN1838868A (en) | 2005-03-25 | 2005-03-25 | Printed circuit board assembly and its processing method |
| PCT/CN2006/000492 WO2006099811A1 (en) | 2005-03-25 | 2006-03-24 | A printed circuit board assembly and the manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100568631A CN1838868A (en) | 2005-03-25 | 2005-03-25 | Printed circuit board assembly and its processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1838868A true CN1838868A (en) | 2006-09-27 |
Family
ID=37016076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100568631A Pending CN1838868A (en) | 2005-03-25 | 2005-03-25 | Printed circuit board assembly and its processing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN1838868A (en) |
| WO (1) | WO2006099811A1 (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101854777A (en) * | 2010-05-06 | 2010-10-06 | 章祖文 | Fabricating methods for special power electronic circuit board for power supply and power module |
| CN102227156A (en) * | 2011-06-08 | 2011-10-26 | 乐健线路板（珠海）有限公司 | High reflection mirror MCPCB (printed circuit board) and preparation method thereof |
| CN102305880A (en) * | 2011-09-08 | 2012-01-04 | 高德（无锡）电子有限公司 | Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test |
| CN102444877A (en) * | 2010-10-08 | 2012-05-09 | 瑞普韩国有限公司 | Heatsink module for LED lamp and the heatsink plate for LED lamp using of it |
| CN102573327A (en) * | 2011-12-25 | 2012-07-11 | 章祖文 | Method for manufacturing power electronic circuit board and power module special for power supply |
| CN102752994A (en) * | 2012-07-24 | 2012-10-24 | 珠海市凡信科技有限公司 | Driver |
| CN104582283A (en) * | 2014-12-31 | 2015-04-29 | 厦门市平大商贸有限公司 | Selective sintering process of printed circuit |
| CN104681220A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Surface-adhered type over-current protection element and manufacturing method |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896421A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896423A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| WO2021004493A1 (en) * | 2019-07-09 | 2021-01-14 | 华为技术有限公司 | Packaging structure and power amplifier |
| CN112469205A (en) * | 2020-11-12 | 2021-03-09 | 北京遥测技术研究所 | Conductive adhesive bonding method for printed board and connector vertical interconnection circuit |
| CN113347778A (en) * | 2021-05-31 | 2021-09-03 | 西安联飞智能装备研究院有限责任公司 | Printed circuit board and method for connecting common mode capacitor and switching device radiator |
| CN114793386A (en) * | 2021-01-25 | 2022-07-26 | 宏启胜精密电子(秦皇岛)有限公司 | Manufacturing method of circuit board and circuit board |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012020838A1 (en) * | 2012-10-24 | 2014-04-24 | Schoeller-Electronics Gmbh | circuit board |
| GB2555860A (en) * | 2016-11-15 | 2018-05-16 | Ashwoods Automotive Ltd | Electrical machines |
| IT201800010104A1 (en) * | 2018-11-07 | 2020-05-07 | Cisel S R L Circuiti Stampati Per Applicazioni Elettr | PRINTED CIRCUIT BOARD WITH HEAT SINK LAYER. |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4242157A (en) * | 1979-04-20 | 1980-12-30 | Rockwell International Corporation | Method of assembly of microwave integrated circuits having a structurally continuous ground plane |
| JPS60116191A (en) * | 1983-11-29 | 1985-06-22 | イビデン株式会社 | Board for placing electronic parts and method of producing same |
| US5384181B1 (en) * | 1987-02-17 | 2000-06-13 | World Properties Inc | Low volume fraction ceramic filled fluoropolymeric composite material |
| US5210941A (en) * | 1991-07-19 | 1993-05-18 | Poly Circuits, Inc. | Method for making circuit board having a metal support |
| CN1208998C (en) * | 2002-03-08 | 2005-06-29 | 启亨股份有限公司 | Printed circuit board and its production process |
-
2005
- 2005-03-25 CN CNA2005100568631A patent/CN1838868A/en active Pending
-
2006
- 2006-03-24 WO PCT/CN2006/000492 patent/WO2006099811A1/en not_active Application Discontinuation
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101854777A (en) * | 2010-05-06 | 2010-10-06 | 章祖文 | Fabricating methods for special power electronic circuit board for power supply and power module |
| CN102444877A (en) * | 2010-10-08 | 2012-05-09 | 瑞普韩国有限公司 | Heatsink module for LED lamp and the heatsink plate for LED lamp using of it |
| CN102227156A (en) * | 2011-06-08 | 2011-10-26 | 乐健线路板（珠海）有限公司 | High reflection mirror MCPCB (printed circuit board) and preparation method thereof |
| CN102227156B (en) * | 2011-06-08 | 2014-10-08 | 乐健科技（珠海）有限公司 | High reflection mirror MCPCB (printed circuit board) and preparation method thereof |
| CN102305880A (en) * | 2011-09-08 | 2012-01-04 | 高德（无锡）电子有限公司 | Switching plate for preventing puncture in printed circuit board electroplate soft metal electric property test |
| CN102573327A (en) * | 2011-12-25 | 2012-07-11 | 章祖文 | Method for manufacturing power electronic circuit board and power module special for power supply |
| CN102573327B (en) * | 2011-12-25 | 2016-02-10 | 章祖文 | The manufacture method of a kind of special power electronic circuit board for power supply and power model |
| CN102752994A (en) * | 2012-07-24 | 2012-10-24 | 珠海市凡信科技有限公司 | Driver |
| CN104582283A (en) * | 2014-12-31 | 2015-04-29 | 厦门市平大商贸有限公司 | Selective sintering process of printed circuit |
| CN104681220A (en) * | 2015-02-04 | 2015-06-03 | 上海长园维安电子线路保护有限公司 | Surface-adhered type over-current protection element and manufacturing method |
| CN107734839A (en) * | 2017-11-21 | 2018-02-23 | 生益电子股份有限公司 | A kind of PCB |
| CN107896421A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896422A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896423A (en) * | 2017-11-21 | 2018-04-10 | 生益电子股份有限公司 | A kind of PCB of quick heat radiating |
| CN107896423B (en) * | 2017-11-21 | 2020-03-27 | 生益电子股份有限公司 | PCB capable of fast radiating |
| WO2021004493A1 (en) * | 2019-07-09 | 2021-01-14 | 华为技术有限公司 | Packaging structure and power amplifier |
| CN112469205A (en) * | 2020-11-12 | 2021-03-09 | 北京遥测技术研究所 | Conductive adhesive bonding method for printed board and connector vertical interconnection circuit |
| CN114793386A (en) * | 2021-01-25 | 2022-07-26 | 宏启胜精密电子(秦皇岛)有限公司 | Manufacturing method of circuit board and circuit board |
| CN114793386B (en) * | 2021-01-25 | 2023-08-18 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board manufacturing method and circuit board |
| CN113347778A (en) * | 2021-05-31 | 2021-09-03 | 西安联飞智能装备研究院有限责任公司 | Printed circuit board and method for connecting common mode capacitor and switching device radiator |
| CN113347778B (en) * | 2021-05-31 | 2023-02-28 | 西安联飞智能装备研究院有限责任公司 | Printed circuit board and method for connecting common mode capacitor and switching device radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006099811A1 (en) | 2006-09-28 |
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